Substrate processing system and method for replacing edge ring

Abstract

This invention provides a substrate processing system and a method for selectively replacing one or both of the two rings constituting an edge ring. An illustrated embodiment of the substrate processing system includes a processing unit, a transport arm, and a replacement unit. In the processing unit, the edge ring is lifted from a substrate support using at least one lifting mechanism. The edge ring includes a first ring and a second ring. The transport arm transports the edge ring between the processing unit and the replacement unit. In the replacement unit, one or both of the first and second rings of the edge ring can be replaced with replacement parts, thereby preparing a replaced edge ring. The replaced etched ring is transported between the replacement unit and the processing unit using the transport arm.

Description

Technical Field

[0001] The exemplary embodiments of the present invention relate to a substrate processing system and a method for replacing edge rings. Background Technology

[0002] Plasma treatment of the substrate is performed using a plasma treatment apparatus. During plasma treatment in the apparatus, the substrate is positioned on the substrate support with an edge ring attached, within the area surrounded by the edge ring. The edge ring is sometimes referred to as a focusing ring.

[0003] Patent document 1 below discloses a focusing ring composed of multiple rings. The multiple rings include a central ring and outer rings. The central ring can be raised and lowered to adjust the characteristics of plasma treatment at the edge of the substrate. The raising and lowering of the edge rings is performed using lifting pins.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-160666 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] People are requesting the ability to replace one or both of the edge rings, including the first ring and the second ring mounted on the first ring.

[0009] Technical solutions for solving technical problems

[0010] In one exemplary embodiment, a substrate processing system is provided. The substrate processing system includes a processing unit, a transport arm, a replacement unit, and a control unit. The processing unit includes a chamber, a substrate support, and at least one lifting mechanism. The substrate support supports an edge ring and supports a substrate disposed thereon within a region surrounded by the edge ring. The edge ring includes a first ring and a second ring. A second ring is mounted on the first ring. At least one lifting mechanism is capable of simultaneously lifting the first and second rings. The transport arm is capable of transporting the edge ring. The replacement unit is capable of replacing one or both of the first and second rings of the edge ring with corresponding replacement parts, thereby preparing a replaced edge ring therein. The control unit is capable of controlling at least one lifting mechanism and the transport arm. The control unit controls at least one lifting mechanism to lift the edge ring from the substrate support. The control unit controls the transport arm to transport the edge ring lifted by the at least one lifting mechanism between the processing unit and the replacement unit. The control unit controls the transport arm to transport the replaced edge ring prepared within the replacement unit between the replacement unit and the processing unit.

[0011] Invention Effects

[0012] According to one exemplary embodiment, one or both of the edge rings, including the first ring and the second ring mounted on the first ring, can be replaced. Attached Figure Description

[0013] Figure 1 This is a diagram illustrating a substrate processing system of an exemplary implementation.

[0014] Figure 2 This is a diagram that schematically illustrates a plasma processing apparatus of an exemplary embodiment.

[0015] Figure 3 This is a diagram that schematically illustrates a substrate support of an exemplary embodiment.

[0016] Figure 4 This is a partial enlarged view of a substrate support according to an exemplary embodiment.

[0017] Figure 5 This is a partially enlarged cross-sectional view of the edge ring of an exemplary embodiment.

[0018] Figure 6 This is a partial enlarged view of a substrate support according to an exemplary embodiment.

[0019] Figure 7 This is a partial enlarged view of a substrate support according to an exemplary embodiment.

[0020] Figure 8 This is a partial enlarged view of a substrate support according to an exemplary embodiment.

[0021] Figure 9 This is a flowchart illustrating an exemplary implementation of a method for replacing an edge ring.

[0022] Figure 10 (a) and Figure 10 (b) are diagrams illustrating a replacement unit in an exemplary implementation.

[0023] Figure 11 This is a flowchart illustrating another embodiment of a method for replacing the edge ring.

[0024] Figure 12 of (a), Figure 12 (b) and Figure 12 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0025] Figure 13 of (a), Figure 13 (b) and Figure 13 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0026] Figure 14 of (a), Figure 14 (b) and Figure 14 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0027] Figure 15 This is a flowchart illustrating another embodiment of a method for replacing the edge ring.

[0028] Figure 16 of (a), Figure 16 (b) and Figure 16 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0029] Figure 17 of (a), Figure 17 (b) and Figure 17 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0030] Figure 18 of (a), Figure 18 (b) and Figure 18 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0031] Figure 19 of (a), Figure 19 (b) and Figure 19 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0032] Figure 20 (a) and Figure 20 (b) are diagrams illustrating the replacement unit of another illustrative implementation.

[0033] Figure 21 of (a), Figure 21 (b) and Figure 21 (c) are diagrams illustrating the replacement unit of another illustrative embodiment.

[0034] Figure 22 (a) and Figure 22 (b) are diagrams illustrating the replacement unit of another illustrative implementation.

[0035] Figure 23 This is a diagram illustrating a substrate processing system of another exemplary embodiment.

[0036] Figure 24 This is a diagram illustrating a substrate processing system of yet another exemplary embodiment.

[0037] Figure 25This is a flowchart illustrating yet another exemplary implementation of a method for replacing the edge ring.

[0038] Figure 26 of (a), Figure 26 (b) and Figure 26 (c) are diagrams representing alternative units in yet another illustrative implementation.

[0039] Figure 27 (a) and Figure 27 (b) are diagrams showing the first and second storage areas set on the loading port, respectively. Figure 27 (c) is a diagram showing a replacement unit in yet another exemplary implementation.

[0040] Figure 28 of (a), Figure 28 (b) and Figure 28 (c) are diagrams representing alternative units in yet another illustrative implementation.

[0041] Figure 29 This is a diagram illustrating a substrate processing system of yet another exemplary embodiment.

[0042] Explanation of reference numerals in the attached figures

[0043] SA……System; PM……Processing unit; 10……Cavity; 16……Substrate support; 70……Lifting mechanism; 22……Edge ring; 211……First ring; 222……Second ring; 22R……Edge ring; RM……Change unit; TR……Conveyor arm. Detailed Implementation

[0044] The following describes various illustrative implementation methods.

[0045] In one exemplary embodiment, a substrate processing system is provided. The substrate processing system includes a processing unit, a transport arm, a replacement unit, and a control unit. The processing unit includes a chamber, a substrate support, and at least one lifting mechanism. The substrate support supports an edge ring and supports a substrate disposed thereon within a region surrounded by the edge ring. The edge ring includes a first ring and a second ring. A second ring is mounted on the first ring. At least one lifting mechanism is capable of simultaneously lifting the first and second rings. The transport arm is capable of transporting the edge ring. The replacement unit is capable of replacing one or both of the first and second rings of the edge ring with corresponding replacement parts, thereby preparing a replaced edge ring therein. The control unit is capable of controlling at least one lifting mechanism and the transport arm. The control unit controls at least one lifting mechanism to lift the edge ring from the substrate support. The control unit controls the transport arm to transport the edge ring lifted by the at least one lifting mechanism between the processing unit and the replacement unit. The control unit controls the transport arm to transport the replaced edge ring prepared within the replacement unit between the replacement unit and the processing unit.

[0046] According to the above embodiment, the first ring and the second ring are transported from the processing unit to the replacement unit. Therefore, one or both of the first ring and the second ring constituting the edge ring can be replaced within the replacement unit.

[0047] In one exemplary embodiment, the substrate processing system further includes a transport unit. The transport unit is connected between the processing unit and the replacement unit. The transport unit can use a transport arm to transport the edge ring through the interior of a depressurized chamber.

[0048] In one exemplary embodiment, the substrate processing system may also include a load locking unit, a loading unit, and a loading port. The load locking unit is connected to the transport unit. The load locking unit may provide a pre-decompression chamber. The loading unit can transport the edge ring via the interior of a housing set to atmospheric pressure. The loading port is connected to the loading unit. Alternatively, the replacement unit may have an additional lifting mechanism for raising the second ring relative to the first ring. In this embodiment, the control unit controls the additional lifting mechanism to raise the second ring, which is being transported to the replacement unit, relative to the first ring of the edge ring. The control unit controls the transport arm to transport the second ring, raised by the additional lifting mechanism, to the load locking unit. The control unit controls the loading unit to transport the second ring, which is being transported to the load locking unit, to the loading port. The control unit controls the transport arm to transport the replaced edge ring, prepared within the replacement unit to replace the second ring with a corresponding replacement part, between the replacement unit and the processing unit.

[0049] In one exemplary embodiment, the replacement unit may also have an additional lifting mechanism, a first storage area, and a second storage area. The additional lifting mechanism is capable of raising the second ring relative to the first ring. The first storage area is a region in which the second ring contained in the edge ring conveyed from the processing unit is stored. The second storage area is a region in which the replacement part for replacing the second ring is stored. In this embodiment, the control unit controls the additional lifting mechanism to raise the second ring of the edge ring conveyed to the replacement unit relative to the first ring of the edge ring. The control unit controls the conveyor arm to store the second ring raised by the additional lifting mechanism in the first storage area. The control unit controls the conveyor arm to convey the replaced edge ring, which includes the first ring of the edge ring conveyed to the replacement unit and the replacement part removed from the second storage area, between the replacement unit and the processing unit.

[0050] In one exemplary embodiment, the replacement unit may be directly connected to the processing unit. In another exemplary embodiment, the replacement unit may have an additional lifting mechanism, a first storage area, and a second storage area. The additional lifting mechanism is capable of raising the second ring relative to the first ring. The first storage area is a region in which the second ring contained in the edge ring conveyed from the processing unit is stored. The second storage area is a region in which the replacement part for replacing the second ring is stored. In this embodiment, the control unit controls the additional lifting mechanism to raise the second ring of the edge ring conveyed to the replacement unit relative to the first ring of the edge ring. The control unit controls the conveyor arm to store the second ring raised by the additional lifting mechanism within the first storage area. The control unit controls the conveyor arm to convey the replaced edge ring, which includes the first ring of the edge ring conveyed to the replacement unit and the replacement part removed from the second storage area, between the replacement unit and the processing unit.

