Isolation structure, digital isolator and method for manufacturing the isolation structure

Abstract

The present invention discloses an isolation structure, a digital isolator and a method for manufacturing the isolation structure. The isolation structure includes a first insulating dielectric layer, a second insulating dielectric layer and a connector. The connector includes: a first metal plate, a second metal plate, a connecting conductor connecting the first metal plate and the second metal plate, the first top metal plate and the corresponding first insulating dielectric layer and the corresponding first metal plate form a first capacitor structure, and the second top metal plate and the corresponding second insulating dielectric layer and the corresponding second metal plate form a second capacitor structure. The present invention does not need to modify the structure of the chip itself, and can form the first capacitor structure and the second capacitor structure, forming a new form of isolation structure of a digital isolator, so that the signal transmission between the sending chip and the receiving chip can be smoothly carried out while isolating the high voltage.

Description

Technical Field

[0001] The present invention relates to the field of semiconductors, and in particular to an isolation structure, a digital isolator and a method for manufacturing the isolation structure. Background Art

[0002] A digital isolator is a device that can disconnect the ground loop, isolate high voltage and maintain signal transmission. The device is divided into two wafers, the transmitter and the receiver. The two wafers are connected by an isolation structure, such as a set of high-voltage isolation capacitors of semiconductor media. Figure 1 As shown in the figure, the digital signal is input from pin A, modulated by the RF oscillator and the RF carrier of the modulator, and sent to the receiver through the isolation structure. After the receiver receives the attenuated RF signal, it is demodulated by the demodulator to restore it to the output signal, and then output from pin B.

[0003] The isolation structure in the above system is made by semiconductor technology. Usually, the lower metal layer inside the chip is used as the lower plate of the capacitor, and the top metal layer inside the chip is used as the upper plate of the capacitor. A SIO2 (silicon dioxide) dielectric layer with a thickness of tens of microns is set between the top metal and the lower metal inside the chip to provide sufficient voltage resistance. For details, see Figure 2 The transmitter and receiver chips each have an isolation structure and are connected via a bonding wire.

[0004] The specific implementation method is as follows Figure 3 Chip 1 is a transmitter, chip 2 is a receiver, C1 represents a capacitor formed by a top metal and a corresponding bottom metal on the transmitting chip, C2 represents a capacitor formed by a top metal and a corresponding bottom metal on the receiving chip, C1, C2 and the bonding wires connecting them constitute an isolation structure. A digital isolator may have several isolation structures. The isolation structure of the prior art is arranged inside the chip, which may require the chip to be modified to a certain extent, and the construction method is relatively complicated. Summary of the invention

[0005] The technical problem to be solved by the present invention is to overcome the defect that the isolation structure of the digital isolator in the prior art is relatively complex, and to provide a new isolation structure of a digital isolator with a simple construction method, a digital isolator and a manufacturing method of the isolation structure.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] The present invention provides an isolation structure in a digital isolator, the digital isolator comprising a transmitting chip and a receiving chip, the transmitting chip comprising at least one first top metal plate, the receiving chip comprising at least one corresponding second top metal plate, the isolation structure comprising a first insulating dielectric layer arranged on each of the first top metal plates and a second insulating dielectric layer arranged on each of the second top metal plates, the isolation structure further comprising a connector, the connector comprising:

[0008] At least one first metal plate and at least one corresponding second metal plate, wherein the at least one first metal plate is in contact with the corresponding first insulating medium layer, and the at least one second metal plate is in contact with the corresponding second insulating medium layer;

[0009] The connector also includes at least one connecting conductor connecting the corresponding first metal plate and the second metal plate. The first top metal plate, the corresponding first insulating medium layer and the corresponding first metal plate form a first capacitor structure. The second top metal plate, the corresponding second insulating medium layer and the corresponding second metal plate form a second capacitor structure.

[0010] Preferably, the connector also includes an insulating part, and the first metal plate, the second metal plate and the connecting conductor are all arranged on the surface of the insulating part; or, at least part of the first metal plate and the second metal plate are exposed to the outer surface of the insulating part, and the connecting conductor is embedded in the insulating part.

