A thermocouple and an electronic device

Abstract

The present application discloses a thermocouple and an electronic device, including: a thermocouple structure extending from the hot end to the cold end, the thermocouple structure including a first thermocouple metal and a second thermocouple metal connected to the first thermocouple metal, the first thermocouple metal and the second thermocouple metal both extending from the hot end to the cold end respectively; a compensation structure including a temperature measurement component and a heat conduction circuit, the heat conduction circuit extending in a direction from the hot end to the cold end so as to conduct the temperature of the hot end in a direction toward the cold end through a wire, the temperature measurement component connected to the end of the heat conduction circuit away from the hot end so as to obtain the temperature of the end of the heat conduction circuit away from the hot end. The present application can indirectly obtain the temperature rise of the cold end of the thermocouple by obtaining the temperature of the heat conduction circuit at the cold end of the thermocouple. This can eliminate system errors and make the measurement accuracy of the thermocouple higher.

Description

Technical Field

[0001] The present application relates to the technical field of temperature measurement, and in particular to a thermocouple and an electronic device. Background Art

[0002] Thermocouples are common temperature measuring elements. Existing thermocouples have systematic errors when measuring temperature, and the accuracy of temperature measurement is low. Summary of the invention

[0003] The present application provides a thermocouple and an electronic device capable of performing more accurate temperature measurement.

[0004] According to one aspect of the present application, a thermocouple is provided, comprising: a galvanic structure extending from a hot end to a cold end, the galvanic structure comprising a first galvanic metal and a second galvanic metal connected to the first galvanic metal, the first galvanic metal and the second galvanic metal respectively extending from the hot end to the cold end; a compensation structure comprising a temperature measurement component and a heat conduction circuit, the heat conduction circuit extending in a direction from the hot end to the cold end so as to conduct the temperature of the hot end in a direction toward the cold end through a wire, the temperature measurement component being connected to an end of the heat conduction circuit away from the hot end so as to obtain the temperature of the end of the heat conduction circuit away from the hot end.

[0005] In the above scheme, the system error caused by the temperature transfer from the hot end to the cold end of the thermocouple when it is working is fully considered. Due to the addition of the heat conduction circuit, the heat conduction circuit transfers the temperature of the hot end position of the thermocouple to the cold end position, which is used to simulate the temperature transferred from the hot end of the thermocouple to the cold end. By obtaining the temperature of the heat conduction circuit at the cold end position of the thermocouple, the temperature rise of the cold junction of the thermocouple can be indirectly obtained. After obtaining this temperature, through simple calculation, the system error value of the thermocouple in the related technology can be obtained, and then the system error can be eliminated, making the measurement accuracy of the thermocouple higher.

[0006] According to one embodiment of the present application, the heat conductive circuit has a first thermal conductivity efficiency for transferring heat from the hot end to the cold end, the thermocouple structure has a second thermal conductivity efficiency for transferring heat from the hot end to the cold end, and the heat conductive circuit is configured so that the first thermal conductivity efficiency is equal to the second thermal conductivity efficiency.

[0007] In the above scheme, "the heat conduction circuit is configured so that the first heat conduction efficiency is equal to the second heat conduction efficiency" means that, under the same time and the same temperature difference conditions, the amount of heat conducted from the hot end to the cold end of the heat conduction circuit is equal to the amount of heat conducted from the hot end to the cold end of the galvanic structure. When the heat conduction circuit meets the above conditions, the temperature transferred from the heat conduction circuit to the cold end is more meaningful for reference and can better reflect the amount of heat transferred from the hot end to the cold end of the galvanic structure and the temperature change.

[0008] According to an embodiment of the present application, the first thermocouple metal, the second thermocouple metal, and the heat conduction line all extend along a straight line, and the first thermocouple metal, the second thermocouple metal, and the heat conduction line are arranged in parallel at intervals.

[0009] In the above solution, the first thermocouple metal, the second thermocouple metal, and the heat conduction line extend in a straight line, making it easier to correspond and match the heat conduction performance between the heat conduction line and the first thermocouple metal and the second thermocouple metal. Therefore, the heat conduction line can more accurately simulate the heat conducted by the first thermocouple metal and the second thermocouple metal, thereby improving the measurement accuracy of the thermocouple.

[0010] According to an embodiment of the present application, along the direction from the hot end to the cold end, the sizes of the first thermocouple metal, the second thermocouple metal, and the heat conduction line are all the same.

[0011] In the above solution, when the lengths of the first thermocouple metal and the heat conduction line are the same, the temperature changes at the ends of the first thermocouple metal and the heat conduction line away from the hot end are more similar, enabling the heat conduction circuit to more accurately simulate the heat conducted by the first thermocouple metal, thereby improving the measurement accuracy of the thermocouple.

[0012] According to an embodiment of the present invention, the direction from the hot end to the cold end is the first direction;

[0013] The first thermocouple metal includes M first metal wires extending along the first direction, the second thermocouple metal includes M second metal wires extending along the first direction, the M first metal wires and the M second metal wires are arranged in a staggered manner one by one, and the M first metal wires and the M second metal wires are connected end to end to form a series circuit, where M is a positive integer;

[0014] The heat conduction line includes N third metal wires extending along the first direction, and the ends of the N third metal wires away from the hot end are all connected to the temperature measurement component, where N is a positive integer;

[0015] Along the direction perpendicular to the first direction, the cross-sectional area of each first metal wire is S1, the total cross-sectional area of each second metal wire is S2, and the cross-sectional area of each third metal wire is S3;

[0016] The thermal conductivity of the first metal wire is λ1, the thermal conductivity of the second metal wire is λ2, and the thermal conductivity of the third metal wire is λ3, where λ1 > λ2;

[0017] The size of the first metal wire along the first direction is L1, the size of the second metal wire along the first direction is L2, and the size of the third metal wire along the first direction is L3;

[0018] S1, S2, S3, λ1, λ2, λ3, L1, L2, L3 satisfy the relational expression:

[0019]

[0020] Among them, A is the error range, and -0.3 ≤ A ≤ 0.3.

[0021] In the above solution, regardless of whether the value of M is 1 or an integer greater than 1, manufacturing the heat conduction line through the above formula can enable the heat conduction line to simultaneously simulate the comprehensive temperature transmission process of both the first thermocouple metal and the second thermocouple metal, and the temperature compensation result is more accurate.

[0022] According to an embodiment of the present application, M and N satisfy the relational expression:

[0023] M = N

[0024] Among them, the M first metal wires and the M second metal wires are combined to form M groups of thermocouple groups, and a third metal wire is provided between the first metal wire and the second metal wire in each thermocouple group.

