Lever-type test conduction device

Abstract

The present invention discloses a lever-type test conduction device, which includes a base for being fixed to a test device, a guiding connection seat arranged at the upper end of the base, a micro-probe assembly passing through the base and the guiding connection seat, and a signal transfer PCB board electrically connected to the micro-probe assembly. An opening for the upper end of the micro-probe assembly to pass through is provided on the upper end surface of the guiding connection seat, and the signal transfer PCB board is connected to the lower end of the micro-probe assembly; it further includes a bottom box with an upper opening and an upper-top lever mechanism arranged inside the bottom box. The upper end of the bottom box is connected to the lower end of the base. The upper-top lever mechanism includes a rotating shaft capable of rotating around its own axis arranged on one side inside the bottom box, a fixing frame arranged on the rotating shaft, and a top rod upwardly passing through a part of the bottom box located inside the fixing frame. The part of the signal transfer PCB board corresponding to the fixing frame is fixed on the fixing frame.

Description

Technical Field

[0001] The invention relates to the field of electronic component conduction testing, and in particular to a lever-type conduction testing device. Background Art

[0002] In the manufacturing process of electronic component modules such as polymer batteries, it is often necessary to perform conduction detection and other processes on the corresponding electronic components (such as 3C batteries or other electronic components that need to be tested). This usually requires the use of test equipment to connect the contact electrodes of the electronic components through the test conduction device, and the test equipment reads the relevant data.

[0003] Traditional test conduction devices usually use a shrapnel-type microprobe assembly as a conduction medium, and the shrapnel-type microprobe includes an integrally formed first contact portion, an elastic portion, and a second contact portion. The first contact portion is electrically connected to the test equipment, and the second contact portion is electrically connected to the electronic component being tested, and the elastic portion is located between the first contact portion and the second contact portion. When the electronic component being tested is subjected to a conduction test, the electronic component being tested is lightly pressed on the second contact portion of the shrapnel-type microprobe. The elastic portion of the shrapnel-type microprobe is composed of a number of "S"-shaped elastic sheets, which make the second contact portion extend upward to closely contact the electronic component being tested to ensure contact stability. However, the shrapnel-type microprobe is prone to deformation after being compressed several times, resulting in poor resilience and greatly reduced mechanical life; if the structure of the microprobe is changed so that it does not have an elastic portion or has a small elasticity, although this can solve the deformation problem of the microprobe and improve its mechanical life, it cannot guarantee its contact stability with the electronic component being tested. Therefore, how to improve the mechanical life of the microprobe while ensuring its contact stability with the electronic components being tested is a technical problem that needs to be solved urgently. Summary of the invention

[0004] In view of the above-mentioned deficiencies of the prior art, the technical problem to be solved by the present invention is to provide a lever-type test conduction device which can increase the mechanical life of the micro-probe assembly and can stably contact the electronic component being tested.

[0005] To solve the above technical problems, a technical solution adopted by the present invention is: to provide a lever-type test conduction device, including a base for fixing with a test device, a guiding connection seat arranged at the upper end of the base, a micro probe assembly penetrating through the base and the guiding connection seat, and a signal transfer PCB board electrically connected to the micro probe assembly. The upper end surface of the guiding connection seat has an opening for the upper end of the micro probe assembly to pass through, and the signal transfer PCB board is connected to the lower end of the micro probe assembly; it further includes a bottom box with an upper opening and an upper top lever mechanism arranged in the bottom box. The upper end of the bottom box is connected to the lower end of the base. The upper top lever mechanism includes a rotating shaft capable of rotating around its own axis arranged on one side in the bottom box, a fixing frame arranged on the rotating shaft, and a top rod upwardly penetrating through a part of the bottom box located inside the fixing frame. The part of the signal transfer PCB board corresponding to the fixing frame is fixed on the fixing frame, and the part of the signal transfer PCB board corresponding to the top rod is connected to the upper end of the top rod so as to be able to move up and down in the base and the guiding connection seat under the drive of the top rod.

[0006] Further, in the initial state, the upper end surface of the micro probe assembly is flush with the upper end of the guiding connection seat or lower than the upper end surface of the guiding connection seat.

[0007] Further, the fixing frame includes a base sleeved on the rotating shaft to be able to rotate with it and a fixing groove seat arranged at the upper end of the base. The width of the fixing groove seat is smaller than the width of the signal transfer PCB. The part of the signal transfer PCB board corresponding to the fixing groove seat is fixed in the fixing groove seat.

