Silicon rod grinding machine and silicon rod grinding method

Abstract

The present application provides a silicon rod grinding machine and a silicon rod grinding method. The rough grinding device and the fine grinding device of the silicon rod grinding machine are respectively arranged at the first processing location and the second processing location of the silicon rod processing platform, and a first transfer device and a second transfer device that simultaneously penetrate the first processing location and the second processing location are provided. Silicon rod clamps and drive mechanisms are respectively configured for the first and second transfer devices. By coordinately controlling the first and second transfer devices, the rough grinding device and the fine grinding device, the rough grinding device and the fine grinding device of the silicon rod grinding machine are both in a working state at the same time, and the grinding processing efficiency is doubled while maintaining the size specification and cost of the silicon rod grinding machine, reducing the grinding operation time, and improving the economic benefits.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and in particular to a silicon rod grinding machine and a silicon rod grinding method. Background Art

[0002] At present, with the increasing attention and development of the utilization of green renewable energy in society, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, ordinary crystalline silicon solar cells are made on high-quality silicon wafers, and such silicon wafers are formed by multi-wire saw cutting and subsequent processing after pulling or casting silicon ingots.

[0003] Taking monocrystalline silicon products as an example, the existing production process of silicon wafers generally includes the following steps: First, use a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, use a silicon rod squaring machine to square the cut short silicon rods to form monocrystalline silicon rods; then perform processing operations such as surface grinding and chamfering on each silicon rod to make the surface shaping of the silicon rod meet the corresponding flatness and dimensional tolerance requirements; subsequently, perform slicing operations on the silicon rods to obtain silicon wafers.

[0004] Generally, in the processes of surface grinding and chamfering of silicon rods, two processes of rough grinding and fine grinding must be passed through. Load a single silicon rod and perform rough grinding and fine grinding in sequence, then transfer and unload it, and then load, grind and unload another silicon rod. In the usual large-scale processing, the silicon rod grinding machine repeats this processing process, and the grinding tools of the silicon rod grinding machine are idle for a long time, resulting in low grinding efficiency and affecting the economic benefits of silicon rod processing. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the related art, the purpose of the present application is to provide a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between the operations of each process and poor effect of silicon rod processing operations existing in the existing related technologies.

[0006] To achieve the above and other related objectives, the present application discloses a silicon rod grinding machine, including: a machine base having a silicon rod processing platform; the silicon rod processing platform is provided with a first processing area and a second processing area; a first transfer device, including a liftable first silicon rod clamp, a first transfer guide rail arranged along a first direction, and a first driving mechanism for driving the first silicon rod clamp and the silicon rod clamped by it to move along a first transfer path and transfer between the first processing area and the second processing area; a second transfer device, including a liftable second silicon rod clamp, a second transfer guide rail arranged along the first direction, and a second driving mechanism for driving the second silicon rod clamp and the silicon rod clamped by it to move along a second transfer path and transfer between the first processing area and the second processing area; wherein, in the transfer working state of the second transfer device and the first transfer device, the silicon rods clamped by the first silicon rod clamp and the second silicon rod clamp are located at different height positions; a rough grinding device, arranged at the first processing area of the silicon rod processing platform, for performing rough grinding operations on the silicon rod located at the first processing area; and a fine grinding device, arranged at the second processing area of the silicon rod processing platform, for performing fine grinding operations on the silicon rod located at the second processing area.

[0007] In certain embodiments of the first aspect of the present application, the first transfer path includes a first transfer segment in the lifting direction, a second transfer segment in the first direction, and a third transfer segment in the lifting direction; the second transfer path includes a one-way transfer segment in the first direction; and the one-way transfer segment and the second transfer segment in the first direction are located at different height positions.

[0008] In certain embodiments of the first aspect of the present application, the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, and the first transfer device and the second transfer device are respectively arranged on opposite sides of the mounting frame.

[0009] In certain embodiments of the first aspect of the present application, the first silicon rod clamp includes: a clamp arm mounting seat arranged on the first transfer guide rail; at least two clamp arms arranged oppositely along the first direction for clamping two end faces of the silicon rod; and a clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

[0010] In certain embodiments of the first aspect of the present application, the clamp arm is a rotary structure; the first silicon rod clamp further includes a clamp arm rotation mechanism for driving the clamp arm to rotate.

[0011] In certain embodiments of the first aspect of the present application, the second silicon rod clamp includes: a clamp arm mounting base provided on the second transfer guide rail; at least a pair of clamp arms arranged oppositely in a first direction for clamping two end faces of the silicon rod; and a clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

[0012] In certain embodiments of the first aspect of the present application, the clamp arm of the silicon rod clamp is a rotary structure; the second silicon rod clamp further includes a clamp arm rotating mechanism for driving the clamp arm to rotate.

[0013] In certain embodiments of the first aspect of the present application, the first driving mechanism includes: a first moving tooth rail arranged in the first direction; a first driving gear provided on the first silicon rod clamp and meshing with the first moving tooth rail; and a first driving power source for driving the first driving gear.

[0014] In certain embodiments of the first aspect of the present application, the second driving mechanism includes: a second moving tooth rail arranged in the first direction; a second driving gear provided on the second silicon rod clamp and meshing with the second moving tooth rail; and a first driving power source for driving the second driving gear.

[0015] In certain embodiments of the first aspect of the present application, the rough grinding device includes: at least a pair of rough grinding tools oppositely arranged at a first processing location of the silicon rod processing platform; a rough grinding tool advancing and retracting mechanism for driving at least one of the at least a pair of rough grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

[0016] In certain embodiments of the first aspect of the present application, the fine grinding device includes: at least a pair of fine grinding tools oppositely arranged at a first processing location of the silicon rod processing platform; a fine grinding tool advancing and retracting mechanism for driving at least one of the at least a pair of fine grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

[0017] In certain embodiments of the first aspect of the present application, the silicon rod grinding machine further includes: a silicon rod transfer device adjacent to the first processing location of the silicon rod processing platform for transferring a silicon rod to be processed to the first processing location of the silicon rod processing platform or transferring the processed silicon rod on the silicon rod processing platform out of the first processing location.

[0018] In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a waiting area, and the silicon rod grinding machine further includes a silicon rod transfer device, which is adjacent to the waiting area of the silicon rod processing platform and is used to transfer the silicon rod to be processed to the waiting area of the silicon rod processing platform or transfer the processed silicon rod on the waiting area out of the silicon rod processing platform.

[0019] The second aspect of the present application further provides a silicon rod grinding method, which is applied to a silicon rod grinding machine. The silicon rod grinding machine includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a first processing area and a second processing area. The silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device. Among them, the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, and the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism. It is characterized in that the silicon rod grinding method includes the following steps:

[0020] Load the first silicon rod onto the first processing station, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the rough grinding device perform rough grinding operations on the first silicon rod located at the first processing area;

[0021] Make the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod it clamps to move along the first transfer path, and make the second driving mechanism in the second transfer device drive the second silicon rod clamp to move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but are vertically offset and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod it clamps are transferred from the first processing area to the second processing area, and the second silicon rod clamp is transferred from the second processing area to the first processing area;

[0022] Make the fine grinding device perform fine grinding operations on the first silicon rod located at the second processing area. At this stage, load the second silicon rod onto the first processing station, make the second silicon rod clamp in the second transfer device clamp the second silicon rod, and make the rough grinding device perform rough grinding operations on the second silicon rod located at the first processing area;

[0023] Make the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod it clamps to move along the first transfer path, and make the second driving mechanism in the second transfer device drive the second silicon rod clamp and the second silicon rod it clamps to move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but are vertically offset and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod it clamps are transferred from the second processing area to the first processing area, and the second silicon rod clamp and the second silicon rod it clamps are transferred from the first processing area to the second processing area;

[0024] Unload the first silicon rod from the first processing location and load the third silicon rod. Let the first silicon rod clamp in the first transfer device hold the third silicon rod, and let the rough grinding device perform rough grinding on the third silicon rod located at the first processing location; at this stage, let the fine grinding device perform fine grinding on the second silicon rod located at the second processing location.

