Single-chip element, electronic module, and electronic device including the single-chip element

Abstract

The present invention provides a single-chip component, an electronic module, and an electronic device including the single-chip component for driving a panel including fingerprint sensing pixels, display pixels, and a touch sensor. The single-chip component includes a main body, a first set of pads and a second set of pads disposed in the main body. The first set of pads includes a plurality of first pads for driving fingerprint sensing pixels, wherein the first set of pads is disposed on both the left and right portions of the main body with respect to an axis and configured to be coupled to fingerprint sensing pixels. The second set of pads includes a plurality of second pads for driving display pixels, wherein the second set of pads is disposed on both the left and right portions and configured to be coupled to the panel.

Description

Technical Field

[0001] The present invention relates to a single-chip element, an electronic module, and an electronic device including the single-chip element for driving a panel including fingerprint sensing pixels, display pixels, and a touch sensor, and more particularly to a single-chip element, an electronic module, and an electronic device for driving a panel including fingerprint sensing pixels, display pixels, and a touch sensor. Background Art

[0002] For computing devices such as smart phones, tablet computers, or other information processing devices, a touch screen is an essential component for user interaction of the multiple computing devices. In order to simplify the circuit area, circuit layout, and make the computing device thinner, a touch and display driver integration (TDDI) integrated circuit (IC) that combines a touch controller and a display driver circuit into a single chip has been utilized to drive and control the display panel using liquid crystal display (LCD) display technology, and the multiple associated touch sensors of the display panel of computing devices such as smart phones and tablet computers.

[0003] On the other hand, fingerprint sensing has increasingly become a standard functionality of the multiple computing devices to meet the multiple emerging requirements for improving information security in various applications such as fingerprint recognition in unlocking the computing device. With the development of the technology, some smart phones now are equipped with a fingerprint sensor inside or under the front display.

[0004] Thus, as the circuit complexity increases due to the multiple requirements of touch sensing, fingerprint sensing, and display driving associated with the display panel, it is challenging to design the circuit routing and control circuit for the display panel associated with touch sensing and fingerprint sensing elements in computing devices such as smart phones or tablet computers. Summary of the Invention

[0005] Based on at least one embodiment of the present invention, an architecture of the present invention for driving fingerprint sensing pixels, display pixels, and a touch sensor through the use of a single-chip element in a computing device. Based on the architecture, the single-chip element can be implemented such that its pads are arranged in such a way that electrical connections of the multiple pads and control lines or related lines for the multiple fingerprint sensing pixels, display pixels, and touch sensors can be achieved through the use of traces that do not cross over each other. In this way, simplification of the circuit layout and circuit load balancing of the multiple traces can be promoted.

[0006] The present invention provides a single-chip element for driving a panel including a plurality of display pixels, a plurality of touch sensors, and a plurality of fingerprint sensing pixels, as exemplified in some specific embodiments below. The single-chip element includes a main body; a first set of pads disposed in the main body; and a second set of pads disposed in the main body. The main body has a left portion and a right portion with respect to an axis. The first set of pads includes a plurality of first pads for driving the plurality of fingerprint sensing pixels, wherein the first set of pads is disposed on both the left portion and the right portion and configured to be coupled to the plurality of fingerprint sensing pixels. The second set of pads includes a plurality of second pads for driving the plurality of display pixels, wherein the second set of pads is disposed on both the left portion and the right portion and configured to be coupled to the panel.

[0007] In some specific embodiments of the single-chip element, the main body has a rectangular shape having a first side, a second side parallel to the first side and closer to the panel than the first side, a left side on the left portion and perpendicular to the first side and the second side, and a right side on the right portion and parallel to the left side, and the axis intersects the first side and the second side.

[0008] In some specific embodiments of the single-chip element, all of the first set of pads and all of the second set of pads are disposed along the first side.

[0009] In some specific embodiments of the single-chip element, the first set of pads is closer to the axis than the second set of pads.

[0010] In some specific embodiments of the single-chip element, the second set of pads is closer to the axis than the first set of pads.

[0011] In some specific embodiments of the single-chip element, all of the first set of pads and all of the second set of pads are disposed along the second side.

[0012] In some specific embodiments of the single-chip element, the first set of pads is closer to the axis than the second set of pads.

[0013] In some specific embodiments of the single-chip element, the second set of pads is closer to the axis than the first set of pads.

[0014] In some specific embodiments of the single-chip element, all of the first set of pads are disposed along one of the first side and the second side, and all of the second set of pads are disposed along both the left side and the right side.

[0015] In some specific embodiments of the single-chip element, all of the first set of pads are arranged along both the left side and the right side, and all of the second set of pads are arranged along one of the first side and the second side.

[0016] In some specific embodiments of the single-chip element, all of the first set of pads are arranged along the left side and the right side, and all of the second set of pads are arranged along the left side and the right side.

[0017] In some specific embodiments of the single-chip element, the plurality of first pads includes a plurality of fingerprint gate-driver-on-array select pads.

[0018] In some specific embodiments of the single-chip element, the plurality of second pads includes a plurality of gate-driver-on-array select pads.

[0019] In some specific embodiments of the single-chip element, the panel is further coupled to a plurality of data lines of the plurality of display pixels, coupled to a plurality of fingerprint sensing lines of the plurality of fingerprint sensing pixels, and a plurality of selection circuits, each of the plurality of selection circuits being coupled to a corresponding set of one of the plurality of data lines, and the second set of pads further includes a plurality of third pads configured to be coupled to the panel and to control the plurality of selection circuits.

[0020] In some specific embodiments of the single-chip element, each of the plurality of selection circuits is further coupled to at least one of the plurality of fingerprint sensing lines.

[0021] In some specific embodiments of the single-chip element, the plurality of third pads are arranged on both the left portion and the right portion.

[0022] In some specific embodiments of the single-chip element, the body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of third pads are arranged along the first side.

[0023] In some specific embodiments of the single-chip element, the body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of third pads are arranged along the second side.

[0024] In some specific embodiments of the single-chip element, the panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and the single-chip element further includes a third set of pads disposed in the body for driving the plurality of data lines or receiving fingerprint sensing signals from the plurality of fingerprint sensing lines, or coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

[0025] In some specific embodiments of the single-chip element, the third set of pads includes a first subgroup of pads for driving the plurality of data lines and receiving fingerprint sensing signals from the plurality of fingerprint sensing lines in a time-division manner; and a second subgroup of pads configured to be coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

[0026] In some specific embodiments of the single-chip element, the panel further includes a plurality of selection circuits, wherein each of the plurality of selection circuits is coupled to a corresponding set of one of the plurality of data lines and a corresponding one of the plurality of fingerprint sensing lines, and wherein the first subgroup of pads is configured to be coupled to the plurality of selection circuits.

[0027] In some specific embodiments of the single-chip element, the first subgroup of pads and the second subgroup of pads are alternately disposed on the body.

[0028] In some specific embodiments of the single-chip element, the first subgroup of pads is configured to drive the plurality of data lines in a time-division manner, while the second subgroup of pads receives touch signals from the plurality of touch sensing lines.

[0029] In some specific embodiments of the single-chip element, the body has a rectangular shape with a first side and a second side parallel to the first side and closer to the panel than the first side, and the third set of pads is disposed along the second side.

[0030] In some specific embodiments of the single-chip element, the single-chip element further includes a fingerprint driver circuit and a touch display driver circuit. The fingerprint driver circuit is disposed in the body and coupled to the plurality of first pads. The touch display driver circuit is disposed in the body and coupled to the plurality of second pads and the plurality of third pads.

[0031] In some specific embodiments of the single-chip element, in the right portion, none of the plurality of third pads are arranged between the plurality of first pads and the plurality of second pads, and in the left portion, none of the plurality of third pads are arranged between the plurality of first pads and the plurality of second pads.

[0032] In some specific embodiments of the single-chip element, the plurality of third pads are arranged beside the plurality of second pads rather than beside the plurality of first pads.

[0033] In some specific embodiments of the single-chip element, the plurality of second pads are arranged beside the plurality of first pads and beside the plurality of third pads.

[0034] In some specific embodiments of the single-chip element, the main body is configured to be arranged on a thin film as a chip-on-film structure.

[0035] In some specific embodiments of the single-chip element, the main body is configured to be arranged on glass as a chip-on-glass structure.

[0036] In some specific embodiments of the single-chip element, the single-chip element further includes a fingerprint driver circuit and a touch display driver circuit. The fingerprint driver circuit is arranged in the main body and coupled to the first set of pads. The touch display driver circuit is arranged in the main body and coupled to the second set of pads.

[0037] In some specific embodiments of the single-chip element, in the right portion, none of the first set of pads are arranged between the second set of pads, and none of the second set of pads are arranged between the first set of pads, and in the left portion, none of the first set of pads are arranged between the second set of pads, and none of the second set of pads are arranged between the first set of pads.

[0038] In some specific embodiments, the panel further includes at least one first gate-on-array (GOA) circuit, and the first set of pads is configured to be coupled to the plurality of fingerprint sensing pixels via the at least one first GOA circuit.

[0039] In some specific embodiments, the panel further includes at least one second gate-on-array (GOA) circuit, and the second set of pads is configured to be coupled to the plurality of display pixels via the at least one second GOA circuit.

[0040] The disclosure of the present invention further provides a single-chip element for driving a panel. The panel includes a plurality of display pixels, a plurality of touch sensors, and a plurality of fingerprint sensing pixels. The panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, a plurality of touch sensing lines coupled to the plurality of touch sensors, and a plurality of selection circuits, each of the plurality of selection circuits being coupled to a corresponding set of one of the plurality of data lines. The single-chip element includes a body, a first set of pads, a second set of pads, and a plurality of third pads, all of which are disposed in the body. The body has a left portion and a right portion with respect to an axis and has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side. The first set of pads includes a plurality of first pads for driving the plurality of fingerprint sensing pixels, wherein the first set of pads is disposed on both the left portion and the right portion and configured to be coupled to the plurality of fingerprint sensing pixels. The second set of pads includes a plurality of second pads for driving the plurality of display pixels and a plurality of third pads for controlling the plurality of selection circuits, wherein the second set of pads is disposed on both the left portion and the right portion and configured to be coupled to the panel, wherein the plurality of third pads are disposed along the first side. The third set of pads is for driving the plurality of data lines or receiving fingerprint sensing signals from the plurality of fingerprint sensing lines, or coupling to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines, wherein the third set of pads is disposed along the second side.

[0041] In some specific embodiments of the single-chip element, the third set of pads includes: a first subgroup of pads for driving the plurality of data lines in a time-division manner and receiving fingerprint sensing signals from the plurality of fingerprint sensing lines; and a second subgroup of pads configured to be coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

[0042] In some specific embodiments of the single-chip element, each of the plurality of selection circuits is further coupled to a corresponding one of the plurality of fingerprint sensing lines, and the first subgroup of pads is configured to be coupled to the plurality of selection circuits.

[0043] In some specific embodiments of the single-chip element, the first subgroup of pads is configured to drive the plurality of data lines in a time-division manner, and the second subgroup of pads receives touch signals from the plurality of touch sensing lines.

[0044] The disclosure of the present invention further provides an electronic module for driving a plurality of fingerprint sensing pixels, a plurality of display pixels, and a plurality of touch sensors, as exemplified in some of the following specific embodiments. The electronic module includes a thin film; and a single-chip element disposed on the thin film, wherein the single-chip element is exemplified as appropriate, such as in any one or any combination of at least one of the specific embodiments.

[0045] The disclosure of the present invention further provides an electronic device, as exemplified in some of the following specific embodiments. The electronic device includes a panel including a plurality of display pixels, a plurality of touch sensors, and a plurality of fingerprint sensing pixels; and a single-chip element for coupling to the panel, wherein the single-chip element is exemplified as appropriate, such as in any one or any combination of at least one of the specific embodiments.

[0046] In some specific embodiments, the plurality of fingerprint sensing pixels correspond to a fingerprint sensing area, the panel has a display area, the plurality of touch sensors correspond to a touch sensing area, and the sizes of the fingerprint sensing area, the display area, and the touch sensing area are substantially the same.

[0047] In some specific embodiments, the electronic device further includes a substrate, and the plurality of display pixels, the plurality of touch sensors, and the plurality of fingerprint sensing pixels are disposed on the substrate.

[0048] In some specific embodiments, the substrate includes glass, and the single-chip element is disposed on a portion of the glass as a chip-on-glass structure.

[0049] In some specific embodiments, the substrate further includes a thin film, and the single-chip element is disposed on the thin film as a chip-on-film structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0051] Figure 1 FIG. is a schematic diagram illustrating an architecture for driving fingerprint sensing pixels, display pixels, and touch sensors through a single-chip element in an arithmetic device using various specific embodiments disclosed in the present invention.

[0052] Figure 2 is an illustration Figure 1 of a specific embodiment of the described architecture.

[0053] Figure 3 is an illustration of a possible example of an electronic module combining TDDI and a Readout IC (ROIC).

[0054] Figure 4A is an illustration of various specific embodiments of a single - chip element based on Figure 1 for driving fingerprint sensing pixels, display pixels, and touch sensors.

[0055] Figure 4B is an illustration of an example of traces connecting to the pads of the single - chip element in Figure 4A above.

[0056] Figure 5 is an illustration of an exemplary specific embodiment of the pad arrangement of a single - chip element.

[0057] Fig. 6A is an illustration of a panel coupled to a single - chip element according to a specific embodiment disclosed in the present invention.

[0058] Figure 6B is an illustration of a panel including display pixels and fingerprint sensing pixels coupled to a single - chip element according to a specific embodiment disclosed in the present invention.

[0059] Figure 6C is an illustration of a panel including display pixels and fingerprint sensing pixels coupled to a single - chip element according to another specific embodiment disclosed in the present invention.

[0060] Fig.6D is an illustration of a panel including display pixels and fingerprint sensing pixels coupled to a single - chip element according to yet another specific embodiment disclosed in the present invention.

[0061] Figure 7 is an illustration of a fingerprint sensing pixel according to a specific embodiment disclosed in the present invention.

[0062] Figure 8 is a timing diagram of a specific embodiment for driving fingerprint sensing pixels, display pixels, and touch sensors.

[0063] Fig. 9A is an illustration of a specific embodiment of the pad arrangement of a single - chip element along its first side.

[0064] Fig. 9BIt is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its first side.

[0065] Fig. 9C It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its first side.

[0066] Fig. 10A It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its second side.

[0067] Fig. 10B It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its second side.

[0068] Fig. 10C It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its second side.

[0069] Fig. 10D It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its second side.

[0070] Fig.11A It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its first side.

[0071] Fig. 11B It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its first side.

[0072] Fig. 11C It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its first side.

[0073] Fig.11D It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its first side.

[0074] Fig. 12A It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its left side and right side.

[0075] Fig. 12B It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its left side and right side.

[0076] Fig. 12C It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its left side and right side.

[0077] Fig.12D It is a schematic diagram illustrating a specific embodiment of the pad arrangement of a single wafer element along its left side and right side.

[0078] Fig.13 It is a schematic diagram showing a specific embodiment of the pad arrangement of a single - chip element.

[0079] Fig.14 It is a schematic diagram showing another specific embodiment of the pad arrangement of a single - chip element.

[0080] Fig.15 It is a schematic diagram showing a specific embodiment of a single - chip element.

[0081] Fig.16 It is a schematic diagram showing the routing structure between a single - chip element (or electronic module) and the panel according to a specific embodiment of the present invention.

[0082] Fig.17 It is a schematic diagram showing a selection circuit on a single - chip element (or electronic module) and the panel according to a specific embodiment of the present invention.