[0008] Further, the cross section of the fixing groove seat is U-shaped, and the U-shaped fixing groove seat has openings communicating with the outside in both the direction towards the signal transfer PCB board and the direction away from the signal transfer PCB board.

[0009] Further, it further includes two first self-restoring springs. The lower ends of the two first self-restoring springs are respectively arranged on both sides of the bottom of the micro probe assembly, and the upper ends of the two first self-restoring springs upwardly penetrate through the base and are connected to the lower end of the guiding connection seat.

[0010] Further, first positioning holes are respectively arranged at positions on both sides of the top rod on the bottom box. Second positioning holes, third positioning holes, fourth positioning holes, and fifth positioning holes are respectively arranged at positions corresponding to the two first positioning holes on the signal transfer PCB board, the micro probe assembly, the base, and the guiding connection seat. Two first positioning pins are sequentially downwardly penetrated through the two fifth positioning holes, the two fourth positioning holes, the third positioning holes, the second positioning holes, and the first positioning holes.

[0011] Further, 7. The lever-type test conduction device according to claim 6, characterized in that: the lower ends of the two first self-restoring springs are respectively arranged at the positions of the two third positioning holes and sleeved on the first positioning pin, and follow the first positioning pin to penetrate upward into the corresponding two fourth positioning holes, and the two first self-restoring springs protrude from the upper end surface of the base to abut against the lower end surface of the guiding connection seat.

[0012] Further, the micro-probe assembly includes a needle mold and a plurality of micro-probes vertically arranged on the needle mold; each micro-probe includes an integrally formed first contact part, a second contact part, a middle part located between the first contact part and the second contact part, and a hollow part arranged on the middle part. The first contact part is electrically connected to the signal transfer PCB board, and the second contact part penetrates through the guiding connection seat and is electrically connected to the connection part of the electronic component to be tested placed on the guiding connection seat.

[0013] Further, the hollow part penetrates through the middle part from one side direction of the middle part to communicate with the outside, and the width from the other side of the middle part to the hollow part is equal to or greater than the width of the first contact part.

[0014] Further, a profiling wall is provided around the upper end surface of the guiding connection seat corresponding to the position of the micro-probe assembly. The space between the profiling walls forms a profiling groove matching the connection part of the electronic component to be tested, and a through hole for the upper end of the micro-probe assembly to penetrate upward is provided at the bottom of the profiling groove.

[0015] The lever-type test conduction device of the present invention adopts a lever-type pushing method to make the micro-probe assembly in good contact with the electronic component to be tested, can be applicable to a variety of micro-probes, expands the range of the traditional limited spring-type micro-probes, and further, is applicable to an integral straight needle, solving the problems that the original micro-probes are deformed due to frequent pressing and have a short mechanical life. By adopting the integral straight needle method, a plurality of integral straight micro-probes can be stacked together to form a stacked micro-probe assembly 3, and there is no need to worry about the problems that the elastic parts of the chip-type micro-probes are easily entangled, interfere with each other, affect each other, and are easily deformed when stacked together, thus solving the problems that have not been solved and are urgently needed to be solved. At the same time, it provides a better basis for greatly increasing the overload current. The overload current can reach 3 to 5 times that of the traditional test conduction device, and the above-mentioned structural design of the integral straight needle greatly improves the width of the test spectrum, can meet the test requirements for more electronic components, has a wide application range and strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a perspective view of an embodiment of the lever-type test conduction device of the present invention.

