Silicon rod grinding machine and silicon rod grinding method

Abstract

The present application provides a silicon rod grinding machine and a silicon rod grinding method. The rough grinding device and the fine grinding device of the silicon rod grinding machine are respectively arranged at the first processing area and the second processing area of the silicon rod processing platform, and a first transfer device and a second transfer device that simultaneously penetrate the first processing area and the second processing area are provided, and a silicon rod fixture and a driving mechanism are respectively configured for the first and second transfer devices. By coordinately controlling the first and second transfer devices and the rough grinding device and the fine grinding device, the rough grinding device and the fine grinding device of the silicon rod grinding machine are both in a working state at the same time, and the grinding processing efficiency is doubled while maintaining the size specification and cost of the silicon rod grinding machine, reducing the grinding operation time, and improving the economic benefits.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and particularly to a silicon rod grinding machine and a silicon rod grinding method. Background Art

[0002] Currently, with the increasing attention and development of the society towards the utilization and development of green renewable energy, the field of photovoltaic solar power generation has received more and more attention. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are made on high-quality silicon wafers, and such silicon wafers are formed by multi-wire saw cutting and subsequent processing after pulling or casting silicon ingots.

[0003] Taking monocrystalline silicon products as an example, the general manufacturing process of existing silicon wafers generally includes the following steps: First, use a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, use a silicon rod squaring machine to square the cut short silicon rods to form monocrystalline silicon rods; then perform processing operations such as grinding the surface and chamfering on each silicon rod to make the surface shaping of the silicon rod meet the corresponding flatness and dimensional tolerance requirements; subsequently, perform slicing operations on the silicon rods to obtain silicon wafers.

[0004] Generally, in the processes of grinding the surface and chamfering of silicon rods, two processes of rough grinding and fine grinding must be passed through. Load a single silicon rod and perform rough grinding and fine grinding in sequence, then transfer and unload it, and then load, grind (rough grinding and fine grinding), and unload another silicon rod. In the usual large-scale processing, the silicon rod grinding machine repeats this processing process, and the grinding tools of the silicon rod grinding machine are idle for a long time, resulting in low grinding efficiency and affecting the economic benefits of silicon rod processing. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the prior art, the purpose of the present application is to provide a silicon rod grinding machine and a silicon rod grinding method, which are used to solve problems such as low grinding efficiency existing in the prior art.

[0006] To achieve the above and other related objectives, a first aspect of the present application provides a silicon rod grinding machine, comprising: a machine base having a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location; a first transfer device, including a first silicon rod clamp, a first transfer guide rail arranged along a first direction, and a first driving mechanism for driving the first silicon rod clamp and the silicon rod clamped by it to move along the first transfer guide rail and transfer between the first processing location and the second processing location; a second transfer device, including a second silicon rod clamp, a second transfer guide rail arranged along the first direction, and a second driving mechanism for driving the second silicon rod clamp and the silicon rod clamped by it to move along the second transfer guide rail and transfer between the first processing location and the second processing location; a rough grinding device, arranged at the first processing location of the silicon rod processing platform, for performing rough grinding operations on the silicon rod located at the first processing location; and a fine grinding device, arranged at the second processing location of the silicon rod processing platform, for performing fine grinding operations on the silicon rod located at the second processing location.

[0007] In certain embodiments of the first aspect of the present application, the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame.

[0008] In certain embodiments of the first aspect of the present application, the first silicon rod clamp includes: a clamp arm mounting seat arranged on the first transfer guide rail; at least two clamp arms arranged oppositely along the first direction for clamping two end faces of the silicon rod; and a clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

[0009] In certain embodiments of the first aspect of the present application, the first silicon rod clamp is a lift-type silicon rod clamp.

[0010] In certain embodiments of the first aspect of the present application, the clamp arms of the first silicon rod clamp are of a rotary structure; the first silicon rod clamp further includes a clamp arm rotation mechanism for driving the clamp arms to rotate.

[0011] In certain embodiments of the first aspect of the present application, the second silicon rod clamp includes: a clamp arm mounting seat arranged on the second transfer guide rail; at least a pair of clamp arms arranged oppositely along the first direction for clamping two end faces of the silicon rod; and a clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

[0012] In certain embodiments of the first aspect of the present application, the second silicon rod clamp is a lift-type silicon rod clamp.

[0013] In certain embodiments of the first aspect of the present application, the clamping arm of the second silicon rod clamp is a rotary structure; the second silicon rod clamp further includes a clamping arm rotation mechanism for driving the clamping arm to rotate.

[0014] In certain embodiments of the first aspect of the present application, the first driving mechanism includes: a first moving tooth rail disposed along a first direction; a first driving gear provided on the first silicon rod clamp and meshing with the first moving tooth rail; and a first driving power source for driving the first driving gear.

[0015] In certain embodiments of the first aspect of the present application, the second driving mechanism includes: a second moving tooth rail disposed along the first direction; a second driving gear provided on the second silicon rod clamp and meshing with the second moving tooth rail; and a first driving power source for driving the second driving gear.

[0016] In certain embodiments of the first aspect of the present application, the rough grinding device includes: at least a pair of rough grinding tools oppositely disposed at a first processing location of the silicon rod processing platform; a rough grinding tool advancing and retreating mechanism for driving at least one of the at least a pair of rough grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

[0017] In certain embodiments of the first aspect of the present application, the fine grinding device includes: at least a pair of fine grinding tools oppositely disposed at a first processing location of the silicon rod processing platform; a fine grinding tool advancing and retreating mechanism for driving at least one of the at least a pair of fine grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

[0018] In certain embodiments of the first aspect of the present application, the silicon rod grinding machine further includes: a silicon rod transfer device adjacent to the first processing location of the silicon rod processing platform for transferring a silicon rod to be processed to the first processing location of the silicon rod processing platform or transferring the processed silicon rod on the silicon rod processing platform out of the first processing location.

[0019] In certain embodiments of the first aspect of the present application, the silicon rod processing platform further has a waiting location, and the silicon rod grinding machine further includes a silicon rod transfer device adjacent to the waiting location of the silicon rod processing platform for transferring a silicon rod to be processed to the waiting location of the silicon rod processing platform or transferring the processed silicon rod on the waiting location out of the silicon rod processing platform.

[0020] The second aspect of the present application further provides a silicon rod grinding method, which is applied to a silicon rod grinding machine. The silicon rod grinding machine includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a first processing area and a second processing area. The silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device. Among them, the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism. The second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism. The silicon rod grinding method is characterized by the following steps: loading a first silicon rod onto the first processing station, clamping the first silicon rod with the first silicon rod clamp in the first transfer device, and causing the rough grinding device to perform a rough grinding operation on the first silicon rod located at the first processing area; causing the first driving mechanism in the first transfer device to drive the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer guide rail to transfer from the first processing area to the second processing area, and causing the fine grinding device to perform a fine grinding operation on the first silicon rod located at the second processing area. At this stage, loading a second silicon rod onto the first processing station, clamping the second silicon rod with the second silicon rod clamp in the second transfer device, and causing the rough grinding device to perform a rough grinding operation on the second silicon rod located at the first processing area; causing the first driving mechanism in the first transfer device to drive the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer guide rail to transfer from the second processing area to the first processing area, unloading the first silicon rod from the first processing area and loading a third silicon rod, clamping the third silicon rod with the first silicon rod clamp in the first transfer device, and causing the rough grinding device to perform a rough grinding operation on the third silicon rod located at the first processing area; at this stage, causing the second driving mechanism in the second transfer device to drive the second silicon rod clamp and the second silicon rod clamped thereby to move along the second transfer guide rail to transfer from the first processing area to the second processing area, and causing the fine grinding device to perform a fine grinding operation on the second silicon rod located at the second processing area.

[0021] The third aspect of the present application further provides a method for grinding a silicon rod, which is applied to a silicon rod grinding machine. The silicon rod grinding machine includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a waiting area, a first processing area, and a second processing area. The silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device. Among them, the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism. The second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism. It is characterized in that the method for grinding a silicon rod includes the following steps: loading a first silicon rod in the waiting area, causing the first silicon rod clamp in the first transfer device to clamp the first silicon rod, and causing the first driving mechanism in the first transfer device to drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to transfer from the waiting area to the first processing area, and causing the rough grinding device to perform a rough grinding operation on the first silicon rod located at the first processing area; causing the first silicon rod clamp in the first transfer device to clamp the first silicon rod and driving the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to the first processing area by the first driving mechanism, and causing the rough grinding device to perform a rough grinding operation on the first silicon rod located at the first processing area; at this stage, loading a second silicon rod in the waiting area, and causing the second driving mechanism in the second transfer device to drive the second silicon rod clamp to clamp the second silicon rod; causing the first driving mechanism in the first transfer device to drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to transfer from the first processing area to the second processing area, and causing the fine grinding device to perform a fine grinding operation on the first silicon rod located at the second processing area; at this stage, causing the second driving mechanism in the second transfer device to drive the second silicon rod clamp and the second silicon rod held by it to move along the second transfer guide rail to transfer from the waiting area to the first processing area, and causing the rough grinding device to perform a rough grinding operation on the second silicon rod located at the first processing area; causing the first driving mechanism in the first transfer device to drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to transfer from the second processing area to the waiting area, unloading the first silicon rod from the waiting area and loading a third silicon rod, causing the first silicon rod clamp in the first transfer device to clamp the third silicon rod, and causing the first driving mechanism in the first transfer device to drive the third silicon rod clamp and the third silicon rod held by it to move along the first transfer guide rail to transfer from the waiting area to the first processing area, and causing the rough grinding device to perform a rough grinding operation on the third silicon rod located at the first processing area; at this stage, causing the second driving mechanism in the second transfer device to drive the second silicon rod clamp and the second silicon rod held by it to move along the second transfer guide rail to transfer from the first processing area to the second processing area, and causing the fine grinding device to perform a fine grinding operation on the second silicon rod located at the second processing area.

