Laser processing equipment loading system and method

Abstract

The present invention provides a loading system and method for a laser processing device, including: a detection component, a motion component, and a calculation component; the motion component is used to move the substrate to be processed to the detection area of the detection component and adjust the position of the workbench; the detection component is used to detect the position information of the substrate to be processed and transmit the detection result to the calculation component; the calculation component is used to perform data processing on the detection result and control the motion component according to the data processing result; the calculation component compares the detection result with a standard template to obtain the angular deviation value and the spatial deviation value between the substrate to be processed and the standard template, calculates the angular correction scheme and the spatial correction scheme according to the angular deviation value and the spatial deviation value, and performs angular correction and spatial correction through the motion component. By adopting a non-clamping system, the present invention avoids the substrate damage caused by the clamping action, reduces the generation of waste wafers caused by clamping errors, and greatly improves the stability of material placement and the working efficiency of the whole machine.

Description

Technical Field

[0001] The present invention relates to the field of laser processing equipment, and particularly to a loading system and method for laser processing equipment. Background Art

[0002] In the current laser processing field, more than ninety percent of the loading systems used in laser processing equipment on the market are clamping and positioning worktables with bearings (bearings), and only a small part uses a bearingless worktable that can automatically identify loading. The loading worktables with automatic identification functions are mostly imported equipment and are relatively expensive.

[0003] The working mode of the original loading system with clamping is as follows:

[0004] The pick-up manipulator takes out the substrate from the magazine, and then the movement motor drives the pick-up manipulator to transport the substrate to the unloading position. The pick-up manipulator descends, places the substrate on the worktable surface, then the pick-up manipulator rises, and the movement motor drives the pick-up manipulator to move to the pending position. The clamping system of the workbench is controlled by a cylinder to drive the clamping wheel to clamp the substrate. At this time, the substrate is between the clamping wheel and the fixed wheel, and the substrate is positioned in this way. Then the workbench adsorbs vacuum, and the clamping wheel resets for subsequent movement.

[0005] In the existing bearing clamping and positioning worktable, problems such as dark cracks in the substrate and waste pieces caused by deviation of the clamping action often occur during the loading process, and both the positioning wheel and the moving wheel are consumables and need to be maintained and replaced regularly. Summary of the Invention

[0006] In order to solve the above defects of the existing bearing clamping and positioning worktable, the present invention provides the following loading system and method for laser processing equipment.

[0007] To achieve the above object, the present invention adopts the following specific technical solutions:

[0008] A loading system for laser processing equipment, comprising: a detection component, a movement component, and a calculation component;

[0009] The movement component is used to move the substrate to be processed to the detection area of the detection component and adjust the position of the workbench;

[0010] The detection component is used to detect the position information of the substrate to be processed and transmit the detection result to the calculation component;

[0011] The calculation component is used to process the detection results and control the motion component according to the data processing results; the calculation component compares the detection results with the standard template to obtain the angular deviation value and spatial deviation value between the substrate to be processed and the standard template, calculates the angular correction scheme and spatial correction scheme according to the angular deviation value and spatial deviation value, and performs angular correction and spatial correction through the motion component.

[0012] Preferably, the detection component includes: an identification camera and an illumination light source; the motion component moves the substrate to be processed to the set detection position, the illumination light source provides illumination, and the identification camera performs graphic acquisition.

[0013] Preferably, the motion component includes: a manipulator, a first micro motor for controlling the manipulator, and a second motor for controlling the workbench; the manipulator clamps and moves the substrate to be processed; the first micro motor drives the manipulator to perform angular movement or position movement; the second motor drives the workbench to perform position movement.

[0014] Preferably, the first micro motor is a small servo motor.

[0015] Preferably, the spatial deviation value includes: a horizontal deviation value and a vertical deviation value.