[0025] The third aspect of the present application further provides a method for grinding a silicon rod, which is applied to a silicon rod grinding machine. The silicon rod grinding machine includes a machine base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting location, a first processing location, and a second processing location. The silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device. Among them, the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism. The second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism. It is characterized in that the method for grinding a silicon rod includes the following steps:

[0026] Load the first silicon rod at the waiting location. Let the first silicon rod clamp in the first transfer device hold the first silicon rod, and let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod it holds to move along the first transfer guide rail to transfer from the waiting location to the first processing location, and let the rough grinding device perform rough grinding on the first silicon rod located at the first processing location;

[0027] Let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod it holds to move along the first transfer path and let the second driving mechanism in the second transfer device drive the second silicon rod clamp to move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but vertically offset and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod it holds are transferred from the first processing location to the second processing location and the second silicon rod clamp is transferred from the second processing location to the first processing location;

[0028] Let the fine grinding device perform fine grinding on the first silicon rod located at the second processing location; at this stage, load the second silicon rod at the waiting location. Let the second silicon rod clamp in the second transfer device hold the second silicon rod, and let the second driving mechanism in the second transfer device drive the second silicon rod clamp and the second silicon rod it holds to move along the second transfer guide rail to transfer from the waiting location to the first processing location, and let the rough grinding device perform rough grinding on the second silicon rod located at the first processing location;

[0029] The first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod held thereby to move along the first transfer path, and the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod held thereby to move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but vertically offset and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod held thereby are transferred from the second processing location to the first processing location, and the second silicon rod clamp and the second silicon rod held thereby are transferred from the first processing location to the second processing location;

[0030] Unload the first silicon rod from the waiting location and load the third silicon rod. The first silicon rod clamp in the first transfer device holds the third silicon rod. The first driving mechanism in the first transfer device drives the first silicon rod clamp and the third silicon rod held thereby to move along the first transfer guide rail to be transferred from the waiting location to the first processing location, and the rough grinding device performs rough grinding on the third silicon rod located at the first processing location; at this stage, the fine grinding device performs fine grinding on the second silicon rod located at the second processing location.

[0031] As described above, the silicon rod grinding machine and the silicon rod grinding method of the present application have the following beneficial effects: The rough grinding device and the fine grinding device of the silicon rod grinding machine are respectively arranged at the first processing location and the second processing location of the silicon rod processing platform, and the first transfer device and the second transfer device that simultaneously penetrate the first processing location and the second processing location are provided, and silicon rod clamps and driving mechanisms are respectively configured for the first and second transfer devices. By coordinately controlling the positions of the first silicon rod clamp and the second silicon rod clamp on the first and second transfer devices and the transfer paths during transfer, the rough grinding device and the fine grinding device of the silicon rod grinding machine are both in a working state at the same time, doubling the grinding processing efficiency while maintaining the size specification and cost of the silicon rod grinding machine, reducing the grinding operation time, and improving the economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It shows a three-dimensional structural schematic diagram of the silicon rod grinding machine of the present application in an embodiment.

[0033] Figure 2 It shows a simplified structural schematic diagram of the silicon rod grinding machine of the present application in an embodiment.

[0034] Figure 3 It shows a structural schematic diagram of the first silicon rod clamp in the silicon rod grinding machine of the present application in an embodiment.

[0035] Figure 4 It shows Figure 2 The enlarged structural schematic diagram at A in

[0036] Figure 5Shown is a schematic structural view of the second silicon rod clamp in the silicon rod grinding machine of the present application in an embodiment.

[0037] Figure 6 Shown is a simplified schematic structural view of the silicon rod grinding machine of the present application in an embodiment.

[0038] Figure 7 Shown is a simplified schematic view of the transfer path of silicon rod transfer in the silicon rod grinding machine of the present application in an embodiment.

[0039] Figure 8 Shown is a simplified schematic view of the transfer path of silicon rod transfer in the silicon rod grinding machine of the present application in an embodiment.

[0040] Figure 9 Shown is a simplified schematic structural view of the silicon rod grinding machine of the present application in an embodiment.

[0041] Figure 10 Shown is a simplified schematic structural view of the silicon rod grinding machine of the present application in an embodiment.

[0042] Figure 11 Shown is a working schematic view of the silicon rod grinding method of the present application in an embodiment.

[0043] Figure 12 Shown is a working schematic view of the silicon rod grinding method of the present application in an embodiment.

[0044] Figure 13 Shown is a working schematic view of the silicon rod grinding method of the present application in an embodiment. Detailed Description of the Invention

[0045] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0046] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical composition, structure, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower part", "above", "upper side", "upper part", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the drawings and another element or feature.

[0047] Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another. For example, the first direction can be referred to as the second direction, and similarly, the second direction can be referred to as the first direction, without departing from the scope of the various described embodiments.

[0048] Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to also include the plural forms, unless the context indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the stated features, steps, operations, elements, components, items, kinds, and / or groups, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are to be construed as inclusive, or meaning either one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition occurs only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0049] In the related processing technology of silicon rods, several processes such as squaring cutting, surface grinding, and chamfering are involved.

[0050] In the processing of silicon materials, it is usually necessary to go through multiple processes to obtain silicon wafers for industrial production, and several processes such as squaring cutting, surface grinding, and chamfering are involved. The original silicon material is usually a long silicon rod and has a cylindrical structure. After the long silicon rod is truncated by a silicon rod cutting machine, multiple short silicon rods are obtained; then, the truncated silicon rod segments are squared by a silicon rod squaring machine to form single-crystal silicon rods, and the cross-section of the obtained single-crystal silicon rods is quasi-rectangular (including quasi-square); the surface damage of the squared single-crystal silicon rods needs to be removed, and chamfers are made on the edges to eliminate internal stress. Subsequently, the single-crystal silicon rods need to be surface-ground and chamfered so that the surface shaping of the silicon rods meets the corresponding flatness and dimensional tolerance requirements before the final slicing can be carried out.

[0051] During the process of grinding a single-crystal silicon rod, it is necessary to first perform rough grinding and then fine grinding, which are respectively achieved by corresponding rough grinding tools and fine grinding tools. In the traditional working method, after rough grinding a single single-crystal silicon rod, it is transported to the fine grinding work area for fine grinding. After fine grinding is completed, the processed silicon rod is transported out of the work area. This process is repeated in a large number of grinding operations. The grinding sequence of fine grinding and rough grinding makes it inevitable that the grinding tools of the silicon rod grinding machine are in a waiting state during operation. For example, when the rough grinding tool is performing rough grinding, the fine grinding tool is in a waiting state, and when the fine grinding tool is performing fine grinding, the rough grinding tool is in a waiting state, resulting in a relatively long grinding process time.

[0052] In the embodiment provided in the present application, to clarify the definition of directions and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined. The first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other pairwise. The length extension direction of the silicon rod grinding machine, that is, the length direction when the single-crystal silicon rod to be ground is placed on it, is defined as the first direction, that is, the front-back direction. The width extension direction of the silicon rod grinding machine, that is, the left-right direction, is defined as the second direction. The vertical direction, that is, the up-down or rise-fall direction, is defined as the third direction.

[0053] Please refer to Figure 1 , which shows a schematic structural diagram of the silicon rod grinding machine of the present application in an embodiment. As Figure 1 shown, the silicon rod grinding machine includes a machine base 1, a first transfer device 2, a second transfer device 3, a rough grinding device 4, and a fine grinding device 5.

