A performance testing device and evaluation method for micron-level metal microchannel heat exchanger

Abstract

The present invention discloses a micron-level metal microchannel heat exchanger performance test device, comprising a heat source chip, a metal microchannel heat exchanger, a test box, a circuit board, a pump, a pressure measurement system and a temperature acquisition system; the metal microchannel heat exchanger is installed in the test box and is connected to the water inlet and outlet of the test box, the heat source chip is arranged on the metal microchannel heat exchanger, and the pressure measurement system and the temperature acquisition system are used to detect the flow resistance and the temperature respectively. The present invention also provides a performance evaluation method based on the above-mentioned test device. The present invention can accurately obtain the heat dissipation capacity, evaluate the heat dissipation contribution of each part, and facilitate the heat dissipation performance evaluation of high-power chip applications.

Description

Technical Field

[0001] The present invention relates to the field of microelectronic packaging, and more specifically to a performance testing device and an evaluation method for a micron-level metal microchannel heat exchanger. Background Art

[0002] Metal microchannels have good thermal conductivity, good RF grounding performance, and great application potential. Current research, especially the evaluation of heat dissipation performance for high-power chip applications, lacks a test method that fully reflects the heat dissipation situation, which is not conducive to promoting the application and development of metal microchannels. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a micron-level metal microchannel heat exchanger performance testing device and evaluation method.

[0004] In order to achieve the above purpose, the technical solution of the present invention is:

[0005] A micron-level metal microchannel heat exchanger performance test device, comprising a heat source chip, a metal microchannel heat exchanger, a test box, a circuit board, a pump, a pressure measurement system and a temperature acquisition system, wherein: the test box is stacked from bottom to top by a lower cover plate, a sealing gasket, and an upper cover plate, and fixed by a fixing member; the lower cover plate is provided with a flow channel, a first water inlet and a first water outlet, the sealing gasket is provided with a second water inlet and a second water outlet corresponding to the first water inlet and the first water outlet; the metal microchannel heat exchanger is installed on the sealing gasket of the test box, and is connected to the second water inlet and the second water outlet. The upper cover is arranged on the metal microchannel heat exchanger and has an opening smaller than the upper surface of the metal microchannel heat exchanger corresponding to the metal microchannel heat exchanger, and the heat source chip is arranged on the metal microchannel heat exchanger in the opening; the circuit board is assembled on the upper cover and electrically connected to the heat source chip; the pump forms a fluid passage with the test box body and the metal microchannel heat exchanger; the pressure measurement system is arranged at the first water inlet and the first water outlet to obtain the flow resistance; the temperature acquisition system includes a plurality of thermocouples, and the thermocouples are arranged on the surface of the heat source chip, the first water inlet and the first water outlet to obtain the corresponding temperature.

[0006] Optionally, the first water inlet is also connected to a constant temperature water bath.

[0007] Optionally, the first water outlet is also connected to a heat exchanger.

[0008] Optionally, the first water inlet is also connected to a filter and a degassing device.

[0009] Optionally, the upper cover plate and the lower cover plate are made of stainless steel or aluminum alloy.

[0010] Optionally, the heat source chip is an analog heat source chip, a GaN HEMT high-power radio frequency device or a high-power SiC power electronic device; the heat source chip is bonded or eutectically welded to the upper surface of the metal microchannel heat exchanger using conductive glue, solder or nano silver paste.

[0011] Optionally, the heat source chip and the circuit board are connected via gold wires, aluminum wires or probe cards.

[0012] Optionally, the sealing gasket is a heat-insulating material; or a heat-insulating gasket is provided between the sealing gasket and the upper cover plate, and the heat-insulating gasket wraps the side surface of the metal microchannel heat exchanger.

[0013] Optionally, the temperature acquisition system also includes an infrared real-time thermal imager for acquiring the surface temperature of the heat source chip.