[0083] Fig.18 It is an illustration for controlling Fig.17 The waveform diagram of the multiple control signals for the switch member depicted in

[0084] Reference numerals

[0085] 1: Arithmetic device

[0086] 5: Processing unit

[0087] 9, 9A, 9B, 9C, 9D, 9E: Panel

[0088] 9_1A - 9_1D, 9_2A - 9_2D: Panel

[0089] 9_3A - 9_3D, 9_4A - 9_4D: Panel

[0090] 10, 10A, 20, 20_1A, 20_1B, 20_1C, 20_1D, 20_2A, 20_2B, 20_2C, 20_2D, 20_3A, 20_3B, 20_3C, 20_3D, 20_4A, 20_4B, 20_4C, 20_4D, 20A, 30A, 30B, 40: Single - chip element

[0091] 11, 11A: Display driver circuit

[0092] 11B: Touch and display driver integrated circuit

[0093] 12, 12A, 49: Touch driver circuit

[0094] 19, 19A, 29A, 41: Fingerprint driver circuit

[0095] 19B: Readout integrated circuit

[0096] 21A: Touch and display driver integration circuit; Touch display driver circuit

[0097] 30C: Monolithic component

[0098] 90_1C, 90_1D, 90_2C, 90_2D: Glass part

[0099] 91: Display pixel array

[0100] 93: Touch sensing array

[0101] 95: Fingerprint sensing array

[0102] 100, 100_1A, 100_1B, 100_2A, 100_2B, 100A: Thin film

[0103] 110, 111, 190, T, T11_3A, T12_3A, T11_3B, T12_3B, T11_3C, T12_3C, T11_3D, T12_3D, T21_3A, T22_3A, T21_3B, T22_3B, T21_3C, T22_3C, T21_3D, T22_3D, T30, T31A, T31B, T32A, T32B, T40: Trace

[0104] 126: Fingerprint sensor

[0105] 150, 150_1A - 150_1D, 150_2A - 150_2D: Flexible printed circuit (FPC)

[0106] 150_3A - 150_3D, 150_4A - 150_4D: Flexible printed circuit (FPC)

[0107] 200, 200_1A - 200_1D, 200_2A - 200_2D, 200_3A - 200_3D, 200_4A - 200_4D, 300A - 300C: Body

[0108] 210, G11_1A, G12_1A, G11_1B, G12_1B, G11_1C, G12_1C, G11_1D, G12_1D, G11_2A, G12_2A, G11_2B, G12_2B, G11_2C, G12_2C, G11_2D, G12_2D, G11_3A, G12_3A, G11_3B, G12_3B, G11_3C, G12_3C, G11_3D, G12_3D, G11_4A, G12_4A, G11_4B, G12_4B, G11_4C, G12_4C, G11_4D, G12_4D: The first set of pads

[0109] 210_1, 210_2 to 210_N, 240A: Pads

[0110] 220, G21_1A, G22_1A, G21_1B, G22_1B, G21_1C, G22_1C, G21_1D, G22_1D, G21_2A, G22_2A, G21_2B, G22_2B, G21_2C, G22_2C, G21_2D, G22_2D, G21_3A, G22_3A, G21_3B, G22_3B, G21_3C, G22_3C, G21_3D, G22_3D, G21_4A, G22_4A, G21_4B, G22_4B, G21_4C, G22_4C, G21_4D, G22_4D: The second set of pads

[0111] 230A: The third set of pads

[0112] 410, 412: Array Gate (GOA) drivers

[0113] 413: Fingerprint receiver multiplexing circuit

[0114] 414: Fingerprint analog front-end circuit

[0115] 415: Fingerprint control circuit

[0116] 416, 496: Data interface circuits

[0117] 493: Touch panel receiver multiplexing circuit

[0118] 494: Touch analog front-end circuit

[0119] 495: Touch control circuit

[0120] 501: The first switching component

[0121] 502: The second switching component

[0122] 502_1: First switching element

[0123] 502_2: Second switching element

[0124] 503: Third switching member

[0125] 504: Fourth switching member

[0126] AA: Active area

[0127] AX: Axis

[0128] B: Blue sub-pixel

[0129] B1: Block

[0130] DAC: Signal converter

[0131] DP: Display pixel

[0132] DS: Display drive signal

[0133] FGL: Fingerprint scan line

[0134] FGOA1, FGOA2: Fingerprint array gate (GOA) scan circuit

[0135] FP_S: Fingerprint sensing signal

[0136] FPR_GCK: Reset signal

[0137] FPR_S1, FPR_S2: Fingerprint drive signal

[0138] FPR_SEL: Selection signal; Acquisition signal

[0139] FS: Fingerprint sensing pixel

[0140] G: Green sub-pixel

[0141] GOA1, GOA2, RG1, RG2, TG1, TG2: Array gate (GOA) circuit

[0142] LS: Trace; Transmission line

[0143] N1D, N1F: First terminal

[0144] N2: Second terminal

[0145] N3D, N3F: Third terminal

[0146] N4: Fourth terminal

[0147] OBF: Output buffer

[0148] P1: Left part

[0149] P2: Right part

[0150] P11A, P12A, P11B, P12B: First solder pad

[0151] P21A, P22A, P21B, P22B: Second solder pad

[0152] P31A, P32A, P31B, P32B: Third solder pad

[0153] P4A, P4B: Fourth solder pad

[0154] P41A, P41B: First subgroup solder pad

[0155] P42A, P42B: Second subgroup solder pad

[0156] PD: Photodiode

[0157] R: Red sub-pixel

[0158] S1: First side

[0159] S2: Second side

[0160] S3: Left side

[0161] S4: Right side

[0162] SC, SC1, SC2: Selection circuit

[0163] SL_FP: Fingerprint sensing line

[0164] SLD: Display data line; Data line

[0165] SLR, SLG, SLB: Data line

[0166] SM1: Selection module

[0167] SM2: Selection module

[0168] SW1SD, SW1FP, SW3FP, SW2R, SW2G, SW2B, SW2FP: Control signal SWR, SWG, SWB, SW_FP: Switch

[0169] T, T1, T2 to TN: Trace

[0170] TS1, TS2: Switch

[0171] TI1: Display driving stage

[0172] TI2: Fingerprint sensing stage

[0173] T11_1A, T12_1A, T11_1B, T12_1B, T11_1C, T12_1C, T11_1D, T12_1D, T11_2A, T12_2A, T11_2B, T12_2B, T11_2C, T12_2C, T11_2D, T12_2D, T11_4A, T12_4A, T11_4B, T12_4B, T11_4C, T12_4C, T11_4D, T12_4D: The first trace

[0174] T21_1A, T22_1A, T21_1B, T22_1B, T21_1C, T22_1C, T21_1D, T22_1D, T21_2A, T22_2A, T21_2B, T22_2B, T21_2C, T22_2C, T21_2D, T22_2D, T21_4A, T22_4A, T21_4B, T22_4B, T21_4C, T22_4C, T21_4D, T22_4D: The second trace

[0175] TDDI_S1: Display driving signal

[0176] TDDI_S2: Selection signal

[0177] TDDI_SW_FP: Selection signal

[0178] TDDI_SWR, TDDI_SWG, TDDI_SWB: Selection signals

[0179] TGL: Scanning line

[0180] TP: Touch

[0181] Vout: Node

[0182] VDD, Vbias: Voltages Detailed implementation manners

[0183] The following will further illustrate, in conjunction with the accompanying drawings, a single-chip element, an electronic module, and an electronic device including the single-chip element for driving a panel including fingerprint sensing pixels, display pixels, and a touch sensor according to an embodiment of the present invention.

[0184] To facilitate the understanding of the purpose, features, and functions of the disclosed content of the present invention, specific embodiments of the implementation manners of the disclosed content of the present invention and the accompanying drawings are provided. The following specific embodiments are provided to illustrate various implementations. However, the disclosed content is not limited to the provided specific embodiments, and the provided specific embodiments can be appropriately combined. In the present specification (including the scope of the patent applications) of the present application, the terms "coupled", "coupling", "connecting", and "connected" may refer to any direct or indirect connection. For example, "a first device is coupled to a second device" should be interpreted as "the first device is directly connected to the second device" or "the first device is indirectly connected to the second device through other devices or connection means". The term "signal" may refer to current, voltage, charge, temperature, data, electromagnetic waves, or any one or more signals. In addition, the term "and / or" may refer to "at least one of". For example, "a first signal and / or a second signal" should be interpreted as "at least one of the first signal and the second signal".

[0185] In the following content, an architecture for driving fingerprint sensing pixels, display pixels, and touch sensors by using a single-chip element in a computing device will be provided. Based on the architecture, the single-chip element can be implemented to include pads arranged in the following manner: the electrical connection of the pads and control lines or related lines for the plurality of fingerprint sensing pixels, display pixels, and touch sensors can be achieved by using traces that do not cross each other. The arrangement of the pads of the single-chip element can facilitate the simplification of the circuit layout and the circuit load balance of the plurality of traces.

[0186] The following provides an architecture for driving fingerprint sensing pixels, display pixels, and touch sensors by using a single-chip component.

[0187] Please refer to Figure 1 , an architecture for driving fingerprint sensing pixels, display pixels, and touch sensors by using a single-chip component in a computing device, is illustrated according to various specific embodiments disclosed in the present invention. As Figure 1 shown in Figure 1 , the computing device 1 includes a processing unit 5, a single-chip component 10, and a panel 9, which includes a plurality of display pixels associated with a plurality of touch sensors; and a plurality of fingerprint sensing pixels. The single-chip component 10 can be used to couple between the processing unit 5 and the panel 9 and serve as a "bridge" between the processing unit 5 and the panel 9, where the panel 9 is associated with the plurality of touch sensors and fingerprint sensing pixels. The processing unit 5 can be configured to control the single-chip component 10 to drive the plurality of display pixels, the plurality of fingerprint sensing pixels, and / or the plurality of touch sensors in order to display images or videos, obtain fingerprint data, and / or touch data. The panel 9 can be a display panel, for example, implemented as an in-cell type or on-cell type display panel of a fingerprint sensor. The single-chip component 10 can be implemented to integrate and include a display driver circuit 11, a touch driver circuit 12, and a fingerprint driver circuit 19. In this way, the single-chip component 10 can be referred to as a fingerprint, touch, display driver integration (FTDI) IC. Based on Figure 1 the architecture shown in Figure 4A , Figure 5 etc. (illustrated in different specific embodiments later), the single-chip component 10 can be configured to include pads arranged in the following manner: electrical connections between the plurality of pads for the plurality of fingerprint sensing pixels, display pixels, and touch sensors and control lines or associated lines can be achieved by using traces that do not cross each other.

[0188] It should be noted that the single-chip element 10 may directly execute driving on the plurality of display pixels, the plurality of fingerprint sensing pixels, and / or the plurality of touch sensors by directly providing relevant driving signals to the plurality of display pixels, the plurality of fingerprint sensing pixels, and / or the plurality of touch sensors. Alternatively, the single-chip element 10 may indirectly execute driving on the plurality of display pixels, the plurality of fingerprint sensing pixels, and / or the plurality of touch sensors by providing relevant driving or control signals to other control circuits (such as a gate driver on array; GOA circuit) that can subsequently directly provide driving signals to the plurality of display pixels, the plurality of fingerprint sensing pixels, and / or the plurality of touch sensors. In other words, the term "driving" may mean "direct driving" that may include generating and directly applying driving signals, or may mean "indirect driving" that may include causing the plurality of direct driving signals to be generated and / or provided in different implementations.

[0189] In some specific embodiments, the computing device 1 (or the electronic device) further includes a substrate, and the plurality of display pixels, the plurality of touch sensors, and the plurality of fingerprint sensing pixels are arranged on the substrate (such as directly attached to the substrate, embedded in the substrate, or arranged above the substrate, but not limited thereto). For example, the substrate includes glass, and the single-chip element 10 is arranged on a part of the glass as a chip-on-glass structure, where the part of the glass may be an extended part separated from another part of the glass (such as an Active Area, AA), where the plurality of display pixels, the plurality of touch sensors, and the plurality of fingerprint sensing pixels are arranged.

[0190] In some specific embodiments, the substrate includes a thin film. The single-chip element may be arranged on the thin film as a chip-on-film structure.

[0191] Based on the architecture exemplified for use in the computing device 1 Figure 1 any electronic device such as a smart phone, a tablet computer, or any other information processing device can be implemented, where the computing device 1 may further include additional components such as, but not limited to, a memory, circuits for wireless or wired communication, image capture, etc., as appropriate.

[0192] In a specific embodiment, such as Figure 2Schematically illustrated, the single-chip component 10A (such as an FTDI IC) integrates and includes a display driver circuit 11A, a touch driver circuit 12A, and a fingerprint driver circuit 19A, which are respectively electrically coupled to a display pixel array 91 including display pixels, a touch sensing array 93 including touch sensors, and a fingerprint sensing array 95 including fingerprint sensing pixels. The design of the FTDI IC (such as the single-chip component 10 or 10A) can be carried out by combining individual or discrete versions of the circuits of the display driver circuit 11A, the touch driver circuit 12A, and the fingerprint driver circuit 19A into a single chip, or by integrating the display driver circuit 11A, the touch driver circuit 12A, and the fingerprint driver circuit 19A into a single chip in any suitable manner. For example, the FTDI IC (such as the single-chip component 10 or 10A) can be implemented to have a reduced overall circuit area by internally sharing a set of circuits such as a power circuit, a multi-time-programmable (MTP) read-only memory (ROM), and / or an oscillation circuit. In an exemplary implementation of the FTDI IC, the display driver circuit 11A and the touch driver circuit 12A (such as a touch and display driver integration (TDDI) IC) can be configured to communicate with the fingerprint driver circuit 19A (such as including a fingerprint readout IC (ROIC)) via an internal communication interface that can be easily implemented and controlled in a time-sharing manner. In some specific embodiments, the FTDI IC has different sets of internally shared circuits, such as those exemplified in U.S. Patent Publication No. 2018 / 0164943A1. Of course, the implementation of the disclosed content of the present invention is not limited to the above-mentioned examples.

[0193] Regarding Figure 1 or Figure 2The hardware structures of the multiple components in the specific embodiments, the display driver circuit (such as 11 or 11A), the touch driver circuit (such as 12 or 12A), and the fingerprint driver circuit (such as 19 or 19A) may be implemented individually or integrally based on a control circuit (which includes a microcontroller-type or processor-type core with computing capabilities). Alternatively, the designs of the display driver circuit (such as 11 or 11A), the touch driver circuit (such as 12 or 12A), and the fingerprint driver circuit (such as 19 or 19A) may be based on techniques using hardware description languages (HDL) or any other design method familiar to those skilled in the art for digital circuits, and may be based on hardware circuits implemented using field programmable gate arrays (FPGA), complex programmable logic devices (CPLD), or application-specific integrated circuits (ASIC).

[0194] In some embodiments, the display pixel array 91, such as a liquid crystal display (LCD) pixel array, an organic light emitting diode (OLED) pixel array, or any other suitable pixel array. The panel 9, for example, may be implemented through an in-cell type or on-cell type display panel integrated with a fingerprint sensor, where the pixel array 91, the touch sensing array 93, and the fingerprint sensing array 95 may be integrated together in a layered or any appropriate manner. The touch sensing array 93 may be implemented by using a capacitive touch sensor in the form of a touch sensing array or other suitable touch sensors. The fingerprint sensing array 95, for example, may be implemented through an optical fingerprint sensor, a capacitive fingerprint sensor, an ultrasonic fingerprint sensor, or any suitable device used as a sensor for sensing fingerprint signals. Of course, the implementation of the present invention is not limited to the above examples.

[0195] In some specific embodiments, the multiple fingerprint sensing pixels of the fingerprint sensing array 95 correspond to a fingerprint sensing area, the panel (or the display pixel array 91) has a display area, the multiple touch sensors of the touch sensing array 93 correspond to a touch sensing area, and the sizes of the fingerprint sensing area, the display area, and the touch sensing area are substantially the same; for example, these areas are the same, nearly the same, slightly different, or the differences between these areas are within a range, so as to facilitate the panel to implement the full-screen fingerprint sensing function. Of course, the implementation of the disclosed content of the present invention is not limited to the multiple examples. For example, the size of the fingerprint sensing area may be different from that of the display area.

[0196] The following shows the criticality of the pad arrangement of the single-chip element.

[0197] In an actual implementation, the electrical connection between the single-chip element 10 or 10A (i.e., FTDI IC) and the multiple display pixels of the panel 9, as well as the multiple associated touch sensors and fingerprint sensing pixels, is more Figure 1 or Figure 2 complicated than that schematically shown. Multiple pads of the single-chip element 10 (or 10A) are arranged thereon, and multiple corresponding traces need to be arranged to connect the multiple pads of the single-chip element 10 (or 10A) to the multiple control lines and related lines of the multiple display pixels, as well as the multiple associated touch sensors and fingerprint sensing pixels. In some implementations, the multiple corresponding traces are arranged to connect the multiple pads of the single-chip element 10 (or 10A) to a first GOA circuit for driving fingerprint sensing pixels, and a second GOA circuit for driving the multiple display pixels and the multiple associated touch sensors. If the multiple pads and the multiple corresponding traces for connecting the single-chip element to the multiple control lines and related lines are not properly implemented, signal interference on the multiple traces will inevitably become serious and reduce the performance of touch or fingerprint sensing.

