Cooling box design for server liquid cooling of electronic equipment racks in data centers

Abstract

The electronic equipment rack includes a plurality of server chassis arranged in a stacked manner. Each server chassis includes one or more servers, and each server includes one or more processors. The electronic equipment rack also includes a plurality of cooling boxes corresponding to the server chassis. Each cooling box is configured to provide liquid cooling to the processor of the server chassis. The cooling box includes a cooling module having one or more cooling devices, wherein the cooling device is arranged and positioned to be vertically aligned with the processor of the corresponding server chassis to extract heat generated from the processor. The cooling box also includes a cooling unit, which is connected to the cooling module to form a cooling loop, so that the cooling liquid circulates between the cooling device and the cooling unit to cool the cooling liquid carrying the heat extracted by the cooling device. A natural convection cooling loop is assembled and adapted on the cooling box.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to data centers. More specifically, embodiments of the present invention relate to cooling box designs for liquid cooling of electronic equipment racks in data centers. Background Art

[0002] Thermal management of high power density chips and processors is a critical issue, especially as the power density of high-end chips such as CPUs (central processing units) and GPUs (general purpose processing units) increases. The cooling device used in the cooling system design is used to maintain the thermal condition of the chip by removing the heat generated by the chip. If the temperature exceeds the limit of the thermal specification, the chip may not operate properly and throttling may occur. In addition, by providing the chip with appropriate or better thermal conditions when the chip is working, better performance or lower power consumption can be achieved.

[0003] Cooling device design is critical. As power density increases, cooling device design or cooling system design becomes a very challenging problem. It requires the cooling device to provide higher heat transfer coefficient, low thermal resistance, larger heat transfer area, as well as high reliability and low operating energy cost and price cost. Effective cooling design for server cooling in electronic equipment racks in data centers is lacking. Summary of the invention

[0004] One aspect of the present disclosure provides an electronic equipment rack of a data center, which includes: a plurality of server chassis arranged in a stacked manner, each server chassis including one or more servers, and each server having one or more processors; and a plurality of cooling boxes, each cooling box corresponding to one of the server chassis, wherein each of the cooling boxes is configured to provide liquid cooling to one or more processors of the corresponding server chassis. Each cooling box includes: a cooling module having one or more cooling devices, the one or more cooling devices being arranged and positioned to be vertically aligned with one or more processors of the corresponding server chassis to extract heat generated from the processors, and a cooling unit connected to the cooling module to form a cooling loop, so that a cooling liquid circulates between the cooling device and the cooling unit to cool the cooling liquid carrying the heat extracted by the cooling device.

[0005] Another aspect of the present disclosure provides a data center system, which includes an array of electronic equipment racks, wherein each electronic equipment rack includes: a plurality of server chassis arranged in a stacked manner, each server chassis including one or more servers, and each server having one or more processors; and a plurality of cooling boxes, each cooling box corresponding to one of the server chassis, wherein each of the cooling boxes is configured to provide liquid cooling to one or more processors of the corresponding server chassis. Each cooling box includes: a cooling module having one or more cooling devices, the one or more cooling devices being arranged and positioned to be vertically aligned with one or more processors of the corresponding server chassis to extract heat generated from the processors, and a cooling unit connected to the cooling module to form a cooling loop, so that a cooling liquid circulates between the cooling device and the cooling unit to cool the cooling liquid carrying the heat extracted by the cooling device.

[0006] Another aspect of the present disclosure provides a cooling box for an electronic equipment rack having multiple server chassis, the cooling box comprising: a cooling module having one or more cooling devices, the one or more cooling devices being arranged and positioned to be vertically aligned with one or more processors of the corresponding server chassis to extract heat generated from the processors; and a cooling unit connected to the cooling module to form a cooling loop, so that cooling liquid circulates between the cooling device and the cooling unit to cool the cooling liquid carrying heat extracted by the cooling device, wherein the cooling box can be inserted into any one of a plurality of server slots and is located on top of the corresponding server chassis so that the cooling device of the cooling box is in contact with the processor of the server chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the invention are illustrated by way of example and not limitation in the figures of the accompanying drawings in which like references indicate similar elements.