[0014] A method for evaluating the performance of a micron-sized metal microchannel heat exchanger is provided. The micron-sized metal microchannel heat exchanger performance testing device is used. A cooling medium is introduced through a first water inlet to obtain input voltage, input current, and the temperatures of the first water inlet, the first water outlet, and the surface of the microchannel heat exchanger. The product of the input voltage (Vn) and the input current (In) is the input heat flux density (Wn), as shown in the following formula:

[0015] Wn=VnIn

[0016] The heat source chip has a heating area of ​​A, and the first heat flux (Qn) is obtained as shown in the following formula:

[0017] Qn=Wn / A

[0018] The first heat flux density is adjusted by adjusting the voltage, with the surface temperature of the heat source chip being less than the maximum allowable temperature and the cooling fluid temperature being less than the cooling fluid phase change temperature as the benchmark; the second heat flux density is calculated from the temperatures of the first water inlet and the first water outlet, and the difference between the first heat flux density and the second heat flux density is the heat dissipation caused by other factors.

[0019] The beneficial effects of the present invention are as follows: the test box body uses upper and lower covers combined with sealing gaskets, and the fixing parts are used for sealing to effectively enhance the air tightness, prevent the leakage of the coolant, and avoid excessive pressure, so that the coolant directly opens the metal microchannel and destroys the assembly. The heat dissipation capacity can be accurately obtained, and the heat dissipation contribution of each part can be evaluated, which is convenient for the heat dissipation performance evaluation of high-power chip applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of a performance testing device for a micron-sized metal microchannel heat exchanger according to an embodiment;

[0021] Figure 2 It is a schematic diagram of the assembly of the test box. DETAILED DESCRIPTION

[0022] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments. The accompanying drawings of the present invention are only for illustration to make it easier to understand the present invention, and the specific proportions thereof can be adjusted according to design requirements.

[0023] A micron-level metal microchannel heat exchanger performance test device, such as Figure 1 and Figure 2 As shown, it mainly includes a heat source chip 501, a metal microchannel heat exchanger 301, a test box body 000, a circuit board 700, a DC power supply, a pump 910, a pressure measurement system 920, and a temperature acquisition system 930, wherein: the test box body 000 is stacked from bottom to top by a lower cover plate 100, a sealing pad 200 and a sealing pad 400, a thermal insulation pad 300, an elastic gasket 500, and an upper cover plate 600, and is fixed by a fixing member 800 (such as a screw or bolt), the lower cover plate 100 has a flow channel 102 and a first water inlet 101A and a first water outlet 101B, and the sealing pad 200 has a second water inlet 201A and a second water outlet 201B corresponding to the first water inlet 101A and the first water outlet 101B of the lower cover plate 100. The metal microchannel heat exchanger 301 is installed on the sealing gasket 200 of the test box body and is connected to the second water inlet 201A and the second water outlet 201B. The upper cover plate 600 is arranged on the metal microchannel heat exchanger 301 and is provided with an opening 601 smaller than the upper surface of the metal microchannel heat exchanger corresponding to the metal microchannel heat exchanger 301, that is, the edge of the opening 601 of the upper cover plate 600 overlaps with at least two sides of the outer periphery of the upper surface of the metal microchannel heat exchanger 301. The sealing gasket 400 has the same opening. The heat source chip 501 is arranged on the metal microchannel heat exchanger 301 within the opening.

[0024] The cooling medium flows in from the first water inlet 101A, passes through the input side of the flow channel 102, the second water inlet 201A, and the input port 302A of the metal microchannel heat exchanger 301, and enters the microchannel 302 of the metal microchannel heat exchanger 301, and then passes through the output port 302B of the metal microchannel heat exchanger 301, the second water outlet 201B, and the output side of the flow channel 102 and flows out from the first water outlet 101B.