[0011] Preferably, the connecting conductor comprises a metal film;

[0012] and / or,

[0013] The first insulating dielectric layer includes a polyimide film; and / or the second insulating dielectric layer includes a polyimide film;

[0014] and / or,

[0015] The first metal plate and the first top metal have the same structural parameters; and / or the second metal plate and the second top metal plate have the same structural parameters, wherein the structural parameters include at least one of size, shape and thickness.

[0016] The present invention further provides a digital isolator, which includes the isolation structure as described above, and further includes a transmitting chip and a receiving chip.

[0017] Preferably, the digital isolator further comprises a first packaging frame and a second packaging frame which are spaced apart from each other, the transmitting chip is mounted on the first packaging frame, and the receiving chip is mounted on the second packaging frame.

[0018] Preferably, the digital isolator also includes a first wire and a second wire, the first wire connects the first packaging frame and the transmitting chip, the first wire is used to transmit the external digital signal to the transmitting chip, the second wire connects the second packaging frame and the transmitting chip, and the second wire is used to transmit the digital signal passing through the receiving chip to the outside.

[0019] Preferably, the transmitting chip includes a modulation circuit, the first wire is used to transmit an external digital signal to the modulation circuit, the modulation circuit is used to modulate the digital signal, and send the modulated digital signal to the first capacitor;

[0020] The receiving chip includes a demodulation circuit, which is used to receive the modulated digital signal from the second capacitor and demodulate the modulated digital signal. The second wire is used to transmit the demodulated digital signal to the outside.

[0021] The present invention also provides a method for manufacturing the isolation structure of the digital isolator as described above, the manufacturing method comprising:

[0022] Disposing a first insulating dielectric layer on each first top metal plate and a second insulating dielectric layer on each second top metal plate;

[0023] Fixing the connector on the first insulating medium and the second insulating medium so that at least one first metal plate and the corresponding at least one second metal plate included in the connector are placed on the corresponding first insulating medium and the corresponding second insulating medium respectively;

[0024] or,

[0025] The first insulating medium and the second insulating medium are respectively fixed on at least one first metal plate and at least one corresponding second metal plate included in the connector.

[0026] Preferably, the manufacturing method further comprises forming the connector by the following steps:

[0027] The first metal plate, the second metal plate and the connecting conductor are manufactured by integral molding; or the first metal plate, the second metal plate and the connecting conductor are manufactured separately and then combined into one.

[0028] Preferably, the step of manufacturing the first metal plate, the second metal plate and the connecting conductor by integral molding comprises:

[0029] Laying a metal plate on the insulating part;

[0030] Etching the metal plate to form a connecting conductor connected to the first metal plate, the second metal plate, and the first metal plate and the second metal plate;

[0031] The insulating portion is removed or retained; the distance between the first metal plate and the second metal plate is the same as the distance between the first top metal plate and the second top metal plate;

[0032] or,

[0033] The step of separately manufacturing the first metal plate, the second metal plate and the connecting conductor and then combining the first metal plate, the second metal plate and the connecting conductor into one body comprises:

[0034] A first metal plate and a second metal plate are arranged on the first insulating portion, wherein the distance between the first metal plate and the second metal plate is the same as the distance between the first top metal plate and the second top metal plate;

[0035] forming a receiving space in the second insulating portion according to the distance between the first top metal plate and the second top metal plate, and arranging a connecting conductor in the receiving space;

[0036] combining the second insulating portion and the first insulating portion so that the first metal plate and the second metal plate are electrically connected through the connecting conductor;

[0037] removing or retaining at least one of the first insulating portion and the second insulating portion;

[0038] or,

[0039] forming a receiving space in the insulating portion;

[0040] The first metal plate, the second metal plate and a connecting conductor for connecting the first metal plate and the second metal plate are arranged in the accommodation space, and at least a portion of the first metal plate and the second metal plate is exposed to an outer surface of the insulating portion;

[0041] The insulation is removed or retained.

[0042] The positive and progressive effect of the present invention is that the present invention can form a first capacitor and a second capacitor on the surface of a receiving chip and a transmitting chip respectively by setting a first insulating medium on the first top metal layer, a second insulating medium on the second top metal layer, and a connector set on the first insulating medium and the second insulating medium. There is no need to modify the structure of the chip itself. A new form of isolation structure of a digital isolator can be formed in a simple way, thereby achieving isolation of high voltage while enabling smooth signal transmission between the transmitting chip and the receiving chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a module diagram of an existing digital isolator.