[0008] Figure 1 is a block diagram illustrating an example of a cooling box and a server chassis according to one embodiment.

[0009] Figure 2 A cooling box and a server chassis are shown in a separated configuration according to one embodiment.

[0010] Figure 3 A top view of a cooling box according to one embodiment is shown.

[0011] Figure 4 A cooling box using thermosyphon technology according to one embodiment is shown.

[0012] Figure 5 is a block diagram illustrating an example of an electronic equipment rack according to one embodiment. DETAILED DESCRIPTION

[0013] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and accompanying drawings are explanations of the present invention and should not be construed as limiting the present invention. Many specific details are described to provide a thorough understanding of various embodiments of the present invention. However, in some cases, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the present invention.

[0014] Reference to "one embodiment" or "an embodiment" in the specification means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0015] Embodiments of the present disclosure provide a cooling box design that is compatible with a server chassis of an electronic equipment rack used in a data center. The concept can also be extended to other electronic equipment or IT instruments used in autonomous vehicles. The cooling box provides liquid cooling to one or more servers of the server chassis. The cooling box is located on the top of the corresponding server chassis. A pair of cooling boxes and a server chassis can be inserted into any slot or shelf of the electronic equipment rack. The cooling box also includes a cooling unit and a cooling module, which can be integrated into a single unit or a separate unit. The cooling box includes a liquid supply line and a liquid return line connecting the cooling unit and the cooling module to form a closed liquid cooling loop. The design can be implemented with different types of cooling solutions with appropriate designs, such as adding fluid pumps, fans or other components. The coolant can be a single-phase coolant or a two-phase coolant, wherein the two-phase coolant, as part of the thermosiphon natural convection technology, can be converted between liquid and gaseous states according to temperature and pressure.

[0016] According to one aspect, an electronic equipment rack includes a plurality of server chassis arranged in a stacked manner. Each server chassis includes one or more servers, and each server includes one or more processors. The electronic equipment rack also includes a plurality of cooling boxes corresponding to the server chassis. Each cooling box is configured to provide liquid cooling to the processor of the server chassis. The cooling box includes a cooling module having one or more cooling devices, and the one or more cooling devices are arranged and positioned to be vertically aligned with the processor of the corresponding server chassis to extract heat generated from the processor. The cooling box also includes a cooling unit, which is connected to the cooling device / module to form a cooling loop so that the cooling liquid circulates between the cooling device and the cooling unit to cool the cooling liquid carrying the heat extracted by the cooling device.

[0017] In one embodiment, each cooling box is located on top of a corresponding server chassis so that a cooling device of the cooling box is in contact with a processor of the server chassis. A cooling liquid circulates between a cooling unit and the cooling device within the cooling box without using an external cooling liquid outside the cooling box. The cooling unit includes a liquid-to-air heat exchanger. The cooling device may be a cold plate having a cooling liquid distribution channel disposed therein. The cooling unit may be located above the cooling device.

[0018] In one embodiment, the cooling box further comprises a liquid supply line extending from the cooling unit to supply the cooling liquid to the cooling device. The cooling box further comprises a liquid return line extending from the cooling device back to the cooling unit to circulate the cooling liquid, which can be implemented using a liquid pump disposed in the cooling box. The cooling liquid can be a single-phase liquid or a two-phase liquid, and when the temperature of the cooling liquid is higher than a first predetermined threshold, the two-phase liquid can be transformed into a vapor, and when the temperature drops below a second predetermined threshold, the two-phase liquid can be transformed from the vapor back into a liquid state.

[0019] According to another aspect, a cooling box shares a similar form factor with a server chassis to be used within an electronics rack and includes a cooling module and a cooling unit. The cooling module includes one or more cooling devices arranged and positioned to be vertically aligned with one or more processors of a corresponding server chassis to extract heat generated from the processors. The cooling unit is coupled to the cooling module to form a cooling loop so that a cooling fluid circulates between the cooling device and the cooling unit. The cooling unit is configured to reduce the temperature of the cooling fluid carrying heat extracted by the cooling device. The cooling box can be inserted into any server slot or shelf and is located on top of the corresponding server chassis so that the cooling device of the cooling box contacts the outer surface of the processor of the server chassis.