[0022] As described above, the silicon rod grinding machine and the silicon rod grinding method of the present application have the following beneficial effects: The rough grinding device and the fine grinding device of the silicon rod grinding machine are respectively arranged at the first processing area and the second processing area of the silicon rod processing platform, and the first transfer device and the second transfer device that penetrate the first processing area and the second processing area at the same time are provided, and silicon rod clamps and driving mechanisms are respectively configured for the first and second transfer devices. By coordinating and controlling the first and second transfer devices, the rough grinding device and the fine grinding device, the rough grinding device and the fine grinding device of the silicon rod grinding machine are both in a working state at the same time, doubling the grinding processing efficiency while maintaining the size specification and cost of the silicon rod grinding machine, reducing the grinding operation time, and improving the economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It shows a schematic structural diagram of the silicon rod grinding machine of the present application in an embodiment.

[0024] Figure 2 It shows a top view schematic diagram of the silicon rod grinding machine of the present application in an embodiment.

[0025] Figure 3 It shows a schematic structural diagram of the silicon rod grinding machine of the present application in an embodiment.

[0026] Figure 4 It shows a schematic structural diagram of the first silicon rod clamp of the silicon rod grinding machine of the present application in an embodiment.

[0027] Figure 5 Shown as Figure 3 An enlarged structural schematic diagram of part A in

[0028] Figure 6 It shows a schematic structural diagram of the second silicon rod clamp of the silicon rod grinding machine of the present application in an embodiment.

[0029] Figure 7 It shows a simplified structural schematic diagram of the silicon rod grinding machine of the present application in an embodiment.

[0030] Figure 8 It shows a simplified structural schematic diagram of the silicon rod grinding machine of the present application in an embodiment.

[0031] Figure 9 It shows a simplified structural top view of the silicon rod grinding machine of the present application in an embodiment.

[0032] Figure 10 It shows a working schematic diagram of the silicon rod grinding method of the present application in an embodiment.

[0033] Figure 11 It shows a working schematic diagram of the silicon rod grinding method of the present application in an embodiment.

[0034] Figure 12 Shown is a working schematic diagram of the silicon rod grinding method of the present application in an embodiment.

[0035] Figure 13 Shown is a working schematic diagram of the silicon rod grinding method of the present application in an embodiment.

[0036] Figure 14 Shown is a working schematic diagram of the silicon rod grinding method of the present application in an embodiment.

[0037] Figure 15 Shown is a working schematic diagram of the silicon rod grinding method of the present application in an embodiment. Detailed implementation manners

[0038] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in this technology can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0039] In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It should be understood that other embodiments may also be used, and mechanical composition, structure, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower part", "above", "upper part", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the figure and another element or feature.

[0040] Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first transfer device may be referred to as the second transfer device, and similarly, the second transfer device may be referred to as the first transfer device, without departing from the scope of the various described embodiments. The first transfer device and the second transfer device both describe a transfer device, but unless the context clearly indicates otherwise in other ways, they are not the same transfer device. Similar situations also include the first transfer guide rail and the second transfer guide rail, the first processing location and the second processing location, the first driving mechanism and the second driving mechanism, the first silicon rod clamp and the second silicon rod clamp, etc.

[0041] Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the stated features, steps, operations, elements, components, items, kinds, and / or groups, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are to be construed as inclusive, meaning either any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition occurs only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some manner.

[0042] In the processing of silicon materials, it is usually necessary to go through multiple processes to obtain silicon wafers for industrial production. The original silicon material is usually a long silicon rod with a cylindrical structure. After the long silicon rod is cut by a silicon rod cutting machine, multiple short silicon rods are obtained; then, a silicon rod squaring machine is used to square the cut silicon rod segments to form single-crystalline silicon rods, and the cross-section of the obtained single-crystalline silicon rods is quasi-rectangular (including quasi-square); the surface damage of the single-crystalline silicon rods obtained by squaring needs to be removed, and chamfers are made on the edges and corners to eliminate internal stress. Subsequently, the single-crystalline silicon rods need to be ground and chamfered so that the surface shaping of the silicon rods meets the corresponding flatness and dimensional tolerance requirements before the final slicing can be carried out.

[0043] During the grinding process of single-crystalline silicon rods, rough grinding is always required first and then fine grinding, which are respectively realized by corresponding rough grinding tools and fine grinding tools. In the traditional working mode, after a single-crystalline silicon rod is rough-ground, it is transported to the fine grinding working area for fine grinding. After the fine grinding is completed, the processed silicon rod is transported out of the working area. This process is repeated in a large number of grinding operations. The grinding sequence of fine grinding and rough grinding makes the grinding tools of the silicon rod grinding machine inevitably in a waiting state during operation. For example, when the rough grinding tool is performing rough grinding, the fine grinding tool is in a waiting state, and when the fine grinding tool is performing fine grinding, the rough grinding tool is in a waiting state, and the grinding process takes a long time.

[0044] In the embodiments provided in the present application, to clarify the definition of directions and the operation modes between different structures, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined. The first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other pairwise. The length extension direction of the silicon rod grinding machine, that is, the length direction when the single-crystalline silicon rod to be ground is placed on it, is defined as the first direction, that is, the front-back direction. The width extension direction of the silicon rod grinding machine, that is, the left-right direction, is defined as the second direction. The vertical direction, that is, the up-down or lift-lower direction, is defined as the third direction.

[0045] Please refer to Figure 1 , which shows a schematic structural view of the silicon rod grinding machine of the present application in an embodiment. As Figure 1 shown, the silicon rod grinding machine includes a machine base 1, a first transfer device 2, a second transfer device 3, a rough grinding device 4, and a fine grinding device 5.

[0046] The silicon rod grinding machine of the present application is used to grind single crystal silicon rods, and the single crystal silicon rods are obtained by cutting the original silicon rod and then squaring the silicon rod through a silicon rod squaring device. The original silicon rod is usually a rod-shaped single crystal silicon grown from a melt by the Czochralski method or the floating zone melting method.

[0047] The machine base 1 has a silicon rod processing platform 11, and the silicon rod processing platform 11 is provided with a first processing area and a second processing area. The silicon rod processing platform 11 is arranged on the upper surface of the machine base 1. In an implementation manner of this embodiment, the processing platform is designed in a rectangular shape conforming to the shape of the machine base 1, and its first processing area and second processing area respectively correspond to the rough grinding processing area and the fine grinding processing area during grinding. As Figure 1 shown, the first processing area and the second processing area are symmetrically and parallelly arranged on the front and rear sides of the silicon rod processing platform 11, and the corresponding single crystal silicon rods carried can be independently processed in the first processing area and the second processing area.

[0048] The first transfer device 2 and the second transfer device 3 are arranged above the silicon rod processing platform 11 through an installation frame 12. The installation frame 12 is erected on the machine base 1 in a vertical frame structure, and the upper surface of the frame is higher than the silicon rod processing platform 11 and bears the first transfer device 2 and the second transfer device 3. In an embodiment of the present application, as Figure 1 shown, the first transfer device 2 and the second transfer device 3 are parallelly arranged on the left and right sides of the installation frame 12. The support structure of the installation frame 12 is arranged on the upper surface of the machine base 1. In the illustrated embodiment, the upper surface of the machine base 1 is rectangular, the support structure of the installation frame 12 is on the outer edge of the rectangle, and the upper surface of the installation frame 12 is approximately the same in shape and size as the upper surface of the machine base 1.

[0049] Please refer to Figure 2 , which shows a simplified structural top view of the silicon rod grinding machine of the present application in an embodiment. As Figure 2As shown, the first transfer device 2 includes a first silicon rod clamp 21, a first transfer guide rail 22, and a first driving mechanism (not shown in the figure). The first silicon rod clamp 21 is carried on the first transfer guide rail 22. The first transfer guide rail 22 is arranged on the upper surface of the installation frame along a first direction, restricting the first silicon rod clamp 21 thereon to move along the first direction. The first driving mechanism is used to drive the first silicon rod clamp 21 and the silicon rod clamped by it to move along the first transfer guide rail 22, and enable the first silicon rod clamp 21 to realize the transfer between a first processing location and a second processing location.

[0050] Please refer to Figure 3 , which shows a simplified structural schematic diagram of the silicon rod grinding machine of the present application in an embodiment. As Figure 3 shown, the first silicon rod clamp 21 includes a clamp arm mounting seat 211, at least two clamp arms 212, and a clamp arm driving mechanism 213.

[0051] Please continue to refer to Figure 1 , the overall first silicon rod clamp presents the clamp arm mounting seat arranged above, and the part outside the clamp arm mounting seat includes the clamp arms in a hanging state. The silicon rod clamp mounting seat is carried on the upper surface of the installation frame. The clamp arms extend downwardly from the clamp arm mounting seat in the hollow part of the installation frame to enable the silicon rod clamped by the clamp arms to be on the processing surface of the silicon rod processing platform.

[0052] The clamp arm mounting seat is arranged on the first transfer guide rail 22. In an implementation manner of this embodiment, a guide groove structure matching the first transfer guide rail 22 is provided at the bottom of the clamp arm mounting seat. The first transfer guide rail 22 is arranged along the first direction, and the length range of the first transfer guide rail 22 in the first direction at least covers the positions of the first working area and the second working area in the first direction to ensure the transfer of the silicon rod clamped by the first silicon rod clamp between the two working areas. In an implementation manner of this embodiment, the first transfer guide rail 22 is set to span the entire length of the installation frame in the first direction.

[0053] Please refer to Figure 4 , which shows a structural schematic diagram of the first silicon rod clamp 21 of the present application in an embodiment. As Figure 4 shown, the clamp arm mounting seat 211 also has a guide rail in the first direction. The clamp arms 212 are arranged on the clamp arm mounting seat 211 through the guide rail and can move in the first direction.

[0054] The at least one pair of clamping arms 212 are arranged oppositely along a first direction and are used for clamping two end faces of the silicon rod. The silicon rod is an elongated structure after squaring, and its length direction is placed along the first direction, and the end faces are cross sections at both ends of the length direction. The clamping arms 212 droop from the clamping arm mounting seat 211, and the clamping ends of the clamping arms are located below the clamping arms 212 for directly contacting and clamping the silicon rod.