[0025] In the above solution, each third metal wire is located between the first metal wire and the second metal wire arranged in groups, so that the environment where each third metal wire is located is closer to the adjacent first metal wire and second metal wire, thereby making the temperature conducted by the third metal wire to the cold end more reference-worthy.

[0026] According to an embodiment of the present application, N is equal to 2, and the thermocouple structure is arranged between the two third metal wires.

[0027] In the above solution, the two third metal wires are arranged around the outer periphery of the thermocouple structure, so that the position arrangement of the heat conduction line does not affect the thermocouple structure, that is, the structure of the heat conduction line can be redesigned on the outer periphery of the original thermocouple structure, and the increase or decrease of the width dimension of the heat conduction line does not need to consider the interference problem with the thermocouple structure (the width of the heat conduction line can be extended towards the outer periphery), reducing the design cost.

[0028] According to an embodiment of the present application, the thermocouple further includes:

[0029] A substrate layer, including a first surface;

[0030] Among them, the thermocouple structure and the heat conduction line are both arranged on the first surface.

[0031] In the above solution, the thermocouple structure and the heat conduction line are simultaneously located on one surface of the substrate, and the integration degree of the thermocouple is higher and the structure is more compact.

[0032] According to an embodiment of the present application, the first thermocouple metal and the second thermocouple metal are connected at the hot end to form a hot junction;

[0033] The thermocouple further includes an insulating layer connected to the hot junction, and the insulating layer is disposed on the surface of the hot junction facing away from the substrate layer;

[0034] The end of the heat conduction line close to the hot junction is disposed on the surface of the insulating layer facing away from the hot junction.

[0035] In the above solution, the end of the heat conduction line located at the hot end can be flush with the position of the hot junction of the thermocouple structure, and the two can contact the heat source at basically the same position, so that the heat conduction circuit can more accurately simulate the heat conducted by the first thermocouple metal, thereby improving the measurement accuracy of the thermocouple.

[0036] According to an embodiment of the present application, the thermocouple further includes:

[0037] A substrate layer, including a first surface and a second surface arranged opposite to each other;

[0038] Wherein, the thermocouple structure is disposed on the first surface, and the heat conduction line is disposed on the second surface.

[0039] In the above solution, when the heat conduction line and the thermocouple structure are disposed on two opposite surfaces of the substrate layer, the heat conduction line can completely coincide with the arrangement position of the thermocouple structure in the direction perpendicular to the substrate layer, so as to more accurately simulate the temperature transferred from the hot end to the cold end of the thermocouple structure. Moreover, the heat conduction line and the thermocouple structure being distributed on different surfaces of the substrate layer also ensures that there is no position interference between the two, and at the same time, the structure of the thermocouple is more compact and the volume is smaller.

[0040] According to an embodiment of the present application, the heat conduction line includes a first heat conduction line and a second heat conduction line. Both the first heat conduction line and the second heat conduction line extend from the hot end to the cold end, and the first heat conduction line and the second heat conduction line are connected at the hot end. The material of the first heat conduction line is the same as the material of the first thermocouple metal, and the material of the second heat conduction line is the same as the material of the second thermocouple metal;

[0041] The orthographic projection of the first thermocouple metal on the second surface is a first projection, the arrangement position of the first heat conduction line coincides with the first projection, the orthographic projection of the second thermocouple metal on the second surface is a second projection, and the arrangement position of the second heat conduction line coincides with the second projection;

[0042] The temperature measurement component includes a first temperature measurement part and a second temperature measurement part. The first temperature measurement part is connected to the end of the first heat conduction line facing away from the hot end, and the second temperature measurement part is connected to the end of the second heat conduction line facing away from the hot end.

[0043] In the above scheme, the first heat conducting wire is used to simulate the temperature conduction of the first galvanic metal, and the second heat conducting wire is used to simulate the temperature conduction of the second galvanic metal, and the first heat conducting wire is arranged corresponding to the position of the first galvanic metal, and the second heat conducting wire is arranged corresponding to the position of the second galvanic metal. That is, the heat conducting circuit completely simulates the structure of the galvanic structure, so that the heat conducting circuit can more accurately simulate the temperature transfer effect of the galvanic metal.

[0044] According to one embodiment of the present application, the thermocouple further includes:

[0045] A shielding layer, the shielding layer is arranged on the second surface;

[0046] The second surface includes a first arrangement area and a second arrangement area, the heat conducting circuit is arranged in the first arrangement area, and the shielding layer is arranged in the second arrangement area.

[0047] In the above solution, the shielding layer and the heat-conducting circuit are arranged on the second surface of the substrate plate at the same time. Specifically, the shielding layer and the heat-conducting circuit basically completely cover the second surface of the substrate plate (there is only a gap at the junction of the heat-conducting circuit and the shielding layer). On the one hand, the heat-conducting circuit does not occupy additional space, and on the other hand, the heat-conducting circuit also acts as a part of the shielding layer and plays a shielding role, killing two birds with one stone.

[0048] According to an embodiment of the present application, the temperature measurement component includes a positive circuit, a negative circuit and a thermistor, the thermistor is connected to the end of the thermal conductive circuit away from the hot end, and the positive circuit, the negative circuit and the thermistor are connected to form a series path.

[0049] In the above scheme, the temperature of the heat-conducting circuit at the cold end is measured by using the principle that thermistor generates resistance changes according to temperature, which has a simple structure and low cost.

[0050] A second aspect of the present application also provides an electronic device,

[0051] The invention comprises an electronic device body and any one of the above-mentioned thermocouples, wherein the thermocouple is arranged in the electronic device body.

[0052] In the above scheme, the thermocouple in the electronic device has a compensation structure, so the measurement accuracy of the thermocouple is higher.