[0198] To show the criticality of the pad arrangement of the single-chip element, the following is taken as Figure 3The possible implementation shown in the figure is used as an example for illustration. In this example, the display panel 9B associated with a touch sensing component (such as a touch sensor) and a fingerprint sensing component (such as a fingerprint sensing pixel) is configured to operate in combination with the TDDI IC 11B and the ROIC 19B for fingerprint sensing, as mentioned above. The TDDI IC 11B and the ROIC 19B are bonded to the film 100 in a Chip-on-film (COF) manner. The film 100 is connected to the flexible printed circuit 150, and the multiple integrated circuits (ICs) on the film 100 can be electrically connected to a processing unit (such as Figure 1 or Figure 2 shown in the figure). The display panel 9B includes gate-on-array (GOA) circuits TG1 and TG2, which are to be driven through the TDDI IC 11B; and GOA circuits RG1 and RG2, which are to be driven through the ROIC 19B respectively on the multiple left and right boundaries of the display panel 9B. The TDDI IC 11B includes some pads for outputting corresponding control signals to control the multiple GOA circuits TG1 and TG2, and the ROIC 19B includes some pads for outputting corresponding control signals to control the multiple GOA circuits RG1 and RG2. As Figure 3 shown in the figure, the TDDI IC 11B and the ROIC 19B are bonded to the film 100, such that the multiple traces 190 from the left side of the ROIC 19B inevitably need to cross the multiple traces from the TDDI IC 11B on the display panel 9B, such as the multiple traces 111 for controlling the data lines (or display data lines or source lines) of the display panel 9B and the multiple traces 110 for controlling the multiple GOA circuits TG1 and TG2. In this way, the following drawbacks will occur. The multiple traces crossing each other will cause signal interference and easily reduce the performance of display, touch sensing, or fingerprint sensing, thus affecting the user experience. To reduce the signal interference caused by the multiple traces crossing each other, additional processing using a specific material is required in the layer corresponding to the area where the multiple traces cross each other, which will also increase the total cost. In Figure 3Among them, the position of the TDDIIC 11B is on the left side, and the position of the ROIC 19B is on the right side. Since the multiple bonding positions of the TDDIIC 11B and the ROIC 19B on the film 100 are asymmetric with respect to the midline of the display panel 9B, the multiple resistance-capacitance (RC) loads of the multiple traces on the multiple left and right sides of the display panel are unequal due to the multiple traces with asymmetric lengths. This not only affects the ability of the multiple signals for driving the multiple GOA circuits on the multiple left and right sides of the display panel, but also affects the performance of display, touch sensing, or fingerprint identification.

[0199] To reduce signal interference, refer to Figure 4A , the single-chip element 20 for driving fingerprint sensing pixels, display pixels, and touch sensors is schematically illustrated according to various embodiments, as will be exemplified below.

[0200] In Figure 4A , the single-chip element 20 includes a main body 200, a first set of pads 210, and a second set of pads 220, and all the multiple pads are arranged in the main body 200. The first set of pads 210 is configured to be coupled to the multiple fingerprint sensing pixels (e.g., via a first GOA circuit) and includes multiple first pads for driving the multiple fingerprint sensing pixels. The second set of pads 220 is configured to be coupled to the panel (such as 9, 9A, or 9B) (e.g., via a second GOA circuit) and includes multiple second pads for driving the multiple display pixels. The axis AX (such as across the midline of the main body 200) defines the main body 200 into a left part P1 and a right part P2. In other words, the main body 200 has the left part P1 and the right part P2 with respect to the axis AX. The first set of pads 210 is arranged on both the left part P1 and the right part P2, and the second set of pads 220 is arranged on both the left part P1 and the right part P2. As Figure 4A illustrated in Figure 5 , for example, the first set of pads 210 (or the second set of pads 220) can be arranged on both the left part P1 and the right part P2 in a symmetric manner or an almost equally distributed manner, so that traces (such as represented by T) can be connected to the first set of pads 210 and extend in a similar manner. In addition, the first set of pads 210 in the left part P1 or the right part P2 is separated from the second set of pads 220, and the second set of pads 220 in the left part P1 or the right part P2 is separated from the first set of pads 210. Accordingly, the pad arrangement of the single-chip element 20 (such as will be later, for example, in FIG. 9A to FIG. 14(illustrated in any of the relevant specific embodiments), promoting that the corresponding plurality of first traces (the plurality of first traces can be coupled to the plurality of fingerprint sensing pixels via the first set of pads 210) and the corresponding plurality of second traces (the plurality of second traces can be coupled to the panel via the second set of pads 220) do not cross each other, and can effectively achieve reducing signal interference.

[0201] Specifically, in Figure 4A , the body 200 represents the integrated circuit of the single-chip element 20, which includes a display driver circuit 11, a touch driver circuit 12, and a fingerprint driver circuit 19 (or Figure 2 as shown in Figure 4A and Figure 4B ), where the body can also be referred to as the wafer body. Referring to Figure 4A , the first set of pads 210 in Figure 4B represents a plurality of conductive (such as metal) pads provided on the body 200 (such as the pads 210_1, 210_2 to 210_N (where N>1) illustrated in Figure 4A ), and the plurality of traces T to the body 200 in Figure 4B can be joined, such that components or circuits (such as represented by the fingerprint driver circuit 19) in the single-chip element 20 for driving the plurality of fingerprint sensing pixels can be electrically connected. Similarly, the second set of pads 220 are conductive (such as metal) pads provided on the body 200, and the traces (or wires) to the body 200 can be joined, such that components or circuits (such as represented by the display driver circuit 11 and the touch driver circuit 12) in the single-chip element 20 for driving the plurality of display pixels and the plurality of touch sensors can be electrically connected. In the following figures, for easy illustration, the plurality of pads and traces will be as shown in Figure 4A or Figure 4B .

[0202] In some specific embodiments of the single-chip element 20, Figure 4A , the body 200 (for example, observed from a top view or a bottom view) has a rectangular shape, which has a first side S1, a second side S2, a left side S3, and a right side S4. As illustrated in Figure 4A , the second side S2 is parallel to the first side S1 and is closer to the display panel than the first side S1 (such as in Figure 1 , Figure 2 , or Figure 3as shown in). The left side S3 is on the left part P1 and perpendicular to the first side S1 and the second side S2, while the right side S4 is on the right part P2 and parallel to the left side S3. In addition, the axis AX intersects the first side S1 and the second side S2. The single-chip element 20 can be implemented to include the first set of pads (or the second set of pads), which are distributed on the left part P1 and the right part P2. In Figure 4A although the first set of pads and the second set of pads are exemplified almost equally relative to the axis AX on the first side S1, the first set of pads and the second set of pads can also be distributed relative to the axis AX at any position on the second side S2 or on both of the plurality of left and right sides, as schematically represented by the dashed rectangle exemplified in Figure 4A as shown. Of course, the implementation of the content disclosed in the present invention is not limited to the plurality of examples.

[0203] Referring to Figure 5 , an exemplary specific embodiment of the pad arrangement of the single-chip element based on Figure 4A is exemplified. As Figure 5 shown, the single-chip element 20_1A includes a main body 200_1A and a plurality of pads. The electronic module including the thin film 100_1A and the single-chip element 20_1A arranged on the thin film 100_1A can be implemented based on Figure 5 . The plurality of pads includes a first set of pads, which are represented by G11_1A and G12_1A; and a second set of pads, which are represented by G21_1A and G22_1A. The first set of pads G11_1A and G12_1A includes a plurality of first pads, which are used to drive the plurality of fingerprint sensing pixels, and the second set of pads G21_1A and G22_1A includes a plurality of second pads, which are used to drive the plurality of display pixels. In Figure 5Among them, the first group of pads G11_1A and G12_1A and the second group of pads G21_1A and G22_1A are both arranged along the first side of the main body 200_1A. And the first group of pads G11_1A and the second group of pads G21_1A are arranged on the left part of the main body 200_1A relative to the axis AX, while the first group of pads G12_1A and the second group of pads G22_1A are arranged on the right part of the main body 200_1A relative to the axis AX. In the example, the single-chip element 20_1A is bonded to the film 100_1A in a COF manner. A plurality of first traces represented by T11_1A and T12_1A can be implemented to be respectively connected to the first group of pads G11_1A and G12_1A, and extend to the plurality of left and right boundaries of the display panel 9_1A to drive a plurality of fingerprint scan lines FGL (partially illustrated) connected to the fingerprint sensing array associated with the display panel 9_1A (such as Figure 6B , Figure 6C , or Fig.6D as partially illustrated therein). A plurality of second traces represented by T21_1A and T22_1A can be implemented to be respectively connected to the second group of pads G21_1A and G22_1A, and extend to the plurality of left and right boundaries of the display panel 9_1A to drive a plurality of TDDI scan lines TGL (partially illustrated) connected to the display pixel array and the touch sensing array associated with the display panel 9_1A (such as Figure 6B , Figure 6C , or Fig.6D as partially illustrated therein). In addition, alignment marks (such as cross symbols) can be marked on the housing of the main body as needed, such as in Figure 5 .

[0204] As illustrated in Figure 5 , the pad arrangement of the single-chip element 20_1A based on Figure 4A can facilitate the implementation of the plurality of traces and prevent the traces from crossing each other. In addition, the pad arrangement of the single-chip element 20_1A based on Figure 4A can facilitate the implementation of the plurality of traces in an almost symmetric manner in terms of trace length and trace pattern, thus reducing the influence of unequal RC loads of the plurality of traces. Compared with the implementation shown in Figure 3 (where the traces need to cross each other), this can not only improve the ability of the plurality of signals for driving the plurality of GOA circuits on the plurality of left and right sides of the panel, but also improve the performance of display, touch sensing, or fingerprint identification. Also, compared with the implementation shown in Figure 3 , based on Figure 4AThe pad arrangement of the single-chip element 20_1A can save the manufacturing cost of the additional processing of specific materials required in the layer corresponding to the region where the plurality of traces cross each other.

[0205] As Figure 5 shown, in an example, the single-chip element 20_1A may further include a third set of pads 230A, which are arranged, for example, along a second side of the main body 200_1A for connection to the display panel 9_1A. For example, the third set of pads 230A are for driving data lines of the display panel 9_1A or receiving fingerprint sensing signals from fingerprint sensing lines of the display panel 9_1A, or are coupled to touch sensing lines of the display panel 9_1A for receiving touch signals from the plurality of touch sensing lines. In Figure 5 , a plurality of traces T30 may be implemented to connect the third set of pads 230A to the display panel 9_1A through a film-on-glass (FOG) connection.

[0206] As Figure 5 shown, in an example, the single-chip element 20_1A may further include a plurality of pads 240A, which are arranged along a first side of the main body 200_1A for connection to the flexible printed circuit 150_1A. In Figure 5 , a plurality of traces T40 may be implemented to connect the plurality of pads 240A to the flexible printed circuit 150_1A through a film-on-film (FOF) connection.

[0207] To illustrate how the pad arrangement of the single-chip element affects the implementation of the architecture based on Figure 1 , the following specific embodiments are related to devices for display, touch sensing, and fingerprint sensing based on the architecture using FTDIIC (as exemplified in Figure 4A , Figure 5 etc.).

[0208] In these specific embodiments related to the electronic device, some specific embodiments illustrate the grouping and setting of the TDDI and fingerprint (FPR) gate output (CGOUT) signals output through the internal leads, external leads, and side leads on the FTDIIC for the display panel. Two types of pads for the TDDI and fingerprint CGOUT signals can be coupled to the TDDI GOA (gate driver on array) and FPR GOA on the display panel, and then the multiple scan lines of the display pixel array are driven using the TDDI GOA, while the multiple scan lines of the multiple FPR sensing pixels are driven using the FPR GOA. In addition, some specific embodiments based on the pad setting of the single-chip element illustrate the routing setting of the pads for the TDDI and fingerprint CGOUT signals on the display panel. Each specific embodiment of the grouping of the multiple TDDI and FPR CGOUT signals is also provided.

[0209] Referring Fig. 6A , a display panel including display pixels and fingerprint sensing pixels coupled to a single-chip element is illustrated according to specific embodiments. Taking Fig. 6A the panel architecture illustrated therein as an example, the active area (AA) of the display panel 9C can be divided into multiple zones for a fingerprint sensing array including multiple fingerprint sensing pixels, for example, 20 zones in the Y direction, and the number of the multiple fingerprint sensing pixels in the X direction can be the same as that of the multiple display pixels for each display row, where each or more display pixels can be equipped with fingerprint sensing pixels. Figure 6B is an enlarged schematic diagram of some components (such as represented by block B1 in Fig. 6A or Figure 6B ). As shown in Fig. 6A and Figure 6B , the single-chip element 20A disposed on the thin film 100A is used to output multiple fingerprint drive signals (such as represented by FPR_S1, FPR_S2) from the fingerprint driver circuit 29A of the single-chip element 20A to the gate driver on array (GOA) circuit GOA1 for the multiple fingerprint sensing pixels FS. The single-chip element 20A is also used to output multiple display drive signals (or touch-related signals) (such as represented by TDDI_S1) from the TDDI circuit 21A of the single-chip element 20A to the GOA circuit GOA2 for the multiple display pixels DP. Accordingly, the single-chip element 20A includes a first group of pads, which includes multiple first pads for driving the multiple fingerprint sensing pixels; and a second group of pads, which includes multiple second pads for driving the multiple display pixels (such as Figure 5 , FIG. 9A to FIG. 14 as exemplified in any one of

[0210] In Fig. 6A and Figure 6B for example, the block B1 disposed on the panel 9C includes a selection circuit (which may include, for example, a signal selector, a switch, a multiplexer, a demultiplexer, or any combination thereof), which is schematically illustrated by switches SWR, SWG, SWB, and SW_FP. Figure 6B The selection circuit of the block B1 in can be implemented as a combination of a data line selection circuit for selecting a data line from a set of data lines (such as display data lines or source lines for sub-pixels of one or more display pixels) and a fingerprint sensing line selection circuit for selecting at least one fingerprint sensing line. For example, the selection circuit including the plurality of switches SWR, SWG, SWB is disposed in the panel 9C for selecting data lines (such as represented by SLR, SLG, and SLB) for a set of red sub-pixels (R), green sub-pixels (G), and blue sub-pixels of the display pixel DP. The single-chip element 20A, for example, generates a driving signal for driving the plurality of selected data lines, and generates a selection signal TDDI_S2 (such as signals represented by TDDI_SWR, TDDI_SWG, TDDI_SWB, as exemplified later in Table 1 and Table 2) for controlling the plurality of switches SWR, SWG, SWB to selectively drive the plurality of data lines SLR, SLG, and SLB. Accordingly, for example, the second set of pads of the single-chip element 20A further includes a plurality of third pads for controlling the selection circuit. In this way, the number of traces and corresponding pads for electrical coupling or connection between the single-chip element 20A and the plurality of data lines of the panel 9C can be reduced.

[0211] In addition, in the block B1, the switch SW_FP is for selecting a corresponding one of the plurality of fingerprint sensing lines to receive a fingerprint sensing signal from a fingerprint sensing pixel (such as represented by FS). In an example, the plurality of third pads further includes a pad for outputting a selection signal (such as a signal represented by TDDI_SW_FP, as exemplified later in Table 1 or Table 2) to control the block B1 so as to use a trace LS for receiving one of the fingerprint sensing signals, where the trace LS is connected to one of the pads of the third set of pads of the single-chip element 20A. In this example, the pad connected to the trace LS can be employed to drive the plurality of data lines of the panel 9C (such as Figure 6Bthe SLR, SLG, SLB) exemplified in, or selectively receive the fingerprint sensing signals from the fingerprint sensing line SL_FP of the panel 9C at different time instants. In this way, if as Figure 6B the specific embodiment shown in Figure 5 is applied to the Figure 5 single-chip element 20_1A of

[0212] In the above specific embodiment, in the configuration of the selection circuit (such as the block B1) in the panel as shown in Figure 6B the single-chip element 20A needs to include the plurality of third pads (such as for outputting the plurality of selection signals TDDI_S2) for controlling the selection circuit, and it is necessary to arrange the corresponding traces selectively.