[0055] The clamping arm driving mechanism 213 can drive at least one clamping arm in the at least one pair of clamping arms 212 to move along the first direction to adjust the distance between the pair of oppositely arranged clamping arms. The clamping ends of the two clamping arms arranged oppositely along the first direction approach each other and clamp the silicon rod, and keep the clamping state to transfer and grind the silicon rod between different working areas. After grinding, the silicon rod is transported to the carrying position and then moves away from each other to release the processed silicon rod. In some implementation manners of this embodiment, the clamping arm driving mechanism 213 can be set as a linear motor to drive the clamping arms 212 to move along the guide rail of the clamping arm mounting seat 211.

[0056] In an embodiment of the present application, the clamping arm driving mechanism 213 includes a driving motor, a driving gear and a pair of racks. The driving motor drives the gear to rotate, and the pair of racks are engaged with opposite ends of the driving gear. When the driving gear rotates, the pair of racks approach or move away from each other under the drive of the linear velocities in opposite directions at both ends of the gear. In an implementation manner of this embodiment, one end of each rack in the pair of racks is engaged with the driving gear, and the other end is respectively connected to a clamping arm, so that the pair of clamping arms approach or move away from each other along the guide rail of the clamping arm mounting seat in the first direction.

[0057] In an embodiment of the present application, the clamping arm has a rotary structure, as Figure 4 shown in the embodiment, the first silicon rod fixture further includes a clamping arm rotating mechanism 214 for driving the clamping arm 212 to rotate. In an implementation manner of this embodiment, a rotatable structure is provided at any clamping end of the pair of clamping arms 212 or at the two clamping ends of the pair of clamping arms 212. Driven by the clamping arm rotating mechanism 214, the clamping ends of the clamping arms rotate around the length direction of the silicon rod, that is, the first direction as the axis, and the clamped silicon rod rotates accordingly around the first direction as the axis. In actual grinding, the grinding surfaces and chamfers that the silicon rod needs to perform are on the four surfaces in the length direction and the edges at the intersections between the four surfaces. The clamping arms provided by the present application can realize the selection and control of different grinding surfaces and different edges of the silicon rod.

[0058] In some embodiments of the present embodiment, the clamping ends of the at least one pair of clamping arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rod are two end faces at both ends of the slender structure, the contact surfaces of the clamping ends of the clamping arms can be set as contact surfaces in the vertical direction or contact surfaces including planes in the vertical direction. The contact surface is arranged on a rotatable platform, and the cross-section of the platform can be set as a custom regular geometric shape or an irregular geometric shape.

[0059] In an embodiment of the present application, the rotatable platform can be set as an integral body hinged by a hinge device with a locking function and can rotate along the axis in the first direction. The axis of the rotation axis is connected to the clamping arm rotating mechanism.

[0060] In an embodiment of the present application, the clamping end of the clamping arm can be set as a rotatable frustum, and the circular plane of the frustum contacts the end face of the silicon rod and remains relatively stationary with the end face of the silicon rod after being pressed against the end face of the silicon rod. The clamping end of the silicon rod further includes a locking structure, and the clamping end of the clamping arm is in a locked state when grinding a selected plane. During the switching of different grinding surfaces, the clamping end of the silicon rod rotates along the center of the frustum under the drive of the clamping arm rotating mechanism.

[0061] Please refer to Figure 5 , shown as Figure 3 The enlarged structural schematic diagram of the silicon rod grinding machine in part A. As Figure 5 shown, the clamping end of the clamping arm includes a rotatable frustum and a series of protruding contacts arranged on the frustum, and each contact has a contact plane. The frustum rotates under the drive of the clamping arm rotating mechanism. In an implementation manner of the present embodiment, the protruding length of the contact, that is, the position in the first direction, is adjustable, so that during the process of clamping the silicon rod, for a silicon rod with a lower flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface is in a pressed state with the end face of the silicon rod. The protruding length is the length in the first direction from the circular plane of the frustum to the contact plane of the contact.

[0062] In an embodiment of the present application, a pressure sensor is provided at the clamping end of the first silicon rod clamp to adjust the protruding length of the contact based on the detected pressure state. Generally, during the process of clamping the silicon rod, a pair of clamping arms of the first silicon rod clamp approach each other in a first direction under the drive of a clamping arm drive mechanism until the contact surface of the clamping end contacts the end surface of the silicon rod to be clamped. When multiple contacts are provided at the clamping end and the pressure value detected when some contacts contact the end surface of the silicon rod in contact is less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contacts (generally in the direction approaching the end surface of the silicon rod); alternatively, each clamping end of a pair of clamping arms of the first silicon rod clamp is provided as a contact surface. During the process of clamping the silicon rod, the pair of clamping arms are driven by the clamping arm drive mechanism to approach each other towards the end surfaces at both ends of the silicon rod to achieve this. After the clamping end contacts the end surface of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor. When the set pressure range is reached, the clamping arm drive mechanism controls to stop the opposite movement of the pair of clamping arms.

[0063] The clamping arm rotation mechanism can be provided on one of the pair of clamping arms to drive the clamping ends of the pair of clamping arms to rotate with the clamped silicon rod; or the clamping arm rotation mechanism is provided on each of the pair of clamping arms and cooperates to control the two clamping ends of the pair of clamping arms to rotate at the same angle and in the same direction. In some implementation manners, the clamping arm rotation mechanism can be set as a driving motor.

[0064] When the silicon rod grinding machine grinds different sides of the silicon rod or chamfers the edge, it is achieved by driving the rotation of the clamping end of the clamping arm through the clamping arm rotation mechanism. Usually, for a single-crystalline silicon rod after squaring, when grinding different sides, the clamping arm rotation mechanism controls the clamping end of the clamping arm to rotate a certain angle, such as 90°, to achieve this. When chamfering different edges, it can be achieved by controlling the clamping end of the clamping arm to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a plane, when chamfering the silicon rod, the clamping arm rotation mechanism can control the clamping end of the clamping arm and the silicon rod it clamps to rotate at different angles for multiple chamfers to achieve this. For example, after grinding one side of the silicon rod, for an edge adjacent to this side and the edge opposite to this edge, multiple chamfers can be performed by rotating a certain angle, such as 40°, 45°, 50°, to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles starting from the initial position of grinding. The method of achieving chamfering can refer to patent disclosure documents such as CN108942570A, etc., and by driving the silicon rod to rotate a certain angle, the grinding tool cooperates to perform a transverse feed in the second direction to achieve the grinding of the edges and corners.

[0065] In an embodiment of the present application, such as Figure 3As shown, the first silicon rod clamp is a lifting type silicon rod clamp. In one implementation, the first silicon rod clamp includes a lifting guide rail and a driving device in the lifting direction. The clamping arm of the silicon rod clamp and the horizontal guide rail on the silicon rod mounting base that bears the clamping arm can move along the lifting guide rail in the third direction, which can be used to control the relative position in the vertical direction between the outer surface of the silicon rod and the grinding surface of the grinding tool, so as to select the ground surface of the silicon rod and the grinding area of the grinding tool for grinding. In one implementation of this embodiment, the lifting guide rail is arranged on the upright surface of the silicon rod mounting base, and a guide groove cooperating with the lifting guide rail and a driving mechanism for driving the clamping arm to move up and down are correspondingly arranged on the clamping arm; the driving mechanism includes a traveling lead screw and a traveling motor. The traveling lead screw is arranged along the lifting guide rail and connected to the traveling motor, and drives the clamping arm to move in the third direction under the drive of the traveling motor. In another implementation, each clamping arm of the pair of clamping arms is cantilevered as a telescopic device and simultaneously moves up and down under the drive of a telescopic drive mechanism.

[0066] Please continue to refer to Figure 2 , the first driving mechanism includes a first moving tooth rail, a first driving gear and a first driving power source. The first moving tooth rail is arranged along the first direction and is parallel to the first transfer guide rail 22. As Figure 2 shown in the embodiment, the first moving tooth rail is fixed on the upper surface of the mounting frame, is set to have a first direction dimension approximately the same as that of the first transfer guide rail 22, and is arranged parallel and adjacent to the first transfer guide rail 22.

[0067] The first driving gear is arranged on the first silicon rod clamp 21 and meshes with the first moving tooth rail, and is used to drive the first silicon rod clamp 21 to move along the first transfer guide rail 22. The first driving power source is used to drive the first driving gear. In one implementation of this application, the first driving gear is arranged on the clamping arm mounting base of the first silicon rod clamp 21. The first driving gear is driven to rotate by the first driving power source. The teeth of the first driving gear mesh with the first moving tooth rail and move along the first moving tooth rail. The first silicon rod clamp 21 connected to the first driving gear thus makes a corresponding movement on the first transfer guide rail 22.

[0068] In one implementation of this embodiment, the first driving power source can be set as a driving motor. The power output shaft of the driving motor is axially connected to the first driving gear to control the movement state of the first driving gear. Subsequently, the first driving power source controls the movement of the first silicon rod clamp and the silicon rod clamped by it in the first direction.

[0069] In an embodiment of the present application, the first driving mechanism may be disposed on the first silicon rod clamp, and includes a traveling motor and a traveling lead screw. The traveling lead screw is disposed along the first transfer guide rail and connected to the traveling motor, and drives the first silicon rod clamp to move along the first transfer guide rail under the drive of the traveling motor.

[0070] Please continue to refer to Figure 2 , the second transfer device 3 includes a second silicon rod clamp 31, a second transfer guide rail 32, and a second driving mechanism. The second silicon rod clamp 31 is carried on the second transfer guide rail 32; the second transfer guide rail 32 is disposed on the upper surface of the mounting frame and is disposed along the first direction, restricting the second silicon rod clamp 31 thereon to move along the first direction; the second driving mechanism is used to drive the second silicon rod clamp 31 and the silicon rod clamped thereby to move along the second transfer guide rail 32, and enable the second silicon rod clamp 31 to be transferred between the first processing location and the second processing location.

