A packaging device for Wiegand wire

Abstract

This invention discloses a Wiegand wire packaging device, comprising a substrate, a wafer layer, an insulating separator layer, and an insulating shell for packaging. An induction coil is etched on the wafer layer and connected to an output pin via a connecting wire. The number of wafer layers can be one or two. When there is only one wafer layer, it is disposed between the substrate and the insulating separator layer or on the side of the insulating separator layer away from the substrate. When there are two wafer layers, each wafer layer includes an upper wafer layer and a lower wafer layer. The lower wafer layer is disposed between the substrate and the insulating separator layer, and the upper wafer layer is disposed on the side of the insulating separator layer away from the substrate. The Wiegand wire is disposed within the insulating separator layer. This invention directly wraps the Wiegand wire within the insulating material, solving the problems associated with wire threading, reducing the size, and avoiding human intervention. It also solves the problem of poor consistency in coil resistance and inductance parameters caused by traditional winding methods, simplifying the production process.

Description

Technical Field

[0001] The present invention belongs to the field of electronics / new energy, and specifically relates to a packaging device, and in particular to a packaging device for Wiegand wires. Background Art

[0002] Wiegand wire is a magnetic alloy wire based on the Wiegand effect. After adding an induction coil to the Wiegand wire and placing it in a magnetic field, when the polarity of the external magnetic field changes and the magnetic induction intensity reaches the excitation threshold, an electrical pulse signal can be generated in the induction coil. Based on this characteristic, people have created a Wiegand sensor that does not require power and works through a dual-pole excitation method. When the magnetic field polarity changes once, the sensor outputs a pair of positive and negative electrical pulse signals, and the signal amplitude is independent of the speed of the magnetic field change, and can work at close to zero speed.

[0003] The current Wiegand sensors are composed of Wiegand wire, frame, induction coil, shell and output pin. Insert the Wiegand wire into the frame with the induction coil wrapped around it, and put it into the shell as a whole. Then weld the induction coil output wire and the output pin. Finally, fill the shell with packaging glue and fix the frame. The Wiegand sensor is completed.

[0004] However, this structure will cause the following problems in the actual production and application of Wiegand sensors:

[0005] 1. Complex structure and large size: If the size is too large, it will affect the integration and miniaturization of electronic product design during use, as well as the complexity of the production process. At the same time, due to the large thickness of the sensor, in the working mode with magnetic steel as the excitation source, the actual distance between the Wiegand wire and the magnetic field is increased, which actually reduces the sensitivity of the Wiegand sensor. The structure currently used in the manufacture of Wiegand sensors requires a skeleton to isolate the induction coil and the Wiegand wire, and to support the induction coil, plus the outer shell and pins, which is bound to cause the entire sensor to be too large. Although there are patch-type Wiegand sensors on the market now, only the pins are replaced with patch form, and its structure still relies on the skeleton wrapped around the induction coil, which fails to substantially solve the problem of large size;

[0006] 2. The relevant parameter errors of the sensor are large: During the production process of the Wiegand sensor, the induction coil needs to be wound on the frame by a wire winding machine. Due to the errors of the winding machine during the winding process and the induction coil material itself, the resistance, inductance and standard values ​​of the Wiegand sensor may have certain errors, and this error is unavoidable under the existing structure and production method;

[0007] 3. Too much human intervention is required, which reduces the degree of automated production: During the production process of Wiegand sensors, the Wiegand wire needs to be threaded, that is, the Wiegand wire needs to be inserted into the frame. Since the through-hole diameters of the Wiegand wire and the frame are relatively thin, and the length of the Wiegand wire is relatively short, manual threading is still required. In addition, since the Wiegand sensor needs to weld the output wire of the induction coil to the pin, the frame installation and welding process still need to be completed manually. Summary of the invention

[0008] The present invention aims to solve the problems existing in existing Wiegand sensor products and proposes a packaging structure for packaging Wiegand wire into a chip, so as to improve the integration and miniaturization of Wiegand sensor products and the standardization and automation of production.

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] A packaging device for Wiegand wires comprises a substrate, a wafer layer, an insulating partition layer, and an insulating shell for packaging, wherein an induction coil is etched on the wafer layer, and the induction coil is connected to an output pin via a connecting line. The number of the wafer layers is one or two. When the number of the wafer layers is one, the wafer layer is arranged between the substrate and the insulating partition layer or on a side of the insulating partition layer away from the substrate. When the number of the wafer layers is two, the wafer layers comprise an upper wafer layer and a lower wafer layer, the lower wafer layer is arranged between the substrate and the insulating partition layer, the upper wafer layer is arranged on a side of the insulating partition layer away from the substrate, and the Wiegand wire is arranged in the insulating partition layer.