[0017] Figure 2 is Figure 1 the top view of

[0018] Figure 3 is Figure 1 the exploded view of

[0019] Figure 4 is Figure 3 the structural schematic diagram of the microprobe in Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figures 1 to 4 , in this embodiment, taking the current test as an example for illustration, the lever-type test conduction device in this embodiment includes a base 1 for fixing with a test device (not shown in the figure), a guiding connection seat 2 provided at the upper end of the base 1, a microprobe assembly 3 passing through the base 1 and the guiding connection seat 2, and a signal transfer PCB board 4 electrically connected to the microprobe assembly 3, and the signal transfer PCB board 4 is connected to the lower end of the microprobe assembly 3; it further includes a bottom box 5 with an upper opening and an upper top lever mechanism 6 provided in the bottom box 5, and the upper end of the bottom box 5 is connected to the lower end of the base 1. The upper top lever mechanism 6 includes a rotating shaft 61 capable of rotating around its own axis provided on one side in the bottom box 5, a fixing frame 62 provided on the rotating shaft 61, and a top rod 63 passing upward through a part of the bottom box 5 located inside the fixing frame 62. The part of the signal transfer PCB board 4 corresponding to the fixing frame 62 is fixed on the fixing frame 62, and the part of the signal transfer PCB board 4 corresponding to the top rod 63 is connected to the upper end of the top rod 63 so as to be able to move up and down a predetermined stroke in the base 1 and the guiding connection seat 2 under the drive of the top rod 63. In this solution, the base 1 and the bottom box 5 can adopt detachable connection methods such as screws and rivets, and can also adopt connection methods such as welding and gluing. Similarly, the guiding connection seat 2 can also adopt detachable connection methods such as screws and rivets to be connected to the base 1, and can also adopt connection methods such as welding and gluing to be connected to the base 1.

[0022] For the lever - type test conduction device of this solution, the connection part (such as a connector) of the electronic component to be tested is placed on the guiding connection base 2 to be electrically connected to the micro - probe, and is electrically connected to the test equipment through the signal transfer PCB board 4. The test equipment tests the electronic component to be tested through this lever - type test conduction device to read the test value. In this specific solution, the base 1 is rigidly fixed to the upper end of the bottom box 5, and the guiding connection base 2 is rigidly fixed on the guiding connection base 2. However, the micro - probe assembly 3 and the signal transfer PCB board 4 connected to the lower end of the micro - probe assembly 3 and located below the base 1 can move relative to the base 1 and the guiding connection base 2 along the installation pressing direction (the up - and - down direction in the figure) of the electronic component to be tested. When placing the connection part of the electronic component to be tested on the guiding connection base 2, an upward force is applied to the ejector rod 63 and maintained until the test of this electronic component is completed, so that the micro - probes of the micro - probe assembly 3 protrude upward through the guiding connection base 2, which is beneficial to the connection between the micro - probe assembly 3 and the electronic component to be tested. When the ejector rod 63 is pushed upward or afterwards, the connection part of the electronic component is placed at the position corresponding to the micro - probe assembly 3 on the guiding connection base 2. The connection part applies a downward pressure to the upper end of the micro - probe assembly 3. The downward force makes the connection part and the upper end of the micro - probe assembly 3 be tightly connected, ensuring close contact throughout the entire test conduction process and preventing problems of poor contact. At the same time, since the ejector rod 63 pushes the micro - probe assembly 3 upward, it provides sufficient guarantee for the close contact between the micro - probe assembly 3 and the electronic device to be tested. Therefore, whether it is a spring - type micro - probe with elasticity or an integral straight - needle without elasticity can achieve the purpose of close contact without relying on its own elastic force. A further benefit is that during the working process, since the micro - probe assembly 3 does not need to rely on its own elastic force to ensure its close contact with the electronic component to be tested, it will not be deformed due to frequent downward pressing, solving the problems of damage to the micro - probe caused by deformation and reduction of its mechanical life, improving the mechanical life of the micro - probe and reducing the replacement cost.

[0023] In a further specific solution, in the initial state, the upper end surface of the micro-probe assembly 3 is in the same plane as the upper surface of the guiding connection base 2 or lower than the upper end surface of the guiding connection base 2. Preferably, the upper end surface of the micro-probe assembly 3 is lower than the upper end surface of the guiding connection base 2. Further, the parallel distance between the upper end surface of the micro-probe assembly 3 in the initial state and the upper end surface of the guiding connection base 2 is less than the thickness of the top plate of the guiding connection base 2. The advantage is that the upper end (metal contact part) of the micro-probe assembly 3 is both lower than the upper end surface of the guiding connection base and does not break away from the restriction of the upper end plate of the guiding connection base 2, ensuring that the micro-probe assembly 3 can penetrate upward through the upper end surface of the guiding connection base 2 each time. This is especially applicable to the application scenario where the micro-probes of the micro-probe assembly 3 are in multiple groups and the through-holes of the guiding connection base 2 are multiple holes. For example, when the thickness of the top plate of the guiding connection base 2 is 0.8 mm, the parallel distance between the upper end surface of the micro-probe assembly 3 and the upper end surface of the guiding connection base 2 can be any value below 0.8 mm (for example, designed to be 0.1 mm). When the ejector rod 63 jacks up the signal transfer PCB board 4 upward, the signal transfer PCB board 4 uses the rotating shaft 61 as a lever fulcrum, and the part of the signal transfer PCB board 4 corresponding to the ejector rod 63 is lifted upward, driving the micro-probe assembly 3 to move upward, so that the upper end of the micro-probe assembly 3 exposes from the upper end surface of the guiding connection base 2, facilitating effective electrical connection with the electronic component to be tested. The advantage of this is that in the initial or unused state, since the upper end of the micro-probe assembly 3 is not exposed, the micro-probe assembly 3 can be well and effectively protected, and the mechanical life of the micro-probe assembly 3 can be extended.