[0053] The present application provides a thermocouple, which fully considers the systematic error caused by the transfer of temperature from the hot end to the cold end of the thermocouple during operation. The present application adds a heat conduction line, which transfers the temperature at the hot end position of the thermocouple to the cold end position, so as to simulate the temperature transferred from the hot end to the cold end of the thermocouple. By obtaining the temperature of the heat conduction line at the cold end position of the thermocouple, the temperature rise at the cold end of the thermocouple can be indirectly obtained. After obtaining this temperature, through simple calculation, the systematic error value of the thermocouple in the related art can be obtained, and then the systematic error can be eliminated, making the measurement accuracy of the thermocouple higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0055] Figure 1 Schematic structural diagram of a thermocouple provided by an embodiment of the present application;

[0056] Figure 2 Schematic structural diagram of a thermocouple provided by another embodiment of the present application;

[0057] Figure 3 Schematic structural diagram of a thermocouple provided by still another embodiment of the present application;

[0058] Figure 4 Schematic structural diagram of the combination of the thermocouple structure, compensation structure and substrate layer in an embodiment of the present application;

[0059] Figure 5 Position Figure 4 Cross-sectional view in the A-A direction;

[0060] Figure 6 Schematic structural diagram of the combination of the thermocouple structure, compensation structure and substrate layer in another embodiment of the present application;

[0061] Figure 7 Position Figure 6 Cross-sectional view in the B-B direction;

[0062] Figure 8 Schematic structural diagram of the combination of the thermocouple structure, compensation structure and substrate layer in still another embodiment of the present application;

[0063] Figure 9 Schematic structural diagram of the combination of the thermocouple structure, compensation structure and substrate layer in yet another embodiment of the present application;

[0064] Figure 10 Schematic diagram of the structure after combination of the thermocouple structure, compensation structure and substrate layer in an embodiment of the present application; wherein, the compensation structure and the thermocouple structure are distributed on different surfaces of the substrate layer;

[0065] Figure 11 is Figure 10 Cross-sectional schematic diagram in the C-C direction of;

[0066] Figure 12 Schematic diagram of the structure after combination of the thermocouple structure, compensation structure and substrate layer in an embodiment of the present application; wherein, the compensation structure and the thermocouple structure are distributed on different surfaces of the substrate layer, and the heat conduction lines are divided into a first heat conduction line and a second heat conduction line;

[0067] Figure 13 is Figure 12 Cross-sectional schematic diagram in the D-D direction of;

[0068] Figure 14 Schematic diagram of the structure after combination of the thermocouple structure, compensation structure, substrate layer and shielding layer in an embodiment of the present application;

[0069] Figure 15 Full cross-sectional schematic diagram of a thermocouple in an embodiment of the present application. Specific embodiments

[0070] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0071] A thermocouple is a temperature measuring element commonly used in temperature measuring instruments. It directly measures temperature and converts the temperature signal into a thermal electromotive force signal, which is then converted into the temperature of the measured medium through an electrical instrument (secondary instrument). When a loop is formed by two different conductors or semiconductors A and B and their two ends are connected to each other, as long as the temperatures at the two nodes are different, one end has a temperature of T, which is called the working end or hot end, and the other end has a temperature of T0, which is called the free end (also called the reference end) or cold end. An electromotive force will be generated in the loop, and the direction and magnitude of this electromotive force are related to the materials of the conductors and the temperatures at the two joints. This phenomenon is called the "thermoelectric effect", the loop formed by the two conductors is called a "thermocouple", the two conductors are called "thermoelectrodes", and the generated electromotive force is called "thermal electromotive force".

[0072] During the actual operation process, the inventor found that when the thermocouple measures temperature, the temperature at the hot end position of the thermocouple will be transmitted to the cold end position through the wires (i.e., the aforementioned conductors or semiconductors A and B) inside the thermocouple, causing the temperature difference between the hot end and the cold end of the thermocouple to change, and further causing the electromotive force generated in the thermocouple loop to change, ultimately affecting the accuracy of the temperature measurement of the thermocouple.

[0073] In view of the above technical problems, the inventor initially adopted various means to improve the specific structure of the thermocouple. On the one hand, the inventor considered that when detecting the temperature change at the cold end of the thermocouple, the temperature displayed after the thermocouple detection can be corrected according to this temperature change. Therefore, an additional temperature sensor was initially used to directly measure the temperature at the cold end of the thermocouple. However, later experimental data showed that in the above scheme, since the additional temperature sensor is generally a module with a current path (the additional temperature sensor should not be a thermocouple structure because the additional thermocouple still has the problem of temperature compensation), for example, the additional temperature sensor can be a circuit module with a thermistor. When the additional temperature sensor directly detects the temperature at the cold end of the thermocouple, the current generated by it will affect the electromotive force in the thermocouple (or an additional temperature will be generated when the additional temperature sensor senses, and the generated temperature is not high, but it cannot be ignored compared to the temperature that the thermocouple needs to compensate), which is equivalent to generating a new system error in the thermocouple, resulting in an unsatisfactory measured temperature. On the other hand, the inventor considered that the additional temperature sensor should not be directly connected to the conductor of the thermocouple, so the temperature sensor was arranged beside the cold end of the thermocouple to directly detect the temperature near the cold end of the thermocouple. Although this scheme can correct the measured value of the thermocouple to a certain extent, the result is still not ideal because the temperature beside the cold end of the thermocouple is difficult to fully reflect the temperature transmitted from the hot end to the cold end of the thermocouple through the wire.

[0074] After the above thinking and practice of the inventor, as Figures 1 - 15 , the following provides a technical solution of an improved thermocouple. This thermocouple overcomes the defects in all the above-mentioned schemes and has a high temperature detection accuracy. Specifically, this thermocouple includes a thermocouple structure 100 and a compensation structure 200.

[0075] The thermocouple structure 100 extends from the hot end 11 to the cold end 12. It should be noted that both the "hot end 11" and the "cold end 12" in this article are terms indicating directions. The thermocouple structure 100 has a hot junction 130 and a cold junction 140. When the thermocouple structure 100 operates, the hot junction 130 is at the position of the hot end 11, and the cold junction 140 is at the position of the cold end 12. The thermocouple structure 100 includes a first thermocouple metal 110 and a second thermocouple metal 120. The first thermocouple metal 110 and the second thermocouple metal 120 are the conductor or semiconductor A and the conductor or semiconductor B in the previous text. Both the first thermocouple metal 110 and the second thermocouple metal 120 extend from the hot end 11 of the thermocouple structure 100 to the cold end 12 respectively, and the first thermocouple metal 110 and the second thermocouple metal 120 are connected at the hot end 11 to form a hot junction 130. When the temperatures of the hot end 11 and the cold end 12 of the thermocouple structure 100 are different, an electromotive force will be generated in the loop formed by the first thermocouple metal 110 and the second thermocouple metal 120. According to the magnitude of the generated electromotive force, the temperature of the hot end 11 of the thermocouple can be correspondingly obtained.

