A power device and substrate thereof

Abstract

The present invention relates to the field of electronic and electrical technology, and in particular to a power device and a substrate thereof. The substrate comprises an insulating portion, a heat-conducting portion, a first conductive portion, and a second conductive portion. Of the two opposite sides of the insulating portion along its thickness direction, one side is connected to the heat-conducting portion, and the other side is connected to the first conductive portion and the second conductive portion, and there is an insulating gap between the first conductive portion and the second conductive portion; a sink groove is provided at the portion of the insulating portion located at the insulating gap, and the sink groove extends from the surface of the insulating portion to the direction where the heat-conducting portion is located. Even if the substrate provided by the present invention is relatively small in size, its insulation reliability is relatively high, and the safety hazard is relatively small.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic appliances, and in particular to a power device and a substrate thereof. Background Art

[0002] DBC (Direct Bonding Copper) is widely used because of its high thermal conductivity, high electrical insulation, high mechanical strength, low expansion and other characteristics of ceramics, as well as its high electrical conductivity and excellent welding performance of oxygen-free copper. With the continuous changes in market demand, DBC has gradually become smaller, which makes the distance between electrodes relatively small, which may cause the insulation reliability of DBC to decrease and increase safety risks. Summary of the invention

[0003] (I) The technical problem to be solved by the present invention is that as DBC develops towards miniaturization, its insulation reliability decreases and the potential safety hazards increase.

[0004] (II) Technical solution

[0005] In order to achieve the above technical problem, the present invention provides a substrate, comprising an insulating portion, a heat conducting portion, a first conductive portion, and a second conductive portion, wherein one side of the insulating portion is connected to the heat conducting portion, and the other side is connected to the first conductive portion and the second conductive portion, and an insulating gap is provided between the first conductive portion and the second conductive portion;

[0006] A sinking groove is provided at a portion of the insulating portion located at the insulating interval, and the sinking groove extends from a surface of the insulating portion toward a direction where the heat conducting portion is located.

[0007] Optionally, a plurality of sinking grooves are provided, and the plurality of sinking grooves are arranged at intervals.

[0008] Optionally, the heat conducting part is made of metal material.

[0009] Optionally, the insulating portion comprises a connecting area and a protruding area, the protruding area is arranged around and connected to the outer periphery of the connecting area, and the projection of the heat conducting portion along the thickness direction is located within the connecting area.

[0010] Optionally, of the two surfaces of the extended area that are opposite to each other along the thickness of the extended area, the surface where the heat conducting portion is located is provided with a sink groove.

[0011] Optionally, the insulating portion includes a connection area and a protruding area, the protruding area is arranged around and connected to the outer periphery of the connection area, and projections of the first conductive portion and the second conductive portion along the thickness direction are both located within the connection area.

[0012] Optionally, of the two surfaces of the extended area that are opposite to each other along the thickness of the extended area, a recessed groove is provided on the surface where the first conductive part is located.

[0013] Optionally, the sink is filled with insulating glue.

[0014] Optionally, the insulating space is filled with insulating glue.

[0015] Based on any of the above substrates, the present invention also provides a power device, which includes any of the above substrates.

[0016] (III) Beneficial effects

[0017] In the substrate provided by the present invention, one side of the insulating part is connected to the heat-conducting part, and the provision of the heat-conducting part can improve the heat dissipation performance of the entire substrate; an insulating spacer is provided between the first conductive part and the second conductive part to separate the first conductive part and the second conductive part to ensure mutual insulation between the two; at the same time, a sinking groove is provided at the portion of the insulating part located at the insulating spacer, and the provision of the sinking groove can further increase the creepage distance between the first conductive part and the second conductive part, thereby improving the safety and reliability of the entire substrate and reducing safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The advantages of the above and / or additional aspects of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a schematic diagram of an intermediate structure of a substrate provided by an embodiment of the present invention;

[0020] Figure 2 is a schematic diagram of another intermediate structure of a substrate provided in an embodiment of the present invention;

[0021] Figure 3 is a schematic diagram of another intermediate structure of a substrate provided in an embodiment of the present invention;

[0022] Figure 4 is a schematic structural diagram of a substrate provided by an embodiment of the present invention;

[0023] Figure 5 It is a schematic structural diagram of the substrate provided by an embodiment of the present invention in another direction.