[0025] The circuit board 700 is assembled on the upper cover plate 600 to provide electrical connection for the heat source chip 501 disposed on the test box body 000. A DC power supply can be selected to power the heat source chip 501, the pump 910, the pressure measurement system 920, etc. The pump 910 forms a fluid passage with the test box body 000 and the micro-metal microchannel heat exchanger 301. A peristaltic pump or a gear pump can be used to drive the cooling medium into the test box body 000, and the medium is collected after flowing through the test link. The pressure measurement system 920 (such as a pressure sensor) is disposed at both ends of the first water inlet 101A and the first water outlet 101B of the test box body 000 to obtain the flow resistance. The greater the flow rate, the better the heat dissipation effect, but the required pumping power is higher, and both must be taken into account at the same time to reflect the best heat dissipation effect. The temperature acquisition system 930 mainly includes a thermocouple (thermometer) 931 and a data acquisition instrument 932. The thermocouple 931 is directly placed on the surface of the heat source chip 501, and at least one thermocouple is placed in the first water inlet, the first water outlet, etc. to obtain the corresponding temperature. The temperature acquisition system 930 can also include an infrared real-time thermal imager 933 to obtain the surface temperature of the entire heat source chip 501 and calibrate it with the temperature measurement result of the thermocouple 931.

[0026] A constant temperature water bath 950 is added before the first water inlet 101A of the test box body 000 to keep the temperature of the coolant constant to the required temperature and to keep the temperature of the water inlet of the test box body 000 constant. A heat exchanger 960 is added after the first water outlet 101B of the test box body 000 to reduce the temperature of the cooling medium that has risen after passing through the heat source to room temperature. A filter or a degassing device 940 can be added before the first water inlet 101A of the test box body 000 to remove impurities and prevent the generation of bubbles, thereby further improving the heat dissipation effect of the coolant.

[0027] The upper cover plate 600 and the lower cover plate 100 of the test box body 000 can be made of stainless steel or aluminum alloy. The heat insulation pad 300 wraps the side of the micro-metal microchannel heat exchanger 301 to eliminate the influence of the box body and the heat dissipation path on the heat dissipation, and truly reflects the heat dissipation capacity of the metal microchannel. In addition, the sealing pad 200 and the sealing pad 400 can also be heat insulation materials, eliminating the heat insulation pad 300.

[0028] The heat source chip 501 can be an analog heat source chip, or a high-power radio frequency device such as GaN HEMT, or a high-power SiC power electronic device. The heat source chip 501 can be bonded or eutectic welded to the upper surface of the metal microchannel heat exchanger 301 using conductive glue, solder, nano silver paste, etc. The electrical connection between the heat source chip 501 and the circuit board 700 (such as PCB) can use gold wire or aluminum wire, or can be connected using a probe card. The electrical connection between the PCB and the heat source chip using a probe card can effectively solve the problem of easy breakage of gold wire or aluminum wire and the limitation of lead span requirements, facilitate experimental operation, and effectively avoid the risk and cost of re-wiring of gold wire or aluminum wire after disconnection.

[0029] A method for evaluating the performance of a micron-sized metal microchannel heat exchanger, comprising:

[0030] The cooling medium is introduced from the first water inlet to obtain the input voltage, input current, and the temperature of the first water inlet, the first water outlet, and the surface of the microchannel heat exchanger. The product of the input voltage (Vn) and the input current (In) is the input heat flux density (Wn), as shown in the following formula:

[0031] Wn=VnIn

[0032] The heat source chip has a heating area of ​​A, and the first heat flux (Qn) is obtained as shown in the following formula:

[0033] Qn=Wn / A

[0034] The voltage is adjusted to adjust the first heat flux density, with the surface temperature of the heat source chip being less than the maximum allowable temperature (such as the maximum allowable temperature of GaN is 200°C) and the cooling medium temperature being less than the cooling medium phase change temperature as the benchmark; the heat dissipation effect of the metal microchannel heat exchanger is calculated from the temperature of the first water inlet and the first water outlet, which is the second heat flux density, and the difference between the two is the heat dissipation caused by other factors. In this way, the heat dissipation capacity can be accurately obtained, the heat dissipation contribution of each part can be evaluated, and the heat dissipation performance evaluation can be facilitated.