[0011] Furthermore, a mounting layer is provided on the substrate, and the mounting layer is fixed on the substrate to position and fix the superstructure.

[0012] Furthermore, when the wafer layer is disposed between the substrate and the insulating spacer layer, the lower surface of the wafer layer disposed between the substrate and the insulating spacer layer is connected to the mounting layer, and the upper surface thereof is connected to the insulating spacer layer.

[0013] Furthermore, the insulating partition layer includes two layers, an upper insulating partition layer and a lower insulating partition layer. The upper surface of the lower insulating partition layer is provided with a lower through hole groove, and the lower surface of the upper insulating partition layer is provided with an upper through hole groove. When the upper insulating partition layer and the lower insulating partition layer are superimposed, the upper through hole groove and the lower through hole groove together form a complete through hole, and a Wiegand wire is installed in the through hole.

[0014] Furthermore, the upper through hole groove and the lower through hole groove are both semicircular through hole grooves.

[0015] Furthermore, the insulating partition layer is a whole insulating partition structure, and the Wiegand wire is encapsulated in the whole insulating partition.

[0016] Furthermore, the insulating shell is a cover structure with an open end, the insulating shell is installed on the substrate, and the open end is connected to the substrate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The packaging structure of the Wiegand wire implemented by the present invention changes the original method of threading the wire into the through hole of the skeleton to a method of laminating the upper and lower layers of the insulating partition, so that the Wiegand wire is directly wrapped in the insulating material, which solves the trouble caused by threading the wire, and because the insulating partition can be made very thin, the volume is greatly reduced, and the necessity of human intervention in production is also reduced. In addition, since the induction coil is etched on the wafer instead of the traditional winding method, on the one hand, it solves the problem of poor consistency of coil resistance and inductance parameters caused by the traditional winding method, and on the other hand, it simplifies the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a left side view of the packaging structure of the present invention.

[0020] Figure 2 It is a front view of the packaging structure of the present invention.

[0021] Markings in the figure: 1. Insulating shell; 2. Upper wafer layer; 3. Upper insulating partition layer; 4. Wiegand wire; 5. Lower insulating partition layer; 6. Lower wafer layer; 7. Mounting layer; 8. Substrate; 9. Connecting wire. DETAILED DESCRIPTION

[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] This embodiment provides a Figure 1-2The packaging device of Wiegand wire shown in the figure. The packaging device includes a substrate 8, a wafer layer, an insulating partition layer, and an insulating shell 1 for packaging. An induction coil is etched on the wafer layer, and the induction coil is connected to the output pin through a connecting line 9. The number of wafer layers is one or two. When the number of wafer layers is one, the wafer layer is arranged between the substrate 8 and the insulating partition layer or arranged on the side of the insulating partition layer away from the substrate 8; when the number of wafer layers is two, the wafer layer includes an upper wafer layer 2 and a lower wafer layer 6, the lower wafer layer 6 is arranged between the substrate 8 and the insulating partition layer, and the upper wafer layer 2 is arranged on the side of the insulating partition layer away from the substrate 8. A Wiegand wire 4 is arranged in the insulating partition layer. The packaging structure of the Wiegand wire in this embodiment changes the original method of threading the wire into the through hole of the skeleton to directly wrapping the Wiegand wire in the insulating material, thereby solving the trouble caused by threading the wire, and because the insulating partition can be made very thin, the volume is greatly reduced, and the necessity of human intervention in production is also reduced; in addition, because the induction coil is etched on the wafer instead of the traditional winding method, on the one hand, it solves the problem of poor consistency of coil resistance and inductance parameters caused by the traditional winding method, and on the other hand, it simplifies the production process.

[0024] In this embodiment, the wafer layer has two parts, one part is the lower wafer layer 6 located close to the mounting layer, and the other part is the upper wafer layer 2 located at the top of the structure, and special coils are etched on both wafer layers to replace the traditional wound induction coils, and the pads etched on the wafer are used to connect the coils to the output pins through connecting wires.

[0025] In order to facilitate the positioning and installation of the upper structure, the present embodiment separates the positioning and installation functions, and separately sets a mounting layer 7 on the substrate 8. The mounting layer 7 is fixed on the substrate to position and fix the upper structure. At this time, if the wafer layer is set between the substrate 8 and the insulating spacer layer, the lower surface of the wafer layer is connected to the mounting layer 7, and the upper surface thereof is connected to the insulating spacer layer.