[0054] The silicon rod grinding machine of the present application is used to grind a single-crystal silicon rod, and the single-crystal silicon rod is obtained by truncating an original silicon rod and then performing squaring by a silicon rod squaring device. The original silicon rod is usually a rod-shaped single-crystal silicon grown from a melt by the Czochralski method or the floating zone melting method.

[0055] The machine base 1 has a silicon rod processing platform 11, and the silicon rod processing platform 11 is provided with a first processing area and a second processing area. The silicon rod processing platform 11 is arranged on the upper surface of the machine base 1. In one implementation manner of this embodiment, the processing platform is designed in a rectangular shape according to the shape of the machine base 1, and its first processing area and second processing area respectively correspond to the rough grinding processing area and the fine grinding processing area during grinding. As Figure 1 shown, the first processing area and the second processing area are collinearly arranged at the front and rear ends of the silicon rod processing platform 11, and the corresponding single-crystal silicon rods carried can be processed independently on the first processing area and the second processing area respectively.

[0056] The support structure of the mounting frame 12 is arranged on the upper surface of the machine base 1. In the illustrated embodiment, the upper surface of the machine base 1 is rectangular, the support structure of the mounting frame 12 is on the outer edge of the rectangle, and the upper surface shape and size of the mounting frame 12 are approximately the same as those of the upper surface of the machine base 1.

[0057] The mounting frame 12 is erected on the machine base 1 to form a vertical frame structure. The upper surface of the frame is higher than the silicon rod processing platform 11 and bears the first transfer device 2 and the second transfer device 3. As Figure 1 shown, the first transfer device 2 and the second transfer device 3 are respectively arranged above the first processing area and the second processing area through the mounting frame. The first transfer device 2 and the second transfer device 3 are relatively arranged parallel in the first direction, opposite or mirror-image in the second direction, and keep the projections of the loaded silicon rods collinear on the horizontal plane. The first transfer device 2 and the second transfer device 3 are arranged above the first processing area and the second processing area through the mounting frame 12 and can move and interchange between the two processing areas to different processing areas.

[0058] Please refer to Figure 2 , which shows a simplified structural schematic diagram of the silicon rod grinding machine of the present application in an embodiment. Please refer to Figure 1 and Figure 2 , as Figure 1 and Figure 2 shown, the first transfer device 2 includes a first silicon rod clamp 21, a first transfer guide rail 22, and a first driving mechanism (not shown in the figure). The first silicon rod clamp 21 is carried on the first transfer guide rail 22; the first transfer guide rail 22 is arranged on the upper surface of the mounting frame 12 and is arranged along the first direction, restricting the first silicon rod clamp 21 thereon to move along the first direction; the first driving mechanism is used to drive the first silicon rod clamp 21 and the silicon rod clamped by it to move along the first transfer guide rail 22 and enable the first silicon rod clamp 21 to realize the transfer between the first processing area and the second processing area. The first silicon rod clamp 21 includes a clamp arm mounting seat 211, at least two clamp arms 212, and a clamp arm driving mechanism 213.

[0059] Please continue to refer to Figure 1 , the first silicon rod clamp 21 as a whole shows that the clamp arm mounting seat is arranged above, and the part outside the clamp arm mounting seat includes the clamp arms in a hanging state. The silicon rod clamp mounting seat is carried on the upper surface of the mounting frame 12, and the clamp arms extend downward from the clamp arm mounting seat in the hollow part of the mounting frame 12 to enable the silicon rod clamped by the clamp arms to be on the processing surface of the silicon rod processing platform 11.

[0060] The arm mounting base is arranged on the first transfer guide rail 22. In an implementation manner of this embodiment, a guide groove structure matching the first transfer guide rail 22 is provided at the bottom of the arm mounting base. The first transfer guide rail 22 is arranged along a first direction, and the length range of the first transfer guide rail 22 in the first direction at least covers the positions of the first working area and the second working area in the first direction to ensure the transfer of the silicon rod clamped by the first silicon rod clamp 21 between the two working areas. In an implementation manner of this embodiment, the first transfer guide rail 22 is set to span the entire length of the mounting frame in the first direction.

[0061] Please refer to Figure 3 , which shows a schematic structural diagram of the first silicon rod clamp 21 of this application in an embodiment. As Figure 3 shown, a guide rail 2111 in the first direction is further provided on the arm mounting base 211. The arm 212 is arranged on the arm mounting base 211 through the guide rail 2111 and can move in the first direction.

[0062] The at least one pair of arms 212 are arranged oppositely along the first direction for clamping two end faces of the silicon rod. The silicon rod is an elongated structure after squaring, and its length direction is placed along the first direction. The end faces are the cross sections at both ends of the length direction. The arms 212 hang down from the arm mounting base 211, and the clamping ends of the arms are located below the arms 212 for directly contacting and clamping the silicon rod.

[0063] The arm driving mechanism 213 can drive at least one of the at least one pair of arms 212 to move along the first direction to adjust the distance between the pair of oppositely arranged arms. The clamping ends of the two arms arranged oppositely along the first direction approach each other and clamp the silicon rod, and keep the clamping state to transfer and grind the silicon rod between different working areas. After the grinding is completed, the silicon rod is transferred to the carrying position and then moves away from each other to release the processed silicon rod.

[0064] In some implementation manners of this embodiment, the arm driving mechanism 213 can be set as a traveling motor to drive the arm 212 to move along the guide rail of the arm mounting base 211.

[0065] In an embodiment of the present application, the arm driving mechanism includes a driving motor, a driving gear, and a pair of racks. The driving motor drives the gear to rotate. The pair of racks are engaged with opposite sides on the circumference of the driving gear, that is, the line connecting the two engagement points where the two racks are respectively engaged with the driving gear passes through the rotation center of the driving gear. When the driving gear rotates, each rack moves under the drive of the gear. The movement direction of each rack is the direction in which the driving gear rotates at its corresponding engagement point. Since the two racks are respectively engaged with opposite sides on the circumference of the driving gear, they have the same linear velocity magnitude under the drive of the driving gear, but opposite movement directions. In an implementation manner of this embodiment, each rack of the pair of racks has an elongated structure, and the teeth engaged with the driving gear are arranged in the length direction. One end of each rack of the pair of racks is engaged with the driving gear, and the other end is connected to an arm. Under the drive of the driving gear, the two racks move in opposite directions, causing the two arms of the pair of arms to move closer to or away from each other along the arm mounting seat guide rail in the first direction.

[0066] In an embodiment of the present application, the arm has a rotary structure, as Figure 3 shown. The first silicon rod clamp further includes an arm rotation mechanism 214 for driving the arm to rotate. In an implementation manner of this embodiment, a rotatable structure is provided at any clamping end of the pair of arms 212. Under the drive of the arm rotation mechanism 214, the clamping end of the arm rotates about the length direction of the silicon rod, that is, the first direction, as the axis, and the clamped silicon rod rotates accordingly about the first direction as the axis. In actual grinding, the grinding surfaces and chamfers required for the silicon rod are on the four surfaces in the length direction and the edges at the intersections between the four surfaces. The arms provided by the present application can realize the selection and control of different grinding surfaces and different edges of the silicon rod.

[0067] In some implementation manners of this embodiment, the clamping ends of the at least one pair of arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rod are the two end faces at both ends of an elongated structure, the contact surfaces of the clamping ends of the arms can be set as contact surfaces in the vertical direction or contact surfaces including planes in the vertical direction. The contact surfaces are arranged on a rotatable platform, and the platform can be set as a custom regular geometric shape or an irregular geometric shape.