[0024] In order to make the structure more compact, more convenient to connect with the test equipment, and occupy less space, the base 1 is in a long block shape, and the bottom box 5 is in a rectangular shape. The length of the base 1 is greater than the length of the bottom box 5. In this way, base positioning holes 11 and base fixing holes 12 can be respectively arranged at the two side ends of the base 1 that extend beyond the bottom box 5, and bottom box fixing holes 51 and bottom box positioning holes 52 for fixing with the bottom box 5 are arranged at positions directly above the two side walls of the bottom box 5 on the base 1. Further, a convex part 13 protruding downward is provided at the lower end of the base 1 corresponding to the inner cavity of the bottom box 5. When connecting with the bottom box 5, this convex part 13 can not only play a limiting role to prevent the base 1 from slipping around, but also facilitate the quick alignment of the bottom box positioning holes 52 and the bottom box fixing holes 51.

[0025] In this embodiment, the bottom box 5 is similar to a dustpan shape, having not only an upper opening, but also a side opening 53 in the projection on the horizontal plane. This side opening 53 is in the view Figure 1In the middle is the front-side opening 53. The fixing bracket 62 is disposed on one side of the inner cavity of the bottom box 5 close to the side opening 53, and the signal transfer PCB board 4 is disposed on the side of the inner cavity of the bottom box 5 far from the side opening 53 (i.e., the above-mentioned inner side). The advantage of such a setting is that it can reduce the production material cost and facilitate the installation and disassembly of the fixing bracket 62. The fixing bracket 62 includes a base 621 sleeved on the rotating shaft 61 and capable of rotating therewith, and a fixing groove seat 622 disposed at the upper end of the base 621. The width of the fixing groove seat 622 is smaller than the width of the signal transfer PCB. The part of the signal transfer PCB board 4 corresponding to the fixing groove seat 622 is fixed in the fixing groove seat 622. Further preferably, the cross-section of the fixing groove seat 622 is U-shaped, and the U-shaped fixing groove seat 622 has openings communicating with the outside in both the direction towards the signal transfer PCB board 4 and the direction away from the signal transfer PCB board 4. The U-shaped fixing groove can better cooperate closely with the signal transfer PCB board 4, and the two sides of the U-shaped fixing groove can limit and protect the signal transfer PCB board 4.

[0026] At the position corresponding to the micro-probe assembly 3 on the upper end surface of the guiding connection seat 2, a profiling wall 21 is surrounded. The space between the profiling walls 21 forms a profiling groove 22 matching the connection part of the measured electronic component. A through hole for the upper end of the micro-probe assembly 3 to penetrate upward is opened at the bottom of the profiling groove 22. Preferably, the through hole is designed as a plurality of grid holes, and the number and positions of the grid holes are determined according to the number of groups of micro-probes in the micro-probe assembly 3, the number of each group, and the layout positions of the micro-probes in different embodiments, and no excessive restrictions are imposed here.