[0026] In order to make the Wiegand wire easier to install and disassemble, in this embodiment, the insulating partition layer is preferably set as a double-layer structure, that is, the insulating partition layer includes two layers, an upper insulating partition layer 3 and a lower insulating partition layer 5. The upper surface of the lower insulating partition layer 5 is provided with a lower through hole groove, and the lower surface of the upper insulating partition layer 3 is provided with an upper through hole groove. In this embodiment, the upper through hole groove and the lower through hole groove are further preferably semicircular through hole grooves. When the upper insulating partition layer 3 and the lower insulating partition layer 5 are superimposed, the upper through hole groove and the lower through hole groove together form a complete through hole for installing the Wiegand wire, which replaces the traditional form of skeleton threading. In this embodiment, the original way of threading the wire into the skeleton through hole is changed to a way of laminating the upper and lower layers of the insulating partition, so that the Wiegand wire is directly wrapped in the insulating material, which solves the trouble caused by threading the wire and makes the threading process more convenient and controllable. Of course, the insulating partition layer in the present invention can also be set as a whole insulating partition structure, and the Wiegand wire is encapsulated in the whole insulating partition, which does not affect the realization of the purpose of the present invention.

[0027] In this embodiment, the insulating shell 1 is preferably a cover structure with an open end, for example, it can be a rectangular structure, and the material is preferably a plastic shell. The insulating shell 1 is installed on the substrate 8 to encapsulate the entire chip structure, and the open end is connected to the substrate 8.

[0028] This embodiment provides a packaging method for Wiegand wires. The method is described by taking only one of the preferred structures in the above embodiments as an example. The preferred structure of the packaging device for Wiegand wires includes two wafer layers, and the insulating partition layer is set to a double-layer structure. The specific method steps are as follows:

[0029] Step 1: The substrate 8 is the bottom layer of the entire chip and is used to fix the entire chip structure.

[0030] Step 2: Connect the mounting layer 7 to the substrate 8 to fix the mounting position of the wafer and the Wiegand.

[0031] Step 3: Lay the lower wafer 6 on the mounting layer 7, and connect the wafer to the output end through the connecting wire 9 by welding.

[0032] Step 4: Lay the lower insulating partition 5 on the lower wafer 6, put the Wiegand wire 4 into the groove position of the lower partition 6, and fix it with glue.

[0033] Step 5: Lay the upper insulating spacer 3 on the lower insulating spacer 5 .

[0034] Step 6: Lay the upper wafer 2 on the upper insulating partition 3, and connect the wafer to the output end through the connecting wire 9 by welding.

[0035] Step 7: Finally, plastic seal the shell to complete the packaging.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging device for Wiegand wire, characterized in that: The invention comprises a substrate (8), a wafer layer, an insulating spacer layer, and an insulating shell (1) for packaging, wherein an induction coil is etched on the wafer layer, and the induction coil is connected to an output pin via a connecting line (9). The number of the wafer layers is one or two. When the number of the wafer layers is one, the wafer layer is arranged between the substrate (8) and the insulating spacer layer or arranged on a side of the insulating spacer layer away from the substrate (8). When the number of the wafer layers is two, the wafer layers comprise an upper wafer layer (2) and a lower wafer layer (6), wherein the lower wafer layer (6) is arranged between the substrate (8) and the insulating spacer layer, and the upper wafer layer (2) is arranged on a side of the insulating spacer layer away from the substrate (8). A Wiegand wire (4) is arranged in the insulating spacer layer.

2. A packaging device for Wiegand wire according to claim 1, characterized in that: A mounting layer (7) is also provided on the substrate (8); the mounting layer (7) is fixed on the substrate to position and fix the upper structure.

3. A packaging device for Wiegand wire according to claim 2, characterized in that: When the wafer layer is arranged between the substrate (8) and the insulating spacer layer, the lower surface of the wafer layer arranged between the substrate (8) and the insulating spacer layer is connected to the mounting layer, and the upper surface of the wafer layer is connected to the insulating spacer layer.

4. A packaging device for Wiegand wire according to claim 1, characterized in that: The insulating spacer layer comprises an upper insulating spacer layer (3) and a lower insulating spacer layer (5); the upper surface of the lower insulating spacer layer (5) is provided with a lower through hole groove, and the lower surface of the upper insulating spacer layer (3) is provided with an upper through hole groove; when the upper insulating spacer layer (3) and the lower insulating spacer layer (5) are superimposed, the upper through hole groove and the lower through hole groove together form a complete through hole, and a Wiegand wire (4) is installed in the through hole.

5. A packaging device for Wiegand wire according to claim 4, characterized in that: The upper through hole groove and the lower through hole groove are both semicircular through hole grooves.

6. The packaging device of Wiegand wire according to claim 1, characterized in that: The insulating partition layer is a whole insulating partition structure, and the Wiegand wire is encapsulated in the whole insulating partition.

7. The packaging device of Wiegand wire according to claim 1, characterized in that: The insulating shell (1) is a cover structure having an open end; the insulating shell (1) is mounted on a substrate (8), and the open end is connected to the substrate (8).

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