[0068] In an embodiment of the present application, the rotatable platform can be set as an integral body hinged by a hinge device with a locking function and can rotate about the axis in the first direction. The axis of the rotation axis is connected to the arm rotation mechanism.

[0069] In an embodiment of the present application, the clamping end of the clamping arm can be set as a rotatable frustum. The circular plane of the frustum contacts the end face of the silicon rod and remains relatively stationary with respect to the end face of the silicon rod after being pressed against the end face of the silicon rod. The clamping end of the silicon rod further includes a locking structure, and the clamping end of the clamping arm is in a locked state when grinding a selected plane. During the switching between different grinding surfaces, the clamping end of the silicon rod rotates along the center of the frustum under the drive of the clamping arm rotation mechanism.

[0070] Please refer to Figure 4 , shown as Figure 2 the enlarged structural schematic diagram of part A of the silicon rod grinding machine. As Figure 4 shown, the clamping end of the clamping arm includes a rotatable frustum and a series of protruding contacts arranged on the frustum. Each contact has a contact plane. The frustum rotates under the drive of the clamping arm rotation mechanism. In an implementation manner of this embodiment, the protruding length of the contact, that is, the position in the first direction, can be adjusted, so that during the process of clamping the silicon rod, for a silicon rod with a relatively low flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface is in a pressed state with the end face of the silicon rod. The protruding length is the length in the first direction from the circular plane of the frustum to the contact plane of the contact.

[0071] In an embodiment of the present application, a pressure sensor is arranged at the clamping end of the first silicon rod clamp to adjust the protruding length of the contact based on the detected pressure state. Generally, during the process of clamping the silicon rod, a pair of clamping arms of the first silicon rod clamp approach each other in the first direction under the drive of the clamping arm drive mechanism until the contact surface of the clamping end contacts the end face of the silicon rod to be clamped. When the clamping end is provided with a plurality of contacts and the detected pressure value of some contacts contacting the end face of the silicon rod in contact is less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contact (generally in the direction approaching the end face of the silicon rod); alternatively, each clamping end of a pair of clamping arms of the first silicon rod clamp is set as a contact surface. During the process of clamping the silicon rod, the pair of clamping arms are driven by the clamping arm drive mechanism to approach each other towards the end faces of both ends of the silicon rod to achieve this. After the clamping end contacts the end face of the silicon rod, the pressure sensor detects the clamping degree of the silicon rod, and when the set pressure range is reached, the clamping arm drive mechanism controls to stop the opposite movement of the pair of clamping arms.

[0072] The clamping arm rotation mechanism can be arranged on one of the pair of clamping arms to drive the clamping ends of the pair of clamping arms and the clamped silicon rod to rotate; or the clamping arm rotation mechanism is arranged on each of the pair of clamping arms and cooperates to control the two clamping ends of the pair of clamping arms to rotate at the same angle and in the same direction. In some implementation manners, the clamping arm rotation mechanism can be set as a driving motor.

[0073] When the silicon rod grinding machine grinds different sides of the silicon rod or chamfers the edges, it is achieved by driving the rotation of the clamping end of the clamping arm through the clamping arm rotation mechanism. Usually, for a single crystal silicon rod after squaring, when grinding different sides, the clamping arm rotation mechanism controls the clamping end of the clamping arm to rotate a certain angle, such as 90°, to achieve it. When chamfering different edges, it can be achieved by controlling the clamping end of the clamping arm to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a plane, when chamfering the silicon rod, the clamping arm rotation mechanism can control the clamping end of the clamping arm and the silicon rod it clamps to rotate different angles for multiple chamfers. For example, after grinding one side of the silicon rod, for an edge adjacent to this side and the edge opposite to this edge, multiple chamfers can be performed by rotating a certain angle, such as 40°, 45°, 50°, etc., to obtain a silicon rod with a smoother transition at the junction of different sides. The above angles are all rotation angles starting from the initial position of grinding. The method of achieving chamfering can refer to patent disclosure documents such as CN108942570A, etc., by driving the silicon rod to rotate a certain angle and the grinding tool to perform a lateral feed in the second direction to achieve the grinding of the edges and corners.

[0074] The first silicon rod fixture can be, for example, a lifting silicon rod fixture. In one implementation, a guide rail in the lifting direction is provided on the clamping arm mounting seat of the first silicon rod fixture. The clamping arm of the silicon rod fixture and the guide rail on the clamping arm mounting seat that bears the clamping arm can move along the lifting guide rail in the third direction, which can be used to control the relative position in the vertical direction between the outer surface of the silicon rod and the grinding surface of the grinding tool, so as to select the surface of the silicon rod to be ground and the grinding area of the grinding tool for grinding. In one implementation of this embodiment, the lifting guide rail is provided on the vertical surface of the clamping arm mounting seat, and corresponding guide grooves and a driving mechanism for driving the clamping arm to perform lifting movement are provided on the clamping arm; the driving mechanism includes a traveling lead screw and a traveling motor. The traveling lead screw is arranged along the lifting guide rail and is connected to the traveling motor, and drives the clamping arm to move in the third direction under the drive of the traveling motor.

[0075] In an embodiment of the present application, when the lifting device of the first silicon rod clamp controls the clamping arm to move between different working positions by the first transfer device, for example, when moving from the first working position to the second working position or when moving from the second working position to the first working position, the clamping arm of the first silicon rod clamp and the silicon rod held thereby move along the lifting guide rail driven by the lifting motion driving mechanism. For example, they rise along the lifting guide rail to a certain height, so that the overall height of the clamping arm of the first silicon rod clamp and the silicon rod held thereby is above the clamping arm of the second silicon rod clamp and the silicon rod held thereby. Subsequently, when the first silicon rod clamp moves in the first direction driven by the first driving mechanism and the second silicon rod clamp moves in the first direction driven by the second driving mechanism, the transfer paths corresponding to the clamping arm of the first silicon rod clamp and the silicon rod held thereby and the transfer paths corresponding to the clamping arm of the second silicon rod clamp and the silicon rod held thereby present two parallel lines in the first direction in space, and the two parallel lines are at different heights respectively and are collinear in the projection on the horizontal plane, that is, in the top view.

[0076] Please continue to refer to Figure 1 , the first driving mechanism includes a first moving tooth rail, a first driving gear and a first driving power source. The first moving tooth rail is arranged in the first direction and is parallel to the first transfer guide rail 22. The first moving tooth rail is fixed on the upper surface of the mounting frame, and the length scale in the first direction is set to be approximately the same as the length scale of the first transfer guide rail 22, and it is arranged parallel and adjacent to the first transfer guide rail 22.

[0077] The first driving gear is arranged on the first silicon rod clamp 21 and meshes with the first moving tooth rail, and is used to drive the first silicon rod clamp 21 to move along the first transfer guide rail 22. The first driving power source is used to drive the first driving gear. In an implementation manner of the present application, the first driving gear is arranged on the clamping arm mounting seat of the first silicon rod clamp 21. The first driving gear is driven to rotate by the first driving power source. The teeth of the first driving gear mesh with the first moving tooth rail and move along with the first moving tooth rail. The first silicon rod clamp 21 connected to the first driving gear thus generates a corresponding movement on the first transfer guide rail 22.

[0078] In an implementation manner of this embodiment, the first driving power source can be set as a driving motor. The power output shaft of the driving motor is axially connected to the first driving gear to control the movement state of the first driving gear. Subsequently, the first driving power source controls the movement of the first silicon rod clamp and the silicon rod held thereby in the first direction.

[0079] In an embodiment of the present application, the first driving mechanism may be disposed on the first silicon rod clamp, and includes a traveling motor and a traveling lead screw. The traveling lead screw is disposed along the first transfer guide rail and connected to the traveling motor, and drives the first silicon rod clamp to move along the first transfer guide rail under the drive of the traveling motor.