[0051] In one exemplary embodiment, the replacement unit may also have a third storage area and a fourth storage area. The third storage area is the area in which the first ring contained in the edge ring conveyed from the processing unit is stored. The fourth storage area is the area in which the replacement part, which replaces the first ring, is stored. In this embodiment, the control unit controls other lifting mechanisms to raise the second ring of the edge ring conveyed to the replacement unit relative to the first ring of the edge ring. The control unit controls the conveying arm to store the second ring, raised by the other lifting mechanisms, in the first storage area. The control unit controls the conveying arm to store the first ring of the edge ring conveyed to the replacement unit in the third storage area. The control unit controls the conveying arm to convey the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring includes the replacement part removed from the fourth storage area and the second ring stored in the first storage area or the replacement part removed from the second storage area.

[0052] In one exemplary embodiment, the substrate processing system may also include a loading unit and a loading port. The loading unit can transport the edge ring via the interior of a housing set to atmospheric pressure. The loading port is connected to the loading unit. Alternatively, the replacement unit may be a load locking unit connected to the transport unit. The replacement unit may have additional lifting mechanisms to raise the second ring relative to the first ring. The loading port is provided with a first storage area and a second storage area. The first storage area is the area in which the second ring from the edge ring transported from the processing unit is stored. The second storage area is the area in which a replacement part for replacing the second ring is stored. In this embodiment, the control unit controls the additional lifting mechanisms to raise the second ring of the edge ring transported to the replacement unit relative to the first ring of that edge ring. The control unit controls the loading unit to store the second ring raised by the additional lifting mechanisms in the first storage area. The control unit controls the loading unit to transport the replacement part from the second storage area to the replacement unit. The control unit controls the conveyor arm to convey the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring includes a first ring of the edge ring conveyed to the replacement unit and a replacement part conveyed from the second storage area.

[0053] In one exemplary embodiment, the substrate processing system may also include a load locking unit and a loading unit. The load locking unit is connected to the transport unit. The loading unit can transport the edge ring via the interior of a housing set to atmospheric pressure. Alternatively, a replacement unit may be connected to the loading unit. Alternatively, the replacement unit may have additional lifting mechanisms, a first storage area, and a second storage area. The additional lifting mechanisms can lift the second ring relative to the first ring. The first storage area is the area in which the second ring contained in the edge ring transported from the processing unit is stored. The second storage area is the area in which a replacement part for replacing the second ring is stored. In this embodiment, the control unit controls the additional lifting mechanisms to lift the second ring of the edge ring transported to the replacement unit relative to the first ring of the edge ring. The control unit controls the loading unit to store the second ring, which has been lifted by the additional lifting mechanisms, in the first storage area. The control unit controls the transport arm to transport the replaced edge ring, which includes the first ring of the edge ring transported to the replacement unit and the replacement part transported from the second storage area, between the replacement unit and the processing unit.

[0054] In another exemplary embodiment, a method for replacing an edge ring is provided. The method includes the step of lifting an edge ring comprising a first ring and a second ring from a substrate support within a processing unit chamber using at least one lifting mechanism. The method further includes the step of conveying the edge ring lifted by the at least one lifting mechanism between the processing unit and a replacement unit using a conveying arm. The method also includes the step of preparing a replaced edge ring by replacing one or both of the first and second rings of the edge ring with corresponding replacement parts within the replacement unit. The method further includes the step of conveying the replaced edge ring between the replacement unit and the processing unit using a conveying arm.

[0055] Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings. Furthermore, the same or corresponding parts will be labeled with the same reference numerals in each drawing.

[0056] Figure 1 This is a diagram illustrating a substrate processing system of an exemplary implementation. Figure 1 The substrate processing system shown (hereinafter referred to as "System SA") includes one or more processing units, a transport arm TR, a changeover unit RM, and a control unit MC. System SA may also include one or more loading ports, a loading unit, one or more load locking units, and a transport unit TM. In the illustrated example, System SA includes three processing units PM1, PM2, and PM3, four loading ports LP1, LP2, LP3, and LP4, and two load locking units LL1 and LL2. Furthermore, the number of loading ports, load locking units, and processing units in System SA can be arbitrary.

[0057] Loading ports LP1 to LP4 are each arranged along one side of the loading unit LM. Each loading port LP1 to LP4 is configured to support a substrate storage container mounted thereon. The substrate storage container may be, for example, a FOUP (Front Opening Unified Pod). Loading ports LP1 to LP4 are connected to the loading unit LM.

[0058] The loading unit LM has a housing. The pressure inside the housing of the loading unit LM is set to atmospheric pressure. The loading unit LM also has a conveying arm LMR. The conveying arm LMR is, for example, a multi-joint arm, controlled by the control unit MC. The conveying arm LMR is configured to convey substrates between each of the substrate storage containers mounted on the loading ports LP1 to LP4 and each of the load locking units LL1 to LL2.

[0059] Both load locking units LL1 and LL2 are located between the loading unit LM and the conveying unit TM. Each load locking unit LL1 and LL2 is connected to the loading unit LM via a gate valve. Each load locking unit LL1 and LL2 provides a pre-pressure reduction chamber. Each load locking unit LL1 and LL2 is connected to the conveying unit TM via a gate valve.

[0060] The transport unit TM has a decompression-capable chamber. The transport unit TM also has a transport arm TMR. The transport arm TMR is, for example, a multi-joint robotic arm, controlled by the control unit MC. The transport arm TMR is configured to transport substrates between each of the load locking units LL1-LL2 and each of the processing units PM1-PM3, and between any two processing units among PM1-PM3. Substrates can be transported between each of the load locking units LL1-LL2 and each of the processing units PM1-PM3 solely through the decompression-capable space. Furthermore, substrates can be transported between any two processing units PM1-PM3 solely through the decompression-capable space.

[0061] Processing units PM1 to PM3 are connected to the transport unit TM. Processing units PM1 to PM3 are substrate processing devices capable of performing dedicated substrate processing. More than one of the processing units PM1 to PM3 can be plasma processing devices.

[0062] The replacement unit RM is connected to the transport unit TM. That is, the transport unit TM is connected between each of the processing units PM1 to PM3 and the replacement unit RM. In one embodiment, the transport arm TMR of the transport unit TM functions as the transport arm TR between the processing units (PM1 to PM3) which are plasma processing devices, and the replacement unit RM. The replacement unit RM is capable of replacing one or both of the first and second rings of the edge ring with corresponding replacement parts, thereby preparing the replaced edge ring.

[0063] The control unit (MC) is configured to control all parts of the system SA. The control unit (MC) is configured to control, for example, the transport arm LMR, the transport arm TMR, and the lifting mechanism of the processing unit (described later) of the system SA. The control unit (MC) can be a computer equipped with a processor, a storage unit such as flash memory, an input device, a display device, and signal input / output interfaces. The control program and scheme data are stored in the storage unit of the control unit (MC). Regarding the control program, the processor of the control unit (MC) executes the control program and controls all parts of the system SA according to the scheme data. Therefore, the methods of the various embodiments described later can be executed.

[0064] Below, refer to Figure 2 . Figure 2 This is a diagram that schematically illustrates a plasma processing apparatus according to an exemplary embodiment. Figure 2 In the image, the plasma processing device is shown as if it has been partially cut open. Figure 2 The plasma processing apparatus 1 shown can be used as any one of the processing units PM1 to PM3 of system SA. The plasma processing apparatus 1 is a capacitively coupled plasma processing apparatus. The plasma processing apparatus 1 includes a chamber 10. The chamber 10 provides an internal space 10s therein. The central axis of the internal space 10s is an axis AX extending in the vertical direction.

[0065] In one embodiment, the chamber 10 includes a chamber body 12. The chamber body 12 has a generally cylindrical shape. An internal space 10s is provided within the chamber body 12. The chamber body 12 is made of, for example, aluminum. The chamber body 12 is electrically grounded. A plasma-resistant membrane is formed on the inner wall surface of the chamber body 12, i.e., the wall surface defining the internal space 10s. This membrane may be a ceramic membrane formed by anodizing or formed of yttrium oxide.

[0066] A passage 12p is formed on the side wall of the chamber body 12. When the substrate W is transported between the internal space 10s and the outside of the chamber 10, the substrate W passes through the passage 12p. In order to open and close the passage 12p, a gate valve 12g is provided along the side wall of the chamber body 12.

[0067] The plasma processing apparatus 1 also includes a substrate support 16. Referring below... Figure 2 , Figure 3 and Figure 4 . Figure 3 This is a diagram that schematically illustrates a substrate support of an exemplary embodiment. Figure 4 This is a partially enlarged view of a substrate support according to an exemplary embodiment. Figure 4 In the diagram, the substrate support is shown partially cut open. The substrate support 16 is configured to support the substrate W placed thereon within the chamber 10. The substrate W has a generally disc-shaped form. The substrate support 16 is supported by a support portion 17. The support portion 17 extends upward from the bottom of the chamber 10. The support portion 17 has a generally cylindrical shape. The support portion 17 is formed of an insulating material such as quartz.

[0068] The substrate support 16 has a first region 161 and a second region 162. The first region 161 is configured to support the substrate W placed thereon. The first region 161 is a generally circular region when viewed from above. The central axis of the first region 161 is axis AX. In one embodiment, the first region 161 includes a base 18 and an electrostatic chuck 20. In one embodiment, the first region 161 may be formed by a portion of the base 18 and a portion of the electrostatic chuck 20. The base 18 and the electrostatic chuck 20 are disposed in the chamber 10. The base 18 is formed of a conductive material such as aluminum and has a generally disk-shaped form. The base 18 constitutes the lower electrode.

[0069] A flow path 18f is formed within the base 18. Flow path 18f is for the heat exchange medium. As the heat exchange medium, a liquid cooling medium or a cooling medium that cools the base 18 by vaporization (e.g., Freon) can be used. A supply device (e.g., a cooling device) for the heat exchange medium is connected to the flow path 18f. This supply device is located outside the chamber 10. The heat exchange medium is supplied to the flow path 18f from the supply device. The heat exchange medium supplied to the flow path 18f returns to the supply device.

[0070] An electrostatic chuck 20 is disposed on a base 18. When the substrate W is processed within the chamber 10, it is placed on the first region 161 and on the electrostatic chuck 20.