[0213] For example, the single-chip element can be implemented to drive the plurality of display pixels by using a selection circuit, but directly receive the fingerprint sensing signals, as shown in Figure 6C wherein Figure 6C the single-chip element 20A in Figure 6C needs to include the plurality of third pads (and corresponding traces) for controlling the selection circuit including the plurality of switches SWR, SWG, SWB. In this example,

[0214] In another example, the single-chip element can even be implemented to drive the plurality of display pixels and directly receive the fingerprint sensing signals without using a selection circuit (such as block B1), as shown in Fig.6D wherein Fig.6D the single-chip element 20A in

[0215] The above-mentioned plurality of examples (such as shown in any of FIG. 6B to FIG. 6D ) can be adopted in any specific embodiment of the single-chip element as long as appropriate, for example Figure 5 、 FIG. 9A to FIG. 15 exemplified in any one of

[0216] For more information about the structure and operation of the display panel and the FTDIIC, reference can be made to Annex I and Annex II of the US Provisional Patent Application No. 62 / 912,666 filed on October 9, 2019 (which is part of this application). However, the implementation of the present invention is not limited thereto.

[0217] Refer to Figure 7 and Figure 8, specific embodiments of the circuit architecture and operating principle of the fingerprint sensing pixel are shown below.

[0218] In Figure 7 , the fingerprint sensing pixel includes a photodiode PD, a switch, and a capacitor. In Figure 8 , multiple operation cycles in the FTDI IC are illustrated and represented by respective blocks represented by "display", "touch", and "fingerprint" for display pixel driving, touch sensor driving, and fingerprint sensing pixel driving, respectively. In addition, during each operation cycle for display, touch, and fingerprint, exemplary waveforms of the multiple corresponding control signals are illustrated under respective blocks representing the multiple operation cycles in Figure 8 , where the multiple control signals illustrated will be described by way of example below and in Tables 1 and 2.

[0219] The following is an example of the operation of fingerprint sensing using the fingerprint sensing pixel.

[0220] In the first step, the fingerprint driver circuit (or fingerprint identification circuit) for the fingerprint (FPR) section sequentially outputs a start pulse signal (such as FPR_STV[4:6], corresponding to the example shown in Fig. 6A ) to the area where finger pressing occurs on the panel (such as Fig. 6A section 4 - 6 in the middle area), and the reset signal FPR_GCK sequentially turns on the reset switch TS1 for each relevant section, so that the cathode of the corresponding photodiode PD is reset to the voltage VDD (such as 5V) and its anode is at the voltage Vbias (such as 0V).

[0221] In the second step, the reset signal FPR_GCK turns off the switch TS1 (such as used as a reset switch), and the voltage across the photodiode is 5V. When the light illuminates the fingerprint, it will generate reflected light. The reflected light illuminates the photodiode PD, thereby accelerating the discharge rate of the photodiode. The reflected light of the fingerprint ridges is brighter, which makes the resistance of the photodiode PD smaller, and the discharge rate at the cathode of the photodiode PD is fast and the voltage of the cathode is small (for example, about 2V). The reflected light of the fingerprint valleys is darker than that of the fingerprint ridges, which makes the resistance of the photodiode PD larger, and the discharge rate at the cathode of the photodiode PD is slow and the voltage of the cathode is larger (for example, about 3V).

[0222] In the third step, the selection signal (or acquisition signal) FPR_SEL sequentially turns on the switches TS2 of each section, and the cathode voltage of the photodiode PD is transmitted to the fingerprint sensing line connected to the node (Vout). In the FPR section, the TDDI_SW_FP signal of the plurality of TDDI CGOUT signals will output a signal at a high level (or asserted) to select the FTDI data line or fingerprint sensing line function for fingerprint voltage sensing, and the remaining TDDI_SWR / TDDI_SWG / TDDI_SWB signals of the plurality of TDDI CGOUT signals will be at a low level. At the same time, the analog front-end (AFE) circuit of the FTDIIC can read the corresponding sensing result Vout1.

[0223] In the fourth step, the reset signal FPR_GCK turns on the switch TS1, the cathode of the photodiode is reset to the voltage VDD (such as 5V) again, and the 5V voltage is transmitted to the node Vout, so that the AFE circuit can read the corresponding reset result Vout2.

[0224] In the fifth step, the fingerprint information is obtained by subtracting the voltage of the reset result Vout2 from the sensing result Vout1.

[0225] The following provides specific embodiments of the CGOUT signals of the FTDIIC (such as the single-chip component 20 or 20_1A).

[0226] Table 1 and Table 2 list the FPR CGOUT signals and TDDI CGOUT signals with their brief descriptions according to specific embodiments, where the symbols "_L" or "_R" in Table 1 or Table 2 indicate that their pads or traces can implement signals on the left or right parts of the single-chip component. Of course, the present invention is not limited thereto. In any panel design, the plurality of signals provided by the FTDI chip to the FPR GOA can be changed according to the plurality of design requirements, and the plurality of signals listed in Table 1 can be classified as the plurality of FPR CGOUT signals. Similarly, the plurality of signals provided by the FTDI chip to the TDDI GOA can be changed according to the plurality of design requirements, and the plurality of signals listed in Table 2 can be classified as the plurality of TDDI CGOUT signals.

[0227] Table 1

[0228]

[0229]

[0230] Table 2

[0231]

[0232]

[0233] As illustrated in Table 1 and Table 2, considering the fact that the multiple operating voltages of the circuit components for display, touch sensing, and fingerprint identification on the panel belong to different categories, the multiple TDDI CGOUT signals and FPR CGOUT signals are grouped. Classifying the multiple CGOUT signals into different groups can facilitate the circuit design simplification and clarify the panel wiring. In other words, it is preferred that the multiple traces of the TDDI CGOUT and the multiple FPR CGOUT signals do not interleave or cross each other. In some implementations, the fingerprint sensing line selection circuit for FTDI can be integrated with the data line selection circuit for display data signals, and such integration (such as the selection circuit of block B1 in Figure 6B ) will bring advantages of reducing the number of pinouts or pad requirements for electrical connection in terms of the panel design, circuit manufacturing and design, and FTDI. In this way, for the selection circuit integration, the TDDI_SW_FP signal can be classified into the TDDI CGOUT voltage signal category and placed in the TDDI CGOUT signal group.

[0234] In addition, any group of the multiple TDDI CGOUT and FPR CGOUT signal groups can be further classified into subgroups according to design requirements. The multiple traces (etc.) of the multiple signals within the subgroup are adjacent to each other and do not intersect with the multiple traces (etc.) of the multiple signals of other subgroups, but the present invention is not limited thereto. In some specific embodiments, each group of the multiple TDDI CGOUT and FPR CGOUT signal groups can be divided into at least two subgroups (such as a left subgroup and a right subgroup), which respectively provide (as illustrated in Figure 6B ) to the GOA on the multiple left sides and right sides of the panel. Preferably, the multiple corresponding pads for the multiple left subgroups and right subgroups can be arranged along the multiple left sides and right sides of the FTDIIC respectively.

[0235] In some specific embodiments, in addition to the TDDI CGOUT and FPR CGOUT, the signals output to the panel and the signals output to the FTDIIC can be further divided into other signal groups (hereinafter in 9A to 12DShown or classified as other inner - lead - bonding (ILB) pads (or other ILB signal groups). In a similar manner to the signal groups mentioned above, the multiple traces (and pads) for another signal group can be arranged adjacent to each other and do not cross the multiple traces of the multiple pads of the multiple two groups of TDDI CGOUT and FPR CGOUT. For example, some or all of the multiple pads for TDDI power and / or FPR power can be classified as other ILB pads. That is, the signals for power can be considered to belong to 9A to 12D the group of other ILB pads shown in. In addition, a separate signal group for one of the powers helps to connect to a capacitor on a flexible printed circuit (FPC).

[0236] The multiple above - mentioned Tables 1 and 2 are only examples. In another example, the multiple FPR CGOUT signals may further include one or more signals for power (such as high and low voltage signals provided to the FPR GOA, and bias signals or voltage source signals provided to the FPR sensor), where the multiple pads and traces for the multiple signals for power can be arranged adjacent to each other and these traces do not cross the multiple traces of the multiple left and right subgroups of the multiple FPR CGOUT signals. Similarly, the multiple TDDI CGOUT signals may include one or more signals for power (such as the multiple high and low voltage signals provided to the TDDI GOA, and bias signals or voltage source signals provided to the FPR sensor), where the multiple pads and traces for the multiple signals for power can be arranged adjacent to each other and these traces do not cross the multiple traces of the multiple left and right subgroups of the multiple TDDI CGOUT signals.

[0237] In some specific embodiments, some or all of the multiple pads for signals for TDDI power and / or for FPR power can be classified as other ILB pads. In other specific embodiments, the multiple pads for signals for power can be classified as a subgroup of the TDDI CGOUT group or a subgroup of the FPR CGOUT group.

[0238] In some specific embodiments, the multiple left and right subgroups of the multiple FPR CGOUT signals can be further subdivided into at least one of the following subgroups, such as GOA SEL (the acquisition signal included in Table 1) and GOAReset (the reset signal in Table 1). In a specific embodiment, since any GCK (such as FPR_GCK1, FPR_GCK2, FPR_GCK3) of the multiple FPR CGOUT signals is transmitted to the gate clock shift register circuit on the panel, which can be performed in the same section on the panel, the multiple GCK CGOUT signals can also be classified into the same reset signal subgroup, where the multiple pads and traces of the multiple GCK CGOUT signals can be arranged adjacent to each other, and these traces do not cross the traces of other signal subgroups (such as the acquisition signal). Similarly, the multiple left and right subgroups of the multiple TDDI CGOUT signals can be subdivided into at least one of the following subgroups: the subgroup of the multiple selection signals (depicted in Table 2), or the subgroup of other control signals (other signals depicted in Table 2), where the multiple pads and traces for these subgroups can be configured to be adjacent to each other without crossing the multiple pads and traces for other subgroups (such as the multiple signals of the control signal subgroup).

[0239] In other words, according to the design requirements, the multiple signals of the multiple FTDI chips can be divided into at least two groups (such as FPR CGOUT signals and TDDI CGOUT signals) or more groups, and the multiple signals in each group can be adjacent to each other, and the pads and traces do not intersect with the multiple signals of another group. The multiple signals in each group can be further subdivided into at least one subgroup according to the design requirements (such as the multiple voltage ranges, functional properties of the multiple signals, and the positions of the corresponding GOA circuits on the panel), and the multiple pads (such as the first group of pads) and signal traces of the subgroup can be arranged adjacent to each other and do not intersect (or cross) the multiple pads and traces of the signals of other subgroups.

[0240] Through the discussion of the above-mentioned signal grouping and various specific embodiments, it should be understood that under the Figure 1 architecture shown in Figure 4AThe pad assignment for the first set of pads and the second set of pads illustrated in the specific embodiments is technically helpful for routing planning and manufacturing, reduction of signal interference, and the benefit of routing RC load balancing. Overall, such a pad assignment can promote the performance of display, touch sensing, and fingerprint sensing. Moreover, the industry can enjoy the pad assignment provided by the single-chip element, and electronic products such as the single-chip element, the electronic module based on the single-chip element, and the computing device based on the electronic module can be easily and effectively carried out and developed accordingly.

[0241] The following provides various pad assignments for the first set of pads and the second set of pads, and specific embodiments of manufacturing techniques (such as COF or COG) for single-chip elements based on Figure 1 the architecture. In diagrams such as Figure 5 , 9A -17, a single-chip element (such as one of 20_1A-20_1D, 20_2A-20_2D, 20_3A-20_3D, 20_4A-20_4D, 30A-30C, 40) includes a body (such as one of 200_1A-200_1D, 200_2A-200_2D, 200_3A-200_3D, 200_4A-200_4D, 300A-300C). The single-chip element is arranged on a panel or a film and is coupled between the panel and the flexible printed circuit. The panel (for example, a part of an exemplary display panel) is represented by a square corresponding to one of, for example, symbols 9_1A-9_1D, 9_2A-9_2D to 9_4A-9_4D, and the flexible printed circuit (FPC) (for example, a part thereof) is represented by another square corresponding to one of, for example, symbols 150_1A-150_1D to 150_4A-150_4D. In addition, the third set of pads may also be assigned in any specific embodiment of the single-chip element shown in Figure 5 in a manner similar to the third set of pads of the single-chip element 20_1A shown therein. In the following specific embodiments illustrated in FIG. 9A to FIG. 17 , for simplicity, the multiple specific pad assignments for TDDI GOA and FPR GOA are not shown. Figure 5 , 9A to 12D In some specific embodiments based on

[0242] and Figure 1 and Figure 4A , as illustrated in Figure 5 , 9A to 9C , all the first set of pads and all the second set of pads are arranged along the lower side of the single-chip element (or the first side S1 as in Figure 4A ).

[0243] As an example of using a COF package, refer again to Figure 5 , the single-chip element 20_1A bonded to the film 100_1A has all the first set of pads G11_1A to G12_1A for fingerprint sensing arranged along the first side (or the lower lateral side), and the second set of pads G21_1A to G22_1A for display and touch sensing (such as TDDI).

[0244] In another example of using a COF package, refer to Fig. 9A , the single-chip element 20_1B bonded to the film 100_1B includes all the first set of pads G11_1B to G12_1B for fingerprint sensing arranged along the first side (or the lower lateral side), and the second set of pads G21_1B to G22_1B for display and touch sensing (such as TDDI). The plurality of first traces represented by T11_1B and T12_1B can be implemented to be respectively connected to the first set of pads G11_1B and G12_1B, and extend to the left and right boundaries of the display panel 9_1B to drive a plurality of fingerprint scan lines FGL connected to the fingerprint sensing array associated with the display panel 9_1B. The plurality of second traces represented by T21_1B and T22_1B can be implemented to be respectively connected to the second set of pads G21_1B and G22_1B, and extend to the left and right boundaries of the display panel 9_1B to drive a plurality of TDDI scan lines TGL connected to the display pixel array and the touch sensing array associated with the display panel 9_1B.

[0245] In an example of using a COG package, refer to Fig. 9B, the single-chip element 20_1C bonded to the glass portion 90_1C of the display panel 9_1C includes all the first sets of pads G11_1C to G12_1C for fingerprint sensing arranged along the first side (or the lower lateral side), and the second sets of pads G21_1C to G22_1C for display and touch sensing (such as TDDI). On the glass portion 90_1C, a plurality of first traces T11_1C and T12_1C can be implemented to be respectively connected to the first sets of pads G11_1C and G12_1C, and extend to the plurality of left and right boundaries of the display panel 9_1C to drive a plurality of fingerprint scan lines FGL connected to the fingerprint sensing array associated with the display panel 9_1C. A plurality of second traces T21_1C and T22_1C can be implemented to be respectively connected to the second sets of pads G21_1C and G22_1C, and extend to the plurality of left and right boundaries of the display panel 9_1C to drive a plurality of TDDI scan lines TGL connected to the display pixel array and the touch sensing array associated with the display panel 9_1C.

[0246] In another example using a COG package, refer to Fig. 9C , the single-chip element 20_1D bonded to the glass portion 90_1D of the display panel 9_1D includes all the first sets of pads G11_1D to G12_1D for fingerprint sensing arranged along the first side (or the lower lateral side), and the second sets of pads G21_1D to G22_1D for display and touch sensing (such as TDDI). On the glass portion 90_1D, a plurality of first traces T11_1D and T12_1D can be implemented to be respectively connected to the first sets of pads G11_1D and G12_1D, and extend to the plurality of left and right boundaries of the display panel 9_1D. A plurality of second traces T21_1D and T22_1D can be implemented to be respectively connected to the second sets of pads G21_1D and G22_1D, and extend to the plurality of left and right boundaries of the display panel 9_1D. For simplicity, the plurality of detailed information is Fig. 9B similar and will not be elaborated further.

[0247] In the examples as shown in Figure 5 and Fig. 9B , the first set of pads is closer to the axis AX than the second set of pads. In the examples as shown in Fig. 9A and Fig. 9C , the second set of pads is closer to the axis AX than the first set of pads. In some examples, such as Figure 5 , 9A to 9C either of the first set of pads and the second set of pads can be internal lead bonding pads. However, the present invention is not limited thereto.