[0024] Reference numerals

[0025] 1-insulating part; 11-connecting area; 12-extending area; 13-sinking groove; 2-heat conducting part; 3-first conductive part; 4-second conductive part; 5-insulating glue. DETAILED DESCRIPTION

[0026] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0027] like Figure 1-Figure 5 As shown, the present invention provides a substrate, which includes an insulating part 1, a heat-conducting part 2, a first conductive part 3 and a second conductive part 4. In order to ensure that the entire substrate has high thermal conductivity and heat dissipation performance, in the substrate provided by the present invention, the insulating part 1 is provided with a heat-conducting part 2 on one of the two opposite sides along its thickness direction, so that the heat of the entire substrate is guided by the heat-conducting part 2 and finally dissipated to the outside, thereby reducing the temperature of the entire substrate to a certain extent, preventing the performance of the substrate from being degraded or even damaged due to excessive temperature of the substrate. At the same time, the insulating part 1 is provided with a first conductive part 3 and a second conductive part 4, both of which are used to provide an electrical contact area. In order to prevent the two from contacting each other and causing a short circuit, an insulating spacer is provided between the first conductive part 3 and the second conductive part 4, which can separate the two and ensure that the two are insulated from each other; and, in order to further improve the insulation performance between the first conductive part 3 and the second conductive part 4, in the substrate provided by the present invention, a sink groove 13 is provided at the portion of the insulating part 1 located at the insulating spacer, and the sink groove 13 is extended from the surface of the insulating part 1 in a direction close to the heat conducting part 2. Under the action of the sink groove 13, the creepage distance between the first conductive part 3 and the second conductive part 4 is further increased, thereby basically preventing the two from forming a mutual connection relationship through the surface of the insulating part 1; at the same time, the insulating spacer between the first conductive part 3 and the second conductive part 4 is usually filled with air, and the insulation performance of air is relatively high. Therefore, during the operation of the substrate provided by the present invention, there is basically no electrical connection due to the failure of the insulation capacity between the first conductive part 3 and the second conductive part 4, and the safety performance is relatively high.

[0028] Specifically, the insulating part 1 can be made of a material with high insulation performance, and in order to ensure that the entire substrate has a high structural strength and a long service life, the insulating part 1 can also be formed of a material with relatively high hardness, which can also ensure that the connection reliability between the heat conducting part 2, the first conductive part 3 and the second conductive part 4 and the insulating part 1 is relatively high. For example, the insulating part 1 can be made of materials such as glass or ceramics. Preferably, the insulating part 1 can be formed of ceramic materials. While ceramic materials have high insulation performance, their thermal resistance is relatively small, so that the heat of the insulating part 1 can be more quickly and thoroughly conducted to the outside through the heat conducting part 2, thereby further reducing the temperature of the substrate during operation and improving the safety and reliability of the entire substrate.

[0029] Accordingly, the heat conducting part 2 can be made of a material with high thermal conductivity, such as graphite or metal. Preferably, the heat conducting part 2 can be made of a metal material. While the metal material has high thermal conductivity and heat dissipation effects, its hardness and rigidity are also relatively high, thereby ensuring that the entire substrate has a high structural strength.

[0030] Similarly, the first conductive part 3 and the second conductive part 4 can also be made of metal materials, which ensures that the first conductive part 3 and the second conductive part 4 have high conductivity on the one hand, and makes the hardness and rigidity of the two formed relatively high on the other hand. Considering factors such as comprehensive performance and cost, the first conductive part 3 and the second conductive part 4 can be made of metal copper or metal aluminum.

[0031] The specific size of the insulation interval between the first conductive part 3 and the second conductive part 4 can be determined according to the actual situation. Preferably, the shortest distances at any positions of the first conductive part 3 and the second conductive part 4 can be equal, so as to further improve the safety and reliability of the entire substrate. For example, the shapes and sizes of the first conductive part 3 and the second conductive part 4 can be made the same, so that during the installation of the two, the shortest distances at corresponding positions on the two can be basically guaranteed to be equal, and the overall insulation performance is relatively high.

[0032] Accordingly, the size and shape of the recess 13 can also be determined according to actual needs. On the one hand, it is ensured that the insulation reliability between the first conductive part 3 and the second conductive part 4 is relatively high. On the other hand, it is also necessary to ensure that when the insulating part 1 is provided with the recess 13, the structural strength of the entire insulating part 1 itself will not decrease too much, thereby achieving the purpose of improving the comprehensive performance of the substrate.

[0033] In addition, there are multiple ways to connect the heat conducting part 2, the first conductive part 3, the second conductive part 4 and the insulating part 1, and the corresponding connection method can be selected according to the different materials of the above four. For example, when the insulating part 1 is made of ceramic material and the heat conducting part 2, the first conductive part 3 and the second conductive part 4 are all made of metal material, one of the multiple ways of mechanical connection, bonding, brazing connection, solid phase diffusion connection, liquid phase connection or melting welding can be used to achieve the purpose of connecting the ceramic material and the metal material. In the actual operation process, those skilled in the art can choose the most suitable way to achieve the purpose of interconnecting the four parts of the insulating part 1, the heat conducting part 2, the first conductive part 3 and the second conductive part 4.