[0071] The second region 162 extends radially outward relative to the first region 161, surrounding the first region 161. The second region 162 is generally annular in plan view. An edge ring 22 is mounted on the second region 162. In one embodiment, the second region 162 may include a base 18. The second region 162 may also include an electrostatic chuck 20. In one embodiment, the second region 162 may be formed by other portions of the base 18 and other portions of the electrostatic chuck 20. The substrate W is placed on the region surrounded by the edge ring 22 and on the electrostatic chuck 20. Details of the edge ring 22 are described later.

[0072] A through hole 162h is formed in the second region 162. The through hole 162h is formed in the second region 162 in a manner that extends in the vertical direction. In one embodiment, a plurality of through holes 162h are formed in the second region 162. The number of through holes 162h may be the same as the number of lifting pins 72 of the lifting mechanism 70 described later. Each through hole 162h and its corresponding lifting pin 72 are arranged in a straight line.

[0073] The electrostatic chuck 20 has a body 20m and an electrode 20e. The body 20m is formed of a dielectric such as aluminum oxide or aluminum nitride. The body 20m has a generally disc-shaped form. The central axis of the electrostatic chuck 20 is axis AX. The electrode 20e is disposed within the body 20m. The electrode 20e has a thin film shape. The electrode 20e is electrically connected to a DC power supply via a switch. When a voltage from the DC power supply is applied to the electrode 20e, an electrostatic attraction is generated between the electrostatic chuck 20 and the substrate W. Using the generated electrostatic attraction, the substrate W is attracted to the electrostatic chuck 20 and held by the electrostatic chuck 20.

[0074] The plasma processing apparatus 1 may also have a gas supply line 25. The gas supply line 25 supplies a heat-conducting gas, such as He gas, from the gas supply mechanism to the gap between the upper surface of the electrostatic chuck 20 and the back (lower surface) of the substrate W.

[0075] The plasma processing apparatus 1 may further include an outer peripheral component 27. The outer peripheral component 27 extends radially outward in the circumferential direction relative to the substrate support 16, surrounding it. The outer peripheral component 27 may also extend radially outward in the circumferential direction relative to the support portion 17, surrounding it. The outer peripheral component 27 may be composed of more than one component. The outer peripheral component 27 may be formed of an insulator such as quartz.

[0076] The plasma processing apparatus 1 also includes an upper electrode 30. The upper electrode 30 is disposed above the substrate support 16. The upper electrode 30, together with component 32, seals the upper opening of the chamber body 12. Component 32 is insulating. The upper electrode 30 is supported above the chamber body 12 via component 32.

[0077] The upper electrode 30 includes a top plate 34 and a support 36. The lower surface of the top plate 34 defines an internal space 10s. A plurality of gas release holes 34a are formed on the top plate 34. Each of the plurality of gas release holes 34a penetrates the top plate 34 in the thickness direction (vertical direction). The top plate 34 is not limited, for example, it is formed of silicon. Alternatively, the top plate 34 may have a structure in which a plasma-resistant film is formed on the surface of an aluminum component. This film may be a ceramic film formed by anodizing or a film formed of yttrium oxide.

[0078] The support body 36 supports the top plate 34 in a detachable manner. The support body 36 is formed of a conductive material, such as aluminum. A gas diffusion chamber 36a is formed inside the support body 36. A plurality of gas holes 36b extend downward from the gas diffusion chamber 36a. The plurality of gas holes 36b are connected to a plurality of gas release holes 34a respectively. A gas inlet 36c is formed in the support body 36. The gas inlet 36c is connected to the gas diffusion chamber 36a. The gas inlet 36c is connected to the gas supply pipe 38.

[0079] Gas supply pipe 38 is connected to gas source group 40 via valve group 41, flow controller group 42, and valve group 43. Gas source group 40, valve group 41, flow controller group 42, and valve group 43 constitute gas supply unit GS. Gas source group 40 includes multiple gas sources. Valve group 41 and valve group 43 each include multiple valves (e.g., on / off valves). Flow controller group 42 includes multiple flow controllers. Each of the multiple flow controllers in flow controller group 42 is a mass flow controller or a pressure-controlled flow controller. Each of the multiple gas sources in gas source group 40 is connected to gas supply pipe 38 via a corresponding on / off valve in valve group 41, a corresponding flow controller in flow controller group 42, and a corresponding on / off valve in valve group 43. The plasma processing device 1 can supply gas from one or more gas sources selected from the multiple gas sources in gas source group 40 to the internal space at an individually adjusted flow rate for 10 seconds.

[0080] A baffle 48 is provided between the substrate support 16 or the outer peripheral component 27 and the side wall of the chamber 10. The baffle 48 can be constructed, for example, by covering an aluminum component with a ceramic such as yttrium oxide. Multiple through holes are formed in the baffle 48. Below the baffle 48, an exhaust pipe 52 is connected to the bottom of the chamber 10. This exhaust pipe 52 is connected to an exhaust device 50. The exhaust device 50 has a pressure controller such as an automatic pressure control valve and a vacuum pump such as a turbomolecular pump, capable of reducing the pressure in the internal space 10s.

[0081] The plasma processing apparatus 1 also includes a high-frequency power supply 61. The high-frequency power supply 61 is a power source that generates high-frequency electrical power (hereinafter referred to as "first high-frequency electrical power"). The first high-frequency electrical power is used to generate plasma from the gas within the chamber 10. The first high-frequency electrical power has a first frequency. The first frequency is a frequency in the range of 27 to 100 MHz. The high-frequency power supply 61 is connected to the upper electrode 30 via a matching circuit 61m. The matching circuit 61m is configured to match the output impedance of the high-frequency power supply 61 with the impedance of the load side (the upper electrode 30 side). Alternatively, the high-frequency power supply 61 may be connected to the base 18 (i.e., the lower electrode) via the matching circuit 61m without going through the upper electrode 30.

[0082] The plasma processing apparatus 1 also includes a high-frequency power supply 62. The high-frequency power supply 62 is a power source that generates high-frequency electrical power (hereinafter referred to as "second high-frequency electrical power") for attracting ions from the plasma to the substrate W. The second high-frequency electrical power has a second frequency. The second frequency is lower than the first frequency. The second frequency is, for example, a frequency in the range of 400 kHz to 13.56 MHz. The high-frequency power supply 62 is connected to the base 18 (i.e., the lower electrode) via a matching circuit 62m. The matching circuit 62m matches the output impedance of the high-frequency power supply 62 with the impedance on the load side (base 18 side).

[0083] Below, refer to Figures 2-4 and Figure 5 The edge ring 22 and the substrate support 16 are described in more detail. Figure 5 This is a partially enlarged cross-sectional view of an edge ring in an exemplary embodiment. The edge ring 22 includes a first ring 221 and a second ring 222. Figure 5 The image shows the state in which the first ring 221 and the second ring 222 are separated from each other.

[0084] The first ring 221 and the second ring 222 are each ring-shaped components. The first ring 221 and the second ring 222 are each formed of a material appropriately selected according to the plasma processing performed in the plasma processing apparatus 1. The first ring 221 and the second ring 222 are each formed of, for example, silicon or silicon carbide.

[0085] The first ring 221 is mounted on the second region 162 with its central axis located on axis AX. In one embodiment, the first ring 221 can be mounted on both the second region 162 and the electrostatic chuck 20. Alternatively, the first ring 221 can also be mounted on a component other than the electrostatic chuck 20 in the second region 162. In one embodiment, such as... Figure 5 As shown, the first ring 221 includes an inner peripheral region 221i, a mounting region 221m, and an outer peripheral region 221o. The inner peripheral region 221i, the mounting region 221m, and the outer peripheral region 221o are each annular regions extending around the central axis of the first ring 221.

[0086] like Figures 2-4 As shown, the inner peripheral region 221i is located near the central axis of the first ring 221, closer to the mounting region 221m and the outer peripheral region 221o, and extends circumferentially. The outer peripheral region 221o extends radially outward relative to the inner peripheral region 221i and the mounting region 221m. With the substrate W placed on the electrostatic chuck 20, the edge of the substrate W extends on or above the inner peripheral region 221i. The outer peripheral region 221o is spaced radially outward relative to the edge of the substrate W.

[0087] The mounting region 221m extends circumferentially between the inner peripheral region 221i and the outer peripheral region 221o. A through hole 221h is formed in the mounting region 221m. The through hole 221h is formed in the mounting region 221m in a vertically extending manner. In one embodiment, a plurality of through holes 221h are formed in the mounting region 221m. The number of through holes 221h may be the same as the number of lifting pins 72 of the lifting mechanism 70.

[0088] Each through hole 221h has a size into which the first columnar portion 721 of the corresponding lifting pin 72 (described later) cannot be inserted, but into which the second columnar portion 722 of the corresponding lifting pin 72 (described later) can be inserted. When each through hole 221h has a cylindrical shape for both the first columnar portion 721 and the second columnar portion 722, it has a diameter smaller than that of the first columnar portion 721 and slightly larger than that of the second columnar portion 722 (or the first portion 722a described later). The first ring 221 is arranged on the second region 162 such that each through hole 221h and the corresponding lifting pin 72 are aligned in a straight line.

[0089] The upper surface of the mounting region 221m extends at a lower position in the height direction compared to the upper surfaces of the inner peripheral region 221i and the outer peripheral region 221o. Therefore, the first ring 221 forms a recess in the mounting region 221m. The second ring 222 is mounted on the mounting region 221m in a manner that it is embedded within the recess. With the substrate W placed on the electrostatic chuck 20, the inner peripheral surface of the second ring 222 faces the end face of the substrate W.

[0090] The lower surface of the second ring 222 is generally flat. In one embodiment, Figure 5 As shown, the lower surface of the second ring 222 also includes a tapered surface that forms a recess 222r. In one embodiment, the lower surface of the second ring 222 forms a plurality of recesses 222r. The number of tapered surfaces and recesses 222r of the second ring 222 can be the same as the number of lifting pins 72 of the lifting mechanism 70. Each recess 222r has a size in which the front end of the second columnar portion 722 of the corresponding lifting pin 72 is inserted. The second ring 222 is arranged on the mounting area 221m such that each recess 222r, the corresponding lifting pin 72, and the corresponding through hole 221h are arranged in a straight line.