[0020] According to another aspect, a data center system includes a plurality of electronic equipment racks, each of which includes one or more server chassis and one or more cooling boxes, each of which includes a cooling module and a cooling unit as described above.

[0021] Figure 1 is a block diagram showing an example of a cooling box of a server chassis according to an electronic equipment rack according to one embodiment. Figure 1, the cooling box 101 is positioned and attached on the top of the server chassis 102 in the electronic equipment rack. The cooling box 101 includes a cooling unit 103 and a cooling module 104. The cooling module 104 includes one or more cooling devices 105A to 105C (collectively referred to as cooling devices 105). The server chassis 102 includes one or more servers 109, and each server 109 includes one or more processors 106A to 106C (collectively referred to as processors 106). When the cooling box 101 is located on the top of the server chassis 102, the cooling device 105 of the cooling module 104 contacts the processor 106 of the server chassis 102 to extract the heat generated from the processor 106.

[0022] In one embodiment, the cooling unit 103 is located on top of the cooling module 104. The cooling unit 103 is connected to the cooling module via a liquid supply line 107 and a liquid return line 108 so that the cooling liquid circulates between the cooling unit 103 and the cooling device 105 of the cooling module 104. The liquid supply line 107 is configured to supply the cooling liquid to the cooling device 105, where the cooling liquid has been cooled by the cooling unit 103. The cooling liquid flows through each of the cooling devices 105 via one or more liquid distribution channels to exchange the heat generated from the processor 106. Different liquid distribution methods can be used, such as parallel mode, series mode; a fluid distribution device such as a manifold can be assembled in the cooling module 104. The cooling liquid carrying the exchanged heat returns to the cooling unit 103 via the liquid return line 108, and is cooled again by the cooling unit 103 for circulation. Note that the cooling liquid circulates completely within the cooling box 101 without using an external cooling liquid or connecting to an external cooling liquid source.

[0023] In one embodiment, the cooling box 101 and the server chassis 102 have similar or identical form factors (e.g., similar or identical physical dimensions). The cooling box 101 can be inserted into any server slot or server shelf of an electronic equipment rack. Typically, the cooling box 101 can be stacked on top of the server chassis 102. The stacked cooling box 101 and server chassis 102 are then inserted into corresponding slots of the electronic equipment rack.

[0024] In this example, the cooling unit 103 and the cooling module 104 are integrated into the cooling box 101 as a single integrated unit. Figure 2 As shown in , the cooling unit 103 and the cooling module 104 can be assembled separately and can be provided by different vendors or manufacturers. Figure 2, the cooling unit 103 can be connected to the cooling module 104 via paired supply lines 107A to 107B and return lines 108A to 108B. The paired supply lines 107A to 107B and / or the paired return lines 108A to 108B can be connected using a drip-free blind mating connector. Based on actual usage, different connection methods can be applied to the loops 108A, 108B and 107A, 107B. In one embodiment, in order to circulate the coolant more efficiently, a liquid pump can be provided in the cooling box 101.

[0025] Figure 3 A top view of a cooling box according to one embodiment is shown. Figure 3 In this example, the cooling unit 103 may be a heat exchanger, specifically, a liquid-to-air heat exchanger. The coolant is cooled by the cooling unit 103 and supplied to the cooling device via a liquid supply line 107. The coolant carrying the heat extracted by the cooling device is returned to the cooling unit via a liquid return line 108. A liquid pump 110 may be provided on the supply line 107 to circulate the coolant, or alternatively, the liquid pump 110 may be provided on the liquid return line 108. In addition, a cooling fan 112 is mounted on the side to provide air cooling to the heat exchanger 103. In one embodiment, the outer surface of the heat exchanger 103 may include a set of fins as a part of a heat sink or radiator to radiate heat with the aid of the cooling fan 112. In addition, additional functions such as leak detection sensors, fluid sensors, etc. may be provided in this area.