[0071] As Figure 2 shown, the second transfer guide rail 32 is parallel to the first transfer guide rail 22 along the first direction, and the first silicon rod clamp 21 of the first transfer device 2 and the second silicon rod clamp 31 of the second transfer device 3 move on mutually parallel paths defined by the first transfer guide rail 22 and the second transfer guide rail 32 respectively. When the first silicon rod clamp 21 and the silicon rod clamped thereby are transferred between different processing locations, the second silicon rod clamp 31 and the silicon rod clamped thereby can also be transferred between different processing locations. The movements of the first silicon rod clamp 21 and the second silicon rod clamp 31 are independent of each other, and the transfer guide rails defining their movement ranges are respectively disposed at different spatial positions without interference.

[0072] In an embodiment of the present application, the top views of the machine base of the silicon rod grinding machine and the mounting frame are both shown as regular rectangles. The first transfer guide rail and the second transfer guide rail are both arranged along the first direction, and are parallel and symmetrically arranged. The symmetry line is the central axis of the machine base in the first direction.

[0073] Please continue to refer to Figure 3 , as shown in the figure, the second silicon rod clamp 31 includes a clamp arm mounting seat 311, at least two clamp arms 312, and a clamp arm driving mechanism 313.

[0074] Please continue to refer to Figure 1 , as a whole, the second silicon rod clamp has the clamp arm mounting seat disposed above, and the part outside the clamp arm mounting seat includes the clamp arms in a hanging state. The silicon rod clamp mounting seat is carried on the upper surface of the mounting frame, and the clamp arms extend downwardly from the clamp arm mounting seat in the hollow part of the mounting frame, so that the silicon rod clamped by the clamp arms is on the processing surface of the silicon rod processing platform.

[0075] The clamping arm mounting seat is arranged on the second transfer guide rail 32. In an implementation manner of this embodiment, a guide groove structure matching the second transfer guide rail 32 is provided at the bottom of the clamping arm mounting seat. The second transfer guide rail 32 is arranged along the first direction, and the length range of the second transfer guide rail 32 in the first direction at least covers the positions of the first working area and the second working area in the first direction to ensure the transfer of the silicon rod clamped by the second silicon rod clamp between the two working areas. In an implementation manner of this embodiment, the second transfer guide rail 32 is set to span the entire length of the mounting frame in the first direction.

[0076] In an embodiment of the present application, the clamping arm mounting seat also has a guide rail in the first direction. Please refer to Figure 6 , which shows a schematic structural diagram of the second silicon rod clamp in an embodiment of the present application. As Figure 6 shown, the clamping arm 312 is arranged on the clamping arm mounting seat 311 through the guide rail 3111 and can move in the first direction.

[0077] The at least one pair of clamping arms 312 are arranged oppositely along the first direction and are used to clamp the two end faces of the silicon rod. The silicon rod is an elongated structure after squaring, and its length direction is placed along the first direction. The end faces are the cross-sections at both ends of the length direction. The clamping arms hang down from the clamping arm mounting seat, and the clamping ends of the clamping arms are located below the clamping arms for directly contacting and clamping the silicon rod.

[0078] The clamping arm driving mechanism 313 can drive at least one clamping arm in the at least one pair of clamping arms to move along the first direction to adjust the distance between the pair of oppositely arranged clamping arms. The clamping ends of the two clamping arms arranged oppositely along the first direction approach each other and clamp the silicon rod, and keep the clamping state to transfer and grind the silicon rod between different working areas. After the grinding is completed, the silicon rod is transported to the carrying position and then moves away from each other to release the processed silicon rod. In some implementation manners of this embodiment, the clamping arm driving mechanism can be set as a traveling motor to drive the clamping arm to move along the guide rail of the clamping arm mounting seat.

[0079] In an embodiment of the present application, the clamping arm driving mechanism includes a driving motor, a driving gear and a pair of racks. The driving motor drives the gear to rotate. The two ends of the pair of racks are engaged with the opposite ends of the driving gear. When the driving gear rotates, the pair of racks approach or move away from each other under the drive of the linear velocities in opposite directions at both ends of the gear. In an implementation manner of this embodiment, one end of each rack in the pair of racks is engaged with the driving gear, and the other end is respectively connected to a clamping arm, so that the pair of clamping arms move away from or approach each other along the guide rail of the clamping arm mounting seat in the first direction.

[0080] In an embodiment of the present application, the clamping arm has a rotary structure. AsFigure 6 In the illustrated embodiment, the second silicon rod clamp further includes a clamp arm rotation mechanism 314 for driving the clamp arm 312 to rotate. In an implementation of this embodiment, a rotatable structure is provided at any one clamping end or both clamping ends of the pair of clamp arms 312, and under the drive of the clamp arm rotation mechanism 314, the clamping end of the clamp arm 312 rotates about the length direction of the silicon rod, i.e., the first direction, as the axis, and the clamped silicon rod rotates accordingly about the first direction as the axis. In actual grinding, the grinding surfaces and chamfers required for the silicon rod are on the four surfaces in the length direction and the edges at the intersections between the four surfaces. The clamp arms provided by the present application can achieve the selection and control of different grinding surfaces and different edges of the silicon rod.

[0081] In some embodiments of this embodiment, the clamping ends of the at least one pair of clamp arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rod are the two end surfaces at both ends of the slender structure, the contact surfaces of the clamping ends of the clamp arms can be set as contact surfaces in the vertical direction or contact surfaces including planes in the vertical direction. The contact surfaces are provided on a rotatable platform, and the cross-section of the platform can be set as a custom regular geometric shape or an irregular geometric shape.

[0082] In an embodiment of the present application, the rotatable platform can be set as an integral body hinged by a hinge device with a locking function and can rotate about the axis in the first direction. The axis of the rotation axis is connected to the clamp arm rotation mechanism.

[0083] In an embodiment of the present application, the clamping end of the clamp arm can be set as a rotatable frustum, and the circular plane of the frustum contacts the end surface of the silicon rod and remains relatively stationary with the end surface of the silicon rod after being in close contact with the end surface of the silicon rod. The clamping end of the silicon rod further includes a locking structure, and the clamping end of the clamp arm is in a locked state when grinding a selected plane. During the switching between different grinding surfaces, the clamping end of the silicon rod rotates along the center of the frustum under the drive of the clamp arm rotation mechanism.

[0084] Please continue to refer to Figure 5 , the clamping end of the clamp arm includes a rotatable frustum and a series of protruding contacts provided on the frustum, and each contact has a contact plane. The frustum rotates under the drive of the clamp arm rotation mechanism. In an implementation of this embodiment, the protruding length of the contacts, i.e., the position in the first direction, is adjustable, so that during the clamping of the silicon rod, for a silicon rod with a relatively low flatness of the end surface, the protruding length of the contacts can be adjusted according to the end surface of the silicon rod, so that each contact surface is in close contact with the end surface of the silicon rod. The protruding length is the length in the first direction from the circular plane of the frustum to the contact plane of the contact.

[0085] In an embodiment of the present application, a pressure sensor is provided at the clamping end of the silicon rod clamp to adjust the protruding length of the contact based on the detected pressure state. Generally, during the process of clamping the silicon rod, a pair of clamping arms of the first silicon rod clamp approach each other along a first direction under the drive of the clamping arm drive mechanism until the contact surface of the clamping end comes into contact with the end surface of the silicon rod to be clamped. When multiple contacts are provided at the clamping end and the pressure value detected by some contacts in contact with the end surface of the contacted silicon rod is less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contacts (generally in the direction approaching the end surface of the silicon rod); alternatively, each clamping end of a pair of clamping arms of the first silicon rod clamp is provided as a contact surface. During the process of clamping the silicon rod, the pair of clamping arms are driven by the clamping arm drive mechanism to approach each other towards the end surfaces at both ends of the silicon rod to achieve this. After the clamping end comes into contact with the end surface of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor. When the set pressure range is reached, the clamping arm drive mechanism controls to stop the relative movement of the pair of clamping arms.

[0086] The clamping arm rotation mechanism can be arranged on one of the pair of clamping arms to drive the clamping ends of the pair of clamping arms to rotate with the clamped silicon rod; or the clamping arm rotation mechanism is arranged on each of the pair of clamping arms and cooperates to control the two clamping ends of the pair of clamping arms to rotate at the same angle and in the same direction. In some implementation manners, the clamping arm rotation mechanism can be set as a driving motor.

[0087] When the silicon rod grinding machine grinds different sides of the silicon rod or chamfers the edges, it is achieved by driving the rotation of the clamping ends of the clamping arms through the clamping arm rotation mechanism. Generally, for a single-crystalline silicon rod after squaring, when grinding different sides, the clamping arm rotation mechanism controls the clamping ends of the clamping arms to rotate a certain angle, such as 90°, to achieve this. When chamfering different edges, it can be achieved by controlling the clamping ends of the clamping arms to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a plane, when chamfering the silicon rod, the clamping arm rotation mechanism can control the clamping ends of the clamping arms and the silicon rod they clamp to rotate at different angles for multiple chamfers to achieve this. For example, after grinding one side of the silicon rod, for an edge adjacent to this side and the edge opposite to this edge, multiple chamfers can be performed by rotating a certain angle, such as 40°, 45°, 50°, etc., to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all the rotation angles starting from the initial position of grinding. The method of achieving chamfering can refer to patent disclosure documents such as CN108942570A, etc., and by driving the silicon rod to rotate a certain angle, the grinding tool cooperates to perform transverse feeding in the second direction to achieve the grinding of the edges and corners.