[0091] like Figures 2-4 As shown, the substrate support 16 also has a lifting mechanism 70. The lifting mechanism 70 includes lifting pins 72, enabling the first ring 221 and the second ring 222 to rise and fall. In one embodiment, the lifting mechanism 70 includes a plurality of lifting pins 72. The number of lifting pins 72 in the lifting mechanism 70 is arbitrary, as long as it can support the edge ring 22 and allow it to rise and fall. For example, the lifting mechanism 70 may have three lifting pins 72.

[0092] Each lifting pin 72 can be formed of an insulating material. For example, each lifting pin 72 can be formed of sapphire, alumina, quartz, silicon nitride, aluminum nitride, or resin. Each lifting pin 72 includes a first columnar portion 721 and a second columnar portion 722. The first columnar portion 721 extends in the vertical direction. The first columnar portion 721 has a first upper end face 721t. The first upper end face 721t is capable of abutting against the lower surface of the first ring 221.

[0093] The second columnar portion 722 extends vertically above the first columnar portion 721. The second columnar portion 722 is narrower than the first columnar portion 721 in such a way that the first upper end face 721t is exposed. In one embodiment, the first columnar portion 721 and the second columnar portion 722 each have a cylindrical shape. In this embodiment, the diameter of the first columnar portion 721 is larger than the diameter of the second columnar portion 722. The second columnar portion 722 can move vertically through the through hole 221h in the mounting region 221m. The vertical length of the second columnar portion 722 is greater than the vertical thickness of the mounting region 221m.

[0094] The second columnar portion 722 has a second upper end face 722t. The second upper end face 722t can abut against the second ring 222. In one embodiment, the front end of the second columnar portion 722 including the second upper end face 722t can be formed into a cone shape to fit into the corresponding recess 222r.

[0095] In one embodiment, the second columnar portion 722 may include a first portion 722a and a second portion 722b. The first portion 722a is formed in a columnar shape and extends upward from the first columnar portion 721. The second portion 722b is formed in a columnar shape and extends above the first portion 722a. The second portion 722b provides a second upper end face 722t. In this embodiment, the width of the first portion 722a is greater than the width of the second portion 722b.

[0096] In one embodiment, the first columnar portion 721, the first portion 722a, and the second portion 722b may each have a cylindrical shape. In this embodiment, the diameter of the first columnar portion 721 is larger than the diameter of the first portion 722a, and the diameter of the first portion 722a is larger than the diameter of the second portion 722b.

[0097] In one embodiment, the second columnar portion 722 may further include a third portion 722c. The third portion 722c extends between the first portion 721a and the second portion 722b. In this embodiment, the third portion 722c has a tapered surface.

[0098] In one embodiment, the lifting mechanism 70 includes one or more drive devices 74. The one or more drive devices 74 are configured to lift and lower a plurality of lifting pins 72. Each of the one or more drive devices 74 may include, for example, a motor.

[0099] In one implementation, such as Figure 3 As shown, the plasma processing apparatus 1 may further include another gas supply unit 76. The gas supply unit 76 supplies gas to each through-hole 162h to prevent discharge within each through-hole 162h. The gas supplied from the gas supply unit 76 to each through-hole 162h is an inactive gas. For example, the gas supplied from the gas supply unit 76 to each through-hole 162h is helium.

[0100] Below, refer to Figures 6-8 . Figures 6-8 Each is a partial enlarged view of a substrate support according to an exemplary embodiment. Figures 6-8 In the figures, the substrate support is shown as partially cut open. Figure 6 The image shows a configuration where only the second ring 222 is positioned above the substrate support 16. Figure 7 The image shows the first ring 221 and the second ring 222 positioned above the substrate support 16. Figure 8 The image shows the state in which the first ring 221 and the second ring 222 are transferred from the lifting pin 72 of the lifting mechanism 70 to the conveying arm.

[0101] like Figure 6 As shown, according to the substrate support 16, the lifting mechanism 70 can be used to raise or lower only the second ring 222, which is abutted by the second upper end face 722t of each lifting pin 72, even when the first upper end face 721t of each lifting pin 72 is not abutting the first ring 221. By adjusting only the height direction position of the second ring 222 using the lifting mechanism 70, the height direction position of the boundary between the plasma and the sheath can be adjusted. As a result, the characteristics of plasma treatment at the edge of the substrate W can be adjusted.

[0102] In one embodiment, the second ring 222 is disposed within a recess in the mounting region 221m. According to this embodiment, the alignment accuracy of the second ring 222 relative to the first ring 221 and the substrate support 16 is improved.

[0103] In one embodiment, with the front end of the second columnar portion 722 of each lifting pin 72 embedded in the corresponding recess 222r of the second ring 222, the second ring 222 is supported by each lifting pin 72. Therefore, movement of the second ring 222 relative to each lifting pin 72 within the horizontal plane can be suppressed. Consequently, the alignment accuracy of the second ring 222 relative to each lifting pin 72 becomes higher, resulting in higher alignment accuracy between the first ring 221 and the second ring 222 on the substrate support 16.

[0104] When the plurality of lifting pins 72 supporting the second ring 222 are moved further upward, the first upper end face 721t of each lifting pin 72 abuts against the first ring 221. That is, when the plurality of lifting pins 72 are moved further upward, a state is formed in which the first upper end face 721t abuts against the first ring 221 and the second upper end face 722t abuts against the second ring 222. In this state, as Figure 7 As shown, the first ring 221 and the second ring 222 can be raised and lowered simultaneously above the substrate support 16 via the lifting mechanism 70. Therefore, according to the substrate support 16, it is possible to raise and lower only one of the two rings constituting the edge ring 22 and to raise and lower both rings simultaneously using a smaller number of lifting pins 72.

[0105] Then as Figure 8 As shown, when the handler of the conveyor arm TMR is moved below the edge ring 22, causing the plurality of lifting pins 72 to move downwards, the edge ring 22 can be transferred from the plurality of lifting pins 72 to the handler of the conveyor arm TMR. Afterwards, the edge ring 22 can be conveyed out of the chamber 10 using the conveyor arm TMR. Subsequently, the edge ring 22, whose first ring 221 and second ring 222 have been replaced with unused parts, can be conveyed into the chamber 10 using the conveyor arm TMR, and the lifting mechanism 70 positions the edge ring 22 on the second region 162.

[0106] In one embodiment, as described above, the second columnar portion 722 of each lifting pin 72 has a first portion 722a and a second portion 722b. The first portion 722a extends upward from the first columnar portion 721 and has a width greater than the width of the second portion 722b. In this embodiment, as... Figure 7 As shown, the first ring 221 is partially disposed in the through hole 221h in the first portion 722a and is supported by each lifting pin 72. The first portion 722a is the part with a relatively large width in the second columnar portion 722. Therefore, movement of the first ring 221 relative to each lifting pin 72 in the horizontal plane can be suppressed. As a result, the positioning accuracy of the first ring 221 on the substrate support 16 is improved.

[0107] The following describes a method for replacing the edge ring performed in a substrate processing system according to various illustrated embodiments. In the following description, along with the method for replacing the edge ring in the various illustrated embodiments, the control of each part of the substrate processing system performed by the control unit MC will also be explained.

[0108] Figure 9 This is a flowchart illustrating an exemplary implementation of a method for replacing an edge ring. Figure 9 The method shown, MT1, is capable of having RM as a replacement unit. Figure 10 (a) and Figure 10 The replacement unit RM1 shown in (b) is executed in the system SA. Figure 10 (a) and Figure 10 Figures (b) show the replacement units of an exemplary embodiment. In the following description, the processing unit PM3 of system SA will be referred to as plasma processing apparatus 1, i.e., processing unit PM. Furthermore, one or more of the processing units PM1 to PM3 may each be a processing unit PM.

[0109] like Figure 10 (a) and Figure 10 As shown in (b), the replacement unit RM1 includes a chamber CH1 providing regions SR11 and SR12. One or more support bodies SP11 are provided within region SR11. In the illustrated example, two support bodies SP11 are provided within region SR11. The two support bodies SP11 are arranged vertically. Each support body SP11 is configured to support the edge ring 22 conveyed from the processing unit PM.

[0110] One or more support bodies SP12 are provided within region SR12. In the illustrated example, two support bodies SP12 are provided within region SR12. The two support bodies SP12 are arranged vertically. Each support body SP12 is configured to support an edge ring 22R, which is a replacement part to be replaced with the edge ring 22 of the processing unit PM. The edge ring 22R may be an unused edge ring. The edge ring 22R includes a first ring 221 and a second ring 222.

[0111] like Figure 9 As shown, method MT1 begins in step ST11. In step ST11, as... Figure 7 As shown, the edge ring 22 is lifted from the substrate support 16 within the chamber 10 of the processing unit PM using a lifting mechanism 70. In step ST11, the control unit MC controls the lifting mechanism 70 to lift the edge ring 22.

[0112] In the next step ST12, the edge ring 22, lifted by the lifting mechanism 70, is transported from the processing unit PM to the replacement unit RM1 by the transport arm TR. The transport arm TR can be the transport arm TMR of the transport unit TM. In this case, the edge ring 22 can be transported only through the interior of the depressurized chamber of the transport unit TM. In step ST12, the control unit MC controls the transport arm TR to transport the edge ring 22.

[0113] In step ST12, the height position of either the conveyor arm TR or the support SP11 can be adjusted so that the conveyor arm TR and the support SP11 do not interfere with each other. Furthermore, in step ST12, as... Figure 10 As shown in (a), the position of one of the manipulator of the conveyor arm TR and the support SP11 in the height direction is adjusted to transfer the edge ring 22 from the manipulator of the conveyor arm TR to the support SP11. For this height direction position adjustment, one of the conveyor arm TR and the changing unit RM1 may have a position adjustment mechanism. In step ST12, the control unit MC controls this position adjustment mechanism.

[0114] Next, in step S12, as Figure 10 As shown in (a), the edge ring 22 is transferred from the robot arm of the conveyor arm TR to a support SP11. Therefore, in step ST12, the control unit MC controls the conveyor arm TR. After the edge ring 22 is transferred from the robot arm of the conveyor arm TR to the support SP11, the robot arm of the conveyor arm TR avoids interference with the components of the replacement unit RM1.