[0026] The above coolant is considered to be a single-phase coolant. That is, the coolant does not change its state or form due to its temperature. According to one embodiment, a multi-phase coolant can also be used as part of the thermosiphon technology. When the temperature of the coolant is below a first predetermined threshold, the two-phase coolant is in a liquid state, and when its temperature is above a second predetermined threshold, the two-phase coolant transforms into a gaseous state.

[0027] Figure 4 is a block diagram showing an example of a cooling box using thermosyphon technology according to one embodiment. Figure 4, in this example, the coolant is a two-phase coolant. The cooling unit 103 is used as a condenser to cool and condense the coolant in a gaseous state, and when the temperature of the coolant drops below a predetermined threshold or due to a change (i.e., increase) in the density of the coolant, the coolant is converted back to a liquid state. The coolant in a liquid state is supplied downward to the cooling device 105 via a liquid supply line. When the coolant in a liquid state flows through each of the cooling devices 105, the coolant is converted from a liquid state to a gaseous state. The vapor moves upward to the vapor region 201 of the cooling unit 103 via a vapor path represented by a dotted line. The vapor is cooled by the cooling unit 103, its density increases, it is converted from a gaseous state to a liquid state, and falls into the liquid region 202 due to its gravity and density. Then, the coolant in a liquid state circulates downward to the cooling device 105.

[0028] In one embodiment, the cooling box 101 further comprises a heat sink having one or more fins attached to the top surface of the cooling unit. Alternatively, the cover of the cooling unit 103 comprises one or more fins integrated thereon. The cooling box further comprises one or more cooling fans that blow air across the fins to cool the temperature of the container of the cooling unit 103. The cover or container of the cooling unit 103 may be made of a thermally conductive material such as metal.

[0029] Figure 5 is a block diagram showing an example of an electronic equipment rack according to one embodiment. Figure 5 , the electronic equipment rack 500 includes a plurality of slots or shelves. Each slot can receive a server chassis or a cooling box as described above. As described above, the cooling box is positioned and attached to the top of the server chassis before being inserted into the slot. In this example, the electronic equipment rack 500 includes bundles 501 to 503. Each of the bundles 501 to 503 includes a cooling box located on the top of the server chassis as described above. The electronic equipment rack 500 also includes other components 504, such as a power supply, a backup battery unit, etc. At the rear end, one or more fans 505 can be used to provide air cooling.

[0030] In the above description, embodiments of the present invention have been described with reference to specific exemplary embodiments of the present invention. It will be apparent that various modifications may be made to the present invention without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Therefore, this specification and the accompanying drawings should be understood in an illustrative rather than a restrictive sense.

Claims

1. An electronic equipment rack of a data center, comprising: A plurality of server chassis arranged in a stacked manner, each server chassis including one or more servers, and each server having one or more processors; as well as a plurality of cooling boxes, each cooling box corresponding to one of the server chassis, wherein each of the cooling boxes is configured to provide liquid cooling to one or more processors of the corresponding server chassis, wherein each cooling box comprises: a cooling module having one or more cooling devices, wherein each of the one or more cooling devices is vertically aligned with and in contact with a corresponding processor of the one or more processors, and a cooling unit coupled to the cooling module to form a cooling circuit, the cooling unit and the cooling module being integrated in the cooling box as a single integrated unit, so that a coolant circulates between the one or more cooling devices and the cooling unit to cool the coolant carrying heat extracted by the one or more cooling devices; the cooling unit being located above the one or more cooling devices; The coolant is a two-phase coolant, wherein after being cooled in the cooling unit, the coolant changes from a gaseous state to a liquid state, and the coolant is supplied downward to the cooling device in the liquid state, and after extracting the heat from the one or more processors, the coolant changes from the liquid state to the gaseous state, and the coolant moves upward to the cooling unit in the gaseous state.

2. The electronic equipment rack according to claim 1, wherein: Each cooling box is located on top of the corresponding server chassis so that the one or more cooling devices of the cooling box are in contact with the one or more processors of the corresponding server chassis.

3. The electronic equipment rack according to claim 1, wherein: The coolant is circulated between the cooling unit and the one or more cooling devices within the cooling box without using an external coolant outside the cooling box.

4. The electronic equipment rack according to claim 1, wherein: The cooling unit includes a liquid-to-air heat exchanger.