[0076] The compensation structure 200 includes a temperature measurement component 220 and a heat conduction line 210. The heat conduction line 210 extends along the direction from the hot end 11 to the cold end 12 to transfer the temperature of the hot end 11 to the cold end 12 through a wire. That is to say, in this embodiment, a wire extending from the hot end 11 of the thermocouple to the cold end 12 is provided, and the temperature of the hot end 11 of the thermocouple is guided to the cold end 12 through the wire to simulate the effect of the thermocouple metal of the thermocouple structure 100 in transferring the temperature of the hot end 11. The temperature measurement component 220 is connected to the end of the heat conduction line 210 away from the hot end 11 to obtain the temperature transferred from the hot end 11 to the cold end 12 through the heat conduction line 210. By obtaining the temperature of the heat conduction line 210 at the position of the cold end 12 of the thermocouple, the rising temperature of the cold junction 140 of the thermocouple can be indirectly obtained. After obtaining this temperature, through simple calculation, the system error value of the thermocouple in the related technology can be obtained, and then the system error can be eliminated, making the measurement accuracy of the thermocouple higher.

[0077] It should be noted that in this article, the meaning of "wire" is defined as a line structure capable of heat conduction. That is to say, the wire can be a metal wire or a non-metal wire capable of conducting electric current, or other wire materials that cannot conduct electric current. For example, the material of the heat conduction line 210 can be common conductive metals such as copper, iron, gold, and silver, or non-metals with electrical conductivity such as graphite and carbon fiber, or it can also be ceramics or other non-conductive materials with high temperature resistance. When the working temperature of the thermocouple is relatively low, the material of the heat conduction line 210 can also be non-conductive materials such as plastic and silica gel. However, regardless of the material of the heat conduction line 210, in order to enable it to reflect the compensation temperature of the thermocouple (for the convenience of description, hereinafter, the temperature transferred from the hot end 11 to the cold end 12 of the thermocouple is referred to as the compensation temperature), it is necessary to specifically design parameters such as its cross-sectional area, density, length, and layout position according to the material of the heat conduction line 210 to make its heat conduction process match the heat conduction process of the thermocouple. For example, when the thermal conductivity of the material of the heat conduction line 210 is lower than that of the material of the thermocouple, the length of the heat conduction line 210 can be appropriately shorter than that of the thermocouple; when the thermal conductivity of the material of the heat conduction line 210 is higher than that of the material of the thermocouple, the length of the heat conduction line 210 can be appropriately longer than that of the thermocouple, or the end of the heat conduction line 210 close to the hot end 11 of the thermocouple can be appropriately away from the hot end 11 of the thermocouple.

[0078] The first thermocouple metal 110 and the second thermocouple metal 120 in the thermocouple are two metals with different materials, and the difference in their thermal conductivities is relatively large. For the convenience of description, it is defined that the thermal conductivity of the first thermocouple metal 110 is higher than that of the second thermocouple metal 120. Exemplarily, the first thermocouple metal 110 can be copper, and the second thermocouple metal 120 can be constantan. At this time, the thermal conductivity performance of the first thermocouple metal 110 is about seventeen times that of the second thermocouple metal 120. Therefore, the compensation temperature of the thermocouple is mainly caused by the transfer of the first thermocouple metal 110. Of course, there can be other combinations of the specific materials of the first thermocouple metal 110 and the second thermocouple metal 120, which will not be elaborated here.

[0079] When the thermal conductivity of the material of the first thermocouple metal 110 is higher than that of the material of the second thermocouple metal 120, considering that the temperature coefficients of the two thermocouple metals of the thermocouple generally vary greatly, and the main error source of the thermocouple is the conduction of the temperature of the hot end 11 by the thermocouple metal with a larger temperature coefficient, the material of the heat conduction line 210 can be the same as that of the first thermocouple metal 110. By simulating the temperature transferred by the thermocouple metal with a higher temperature coefficient, the measurement accuracy of the thermocouple can be improved to a large extent, and using the material of the existing thermocouple for the heat conduction line 210 can also reduce the design difficulty and processing cost.

[0080] The heat conduction line 210 can extend linearly or curvilinearly. In order to enable the heat conduction line 210 to match the temperature conduction path of the first thermocouple metal 110 and thus obtain the compensation temperature more accurately, in one embodiment, both the first thermocouple metal 110 and the heat conduction line 210 extend linearly, and the first thermocouple metal 110 and the heat conduction line 210 are arranged in parallel at intervals. In the above solution, the heat conduction performance between the heat conduction line 210 and the first thermocouple metal 110 is more easily corresponding and matching. Therefore, the heat conduction line 210 can more accurately simulate the heat conducted by the first thermocouple metal 110, thereby improving the measurement accuracy of the thermocouple.

[0081] Along the direction from the hot end 11 to the cold end 12, the sizes of the first thermocouple metal 110, the second thermocouple metal 120, and the heat conduction line 210 can be the same or different. When the sizes of the three are the same, the temperature changes at the ends of the first thermocouple metal 110 and the heat conduction line 210 away from the hot end 11 are closer, enabling the heat conduction circuit to more accurately simulate the heat conducted by the first thermocouple metal 110, thereby improving the measurement accuracy of the thermocouple. Of course, in some scenarios, due to space limitations, when the length dimensions of the heat conduction line 210, the first thermocouple metal 110, and the second thermocouple metal 120 cannot be the same, the heat conduction effect of the heat conduction line 210 can also be made to match the heat conduction effect of the thermocouple structure 100 by changing the material, cross-sectional area, or arrangement position of the heat conduction line 210.

[0082] The compensation structure 200 can be connected to the thermocouple structure 100 or not connected at all, that is, the compensation structure 200 and the thermocouple structure 100 can be two independent units. For example, the compensation structure 200 can be an independently existing component arranged beside the thermocouple in the related art. The compensation structure 200 can display the compensation temperature or transmit a signal with the compensation temperature. The operator can analyze the measured value of the thermocouple according to the displayed compensation temperature or the transmitted signal to obtain the final accurate value. In the above solution, the thermocouple in the related art is the thermocouple structure 100 in the embodiment of the present application, and the combination of the thermocouple in the related art and the compensation structure 200 is called the thermocouple in the embodiment of the present application.

[0083] To make the thermocouple structure 100 more compact, the thermocouple structure 100 and the compensation structure 200 can be connected to each other. According to an embodiment of the present application, the thermocouple may further include a substrate layer 300. The substrate layer 300 includes a first surface 310, and both the thermocouple structure 100 and the heat conduction line 210 are disposed on the first surface 310. That is, the heat conduction line 210 of the thermocouple structure 100 and the compensation structure 200 is connected by using the substrate layer 300. It is applicable to small thermocouples. For large thermocouples, the thermocouple structure 100 and the compensation structure 200 can be connected by using other connection brackets, which will not be elaborated here.