[0115] In the next step ST13, the replaced edge ring 22R is prepared. The replaced edge ring 22R is prepared in advance as a replacement part in area SR12 and supported by a support body SP12.

[0116] In the next step ST14, the replaced edge ring 22R is transported from the replacement unit RM1 to the processing unit PM using the transport arm TR. The transport arm TR can be the transport arm TMR of the transport unit TM. In this case, the replaced edge ring 22R can be transported only through the interior of the depressurized chamber of the transport unit TM. In step ST14, the control unit MC controls the transport arm TR to transport the replaced edge ring 22R.

[0117] In step ST14, the height position of either the robot arm of the conveyor arm TR or the support SP12 is adjusted so that the robot arm of the conveyor arm TR and the support SP12 do not interfere with each other. Furthermore, in step ST14, as... Figure 10As shown in (b), the height position of one of the manipulator of the conveyor arm TR and the support SP12 is adjusted to transfer the replaced edge ring 22R from one support SP12 to the manipulator of the conveyor arm TR. The position adjustment mechanism described above can be used to perform this height position adjustment. In step ST14, the control unit MC controls the position adjustment mechanism.

[0118] In step ST14, the replaced edge ring 22R is transferred from the robotic arm of the conveyor arm TMR to the lifting pin 72 of the lifting mechanism 70 within the processing unit PM. Then, the replaced edge ring 22R is mounted on the substrate support 16. Therefore, the control unit MC controls the conveyor arm TMR and the lifting mechanism 70.

[0119] The following is for reference Figure 11 as well as Figure 12 of (a), Figure 12 (b) Figure 12 (c) Figure 13 of (a), Figure 13 (b) Figure 13 (c) Figure 14 of (a), Figure 14 (b) and Figure 14 (c) Figure 11 This is a flowchart of a method for a more peripheral loop, which is another illustrative implementation. Figure 12 of (a), Figure 12 (b) Figure 12 (c) Figure 13 of (a), Figure 13 (b) Figure 13 (c) Figure 14 of (a), Figure 14 (b) and Figure 14 (c) are diagrams illustrating the replacement unit of another illustrative embodiment. Figure 11 The method MT2 shown can be performed in a system SA having a replacement unit RM2 as shown in the above figure, which is a replacement unit RM. In the following description, the processing unit PM3 of the system SA is referred to as the plasma processing apparatus 1, i.e., the processing unit PM. Furthermore, one or more of the processing units PM1 to PM3 can each be a processing unit PM.

[0120] The replacement unit RM2 includes a chamber CH21 and a lifting mechanism LU. The lifting mechanism LU is configured to lift the second ring 222 upward relative to the first ring 221 within the chamber CH21. The lifting mechanism LU may have the same structure as the lifting mechanism 70. That is, the lifting mechanism LU may have one or more lifting pins PN identical to the lifting pin 72 and one or more drive devices DA identical to the drive device 74.

[0121] Chamber CH21 provides a region SR21 as a first storage area and a region SR22 as a second storage area. In one embodiment, another chamber CH22 is provided within chamber CH21. Regions SR21 and SR22 may be provided in chamber CH22.

[0122] One or more support bodies SP21 are provided within region SR21. In the illustrated example, two support bodies SP21 are provided within region SR21. The two support bodies SP21 are arranged vertically. Each support body SP21 is configured to support a second ring 222 of the edge ring 22 delivered from the processing unit PM.

[0123] One or more support bodies SP22 are provided within region SR22. In the illustrated example, two support bodies SP22 are provided within region SR22. Each support body SP22 is configured to support a ring 222R, which is a replacement part that is interchangeable with the second ring 222 of the edge ring 22 of the processing unit PM. The ring 222R may be an unused second ring 222.

[0124] like Figure 11 As shown, method MT2 begins at step ST21. Step ST21 is the same as step ST11. In step ST21, the edge ring 22 is lifted from the substrate support 16 within the chamber 10 of the processing unit PM using the lifting mechanism 70. In step ST21, the control unit MC controls the lifting mechanism 70 to lift the edge ring 22.

[0125] In the next step ST22, the edge ring 22, which is lifted by the lifting mechanism 70, is as follows: Figure 12 As shown in (a), the edge ring 22 is transported from the processing unit PM to the replacement unit RM2 by the conveyor arm TR. The conveyor arm TR can be the conveyor arm TMR of the conveyor unit TM. In this case, the edge ring 22 can be transported only through the interior of the depressurized chamber of the conveyor unit TM. In step ST22, the control unit MC controls the conveyor arm TR to transport the edge ring 22.

[0126] In the next step ST23, as Figure 12 As shown in (b), the second ring 222 is raised relative to the first ring 221 using the lifting mechanism LU. In step ST23, the control unit MC controls the lifting mechanism LU to raise the second ring 222 relative to the first ring 221. After step ST23 is executed, the robotic arm of the conveyor arm TR avoids interference with the first ring 221.

[0127] In the next step ST24, the second ring 222 is housed within region SR21. In step ST24, as... Figure 12As shown in (c), the second ring 222 is transferred from the lifting pin PN to the robot arm of the conveying arm TR. Specifically, the lifting pin PN descends, allowing the robot arm of the conveying arm TR to enter between the first ring 221 and the second ring 222. Then, the robot arm of the conveying arm TR enters between the first ring 221 and the second ring 222. Then, by descending the lifting pin PN, the second ring 222 is transferred from the lifting pin PN to the robot arm of the conveying arm TR. In step ST24, the control unit MC controls the conveying arm TR and the lifting mechanism LU to transfer the second ring 222 from the lifting pin PN to the robot arm of the conveying arm TR.

[0128] Next, in step ST24, the height position of either the robot arm of the conveyor arm TR or the support SP21 is adjusted so that the robot arm of the conveyor arm TR and the support SP21 do not interfere with each other. Furthermore, in step ST24, as... Figure 13 As shown in (a), the position of one of the manipulator of the conveyor arm TR and the support SP21 in the height direction is adjusted to transfer the second ring 222 from the manipulator of the conveyor arm TR to the support SP21. For this height direction position adjustment, one of the conveyor arm TR and the changing unit RM2 may have a position adjustment mechanism. In step ST24, the control unit MC controls this position adjustment mechanism.

[0129] Next, in step S24, as Figure 13 As shown in (a), the second ring 222 is transferred from the robot arm of the conveyor arm TR to a support SP21. Therefore, in step ST24, the control unit MC controls the conveyor arm TR. Furthermore, after the second ring 222 is transferred from the robot arm of the conveyor arm TR to a support SP21, the robot arm of the conveyor arm TR avoids interference with the components of the replacement unit RM2.

[0130] In the next step ST25, the replaced edge ring 22R is prepared. In step ST25, firstly, ring 222R is transferred from a support SP22 to the robot arm of the conveyor arm TR. Specifically, the height position of either the robot arm of the conveyor arm TR or the support SP22 is adjusted using the aforementioned position adjustment mechanism, ensuring that the robot arm of the conveyor arm TR and the support SP22 do not interfere with each other. Then, the robot arm of the conveyor arm TR... Figure 13 As shown in (b), the entry area SR22 receives a ring 222R from a support SP22. Then, the robotic arm TR, having received the ring 222R, proceeds as follows: Figure 13 As shown in (c), avoid area SR22.

[0131] Next, in step ST25, the lifting pin PN rises. The result is as follows: Figure 14As shown in (a), ring 222R is transferred from the robot arm of the conveyor arm TR to the lifting pin PN. Then, the robot arm of the conveyor arm TR moves aside to avoid interfering with the first ring 221. Next, the lifting pin PN rises, allowing the robot arm of the conveyor arm TR to access below the first ring 221. Then, the robot arm of the conveyor arm TR... Figure 14 As shown in (b), it enters the area below the first ring 221. Then, by descending via the lifting pin PN, the first ring 221 and ring 222R are transferred from the lifting pin PN to the robotic arm of the conveying arm TR. The result is as follows: Figure 14 As shown in (c), an edge ring 22R comprising a first ring 221 and a ring 222R can be prepared. In step ST25, the control unit MC controls the conveying arm TR, the lifting mechanism LU, and the aforementioned position adjustment mechanism to prepare the replaced edge ring 22R.

[0132] In the next step ST26, the edge ring 22R, which has been replaced, is transported from the replacement unit RM2 to the processing unit PM by the conveying arm TR. The conveying arm TR can be the conveying arm TMR of the conveying unit TM. In this case, the edge ring 22R can be transported only through the inside of the depressurized chamber of the conveying module TM. In step ST26, the control unit MC controls the conveying arm TR to transport the edge ring 22R.

[0133] In step ST26, the replaced edge ring 22R is transferred from the robotic arm of the conveyor arm TMR to the lifting pin PN of the lifting mechanism 70 within the processing unit PM. Then, the replaced edge ring 22R is mounted on the substrate support 16. For this purpose, the control unit MC controls the conveyor arm TMR and the lifting mechanism 70.

[0134] Furthermore, in step ST24 of method MT2, the second ring 222 may not be housed within region SR21. In step ST24, the second ring 222 may be conveyed by the conveyor arm TR to one of the load locking units LL1 and LL2. Then, the second ring 222 may be conveyed by the conveyor arm LMR from one of the load locking units to a container provided on one of the loading ports LP1 to LP4, and housed within that container. In this case, in step ST24, the control unit MC controls the conveyor arm TR and the conveyor arm LMR to house the second ring 222 within the container provided on one of the loading ports. Furthermore, in this case, the replacement unit RM2 may not have region SR21.

[0135] Below, refer to Figure 15 . Figure 15 This is a flowchart illustrating a method for a more peripheral loop in another illustrative implementation. Furthermore, refer to... Figure 16 of (a), Figure 16 (b) Figure 16(c) Figure 17 of (a), Figure 17 (b) Figure 17 (c) Figure 18 of (a), Figure 18 (b) Figure 18 (c) Figure 19 of (a), Figure 19 (b) and Figure 19 (c). Also refer to Figure 20 (a) and Figure 20 (b). The above figure is a flowchart of a method for replacing the edge ring according to another illustrative embodiment. Figure 15 The method MT3 shown can be performed in a system SA having a replacement unit RM3 as shown in the above figure, which serves as a replacement unit RM. In the following description, the processing unit PM3 of the system SA is referred to as the plasma processing apparatus 1, i.e., the processing unit PM. Furthermore, one or more of the processing units PM1 to PM3 can each be a processing unit PM.