5. The electronic equipment rack according to claim 1, wherein: At least one of the one or more cooling devices includes a cold plate.

6. The electronic equipment rack according to claim 1, wherein: The cooling box also includes: a supply line extending from the cooling unit to supply the cooling liquid to the cooling device to exchange heat generated from a processor of the server chassis; and A return line is connected to the cooling device to return the coolant carrying the heat to the cooling unit.

7. The electronic equipment rack according to claim 6, wherein: The cooling liquid flows downwardly through the supply line in a liquid state, and the cooling liquid flows upwardly through the return line in a gaseous state.

8. The electronic equipment rack according to claim 1, wherein: An outer surface of the cooling unit includes one or more fins that operate as heat radiators, and wherein the cooling box further includes a cooling fan that blows air across the fins.

9. The electronic equipment rack according to claim 1, wherein: Each cooling tank also includes a liquid pump to circulate the cooling liquid.

10. The electronic equipment rack according to claim 1, wherein: Each cooling box has the same physical form factor as a server chassis.

11. A data center system, comprising: An array of electronic equipment racks, wherein each electronic equipment rack comprises: a plurality of server chassis arranged in a stacked manner, each server chassis including one or more servers, and each server having one or more processors; and a plurality of cooling boxes, each cooling box corresponding to one of the server chassis, wherein each of the cooling boxes is configured to provide liquid cooling to one or more processors of the corresponding server chassis, wherein each cooling box comprises: a cooling module having one or more cooling devices, wherein each of the one or more cooling devices is vertically aligned with and in contact with a corresponding processor of the one or more processors, and a cooling unit connected to the cooling module to form a cooling circuit, wherein the cooling unit and the cooling module are integrated into the cooling box as a single integrated unit so that a coolant circulates between the cooling device and the cooling unit, to cool the coolant carrying heat extracted by the cooling device; The cooling unit is located above the one or more cooling devices; The coolant is a two-phase coolant, wherein after being cooled in the cooling unit, the coolant changes from a gaseous state to a liquid state, and the coolant is supplied downward to the cooling device in the liquid state, and after extracting the heat from the one or more processors, the coolant changes from the liquid state to the gaseous state, and the coolant moves upward to the cooling unit in the gaseous state.

12. The data center system according to claim 11, wherein: Each cooling box is located on top of the corresponding server chassis so that the one or more cooling devices of the cooling box are in contact with the one or more processors of the corresponding server chassis.

13. The data center system according to claim 11, wherein: The coolant is circulated between the cooling unit and the one or more cooling devices within the cooling box without using an external coolant outside the cooling box.

14. The data center system according to claim 11, wherein: The cooling unit includes a liquid-to-air heat exchanger.

15. The data center system according to claim 11, wherein: At least one of the cooling devices comprises a cold plate.

16. A cooling box for an electronic equipment rack having a plurality of server chassis, the cooling box comprising: a cooling module having one or more cooling devices, wherein each of the one or more cooling devices is vertically aligned with and in contact with a corresponding processor of the one or more processors; and a cooling unit coupled to the cooling module to form a cooling loop, the cooling unit and the cooling module being integrated into the cooling box as a single integrated unit, so that a cooling liquid circulates between the one or more cooling devices and the cooling unit to cool the cooling liquid carrying heat extracted by the one or more cooling devices, wherein the cooling box is insertable into any one of a plurality of server slots and is located on top of a corresponding server chassis so that the one or more cooling devices of the cooling box are in contact with the one or more processors of the server chassis; the cooling unit is located above the one or more cooling devices; The coolant is a two-phase coolant, wherein after being cooled in the cooling unit, the coolant changes from a gaseous state to a liquid state, and the coolant is supplied downward to the cooling device in the liquid state, and after extracting the heat from the one or more processors, the coolant changes from the liquid state to the gaseous state, and the coolant moves upward to the cooling unit in the gaseous state.

17. The cooling box according to claim 16, wherein: The cooling box has the same form factor as the corresponding server chassis.

18. The cooling box according to claim 16, wherein: The coolant is circulated between the cooling unit and the one or more cooling devices within the cooling box without using an external coolant outside the cooling box.

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