[0084] When the heat conduction line 210 is disposed on the first surface 310, the temperature measurement component 220 of the compensation structure 200 can be disposed on the first surface 310 or outside the first surface 310. When the temperature measurement component 220 is disposed outside the first surface 310, the end of the heat conduction line 210 facing away from the hot end 11 of the thermocouple extends out of the substrate layer 300 and is connected to the temperature measurement component 220.

[0085] When both the heat conduction line 210 and the thermocouple structure 100 are located on the same surface of the substrate layer 300, in order to avoid position interference between the heat conduction line 210 and the thermocouple structure 100, the end of the heat conduction line 210 located at the position of the hot end 11 of the thermocouple structure 100 cannot coincide with the position of the hot junction 130 of the thermocouple structure 100 (i.e., the junction point of the first thermocouple metal 110 and the second thermocouple metal 120 and the part for receiving the heat source). Therefore, there is a small difference in the initial temperature received by the hot junction 130 of the thermocouple structure 100 and the heat conduction line 210 from the heat source position. In view of this defect, in an embodiment of the present application, the thermocouple further includes an insulating layer 400 connected to the hot junction 130. The insulating layer 400 is disposed on the surface of the hot junction 130 facing away from the substrate layer 300, and the end of the heat conduction line 210 close to the hot junction 130 is disposed on the surface of the insulating layer 400 facing away from the hot junction 130. In other words, the end of the heat conduction line 210 close to the hot end 11 of the thermocouple is stacked with the hot junction 130 of the thermocouple structure 100, and the two are isolated by the insulating layer 400. In the above solution, the end of the heat conduction line 210 located at the hot end 11 can be flush with the position of the hot junction 130 of the thermocouple structure 100, and the two can basically contact the heat source at the same position. Therefore, the initial temperature received by the hot junction 130 of the thermocouple structure 100 and the heat conduction line 210 from the heat source position is basically the same, and finally the measurement accuracy of the thermocouple can be improved.

[0086] Specifically, the area and position of the insulating layer 400 covering the surface of the thermocouple structure 100 facing away from the substrate layer 300 depend on the orientation and specific dimensions of the heat conduction line 210. The specific function of the insulating layer 400 is to prevent the heat conduction line 210 from connecting to the thermocouple structure 100, so the insulating layer 400 can achieve the isolation effect between the heat conduction line 210 and the thermocouple structure 100.

[0087] In a specific embodiment, when the material of the heat conduction line 210 is non-conductive (for example, when the material of the heat conduction line 210 is ceramic), the thermocouple may not have the insulating layer 400, and the heat conduction line 210 is directly in contact with the hot junction 130 of the thermocouple structure 100. Of course, in this embodiment, the length, thermal conductivity, and cross-sectional area of the heat conduction line 210 need to be specifically designed to match the heat conduction process of the thermocouple structure 100.

[0088] When the heat conduction junction 130 and the thermocouple are both arranged on the first surface 310 of the substrate layer 300, their relative positions can be determined according to specific design requirements, as long as the heat conduction processes of the two do not affect each other. Specifically, according to an embodiment of the present application, the first thermocouple metal 110 includes M first metal wires 111 arranged in parallel at intervals (of course, the first metal wires 111 may not be arranged in parallel, but for illustrative purposes, a special case where the first metal wires 111 are arranged in parallel is selected here), and the second thermocouple metal 120 includes M second metal wires 121 arranged in parallel at intervals. Each of the first metal wires 111 and each of the second metal wires 121 extend along the direction from the hot end 11 to the cold end 12 of the thermocouple structure 100 (i.e., Figure 3 the first direction X in Figure 2 ), and the M first metal wires 111 and the M second metal wires 121 are arranged in an alternating manner one by one, and the M first metal wires 111 and the M second metal wires 121 are connected end to end to form a series circuit. Among them, M is a positive integer, for example, M can be 1, 2, 3... See Figure 3 for the schematic structural diagram of the thermocouple structure 100 when M is 1; see Figure 2 for the schematic structural diagram of the thermocouple structure 100 when M is 4. The heat conduction line 210 includes N third metal wires, and the N third metal wires all extend along the direction from the hot end 11 to the cold end 12, and the ends of the N third metal wires facing away from the hot end 11 are all connected to the temperature measurement component 220. Among them, N is a positive integer, for example, N can be 1, 2, 3... See Figure 3 for the schematic structural diagram of the thermocouple structure 100 when N is 1; see

[0089] The number of the first metal wires 111 and the second metal wires 121 may have no direct relation with the number of the third metal wires, that is, the value of M and the value of N may have no direct relation. For the convenience of layout, in an embodiment of the present application, M and N satisfy the relation:

[0090] M = N

[0091] Wherein, M first metal wires 111 and M second metal wires 121 are combined to form M groups of thermocouple groups, and a third metal wire is arranged between the first metal wire 111 and the second metal wire 121 in each group of thermocouple groups. Refer to Figure 3 , wherein M = N = 4, and a third metal wire is arranged between the first metal wire 111 and the second metal wire 121 in each group of thermocouple groups, and there are a total of four groups of thermocouple groups, so there are four third metal wires, and the ends of the four third metal wires departing from the hot end 11 are commonly connected. In the above solution, the environment where each third metal wire is located is closer to the adjacent first metal wire 111 and second metal wire 121, so that the temperature conducted by the third metal wire to the cold end 12 is more meaningful for reference.

[0092] As Figure 9 shown, in order to be able to add a heat conduction line 210 on the basis of the existing thermocouple structure 100, in an embodiment of the present application, N can be made equal to 2, and the thermocouple structure 100 is arranged between two third metal wires. That is to say, the heat conduction line 210 is arranged at the peripheral position of the thermocouple structure 100. Such a structural design can enable a thermocouple in the embodiment of the present application to be directly formed by adding a heat conduction line 210 on the periphery on the basis of the original thermocouple (i.e., the thermocouple structure 100 in the present application). The addition of the heat conduction line 210 will not affect the layout of the original thermocouple structure 100, and the original processing equipment can still be used. The processing process of the thermocouple structure 100 remains basically unchanged compared with before, reducing the processing cost.

[0093] In the foregoing embodiment, the thermocouple structure 100 and the heat conduction line 210 are arranged on the same surface of the substrate layer 300, so that the thermocouple structure 100 and the heat conduction line 210 can be processed in the same process, and the processing efficiency is higher. However, in order to make the thermocouple structure 100 more compact, the heat conduction line 210 and the thermocouple structure 100 can be arranged on different surfaces of the substrate layer 300. That is, in an embodiment of the present application, the thermocouple includes a substrate layer 300, and the substrate layer 300 includes a first surface 310 and a second surface 320 which are oppositely arranged. Among them, the thermocouple structure 100 is arranged on the first surface 310, and the heat conduction line 210 is arranged on the second surface 320. In the above solution, there is no position interference between the heat conduction line 210 and the thermocouple structure 100, and the structure of the thermocouple is more compact and the volume is smaller.