[0016] The method for loading a laser processing device includes the following steps:

[0017] S1. The motion component performs a wafer picking action, and after the wafer picking action is completed, moves the substrate to be processed to the set detection area; the detection component detects the substrate to be processed and transmits the detection results to the calculation component;

[0018] S2. The calculation component compares the detection results with the standard template to obtain the angular deviation value between the substrate to be processed and the standard template, calculates the angular correction scheme according to the angular deviation value, and performs angular correction through the motion component according to the angular correction scheme; after the correction is completed, the detection component performs detection again and transmits the detection results to the calculation component;

[0019] S3. Repeat S2 until there is no angular deviation between the substrate to be processed and the standard template;

[0020] S4. The calculation component compares the last detection result in S2 or S3 with the standard template to obtain the final spatial deviation value between the substrate to be processed and the standard template, calculates the spatial correction scheme according to the spatial deviation value, and moves the workbench through the motion component for spatial correction according to the spatial correction scheme to keep the spatial position relationship between the workbench and the substrate to be processed fixed;

[0021] S5. The motion component moves the substrate to be processed to the set feeding position on the upper surface of the workbench to complete one loading operation.

[0022] Preferably, the spatial deviation value includes: a horizontal deviation value and a vertical deviation value.

[0023] The present invention can achieve the following technical effects:

[0024] (1) By adopting a non-clamping system, the substrate damage caused by the clamping action is avoided, the generation of waste wafers due to clamping errors is reduced, the stability of the feeding and the working efficiency of the whole machine are greatly improved, the qualified rate of the product is indirectly improved, and the generation of waste wafers during work is reduced.

[0025] (2) The clamping mechanism is cancelled, thereby reducing the personnel cost and capital cost of the daily maintenance of the equipment.

[0026] (3) The research and development of the non-clamping mechanism is of great help to the improvement of the quality of the laser processing equipment, also lays a solid foundation for the future market prospect of the laser processing equipment, and provides help for the improvement of different semiconductor equipment in the future. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a three-dimensional schematic diagram of the loading system of the laser processing equipment according to an embodiment of the present invention;

[0028] Figure 2 is Figure 1 the front view of the three-dimensional schematic diagram of the loading system of the laser processing equipment shown in the embodiment;

[0029] Figure 3 is Figure 1 the right view of the three-dimensional schematic diagram of the loading system of the laser processing equipment shown in the embodiment;

[0030] Figure 4 is Figure 1 the top view of the three-dimensional schematic diagram of the loading system of the laser processing equipment shown in the embodiment.

[0031] The reference numerals therein include: a detection component 1, an identification camera 101, an illumination light source 102, a motion component 2, a manipulator 201, and a first micro motor 202. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, and do not constitute a limitation to the present invention.

[0033] As Figure 1 shown, the loading system of the laser processing equipment provided by the embodiment of the present invention includes: a detection component 1, a motion component 2, and a calculation component.

[0034] The detection component 1 includes a detector and a detection environment providing device. After the motion component 2 moves the substrate to be processed to the detection area of the detection component 1, a signal is transmitted to the detection component 1, the detection environment providing device is activated to provide the environment required for the normal operation of the detector, and the detector starts to work, obtaining a detection result and transmitting the detection result to the calculation component.

[0035] The calculation component processes the detection results transmitted by the detection component, designs a solution based on the data processing results, and transmits the designed solution to the motion component to control the motion of the motion component 2.

[0036] The motion component 2 includes a manipulator for moving the substrate to be processed, a first motor for controlling the manipulator, and a second motor for controlling the workbench. Both the first motor and the second motor can be controlled to move through a program, so that they can move according to the solution designed by the calculation component.

[0037] In an embodiment of the present invention, the motion component 2 includes a rotary motor for angle deviation correction and a linear motor for spatial deviation correction. The angle deviation of the manipulator is corrected by rotating the angle of the rotary motor, and the workbench is horizontally and vertically corrected by the linear motor.

[0038] As Figures 2-4 shown, in an embodiment of the present invention, the detection component 1 includes: an identification camera 101, an illumination light source 102, and the motion component 2 includes: a manipulator 201, a first micro-motor 202 for controlling the manipulator.