[0248] In some specific embodiments based on Figure 1 and Figure 4A as illustrated in FIG. 10A to FIG. 10D all of the first set of pads and all of the second set of pads are arranged along the higher side (or the second side S2 as in Figure 4A ) of the single - wafer element.

[0249] As an example of using COF packaging, referring to Fig. 10A , the single - wafer element 20_2A bonded to the thin film 100_2A includes all of the first set of pads G11_2A to G12_2A for fingerprint sensing arranged along the second side (or the higher lateral side), and the second set of pads G21_2A to G22_2A for display and touch sensing (such as TDDI). A plurality of first traces T11_2A and T12_2A can be implemented to be respectively connected to the first set of pads G11_2A and G12_2A and extend to the plurality of left and right boundaries of the display panel 9_2A to drive a plurality of fingerprint scan lines FGL connected to a fingerprint sensing array associated with the display panel 9_2A. A plurality of second traces T21_2A and T22_2A can be implemented to be respectively connected to the second set of pads G21_2A and G22_2A and extend to the plurality of left and right boundaries of the display panel 9_2A to drive a plurality of TDDI scan lines TGL connected to a display pixel array and a touch sensing array associated with the display panel 9_2A.

[0250] In another example of using COF packaging, referring to Fig. 10B , the single - wafer element 20_2B bonded to the thin film 100_2B includes all of the first set of pads G11_2B to G12_2B for fingerprint sensing arranged along the second side, and the second set of pads G21_2B to G22_2B for display and touch sensing (such as TDDI).

[0251] In an example of using COG packaging, referring to Fig. 10C , the single - wafer element 20_2C bonded to the glass part 90_2C of the display panel 9_2C includes all of the first set of pads G11_2C to G12_2C for fingerprint sensing arranged along the second side, and the second set of pads G21_2C to G22_2C for display and touch sensing (such as TDDI).

[0252] In another example of using COG packaging, referring to Fig. 10D, the single-chip element 20_2D bonded to the glass part 90_2D of the display panel 9_2D includes all the first sets of pads G11_2D to G12_2D for fingerprint sensing arranged along the second side, and the second sets of pads G21_2D to G22_2D for display and touch sensing (such as TDDI).

[0253] In Fig. 10B (or Fig. 10C , Fig. 10D ), a plurality of first traces T11_2B and T12_2B (or T11_2C and T12_2C; T11_2D and T12_2D) can be implemented to connect the first sets of pads G11_2B and G12_2B (or G11_2C and G12_2C; G11_2D and G12_2D) to the panel 9_2B (or 9_2C, 9_2D) respectively. A plurality of second traces T21_2B and T22_2B (or T21_2C and T22_2C; T21_2D and T22_2D) can be implemented to connect the second sets of pads G21_2B and G22_2B (or G21_2C and G22_2C; G21_2D and G22_2D) to the panel 9_2B (or 9_2C, 9_2D) respectively. For simplicity, the multiple detailed information for FIG. 10B to FIG. 10D is similar to the multiple above examples and will not be elaborated here.

[0254] In examples such as Fig. 10A and Fig. 10C shown, the first set of pads is closer to the axis AX than the second set of pads. In examples such as Fig. 10B and Fig. 10D shown, the second set of pads is closer to the axis AX than the first set of pads. In some examples, such as any of FIG. 10A to FIG. 10D , the first and second groups of pads can be outer-lead-bonding (OLB) pads. Shorter traces can be implemented in the multiple examples shown in Figure 5 , 9A to 9C compared to those in FIG. 10A to FIG. 10D . However, the present invention is not limited to the shown multiple examples.

[0255] In some specific embodiments based on Figure 1 and Figure 4A , as exemplified in FIG. 11A to FIG. 11D , all the first set of pads and all the second set of pads are along the lower side of the single-chip element (or as in Figure 4Ais arranged along the first side S1), and the traces connecting to the first set of pads or the second set of pads can be routed from the shorter sides (such as the left side S3 and the right side S4). Fig.11A and Fig. 11B employs a COF arrangement, while Fig. 11C and Fig.11D employs a COG arrangement. In Fig. 11B or Fig.11D the second set of pads G21_3B to G22_3B or G21_3D to G22_3D (such as TDDICGOUT) of the single-chip element 20_3B or 20_3D is closer to the axis AX than the first set of pads G11_3B to G12_3B or G11_3D to G12_3D (such as FPR CGOUT), which are the ILB pads of the single-chip element 20_3B or 20_3D. The plurality of traces T11_3B to T12_3B or T11_3D to T12_3D of the first set of pads G11_3B to G12_3B or G11_3D to G12_3D are routed from the plurality of shorter sides (such as the left side S3 and the right side S4) to the display panel via Line-on-film (LOF) lines or Line-on-glass (LOG) lines, while the plurality of traces T21_3B to T22_3B or T21_3D to T22_3D of the second set of pads G21_3B to G22_3B or G21_3D to G22_3D are routed from the lower side (such as the first side S1). In Fig.11A or Fig. 11C the first set of pads G11_3A to G12_3A or G11_3C to G12_3C (such as FPRCGOUT) of the single-chip element 20_3A or 20_3C is closer to the axis AX than the second set of pads G21_3A to G22_3A or G21_3C to G22_3C (such as TDDI CGOUT), which are the ILB pads of the single-chip element 20_3A or 20_3C. The plurality of traces T21_3A to T22_3A or T21_3C to T22_3C of the second set of pads G21_3A to G22_3A or G21_3C to G22_3C are routed from the plurality of shorter sides (such as the left side S3 and the right side S4) to the display panel via Line-on-film (LOF) lines or Line-on-glass (LOG) lines, while the plurality of traces T11_3A to T12_3A or T11_3C to T12_3C of the first set of pads G11_3A to G12_3A or G11_3C to G12_3C are routed from the lower side (such as the first side S1). This allows the panel manufacturer to flexibly choose whether to route the plurality of traces from the plurality of longer sides of the wafer (such as FTDIIC) or the plurality of traces from the plurality of shorter sides to the display panel.

[0256] In some specific embodiments of the single-chip element based on Figure 1 and FIG. 4, as exemplified in FIG. 12A to FIG. 12D , all of the first set of pads are arranged along the left side S3 and the right side S4, and all of the second set of pads are arranged along the left side S3 and the right side S4.

[0257] Fig. 12A and Fig. 12B adopt a COF arrangement, while Fig. 12C and Fig.12D adopt a COF arrangement. The first set of pads G11_4A to G12_4A, G11_4B to G12_4B, G11_4C to G12_4C, or G11_4D to G12_4D (such as FPR CGOUT) and the second set of pads G21_4A to G22_4A, G21_4B to G22_4B, G21_4C to G22_4C, or G21_4D to G22_4D (such as TDDI CGOUT) are pads from the multiple shorter sides of the single-chip elements 20_4A, 20_4B, 20_4C, or 20_4D. In Fig. 12A or Fig. 12C , the second set of pads (such as TDDI CGOUT) is configured to be close to the multiple OLB pads, while the first set of pads (such as FPR CGOUT) is configured to be close to the multiple ILB pads. In Fig. 12B or Fig.12D , the second set of pads is configured to be close to the multiple ILB pads, while the first set of pads is configured to be close to the multiple OLB pads. In Fig. 12A (or Fig. 12B , Fig. 12C , or Fig.12D ), multiple first traces T11_4A and T12_4A (or T11_4B, T12_4B; T11_4C, T12_4C; T11_4D, T12_4D) can be implemented to connect the first set of pads G11_4A and G12_4A (or G11_4B, G12_4B; G11_4C, G12_4C; G11_4D, G12_4D) to the panel 9_4A (or 9_4B, 9_4C, 9_4D) respectively. Multiple second traces T21_4A and T22_4A (or T21_4B, T22_4B; T21_4C, T22_4C; T21_4D, T22_4D) can be implemented to connect the second set of pads G21_4A and G22_4A (or G21_4B, G22_4B; G21_4C, G22_4C; G21_4D, G22_4D) to the panel 9_2B (or 9_2C, 9_2D) respectively.

[0258] In some specific embodiments of the single-chip element based on Figure 1 and Figure 4A , all of the first set of pads are arranged along one of the first side S1 and the second side S2 (as exemplified in Figure 5 , 9A to 9C ; FIG. 10A to FIG. 10D ), while all of the second set of pads are arranged along both the left side S3 and the right side S4 (as exemplified in FIG. 12A to FIG. 12D ).

[0259] In some specific embodiments of the single-chip element based on Figure 1 and Figure 4A , all of the first set of pads are arranged along both the left side S3 and the right side S4 (as exemplified in FIG. 12A to FIG. 12D ), while all of the second set of pads are arranged along one of the first side S1 and the second side S2 (as exemplified in Figure 5 , 9A to 9C ; FIG. 10A to FIG. 10D ).

[0260] Thus, compared with the possible implementation described in Figure 3 , the above-mentioned multiple specific embodiments regarding pad arrangements (as exemplified in Figure 5 , 9A to 12D , or related specific embodiments) can facilitate the configuration of corresponding traces in a nearly symmetric manner without crossing each other. Accordingly, signal interference in touch sensing and fingerprint sensing can be reduced. In addition, the manufacturing cost can also be reduced because specific materials and additional processing used to reduce the impact of trace crossing each other can be omitted.

[0261] The following further provides specific embodiments of a single-chip element based on the architecture of Figure 1 (with pad assignments for FPR CGOUT signals and TDDI CGOUT signals).

[0262] In an arithmetic device of a single-chip element adopting the architecture of Figure 1 , the panel of the arithmetic device may generally be selected by a data line selection circuit, a fingerprint sensing line selection circuit, or both arranged beside the boundary of the panel (such as Figure 6B or Figure 6Cis implemented by exemplifying the block B1), wherein the boundary is generally adjacent to the single-chip element. To avoid the possibility of the trace for the TDDI CGOUT signal crossing the plurality of traces on the panel, the plurality of traces for the TDDI_SWR / TDDI_SWG / TDDI_SWB / TDDI_SW_FP signals may be implemented as close as possible to the center of the panel. Referring to Fig.13 and Fig.14 , a single-chip element is coupled to the panel, which includes, among other components, a plurality of selection circuits SC (each of which may be implemented as Figure 6B or Figure 6C shown in the plurality of switches SWR / SWG / SWB / SW_FP).

[0263] As Fig.13 exemplified, for example, the single-chip element 30A based on the architecture of the single-chip element 10 or 10A and the pad arrangement as Figure 4A exemplified includes a first set of pads, a second set of pads, and a third set of pads.

[0264] The first set of pads may include a plurality of first pads P11A and P12A. For example, the first set of pads and the second set of pads are arranged on both the left part and the right part (such as on the lower side or the first side), while the third set of pads is arranged along the higher side or the second side. As Fig.13 shown, the first set of pads including the plurality of first pads P11A and P12A is closer to the axis AX than the second set of pads including the plurality of second pads P21A and P22A and the plurality of third pads P31A and P32A. For example, the first set of pads includes the plurality of first pads P11A for the FPR_STV, FPR_GCK1, FPR_GCK2, FPR_GCK3, FPR_SEL1, FPR_SEL2, FPR_SEL3, FPR_UD, and / or FPR_UDB signals of the left part, and the first set of pads further includes the plurality of first pads P12A corresponding to the same individual signals as above for the right part, as exemplified in Tables 1 and 2.

[0265] The second set of pads may include a plurality of second pads P21A and P22A and a plurality of third pads P31A and P32A. The second set of pads includes the plurality of second pads P21A for the TDDI_STV, TDDI_UD, TDDI_UDB, TDDI_GCK1, TDDI_GCK2, TDDI_RST signals of the left portion, and the second set of pads further includes the plurality of second pads P22A corresponding to the same individual signals for the right portion, as exemplified in Tables 1 and 2. The second set of pads may further include the plurality of third pads P31A, which are used to output control signals, such as the TDDI_SWR, TDDI_SWG, TDDI_SWB, and / or TDDI_SW_FP signals of the left portion, and further includes the plurality of corresponding third pads P32A for the same respective signals of the right portion, as exemplified in Tables 1 and 2. In Fig.13 , the plurality of third pads P31A, P32A (such as ILB pads) are configured to be coupled to the plurality of selection circuits SC of the panel via traces T31A, T32A respectively.

[0266] The third set of pads includes a plurality of fourth pads (such as P4A). In some embodiments, the third set of pads includes the plurality of fourth pads P4A, which are used to drive the plurality of data lines or receive fingerprint sensing signals from the plurality of fingerprint sensing lines, or are coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

[0267] In an embodiment, the plurality of fourth pads P4A includes a plurality of first sub-group pads (such as P41A), which are used to drive the plurality of data lines in a time-division manner and receive fingerprint sensing signals from the plurality of fingerprint sensing lines; and a second sub-group pads (such as P42A), which are configured to be coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines. For example, referring to Figure 6B 、 Figure 8 、 Fig.13 , one of the first sub-group pads connecting the trace LS is used to transmit the plurality of TDDI_SWR, TDDI_SWG, TDDI_SWB signals (such as Figure 8 selectively established as shown on the left side) at different times during a plurality of time intervals for display, and the same pad connecting the trace LS is used to transmit the plurality of related signals such as the TDD_SW_FP signal (such as Figure 8When the selective establishment shown on the right side is in use during the period for fingerprint (FP), a fingerprint sensing signal is received from the fingerprint sensing line. In addition, during the period for the touchpad (TP) (as exemplified in Figure 8 ), the second subgroup of pads (such as P42A) is configured to receive touch signals from the plurality of touch sensing lines of the panel.

[0268] In another example, the first subgroup of pads (such as P41A) is configured to drive the plurality of data lines in a time-division manner, and the second subgroup of pads receives touch signals from the plurality of touch sensing lines. For example, referring to Figure 6C 、 Fig.13 , the first subgroup of pads connecting the trace LS is configured to selectively transmit the plurality of TDDI_SWR, TDDI_SWG, TDDI_SWB signals (such as the selective establishment shown on the left side of Figure 8 ) through the selection circuit of the block B1 at different times.

[0269] In some embodiments, the first subgroup of pads and the second subgroup of pads are alternately arranged on the body. For example, as shown in Fig.13 or Fig.14 , the first subgroup of pads P41A (or P41B) and the second subgroup of pads P42A (or P42B) are alternately arranged on the body of the monolithic element 30A (or 30B).

[0270] As exemplified in Fig.14 , for example, the monolithic element 30B (such as based on the monolithic element 10 or 10A) includes a first group of pads including a plurality of first pads P11B and P12B; a second group of pads including a plurality of second pads P21B and P22B and a plurality of third pads P31B and P32B; and a third group of pads including a plurality of fourth pads P4B. As shown in Fig.14 , Fig.13 The difference between the specific embodiment of Fig.14 and Fig.14 is that in the specific embodiment of Fig.14 , the plurality of third pads P31B and P32B are closer to the axis AX than the plurality of second pads P21B and P22B and the plurality of first pads P11B and P12B. For example, in the specific embodiment of Fig.14 , the plurality of first pads P11B and P12B, the plurality of second pads P21B and P22B, the plurality of third pads P31B and P32B, and the plurality of fourth pads P4B may include means for connecting to, such as Fig.13The pads for signals of the same type as their counterparts exemplified in the specific embodiments described above. In some implementations, the plurality of traces of the second set of pads including the plurality of second pads P21B and P22B and the plurality of third pads P31B and P32B may be routed from the plurality of shorter sides (such as the left side and the right side) to the display panel via film over glass (FOG) lines or glass over glass (GOG) lines. In Fig.14 , the plurality of traces T31B, T32B coupled to the plurality of third pads P31B and P32B are for controlling the plurality of selection circuits SC. In this way, the panel manufacturer can flexibly choose whether to route the plurality of traces from the plurality of longer sides of the wafer (such as the FTDIIC) or the plurality of traces from the plurality of shorter sides to the display panel.