[0094] When the heat conduction line 210 is arranged on the second surface 320, the arrangement position of the heat conduction line 210 can be more flexible compared to when the heat conduction line 210 is arranged on the first surface 310. The arrangement position of the heat conduction line 210 on the second surface 320 in this embodiment can correspond to the arrangement position of the heat conduction line 210 when it is arranged on the first surface 310 in the foregoing embodiments, that is, the heat conduction line 210 in this embodiment can be arranged at the position of the orthographic projection of the heat conduction line 210 on the second surface 320 in the foregoing embodiments. Of course, the heat conduction line 210 can also be arranged at the position of the orthographic projection of the thermocouple structure 100 on the second surface 320. When the heat conduction line 210 is arranged at the position of the orthographic projection of the thermocouple structure 100 on the second surface 320, the end of the heat conduction line 210 close to the hot junction 130 of the thermocouple structure 100 can be at the same position of the heat source as the hot junction 130 of the thermocouple structure 100, so that the heat conduction line 210 can more accurately simulate the heat conduction process of the thermocouple structure 100.

[0095] When the heat conduction line 210 is arranged on the second surface 320, the heat conduction line 210 can include a first heat conduction wire 212 and a second heat conduction wire 213. Both the first heat conduction wire 212 and the second heat conduction wire 213 extend from the hot end 11 to the cold end 12 respectively, and the first heat conduction wire 212 and the second heat conduction wire 213 are connected at the hot end 11. The material of the first heat conduction wire 212 is the same as the material of the first thermocouple metal 110, and the material of the second heat conduction wire 213 of the heat conduction line 210 is the same as the material of the second thermocouple metal 120. The orthographic projection of the first thermocouple metal 110 on the second surface 320 is the first projection, and the arrangement position of the first heat conduction wire 212 coincides with the first projection. The orthographic projection of the second thermocouple metal 120 on the second surface 320 is the second projection, and the arrangement position of the second heat conduction wire 213 coincides with the second projection. It can also be understood that the heat conduction line 210 is a mirror image structure of the thermocouple structure 100 on the second surface 320, and both have the same material and size. However, the thermocouple structure 100 is used for temperature measurement, and the heat conduction line 210 is used for temperature compensation. When the heat conduction line 210 is arranged in the above structure, the heat conduction process of the heat conduction line 210 is basically exactly the same as the heat conduction process of the thermocouple structure 100, so the temperature measurement accuracy of the thermocouple is higher.

[0096] When the heat conducting circuit 210 is a mirror image structure of the electric couple structure 100 on the second surface 320, the temperature measuring component 220 may also include a first temperature measuring part and a second temperature measuring part, and both the first temperature measuring part and the second temperature measuring part can be used for temperature measurement. The first temperature measuring part is connected to the end of the first heat conducting wire 212 away from the hot end 11 to measure the temperature of the end of the first heat conducting wire 212 away from the hot end 11; the second temperature measuring part is connected to the end of the second heat conducting wire 213 away from the hot end 11 to measure the temperature of the end of the second heat conducting part away from the hot end 11. In the above scheme, by simultaneously measuring the temperatures of the first heat conducting wire 212 and the second heat conducting wire 213 away from the hot end 11, the compensation temperature of the electric couple structure 100 can be better reflected, and the measurement accuracy of the thermocouple can be improved.

[0097] In the thermocouple in the related art, the second surface 320 is provided with a shielding layer 500, and the shielding layer 500 is used to shield electromagnetic interference. However, when the heat-conducting circuit 210 is provided on the second surface 320, the heat-conducting circuit 210 occupies part of the position of the shielding layer 500. Therefore, when the thermocouple in the embodiment of the present application also includes the shielding layer 500, in one embodiment, a part of the shielding layer 500 can be provided on the surface of the heat-conducting circuit 210 away from the substrate layer 300 (that is, a part of the shielding layer 500 is stacked with the heat-conducting circuit 210), and the other part is provided on the position where the heat-conducting circuit 210 is not provided on the second surface 320. In another embodiment, in order to reduce the thickness of the thermocouple, the shielding layer 500 can also be provided only on the part of the second surface 320 where the heat-conducting circuit 210 is not provided, that is, the second surface 320 includes a first arrangement area 321 and a second arrangement area 322, the heat-conducting circuit 210 is arranged in the first arrangement area 321, and the shielding layer 500 is arranged in the second arrangement area 322. In the above solution, the shielding layer 500 and the heat-conducting circuit 210 are arranged on the second surface 320 of the substrate plate at the same time. Specifically, the shielding layer 500 and the heat-conducting circuit 210 can be substantially completely covered with the second surface 320 of the substrate plate (only the junction of the heat-conducting circuit 210 and the shielding layer 500 has a gap). On the one hand, the heat-conducting circuit 210 does not occupy additional space, reducing the thickness of the thermocouple. On the other hand, when the heat-conducting circuit 210 is made of metal, the heat-conducting circuit 210 also acts as a part of the shielding layer 500, playing a shielding role, killing two birds with one stone.

[0098] Specifically, no matter the heat conducting circuit 210 is disposed on the first surface 310 or the second surface 320, the thermocouple may also have two protective layers 600, both of which have insulating and protective functions. One of the protective layers 600 is attached to one side of the first surface 310 of the substrate layer 300, and the thermocouple structure 100 is located between the substrate layer 300 and the protective layer 600. Another protective layer 600 is attached to one side of the second surface 320 of the substrate layer 300, and the shielding layer 500 is located between the substrate layer 300 and the protective layer 600.

[0099] The structure of the temperature measurement component 220 can be any existing component capable of performing temperature measurement. Specifically, in one embodiment, the temperature measurement component 220 can include a positive circuit, a negative circuit, and a thermistor 221. The thermistor 221 is connected to the end of the thermal conductive circuit 210 away from the hot end 11. The positive circuit, the negative circuit, and the thermistor 221 are connected to form a series path. When the temperature of the thermistor 221 changes, the current of the positive circuit and the negative circuit changes. The temperature value of the thermistor 221 can be analyzed based on the change in the current, thereby reflecting the temperature value of the end of the thermal conductive circuit 210 away from the hot end 11 of the galvanic structure 100.