[0088] In an embodiment of the present application, such as Figure 3As shown, the second silicon rod clamp 31 is a lift-type silicon rod clamp. In one implementation, a guide rail in the lifting direction is provided on the clamp arm mounting seat 311 of the second silicon rod clamp 31. The clamp arm 312 of the second silicon rod clamp 31 and the guide rail on the silicon rod mounting seat that bears the clamp arm can move along the lifting guide rail in the third direction, and can be used to control the relative position in the vertical direction between the outer surface of the silicon rod and the grinding surface of the grinding tool, so as to select the ground surface of the silicon rod and the grinding area used by the grinding tool for grinding. In one implementation of this embodiment, the lifting guide rail is provided on the vertical surface of the silicon rod mounting seat, and a guide groove matching the lifting guide rail and a driving mechanism for driving the clamp arm to move up and down are correspondingly provided on the clamp arm 312; the driving mechanism includes a traveling lead screw and a traveling motor. The traveling lead screw is arranged along the lifting guide rail and is connected to the traveling motor, and drives the clamp arm to move in the third direction under the drive of the traveling motor. In another implementation, each clamp arm of the pair of clamp arms 312 is cantilevered as a telescopic device and simultaneously moves up and down under the drive of the telescopic drive mechanism.

[0089] Please continue to refer to Figure 2 , the second driving mechanism includes a second moving tooth rail, a second driving gear and a second driving power source. The second moving tooth rail is arranged along the first direction and is parallel to the second transfer guide rail. As Figure 2 shown in the embodiment, the second moving tooth rail is fixed on the upper surface of the mounting frame, is set to have a first direction dimension approximately the same as that of the second transfer guide rail, and is arranged parallel and adjacent to the second transfer guide rail.

[0090] The second driving gear is arranged on the second silicon rod clamp 31 and meshes with the second moving tooth rail, and is used to drive the second silicon rod clamp 31 to move along the second transfer guide rail 32. The second driving power source is used to drive the second driving gear. In one implementation of this application, the second driving gear is arranged on the silicon rod mounting seat of the second silicon rod clamp 31. The second driving gear is driven to rotate by the second driving power source. The teeth of the second driving gear mesh with the second moving tooth rail and move along with the second moving tooth rail. The second silicon rod clamp 31 connected to the second driving gear thus makes a corresponding movement on the second transfer guide rail 32.

[0091] In one implementation of this embodiment, the second driving power source can be set as a driving motor. The power output shaft of the driving motor is axially connected to the second driving gear to control the movement state of the second driving gear. Subsequently, the first silicon rod clamp and the silicon rod clamped by it are controlled by the second driving power source to move in the first direction.

[0092] In one embodiment of the present application, the second driving mechanism may be arranged on the second silicon rod clamp, including a traveling motor and a traveling screw. The traveling screw is arranged along the second transfer guide rail and connected to the traveling motor. Under the drive of the traveling motor, the second silicon rod clamp is driven to move along the second transfer guide rail.

[0093] See also Figure 7 , which is a schematic diagram of the structure of a silicon rod grinding machine in one embodiment of the present application. Figure 7 As shown, the rough grinding device 4 includes at least one pair of rough grinding tools 41 and a rough grinding tool advance and retreat mechanism 42 .

[0094] The at least one pair of rough grinding tools 41 is arranged at the first processing position, and the pair of rough grinding tools 41 is arranged opposite to each other in the second direction. In some implementations, the rough grinding tool 41 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain particle size and roughness, and the two grinding wheels arranged opposite to each other are respectively provided to two symmetrical grinding surfaces of the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is formed by consolidating abrasive grains and a binder to form a surface with an abrasive grain portion that contacts and rotates with the surface of the silicon rod to be ground. The rough grinding wheel has a certain abrasive grain size and abrasive grain density, and there are pores in the grinding wheel. The abrasive of the grinding wheel can be set to aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods, The abrasive has a hardness greater than the hardness of silicon material.

[0095] The rough grinding tool advance and retreat mechanism 42 is used to drive at least one of the at least one pair of rough grinding tools 41 to move horizontally along the second direction, which is the width direction of the silicon rod grinder defined perpendicular to the first direction. The rough grinding tool advance and retreat mechanism 42 controls the movement of at least one of the pair of rough grinding tools 41 in the second direction to adjust the relative distance between the two rough grinding tools in the pair of rough grinding tools 42 in the second direction, thereby controlling the feed amount during the grinding process, that is, determining the grinding amount. When the first transfer device and / or the second transfer device carries and transfers the silicon rod through the first processing location to the second processing location or when the silicon rod is polished and transferred through the first processing location to be transferred out of the processing location, the at least one pair of rough grinding tools 41 moves in the second direction under the control of the rough grinding tool advance and retreat mechanism 42 to form a path for safe transfer of the silicon rod, that is, during the transfer process, the first transfer device and / or the second transfer device does not collide with the silicon rod it carries and the rough grinding tool 41.

[0096] See also Figure 8 , which is a simplified structural schematic diagram of a silicon rod grinding machine of the present application in one embodiment. Figure 8As shown, in some implementations, a rough grinding tool advancing and retracting mechanism is configured for each pair of rough grinding tools 41. The rough grinding tool advancing and retracting mechanism includes a sliding guide rail 422, a driving motor 421, and a ball screw (not shown in the figure). The sliding guide rail 422 is arranged along the second direction and is disposed on the first processing position of the machine base. A guide groove along the second direction that cooperates with the sliding guide rail 422 is provided at the bottom of the rough grinding tool 41. The ball screw is arranged along the sliding guide rail 422 and is axially connected to the driving motor 421.

[0097] In an embodiment of the present application, one grinding tool in the at least one pair of rough grinding tools is configured with the driving motor and the ball screw. The relative distance between the rough grinding tools is changed by moving one of the relatively arranged pair of grinding tools.

[0098] In an embodiment of the present application, each grinding tool in the at least one pair of rough grinding tools is configured with the driving motor and the ball screw. The driving motor can separately control the position of the corresponding grinding tool in the second direction, or based on a certain cooperation relationship, the two grinding tools move away from or close to each other at the same linear speed. For example, during the grinding process, the pair of rough grinding tools feed towards each other at the same speed in the second direction, and the grinding wheels of the pair of rough grinding tools rotate at the same linear speed for grinding.

[0099] In an embodiment of the present application, a pair of rough grinding tools are driven by the same driving motor to move in the second direction at equal and opposite speeds. In one implementation of this embodiment, the rough grinding tool advancing and retracting mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail is arranged along the second direction and is disposed on the first processing position of the machine base. A guide groove along the second direction that cooperates with the guide rail is provided at the bottom of the rough grinding tool. The driving motor drives the gear to rotate. The two ends of the pair of racks are meshed with the opposite ends of the driving gear. When the driving gear rotates, the pair of racks move closer to or away from each other under the drive of the linear speeds in opposite directions at both ends of the gear. In one implementation of this embodiment, one end of each of the pair of racks is meshed with the driving gear, and the other end is respectively connected to a rough grinding tool, so that the pair of rough grinding tools move away from or close to each other along the guide rail in the second direction.

[0100] In one embodiment of the present application, the rough grinding device also includes a cooling device to cool the at least one pair of rough grinding tools, reduce the damage to the surface layer of the silicon rod during the grinding process, and improve the grinding efficiency and service life of the grinding wheel. In one implementation of this embodiment, the cooling device includes a cooling water pipe, a guide groove and a guide hole. In some embodiments, a protective cover for placing cooling water into the rotating drive motor of the grinding wheel is provided on the outer edge of the circumference of the grinding wheel. One end of the cooling water pipe is connected to the cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The guide groove is provided on the protective cover as the contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source. The cooling water sucked by the cooling water pipe is directed to the guide groove and the guide hole on the surface of the grinding wheel, and is guided to the contact surface between the grinding wheel and the ground silicon rod for cooling. During the grinding of the grinding wheel, the cooling water in the guide hole of the grinding wheel is centrifugally entered into the grinding wheel for sufficient cooling.

[0101] The at least one pair of rough-grinding tools corresponds to the at least one pair of clamping arms. During the grinding process, the silicon rod is clamped by the opposite pair of clamping arms and moves in the first direction to control the order of grinding and chamfering the side and edges of the silicon rod. The reciprocating motion can ensure that the silicon rod is fully ground in the length direction of the silicon rod. The pair of rough-grinding tools arranged opposite to each other move in the second direction to determine the feed amount of grinding the contact surface between the tool and the silicon rod.

[0102] Please continue reading Figure 7 The fine grinding device 5 includes at least one pair of fine grinding tools 51 and a fine grinding tool advance and retreat mechanism 52.

[0103] The at least one pair of fine grinding tools 51 is arranged at the first processing position, and the pair of fine grinding tools 51 is arranged opposite to each other in the second direction. In some implementations, the fine grinding tool 51 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain particle size and roughness, and the two grinding wheels arranged opposite to each other are respectively provided to two symmetrical grinding surfaces of the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is formed by consolidating abrasive grains and a binder to form a surface with an abrasive grain portion that contacts and rotates with the surface of the silicon rod to be ground. The fine grinding wheel has a certain abrasive grain size and abrasive grain density, and there are pores in the grinding wheel. In particular, the abrasive grain size of the fine grinding tool grinding wheel is smaller than the abrasive grain size of the rough grinding tool grinding wheel, so that the ground surface of the silicon rod can form a surface with a higher surface finish during grinding; or the abrasive grain density of the fine grinding tool grinding wheel is greater than the abrasive grain density of the rough grinding tool grinding wheel, and has a higher finish.

[0104] The abrasive of the grinding wheel can be set to abrasive grains with a hardness greater than that of silicon material, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the needs of grinding silicon rods.

[0105] The fine grinding tool advancing and retracting mechanism 52 is used to drive at least one of the at least one pair of fine grinding tools 51 to move laterally in the second direction, which is the width direction of the silicon rod grinding machine defined perpendicular to the first direction. The fine grinding tool advancing and retracting mechanism 52 controls the movement of at least one of the pair of fine grinding tools 51 in the second direction, thereby controlling the relative distance between the two opposite grinding tools of the pair of fine grinding tools 51 in the second direction, and further controlling the feed amount during grinding, that is, determining the grinding amount. When the first transfer device and / or the second transfer device carry and transfer the silicon rod to move from the second processing position to the first processing position or when the grinding of the silicon rod is completed and it is transferred through the second processing position to be removed from the processing position, the at least one pair of fine grinding tools 51 move in the second direction under the control of the fine grinding tool advancing and retracting mechanism 52 to form a path for the safe transfer of the silicon rod, that is, during the transfer process, no collision occurs between the first transfer device and / or the second transfer device, the silicon rod carried by it, and the fine grinding tools 51.