[0044] Figure 2 Schematic diagram of the structure of capacitors in existing digital isolators.

[0045] Figure 3 It is a structural schematic diagram of the isolation structure in the existing digital isolator.

[0046] Figure 4 Schematic diagram of the isolation structure in the digital isolator in Example 1 of the present invention.

[0047] Figure 5 This is a top perspective view of an isolation structure in Example 1.

[0048] Figure 6 This is a top perspective view of another isolation structure in Example 1.

[0049] Figure 7 Flow chart of the manufacturing method in Example 3 of the present invention.

[0050] Figure 8 This is a flowchart of a first implementation method of step 302 in Example 3.

[0051] Fig. 9 This is a flowchart of a second implementation method of step 302 in Example 3.

[0052] Fig.10 This is a flowchart of a third implementation method of step 302 in Example 3. DETAILED DESCRIPTION

[0053] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0054] Example 1

[0055] This embodiment provides an isolation structure 1 in a digital isolator, such as Figure 4 As shown, the digital isolator includes a transmitting chip 101 and a receiving chip 201. The transmitting chip 101 includes at least one first top-layer metal plate 102, and the receiving chip 201 includes at least one corresponding second top-layer metal plate 202. It should be understood that the digital isolator in this embodiment may also include other structures, and the specific types, quantities, positional relationships, etc. of the other structures can be determined based on the prior art, and they should not be considered as limitations of this embodiment.

[0056] The isolation structure 1 in this embodiment includes a first insulating dielectric layer 103 arranged on each first top metal plate 102 and a second insulating dielectric layer 203 arranged on each second top metal plate. In this embodiment, the first insulating dielectric layer 103 and the second insulating dielectric layer 203 are preferably made of materials with low dielectric constants, such as polyimide film, to improve the performance of the capacitor structure formed according to the first insulating dielectric layer 103 or the second insulating dielectric layer 203.

[0057] The isolation structure 1 in this embodiment further includes a connector 10, which includes: at least one first metal plate 106 and at least one corresponding second metal plate 107, wherein the at least one first metal plate 106 is in contact with the corresponding first insulating dielectric layer 103, and the at least one second metal plate 107 is in contact with the corresponding second insulating dielectric layer 203. The first top metal plate 102, the corresponding first insulating dielectric layer 103 and the corresponding first metal plate 106 form a first capacitor structure, and the first top metal plate 102, the corresponding second insulating dielectric layer 203 and the corresponding second metal plate 107 form a second capacitor structure. In an ideal case, the size and shape of the first metal plate 106 and the first top metal plate 102 are consistent, and the first metal plate 106 and the first top metal plate 102 are aligned in position, and the size and shape of the second metal plate 107 and the first top metal plate 102 are consistent, and the second metal plate 107 and the first top metal plate 102 are aligned in position, so as to further form the performance of the first capacitor structure and the second capacitor structure.

[0058] The isolation structure 1 in this embodiment also includes at least one connecting conductor 105 connecting the corresponding first metal plate 106 and the second metal plate 107. In this embodiment, the connecting conductor 105 is specifically implemented as a metal film. In other embodiments, the connecting conductor 105 can also be other materials and shapes that achieve conductivity between the first metal plate 106 and the second metal plate 107.

[0059] In this embodiment, a first capacitor can be formed by the first insulating dielectric layer 103, a first metal plate 106 disposed on the first insulating dielectric layer 103 in the connector 10, and a first top metal plate 102 of the structure of the transmitting chip 101 itself. A second capacitor can be formed by the second insulating dielectric layer 203, a second metal plate 107 disposed on the second insulating dielectric layer 203 in the connector 10, and a second top metal plate 202 of the structure of the receiving chip 201 itself. In this embodiment, the first capacitor and the second capacitor can be formed in the digital isolator without modifying the structure of the chip itself. In addition, by disposing a connecting conductor 105 in the connector 10, conduction between the transmitting chip 101 and the receiving chip 201 can be achieved, so that the signal transmission between the transmitting chip 101 and the receiving chip 201 can be smoothly carried out while isolating the high voltage.