[0100] In some of the aforementioned embodiments, in order to save processing costs or design costs, the material and length of the heat-conducting line 210 are the same as those of the first galvanic metal 110. However, the aforementioned solution is not universal, and the heat-conducting line 210 cannot theoretically completely simulate the temperature transfer effect of the galvanic structure 100, and still has a certain error in theory. In order to further improve the measurement accuracy of the thermocouple, a more accurate solution is provided in the following embodiments.

[0101] Specific parameters of the first galvanic metal 110 , the second galvanic metal 120 , and the thermal conductive line 210 are defined below.

[0102] The first galvanic metal 110 includes M first metal wires 111 extending along the first direction X, and the second galvanic metal 120 includes M second metal wires 121 extending along the first direction X. The M first metal wires 111 and the M second metal wires 121 are arranged alternately and spaced one by one, and the M first metal wires 111 and the M second metal wires 121 are connected end to end to form a series path, wherein M is a positive integer, for example, M can be 1, 2, 3, etc. See Figure 2 , wherein it is a schematic diagram of the structure of the electric couple structure 100 when M is 1; see Figure 3, where M is 4 and is a schematic diagram of the structure of the electric couple structure 100. The heat conducting circuit 210 includes N third metal wires extending along the first direction X, and the ends of the N third metal wires away from the hot end 11 are all connected to the temperature measurement component 220, where N is a positive integer, for example, N can be 1, 2, 3, etc. See Figure 2 , wherein it is a schematic diagram of the structure of the electric couple structure 100 when N is 1; see Figure 3 , wherein it is a schematic structural diagram of the electric couple structure 100 when N is 4.

[0103] In the direction perpendicular to the first direction X, the cross-sectional area of each first metal wire 111 is S1, the sum of the cross-sectional areas of each second metal wire 121 is S2, and the cross-sectional area of each third metal wire is S3. It should be noted that, in the direction perpendicular to the substrate layer 300, the sizes of the first galvanic metal 110, the second galvanic metal 120 and the thermal conductive line 210 can be the same or different, that is, the thicknesses of the first galvanic metal 110, the second galvanic metal 120 and the thermal conductive line 210 can be the same or different. The number of the first metal wires 111 in the first galvanic metal 110 can be one or more, and the number of the second metal wires 121 in the second galvanic metal 120 is the same as the number of the first metal wires 111 in the first galvanic metal 110. The number of the third metal wires in the thermal conductive line 210 can be one or more, and the number of the third metal wires can be related to the number of the first metal wires 111 or not.

[0104] The thermal conductivity of the first metal wire 111 is λ1, the thermal conductivity of the second metal wire 121 is λ2, and the thermal conductivity of the third metal wire is λ3, where λ1 > λ2. It should be noted that when the number of the first metal wire 111 and the second metal wire 121 is one (that is, when the thermocouple structure 100 has only one hot junction 130 and one cold junction 140), in essence, the hot junction 130 and the cold junction 140 of the thermocouple structure 100 are distributed at both ends of the second metal wire 121. At this time, the error that appears in the thermocouple structure 100 is only caused by the heat conduction of the second metal wire 121 and has nothing to do with the first metal wire 111. Therefore, it is only necessary to make the heat conduction process of the heat conduction line 210 match the temperature conduction process of the second metal wire 121. When the number of the first metal wire 111 and the second metal wire 121 is greater than 1 (that is, when the number of the hot junctions 130 and cold junctions 140 of the thermocouple structure 100 is multiple), the heat conduction of both the first metal wire 111 and the second metal wire 121 affects the measurement result of the thermocouple structure 100. For example, when the number of both the first metal wire 111 and the second metal wire 121 is two, one first metal wire 111 and two second metal wires 121 transfer the temperature of the heat source 11 to affect the measurement result of the thermocouple. And because the thermal conductivity of the first metal wire 111 is generally much greater than that of the second metal wire 121, the first metal wire 111 has a greater impact on the measurement accuracy of the thermocouple structure 100.

[0105] The dimension of the first metal wire 111 along the first direction X is L1, the dimension of the second metal wire 121 along the first direction X is L2, and the dimension of the third metal wire along the first direction X is L3.

[0106] S1, S2, S3, λ1, λ2, λ3, L1, L2, L3, M, N satisfy the relational expression:

[0107]

[0108] Wherein, A is the error range, and -0.3 ≤ A ≤ 0.3. For example, the value of A can be -0.3, -0.1, 0, 0.1, or 0.3, etc.

[0109] When S1, S2, S3, λ1, λ2, λ3, L1, L2, L3, M, N satisfy the above relational expression, the heat conduction parameters of the heat conduction line 210 are accurately limited within a suitable range, so that the heat conduction process of the heat conduction line 210 can simultaneously match the superposition effect of the first thermocouple metal 110 and the second thermocouple metal 120. And this matching process does not limit the material and dimension of the heat conduction line 210.

[0110] In theory, according to the above formula, any wire with heat conduction function can be used as the heat conduction line 210. For example, when the heat conduction coefficient of the heat conduction line 210 is low, its cross-sectional area can be increased or its length can be decreased; when the heat conduction line 210 cannot be arranged too long due to space limitations, a material with a low heat conduction coefficient can be selected to process the heat conduction line 210 or the cross-sectional area of the heat conduction line 210 can be decreased.

[0111] Of course, in order to reduce the design cost and processing cost, the material of the heat conduction line 210 can directly select the material of the first thermocouple metal 110 or the material of the second thermocouple metal 120. For example, when the material of the first thermocouple metal 110 is copper and the material of the second thermocouple metal 120 is copper-nickel, the material of the heat conduction line 210 can be copper or copper-nickel. In particular, in theory, the material of the heat conduction line 210 can also be multiple, that is, one section of the heat conduction line 210 is one material and the other section is another material. For example, one section of the heat conduction line 210 can be copper and the other section can be copper-nickel. When the heat conduction line 210 has multiple third metal wires, the materials of each third metal wire can be the same, or the materials of at least two third metal wires can be different. At the same time, for the same third metal wire, its material can be one or multiple. For example, for the same third metal wire, one section can be copper and the other section can be copper-nickel.

[0112] The following is the specific derivation process of the foregoing formula:

[0113] According to the heat conduction law: Q is the transferred energy, λ is the heat conduction coefficient, S is the heat transfer area, dt is the temperature difference at both ends, and dx is the coordinate on the heat conduction surface, that is, L.