[0136] The replacement unit RM3 includes a chamber CH31 and a lifting mechanism LU. The lifting mechanism LU is configured to lift the second ring 222 upward relative to the first ring 221 within the chamber CH31. The lifting mechanism LU may have the same structure as the lifting mechanism 70. That is, the lifting mechanism LU may have one or more lifting pins PN identical to the lifting pin 72 and one or more drive devices DA identical to the drive device 74.

[0137] The chamber CH31 provides a region SR31 as a first storage area and a region SR32 as a second storage area. In one embodiment, another chamber CH32 is provided within the chamber CH31. Regions SR31 and SR32 may be provided in the chamber CH32.

[0138] One or more support bodies SP31 are provided within region SR31. In the illustrated example, one support body SP31 is provided within region SR31. The support body SP31 is configured to support the second ring 222 of the edge ring 22 delivered from the processing unit PM. One or more support bodies SP32 are provided within region SR32. In the illustrated example, one support body SP32 is provided within region SR32. The support body SP32 is configured to support ring 222R, which is a replacement part that is interchangeable with the second ring 222 of the edge ring 22 of the processing unit PM. Ring 222R may be an unused second ring 222.

[0139] Chamber CH31 provides region SR33 as a third storage area and region SR34 as a fourth storage area. Regions SR33 and SR34 can be provided in chamber CH32.

[0140] One or more support bodies SP33 are provided within region SR33. In the illustrated example, one support body SP33 is provided within region SR33. The support body SP33 is configured to support the first ring 221 of the edge ring 22 delivered from the processing unit PM.

[0141] One or more support bodies SP34 are provided within region SR34. In the illustrated example, one support body SP34 is provided within region SR34. The support body SP34 supports a ring 221R, which is a replacement part that is interchangeable with the first ring 221 of the edge ring 22 of the processing unit PM. The ring 221R may be an unused first ring 221.

[0142] like Figure 15 As shown, method MT3 begins at step ST31. Step ST31 is the same as step ST11. In step ST31, the edge ring 22 is lifted from the substrate support 16 within the chamber 10 of the processing unit PM using the lifting mechanism 70. In step ST31, the control unit MC controls the lifting mechanism 70 to lift the edge ring 22.

[0143] In the next step ST32, the edge ring 22, which is lifted by the lifting mechanism 70, is as follows: Figure 16 As shown in (a), the edge ring 22 is transported from the processing unit PM to the replacement unit RM3 by the conveyor arm TR. The conveyor arm TR can be the conveyor arm TMR of the conveyor unit TM. In this case, the edge ring 22 can be transported only through the interior of the depressurized chamber of the conveyor unit TM. In step ST32, the control unit MC controls the conveyor arm TR to transport the edge ring 22.

[0144] In the next step ST33, as Figure 16 As shown in (b), the second ring 222 is raised relative to the first ring 221 using the lifting mechanism LU. In step ST33, the control unit MC controls the lifting mechanism LU to raise the second ring 222 relative to the first ring 221. After step ST33 is executed, the robotic arm of the conveyor arm TR makes way so as not to interfere with the first ring 221.

[0145] In the next step ST34, the second ring 222 is housed within region SR31. In step ST34, as... Figure 16As shown in (c), the second ring 222 is transferred from the lifting pin PN to the robotic arm of the conveyor arm TR. Specifically, the lifting pin PN descends, allowing the robotic arm of the conveyor arm TR to enter between the first ring 221 and the second ring 222. Then, the robotic arm of the conveyor arm TR enters between the first ring 221 and the second ring 222. Then, by descending the lifting pin PN, the second ring 222 is transferred from the lifting pin PN to the robotic arm of the conveyor arm TR. In step ST34, the control unit MC controls the conveyor arm TR and the lifting mechanism LU to transfer the second ring 222 from the lifting pin PN to the robotic arm of the conveyor arm TR.

[0146] Next, in step ST34, the height position of either the robot arm of the conveyor arm TR or the support body SP31 is adjusted so that the robot arm of the conveyor arm TR and the support body SP31 do not interfere with each other. Furthermore, in step ST34, as... Figure 17 As shown in (a), the position of one of the manipulator of the conveyor arm TR and the support SP31 in the height direction is adjusted to transfer the second ring 222 from the manipulator of the conveyor arm TR to the support SP31. For this height direction position adjustment, one of the conveyor arm TR and the changing unit RM3 may have a position adjustment mechanism. In step ST34, the control unit MC controls this position adjustment mechanism.

[0147] Next, in step S34, as Figure 17 As shown in (a), the second ring 222 is transferred from the robot arm of the conveyor arm TR to the support SP31. For this purpose, in step ST34, the control unit MC controls the conveyor arm TR. Furthermore, after the second ring 222 is transferred from the robot arm of the conveyor arm TR to the support SP31, the robot arm of the conveyor arm TR avoids interference with the components of the replacement unit RM3.

[0148] In the next step ST35, the first ring 221 is housed within region SR33. In step ST35, as... Figure 17 As shown in (b), the first ring 221 is transferred from the lifting pin PN to the robotic arm of the conveying arm TR. Specifically, the lifting pin PN rises. Then, the robotic arm of the conveying arm TR enters the area below the first ring 221. Then, the first ring 221 is transferred from the lifting pin PN to the robotic arm of the conveying arm TR by lowering the lifting pin PN. In step ST35, the control unit MC controls the conveying arm TR and the lifting mechanism LU to transfer the first ring 221 from the lifting pin PN to the conveying arm TR.

[0149] Next, in step ST35, the height position of either the robot arm of the conveyor arm TR or the support body SP33 is adjusted so that the robot arm of the conveyor arm TR and the support body SP33 do not interfere with each other. Furthermore, in step ST35, as... Figure 17As shown in (c), the position of either the robot arm of the conveyor arm TR or the support SP33 in the height direction is adjusted to transfer the first ring 221 from the robot arm of the conveyor arm TR to the support SP33. To perform this height direction position adjustment, the control unit MC controls the aforementioned position adjustment mechanism.

[0150] Next, in step S35, as Figure 17 As shown in (c), the first ring 221 is transferred from the robot arm of the conveyor arm TR to the support SP33. Therefore, in step ST35, the control unit MC controls the conveyor arm TR. Furthermore, after the support SP33 is transferred from the robot arm of the conveyor arm TR to the first ring 221, the robot arm of the conveyor arm TR avoids interference with the components of the replacement unit RM3.

[0151] In the next step ST36, the replaced edge ring 22R is prepared. In step ST36, firstly, ring 221R is transferred from support SP34 to the robot arm of the conveyor arm TR. Specifically, the height position of either the robot arm of the conveyor arm TR or the support SP34 is adjusted using the aforementioned position adjustment mechanism so that the robot arm of the conveyor arm TR and the support SP34 do not interfere with each other. Then, the robot arm of the conveyor arm TR... Figure 18 As shown in (a), the robot enters region SR34 and receives ring 221R from support SP34. Then, the robot arm TR, having received ring 221R, moves as shown in (a). Figure 18 As shown in (b), avoid area SR34.

[0152] Next, in step ST36, the lifting pin PN rises. The result is as follows: Figure 18 As shown in (c), ring 221R is transferred from the robot arm of the conveyor arm TR to the lifting pin PN. Then, the robot arm of the conveyor arm TR moves aside to prevent interference with ring 221R. Next, the lifting pin PN descends.

[0153] Next, in step ST36, the second ring 222 is transferred from the support SP31 to the robot arm of the conveyor arm TR. Specifically, the position of one of the conveyor arm TR and the support SP31 in the height direction is adjusted using the aforementioned position adjustment mechanism so that the robot arm of the conveyor arm TR and the support SP31 do not interfere with each other. Then, the robot arm of the conveyor arm TR... Figure 19 As shown in (a), the entry area SR31 receives the second ring 222 from the support SP31. Then, the robotic arm TR, having received the second ring 222, proceeds as follows: Figure 19 As shown in (b), avoid area SR31.

[0154] Next, in step ST36, the lifting pin PN of the lifting mechanism LU rises. As a result, as... Figure 19As shown in (c), the second ring 222 is transferred from the manipulator of the conveyor arm TR to the lifting pin PN. Then, the manipulator of the conveyor arm TR avoids the ring 221R to prevent interference.

[0155] Next, in step ST36, ring 221R and second ring 222 are transferred from the lifting pin PN to the robotic arm of the conveying arm TR. Specifically, the lifting pin PN rises. Then, as... Figure 20 As shown in (a), the robotic arm of the conveyor arm TR enters the area below ring 221R. Then, by descending via the lifting pin PN, ring 221R and the second ring 222 are transferred from the lifting pin PN to the robotic arm of the conveyor arm TR. The result is as follows: Figure 20 As shown in (b), an edge ring 22R comprising ring 221R and a second ring 222 is prepared. In step ST36, the control unit MC controls the conveyor arm TR, the lifting mechanism LU, and the aforementioned position adjustment mechanism to prepare the replaced edge ring 22R.

[0156] In the next step ST37, the replaced edge ring, i.e., edge ring 22R, is transported from the replacement unit RM3 to the processing unit PM using the conveyor arm TR. The conveyor arm TR can be the conveyor arm TMR of the conveyor unit TM. In this case, the edge ring 22R can be transported only through the interior of the depressurized chamber of the conveyor unit TM. In step ST37, the control unit MC controls the conveyor arm TR to transport the edge ring 22R.

[0157] In step ST37, the replaced edge ring 22R is transferred from the conveyor arm TMR to the lifting pin 72 of the lifting mechanism 70 within the processing unit PM. Then, the replaced edge ring 22R is mounted on the substrate support 16. For this purpose, the control unit MC controls the conveyor arm TMR and the lifting mechanism 70.

[0158] Below, refer to Figure 15 as well as Figure 21 of (a), Figure 21 (b) Figure 21 (c) Figure 22 (a) and Figure 22 (b). The above figure is a diagram illustrating a replacement unit in yet another exemplary embodiment. In step ST36 of method MT3, ring 221R and a replaced edge ring 22R containing ring 222R may also be prepared.