[0034] In order to further improve the insulation reliability between the first conductive part 3 and the second conductive part 4, preferably, as Figure 3As shown, a plurality of sink grooves 13 may be provided, and in the process of forming the sink grooves 13, the plurality of sink grooves 13 may be arranged at intervals, so as to maximize the creepage distance between the first conductive part 3 and the second conductive part 4 when the same volume of material is removed from the insulating part 1. Optionally, the shapes and sizes of the plurality of sink grooves 13 may correspond to each other, so as to reduce the processing difficulty to a certain extent, and also make the structural strength at any position on the insulating part 1 not much different, and the overall structural stability is relatively high.

[0035] Specifically, Figure 3 and Figure 5 As shown, in terms of the cross section of the substrate, the shape of the sink 13 can be rectangular, or it can also be circular, elliptical, etc., which is not limited here. The size between two adjacent sinks 13 can be determined according to the specific dimensions of the insulating part 1, the insulating interval, and the first conductive part 3 and the second conductive part 4. In addition, in order to further improve the overall structural strength and reliability of the insulating part 1, the spacing between any two adjacent sinks 13 can be equal. Of course, depending on the actual situation, the shapes, sizes and other parameters of the multiple sinks 13 can also be different. In this regard, technicians in this field can flexibly select according to the specific situation during actual operation.

[0036] Considering that the thermal conductivity, thermal resistance, hardness and rigidity of metal materials are relatively high, preferably, metal materials can be used to form the heat conducting part 2 to improve the comprehensive performance of the heat conducting part 2 and even the entire substrate. However, considering that metal materials have the ability to conduct electricity, in order to prevent insulation failure caused by the relatively small interval between the first conductive part 3 and / or the second conductive part 4 and the heat conducting part 2, preferably, as Figure 2 and Figure 3 As shown, the insulating part 1 may include a connecting area 11 and a protruding area 12, and the protruding area 12 is arranged around the outer periphery of the connecting area 11. In addition, in the process of designing the substrate, by making the projection of the heat-conducting part 2 along the aforementioned thickness direction located within the connecting area 11, the creepage distance between the heat-conducting part 2 and the first conductive part 3 and the second conductive part 4 can be increased, thereby reducing the probability of insulation failure between the heat-conducting part 2 and the first conductive part 3 and the second conductive part 4 to a certain extent, thereby improving the safety and reliability of the entire substrate.

[0037] Specifically, the shapes and sizes of the connection area 11 and the extension area 12 can also be determined according to actual conditions. For example, when the connection area 11 is a circular structure, the extension area 12 can be a circular ring structure, or an inner circle and outer square structure; or, when the connection area 11 is a square structure, the extension area 12 can be a square ring structure. Technical personnel in this field can flexibly determine the structure according to actual needs during the design process.

[0038] Preferably, the creepage distance between the heat conducting part 2 and the first conductive part 3 and the second conductive part 4 can be further increased by forming a groove 13 on the extension area 12, so that the insulation reliability between the heat conducting part 2 and the first conductive part 3 and the second conductive part 4 is greatly improved. Specifically, the size and shape of the groove 13 can be determined according to the requirements. For example, the groove 13 can be a rectangular structure, or the groove 13 can be a circular structure or other shapes. Similarly, Figure 3 As shown, a plurality of sink grooves 13 may be provided on the extension area 12, and the spacing between two adjacent sink grooves 13 may be equal. Optionally, when a plurality of sink grooves 13 are provided on the entire substrate, the structure and size of each sink groove 13 may be the same, thereby further reducing the processing difficulty in the process of forming the sink grooves 13.

[0039] In addition, regardless of whether the projection of the heat conducting portion 2 along its thickness direction is located within the connecting area 11, Figure 2 and Figure 3 As shown, the projections of the first conductive part 3 and the second conductive part 4 along the aforementioned thickness direction can be located within the connection area 11, which can also make the creepage distance between the first conductive part 3 and the second conductive part 4 and the heat conductive part 2 relatively large, so that insulation failure will basically not occur during the operation of the substrate. In order to further increase the creepage distance between the heat conductive part 2 and the first conductive part 3 and the second conductive part 4, preferably, a sink groove 13 can also be formed on the side where the first conductive part 3 is located on the two opposite sides of the extension area 12 along its own thickness to improve the safety and reliability of the substrate.

[0040] Preferably, if Figure 1 As shown, the projections of the heat conducting part 2, the first conductive part 3 and the second conductive part 4 along the aforementioned thickness direction can be located within the connection area 11, which can further increase the creepage distance between the heat conducting part 2 and the first conductive part 3 and the second conductive part 4, thereby further increasing the safety reliability of the entire substrate and reducing safety hazards. Accordingly, it is also possible to simultaneously form sink grooves 13 on both sides of the extension area 12 along the thickness direction of the extension area 12, thereby maximizing the safety performance of the substrate and preventing the substrate from being damaged by electrical connection. In addition, the structures and sizes of the multiple sink grooves 13 can be the same to reduce the difficulty of processing.

