A communication device based on an orthogonal chassis and having a double-layer rear light-emitting port

Abstract

The present invention discloses a communication device with a double-layer rear light-emitting port based on an orthogonal chassis, which includes a chassis, a plurality of rear plug-in cards and a plurality of heat dissipation units. The rear plug-in card includes a chassis and a front panel. The rear plug-in cards and the heat dissipation units are arranged at intervals and vertically inserted into the rear of the chassis. A plurality of light ports and ventilation ports are provided on the front panel of the rear plug-in card. Through the improvement and innovation of the heat dissipation structure of the rear plug-in card chassis, without changing the original heat dissipation air duct, the heat dissipation performance of the interface is greatly improved, avoiding the modification of the overall machine structure, and having a wide range of applications. By setting a double-layer light port on the rear plug-in card, the interface density of the device is additionally increased to meet the requirements of large data flow of users. At the same time, an excellent heat dissipation system can ensure that when the power consumption increases, the generated heat can be quickly discharged.

Description

Technical Field

[0001] The present invention relates to a communication device with an orthogonal architecture, and particularly to a communication device with a double-layer rear light-emitting port based on an orthogonal chassis. Background Art

[0002] With the rapid development of electronic communication technology, the backbone network traffic has been growing at a speed of 50% - 80% annually. To meet the requirements of network market traffic processing, major operators and data centers have put forward higher requirements for the interface density of communication devices. In the prior art, rack-mounted communication devices generally use an orthogonal architecture to insert corresponding plug-in cards, that is, generally composed of a backplane, a main control card, front plug-in cards, rear plug-in cards, and a heat dissipation unit. The backplane is used as the interconnection line for other boards, the main control card provides an interface for users to manage the entire device and system, user data is transferred from the interface of the front plug-in card, forwarded by the rear plug-in card, and finally transferred out from the interface of the corresponding front plug-in card. If the user data is marked as needing to be processed, the rear plug-in card will first forward the user data to the front processing board for processing, and then send the processed data to the interface of the destination front plug-in card for transfer out, while the heat dissipation unit dissipates heat for all boards at the same time.

[0003] User data is accessed and transferred out through the interfaces on the front plug-in cards. When the traffic further increases, the communication device needs to provide more interfaces to meet the requirements. However, a higher interface density means that the power consumption of the whole machine will inevitably increase, and at the same time, too many interface densities will block the heat dissipation air duct, which poses a challenge to the heat dissipation of the whole machine. Therefore, how to balance between the interface density and effective heat dissipation has become an urgent problem to be solved in this field. Summary of the Invention

[0004] Object of the Invention: The object of the present invention is to provide a double-layer rear light-emitting port communication device with high interface density and high heat dissipation performance.

[0005] Technical Solution: The communication device with a double-layer rear light-emitting port of the present invention includes a chassis, a plurality of rear plug-in cards, and a plurality of heat dissipation units. The rear plug-in card includes a chassis and a front panel. The rear plug-in cards and the heat dissipation units are arranged at intervals and vertically inserted into the rear part of the chassis. A plurality of light ports and ventilation openings are provided on the front panel.

[0006] Further, the light ports include double-layer light ports and single-layer light ports.

[0007] Further, the ventilation openings are arranged on both sides of the light ports, and the ventilation openings are in the remaining space on the front panel and are as close as possible to the double-layer light ports.

[0008] Further, the shape of the ventilation openings includes one or more of a circle, an ellipse, and a regular polygon.

[0009] Further, the number of the rear plug-in cards is 4, and the number of the heat dissipation units corresponds to that of the rear plug-in cards.

[0010] Further, heat dissipation holes are provided on the front surface of the double-layer optical port.

[0011] When the whole machine is working, the cooling medium enters from the air inlet at the front end of the chassis, passes through the front plug-in cards, the backplane, and the rear plug-in cards, and then is discharged through the heat dissipation units, thereby effectively dissipating heat from the whole machine device with an orthogonal structure.

[0012] Since the double-layer optical ports of the rear plug-in cards and the heat dissipation units are arranged side by side, the air inlet at the front end cannot reach the double-layer optical interfaces. The heat dissipation at the double-layer interfaces of the rear plug-in cards utilizes the different air pressures at both ends of the interfaces. The air pressure at the interface panel is greater than that at the rear end of the interface, so part of the air will enter from the interface panel of the rear plug-in card and then be discharged through the heat dissipation units, thus achieving the effect of dissipating heat from the double-layer interfaces.

[0013] Beneficial effects: Compared with the prior art, the present invention has the following remarkable advantages:

[0014] (1) By improving the heat dissipation structure of the rear plug-in card frame, the present invention greatly improves the heat dissipation performance of the double-layer interfaces without changing the original heat dissipation air duct, avoids the modification of the whole machine structure, and has a wide range of applications;

[0015] (2) By providing double-layer optical ports on the rear plug-in cards, the interface density of the device is additionally increased to meet the requirements of large data flow of users. At the same time, an excellent heat dissipation system can ensure that the generated heat can be quickly discharged when the power consumption increases. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of a communication device with double-layer rear outgoing optical ports according to the present invention;

[0017] Figure 2 It is a schematic structural diagram of a rear plug-in card according to the present invention;

[0018] Figure 3 It is a schematic structural diagram of a double-layer optical port according to the present invention;

[0019] Figure 4 It is an overall structure diagram of a rear plug-in card in an embodiment of the present invention;

[0020] Figure 5 It is a structural diagram of a hexagonal ventilation opening in an embodiment of the present invention;

[0021] Figure 6 It is a top view of the flow direction of the cooling medium for heat dissipation of the double-row rear outgoing interfaces on the rear plug-in card in an embodiment of the present invention. Detailed Embodiments

[0022] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings.