[0060] In this embodiment, when the transmitting chip 101 and the receiving chip 201 include a plurality of groups of correspondingly arranged first top metal plates 102 and second top metal plates 202, a corresponding first insulating dielectric layer can be arranged on each first top metal plate 102, and a corresponding second insulating dielectric layer can be arranged on each second top metal plate 202. A plurality of corresponding first metal plates 106 and second metal plates 107 are arranged in the connecting body 10, and a connecting conductor 105 connecting each group of first metal plates 106 and second metal plates 107 is arranged. The connecting body 10 is arranged as a whole on the receiving chip 201 and the receiving chip 201 on which the first insulating dielectric layer 103 and the second insulating dielectric layer 203 are already arranged. On the transmitting chip 101, the transmission of multiple signals between the transmitting chip 101 and the receiving chip 201 can be realized. In this embodiment, when the transmitting chip 101 and the receiving chip need to perform multiple signal transmission, there is no need to perform separate wiring for each group of capacitors between the transmitting chip 101 and the receiving chip. The process of multiple signal transmission can be realized by setting the connecting body 10 as a whole on the transmitting chip 101 and the receiving chip 201. This not only reduces the complexity of the connection method through one-to-one wiring, reduces the complexity of the process of setting the isolation structure 1, but also improves the controllability of the setting method by setting the connecting body 10 in advance, and also improves the connection accuracy between the capacitors.

[0061] In this embodiment, the connector 10 may further include an insulating portion 104. In a specific implementation, the first metal plate 106, the second metal plate 107 and the connecting conductor 105 are all arranged on the surface of the insulating portion 104. In another specific implementation, at least part of the first metal plate 106 and the second metal plate 107 are exposed to the outer surface of the insulating portion 104, and the connecting conductor 105 is embedded in the insulating portion 104. Figure 4 This is a specific implementation form of this structure, wherein the outer surfaces of the first metal plate 106 and the second metal plate 107 are parallel to the bottom of the insulator 104 respectively. Figure 5 FIG. 1 shows a top perspective view of a connection portion in a specific structure, wherein the connection body 10 includes three pairs of first metal plates 106 and second metal plates 107, and a connection conductor 105 for connecting the first metal plates 106 and the second metal plates 107. Figure 6 Another specific top perspective view of the connection portion is shown, wherein each group of connection conductors 105, the first metal plate 106 and the second metal plate 107 are integrally formed, such as a whole metal plate.

[0062] It should be understood that in this embodiment, the shape, thickness and structure of the first metal plate 106, the second metal plate 107 and the connecting conductor 105 can be set according to specific requirements.

[0063] In this embodiment, the provision of the insulating portion can, on the one hand, provide a good protection for the first metal plate 106 , the second metal plate 107 and the connecting conductor 105 , and on the other hand, also improve the compression resistance of the isolation structure 1 .

[0064] Example 2

[0065] The present invention provides a digital isolator, such as Figure 4 As shown, the digital isolator includes a transmitting chip 101, a receiving chip 201 and the isolation structure 1 described in Example 1.

[0066] Furthermore, the digital isolator also includes a first packaging frame 121 and a second packaging frame 221 set at a preset distance. The transmitting chip 101 is installed on the first packaging frame 121, and the receiving chip 201 is installed on the second packaging frame 221. The distance between the first packaging frame 121 and the second packaging frame 221 determines the internal pressure resistance of the digital isolator. The smaller the distance, the higher the internal pressure resistance. In practice, the distance between the first packaging frame 121 and the second packaging frame 221 can be determined according to the demand for internal pressure resistance.

[0067] In this embodiment, the digital isolator may further include a first wire 109 arranged on the transmitting chip 101 and a second wire 110 arranged on the receiving chip 201. The external digital signal can be received through the first wire 109, and the digital signal can be transmitted to the outside through the second wire 110. It should be understood that this embodiment may include multiple first wires 109 and corresponding multiple second wires 110, and multiple digital signals can be transmitted through the first wire 109 and the second wire 110.