[0041] In order to further reduce the probability of insulation failure between the first conductive part 3 and the second conductive part 4, preferably, insulating glue 5 can be filled in the groove 13 on the insulating part 1, thereby basically cutting off the ability of the first conductive part 3 and the second conductive part 4 to communicate with each other, thereby improving the safety and reliability of the substrate.

[0042] like Figure 1As shown, when there are multiple sinking grooves 13, no matter where the multiple sinking grooves 13 are located, the insulating glue 5 can be filled in the multiple sinking grooves 13, so as to comprehensively improve the insulation performance between the first conductive part 3 and the second conductive part 4. Preferably, the insulating gap between the first conductive part 3 and the second conductive part 4 can also be filled with the insulating glue 5 to further reduce the probability of insulation failure between the first conductive part 3 and the second conductive part 4. At the same time, when the thermal conductive part 2 and / or the first conductive part 3 and / or the second conductive part 4 are not covered on the extension area 12, and the insulating glue 5 is provided at the position of the sinking groove 13 on the extension area 12, the size of the insulating glue 5 in the aforementioned thickness direction can also be relatively large, and at least exceed the surface of the insulating part 1.

[0043] In addition, there are many ways to process the substrate provided in the above embodiments of the present invention. The present invention provides a specific processing process as follows: First, the materials of the insulating part 1, the heat conducting part 2, the first conductive part 3 and the second conductive part 4 are determined according to actual needs. For example, the insulating part 1 can be made of ceramic material, and the other parts can be made of metal material. During the processing, Figure 1 As shown, the heat conducting part 2 and the conductive structure can be connected to the insulating part 1 on opposite sides along the thickness direction thereof by bonding, and then, as shown in FIG. Figure 2 As shown, an insulating spacer can be formed in the middle region of the conductive structure by etching, thereby forming a first conductive portion 3 and a second conductive portion 4; then, as shown in FIG. Figure 3 As shown, the sink groove 13 can be formed by laser etching, and the number and shape of the sink groove 13 can be determined according to actual needs; then, as shown in FIG. Figure 4 As shown, insulating glue 5 is coated on each groove 13, and the coating amount of insulating glue 5 can be made relatively large to ensure that the insulation reliability between the first conductive part 3 and the second conductive part 4 is relatively high; finally, the insulating glue 5 can be solidified and formed by high-temperature curing to form the substrate provided by the embodiment of the present invention.

[0044] The second aspect of the present invention further provides a power device, which includes the substrate provided by any of the above embodiments. While this power device has the advantage of miniaturization, it also has relatively high safety and reliability and relatively low safety hazards.

[0045] In the description of the present invention, it should be noted that the terms "upper", "lower", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the inside of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A substrate, It is characterized in that The insulating portion (1) comprises an insulating portion (1), a heat conducting portion (2), a first conductive portion (3) and a second conductive portion (4); one side of the insulating portion (1) is connected to the heat conducting portion (2) and the other side is connected to the first conductive portion (3) and the second conductive portion (4); an insulating gap is provided between the first conductive portion (3) and the second conductive portion (4); A sink groove (13) is provided at a portion of the insulating portion (1) located at the insulating interval, and the sink groove (13) extends from the surface of the insulating portion (1) in the direction where the heat conducting portion (2) is located; The heat conducting part (2) is made of metal material, the insulating part (1) comprises a connecting area (11) and a protruding area (12), the protruding area (12) is arranged around and connected to the outer periphery of the connecting area (11), the projections of the heat conducting part (2), the first conductive part (3) and the second conductive part (4) along the thickness direction are all located within the connecting area (11), and the recessed groove (13) is formed on the protruding area (12).

2. The substrate according to claim 1, It is characterized in that A plurality of the sinking grooves (13) are provided, and the plurality of sinking grooves (13) are arranged at intervals.

3. The substrate according to claim 1, It is characterized in that Of the two surfaces of the extended area (12) that are opposite to each other along its thickness, the surface where the heat conducting portion (2) is located is provided with a sink groove (13).

4. The substrate according to claim 1, It is characterized in that Of the two surfaces of the protruding area (12) that are opposite to each other along its thickness, the surface where the first conductive part (3) is located is provided with a recessed groove (13).

5. The substrate according to any one of claims 1 to 4, It is characterized in that The sink (13) is filled with insulating glue (5).

6. The substrate according to any one of claims 1 to 4, It is characterized in that The insulating space is filled with insulating glue (5).

7. A power device, It is characterized in that A substrate comprising any one of claims 1 to 6.

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