[0106] Please continue to refer to Figure 8 , in some implementation manners, a fine grinding tool advancing and retracting mechanism is configured for each pair of fine grinding tools 51. The fine grinding tool advancing and retracting mechanism includes a sliding guide rail 522, a driving motor 521, and a ball screw (not shown in the figure). The sliding guide rail 522 is arranged in the second direction and is disposed on the first processing position of the machine base. A guide groove in the second direction that cooperates with the sliding guide rail 522 is provided at the bottom of the fine grinding tool 51. The ball screw is arranged along the sliding guide rail 522 and is axially connected to the driving motor 521.

[0107] In an embodiment of the present application, one of the at least one pair of fine grinding tools is configured with the driving motor and the ball screw, and the relative distance between the fine grinding tools is changed by moving one of the pair of relatively arranged grinding tools.

[0108] In an embodiment of the present application, each of the at least one pair of fine grinding tools is configured with the driving motor and the ball screw. The driving motor can separately control the position of the corresponding grinding tool in the second direction, or based on a certain cooperation relationship, the two grinding tools move away from or close to each other at the same linear speed. For example, during grinding, the pair of fine grinding tools feed towards each other at the same speed in the second direction, and the grinding wheels of the pair of fine grinding tools rotate at the same linear speed for grinding.

[0109] In an embodiment of the present application, a pair of fine grinding tools are driven by the same driving motor to move in the second direction at equal and opposite speeds. In one implementation of this embodiment, the fine grinding tool advancing and retracting mechanism includes a driving motor, a driving gear, a pair of racks, and guide rails. The guide rails are arranged in the second direction and are located on the first processing area of the machine base. The bottom of the fine grinding tool is provided with a guide groove in the second direction that cooperates with the guide rails. The driving motor drives the gear to rotate. The two ends of the pair of racks that are opposite to the driving gear are engaged. When the driving gear rotates, the pair of racks are driven by the linear speeds in opposite directions at both ends of the gear to move closer to or away from each other. In one implementation of this embodiment, one end of each rack in the pair of racks is engaged with the driving gear, and the other end is respectively connected to a fine grinding tool, so that the pair of fine grinding tools move away from or close to each other along the guide rails in the second direction.

[0110] In an embodiment of the present application, the fine grinding device further includes a cooling device to cool the at least one pair of fine grinding tools, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and service life of the grinding wheel. In one implementation of this embodiment, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole. In some implementations, a protective cover for the rotating driving motor for placing cooling water to enter the grinding wheel is provided on the outer circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The diversion groove is provided on the protective cover as the contact point between the protective cover and the cooling water pipe. The diversion hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source. The cooling water sucked through the cooling water pipe reaches the diversion groove and the diversion hole on the surface of the grinding wheel, and is guided to directly reach the contact surface between the grinding wheel and the silicon rod being ground for cooling. During the grinding of the grinding wheel, the cooling water in the diversion hole enters the inside of the grinding wheel by centrifugal force for sufficient cooling.

[0111] The at least one pair of fine grinding tools corresponds to the at least one pair of clamping arms. During the grinding process, a pair of clamping arms arranged oppositely clamp the silicon rod and move in the first direction to control the order of grinding and chamfering the side and edges of the silicon rod. Reciprocating motion can ensure sufficient grinding of the silicon rod in the length direction. A pair of fine grinding tools arranged oppositely move in the second direction to determine the feed amount of grinding on the contact surface between the grinding tool and the silicon rod.

[0112] The silicon rod grinding machine provided by the present application can have the first processing area and the second processing area in a working state simultaneously during actual grinding, and can perform rough grinding and fine grinding on different silicon rods respectively. In one embodiment, a single-crystalline silicon rod to be ground is transferred to the first processing area. A pair of rough grinding tools of the rough grinding device are driven by a rough grinding tool advancing and retreating mechanism to move laterally to both sides of the silicon rod, and a pair of clamping arms of the first transfer device clamp the silicon rod to cooperate with the rough grinding device for grinding; after the rough grinding is completed, the clamping arms of the first transfer device transfer the silicon rod that has been rough ground to the second processing area along the first direction. The fine grinding tools in the second processing area are driven by a fine grinding tool advancing and retreating mechanism to move to both sides of the silicon rod, and then the silicon rod is finely ground by the cooperation of the clamping arms of the first transfer device and the fine grinding tools. At the same time, another silicon rod to be ground can be placed in the first processing area and clamped by the clamping arms of the second transfer device. The rough grinding tools are driven by a rough grinding tool advancing and retreating mechanism to move to both sides of the second transfer guide rail, that is, both sides of the silicon rod to be ground, to perform rough grinding on it. When the rough grinding is completed, the silicon rod in the second processing area mentioned above has been finely ground. The second transfer device transfers the silicon rod that has been rough ground to the second processing area for fine grinding. The silicon rod clamped by the first transfer device is transferred out of the silicon rod processing platform after the fine grinding is completed. Then the first transfer device continues to clamp the silicon rod that has not been ground and repeats the above process.

[0113] In some embodiments of the present application, the first silicon rod clamp and the second silicon rod clamp include multiple pairs of clamping arms arranged oppositely in the first direction, and multiple pairs of relatively arranged rough grinding tools and fine grinding tools are respectively arranged at the rough grinding device and the fine grinding device. In some implementation manners, the number of pairs of clamping arms on the first silicon rod clamp, the second silicon rod clamp, the rough grinding device, and the fine grinding device is the same as the number of pairs of grinding tools. The driving mechanisms of each pair of clamping arms and each pair of grinding tools are relatively independent, and multiple silicon rods can be transferred and ground relatively independently between the first processing area and the second processing area at the same time.

[0114] In some embodiments of the present application, the silicon rod grinding machine further includes a silicon rod transfer device. The silicon rod transfer device is used to transfer the silicon rod to be processed to the first processing area or transfer the silicon rod after grinding out of the silicon rod processing platform.

[0115] Please continue to refer to Figure 1, the silicon rod transfer device 6 is adjacent to the first processing area of the silicon rod processing platform and penetrates through the first transfer device 2 and the second transfer device 3. In an embodiment of the present application, the silicon rod transfer device 6 can be set as a conveyor belt mechanism, and its conveying direction is along the second direction, transporting the silicon rod located on the transfer device to the first processing area. The two end points of the conveyor belt can be set on the left and right sides of the machine base, and the conveying distance covers the width of the silicon rod grinding machine. According to the processing requirements, the silicon rod can be transferred from the loading position to the first transfer rail or the second transfer rail at the first processing area, or the silicon rod at the first processing area or the second processing area can be transferred out of the silicon rod processing platform to the unloading position. The loading position and the unloading position can be the same position, located at the same end of the silicon rod transfer device; or they can be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

[0116] In some implementation manners of the present application, the silicon rod transfer device 6 can also be set as a chain conveyor mechanism or a speed chain mechanism to realize the transfer of the silicon rod between different processing areas and the loading position or the unloading position in the second direction.

[0117] In some embodiments of the present application, the silicon rod processing platform is also provided with a waiting area, and the silicon rod grinding machine also includes a silicon rod transfer device.

[0118] Please refer to Figure 9 , which shows a schematic structural diagram of the silicon rod grinding machine of the present application in an embodiment. As Figure 9 shown, the waiting area 113 is arranged beside the machine base in the second direction and can be used as the loading position of the silicon rod to be processed and the unloading position of the processed silicon rod.

[0119] The silicon rod transfer device 6 is adjacent to the waiting area 113 of the silicon rod processing platform 11, and is used to transfer the silicon rod to be processed to the waiting area 113 of the silicon rod processing platform 11 or transfer the processed silicon rod on the waiting area 113 out of the silicon rod processing platform 11. In an implementation manner, the silicon rod transfer device 6 can be set as a conveyor belt mechanism, and its conveying direction is along the second direction, transporting the silicon rod located on the transfer device to the first processing area. The two end points of the conveyor belt can be set on the left and right sides of the machine base, and the conveying distance covers the width of the silicon rod grinding machine. According to the processing requirements, the silicon rod can be transferred from the loading position to the first transfer rail or the second transfer rail at the first processing area, or the silicon rod at the first processing area or the second processing area can be transferred out of the silicon rod processing platform 11 to the unloading position. The loading position and the unloading position can be the same position, located at the same end of the silicon rod transfer device; or they can be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

[0120] In some implementations of the present application, the silicon rod transfer device 6 can also be set as a chain conveyor mechanism or a speed chain mechanism to transfer the silicon rod between different processing positions and the loading position or the unloading position in the second direction.

[0121] Through the silicon rod grinding machine provided by the present application, during the grinding process of the silicon rod, the rough grinding device and the fine grinding device in the first working position and the second working position can respectively grind the silicon rods in different grinding stages, doubling the grinding efficiency while maintaining the size specifications and costs of the silicon rod grinding machine, reducing the time-consuming of silicon rod processing, and improving the economic benefits.

[0122] To implement the use of the silicon rod grinding machine provided by the present application, the present application also provides a silicon rod grinding method in a second aspect. The silicon rod grinding method can be used in a silicon rod grinding machine. The silicon rod grinding machine includes a machine base having a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing position and a second processing position; the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device. Among them, the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, and the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism.

[0123] The fine grinding device and the rough grinding device are respectively located in different processing positions; in the embodiments provided by the present application, the rough grinding device and the fine grinding device respectively correspond to the first processing position and the second processing position.