[0271] In Fig.13 and Fig.14 of the above-described plurality of specific embodiments, the SW_FP signal belongs to the TDDICGOUT signal group, and the pads for the SW_FP signal are correspondingly included in the second set of pads, but the present invention is not limited to the plurality of examples. In some other specific embodiments, the SW_FP signal may belong to the FPR CGOUT signal group, and in this case, the pads for the SW_FP signal are included in the first set of pads. Preferably, but not limited to, the positions of the pads and traces for the SW_FP signal are close to the positions of the pads and traces for the TDDI_SWR, TDDI_SWG, and TDDI_SWB signals in the TDDI group.

[0272] In some other specific embodiments, for example, as Annex 3 submitted in the U.S. Provisional Patent Application No. 62 / 912,666 filed on October 9, 2019, entitled "A driver chip for fingerprint identification and touch display, a display system and a driving method", and incorporated as part of the present application, the SW_FP signal may not need to be implemented, so TDDI_SW_FP is optional and removable as needed.

[0273] In addition, any pad for the FPR CGOUT or TDDI CGOUT signal group (such as the first group of pads or the first group of pads) can be located on the higher and longer side, the lower long side, the short side, and the higher / lower long side and the short side of the single-chip element. Even the multiple pads for any TDDI CGOUT and FPR CGOUT can be located on different sides. For example, some pads are located on the higher long / short side, and some pads are located on the shorter side; or some pads are located on the higher long side or the short side and are shorted to the short side, partially on the higher / lower long side; or some pads are on the higher long / short side and are shorted to the short side, and some are on the short side. The multiple pads for TDDI CGOUT and the multiple pads for the FPR CGOUT signal can be configured as two parts of the pads of the ILB pads of the FTDI, respectively located at the positions of the two ends of one side close to the main body of the single-chip element and at the positions between the multiple ends of the side (as illustrated in the example related to Fig.13 ), or respectively located at the positions between the multiple ends of the side and at the positions close to the multiple ends of the side (as illustrated in the example related to Fig.14 ). Various combinations can be configured according to design requirements. However, the multiple pads for the TDDI CGOUT and FPR CGOUT signals are not staggered. Other specific embodiments can be inferred by analogy, and the multiple detailed information is not repeated here for simplicity.

[0274] In some specific embodiments, the relationship between the positions of the multiple source pads (or data line pads) for driving the multiple data lines of the display panel, the touch RX pads for coupling the receiving lines of the touch control sensing data, and the relationship between each other and the CGOUT are provided. In some specific embodiments, the multiple two types of pads (such as source pads and touch RX pads) may be located on the long side opposite to the CGOUT pad, for example Figure 5 , 9A to 12D in each specific embodiment. Preferably, the multiple two types of pads can be located on the long side of the FTDII closer to the panel, as Fig.13 and Fig.14 illustrated, but the present invention is not limited thereto.

[0275] Optionally, the multiple first pads include multiple fingerprint array upper gate driver selection pads. As mentioned above, the multiple fingerprint array upper gate driver selection pads are related to the multiple pads of the single-chip element for controlling fingerprint sensing pixels. To illustrate this, refer to Fig. 6A , Figure 6B , Figure 6C , and Figure 7 , the panel 9C includes a plurality of display lines, and each display line includes a plurality of display pixels DP, and a display pixel DP includes a plurality of sub-pixels, such as a red sub-pixel (R), a green sub-pixel (G), and a blue sub-pixel (B) (not limited thereto), wherein the gate-on-array (GOA) circuits GOA1 and GOA2 are arranged on the plurality of left and right boundaries of the display or panel 9C. In Figure 6B (or Figure 6C ), the gate-on-array (GOA) circuit GOA2 of the panel 9C is coupled to the plurality of scan lines (or gate lines) TGL of the plurality of display pixels DP, and the plurality of scan lines are coupled to the plurality of display pixels DP. The GOA circuit GOA2 is configured to control the plurality of display pixels DP via the plurality of scan lines TGL. The GOA circuit GOA2 scans the plurality of scan lines TGL of the plurality of display pixels DP according to the control of the TDDI circuit 21A (such as a circuit including a display driver and a touch driver). In an example, each of the plurality of scan lines TGL may be a single wire or include multiple wires. For example, each of the plurality of scan lines TGL may include a reset wire and / or a select wire.

[0276] As Figure 6B or Figure 6C shown, each (or more) display pixel DP is associated with a fingerprint sensing pixel FS, as Figure 7 illustrated. The GOA circuit GOA1 of the panel 9C is coupled to the plurality of fingerprint sensing pixels FS via a plurality of scan lines (such as FGL). The first set of pads is configured to be coupled to the plurality of fingerprint sensing pixels via one or more GOA circuits GOA1. The GOA circuit GOA1 scans the plurality of fingerprint scan lines FGL of the plurality of fingerprint sensing pixels FS according to the control of the fingerprint driver circuit 29A. In an example, each of the plurality of fingerprint scan lines FGL may be a single wire or include multiple wires. For example, each of the plurality of fingerprint scan lines FGL may include a reset wire for transmitting a reset signal (such as represented by FPR_GCK in Figure 7 ) to control a switch (such as switch T1); and / or a select wire for transmitting an acquisition signal (such as by Figure 7The FPR_SEL in (denoted as such) is used to control another switch (such as switch T2). In the above-mentioned multiple specific embodiments, the first set of pads of the single-chip element includes the multiple pads (or referred to as fingerprint array on-gate driver selection pads), which are used to output a first set (or group) of signals including the reset signal and a second set (or group) of signals including the multiple acquisition signals to the reset wire and the selection wire for controlling the multiple fingerprint sensing pixels. In an example, the multiple fingerprint array on-gate driver selection pads include the multiple pads for outputting the multiple FPR_GCK1, FPR_GCK2, FPR_GCK3, FPR_SEL1, FPR_SEL2, FPR_SEL3 signals, as in the specific embodiment related to Fig.13 or Fig.14 . In some examples, the GOA circuit GOA2 can be further used to control the multiple touch sensors of the panel. In an actual implementation, if the multiple touch sensors are self-capacitance touch sensors, the multiple touch sensors can be implemented as the common electrodes of the display panel.

[0277] Regarding the implementation of the multiple fingerprint array on-gate driver selection pads, in a specific embodiment, a panel (such as Figure 5 , 9A to 12D , Fig.15 illustrated in any one of them, or related examples) can be implemented based on Fig. 6A and Figure 6B to include two GOA circuits (such as denoted by GOA1 in any one of FIG. 6B to FIG. 6D ), which are on the multiple left and right boundaries of the panel for fingerprint sensing, while a single-chip element (such as Figure 5 , 9A to 12D , Fig.15 illustrated in any one of them, or related examples) can be implemented to include the first set of pads for the left part and the right part, and each part includes multiple first pads for outputting both the first set of signals and the second set of signals to control at least the multiple two switches (such as transistors T1 and T2) for the multiple fingerprint sensing pixels of the panel. In another specific embodiment of a panel (such as Figure 5 , 9A to 12D , Fig.15 illustrated in any one of them, or related examples) having two GOA circuits GOA1 as described above, a single-chip element (such as Figure 5 , 9A to 12D , Fig.15As exemplified in any of them, or related examples), it can be implemented to include the first set of pads for the left part (or right part), which includes the plurality of pads for outputting the first signal set, and includes the first set of pads for the right part (or left part), which includes the plurality of pads for outputting the second signal set, so as to respectively control at least the plurality of two switches (such as transistors T1 and T2) for the plurality of fingerprint sensing pixels of the panel.

[0278] Optionally, the plurality of second pads include a plurality of array gate driver selection pads. For example, the plurality of array gate driver selection pads are for outputting signals (such as represented by Figure 6B TDDI_S1 in) for driving the plurality of display pixels and / or touch sensors. In some examples, the plurality of array gate driver selection pads include the plurality of pads for outputting the plurality of TDDI_GCK1, TDDI_GCK2, TDDI_RST signals, as exemplified in the specific embodiments related to Fig.13 or Fig.14 related.

[0279] Optionally, the panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and a plurality of selection circuits. Each of the plurality of selection circuits is coupled to one set of the plurality of data lines and one of the plurality of fingerprint sensing lines, and the single-chip element further includes a plurality of third pads, which are arranged in the main body and configured to be coupled to the panel and to control the plurality of selection circuits. In an example, as shown in Figure 6B , the block B1 serving as a selection circuit can be implemented by using a multiplexer, a demultiplexer, or a switch, and the plurality of pads of the single-chip element 20A connected to the TDDI circuit 21A output the plurality of control signals (such as represented by Figure 6B TDDI_S2 in) to control the block B1. For example, the plurality of third pads can be implemented to include the plurality of pads for outputting the plurality of TDDI_SWR, TDDI_SWG, TDDI_SWB, TDDI_SW_FP signals, as exemplified in the specific embodiments related to Fig.13 or Fig.14 related. In Figure 6BIn this case, the number of fingerprint sensing pixels FS is controlled through switches. Of course, the content disclosed in the present invention is not limited thereto. In another example, the panel can be implemented such that the plurality of fingerprint sensing pixels are controlled through the single-chip element (such as FTDI) without using switches. Also, the selection circuit can be implemented in any suitable manner; for example, through time multiplexing, one of the plurality of second pads can be implemented to control three or four (or more) switches in order to achieve a reduction in signal lines.

[0280] Optionally, the plurality of third pads are arranged on both the left portion and the right portion (as Fig.13 or Fig.14 shown in).

[0281] Optionally, the body has a rectangular shape, which has a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of third pads are arranged along the first side (as Figure 13 or Figure 14 shown in).

[0282] In some specific embodiments, the plurality of third pads can be arranged along the second side in a manner similar to those pads shown in any of Figures 10A to 10D the examples.

[0283] Optionally, the panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and the single-chip element further includes a plurality of fourth pads, which are arranged in the body. For example, the plurality of fourth pads can be used to drive the plurality of data lines, or receive fingerprint sensing signals from the plurality of fingerprint sensing lines, or be coupled to a plurality of touch sensing lines of the panel (as Figure 13 or Figure 14 shown in) to receive touch signals from the plurality of touch sensing lines. As long as appropriate, one or more of the above examples of the plurality of fourth pads can be implemented in different scenarios of the panel. In the example, referring to Figure 6A and Figure 6B , the panel for the architecture based on Figure 1 is implemented to include signals for display pixels and fingerprint sensing pixels in a multiplexing circuit; that is, sharing the same selection circuit (such as block B1). In another example, referring to Figure 6D , for Figure 1 the architecture of the panel can be further modified to be implemented without using a selection circuit (such as block B1). In yet another example, referring to Figure 6A and Figure 6C , for Figure 1The panel of the described architecture can be further modified to achieve the control for the display pixels with selection circuits. Of course, the implementation of the disclosure of the present invention is not limited thereto.

[0284] Optionally, the panel further includes a plurality of selection circuits, wherein each of the plurality of selection circuits (such as block B1 illustrated in Figure 6B is coupled to one set of the plurality of data lines (such as SLR, SLG, SLB illustrated in Figure 6B and one of the plurality of fingerprint sensing lines (such as SL_FP illustrated in Figure 6B ), and wherein the first set of pads is configured to be coupled to the plurality of selection circuits.

[0285] Optionally, the body has a rectangular shape, which has a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of fourth pads are arranged along the second side (such as illustrated in Figure 13 or Figure 14 ).

[0286] Optionally, a fingerprint driver circuit (e.g., 19; 19A; 29A) and a touch display driver circuit (e.g., 11 and 12; 11A and 12A; 21A) can be implemented in the body of the single-chip element. The fingerprint driver circuit is arranged in the body and is coupled to the first set of pads. The touch display driver circuit is arranged in the body and is coupled to the plurality of second pads. In an implementation having the plurality of third pads, the touch display driver circuit can be further coupled to the plurality of third pads.

[0287] Optionally, in the right portion, none of the plurality of third pads is arranged between the plurality of first pads and the plurality of second pads, and in the left portion, none of the plurality of third pads is arranged between the plurality of first pads and the plurality of second pads.

[0288] Optionally, the plurality of third pads are arranged beside the plurality of second pads rather than beside the plurality of first pads (as shown in Figure 13 or Figure 14 ).

[0289] Optionally, the plurality of second pads are arranged beside the plurality of first pads and beside the plurality of third pads (as shown in Figure 13 or Figure 14 ).

[0290] Optionally, the single-chip element further includes a fingerprint driver circuit and a touch display driver circuit. The fingerprint driver circuit is disposed in the body and coupled to the plurality of first pads. The touch display driver circuit is disposed in the body and coupled to the plurality of second pads.

[0291] Optionally, in the right portion, none of the first set of pads is disposed between the second set of pads, and none of the second set of pads is disposed between the first set of pads, and in the left portion, none of the first set of pads is disposed between the second set of pads, and none of the second set of pads is disposed between the first set of pads (as Figure 5 , Figures 9A to 12D , Figures 13 to 15 illustrated).

[0292] In some embodiments, the structure of a single-chip element (such as an FTDI IC) is illustrated in Figure 15 . In Figure 15 , for example, the single-chip element 40 includes a fingerprint driver circuit 41 and a touch driver circuit 49. For example, the fingerprint driver circuit 41 includes a fingerprint receiver multiplexing circuit (FPR RX MUX) 413, a fingerprint analog front end (AFE) circuit 414 (which may include an analog front end (such as a low-noise amplifier) and an analog-to-digital converter), a fingerprint control circuit 415, and a data interface circuit 416. The fingerprint control circuit 415 can be implemented to connect to one or more GOA drivers 410 and 412 to drive the plurality of fingerprint GOA scan circuits FGOA1 and FGOA2 disposed on the panel 9D. For example, the touch driver circuit 49 includes a touch panel receiver multiplexing circuit (TP RX MUX) 493, a touch analog front end circuit 494 (which may include an analog-to-digital converter), a touch control circuit 495 (such as an MCU), and a data interface circuit 496.

[0293] Moreover, the following is provided in Figure 13 or Figure 14 some embodiments regarding the implementation of the plurality of selection circuits and the configuration of the single-chip element (or electronic module). Whenever appropriate, these embodiments can also be partially or fully utilized for any of the single-chip elements illustrated above, based on the configuration of Figure 6B , Figure 6C , or other selection circuits.

[0294] Figure 16 and Figure 17 is a schematic diagram of a wiring structure between a single-chip element (or electronic module) 30C and a display panel 9E that exemplifies a specific embodiment according to the described architecture based on Figure 1 . Referring to Figure 16 and Figure 17 , the single-chip element 30C includes a selection module SM1 (or a first switching circuit). The display panel 9E includes a selection module SM2 (or a second switching circuit). The selection module SM1 can be configured to be coupled to the selection module SM2 via a trace (or transmission line) LS.

[0295] The selection module SM1 includes a plurality of first terminals NlD and NlF and a plurality of second terminals N2, where the plurality of second terminals N2 can be regarded as or coupled to each pad of the plurality of fourth pads, such as Figure 13 or Figure 14 the first subgroup of pads (i.e., a subgroup of pads) P41A exemplified in

[0296] . The number of the plurality of first terminals N1D and N1F is greater than the number of the plurality of second terminals N2. The plurality of first terminals N1D are coupled to the display driver circuit (such as 11 or 11A) or the touch display driver circuit (such as 21A). In this embodiment, the display driver circuit (such as 11 or 11A) includes a signal processing circuit, and the signal processing circuit includes an output buffer OBF and a signal converter DAC, and the display driver circuit outputs a display driving signal DS for driving the display panel 9E. The plurality of first terminals N1F are coupled to the fingerprint AFE circuit 414 of the fingerprint driver circuit (such as 19, 19A, or 29A). The plurality of second terminals N2 can be configured to be coupled to the selection module SM2 of the display panel 9E via the plurality of traces LS.

[0297] The second switch component 502 may include a first switch element 502_1 and a second switch element 502_2. The first switch element 502_1 is coupled to the corresponding one of the plurality of second terminals N2 and the fingerprint driver circuit (such as 19, 19A, or 29A). The first switch element 502_1 is controlled to transmit the plurality of fingerprint sensing signals FP_S to the fingerprint driver circuit (such as 19, 19A, or 29A) during the fingerprint sensing phase. The second switch element 502_2 is coupled between the first switch element 502_1 and the fingerprint driver circuit (such as 19, 19A, or 29A). The second switch element 502_2 is controlled to transmit the plurality of fingerprint sensing signals FP_S to the fingerprint driver circuit (such as 19, 19A, or 29A) in response to a determination of touch information during the fingerprint sensing phase. The first switch element 502_1 and the second switch element 502_2 are controlled by different control signals SW1FP and SW3FP respectively. That is, the control signal SW1FP is established during the fingerprint sensing phase, and the control signal SW3FP is established based on the touch information during the fingerprint sensing phase.