[0159] Specifically, in step ST36, after ring 221R is transferred from the robot arm of the conveyor arm TR to the lifting pin PN, the robot arm of the conveyor arm TR makes way to prevent interference with ring 221R. Then, the lifting pin PN descends.

[0160] Next, in step ST36, ring 222R is transferred from support SP32 to the robot arm of conveying arm TR. Specifically, the position of either the robot arm of conveying arm TR or support SP32 in the height direction is adjusted using the aforementioned position adjustment mechanism, so that the robot arm of conveying arm TR and support SP32 do not interfere with each other. Then, the robot arm of conveying arm TR... Figure 21 As shown in (a), the ring 222R is received from the support SP32 in the entry area SR32. Then, the robotic arm TR, having received the ring 222R, moves as shown in (a). Figure 21 As shown in (b), avoid area SR32.

[0161] Next, in step ST36, the lifting pin PN rises. The result is as follows: Figure 21 As shown in (c), ring 222R is transferred from the robot arm of the conveyor arm TR to the lifting pin PN. Then, the robot arm of the conveyor arm TR avoids interference with ring 221R.

[0162] Next, in step ST36, ring 221R and second ring 222 are transferred from the lifting pin PN to the robotic arm of the conveying arm TR. Specifically, the lifting pin PN rises. Then, as... Figure 22 As shown in (a), the robotic arm of the conveyor arm TR enters the area below ring 221R. Then, by descending via the lifting pin PN, rings 221R and 222R are transferred from the lifting pin PN to the robotic arm of the conveyor arm TR. The result is as follows: Figure 22 As shown in (b), an edge ring 22R comprising ring 221R and ring 222R is prepared. In step ST36, the control unit MC controls the conveyor arm TR, the lifting mechanism LU, and the aforementioned position adjustment mechanism to prepare the replaced edge ring 22R.

[0163] Furthermore, in method MT3, when the second ring 222 is to be replaced with ring 222R, in step ST34, the second ring 222 may not be housed within region SR31. In step ST34, the second ring 222 may be conveyed by the conveyor arm TR to one of the load locking units LL1 and LL2. Then, the second ring 222 may be conveyed by the conveyor arm LMR from one of the load locking units to a container provided on one of the loading ports LP1 to LP4, and housed within that container. In this case, in step ST24, the control unit MC controls the conveyor arms TR and LMR to house the second ring 222 within the container provided on one of the loading ports. In this case, the replacement unit RM3 may not have region SR31.

[0164] Alternatively, in method MT3, in step ST35, the first ring 221 may not be housed within region SR33. In step ST35, the first ring 221 may be conveyed by the conveyor arm TR to one of the load locking units LL1 and LL2. Then, the first ring 221 may be conveyed by the conveyor arm LMR from one of the load locking units to a container located at one of the loading ports LP1 to LP4, and housed within that container. In this case, in step ST35, the control unit MC controls the conveyor arms TR and LMR to house the first ring 221 within the container located at one of the loading ports. In this case, the replacement unit RM3 may not have region SR33.

[0165] Below, refer to Figure 23 . Figure 23 This is a diagram illustrating a substrate processing system of another exemplary embodiment. Figure 23 The substrate processing system shown (hereinafter referred to as "System SB") includes a processing unit PM4 in addition to processing units PM1 to PM3. Processing unit PM4 is a dedicated substrate processing device. Processing unit PM4 is connected to the transport unit TM. Processing unit PM4 can be the plasma processing device 1. In System SB, the replacement unit RM is directly connected to the processing unit PM. The replacement unit RM is connected to the transport unit TM via the processing unit PM. In the illustrated example, processing unit PM is processing unit PM3, but one or more of the processing units PM1 to PM3 can also be processing unit PM. Furthermore, other structures of System SB can be the same as the corresponding structure of System SA.

[0166] Method MT1 can be executed in a system SB having a replacement unit RM1 as a replacement unit RM. Furthermore, method MT2 can be executed in a system SB having a replacement unit RM2 as a replacement unit RM. Additionally, method MT3 can be executed in a system SB having a replacement unit RM3 as a replacement unit RM. In each of methods MT1 to MT3, a conveyor arm TMR can be used as the conveyor arm TR. Alternatively, in each of methods MT1 to MT3, another conveyor arm included in the processing unit PM or the replacement unit RM can be used as the conveyor arm TR.

[0167] Below, refer to Figure 24 . Figure 24 This is a diagram illustrating a substrate processing system of yet another exemplary embodiment. Figure 24In the substrate processing system shown (hereinafter referred to as "System SC"), the load locking unit constitutes the replacement unit RM4. In the illustrated example, the load locking unit LL2 constitutes the replacement unit RM4. Alternatively, the load locking unit LL1 can also constitute the replacement unit RM4. Furthermore, other structures of System SC can be the same as the corresponding structures of System SB.

[0168] Figure 25 This is a flowchart of another exemplary implementation of a method for replacing the edge ring. Figure 25 The method shown can be executed in MT4 on system SC. See below for reference. Figure 25 as well as Figure 26 of (a), Figure 26 (b) Figure 26 (c) Figure 27 of (a), Figure 27 (b) Figure 27 (c) Figure 28 of (a), Figure 28 (b) and Figure 28 (c) Figure 26 of (a), Figure 26 (b) and Figure 26 (c) are diagrams representing alternative units in yet another illustrative implementation. Figure 27 (a) and Figure 27 (b) are diagrams showing the first and second storage areas located on the loading port, respectively. Figure 27 (c) is a diagram showing a replacement unit in yet another exemplary implementation. Figure 28 of (a), Figure 28 (b) and Figure 28 (c) are diagrams representing alternative units in yet another illustrative implementation.

[0169] like Figure 26 As shown in (a), the replacement unit RM4, i.e., the load locking unit, includes a lifting mechanism LU. The lifting mechanism LU is configured to lift the second ring 222 upward relative to the first ring 221 within the chamber of the load locking unit. The lifting mechanism LU may have the same structure as the lifting mechanism 70. That is, the lifting mechanism LU may have one or more lifting pins PN identical to the lifting pin 72 and one or more drive devices DA identical to the drive device 74.

[0170] like Figure 27 As shown in (a), in the system SC, a region SR41 serving as a first storage area and a region SR42 serving as a second storage area are provided on one of the loading ports LP1 to LP4. In one embodiment, regions SR41 and SR42 are provided inside the chamber CH4.

[0171] One or more support bodies SP41 are provided within region SR41. In the illustrated example, two support bodies SP41 are provided within region SR41. The two support bodies SP41 are arranged vertically. Each support body SP41 is configured to support a second ring 222 of the edge ring 22 conveyed from the processing unit PM. Figure 24 In the example shown, the processing unit PM is processing unit PM3, but one or more other processing units among processing units PM1 to PM3 can also be processing unit PM.

[0172] like Figure 27 As shown in (a), one or more support bodies SP42 are provided within region SR42. In the illustrated example, two support bodies SP42 are provided within region SR42. Each support body SP42 is configured to support a ring 222R, which is a replacement part that is interchangeable with the second ring 222 of the edge ring 22 of the processing unit PM. The ring 222R may be an unused second ring 222.

[0173] like Figure 25 As shown, method MT4 begins at step ST41. Step ST41 is the same as step ST11. In step ST41, the edge ring 22 is lifted from the substrate support 16 within the chamber 10 of the processing unit PM using the lifting mechanism 70. In step ST41, the control unit MC controls the lifting mechanism 70 to lift the edge ring 22.

[0174] In the next step ST42, the edge ring 22 is lifted by the lifting mechanism 70, as follows: Figure 26 As shown in (a), the conveyor arm TMR transports the edge ring 22 from the processing unit PM to the replacement unit RM4 (i.e., the load locking unit). In step ST42, the control unit MC controls the conveyor arm TMR to transport the edge ring 22.

[0175] In the next step ST43, as Figure 26 As shown in (b), the second ring 222 is raised relative to the first ring 221 using the lifting mechanism LU. In step ST43, the control unit MC controls the lifting mechanism LU to raise the second ring 222 relative to the first ring 221. After step ST43 is executed, the robot arm of the conveyor arm TMR makes way.

[0176] In the next step ST44, the second ring 222 is housed within region SR41. In step ST44, as... Figure 26As shown in (c), the second ring 222 is transferred from the lifting pin PN of the lifting mechanism LU to the robot arm of the conveying arm LMR. Specifically, the robot arm of the conveying arm LMR enters between the first ring 221 and the second ring 222. Then, the second ring 222 is transferred from the lifting pin PN to the robot arm of the conveying arm LMR by descending the lifting pin PN. In step ST44, the control unit MC controls the conveying arm LMR and the lifting mechanism LU to transfer the second ring 222 from the lifting pin PN of the lifting mechanism LU to the robot arm of the conveying arm LMR.

[0177] Next, in step ST44, as Figure 27 As shown in (a), the second ring 222 is transported to region SR41 by the transport arm LMR. Then, the second ring 222 is transferred from the robot arm of the transport arm LMR to a support SP41. In step ST44, the control unit MC controls the transport arm LMR to transfer the second ring 222 from the robot arm of the transport arm LMR to a support SP41.

[0178] In the next step ST45, the replaced edge ring 22R is prepared. In step ST45, firstly, as... Figure 27 As shown in (b), the ring 222R housed in region SR42 is transferred from a support SP42 to the robot arm of the transfer arm LMR. In step ST45, the control unit MC controls the transfer arm LMR to transfer the ring 222R from a support SP42 to the robot arm of the transfer arm LMR.

[0179] Next, in step ST45, as Figure 27 As shown in (c), ring 222R is conveyed to replacement unit RM4. In step ST45, control unit MC controls conveyor arm LMR to convey ring 222R to replacement unit RM4.

[0180] Next, in step ST45, the lifting pin PN of the lifting mechanism LU rises. As a result, as... Figure 28 As shown in (a), ring 222R is transferred from the manipulator of the conveyor arm LMR to the lifting pin PN. Then, the conveyor arm LMR makes a clearance. In step ST45, the control unit MC controls the conveyor arm LMR and the lifting mechanism LU to transfer ring 222R from the manipulator of the conveyor arm LMR to the lifting pin PN.