[0080] Please continue to refer to Figure 1 , the second transfer device 3 includes a second silicon rod clamp 31, a second transfer guide rail 32, and a second driving mechanism. The second silicon rod clamp 31 is carried on the second transfer guide rail 32; the second transfer guide rail 32 is disposed on the upper surface of the mounting frame 12 and is arranged along the first direction, restricting the second silicon rod clamp 31 thereon to move along the first direction; the second driving mechanism is used to drive the second silicon rod clamp 31 and the silicon rod clamped thereby to move along the second transfer guide rail 32, and enable the second silicon rod clamp 31 to be transferred between the first processing position and the second processing position.

[0081] Please refer to Figure 5 , which shows a schematic structural diagram of the second silicon rod clamp 31 of the silicon rod grinding machine of the present application in an embodiment. As Figure 5 shown, the second silicon rod clamp 31 includes a clamp arm mounting seat 311, at least two clamp arms 312, and a clamp arm driving mechanism 313.

[0082] Please refer to in combination Figure 1 and Figure 5 , the second silicon rod clamp 31 as a whole presents that the clamp arm mounting seat 311 is disposed above, and the part outside the clamp arm mounting seat 311 includes the clamp arms 312 in a hanging state. The clamp arm mounting seat 311 is carried on the upper surface of the mounting frame 12, and the clamp arms 312 extend downward from the clamp arm mounting seat 311 into the hollow part of the mounting frame 12, so that the silicon rod clamped by the clamp arms 312 is on the processing surface of the silicon rod processing platform 11.

[0083] The clamp arm mounting seat 311 is disposed on the second transfer guide rail 32. In an implementation manner of this embodiment, a guide groove structure matching the second transfer guide rail 32 is provided at the bottom of the clamp arm mounting seat 311. The second transfer guide rail 32 is arranged along the first direction, and the length range of the second transfer guide rail 32 in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the transfer of the silicon rod clamped by the second silicon rod clamp 31 between the two working areas. In an implementation manner of this embodiment, the second transfer guide rail 32 is set to span the entire length of the mounting frame 12 in the first direction.

[0084] Please refer to in combination Figure 1 , Figure 3 and Figure 5, as shown in the figure, the second transfer guide rail 32 and the first transfer guide rail 22 are arranged in parallel and symmetrically. The arm mounting seats 211 of the first silicon rod clamp 21 and the arm mounting seats 311 of the second silicon rod clamp 31 move respectively on parallel paths defined by the first transfer guide rail 22 and the second transfer guide rail 32. When the first silicon rod clamp 21 and the silicon rod it holds are transferred between different processing positions, the second silicon rod clamp 31 and the silicon rod it holds can also be transferred between different processing positions. The movement of the arm mounting seat 211 of the first silicon rod clamp 21 and the movement of the arm mounting seat 311 of the second silicon rod clamp 31 are independent of each other. The first transfer guide rail 22 and the second transfer guide rail 32 that define the movement ranges of the arm mounting seats on the two transfer devices are respectively arranged at different spatial positions and do not interfere with each other.

[0085] In an embodiment of the present application, the arm mounting seat further has a guide rail in the first direction. Please continue to refer to Figure 5 , the arm 312 is arranged on the arm mounting seat 311 through a horizontal guide rail 3111 in the first direction and can move in the first direction.

[0086] The at least one pair of arms 312 are arranged oppositely in the first direction for clamping two end faces of the silicon rod. The silicon rod is an elongated structure after squaring, and its length direction is placed along the first direction. The end faces are the cross-sections at both ends of the length direction. The arms hang down from the arm mounting seat, and the clamping ends of the arms are located below the arms for directly contacting and clamping the silicon rod.

[0087] The arm driving mechanism 313 can drive at least one of the at least one pair of arms 312 to move along the first direction to adjust the distance between the pair of oppositely arranged arms. The clamping ends of the two arms arranged oppositely in the first direction move closer to each other to clamp the silicon rod, and keep the clamping state to transfer and grind the silicon rod between different working areas. After grinding, the silicon rod is transferred to the carrying position and then the two arms move away from each other to release the processed silicon rod. In some implementation manners of this embodiment, the arm driving mechanism 314 can be set as a traveling motor to drive the arm 312 to move along the guide rail 3111 of the arm mounting seat 311.

[0088] In an embodiment of the present application, the clamping arm driving mechanism includes a driving motor, a driving gear, and a pair of racks. The driving motor drives the driving gear to rotate. The pair of racks are engaged with opposite sides on the circumference of the driving gear, that is, the line connecting the two engagement points where the two racks are respectively engaged with the driving gear passes through the rotation center of the driving gear. When the driving gear rotates, each rack moves driven by the gear. The moving direction of each rack is the direction in which the driving gear rotates at its corresponding engagement point. Since the two racks are respectively engaged with opposite sides on the circumference of the driving gear, they have the same linear velocity but opposite moving directions when driven by the driving gear. In an implementation manner of this embodiment, each of the pair of racks has an elongated structure, and the teeth engaged with the driving gear are arranged in the length direction. One end of each of the pair of racks is engaged with the driving gear, and the other end is connected to a clamping arm. Driven by the driving gear, the two racks move in opposite directions, causing the two clamping arms of the pair of clamping arms to move closer to or away from each other along the guide rail of the clamping arm mounting seat in the first direction.

[0089] In an embodiment of the present application, the clamping arm has a rotary structure. As Figure 5 shown, the second silicon rod clamp 31 further includes a clamping arm rotating mechanism 314 for driving the clamping arm to rotate. In an implementation manner of this embodiment, a rotatable structure is provided at the clamping end of any one of the pair of clamping arms 312. Driven by the clamping arm rotating mechanism 314, the clamping end of the clamping arm rotates with the length direction of the silicon rod, that is, the first direction, as the axis, and the clamped silicon rod rotates accordingly with the first direction as the axis. In actual grinding, the grinding surfaces and chamfers that the silicon rod needs to perform are on the four surfaces in the length direction and the edges at the intersections between the four surfaces. The clamping arm provided by the present application can realize the selection and control of different grinding surfaces and different edges of the silicon rod.

[0090] In some implementation manners of this embodiment, the contact surface at the clamping end of the clamping arm can be set as a contact surface in the vertical direction or a contact surface including a plane in the vertical direction. The contact surface is provided on a rotatable platform, and the platform can be set as a custom regular geometric shape or an irregular geometric shape.

[0091] In an embodiment of the present application, the rotatable platform can be set as an integral body hinged by a hinge device with a locking function and can rotate along the axis in the first direction. The axis of the rotation shaft is connected to the clamping arm rotating mechanism.

[0092] In an embodiment of the present application, the clamping end of the clamping arm may be provided as a rotatable frustum, the circular plane of the frustum contacts the end face of the silicon rod, and remains relatively stationary with the end face of the silicon rod after being in close contact with the end face of the silicon rod. The clamping end of the silicon rod further includes a locking structure, and the clamping end of the clamping arm is in a locked state when grinding a selected plane. During the switching between different grinding surfaces, the clamping end of the silicon rod rotates along the center of the frustum under the drive of the clamping arm rotating mechanism.

[0093] Please continue to refer to Figure 4 , in an embodiment of the present application, the clamping end of the clamping arm includes a rotatable frustum and a series of protruding contacts provided on the frustum, and each contact has a contact plane. The frustum rotates under the drive of the clamping arm rotating mechanism. In an implementation manner of this embodiment, the protruding length of the contact, that is, the position in the first direction, is adjustable, so that during the process of clamping the silicon rod, for a silicon rod with a relatively low flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact surface is in close contact with the end face of the silicon rod. The protruding length is the length in the first direction from the circular plane of the frustum to the contact plane of the contact.