[0298] The selection module SM2 includes a plurality of third terminals N3D and N3F and a plurality of fourth terminals N4. The number of the plurality of third terminals N3D and N3F is greater than the number of the plurality of fourth terminals N4. The plurality of third terminals N3D are coupled to the plurality of display data lines SLD. The plurality of third terminals N3F are coupled to the plurality of fingerprint sensing lines SL_FP. The plurality of fourth terminals N4 can be configured to be coupled to the selection module SM1 of the single-chip element 30C via the plurality of traces LS.

[0299] Specifically, the selection module SM2 includes a plurality of selection circuits SC2. Each of the plurality of selection circuits SC2 includes a plurality of third switch members 503 and one or more fourth switch members 504. The plurality of third switch members 503 are coupled between the plurality of third terminals N3D (respective first portions of the plurality of third terminals) and the plurality of fourth terminals N4 (one of the plurality of fourth terminals). The fourth switch member 504 is coupled between the plurality of third terminals N3F (respective second portions of the plurality of third terminals) and the plurality of fourth terminals N4 (one of the plurality of fourth terminals). The first portions (such as N3D) of the plurality of third terminals N3D and N3F are coupled to the plurality of data lines SLD of the display panel 9E, and the second portions (such as N3F) of the plurality of third terminals N3D and N3F are coupled to the plurality of fingerprint sensing lines SL_FP. In a specific embodiment of the present invention, the plurality of third switch members 503 are switched to receive the plurality of display driving signals DS from the single-chip element 30C during the display driving stage. The fourth switch member 504 is switched to transmit the plurality of fingerprint sensing signals FP_S to the single-chip element 30C during the fingerprint sensing stage.

[0300] In a specific embodiment of the present invention, the single-chip element 30C (such as the control circuit of the single-chip element, for example 10 or 10A) is configured to generate control signals for controlling the plurality of selection modules SM1 and SM2. For example, the single-chip element 30C generates the plurality of control signals SW1SD, SW1FP, and SW3FP to control the corresponding switch members of the plurality of selection circuits SC1 of the selection module SM1, and generates the plurality of control signals SW2R, SW2G, SW2B, and SW2FP to control the corresponding switch members of the plurality of selection circuits SC2 of the selection module SM2.

[0301] During the display driving stage, the control signal SW1SD turns on the plurality of corresponding switch members of the selection module SM1, and the plurality of control signals SW2R, SW2G, and SW2B turn on the plurality of corresponding switch members of the selection module SM2. The selection module SM2 is switched to receive the plurality of display driving signals DS from the single-chip element 30C during the display driving stage. Specifically, the plurality of third switch members 503 are switched to receive the plurality of display driving signals DS from the single-chip element 30C during the display driving stage. On the other hand, during the display driving stage, the plurality of control signals SW1FP and SW3FP turn off the plurality of corresponding switch members of the selection module SM1, and the control signal SW2FP turns off the plurality of corresponding switch members of the selection module SM2.

[0302] Therefore, the multiple display driving signals DS are output from the single-chip element 30C to the display panel 9E via the multiple traces LS and the multiple selection modules SM1 and SM2. That is, the single-chip element 30C generates the multiple control signals SW1SD, SW2R, SW2G, and SW2B for controlling the multiple selection modules SM1 and SM2, so that during the display driving phase, the multiple display driving signals DS from the display driver circuit (11 or 11A) or the touch display driver circuit (such as 21A) are transmitted to the multiple data lines SLD via the multiple selection modules SM1 and SM2. In a specific embodiment of the present invention, the display pixel DP includes three sub-pixels, but the present invention is not limited thereto. In this case, the multiple display driving signals DS are multiplexed RGB signals and are delivered to the respective data lines SLD on the display panel 9E via the multiple selection modules SM1 and SM2.

[0303] During the fingerprint sensing phase, the multiple control signals SW1FP and SW3FP turn on the multiple corresponding switch members of the selection module SM1, and the control signal SW2FP turns on the multiple corresponding switch members of the selection module SM2. The selection module SM2 is switched to transmit the multiple fingerprint sensing signals FP_S from the display panel 9E to the single-chip element 30C during the fingerprint sensing phase. Specifically, the multiple fourth switch members 504 are switched to transmit the multiple fingerprint sensing signals FP_S to the single-chip element 30C during the fingerprint sensing phase.

[0304] On the other hand, the control signal SW1SD turns off the corresponding switch members of the selection module SM1, and the control signals SW2R, SW2G, and SW2B turn off the corresponding switch members of the selection module SM2. Accordingly, the plurality of fingerprint sensing signals FP_S are input from the display panel 9E to the single-chip element 30C via the plurality of traces LS and the plurality of selection modules SM1 and SM2. That is, the single-chip element 30C generates the control signals SW1FP, SW3FP, and SW2FP for controlling the plurality of selection modules SM1 and SM2 so that, in the fingerprint sensing phase, the plurality of fingerprint sensing signals FP_S from the plurality of fingerprint sensors 126 are received via the plurality of selection modules SM1 and SM2 by the fingerprint AFE circuit 414 of the fingerprint driver circuit (such as 19, 19A, or 29A). In a specific embodiment of the present invention, the plurality of traces LS are shared by the plurality of display driving signals DS and the plurality of fingerprint sensing signals FP_S. The plurality of display driving signals DS and the plurality of fingerprint sensing signals FP_S are transmitted on the plurality of traces LS in different phases.

[0305] In the touch sensing phase (the third time period), the control signals for controlling the corresponding switch members of the plurality of selection modules SM1 and SM2 may be appropriately established to allow signals to be transmitted to the plurality of data lines SLD for facilitating touch sensing operations and / or the plurality of fingerprint sensing lines SL_FP of the display panel 9E. For example, the control signals SW2R, SW2G, SW2B, and SW2FP may turn on the corresponding switch members of the selection module SM2 in the touch sensing phase to allow signals to be transmitted to the plurality of data lines SLD and / or the plurality of fingerprint sensing lines SL_FP. The plurality of signals may be DC voltages such as ground voltages or other AC voltages that can reduce parasitic noise in the touch sensing operation.

[0306] Alternatively, the plurality of control signals for controlling the plurality of corresponding switch members of the plurality of selection modules SM1 and SM2 may be appropriately de-asserted to prohibit the signal transmission to the plurality of data lines SLD and / or the plurality of fingerprint sensing lines SL_FP of the display panel 9E. The plurality of control signals SW1SD, SW1FP, and SW3FP may turn off the plurality of corresponding switch members of the selection module SM1, and / or the plurality of control signals SW2R, SW2G, SW2B, and SW2FP may turn off the plurality of corresponding switch members of the selection module SM2 during the touch sensing phase to prohibit signal transmission to the plurality of data lines SLD and / or the plurality of fingerprint sensing lines SL_FP. The prohibition of signal transmission may float the plurality of data lines SLD and / or the plurality of fingerprint sensing lines SL_FP to avoid noise coupling from parasitic capacitance in the touch sensing operation. Thus, the single-chip element 30C generates the plurality of control signals SW1SD, SW1FP, SW3FP, and SW2R, SW2G, SW2B, SW2FP for controlling the plurality of selection modules SM1 and SM2 respectively, so that the plurality of data lines SLD and / or the plurality of fingerprint sensing lines SL_FP of the display panel 9E are floated or coupled to the DC voltage during the touch sensing phase. Since the plurality of data lines SLD and / or the plurality of fingerprint sensing lines SL_FP of the display panel 9E are floated or coupled to the DC voltage, the parasitic capacitance affecting the touch sensing signal is reduced.

[0307] Figure 18 is an example for controlling Figure 17 the waveform diagrams of the plurality of control signals for the switch members depicted in. Referring to Figures 16 to 17 , the selection module SM2 is configured to perform, for example, 1:Q demultiplexing (where Q = 4). During the display driving phase TI1, the plurality of control signals SW2R, SW2G, and SW2B sequentially turn on the plurality of corresponding switch members of the selection module SM2. During the fingerprint sensing phase TI2, the control signal SW2FP turns on the plurality of corresponding switch members of the selection module SM2. It should be noted that additional touch sensing phases may be added. For example, the display driving phase TI1 may further include at least one sub-period (not shown) for touch sensing.

[0308] Such as Figures 16 to 18 The specific embodiments illustrated in can be applied to the specific embodiments as shown above (such as Figure 15 , based on Figure 6C or Figure 6Bor in combination therewith, so as to achieve, whenever appropriate, the functionality of the FTDI single-chip element or electronic module as exemplified in the various specific embodiments described above.

[0309] In summary, a single-chip element, an electronic module, and an electronic device including the single-chip element for driving a panel including fingerprint sensing pixels, display pixels, and a touch sensor according to an embodiment of the present invention are provided. Based on the architecture, the single-chip element can be implemented such that its pads are arranged in the following manner: the electrical connections of the pads and control lines or related lines for the plurality of fingerprint sensing pixels, display pixels, and touch sensors can be achieved by using traces that do not cross over each other. In this way, the circuit layout simplification and circuit load balancing of the plurality of traces can be promoted.

[0310] The above description is only an embodiment of the present invention, and it is not intended to limit the patent scope of the present invention.

Claims

1. A single-chip component for driving a panel including a plurality of fingerprint sensing pixels, a plurality of display pixels, and a plurality of touch sensors, characterized in that, The single-chip element includes: a wafer body having a left portion and a right portion with respect to an axis; a first set of pads disposed in the wafer body and including a plurality of first pads for driving the plurality of fingerprint sensing pixels, wherein the first set of pads is disposed on both the left portion and the right portion and configured to be coupled to the plurality of fingerprint sensing pixels; and a second set of pads disposed in the wafer body and including a plurality of second pads for driving the plurality of display pixels, wherein the second set of pads is disposed on both the left portion and the right portion and configured to be coupled to the panel, and at least some of the second pads in the second set of pads are configured to be coupled to a gate driver on array (GOA) circuit in the panel for driving the plurality of display pixels; wherein the first set of pads and the second set of pads are disposed on the same surface of the wafer body, and the first set of pads and the second set of pads are not connected to each other via traces.

2. The single-chip element according to claim 1, characterized in that, The wafer body has a rectangular shape having a first side, a second side parallel to the first side and closer to the panel than the first side, a left side on the left portion and perpendicular to the first side and the second side, and a right side on the right portion and parallel to the left side, and the axis intersects the first side and the second side.

3. The single-chip element according to claim 2, characterized in that, All of the first set of pads and all of the second set of pads are disposed along the first side.

4. The single-chip element according to claim 3, wherein The first set of pads is closer to the axis than the second set of pads.

5. The single-chip element according to claim 3, characterized in that, The second set of pads is closer to the axis than the first set of pads.

6. The single-chip element according to claim 2, wherein All of the first set of pads and all of the second set of pads are disposed along the second side.

7. The single-chip element according to claim 6, wherein The first set of pads is closer to the axis than the second set of pads.

8. The single-chip element according to claim 6, wherein The second set of pads is closer to the axis than the first set of pads.

9. The single-chip element according to claim 2, characterized in that, All of the first set of pads are disposed along one of the first side and the second side, and all of the second set of pads are disposed along both the left side and the right side.

10. The single-chip element according to claim 2, characterized in that, All of the first set of pads are disposed along both the left side and the right side, and all of the second set of pads are disposed along one of the first side and the second side.

11. The single-chip element according to claim 2, characterized in that, All of the first set of pads are disposed along the left side and the right side, and all of the second set of pads are disposed along the left side and the right side.

12. The single-chip element according to claim 1, characterized in that, The plurality of first pads includes a plurality of gate-driver-on-array selection pads for fingerprints.

13. The single-chip element according to claim 1, wherein The plurality of second pads includes a plurality of gate-driver-on-array selection pads.

14. The single-chip element according to claim 1, characterized in that, The panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and a plurality of selection circuits, each of the selection circuits being coupled to a corresponding set of one of the plurality of data lines, and the second set of pads further includes: A plurality of third pads, configured to be coupled to the panel and to control the plurality of selection circuits.

15. The single-chip element according to claim 14, wherein, Each of the plurality of selection circuits is further coupled to at least one of the plurality of fingerprint sensing lines.

16. The single-chip element according to claim 14, wherein The plurality of third pads are disposed on both the left portion and the right portion.

17. The single-chip element according to claim 14, wherein the wafer body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of third pads are disposed along the first side.

18. The single-chip element according to claim 14, wherein the wafer body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of third pads are disposed along the second side.

19. The single-chip component according to claim 1, characterized in that, The panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and a plurality of touch sensing lines coupled to the plurality of touch sensors, and the single-chip element further includes: A third set of pads disposed in the wafer body for driving the plurality of data lines or receiving fingerprint sensing signals from the plurality of fingerprint sensing lines, or coupling to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

20. The single-chip element according to claim 19, wherein, The third set of pads includes a first subgroup of pads for driving the plurality of data lines in a time-division manner and receiving fingerprint sensing signals from the plurality of fingerprint sensing lines; and a second subgroup of pads configured to be coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

21. The single-chip element according to claim 20, wherein The panel further includes a plurality of selection circuits, wherein each of the plurality of selection circuits is coupled to a corresponding set of one of the plurality of data lines and a corresponding one of the plurality of fingerprint sensing lines, and wherein the first subgroup of pads is configured to be coupled to the plurality of selection circuits.

22. The single-chip element according to claim 20, wherein The first subgroup of pads and the second subgroup of pads are alternately disposed on the wafer body.

23. The single-chip element according to claim 20, wherein The first subgroup of pads is configured to drive the plurality of data lines in a time-division manner, while the second subgroup of pads receives touch signals from the plurality of touch sensing lines.

24. The single-chip element according to claim 19, wherein the wafer body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the third set of pads is disposed along the second side.

25. The single-chip element according to claim 14, further comprising: A fingerprint driver circuit disposed in the wafer body and coupled to the plurality of first pads; and A touch display driver circuit disposed in the wafer body and coupled to the plurality of second pads and the plurality of third pads.

26. The single-chip element according to claim 14, wherein In the right portion, none of the plurality of third pads is disposed between the plurality of first pads and the plurality of second pads, and in the left portion, none of the plurality of third pads is disposed between the plurality of first pads and the plurality of second pads.

27. The single-chip element according to claim 14, characterized in that, The plurality of third pads are disposed beside the plurality of second pads rather than beside the plurality of first pads.

28. The single-chip element according to claim 14, wherein The plurality of second pads are disposed beside the plurality of first pads and beside the plurality of third pads.

29. The single-chip element according to claim 1, characterized in that, The wafer body is configured to be disposed on a thin film as a chip-on-film structure.

30. The single-chip element according to claim 1, characterized in that, The wafer body is configured to be disposed on glass as a chip-on-glass structure.

31. The single-chip element according to claim 1, further comprising: a fingerprint driver circuit disposed in the wafer body and coupled to the first set of pads; and a touch display driver circuit disposed in the wafer body and coupled to the second set of pads.

32. The single-chip element according to claim 1, wherein in the right portion, none of the first set of pads is disposed between the second set of pads, and none of the second set of pads is disposed between the first set of pads, and in the left portion, none of the first set of pads is disposed between the plurality of second pads, and none of the second set of pads is disposed between the plurality of first pads.

33. The single-chip element according to claim 1, wherein The panel further includes at least one first gate-on-array (GOA) circuit, and the first set of pads is configured to be coupled to the plurality of fingerprint sensing pixels via the at least one first GOA circuit.

34. The single-chip element according to claim 33, wherein The panel further includes at least one second gate-on-array (GOA) circuit, and the second set of pads is configured to be coupled to the plurality of display pixels via the at least one second GOA circuit, wherein the at least one second GOA circuit is the GOA circuit for driving the plurality of display pixels.