[0068] In this embodiment, the transmitting chip 101 further includes a modulation circuit 122, the first wire 109 is used to transmit an external digital signal to the modulation circuit 122, the modulation circuit 122 is used to modulate the digital signal, and send the modulated digital signal to the first capacitor;

[0069] The receiving chip 201 further includes a demodulation circuit 222, which is used to receive the modulated digital signal from the second capacitor and demodulate the modulated digital signal. The second wire 110 is used to transmit the demodulated digital signal to the outside.

[0070] In this embodiment, the specific digital signal transmission process is as follows: the digital signal is modulated by the modulation circuit 122 in the transmitter chip 101 and then sent to the first capacitor, and the modulated signal is transmitted to the demodulation circuit 222 in the receiver chip 201 via the first capacitor, the connecting conductor 105 and the second capacitor. The demodulation circuit 222 demodulates the signal and restores it to a digital signal identical to the input signal and then outputs it.

[0071] It should be understood that the digital isolator in this embodiment may also include other structures, and the types, quantities, positional relationships, etc. of the specific other structures may be selected as needed and implemented according to the prior art, and should not be considered as a limitation to this embodiment.

[0072] Example 3

[0073] This embodiment provides a method for manufacturing an isolation structure of a digital isolator, wherein the manufacturing method is used to manufacture the isolation structure 1 in Embodiment 1, such as Figure 7 As shown, in this embodiment, the manufacturing method includes:

[0074] Step 301: Dispose a first insulating dielectric layer on each first top metal plate and a second insulating dielectric layer on each second top metal plate.

[0075] Step 302: fix the connector on the first insulating dielectric layer and the second insulating dielectric layer so that at least one first metal plate and the corresponding at least one second metal plate disposed at the bottom of the connector are placed on the corresponding first insulating dielectric layer and the corresponding second insulating dielectric layer respectively.

[0076] In other embodiments, step 301 may not be performed. In step 302, the first insulating medium and the second insulating medium are respectively fixed on at least one first metal plate and at least one corresponding second metal plate included in the connector. When used in a digital isolator, the connector fixed with the first insulating medium and the second insulating medium is directly placed on the corresponding first top metal plate and the corresponding second top metal plate. In this embodiment, there are two ways to make the connector. The first way is to make the connector including the first metal plate, the second metal plate and the connecting conductor by integral molding. The second way is to separately make the first metal plate, the second metal plate and the connecting conductor and then combine the first metal plate, the second metal plate and the connecting conductor into one body to form the connector.

[0077] When the first method is adopted, in a specific implementation manner, Figure 8 As shown, the method for manufacturing the connector includes:

[0078] Step 3021: Lay a metal plate on an insulating portion.

[0079] Step 3022: Etch the metal plate to form a first metal plate, a second metal plate, and a connecting conductor for connecting the first metal plate and the second metal plate.

[0080] The number of the etched first metal plates 106, second metal plates 107 and connecting conductors 105 can be determined according to the number of the first top metal plates 102 and the corresponding second top metal plates 202. Figure 5 or Figure 6 In the specific structure shown, in step 3022, three first metal plates 106, two second metal plates 107 and a connecting conductor 105 for connecting the first metal plate 106 and the second metal plate 107 are etched respectively.

[0081] In this embodiment, after step 3022, the insulating portion may be further removed, thereby simplifying the specific structure of the isolation device. It should be understood that the insulator may not be removed after step 3022, thereby increasing the overall pressure resistance of the isolation structure 1. The top perspective view of this method without removing the insulating portion is as shown in FIG. Figure 5 or Figure 6 shown.

[0082] When the second method is adopted, in a specific implementation manner, Fig. 9 As shown, the method for manufacturing the connector 10 includes:

[0083] Step 3121: Dispose a first metal plate and a second metal plate on the first insulating portion.

[0084] Step 3122: forming a receiving space in the second insulating portion according to the distance between the first top metal layer and the second top metal layer, and disposing a connecting conductor in the receiving space.

[0085] Step 3123: Invert the second insulating portion including the connecting conductor onto the first insulating portion to allow the first metal plate and the second metal plate to be electrically connected through the connecting conductor.

[0086] Similarly, this method can also be used to set multiple first metal plates 106 and corresponding second metal plates 107 and corresponding connecting conductors 105 according to actual needs.