[0039] In an embodiment of the present invention, the first micro-motor 202 is a small servo motor. Compared with the commonly used stepping motor, the small servo motor has the advantage of more precise motion control and can perform precise positioning more effectively.

[0040] In an embodiment of the present invention, the spatial deviation value includes a horizontal deviation value and a vertical deviation value. The calculation component calculates a horizontal correction solution and a vertical correction solution based on the horizontal deviation value and the vertical deviation value, and sends the correction solution to the linear motor, and the linear motor performs horizontal correction and vertical correction on the workbench surface.

[0041] The following Figures 1-4 will be used to illustrate the specific working mode of the present invention in detail:

[0042] (1) The first micro-motor 202 controls the manipulator 201 to perform an operation of returning to the set starting point to ensure that the initial position of the manipulator 201 is fixed.

[0043] (2) The first micro-motor 202 controls the manipulator 201 to move to the magazine for picking up the wafer. After the picking-up operation is completed, the manipulator 201 and the substrate to be processed are moved to the set detection area together. After the movement is completed, the first micro-motor 202 transmits a movement-in-place signal to the motion control card. After receiving the movement-in-place signal, the motion control card turns on the illumination light source 102 and starts the recognition camera 101 to perform image acquisition.

[0044] (3) The calculation component compares the collected image with the standard template to obtain the angular deviation value between the substrate to be processed and the standard template, calculates the angular correction scheme according to the angular deviation value, and controls the manipulator 201 to perform angular correction through the first micro-motor 202 according to the angular correction scheme. After the correction is completed, the first micro-motor 202 transmits a correction-completed signal to the motion control card. After receiving the correction-completed signal, the motion control card starts the recognition camera 101 again to perform image acquisition.

[0045] (4) Repeat step (3) until there is no angular deviation between the substrate to be processed and the standard template.

[0046] (5) The calculation component compares the last collected image in step (3) or (4) with the standard template to obtain the final spatial deviation value between the substrate to be processed and the standard template, calculates the spatial correction scheme according to the spatial deviation value, and moves the workbench through the second motor according to the spatial correction scheme to perform spatial correction, keeping the spatial position relationship between the workbench and the substrate to be processed fixed.

[0047] (6) According to the preset action, the first micro-motor 202 controls the manipulator 201 to accurately move the substrate to be processed to the set feeding position on the upper surface of the workbench, completing one loading operation.

[0048] The non-clamping system provided by the present invention has certain advantages in terms of quality improvement compared to the edge positioning clamping system, can improve the positioning accuracy, and thus reduce the yield decline and increased production cost caused by waste wafers due to inaccurate positioning.

[0049] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0050] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

[0051] The specific embodiments of the present invention described above do not constitute a limitation to the protection scope of the present invention. Any other corresponding changes and deformations made according to the technical concept of the present invention should be included within the protection scope of the claims of the present invention.

Claims

1. Feeding method for laser processing equipment, characterized in that, it includes the following steps: S1. The moving component performs a wafer picking action, and after the wafer picking action is completed, moves the substrate to be processed to a set detection area; the detection component detects the substrate to be processed and transmits the detection result to the calculation component; S2. The calculation component compares the detection result with the standard template to obtain the angular deviation value between the substrate to be processed and the standard template, calculates the angular correction scheme according to the angular deviation value, and performs angular correction through the moving component according to the angular correction scheme; after the correction is completed, the detection component performs detection again and transmits the detection result to the calculation component; S3. Repeat S2 until there is no angular deviation between the substrate to be processed and the standard template; S4. The calculation component compares the last detection result in S2 or S3 with the standard template to obtain the final spatial deviation value between the substrate to be processed and the standard template, calculates the spatial correction scheme according to the spatial deviation value, and moves the workbench through the moving component for spatial correction according to the spatial correction scheme to keep the spatial position relationship between the workbench and the substrate to be processed fixed; S5. The moving component moves the substrate to be processed to the set feeding position on the upper surface of the workbench to complete one feeding operation.

2. The feeding method for laser processing equipment according to claim 1, characterized in that, the spatial deviation value includes: horizontal deviation value, vertical deviation value.

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