[0114] The heat transferred from the hot junction 130 to the cold junction 140 through the first thermocouple metal 110 in the thermocouple is:

[0115]

[0116] The heat transferred from the hot junction 130 to the cold junction 140 through the second thermocouple metal 120 in the thermocouple is:

[0117]

[0118] Making the temperature difference dt between the hot and cold junctions 130 equal to the temperature difference dt at both ends of the heat conduction line, the heat transferred through the heat conduction line is:

[0119]

[0120] That is

[0121]

[0122] It can be simplified to obtain:

[0123]

[0124] Adding the error range A, it can be obtained:

[0125]

[0126] It should be noted that the heat conduction line 210 designed according to the above formula can be arranged in the thermocouple with the substrate layer 300 or in the thermocouple without the substrate layer 300. When there is a substrate layer 300, the heat conduction line 210 can be arranged on the same surface as the thermocouple structure 100 or on different surfaces. The specific arrangement position of the heat conduction line 210 depends on the actual requirements.

[0127] The second aspect of the present application also provides an electronic device, which includes an electronic device body and the thermocouple of any one of the above, wherein the thermocouple is arranged inside the electronic device body.

[0128] In the drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present application, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for exemplary illustration and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0129] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A thermocouple, characterized in that, include: A galvanic structure extending from a hot end to a cold end, the galvanic structure comprising a first galvanic metal and a second galvanic metal connected to the first galvanic metal, the first galvanic metal and the second galvanic metal both extending from the hot end to the cold end respectively; The compensation structure includes a temperature measurement component and a heat conduction circuit, wherein the heat conduction circuit extends in a direction from the hot end to the cold end so as to conduct the temperature of the hot end in a direction toward the cold end through a wire, and the temperature measurement component is connected to an end of the heat conduction circuit away from the hot end so as to obtain the temperature of the end of the heat conduction circuit away from the hot end, and the end of the heat conduction circuit away from the hot end is the end of the heat conduction circuit located at the cold end; The heat conducting circuit has a first heat conducting efficiency for transferring heat from the hot end to the cold end, the electric couple structure has a second heat conducting efficiency for transferring heat from the hot end to the cold end, and the heat conducting circuit is configured so that the first heat conducting efficiency is equal to the second heat conducting efficiency; The first galvanic metal, the second galvanic metal and the heat-conducting line all extend along a straight line, and the first galvanic metal, the second galvanic metal and the heat-conducting line are arranged in parallel and at intervals.

2. The thermocouple according to claim 1, characterized in that Along the direction from the hot end to the cold end, the sizes of the first galvanic metal, the second galvanic metal and the heat-conducting line are all the same.

3. The thermocouple according to claim 1, characterized in that The direction from the hot end to the cold end is a first direction; The first galvanic metal comprises M first metal wires extending along the first direction, the second galvanic metal comprises M second metal wires extending along the first direction, the M first metal wires and the M second metal wires are arranged alternately and spaced one by one, and the M first metal wires and the M second metal wires are connected end to end to form a series path, wherein M is a positive integer; The heat conducting circuit includes N third metal wires extending along the first direction, and ends of the N third metal wires away from the hot end are all connected to the temperature measurement component, wherein N is a positive integer; Along a direction perpendicular to the first direction, the cross-sectional area of each of the first metal wires is S1, the sum of the cross-sectional areas of each of the second metal wires is S2, and the cross-sectional area of each of the third metal wires is S3; The thermal conductivity of the first metal wire is λ1, the thermal conductivity of the second metal wire is λ2, and the thermal conductivity of the third metal wire is λ3, wherein λ1>λ2; The length of the first metal line along the first direction is L1, the length of the second metal line along the first direction is L2, and the length of the third metal line along the first direction is L3; The S1, the S2, the S3, the λ1, the λ2, the λ3, the L1, the L2, and the L3 satisfy the relationship: Wherein, A is an error range, and -0.3≤A≤0.

3.

4. The thermocouple according to claim 3, characterized in that The M and the N satisfy the relationship: M=N Among them, the M first metal wires and the M second metal wires are combined to form M sets of thermocouple groups, and one of the third metal wires is provided between the first metal wire and the second metal wire in each thermocouple group.

5. The thermocouple according to claim 3, wherein the N is equal to 2, and the thermocouple structure is arranged between the two third metal wires.

6. The thermocouple according to claim 1, wherein, It further includes: a substrate layer including a first surface; Among them, the thermocouple structure and the heat conduction line are both arranged on the first surface.

7. The thermocouple according to claim 6, wherein the first thermocouple metal and the second thermocouple metal are connected at the hot end to form a hot junction; the thermocouple further includes an insulating layer connected to the hot junction, and the insulating layer is arranged on the surface of the hot junction facing away from the substrate layer; the end of the heat conduction line close to the hot junction is arranged on the surface of the insulating layer facing away from the hot junction.

8. The thermocouple according to claim 1, wherein, It further includes: a substrate layer including a first surface and a second surface arranged opposite to each other; Among them, the thermocouple structure is arranged on the first surface, and the heat conduction line is arranged on the second surface.

9. The thermocouple according to claim 8, wherein the heat conduction line includes a first heat conduction line and a second heat conduction line. Both the first heat conduction line and the second heat conduction line extend from the hot end to the cold end respectively, and the first heat conduction line and the second heat conduction line are connected at the hot end. The material of the first heat conduction line is the same as the material of the first thermocouple metal, and the material of the second heat conduction line is the same as the material of the second thermocouple metal; the orthographic projection of the first thermocouple metal on the second surface is a first projection, and the arrangement position of the first heat conduction line coincides with the first projection. The orthographic projection of the second thermocouple metal on the second surface is a second projection, and the arrangement position of the second heat conduction line coincides with the second projection; the temperature measurement component includes a first temperature measurement part and a second temperature measurement part. The first temperature measurement part is connected to the end of the first heat conduction line facing away from the hot end, and the second temperature measurement part is connected to the end of the second heat conduction line facing away from the hot end.

10. The thermocouple according to claim 8, characterized in that, It further includes: a shielding layer, and the shielding layer is arranged on the second surface; Among them, the second surface includes a first arrangement area and a second arrangement area. The heat conduction line is arranged in the first arrangement area, and the shielding layer is arranged in the second arrangement area.

11. The thermocouple according to claim 1, wherein the temperature measurement component includes a positive electrode line, a negative electrode line, and a thermistor. The thermistor is connected to the end of the heat conduction line facing away from the hot end, and the positive electrode line, the negative electrode line, and the thermistor are connected to form a series circuit.

12. An electronic device, wherein it includes an electronic device body and the thermocouple according to any one of claims 1-11, and the thermocouple is arranged inside the electronic device body.

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