[0094] In an embodiment of the present application, a pressure sensor is provided at the clamping end of the silicon rod fixture to adjust the protruding length of the contact based on the detected pressure state. Generally, during the process of clamping the silicon rod, a pair of clamping arms of the first silicon rod fixture move closer to each other in the first direction under the drive of the clamping arm driving mechanism until the contact surface of the clamping end contacts the end face of the silicon rod to be clamped. When multiple contacts are provided at the clamping end and the detected pressure value of some contacts in contact with the end face of the silicon rod in contact is less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contact (generally in the direction approaching the end face of the silicon rod); alternatively, each clamping end of a pair of clamping arms of the first silicon rod fixture is provided as a contact surface. During the process of clamping the silicon rod, the pair of clamping arms are driven by the clamping arm driving mechanism to move closer to the end faces at both ends of the silicon rod to achieve. After the clamping end contacts the end face of the silicon rod, the pressure sensor detects the clamping degree of the silicon rod, and when the set pressure range is reached, the clamping arm driving mechanism controls to stop the opposite movement of the pair of clamping arms.

[0095] Please continue to refer to Figure 5 , the clamping arm rotating mechanism 314 may be provided on one of the pair of clamping arms 312 to drive the clamping end of the pair of clamping arms and the clamped silicon rod to rotate.

[0096] In another embodiment, the clamping arm rotating mechanism is provided on each of the pair of clamping arms and cooperates to control the two clamping ends of the pair of clamping arms to rotate at the same angle and in the same direction. In some implementation manners, the clamping arm rotating mechanism may be provided as a driving motor.

[0097] When the grinding machine for silicon rods grinds different sides of the silicon rod or chamfers the edges, it is achieved by driving the rotation of the clamping end of the clamping arm through the clamping arm rotation mechanism. Usually, for a single-crystalline silicon rod after squaring, when grinding different sides, the clamping arm rotation mechanism can control the clamping end of the clamping arm to rotate a certain angle, such as 90°, to achieve it. When chamfering different edges, it can be achieved by controlling the clamping end of the clamping arm to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is a plane, when chamfering the silicon rod, the clamping arm rotation mechanism can control the clamping end of the clamping arm and the silicon rod it clamps to rotate different angles to perform multiple chamfers. For example, after grinding one side of the silicon rod, for an edge adjacent to this side and the edge opposite to this edge, multiple chamfers can be performed by rotating a certain angle, such as 40°, 45°, 50°, etc., to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles starting from the initial position of grinding. The method of achieving chamfering can refer to patent disclosure documents such as CN108942570A, etc., and by driving the silicon rod to rotate a certain angle, the grinding tool is coordinated to perform a transverse feed in the second direction to achieve the grinding of the edges and corners.

[0098] In an embodiment of the present application, as Figure 5 shown, the second silicon rod fixture 31 is a lifting type silicon rod fixture. In one implementation manner, a lifting guide rail 315 in the third direction is provided on the clamping arm mounting seat 311 of the second silicon rod fixture 31. The clamping arm 312 of the second silicon rod fixture 31 and the guide rail 3111 on the clamping arm mounting seat 311 that carries the clamping arm 312 can move in the third direction along the lifting guide rail 315, which can be used to control the relative position in the vertical direction between the outer surface of the silicon rod and the grinding surface of the grinding tool, so as to select the surface of the silicon rod to be ground and the grinding area used by the grinding tool for grinding. In one implementation manner of this embodiment, the lifting guide rail 315 is provided on the vertical surface of the clamping arm mounting seat 311, and a guide groove cooperating with the lifting guide rail 315 and a driving mechanism for driving the clamping arm 312 to perform a lifting movement are correspondingly provided on the clamping arm 312; the driving mechanism includes a traveling lead screw and a traveling motor. The traveling lead screw is arranged along the lifting guide rail and is connected to the traveling motor, and drives the clamping arm to move in the third direction under the drive of the traveling motor.

[0099] Please continue to refer to Figure 1, the second driving mechanism (not shown in the figure) includes a second moving tooth rail, a second driving gear, and a second driving power source. The second moving tooth rail is arranged in the first direction and is parallel to the second transfer guide rail. The second moving tooth rail is fixed on the upper surface of the mounting frame 12, and its length scale in the first direction is set to be approximately the same as that of the second transfer guide rail 32, and it is arranged parallel and adjacent to the second transfer guide rail 32.

[0100] The second driving gear is arranged on the second silicon rod clamp 31 and meshes with the second moving tooth rail to drive the second silicon rod clamp 31 to move along the second transfer guide rail 32. The second driving power source is used to drive the second driving gear. In an implementation manner of the present application, the second driving gear is arranged on the clamp arm mounting seat of the second silicon rod clamp 31. The second driving gear is driven to rotate by the second driving power source. The teeth of the second driving gear mesh with the second moving tooth rail and move along with the second moving tooth rail. The second silicon rod clamp 31 connected to the second driving gear thus moves correspondingly on the second transfer guide rail 32.

[0101] In an implementation manner of this embodiment, the second driving power source can be set as a driving motor. The power output shaft of the driving motor is axially connected to the second driving gear to control the motion state of the second driving gear. Subsequently, the first silicon rod clamp and the silicon rod clamped by it are controlled by the second driving power source to move in the first direction.

[0102] In an embodiment of the present application, the second driving mechanism can be arranged on the second silicon rod clamp and includes a traveling motor and a traveling lead screw. The traveling lead screw is arranged along the second transfer guide rail and is connected to the traveling motor. Under the drive of the traveling motor, it drives the second silicon rod clamp to move along the second transfer guide rail.

[0103] In actual setting, while maintaining the designed processing efficiency, in order to reduce the size specification of the silicon rod grinding machine, the clamp arms of the first silicon rod clamp and the second silicon rod clamp and the silicon rods clamped by them are collinear in the top view projection diagram, and the collinear direction is the first direction. The first silicon rod clamp lifting device controls the clamp arm of the first silicon rod clamp and the silicon rod clamped by it to rise to a certain height position, so that the clamp arm of the first silicon rod clamp and the silicon rod clamped by it and the clamp arm of the second silicon rod clamp and the silicon rod clamped by it that are collinear in the top view projection are at different height positions, meeting the requirement that there is no collision between the first silicon rod clamp and the silicon rod clamped by it and the second silicon rod clamp and the silicon rod clamped by it during the transfer process, and realizing the safe transfer between the two silicon rod clamps at different processing positions.

[0104] Please refer to Figure 6 , which shows a simplified structural schematic diagram of the silicon rod grinding machine of the present application in an embodiment. Please refer to in combinationFigure 1 and Figure 6 , such as Figure 1 and Figure 6 As shown, the first transfer device 2 and the second transfer device 3 are respectively installed at the left and right ends of the installation frame 12. The second transfer device 3 includes a second transfer guide rail 32, and the second transfer guide rail 32 is arranged in parallel with the first transfer guide rail 31. The first silicon rod clamp 21 and the second silicon rod clamp 31 respectively carried on the first transfer guide rail 22 and the second transfer guide rail 32 have the same structure and work independently under the control of the corresponding driving devices. Among them, when the second transfer device and the first transfer device are in the transfer working state, the silicon rods clamped by the first silicon rod clamp and the second silicon rod clamp are at different height positions.