[0124] The fine grinding device includes at least a pair of fine grinding tools, which can simultaneously grind the opposite sides of the silicon rod; the rough grinding device includes at least a pair of rough grinding tools, which can simultaneously grind the opposite sides of the silicon rod. In some implementations, at least one of the pair of rough grinding tools of the rough grinding device has a degree of freedom of movement in the second direction, and at least one of the pair of fine grinding tools of the fine grinding tools has a degree of freedom of movement in the second direction. For the silicon rod clamped on the first transfer guide rail or the second transfer guide rail at the first processing position, the rough grinding device can move along the second direction to both sides of the silicon rod to perform rough grinding operations, and control the grinding amount of the silicon rod being ground during the rough grinding operation; for the silicon rod clamped on the first transfer guide rail or the second transfer guide rail at the second processing position, the fine grinding device can move along the second direction to both sides of the silicon rod to perform fine grinding operations, and control the grinding amount of the silicon rod being ground during the fine grinding operation.

[0125] The first driving mechanism drives the first silicon rod clamp to move along the first transfer guide rail; the second driving mechanism drives the second silicon rod clamp to move along the second transfer guide rail. The first transfer guide rail and the first transfer guide rail are arranged in parallel on the machine base and are both arranged along the first direction.

[0126] The first direction and the second direction are perpendicular to each other. In the embodiments provided in the present application, the first direction is along the length direction of the machine base, and the second direction is the width direction of the machine base.

[0127] In some embodiments, the silicon rod grinding machine to which the silicon rod grinding method can be applied includes any one of the embodiments shown in Figures 1 to 9 the silicon rod grinding machine of the embodiments shown.

[0128] The silicon rod grinding method includes the following steps:

[0129] Please refer to Figure 10 , which shows a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. In the state shown in Figure 10 , the first silicon rod 71 is loaded at the first processing station. The first silicon rod clamp 21 in the first transfer device is made to clamp the first silicon rod 71, and the rough grinding device 4 is made to perform a rough grinding operation on the first silicon rod 71 located at the first processing position. In some implementation manners, the first silicon rod 71 moves along the first direction under the clamping of the first silicon rod clamp 21. During the rough grinding process and the subsequent fine grinding process, the first silicon rod clamp 21 drives the first silicon rod 71 to move, so that the contact surface between the first silicon rod 71 and the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of two opposite side surfaces is completed; alternatively, the first silicon rod clamp 21 drives the first silicon rod 71 to move circuitously in the first direction, so that the contact surface between the first silicon rod 71 and the rough grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The first silicon rod clamp 21 includes at least a pair of clamping arms, and the clamping arms are rotatable. Under the clamping of the clamping arms, the first silicon rod 71 can rotate along the axis line in the first direction, that is, the switching and chamfering of the grinding of different side surfaces of the first silicon rod 71 are realized.

[0130] Please refer to Figure 11 , which shows a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. In the state shown in Figure 11 , after the rough grinding of the first silicon rod 71 at the first processing position is completed, the first driving mechanism in the first transfer device is made to drive the first silicon rod clamp 21 and the first silicon rod 71 clamped thereby to move along the first transfer guide rail 22, so as to transfer the first silicon rod 71 from the first processing position to the second processing position, and the fine grinding device 5 is made to perform a fine grinding operation on the first silicon rod 71; at this stage, the second silicon rod 72 is loaded at the first processing position, the second silicon rod clamp 31 in the second transfer device is made to clamp the second silicon rod 72, and the rough grinding device 4 is made to perform a rough grinding operation on the second silicon rod 72 located at the first processing position.

[0131] In some implementations, the second silicon rod 72 moves along a first direction under the clamping of the second silicon rod clamp 31. During the rough grinding process and the subsequent fine grinding process, the second silicon rod clamp 31 drives the second silicon rod 72 to move, so that the contact surface of the second silicon rod 72 with the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of two opposite side surfaces is completed; alternatively, the second silicon rod clamp 31 drives the second silicon rod 72 to move circuitously in the first direction, so that the contact surface of the second silicon rod 72 with the grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The second silicon rod clamp 31 includes at least a pair of clamping arms, and the clamping arms are rotatable. Under the clamping of the clamping arms, the second silicon rod 72 can rotate along the axis line in the first direction, that is, the grinding switching and chamfering of different side surfaces of the clamped second silicon rod 72 are realized.

[0132] Please refer to Figure 12 , which shows a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. When the fine grinding operation of the first silicon rod 71 located in the second processing area is completed, the rough grinding operation of the second silicon rod 72 located in the first processing area is completed. In the state as shown in Figure 12 , the first driving mechanism in the first transfer device is made to drive the first silicon rod clamp 21 and the first silicon rod 71 clamped by it to move along the first transfer guide rail 22, so as to transfer the first silicon rod 71 from the second processing area to the first processing area, and then unload and load the third silicon rod 73 from the first processing area. The first silicon rod clamp 21 in the first transfer device is made to clamp the third silicon rod 73, and the rough grinding device 4 is made to perform a rough grinding operation on the third silicon rod 73 located in the first processing area; at this stage, the second driving mechanism in the second transfer device is made to drive the second silicon rod clamp 31 and the second silicon rod 72 clamped by it to move along the second transfer guide rail 32, so as to transfer the second silicon rod 72 from the first processing area to the second processing area, and the fine grinding device 5 is made to perform a fine grinding operation on the second silicon rod 72 located in the second processing area.

[0133] When the fine grinding operation of the second silicon rod 72 located in the second processing area is completed, the rough grinding operation of the third silicon rod 73 located in the first processing area is completed. The second driving mechanism of the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by it to move along the second transfer guide rail 32 from the second processing area to the first processing area, so that the ground second silicon rod 72 can be unloaded and a new silicon rod to be ground can be loaded.

[0134] The silicon rod grinding method provided by the present application realizes rough grinding and fine grinding of different silicon rods on the same silicon rod grinding equipment at the same time, reduces the waiting time for grinding, and repeats the above grinding steps, that is, realizes the grinding and transfer of a large number of silicon rods.

[0135] The third aspect of the present application further provides a method for grinding a silicon rod, which can be used in a silicon rod grinding machine.

[0136] The silicon rod grinding machine includes a machine base with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area, a second processing area, and a waiting area; the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device; wherein, the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, and the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism.

[0137] The waiting area is adjacent to the first processing area, and is used for loading the silicon rod to be ground that needs to be transferred into the processing area or for unloading the silicon rod after grinding.

[0138] The fine grinding device and the rough grinding device are located in different processing areas respectively; in the embodiment provided by the present application, the rough grinding device and the fine grinding device respectively correspond to the first processing area and the second processing area.

[0139] The fine grinding device includes at least a pair of fine grinding tools, which can grind the opposite sides of the silicon rod simultaneously; the rough grinding device includes at least a pair of rough grinding tools, which can grind the opposite sides of the silicon rod simultaneously. In some implementation manners, at least one grinding tool in a pair of rough grinding tools of the rough grinding device has a degree of freedom of movement in the second direction, and at least one fine grinding tool in a pair of fine grinding tools of the fine grinding tool has a degree of freedom of movement in the second direction. For the silicon rod clamped on the first transfer guide rail or the second transfer guide rail in the first processing area, the rough grinding device can move along the second direction to both sides of the silicon rod to perform rough grinding operations, and control the grinding amount of the silicon rod being ground during the rough grinding operation; for the silicon rod clamped on the first transfer guide rail or the second transfer guide rail in the second processing area, the fine grinding device can move along the second direction to both sides of the silicon rod to perform fine grinding operations, and control the grinding amount of the silicon rod being ground during the fine grinding operation.

[0140] The first driving mechanism drives the first silicon rod clamp to move along the first transfer guide rail; the second driving mechanism drives the second silicon rod clamp to move along the second transfer guide rail. The first transfer guide rail and the first transfer guide rail are arranged in parallel on the machine base and are both arranged along the first direction.

[0141] The first direction and the second direction are perpendicular to each other. In the embodiment provided by the present application, the first direction is along the length direction of the machine base, and the second direction is the width direction of the machine base.

[0142] In some embodiments, the silicon rod grinding machine to which the silicon rod grinding method can be applied includes as Figures 1 to 9The silicon rod grinding machine of any one of the embodiments shown.

[0143] The silicon rod grinding method includes the following steps:

[0144] Load the first silicon rod onto the waiting position, let the first silicon rod clamp in the first transfer device clamp the first silicon rod, and let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod clamped by it to move along the first transfer guide rail, so as to transfer the first silicon rod from the waiting position to the first processing position. Please refer to Figure 13 , which shows a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. In the state as Figure 13 shown, the first silicon rod 71 is transferred to the first processing position, and the rough grinding device 4 performs rough grinding operations on the first silicon rod 71 located at the first processing position; at this stage, the second silicon rod 72 is loaded onto the waiting position 113, and the second silicon rod clamp 31 in the second transfer device clamps the second silicon rod 72.

[0145] In some implementation manners, the first silicon rod 71 moves along the first direction under the clamping of the first silicon rod clamp 21. During the rough grinding process and the subsequent fine grinding process, the first silicon rod clamp 21 drives the first silicon rod 71 to move from one end to the other end to complete the grinding of two opposite sides; alternatively, the first silicon rod clamp 21 drives the first silicon rod 71 to move circuitously in the first direction, so that the contact surface between the first silicon rod 71 and the rough grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The first silicon rod clamp 21 includes at least a pair of clamping arms, and the clamping arms are rotatable. Under the clamping of the clamping arms, the first silicon rod 71 can rotate along the axis line in the first direction, that is, the switching and chamfering of the grinding of different sides of the first silicon rod 71 are realized.

[0146] After the rough grinding of the first silicon rod 71 at the first processing position is completed, let the first driving mechanism in the first transfer device drive the first silicon rod clamp 21 and the first silicon rod 71 clamped by it to move along the first transfer guide rail 22, so as to transfer the first silicon rod 71 from the first processing position to the second processing position, and let the fine grinding device 5 perform fine grinding operations on the first silicon rod 71; at this stage, let the second driving mechanism in the second transfer device drive the second silicon rod clamp 31 and the second silicon rod 72 clamped by it to move along the second transfer guide rail 32, so as to transfer the second silicon rod 72 from the waiting position 113 to the first processing position, and let the rough grinding device 4 perform rough grinding operations on the second silicon rod 72 located at the first processing position. Please refer to Figure 14 , which shows a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. In the state as Figure 14In the state shown, the first silicon rod 71 is transferred to the second processing location, and is ground by a fine grinding tool; the second silicon rod 72 is transferred to the first processing location, and is ground by a rough grinding tool.