[0027] As a preferred solution, the lever-type test conduction device further includes at least two first self-restoring springs 71 (two first self-restoring springs 71 in this embodiment). The lower ends of the two first self-restoring springs 71 are respectively arranged on both sides of the bottom of the micro-probe assembly 3. The upper ends of the two first self-restoring springs 71 pass upward through the base 1 and are connected to the lower end of the guiding connection seat 2. The advantages of such a setting are as follows: First, it increases the toughness of the micro-probe assembly 3, reduces the dryness and incoherence during up and down movement, and further protects the micro-probe assembly 3 and other components; Second, when the ejector rod 63 jacks up the signal PCB board upward, the first self-restoring spring 71 is compressed, and the micro-probe assembly 3 also receives an upward force, ensuring good contact and toughness at the connection part between the micro-probe assembly 3 and the electronic component to be tested; Second, when the conduction test of the electronic component is completed and the ejector rod 63 drops, since the upper end of the first self-restoring spring 71 abuts against the lower end face of the guiding connection seat 2, and the guiding connection seat 2 is fixed on the base 1 and does not move, therefore, under the action of the self-restoring spring of the first self-restoring spring 71, the lower end rebounds downward to reset, so that the signal transfer PCB board 4 drops downward, thereby making the upper end of the micro-probe assembly 3 fall into the guiding connection seat 2, making the micro-probe assembly 3 in a state of not protruding (protruding out of the guiding connection seat 2) unless used, avoiding the problem that when the connection part is just placed in the profiling groove 22, it contacts the micro-probe assembly 3 and cannot be effectively connected. This is because when the connection part is just placed in the profiling groove 22, it is in an inclined state, and in this state, the contact points between the micro-probe and the connection part may have attenuation, resulting in the micro-probe possibly not being able to contact the contact points of the connection part. When the connection part is completely placed in the profiling groove 22, when the connection part is pressed downward by the pressing rod of the test equipment, when the connection part completely enters the groove, the position can be ensured to be correct at this time, and at the same time, the downward pressure makes the micro-probe protrude out of the guiding connection seat 2. In addition, it also protects the metal contact part of the micro-probe assembly 3 from being exposed for a long time, effectively preventing the micro-probe assembly 3 from being easily corroded and aged due to exposure to the outside air.

[0028] For the convenience of installation and to speed up the assembly speed, first positioning holes 72 are respectively arranged at positions on the bottom box 5 on both sides of the ejector rod 63. At positions corresponding to the two first positioning holes 72 on the signal transfer PCB board 4, the micro-probe assembly 3, the base 1, and the guiding connection seat 2, two second positioning holes (not shown in the figure), two third positioning holes (not shown in the figure), two fourth positioning holes 73, and two fifth positioning holes 74 are respectively provided. Two first positioning pins 75 are sequentially inserted downward through the two fifth positioning holes 74, the two fourth positioning holes 73, the third positioning holes, the second positioning holes, and the first positioning holes 72. In this way, during assembly, all components can be positioned through the two first positioning pins 75.

[0029] Further preferably, the lower ends of the two first self - restoring springs 71 are respectively disposed at the positions of the two third positioning holes and sleeved on the first positioning pin 75. Along with the first positioning pin 75, they penetrate upward into the corresponding two fourth positioning holes 73, and the two first self - restoring springs 71 protrude from the upper end surface of the base 1 to abut against the lower end surface of the guiding connection seat 2. The design of the first self - restoring spring 71 and the first positioning pin 75 together makes the layout more compact, and the first self - restoring screw does not require another guiding column to solve the problems of non - telescoping along the height direction and self - restoration of the screw.

[0030] In this embodiment, the micro - probe assembly 3 includes a needle die 31 and a plurality of micro - probes 32 vertically disposed on the needle die 31. Further, the micro - probe assembly 3 further includes a positioning plate 33 for mounting and positioning the needle die 31. The positioning plate 33 is disposed on the signal transfer PCB board 4. At the positions corresponding to the probes on the positioning plate 33, there are through - holes for the probes to pass downward to be electrically connected to the gold fingers of the signal transfer PCB board 4. The above - mentioned two third positioning holes are respectively disposed at both ends of the positioning plate 33. Further, at the position corresponding to the needle die 31 on the positioning plate 33, a positioning groove 331 is provided downward, and the needle die 31 is installed in the positioning groove 331. It can be understood that the setting positions of the micro - probes 32 are determined according to the contact shape and area of the connecting parts of the electronic components to be tested in different embodiments. In different embodiments, their setting positions can have different variations. According to the test type, the micro - probes can include positive - pole micro - probes, negative - pole micro - probes, various signal micro - probes, etc. Among them:

[0031] The microprobe includes an integrally formed first contact portion 323, a second contact portion 324, a middle portion 325 located between the first contact portion 323 and the second contact portion 324, and a hollow portion 326 provided on the middle portion 325. The first contact portion 323 is electrically connected to the signal transfer PCB board 4, and the second contact portion 324 passes through the guiding connection base 2 and is electrically connected to the connection portion of the electronic component to be tested placed on the guiding connection base 2. Preferably, the hollow portion 326 penetrates the middle portion 325 from one side direction of the middle portion 325 to communicate with the outside, and the width from the other side of the middle portion 325 to the hollow portion 326 is equal to or greater than the width of the first contact portion 323. In this embodiment, the middle portion 325 is actually located in the lower middle part of the microprobe 32. The hollow portion 326 is integrally U-shaped, and each corner is designed to be arc-shaped. There will be a slight deformation when stressed, so that all the microprobes 32 can fully contact the connection portion of the electronic component to be tested. Generally speaking, the bottom of the microprobe 32 and the middle portion 325 have the same width, which is wider than the top (the second contact portion 324), and has a large contact area with the signal transfer PCB board 4, achieving a higher overload test current and a wider test spectrum.

[0032] The microprobe assembly 3 can design the microprobes 32 into multiple groups according to factors such as the requirements of different embodiments, the contact area size and shape of the connection portion. They can all be set as stacked microprobes 32, or can be designed as single independent microprobes 32, or can also adopt a combination of stacked and single independent microprobes 32. Stacking multiple microprobes 32 can achieve the conduction of a larger current.

[0033] Adopting such microprobes 32 has the following advantages: First, the first contact portion 323 and the middle portion 325 are wider (wider than the top / the second contact portion 324), achieving a higher overload test current and a wider test spectrum; Second, the hollow portion 326 enables the microprobe 32 to have a micro-deformation (the shape and size can be designed according to the requirements of different embodiments), has a certain elasticity, and can be slightly deformed when stressed, so that each micro-needle in the whole device can make good contact with the product connection portion, solving the problem that some shorter probes cannot effectively contact due to the slight height dimension error of different microprobes 32 in the early processing and manufacturing; Third, the width from the hollow portion 326 to the other side of the middle portion 325 is greater than the width of the second contact portion 324, providing enough overload current; Fourth, the one-piece straight needle instead of the S-shaped elastic piece can pass through a wider test spectrum and a larger test current.

[0034] As a practical application of the lever-type test conduction device of the present invention, the thickness of the upper end surface of the guiding connection base 2 is designed to be 0.8 mm. The ejector rod 63 can move slightly along the guiding column as a whole by about 0.2 - 0.4 mm, so that the needle tip exposes from the profiling groove 22 and contacts the product connection part. The signal lead-out wire of the signal transfer PCB board 4 is led out from an opening on one side of the bottom box 5, and the fulcrum is located at the center of the signal lead-out wire, so that the rotation of the lever mechanism will not be affected when the signal lead-out wire shakes. The first positioning pin positions components such as the guiding connection base 2 and the signal transfer PCB board 4 to ensure the precise positions of all components. The needle die 31 is used to fix the micro-needles and can move slightly in the inner cavity of the base 1. Since the pitch of the micro-probes 32 is the same as that of the product connection part, for different products, the needle die 31, the signal transfer PCB board 4 and the guiding connection base 2 need to be redesigned to ensure that the micro-probes 32 can transfer the test signal to the test equipment.

[0035] In summary, for the lever-type test conduction device of the present invention, the lever-type pushing method is adopted to make the micro-probe assembly 3 in good contact with the electronic component to be measured. It can be applicable to various micro-probes 32, expanding the range of the traditional limited spring-type micro-probes 32. Further, it is applicable to integral straight needles, solving the problems of deformation of the original micro-probes 32 due to frequent pressing and short mechanical life. By adopting the integral straight needle method, multiple integral straight micro-probes 32 can be stacked together to form a stacked micro-probe assembly 3, eliminating the need to worry about problems such as the elastic parts of the chip-type micro-probes 32 being easily entangled, interfering with each other, being affected by each other, and being easily deformed, which in turn leads to damage. This solves the problem that has not been solved and is urgently needed to be solved. At the same time, it provides a better basis for greatly increasing the overload current. The overload current can reach 3 - 5 times that of the traditional test conduction device. And the above-mentioned structural design of the integral straight needle greatly improves the width of the test spectrum, can meet the test requirements for more electronic components, has a wide application range and strong versatility.