[0181] Next, in step ST45, as Figure 28 As shown in (b), the robotic arm of the TMR conveyor enters the area below the first ring 221. Then, as... Figure 28As shown in (c), the lifting pin PN descends. As a result, the first ring 221 and ring 222R are transferred from the lifting pin PN to the robot arm of the conveyor arm TMR, and the replaced edge ring 22R, containing the first ring 221 and ring 222R, is prepared on the robot arm of the conveyor arm TMR. In step ST45, the control unit MC controls the conveyor arm TMR and the lifting mechanism LU to prepare the replaced edge ring 22R on the robot arm of the conveyor arm TMR.

[0182] In the next step ST46, the replaced edge ring, i.e., edge ring 22R, is transported from the replacement unit RM4 to the processing unit PM by the conveyor arm TMR. In step ST46, the control unit MC controls the conveyor arm TMR to transport the edge ring 22R.

[0183] In step ST46, the replaced edge ring 22R is transferred from the robotic arm of the conveyor arm TMR to the lifting pin 72 of the lifting mechanism 70 within the processing unit PM. Then, the replaced edge ring 22R is mounted on the substrate support 16. For this purpose, the control unit MC controls the conveyor arm TMR and the lifting mechanism 70.

[0184] Below, refer to Figure 29 . Figure 29 This is a diagram illustrating another exemplary embodiment of a substrate processing system. In Figure 29 In the substrate processing system shown (hereinafter referred to as "System SD"), the replacement unit RM4 is a different module from the load locking units LL1 and LL2, and is connected to the loading unit LM. The other structures of System SD can be the same as the corresponding structures of System SC.

[0185] Method MT4 can also be executed in system SD. The differences between method MT4 executed in system SD and method MT4 executed in system SC are explained below. In step ST42, the edge ring 22 is transported from processing unit PM to one of the load locking units LL1 and LL2 using the transport arm TMR. Then, the edge ring 22 is transported from one load locking unit to replacement unit RM4 using the transport arm LMR.

[0186] In step ST45, the replaced edge ring 22R is prepared on the robotic arm of the conveyor arm LMR. In step ST46, the edge ring 22R is conveyed from the replacement unit RM4 to one of the load locking units LL1 and LL2 using the conveyor arm LMR. Then, the edge ring 22R is conveyed from one load locking unit to the processing unit PM using the conveyor arm TMR.

[0187] In addition, the system SC and system SD can also use the replacement unit RM4 to replace the edge ring 22 with the assembly of ring 221R and ring 222R, i.e., the replaced edge ring 22R.

[0188] According to the various embodiments described above, the first ring 211 and the second ring 222 can be transported from the processing unit PM to the replacement unit. Therefore, one or both of the first ring 221 and the second ring 222 constituting the edge ring can be replaced within the replacement unit.

[0189] The above descriptions illustrate various illustrative embodiments, but the embodiments are not limited to those described above, and various additions, omissions, and modifications can be made. Furthermore, elements from different embodiments can be combined to form other embodiments.

[0190] For example, the plasma processing device used as a processing unit in the substrate processing system is not limited to plasma processing device 1. The plasma processing device used as a processing unit in the substrate processing system can be any type of plasma processing device, including the substrate support 16. Such a plasma processing device can be a capacitively coupled type plasma processing device, different from plasma processing device 1. Alternatively, such a plasma processing device can be an inductively coupled type plasma processing device or a plasma processing device that generates plasma using surface waves such as microwaves.

[0191] Furthermore, the processing unit may have two or more lifting mechanisms capable of raising the first ring 221 and the second ring 222 individually and simultaneously. Throughout this specification, "raising simultaneously" includes not only "raising simultaneously" but also "being raised simultaneously."

[0192] Based on the above description, various embodiments of the present invention have been described in this specification for illustrative purposes. It should be understood that various changes can be made without departing from the scope and spirit of the invention. Therefore, the various embodiments disclosed in this specification are not intended to be limiting, and the true scope and spirit are given by the appended claims.

Claims

1. A substrate processing system, characterized in that, include: A processing unit capable of processing a substrate includes: a chamber; and a substrate support capable of supporting an edge ring comprising a first ring and a second ring mounted on the first ring, capable of supporting a substrate disposed thereon in a region surrounded by the edge ring, and having at least one lifting mechanism capable of simultaneously lifting the first ring and the second ring. A conveyor arm capable of conveying the edge ring; A replacement unit, wherein one or both of the first and second rings of the edge ring can be replaced with corresponding replacement parts, thereby enabling the preparation of a replaced edge ring; and A control unit capable of controlling at least one lifting mechanism and the conveying arm. The control unit controls the at least one lifting mechanism to lift the edge ring from the substrate support. The control unit controls the conveying arm to convey the edge ring, which has been raised by the at least one lifting mechanism, between the processing unit and the replacement unit, and to convey the replaced edge ring, which has been prepared in the replacement unit, between the replacement unit and the processing unit. The replacement unit has an additional lifting mechanism for raising the second ring relative to the first ring.

2. The substrate processing system as described in claim 1, characterized in that: It also includes a conveying unit connected between the processing unit and the replacement unit, which can use the conveying arm to convey the edge ring through the interior of the depressurized chamber.

3. The substrate processing system as described in claim 2, characterized in that, Also includes: A load locking unit connected to the conveying unit; A loading unit capable of transporting the edge ring through the interior of a housing set to atmospheric pressure; and The loading port connected to the loading unit, The control unit controls the other lifting mechanisms to raise the second ring of the edge ring, which is being transported to the replacement unit, relative to the first ring of the edge ring. The control unit controls the conveying arm to transport the second ring, which has been raised by the other lifting mechanism, to the load locking unit. The control unit controls the loading unit to deliver the second ring, which is to be delivered to the load locking unit, to the loading port. The control unit controls the conveying arm to convey the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring is prepared in the replacement unit by replacing the second ring with a corresponding replacement part.

4. The substrate processing system as described in claim 2, characterized in that, Also includes: The replacement unit further includes: a first storage area in which the second ring contained in the edge ring delivered from the processing unit is stored; The second storage area stores replacement parts that are interchangeable with the second ring. The control unit controls the other lifting mechanisms to raise the second ring of the edge ring, which is being transported to the replacement unit, relative to the first ring of the edge ring. The control unit controls the conveying arm to store the second ring, which has been raised by the other lifting mechanism, in the first storage area, and to transport the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring includes the first ring of the edge ring that has been transported to the replacement unit and the replacement part that has been taken out from the second storage area.

5. The substrate processing system as described in claim 1, characterized in that: The replacement unit is directly connected to the processing unit.

6. The substrate processing system as described in claim 5, characterized in that: The replacement unit further includes: a first storage area for storing the second ring included in the edge ring conveyed from the processing unit; and a second storage area for storing replacement parts that replace the second ring. The control unit controls the other lifting mechanisms to raise the second ring of the edge ring, which is being transported to the replacement unit, relative to the first ring of the edge ring. The control unit controls the conveying arm to store the second ring, which has been raised by the other lifting mechanism, in the first storage area, and to transport the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring includes the first ring of the edge ring that has been transported to the replacement unit and the replacement part that has been taken out from the second storage area.

7. The substrate processing system as described in claim 4 or 6, characterized in that: The replacement unit further includes: a third storage area for storing the first ring included in the edge ring conveyed from the processing unit; and a fourth storage area for storing the replacement part that is replaced with the first ring. The control unit controls the other lifting mechanisms to raise the second ring of the edge ring, which is being transported to the replacement unit, relative to the first ring of the edge ring. The control unit controls the conveying arm to store the second ring, which has been raised by the other lifting mechanism, in the first storage area; to store the first ring of the edge ring to be conveyed to the replacement unit in the third storage area; and to convey the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring includes the replacement part taken from the fourth storage area and the second ring stored in the first storage area or the replacement part taken from the second storage area.

8. The substrate processing system as described in claim 2, characterized in that, Also includes: A loading unit capable of transporting the edge ring through the interior of a housing set to atmospheric pressure; and The loading port connected to the loading unit, The replacement unit is a load locking unit connected to the conveying unit. The loading port is provided with: a first storage area for storing the second ring included in the edge ring conveyed from the processing unit; and a second storage area for storing the replacement part that is interchanged with the second ring. The control unit controls the other lifting mechanisms to raise the second ring of the edge ring, which is being transported to the replacement unit, relative to the first ring of the edge ring. The control unit controls the loading unit to store the second ring, which has been raised by the other lifting mechanism, within the first storage area, and to transport the replacement part from the second storage area to the replacement unit. The control unit controls the conveying arm to convey the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring includes the first ring of the edge ring conveyed to the replacement unit and the replacement part conveyed from the second storage area.

9. The substrate processing system as described in claim 2, characterized in that, Also includes: A load locking unit connected to the conveying unit; and A loading unit capable of transporting the edge ring through the interior of a housing set to atmospheric pressure. The replacement unit is connected to the loading unit and has: a first storage area for storing the second ring included in the edge ring conveyed from the processing unit; and a second storage area for storing the replacement part that replaces the second ring. The control unit controls the other lifting mechanisms to raise the second ring of the edge ring, which is being transported to the replacement unit, relative to the first ring of the edge ring. The control unit controls the loading unit to store the second ring, which has been raised by the other lifting mechanism, within the first storage area. The control unit controls the conveying arm to convey the replaced edge ring between the replacement unit and the processing unit. The replaced edge ring includes the first ring of the edge ring conveyed to the replacement unit and the replacement part taken out from the second storage area.

10. A method for replacing an edge ring, characterized in that, include: The step of using at least one lifting mechanism to lift the edge ring containing the first ring and the second ring from the substrate support within the chamber of the processing unit; The step of using a conveyor arm to transport the edge ring, which has been raised by the at least one lifting mechanism, between the processing unit and the replacement unit; Within the replacement unit, the step of preparing the replaced edge ring involves replacing one or both of the first ring and the second ring of the edge ring with corresponding replacement parts; and The step of using the conveyor arm to transport the replaced edge ring between the replacement unit and the processing unit. The replacement unit has an additional lifting mechanism for raising the second ring relative to the first ring.

Images