[0105] The first silicon rod clamp 21 and the second silicon rod clamp 31 are asymmetric structures in the second direction for the clamp itself. The first silicon rod clamp 21 and the second silicon rod clamp 31 are arranged in the second reverse direction, that is, mirror-symmetrically. The silicon rods clamped by the first silicon rod clamp 21 and the second silicon rod clamp 31 are on the same straight line in space when in the clamping state or when the rough grinding tool 41 and the fine grinding tool 51 are both in the grinding state, and the same straight line is a straight line along the first direction. The first silicon rod clamp 21 and the second silicon rod clamp 31 can move along the first transfer guide rail 22 and the second transfer guide rail 32 respectively and have the freedom of movement in the first direction. The silicon rod clamps are both equipped with lifting guide rails, so that the clamped silicon rods can exchange positions through the movement in the third direction and the first direction and be in an alternating state at different horizontal planes during the movement.

[0106] The moving ranges of the lifting guide rails of the first silicon rod clamp 21 and the second silicon rod clamp 31 in the third direction can satisfy that the clamping ends of the clamping arms of the two silicon rod clamps and the clamped silicon rods are in different height intervals.

[0107] The first transfer path is the transfer path that the first silicon rod clamp 21 transfers the clamped silicon rod from the first processing location to the second processing location or transfers the silicon rod from the second processing location to the first processing location in the clamping state.

[0108] The second transfer path is the transfer path that the second silicon rod clamp 31 transfers the clamped silicon rod from the first processing location to the second processing location or transfers the silicon rod from the second processing location to the first processing location in the clamping state.

[0109] Please refer to Figure 7 and Figure 8, which is shown as a simplified schematic diagram of the first transfer path corresponding to the silicon rod clamped by the first silicon rod clamp and the second transfer path corresponding to the silicon rod clamped by the second silicon rod clamp in one embodiment. As shown in Figure 7, the first transfer path includes a first transfer segment S1 in the lifting direction, i.e., the third direction, a second transfer segment S2 in the first direction, and a third transfer segment S3 in the lifting direction; the second transfer path includes a one-way transfer segment S4 in the first direction.

[0110] Specifically, when the positions of the first silicon rod clamp and the silicon rod a it clamps and the second silicon rod clamp and the silicon rod b it clamps are switched between the first processing location and the second processing location, the transfer path of the silicon rod a clamped by the first silicon rod clamp can be:

[0111] Starting from the initial position as shown in Figure 7 , the silicon rod a clamped by the first silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp are respectively on the same horizontal plane or horizontal planes with similar heights in two processing locations. The clamping end of the clamping arm of the first silicon rod clamp and the silicon rod a it clamps move along the lifting guide rail to a certain height, that is, the first transfer segment S1 in the lifting direction is formed;

[0112] Then the first silicon rod clamp and the silicon rod a it clamps as a whole move in the first direction along the first transfer guide rail driven by the first driving device, that is, the second transfer segment S2 in the first direction is formed, and the two end points of the second transfer segment are respectively located in the first processing location and the second processing location;

[0113] When the silicon rod a clamped by the first silicon rod clamp is transferred in the first direction to form the second transfer segment S2, the second silicon rod clamp and the silicon rod b it clamps as a whole move in the first direction driven by the second driving device, that is, the one-way transfer segment S4 in the first direction is formed, and the two end points of the one-way transfer segment are respectively located in the first processing location and the second processing location. For example, when the first silicon rod clamp is transferred from the first processing location to the second processing location, the second silicon rod clamp is transferred from the second processing location to the first processing location;

[0114] After the second silicon rod clamp and the silicon rod b it clamps leave the second processing location, the clamping end of the clamping arm of the first silicon rod clamp and the silicon rod it clamps descend under the control of the lifting device, that is, the third transfer segment S3 in the lifting direction is formed.

[0115] Please refer to Figure 7 and Figure 8 , in the state as shown in Figure 8 , the silicon rod a clamped by the first silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp are respectively transferred from the initial processing location to another processing location, that is, one transfer is completed.

[0116] As Figure 8 shown, according to the processing requirements, when the first silicon rod clamp and the silicon rod a it holds and the second silicon rod clamp and the silicon rod b it holds need to be transferred from one processing location to another processing location again, it can be achieved in a similar manner. For example, the silicon rod a held by the first silicon rod clamp rises along the lifting guide rail to a certain height to form the first transfer section S1 in the lifting direction; then the first silicon rod clamp and the silicon rod a it holds as a whole move along the first transfer guide rail to form the second transfer section S2 in the first direction, and the direction of the second transfer section S2 is controlled by the first driving device, and it can be from the first processing location to the second processing location or from the second processing location to the first processing location; at this stage, the second silicon rod clamp and the second silicon rod b it holds move along the first direction under the drive of the second driving device, that is, form the one-way transfer section S4 in the first direction; then the silicon rod a held by the first silicon rod clamp descends along its lifting guide rail to form the third transfer section S3 in the lifting direction.

[0117] After the transfer is completed, the first silicon rod clamp and the second silicon rod clamp and the silicon rods they hold have exchanged the processing locations again. During the processing of multiple silicon rods, the grinding devices at the first processing location and the second processing location can process simultaneously. After unloading the processed silicon rods, new silicon rods to be ground are installed, and the above process of silicon rod transfer is cycled.

[0118] The heights of the first transfer section S1 and the third transfer section S3 in the lifting direction in the first transfer path are adjusted by the lifting device of the first silicon rod clamp. In actual operation, within the allowable lifting range of the lifting guide rail, the corresponding lifting heights of the first transfer section S1 and the third transfer section S3 can be controlled according to the needs of realizing the transfer; the one-way transfer section S4 in the first direction in the second transfer path and the second transfer section in the first direction in the first transfer path are at different height positions, that is, it satisfies that the silicon rod a held by the first silicon rod clamp and the silicon rod b held by the second silicon rod clamp are at different height positions during the transfer, and the two silicon rods are staggered up and down to achieve safe transfer.

[0119] In another embodiment of the present application, the clamping arms of the first silicon rod clamp and the clamping arms of the second silicon rod clamp can both move in the first direction and the third direction in space. That is, the second transfer path corresponding to the silicon rod held by the second silicon rod clamp also includes a transfer section in the lifting direction, and its lifting height is controlled by the lifting device of the second silicon rod clamp. In actual transfer, it should be understood that the first transfer path and the second transfer path are not the only fixed paths. During the transfer, collisions between the structure of the silicon rod grinding machine or the silicon rods can be avoided. The first transfer path and the second transfer path only need to be at different height positions in the transfer section in the first direction to satisfy safe transfer.

[0120] Please refer to Figure 9 , which shows a simplified structural schematic diagram of the silicon rod grinding machine in an embodiment. As Figure 9 shown, the first transfer device 2 or / and the second transfer device 3 are in the silicon rod transfer state. The first silicon rod clamp 21 and the second silicon rod clamp 31 are both provided with lifting guide rails. Within the movable range defined by the lifting guide rails, the height of the silicon rod clamped by the first silicon rod clamp 21 and the silicon rod clamped by the second silicon rod clamp 31 can be adjusted, and the formed first transfer path and the second transfer path are not unique either. In actual adjustment, it is only necessary to ensure that the two silicon rods and their clamps do not overlap within the height range they occupy according to the need to meet safe transfer. The height range occupied by the silicon rod and the clamp is from the lower surface of the clamped silicon rod or the lower surface of the clamping end of the clamping arm to the upper surface of the horizontal guide rail carrying the clamping arm.

[0121] Please continue to refer to Figure 2 , the rough grinding device 4 includes at least a pair of rough grinding tools 41 and a rough grinding tool advancing and retreating mechanism 42.