[0087] This method may further include removing the first insulating portion and / or removing the second insulating portion after step 3123.

[0088] In another specific embodiment, Fig.10 As shown, the method for manufacturing the connector 10 may further include:

[0089] Step 3221: Form a receiving space in the second insulating part.

[0090] Step 3222: Arrange a first metal plate, a second metal plate, and a connecting conductor for connecting the first metal plate and the second metal plate in the accommodating space.

[0091] At least a portion of the first metal plate 106 and the second metal plate 107 is exposed to the outer surface of the second insulating portion.

[0092] Similarly, this method can also be used to set multiple first metal plates 106 and corresponding second metal plates 107 and corresponding connecting conductors 105 according to actual needs.

[0093] This method may further include removing the second insulating portion after step 3123 .

[0094] In this embodiment, a first capacitor can be formed by the first insulating medium arranged on the first top metal plate 102, the first metal plate 106 arranged in the connector 10, and the first top metal plate 102 of the structure of the transmitting chip 101 itself. A second capacitor can be formed by the second insulating medium layer arranged on the second top metal plate 202, the second metal plate 107 arranged in the connector 10, and the second top metal plate 202 of the structure of the receiving chip 201 itself. In this embodiment, the first capacitor and the second capacitor can be formed in the receiving chip 201 and the transmitting chip 101 without modifying the structure of the chip itself. In addition, by setting the connecting conductor 105 in the connector 10, conduction between the transmitting chip 101 and the receiving chip 201 can be achieved, so that the signal transmission between the transmitting chip 101 and the receiving chip 201 can be smoothly carried out while isolating the high voltage.

[0095] In this embodiment, when the receiving chip 201 and the transmitting chip 101 include a plurality of groups of correspondingly arranged first top metal plates 102 and second top metal plates 202, a corresponding first insulating dielectric layer can be arranged on each first top metal plate 102, a corresponding second insulating dielectric layer can be arranged on each second top metal plate 202, a plurality of groups of corresponding first metal plates 106 and second metal plates 107 can be arranged in the overall connector 10, and a connecting conductor 105 connecting each group of first metal plates 106 and second metal plates 107 can be arranged, and the connector 10 can be arranged as a whole on the receiving chip 201 and the transmitting chip 101 on which the first insulating dielectric layer and the second insulating dielectric layer are arranged. On the transmitting chip 101, the transmission of multiple signals between the transmitting chip 101 and the receiving chip can be realized. In this embodiment, when the transmitting chip 101 and the receiving chip need to perform multiple signal transmission, there is no need to perform separate wiring for each group of capacitors between the transmitting chip 101 and the receiving chip. The process of multiple signal transmission can be realized by setting the connecting body 10 as a whole on the transmitting chip 101 and the receiving chip 201. This not only reduces the complexity of the connection method through one-to-one wiring, reduces the complexity of the process of setting the isolation structure 1, and by setting the connecting body 10 in advance, the controllability of the setting method is improved, and the connection accuracy between the capacitors is also improved.

[0096] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. An isolation structure in a digital isolator, the digital isolator comprising a transmitting chip and a receiving chip, the transmitting chip comprising at least one first top metal plate, the receiving chip comprising at least one corresponding second top metal plate, characterized in that: The isolation structure includes a first insulating dielectric layer disposed on each of the first top metal plates and a second insulating dielectric layer disposed on each of the second top metal plates. The isolation structure also includes a connector, and the connector includes: At least one first metal plate and at least one corresponding second metal plate, wherein the at least one first metal plate is in contact with the corresponding first insulating medium layer, and the at least one second metal plate is in contact with the corresponding second insulating medium layer; The connector further comprises at least one connecting conductor connecting the first metal plate and the second metal plate which are arranged correspondingly, the first top metal plate and the corresponding first insulating medium layer and the corresponding first metal plate form a first capacitor structure, and the second top metal plate and the corresponding second insulating medium layer and the corresponding second metal plate form a second capacitor structure; The first metal plate has the same structural parameters as the first top metal; and / or, the second metal plate has the same structural parameters as the second top metal plate, and the structural parameters include at least one of size, shape and thickness; the first metal plate is aligned with the first top metal; and / or, the second metal plate is aligned with the second top metal plate.