[0035] The above embodiments are only used to further illustrate a micron-level metal microchannel heat exchanger performance testing device and evaluation method of the present invention, but the present invention is not limited to the embodiments. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention fall within the protection scope of the technical solution of the present invention.

Claims

1. A micron-scale metal microchannel heat exchanger performance testing device, characterized by: It includes a heat source chip, a metal microchannel heat exchanger, a test box, a circuit board, a pump, a pressure measurement system, and a temperature acquisition system, including: The test box body is stacked from bottom to top by a lower cover plate, a sealing gasket, and an upper cover plate, and fixed by a fixing member; the lower cover plate is provided with a flow channel, a first water inlet, and a first water outlet; the sealing gasket is provided with a second water inlet and a second water outlet corresponding to the first water inlet and the first water outlet; the metal microchannel heat exchanger is mounted on the sealing gasket of the test box body and is connected to the second water inlet and the second water outlet; the upper cover plate is provided on the metal microchannel heat exchanger and has an opening corresponding to the metal microchannel heat exchanger and smaller than the upper surface of the metal microchannel heat exchanger; the heat source chip is provided on the metal microchannel heat exchanger within the opening; The circuit board is assembled on the upper cover plate and electrically connected to the heat source chip; The pump forms a fluid passage with the test box body and the metal microchannel heat exchanger; The pressure measurement system is provided at the first water inlet and the first water outlet to obtain the flow resistance; The temperature acquisition system includes a plurality of thermocouples, which are arranged on the surface of the heat source chip, the first water inlet and the first water outlet to obtain corresponding temperatures.

2. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The first water inlet is also connected to a constant temperature water bath.

3. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The first water outlet is also connected to a heat exchanger.

4. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The first water inlet is also connected to a filter and a degassing device.

5. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The upper cover plate and the lower cover plate are made of stainless steel or aluminum alloy.

6. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The heat source chip is an analog heat source chip, a GaN HEMT high-power radio frequency device or a high-power SiC power electronic device; the heat source chip is bonded or eutectic-welded to the upper surface of the metal microchannel heat exchanger using conductive glue, solder or nano-silver paste.

7. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The heat source chip and the circuit board are connected via gold wires, aluminum wires or probe cards.

8. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The sealing gasket is made of a heat-insulating material; or a heat-insulating gasket is provided between the sealing gasket and the upper cover plate, and the heat-insulating gasket wraps the side surface of the metal microchannel heat exchanger.

9. The micron-scale metal microchannel heat exchanger performance testing device according to claim 1, characterized in that: The temperature acquisition system also includes an infrared real-time thermal imager for acquiring the surface temperature of the heat source chip.

10. A method for evaluating the performance of a micron-scale metal microchannel heat exchanger, characterized by: The micron-sized metal microchannel heat exchanger performance testing device according to any one of claims 1 to 9 is used. A cooling medium is introduced through the first water inlet to obtain input voltage, input current, and the temperatures of the first water inlet, the first water outlet, and the surface of the microchannel heat exchanger. The product of the input voltage (Vn) and the input current (In) is the input heat flux density (Wn), as shown in the following formula: Wn=Vn In The heat source chip has a heating area of ​​A, and the first heat flux density (Qn) is obtained as shown in the following formula: Qn=Wn / A The first heat flux density is adjusted by adjusting the voltage, with the surface temperature of the heat source chip being lower than the maximum allowable temperature and the cooling medium temperature being lower than the cooling medium phase change temperature as the benchmark; the second heat flux density is calculated from the temperature of the first water inlet and the first water outlet, and the difference between the first heat flux density and the second heat flux density is the heat dissipation caused by other factors.

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