[0147] In some implementation manners, the second silicon rod 72 moves along a first direction under the clamping of the second silicon rod fixture 31. During the rough grinding process and the subsequent fine grinding process, the second silicon rod fixture 31 drives the second silicon rod 72 to move, so that the contact surface between the second silicon rod 72 and the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of two opposite side surfaces is completed; or, the second silicon rod fixture 31 drives the second silicon rod 72 to move circuitously in the first direction, so that the contact surface between the second silicon rod 72 and the grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The second silicon rod fixture 31 includes at least a pair of clamping arms, the clamping arms are rotatable, and the second silicon rod 72 can rotate along the axis line in the first direction under the clamping of the clamping arms, that is, the grinding switching and chamfering of different side surfaces of the clamped second silicon rod 72 are realized.

[0148] Please refer to Figure 15 , which shows a simplified structural schematic diagram of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application in an embodiment. When the fine grinding operation of the first silicon rod 71 located at the second processing location is completed, the rough grinding operation of the second silicon rod 72 located at the first processing location is completed. In the state as Figure 15 shown, the first driving mechanism in the first transfer device drives the first silicon rod fixture 21 and the first silicon rod 71 clamped thereby to move along the first transfer guide rail 22, so as to transfer the first silicon rod 71 from the second processing location to the waiting location 113, and then unload and load the third silicon rod 73 from the waiting location 113; make the first silicon rod fixture 21 in the first transfer device clamp the third silicon rod 73, and drive the first silicon rod fixture 21 and the third silicon rod 73 clamped thereby to move along the first transfer guide rail 22 by the first driving device, so that the third silicon rod 73 is transferred from the waiting location 113 to the first processing location, and make the rough grinding device 4 perform a rough grinding operation on the third silicon rod 73 located at the first processing location; at this stage, make the second driving mechanism in the second transfer device drive the second silicon rod fixture 31 and the second silicon rod 72 clamped thereby to move along the second transfer guide rail 32, so as to transfer the second silicon rod 72 from the first processing location to the second processing location, and make the fine grinding device 5 perform a fine grinding operation on the second silicon rod 72 located at the second processing location.

[0149] When the fine grinding operation of the second silicon rod 72 located at the second processing position is completed, the rough grinding operation of the third silicon rod 73 located at the first processing position is completed. The second driving mechanism of the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 held by it to be transferred along the second transfer guide rail 32 from the second processing position to the waiting position 113, and then the ground second silicon rod 72 can be unloaded and a new silicon rod to be ground can be loaded.

[0150] The above embodiments are only illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present application should still be covered by the claims of the present application.

Claims

1. A silicon rod grinding machine, characterized in that, it includes: A machine base with a silicon rod processing platform; the silicon rod processing platform is provided with a first processing area and a second processing area; A first transfer device is arranged above the silicon rod processing platform through a mounting frame; the first transfer device includes a first silicon rod clamp, a first transfer guide rail arranged on the mounting frame along a first direction, and a first driving mechanism for driving the first silicon rod clamp and the silicon rod it clamps to move along the first transfer guide rail and transfer between the first processing area and the second processing area; the first silicon rod clamp is a lifting type silicon rod clamp; A second transfer device is arranged above the silicon rod processing platform through a mounting frame; the second transfer device includes a second silicon rod clamp, a second transfer guide rail arranged on the mounting frame along a first direction, and a second driving mechanism for driving the second silicon rod clamp and the silicon rod it clamps to move along the second transfer guide rail and transfer between the first processing area and the second processing area; the second silicon rod clamp is a lifting type silicon rod clamp; A rough grinding device is arranged at the first processing area of the silicon rod processing platform for rough grinding the silicon rod located at the first processing area; and A fine grinding device is arranged at the second processing area of the silicon rod processing platform for fine grinding the silicon rod located at the second processing area.

2. The silicon rod grinding machine according to claim 1, characterized in that, the first silicon rod clamp includes: A clamp arm mounting seat arranged on the first transfer guide rail; At least two clamp arms arranged oppositely along the first direction for clamping two end faces of the silicon rod; and A clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

3. The silicon rod grinding machine according to claim 2, characterized in that, the clamp arm is a rotary structure; the first silicon rod clamp further includes a clamp arm rotating mechanism for driving the clamp arm to rotate.

4. The silicon rod grinding machine according to claim 1, characterized in that, the second silicon rod clamp includes: A clamp arm mounting seat arranged on the second transfer guide rail; At least a pair of clamp arms arranged oppositely along the first direction for clamping two end faces of the silicon rod; and A clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

5. The silicon rod grinding machine according to claim 4, characterized in that, the clamp arm is a rotary structure; the second silicon rod clamp further includes a clamp arm rotating mechanism for driving the clamp arm to rotate.

6. The silicon rod grinding machine according to claim 1, characterized in that, the first driving mechanism includes: A first moving tooth rail arranged along the first direction; A first driving gear arranged on the first silicon rod clamp and meshing with the first moving tooth rail; and A first driving power source for driving the first driving gear.

7. The silicon rod grinding machine according to claim 1, characterized in that, the second driving mechanism includes: A second moving tooth rail arranged along the first direction; A second driving gear arranged on the second silicon rod clamp and meshing with the second moving tooth rail; and A first driving power source for driving the second driving gear.

8. The silicon rod grinding machine according to claim 1, characterized in that the rough grinding device includes: at least one pair of rough grinding tools, oppositely arranged at the first processing area of the silicon rod processing platform; a rough grinding tool advancing and retreating mechanism for driving at least one of the at least one pair of rough grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

9. The silicon rod grinding machine according to claim 1, characterized in that the fine grinding device includes: at least one pair of fine grinding tools, oppositely arranged at the first processing area of the silicon rod processing platform; a fine grinding tool advancing and retreating mechanism for driving at least one of the at least one pair of fine grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

10. The silicon rod grinding machine according to claim 1, characterized in that it further includes: a silicon rod transfer device, adjacent to the first processing area of the silicon rod processing platform, for transferring the silicon rod to be processed to the first processing area of the silicon rod processing platform or transferring the processed silicon rod on the silicon rod processing platform out of the first processing area.

11. The silicon rod grinding machine according to claim 1, characterized in that the silicon rod processing platform is further provided with a waiting area, and the silicon rod grinding machine further includes a silicon rod transfer device, adjacent to the waiting area of the silicon rod processing platform, for transferring the silicon rod to be processed to the waiting area of the silicon rod processing platform or transferring the processed silicon rod on the waiting area out of the silicon rod processing platform.

12. A silicon rod grinding method, applied to a silicon rod grinding machine, the silicon rod grinding machine including a machine base having a silicon rod processing platform, the silicon rod processing platform being provided with a first processing area and a second processing area, the silicon rod grinding machine further including a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism, characterized in that the silicon rod grinding method includes the following steps: Loading a first silicon rod onto a first processing station, clamping the first silicon rod with the first silicon rod clamp in the first transfer device, and performing a rough grinding operation on the first silicon rod located at the first processing area by the rough grinding device; Driving the first silicon rod clamp and the first silicon rod clamped thereby by the first driving mechanism in the first transfer device to move along the first transfer guide rail to be transferred from the first processing area to the second processing area, and performing a fine grinding operation on the first silicon rod located at the second processing area by the fine grinding device. At this stage, loading a second silicon rod onto the first processing station, clamping the second silicon rod with the second silicon rod clamp in the second transfer device, and performing a rough grinding operation on the second silicon rod located at the first processing area by the rough grinding device; Let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to transfer from the second processing location to the first processing location, unload the first silicon rod from the first processing location and load the third silicon rod, let the first silicon rod clamp in the first transfer device hold the third silicon rod, and let the rough grinding device perform rough grinding operations on the third silicon rod located at the first processing location; at this stage, let the second driving mechanism in the second transfer device drive the second silicon rod clamp and the second silicon rod held by it to move along the second transfer guide rail to transfer from the first processing location to the second processing location, and let the fine grinding device perform fine grinding operations on the second silicon rod located at the second processing location.

13. A method for grinding a silicon rod, which is applied to a silicon rod grinding machine. The silicon rod grinding machine includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a waiting location, a first processing location, and a second processing location. The silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device. Wherein, The first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism. The second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism. The method for grinding a silicon rod is characterized by the following steps: Load the first silicon rod at the waiting location, and let the first silicon rod clamp in the first transfer device hold the first silicon rod. Let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to transfer from the waiting location to the first processing location, and let the rough grinding device perform rough grinding operations on the first silicon rod located at the first processing location; at this stage, load the second silicon rod at the waiting location, and let the second driving mechanism in the second transfer device drive the second silicon rod clamp to hold the second silicon rod. Let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to transfer from the first processing location to the second processing location, and let the fine grinding device perform fine grinding operations on the first silicon rod located at the second processing location; at this stage, let the second driving mechanism in the second transfer device drive the second silicon rod clamp and the second silicon rod held by it to move along the second transfer guide rail to transfer from the waiting location to the first processing location, and let the rough grinding device perform rough grinding operations on the second silicon rod located at the first processing location. Let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer guide rail to transfer from the second processing position to the waiting position, unload the first silicon rod from the waiting position and load the third silicon rod, let the first silicon rod clamp in the first transfer device hold the third silicon rod, and let the first driving mechanism in the first transfer device drive the third silicon rod clamp and the third silicon rod held by it to move along the first transfer guide rail to transfer from the waiting position to the first processing position, and let the rough grinding device perform rough grinding operations on the third silicon rod located at the first processing position; at this stage, let the second driving mechanism in the second transfer device drive the second silicon rod clamp and the second silicon rod held by it to move along the second transfer guide rail to transfer from the first processing position to the second processing position, and let the fine grinding device perform fine grinding operations on the second silicon rod located at the second processing position.

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