35. A single-chip element for driving a panel, the panel including a plurality of display pixels, a plurality of touch sensors, and a plurality of fingerprint sensing pixels, the panel further including a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, a plurality of touch sensing lines coupled to the plurality of touch sensors, and a plurality of selection circuits, each of the plurality of selection circuits being coupled to a corresponding set of one of the plurality of data lines, characterized in that, The single-chip element includes: a wafer body having a left portion and a right portion with respect to an axis, wherein the wafer body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side; a first set of pads disposed in the wafer body and including a plurality of first pads for driving the plurality of fingerprint sensing pixels, the first set of pads being disposed on both the left portion and the right portion and configured to be coupled to the plurality of fingerprint sensing pixels; and a second set of pads disposed in the wafer body and including a plurality of second pads for driving the plurality of display pixels and a plurality of third pads for controlling the plurality of selection circuits, the second set of pads being disposed on both the left portion and the right portion and configured to be coupled to the panel, wherein the plurality of third pads are disposed along the first side; and A third set of pads, which are arranged in the wafer body, are used to drive the plurality of data lines or receive fingerprint sensing signals from the plurality of fingerprint sensing lines, or are coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines, wherein the third set of pads are arranged along the second side.

36. The single-chip element according to claim 35, wherein, The third set of pads includes a first subgroup of pads, which are used to drive the plurality of data lines in a time-division manner and receive fingerprint sensing signals from the plurality of fingerprint sensing lines; and a second subgroup of pads, which are configured to be coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

37. The single-chip component according to claim 36, characterized in that, Each of the plurality of selection circuits is further coupled to a corresponding one of the plurality of fingerprint sensing lines, and the first subgroup of pads is configured to be coupled to the plurality of selection circuits.

38. The single-chip element according to claim 36, wherein The first subgroup of pads is configured to drive the plurality of data lines in a time-division manner, and the second subgroup of pads receives touch signals from the plurality of touch sensing lines.

39. The single-chip component according to claim 35, characterized in that, The panel further includes at least one first gate-on-array (GOA) circuit, and the first set of pads is configured to be coupled to the plurality of fingerprint sensing pixels via the at least one first GOA circuit.

40. The single-chip element according to claim 39, wherein The panel further includes at least one second gate-on-array (GOA) circuit, and the second set of pads is configured to be coupled to the plurality of display pixels via the at least one second GOA circuit.

41. An electronic module for driving a panel including a plurality of fingerprint sensing pixels, a plurality of display pixels, and a plurality of touch sensors, characterized in that, The electronic module includes: A thin film, which is configured to be electrically coupled to the plurality of fingerprint sensing pixels, the plurality of display pixels, and the plurality of touch sensors; and A single-chip element, which is arranged on the thin film, and the single-chip element includes: A wafer body, which has a left part and a right part with respect to an axis; A first set of pads, which are arranged in the wafer body and include a plurality of first pads for driving the plurality of fingerprint sensing pixels, wherein the first set of pads are arranged on both the left part and the right part and are configured to be electrically coupled to the plurality of fingerprint sensing pixels; And A second set of pads, which are arranged in the wafer body and include a plurality of second pads for driving the plurality of display pixels, wherein the second set of pads are arranged on both the left part and the right part and are configured to be electrically coupled to the plurality of display pixels, and at least some of the second pads in the second set of pads are configured to be coupled to a gate-on-array (GOA) circuit in the panel for driving the plurality of display pixels, wherein the first set of pads and the second set of pads are arranged on the same surface of the wafer body, and the first set of pads and the second set of pads are not connected to each other via traces.

42. The electronic module according to claim 41, wherein the wafer body has a rectangular shape, having a first side, a second side parallel to the first side and closer to the display than the first side, a left side on the left portion and perpendicular to the first side and the second side, and a right side on the right portion and parallel to the left side, and the axis intersects the first side and the second side.

43. The electronic module according to claim 42, wherein all of the first set of pads and all of the second set of pads are arranged along the first side.

44. The electronic module according to claim 43, wherein the first set of pads is closer to the axis than the second set of pads.

45. The electronic module according to claim 43, wherein the second set of pads is closer to the axis than the first set of pads.

46. The electronic module according to claim 42, wherein all of the first set of pads and all of the second set of pads are arranged along the second side.

47. The electronic module according to claim 46, wherein the first set of pads is closer to the axis than the second set of pads.

48. The electronic module according to claim 46, wherein the second set of pads is closer to the axis than the first set of pads.

49. The electronic module according to claim 42, wherein all of the first set of pads are arranged along one of the first side and the second side, and all of the second set of pads are arranged along both the left side and the right side.

50. The electronic module according to claim 42, wherein all of the first set of pads are arranged along both the left side and the right side, and all of the second set of pads are arranged along one of the first side and the second side.

51. The electronic module according to claim 42, wherein all of the first set of pads are arranged along the left side and the right side, and all of the second set of pads are arranged along the left side and the right side.

52. The electronic module according to claim 51, wherein the plurality of first pads includes a plurality of gate-driver-on-array select pads.

53. The electronic module according to claim 51, wherein the plurality of second pads includes a plurality of gate-driver-on-array select pads.

54. The electronic module according to claim 51, wherein the panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and a plurality of selection circuits, each of the plurality of selection circuits being coupled to a corresponding set of one of the plurality of data lines, and the second set of pads further includes: a plurality of third pads configured to be coupled to the panel and to control the plurality of selection circuits.

55. The electronic module according to claim 54, wherein each of the plurality of selection circuits is further coupled to at least one of the plurality of fingerprint sensing lines.

56. The electronic module according to claim 54, wherein the plurality of third pads are disposed on both the left portion and the right portion.

57. The electronic module according to claim 54, wherein the wafer body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of third pads are disposed along the first side.

58. The electronic module according to claim 54, wherein the wafer body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the plurality of third pads are disposed along the second side.

59. The electronic module according to claim 41, wherein the panel further includes a plurality of data lines coupled to the plurality of display pixels and a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and the single-chip element further includes: a third set of pads disposed in the wafer body for driving the plurality of data lines or receiving fingerprint sensing signals from the plurality of fingerprint sensing lines, or coupled to a plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

60. The electronic module according to claim 59, wherein the third set of pads includes a first subgroup of pads for driving the plurality of data lines in a time-division manner and receiving fingerprint sensing signals from the plurality of fingerprint sensing lines; and a second subgroup of pads configured to be coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

61. The electronic module according to claim 60, wherein the panel further includes a plurality of selection circuits, wherein each of the plurality of selection circuits is coupled to a corresponding set of one of the plurality of data lines and a corresponding one of the plurality of fingerprint sensing lines, and wherein the first subgroup of pads is configured to be coupled to the plurality of selection circuits.

62. The electronic module according to claim 60, wherein the first subgroup of pads and the second subgroup of pads are alternately disposed on the wafer body.

63. The electronic module according to claim 60, wherein the first subgroup of pads is configured to drive the plurality of data lines in a time-division manner, and the second subgroup of pads receives touch signals from the plurality of touch sensing lines.

64. The electronic module according to claim 59, wherein the wafer body has a rectangular shape having a first side and a second side parallel to the first side and closer to the panel than the first side, and the third set of pads are disposed along the second side.

65. The electronic module according to claim 54, further comprising: a fingerprint driver circuit disposed in the wafer body and coupled to the plurality of first pads; and A touch display driver circuit, which is arranged in the wafer body and coupled to the plurality of second pads and the plurality of third pads.

66. The electronic module according to claim 54, wherein in the right part, none of the plurality of third pads is arranged between the plurality of first pads and the plurality of second pads, and in the left part, none of the plurality of third pads is arranged between the plurality of first pads and the plurality of second pads.

67. The electronic module according to claim 54, wherein the plurality of third pads are arranged beside the plurality of second pads rather than beside the plurality of first pads.

68. The electronic module according to claim 54, wherein the plurality of second pads are arranged beside the plurality of first pads and beside the plurality of third pads.

69. The electronic module according to claim 41, further comprising: a fingerprint driver circuit, which is arranged in the wafer body and coupled to the first set of pads; and a touch display driver circuit, which is arranged in the wafer body and coupled to the second set of pads.

70. The electronic module according to claim 41, wherein in the right part, none of the first set of pads is arranged between the second set of pads, and none of the second set of pads is arranged between the first set of pads, and in the left part, none of the first set of pads is arranged between the plurality of second pads, and none of the second set of pads is arranged between the plurality of first pads.

71. The electronic module according to claim 41, wherein the plurality of fingerprint sensing pixels correspond to a fingerprint sensing area, the panel has a display area, the plurality of touch sensors correspond to a touch sensing area, and the sizes of the fingerprint sensing area, the display area, and the touch sensing area are substantially the same.

72. The electronic module according to claim 41, wherein the panel further comprises at least one first gate on array (GOA) circuit, and the first set of pads is configured to be coupled to the plurality of fingerprint sensing pixels via the at least one first GOA circuit.

73. The electronic module according to claim 72, wherein the panel further comprises at least one second gate on array (GOA) circuit, and the second set of pads is configured to be coupled to the plurality of display pixels via the at least one second GOA circuit.

74. An electronic device, characterized in that, The electronic device includes: a panel, which includes a plurality of display pixels, a plurality of touch sensors, and a plurality of fingerprint sensing pixels; and a single-chip element, which is used to be coupled to the panel, and the single-chip element includes: a wafer body, which has a left part and a right part with respect to an axis; a first set of pads, which are arranged in the wafer body and include a plurality of first pads for driving the plurality of fingerprint sensing pixels, wherein the first set of pads are arranged on both the left part and the right part and electrically coupled to the plurality of fingerprint sensing pixels; and A second set of pads, which are disposed in the wafer body and include a plurality of second pads for driving the plurality of display pixels, wherein the second set of pads are disposed on both the left portion and the right portion and are electrically coupled to the plurality of display pixels, and at least some of the second pads in the second set of pads are configured to be coupled to a gate driver on array (GOA) circuit in the panel for driving the plurality of display pixels. Wherein the first set of pads and the second set of pads are disposed on the same surface of the wafer body, and the first set of pads and the second set of pads are not connected to each other via traces.

75. The electronic device according to claim 74, characterized in that, The wafer body has a rectangular shape, which has a first side, a second side parallel to the first side and closer to the display than the first side, a left side on the left portion and perpendicular to the first side and the second side, a right side on the right portion and parallel to the left side, and the axis intersects the first side and the second side.

76. The electronic device according to claim 75, wherein All of the first set of pads and all of the second set of pads are arranged along the first side.

77. The electronic device according to claim 76, wherein, The first set of pads is closer to the axis than the second set of pads.

78. The electronic device according to claim 76, wherein The second set of pads is closer to the axis than the first set of pads.

79. The electronic device according to claim 75, wherein All of the first set of pads and all of the second set of pads are arranged along the second side.

80. The electronic device according to claim 79, wherein The first set of pads is closer to the axis than the second set of pads.

81. The electronic device according to claim 79, wherein, The second set of pads is closer to the axis than the first set of pads.

82. The electronic device according to claim 75, wherein All of the first set of pads are arranged along one of the first side and the second side, and all of the second set of pads are arranged along both the left side and the right side.

83. The electronic device according to claim 75, wherein, All of the first set of pads are arranged along both the left side and the right side, and all of the second set of pads are arranged along one of the first side and the second side.

84. The electronic device according to claim 75, characterized in that, All of the first set of pads are arranged along the left side and the right side, and all of the second set of pads are arranged along the left side and the right side.

85. The electronic device according to claim 74, wherein The plurality of first pads includes a plurality of gate-driver-on-array select pads for fingerprints.

86. The electronic device according to claim 74, characterized in that, The plurality of second pads includes a plurality of gate-driver-on-array select pads.

87. The electronic device according to claim 74, wherein, The panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and a plurality of selection circuits, each of the plurality of selection circuits being coupled to a corresponding set of one of the plurality of data lines, and the second set of pads further includes: A plurality of third pads, which are configured to be coupled to the panel and to control the plurality of selection circuits.

88. The electronic device according to claim 87, wherein, Each of the plurality of selection circuits is further coupled to at least one of the plurality of fingerprint sensing lines.

89. The electronic device according to claim 87, wherein, The plurality of third pads are disposed on both the left portion and the right portion.

90. The electronic device according to claim 87, wherein The main body has a rectangular shape, which has a first side edge and a second side edge parallel to the first side edge and closer to the panel than the first side edge, and the plurality of third pads are arranged along the first side edge.

91. The electronic device according to claim 87, wherein the main body has a rectangular shape, which has a first side edge and a second side edge parallel to the first side edge and closer to the panel than the first side edge, and the plurality of third pads are arranged along the second side edge.

92. The electronic device according to claim 74, wherein The panel further includes a plurality of data lines coupled to the plurality of display pixels, a plurality of fingerprint sensing lines coupled to the plurality of fingerprint sensing pixels, and the single-chip element further includes: A third set of pads, which are arranged in the main body for driving the plurality of data lines or receiving fingerprint sensing signals from the plurality of fingerprint sensing lines, or coupled to a plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

93. The electronic device according to claim 92, characterized in that, The third set of pads includes a first subgroup of pads, which are used to drive the plurality of data lines in a time-division manner and receive fingerprint sensing signals from the plurality of fingerprint sensing lines; and a second subgroup of pads, which are configured to be coupled to the plurality of touch sensing lines of the panel to receive touch signals from the plurality of touch sensing lines.

94. The electronic device according to claim 93, wherein The panel further includes a plurality of selection circuits, wherein each of the plurality of selection circuits is coupled to a corresponding set of one of the plurality of data lines and a corresponding one of the plurality of fingerprint sensing lines, and wherein the first subgroup of pads is configured to be coupled to the plurality of selection circuits.

95. The electronic device according to claim 93, characterized in that, The first subgroup of pads and the second subgroup of pads are alternately arranged on the main body.

96. The electronic device according to claim 93, wherein The first subgroup of pads is configured to drive the plurality of data lines in a time-division manner, while the second subgroup of pads receives touch signals from the plurality of touch sensing lines.

97. The electronic device according to claim 92, wherein the main body has a rectangular shape, which has a first side edge and a second side edge parallel to the first side edge and closer to the panel than the first side edge, and the third set of pads are arranged along the second side edge.

98. The electronic device according to claim 87, further comprising: A fingerprint driver circuit, which is arranged in the main body and coupled to the plurality of first pads; and A touch display driver circuit, which is arranged in the main body and coupled to the plurality of second pads and the plurality of third pads.

99. The electronic device according to claim 87, wherein in the right part, none of the plurality of third pads are arranged between the plurality of first pads and the plurality of second pads, and in the left part, none of the plurality of third pads are arranged between the plurality of first pads and the plurality of second pads. The electronic device according to claim 87, wherein, The plurality of third pads are arranged beside the plurality of second pads rather than beside the plurality of first pads.

101. The electronic device according to claim 87, characterized in that, The plurality of second pads are arranged beside the plurality of first pads and beside the plurality of third pads.

102. The electronic device according to claim 74, further comprising: A fingerprint driver circuit, which is disposed in the main body and coupled to the first set of pads; and A touch display driver circuit, which is disposed in the main body and coupled to the second set of pads.

103. The electronic device according to claim 74, wherein in the right portion, none of the first set of pads is disposed between the second set of pads, and none of the second set of pads is disposed between the first set of pads, and in the left portion, none of the first set of pads is disposed between the second set of pads, and none of the second set of pads is disposed between the first set of pads.

104. The electronic device according to claim 74, characterized in that, The plurality of fingerprint sensing pixels correspond to a fingerprint sensing area, the panel has a display area, the plurality of touch sensors correspond to a touch sensing area, and the sizes of the fingerprint sensing area, the display area, and the touch sensing area are substantially the same.

105. The electronic device according to claim 74, further comprising a substrate, and the plurality of display pixels, the plurality of touch sensors, and the plurality of fingerprint sensing pixels are disposed on the substrate.

106. The electronic device according to claim 105, wherein, The substrate includes glass, and the single-chip element is disposed on a portion of the glass as a chip-on-glass structure.

107. The electronic device according to claim 105, characterized in that, The substrate includes a thin film, and the single-chip element is disposed on the thin film as a chip-on-film structure.

108. The electronic device according to claim 74, wherein The panel further includes at least one first gate-on-array (GOA) circuit, and the first set of pads is configured to be coupled to the plurality of fingerprint sensing pixels via the at least one first GOA circuit.

109. The electronic device according to claim 108, wherein, The panel further includes at least one second gate-on-array (GOA) circuit, and the second set of pads is configured to be coupled to the plurality of display pixels via the at least one second GOA circuit, wherein the at least one second GOA circuit is the GOA circuit for driving the plurality of display pixels.

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