2. The isolation structure according to claim 1, characterized in that: The connector also includes an insulating part, and the first metal plate, the second metal plate and the connecting conductor are all arranged on the surface of the insulating part; or, at least part of the first metal plate and the second metal plate are exposed to the outer surface of the insulating part, and the connecting conductor is embedded in the insulating part.

3. The isolation structure according to claim 1, characterized in that: The connecting conductor includes a metal film; and / or, The first insulating dielectric layer includes a polyimide film; and / or the second insulating dielectric layer includes a polyimide film.

4. A digital isolator, characterized in that: The digital isolator includes the isolation structure as described in any one of claims 1 to 3, and the digital isolator also includes a transmitting chip and a receiving chip.

5. The digital isolator according to claim 4, characterized in that The digital isolator further comprises a first packaging frame and a second packaging frame which are spaced apart from each other. The transmitting chip is mounted on the first packaging frame, and the receiving chip is mounted on the second packaging frame.

6. The digital isolator according to claim 5, characterized in that The digital isolator also includes a first wire and a second wire, the first wire connects the first packaging frame and the transmitting chip, the first wire is used to transmit an external digital signal to the transmitting chip, the second wire connects the second packaging frame and the transmitting chip, and the second wire is used to transmit the digital signal passing through the receiving chip to the outside.

7. The digital isolator according to claim 6, characterized in that The transmitting chip includes a modulation circuit, the first wire is used to transmit an external digital signal to the modulation circuit, the modulation circuit is used to modulate the digital signal, and send the modulated digital signal to the first capacitor; The receiving chip includes a demodulation circuit, which is used to receive the modulated digital signal from the second capacitor and demodulate the modulated digital signal. The second wire is used to transmit the demodulated digital signal to the outside.

8. A method for manufacturing an isolation structure of a digital isolator as claimed in any one of claims 1 to 3, characterized in that: The manufacturing method comprises: Disposing a first insulating dielectric layer on each first top metal plate and a second insulating dielectric layer on each second top metal plate; Fixing the connector on the first insulating medium and the second insulating medium so that at least one first metal plate and the corresponding at least one second metal plate included in the connector are placed on the corresponding first insulating medium and the corresponding second insulating medium respectively; or, The first insulating medium and the second insulating medium are respectively fixed on at least one first metal plate and at least one corresponding second metal plate included in the connector.

9. The method for manufacturing an isolation structure according to claim 8, characterized in that: The manufacturing method further comprises forming the connector by the following steps: The first metal plate, the second metal plate and the connecting conductor are manufactured by integral molding; or the first metal plate, the second metal plate and the connecting conductor are manufactured separately and then combined into one.

10. The method for manufacturing an isolation structure according to claim 9, characterized in that: The step of manufacturing the first metal plate, the second metal plate and the connecting conductor by integral molding comprises: Laying a metal plate on the insulating part; Etching the metal plate to form a connecting conductor connected to the first metal plate, the second metal plate, and the first metal plate and the second metal plate; The insulating portion is removed or retained; the distance between the first metal plate and the second metal plate is the same as the distance between the first top metal plate and the second top metal plate; or, The step of separately manufacturing the first metal plate, the second metal plate and the connecting conductor and then combining the first metal plate, the second metal plate and the connecting conductor into one body comprises: A first metal plate and a second metal plate are arranged on the first insulating portion, wherein the distance between the first metal plate and the second metal plate is the same as the distance between the first top metal plate and the second top metal plate; forming a receiving space in the second insulating portion according to the distance between the first top metal plate and the second top metal plate, and arranging a connecting conductor in the receiving space; combining the second insulating portion and the first insulating portion so that the first metal plate and the second metal plate are electrically connected through the connecting conductor; removing or retaining at least one of the first insulating portion and the second insulating portion; or, forming a receiving space in the insulating portion; The first metal plate, the second metal plate and a connecting conductor for connecting the first metal plate and the second metal plate are arranged in the accommodation space, and at least a portion of the first metal plate and the second metal plate is exposed to an outer surface of the insulating portion; The insulation is removed or retained.

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