[0023] The inventors have found through research that in most current communication devices with an orthogonal architecture, traffic basically enters / leaves through the interfaces on the front plug-in cards. However, the number of slots in the front of the communication device is fixed, and the number of front plug-in cards that can be placed is limited, which results in a limited interface density. If the interface density needs to be further expanded, it cannot be achieved. Some communication devices use the rear plug-in cards at the back of the chassis to provide interfaces on them, thereby increasing the interface density.

[0024] Although some communication devices have interfaces on their rear plug-in cards, there are more or less some problems. For example, some of the interfaces on the rear plug-in cards are layer-3 interfaces. But to solve the interface heat dissipation and the overall heat dissipation of the machine, the cooling fan can only be built into the rear plug-in card. However, such a design will bring reliability problems because the fan has relatively large vibrations during high-speed operation, and the reliability of the connection points of the single-board connectors will be reduced in the long-term operating environment; some of the interfaces on the rear plug-in cards are dual-layer, but due to structural limitations, the number of rear plug-in cards can only be 2; there are also some rear plug-in cards with single / double-layer mixtures, but to meet the heat dissipation requirements, only an independent heat dissipation air duct for the rear plug-in card can be established, that is, the Z-shaped heat dissipation method is adopted, which leads to an increase in the overall height of the communication device. Therefore, it is necessary to provide an orthogonal structure communication device that can increase the interface density of the device and at the same time ensure good heat dissipation.

[0025] The present invention provides a double-layer rear optical port communication device with high interface density and high heat dissipation, including a chassis 3 and rear plug-in cards 1 and heat dissipation units 2 that are vertically inserted on the chassis 3 and arranged at intervals. The number of rear plug-in cards 1 and heat dissipation units 2 corresponds one by one, ensuring that each optical port on the rear plug-in card 1 has a fan frame for heat dissipation. The two are arranged at intervals in turn and are closely attached, and the entire occupied area of the double-layer optical port 4 is within the range of the heat dissipation unit 2. As Figure 1 shown, four groups of rear plug-in cards and heat dissipation units are adopted in this embodiment.

[0026] As Figure 2 、 Figure 4 shown, the rear plug-in card 1 includes a chassis 6, a front panel 9 is vertically connected to the front end of the chassis 6, a double-layer optical port 4 is provided on the front panel 9, a ventilation opening 5 is provided between adjacent optical ports 4, several connectors 7 are provided on the rear side of the chassis 6 for docking with the front plug-in card, and a main chip 8 is provided in the middle of the chassis 6. Preferably, ventilation holes 10 are provided on the surface of the double-layer optical port 4 to further improve the heat dissipation performance, as Figure 3 shown.

[0027] As a further preference, in order to ensure the best air intake and heat dissipation effect, the shape of the vent 5 is selected from one or a combination of a circle, an ellipse and a regular polygon, but is not limited to the above shapes, and can be particularly preferably a regular hexagon, such as Figure 5 shown.

[0028] When the device is working, the cooling medium enters from the front air inlet of the chassis, and finally passes through the heat dissipation unit 2, and is discharged by the heat dissipation unit 2. In this process, because the double-layer optical port 4 is close to the side of the heat dissipation unit 2 and is smaller in depth than the heat dissipation unit 2, the cooling medium entering from the front cannot flow through the double-layer optical port 4.

[0029] Since the rear card 1 and the heat dissipation unit 2 are arranged in sequence, when the cooling medium is discharged from the heat dissipation unit 2, the wind speed is fast. Figure 6 A high pressure is formed at the front end area a of the double-layer optical port 4, and a low pressure is formed at the rear end area b of the double-layer optical port 4, so part of the cooling medium will be Figure 6 The heat dissipation channel in the double-layer optical port 4 flows through the double-layer optical port 4, enters the heat dissipation unit 2, and is then discharged from the heat dissipation unit 2, thereby playing a role in cooling the double-layer optical port 4. The heat dissipation channel enters through the vents 5 opened on the front panel 9 and the heat dissipation vents 10 of the double-layer optical port.

[0030] It should be noted that if the double-layer interface adopts the method of two single-layer interfaces pressing against each other, or there is only a single-layer interface, then the heat dissipation channel is only through the vent 5 opened on the front panel 9 to enter the double-layer optical port 4 to dissipate heat.

Claims

1. A communication device with a double-layer rear light output port based on an orthogonal chassis, comprising a chassis (3), a plurality of rear plug-in cards (1) and a plurality of heat dissipation units (2), wherein the rear plug-in card (1) comprises a chassis (6) and a front panel (9). Characterized in that the rear plug-in cards (1) and the heat dissipation units (2) are arranged at intervals and vertically inserted into the rear of the chassis (3); a plurality of optical ports (4) and ventilation openings (5) are provided on the front panel (9), heat dissipation holes (10) are provided on the front surface of the optical ports (4), the optical ports (4) include double-layer optical ports and single-layer optical ports, and the ventilation openings (5) are arranged on both sides of the optical ports (4).

2. The communication device with a double-layer rear light output port based on an orthogonal chassis according to claim 1, Characterized in that the shape of the ventilation opening (5) includes one or more of a circle, an ellipse and a regular polygon.

3. The communication device with a double-layer rear light output port based on an orthogonal chassis according to claim 1, Characterized in that the number of the rear plug-in cards (1) and the heat dissipation units (2) is 4 each.

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