[0036] The above is only the embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A lever-type test conduction device, comprising a base for fixing to a test device, a guiding connection seat provided at the upper end of the base, a micro-probe assembly passing through the base and the guiding connection seat, and a signal transfer PCB board electrically connected to the micro-probe assembly. The upper end surface of the guiding connection seat has an opening for the upper end of the micro-probe assembly to pass through, and is characterized in that: The signal transfer PCB board is connected to the lower end of the micro-probe assembly; it further includes a bottom box with an upper opening and an upper pressing lever mechanism disposed inside the bottom box. The upper end of the bottom box is connected to the lower end of the base. The upper pressing lever mechanism includes a rotating shaft that can rotate around its own axis and is disposed on one side inside the bottom box, a fixing frame disposed on the rotating shaft, and a top rod that passes upward through a part of the bottom box located inside the fixing frame. The part of the signal transfer PCB board corresponding to the fixing frame is fixed on the fixing frame, and the part of the signal transfer PCB board corresponding to the top rod is connected to the upper end of the top rod so as to be able to move up and down between the base and the guiding connection seat under the drive of the top rod; in the initial state, the upper end surface of the micro-probe assembly is flush with the upper end surface of the guiding connection seat or lower than the upper end surface of the guiding connection seat; the fixing frame includes a base sleeved on the rotating shaft to be able to rotate with it and a fixing groove seat disposed on the upper end of the base. The width of the fixing groove seat is smaller than the width of the signal transfer PCB board, and the part of the signal transfer PCB board corresponding to the fixing groove seat is fixed in the fixing groove seat.

2. The lever-type test conduction device according to claim 1, characterized in that: The cross-section of the fixing groove seat is U-shaped, and the U-shaped fixing groove seat has openings communicating with the outside in both the direction towards the signal transfer PCB board and the direction away from the signal transfer PCB board.

3. The lever-type test conduction device according to claim 1, characterized in that: It further includes two first self-restoring springs. The lower ends of the two first self-restoring springs are respectively disposed on both sides of the bottom of the micro-probe assembly, and the upper ends of the two first self-restoring springs pass upward through the base and are connected to the lower end of the guiding connection seat.

4. The lever-type test conduction device according to claim 3, characterized in that: First positioning holes are respectively provided at positions on both sides of the top rod on the bottom box. Second positioning holes, third positioning holes, fourth positioning holes, and fifth positioning holes are respectively provided at positions corresponding to the two first positioning holes on the signal transfer PCB board, the micro-probe assembly, the base, and the guiding connection seat. Two first positioning pins are sequentially inserted downward through the two fifth positioning holes, the two fourth positioning holes, the third positioning holes, the second positioning holes, and the first positioning holes.

5. The lever-type test conduction device according to claim 4, characterized in that: The lower ends of the two first self-restoring springs are respectively disposed at the positions of the two third positioning holes and sleeved on the first positioning pins, and follow the first positioning pins to be inserted upward through the corresponding two fourth positioning holes, and the two first self-restoring springs protrude from the upper end surface of the base to abut against the lower end surface of the guiding connection seat.

6. The lever-type test conduction device according to claim 1, characterized in that: The micro-probe assembly includes a needle mold and a plurality of micro-probes vertically disposed on the needle mold; each micro-probe includes an integrally formed first contact part, a second contact part, a middle part located between the first contact part and the second contact part, and a hollow part disposed on the middle part. The first contact part is electrically connected to the signal transfer PCB board, and the second contact part passes through the guiding connection seat and is electrically connected to the connection part of the electronic component to be tested placed on the guiding connection seat.

7. The lever-type test conduction device according to claim 6, characterized in that: The hollowed-out portion penetrates through the middle portion from one side direction of the middle portion to communicate with the outside, and the width from the other side of the middle portion to the hollowed-out portion is equal to or greater than the width of the first contact portion.

8. The lever-type test conduction device according to any one of claims 1 to 7, characterized in that: At the position corresponding to the microprobe assembly on the upper end surface of the guiding connection base, a profiling wall is provided around, and the space between the profiling walls forms a profiling groove matching the connection portion of the electronic component to be tested. A perforation is provided at the bottom of the profiling groove for the upper end of the microprobe assembly to penetrate upward.

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