[0122] The at least a pair of rough grinding tools 41 are arranged at the first processing location, and the pair of rough grinding tools 41 are arranged oppositely in the second direction. In some implementation manners, the rough grinding tool 41 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain particle size and roughness. The two grinding wheels arranged oppositely respectively provide two symmetric grinding surfaces for the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is consolidated by abrasive grains and a binder, and the surface with the abrasive grain part contacts and rotates with the surface of the silicon rod to be ground. The rough grinding wheel has a certain abrasive grain size and abrasive grain density, and at the same time, there are pores in the grinding wheel. The abrasive of the grinding wheel can be set as abrasive grains such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc. whose hardness is greater than the hardness of the silicon material according to the need of grinding the silicon rod.

[0123] The rough grinding tool advancing and retreating mechanism 42 is used to drive at least one rough grinding tool 41 in the at least a pair of rough grinding tools 41 to move laterally in the second direction, and the second direction is the width direction of the silicon rod grinding machine defined perpendicular to the first direction. The rough grinding tool advancing and retreating mechanism 42 controls the displacement of at least one rough grinding tool in the pair of rough grinding tools 41 in the second direction to realize adjusting the relative distance between the two rough grinding tools in the pair of rough grinding tools 42 in the second direction, and further controls the feed amount during the grinding process, that is, determines the grinding amount.

[0124] In some implementation manners, a rough grinding tool advancing and retreating mechanism is configured for each pair of rough grinding tools. In as Figure 2In the illustrated embodiment, the rough grinding tool advancing and retracting mechanism includes a sliding guide rail 422, a driving motor 421, and a ball screw (not shown in the figure). The sliding guide rail 422 is arranged along the second direction and is disposed on the first processing position of the machine base. A guide groove along the second direction that cooperates with the sliding guide rail 422 is provided at the bottom of the rough grinding tool 41. The ball screw is arranged along the sliding guide rail 422 and is axially connected to the driving motor 421.

[0125] In an embodiment of the present application, one of the at least one pair of rough grinding tools is configured with the driving motor and the ball screw, and the relative distance between the rough grinding tools is changed by moving one of the pair of relatively arranged grinding tools.

[0126] In an embodiment of the present application, each of the at least one pair of rough grinding tools is configured with the driving motor and the ball screw. The driving motor can separately control the position of the corresponding grinding tool in the second direction, or based on a certain cooperative relationship, the two grinding tools move away from or close to each other at the same linear speed. For example, during the grinding process, the pair of rough grinding tools feed towards each other at the same speed in the second direction, and the grinding wheels of the pair of rough grinding tools rotate at the same linear speed for grinding.

[0127] In an embodiment of the present application, a pair of rough grinding tools are driven by the same driving motor to move in the second direction at equal and opposite speeds. In an implementation manner of this embodiment, the rough grinding tool advancing and retracting mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail is arranged along the second direction and is disposed on the first processing position of the machine base. A guide groove along the second direction that cooperates with the guide rail is provided at the bottom of the rough grinding tool. The driving motor drives the gear to rotate. The two ends of the pair of racks are meshed with the two opposite ends of the driving gear. When the driving gear rotates, the pair of racks move closer to or away from each other under the drive of the linear speeds in opposite directions at both ends of the gear. In an implementation manner of this embodiment, one end of each of the pair of racks is meshed with the driving gear, and the other end is respectively connected to a rough grinding tool, so that the pair of rough grinding tools move away from or close to each other along the guide rail in the second direction.

[0128] In an embodiment of the present application, the rough grinding device further includes a cooling device to cool the at least one pair of rough grinding tools, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and service life of the grinding wheel. In an implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole. In some implementation manners, a protective cover for placing a rotary drive motor for cooling water to enter the grinding wheel is provided on the outer circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The diversion groove is provided on the protective cover as the contact point between the protective cover and the cooling water pipe, and the diversion hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source, and the cooling water sucked through the cooling water pipe reaches the diversion groove and diversion hole on the surface of the grinding wheel, and is guided directly to the contact surface between the grinding wheel and the silicon rod being ground for cooling. During the grinding of the grinding wheel, the cooling water in the diversion hole enters the interior of the grinding wheel by centrifugal force for sufficient cooling.

[0129] The at least one pair of rough grinding tools corresponds to the at least one pair of clamping arms. During grinding, a silicon rod is clamped by a pair of opposite clamping arms and moves in a first direction to control the order of grinding and chamfering the side and edges of the silicon rod. Reciprocating motion can ensure sufficient grinding of the silicon rod in the length direction. A pair of relatively arranged rough grinding tools move in a second direction to determine the feed amount of grinding on the contact surface between the grinding tool and the silicon rod.

[0130] Please continue to refer to Figure 2 , the fine grinding device 5 includes at least one pair of fine grinding tools 51 and a fine grinding tool advancing and retreating mechanism 52.

[0131] The at least one pair of fine grinding tools 51 is arranged at a first processing location, and the pair of fine grinding tools 51 are arranged oppositely in a second direction. In some implementation manners, the fine grinding tool 51 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain particle size and roughness. The two relatively arranged grinding wheels respectively provide two symmetrical grinding surfaces for the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is consolidated by abrasive grains and a binder to form a surface with an abrasive grain part in contact with the surface of the silicon rod to be ground and rotate. The fine grinding wheel has a certain abrasive grain size and abrasive grain density, and at the same time, there are pores in the grinding wheel. In particular, the abrasive grain size of the fine grinding tool grinding wheel is smaller than that of the rough grinding tool grinding wheel, which can make the ground surface of the silicon rod form a surface with a higher surface finish during grinding; or the abrasive grain density of the fine grinding tool grinding wheel is greater than that of the rough grinding tool grinding wheel, having a higher finish.

[0132] The abrasive of the grinding wheel can be set as abrasive grains such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc. with a hardness greater than that of the silicon material according to the needs of grinding the silicon rod.

[0133] The fine grinding tool advancing and retracting mechanism 52 is used to drive at least one fine grinding tool in the at least one pair of fine grinding tools 51 to move laterally in the second direction, and the second direction is the width direction of the silicon rod grinding machine defined perpendicular to the first direction. The fine grinding tool advancing and retracting mechanism 52 controls the movement of at least one fine grinding tool in the pair of fine grinding tools 51 in the second direction to control the relative distance between the two grinding tools in the pair of fine grinding tools 51 in the second direction, and further controls the feed amount during the grinding process, that is, determines the grinding amount.

[0134] In some implementation manners, a rough grinding tool advancing and retracting mechanism is configured for each pair of rough grinding tools. In Figure 2 In the embodiment shown, the fine grinding tool advancing and retracting mechanism includes a sliding guide rail 522, a driving motor 521, and a ball screw. The sliding guide rail 522 is arranged in the second direction and is arranged at the first processing position of the machine base. A guide groove in the second direction that cooperates with the sliding guide rail 522 is provided at the bottom of the fine grinding tool 51. The ball screw is arranged along the sliding guide rail 522 and is axially connected to the driving motor 521.

[0135] In an embodiment of the present application, one grinding tool in the at least one pair of fine grinding tools is configured with the driving motor and the ball screw, and the relative distance between the fine grinding tools is changed by moving one of the pair of relatively arranged grinding tools.

[0136] In an embodiment of the present application, each grinding tool in the at least one pair of fine grinding tools is configured with the driving motor and the ball screw. The driving motor can separately control the position of the corresponding grinding tool in the second direction, or based on a certain cooperation relationship, the two grinding tools move away from or approach each other at the same linear speed. For example, during the grinding process, the pair of fine grinding tools feed towards each other at the same speed in the second direction, and the pair of fine grinding tool grinding wheels rotate at the same linear speed for grinding.

[0137] In an embodiment of the present application, a pair of fine grinding tools are driven by the same driving motor to move in the second direction at the same speed in opposite directions. In one implementation of this embodiment, the fine grinding tool advancing and retracting mechanism includes a driving motor, a driving gear, a pair of racks, and guide rails. The guide rails are arranged in the second direction and are located on the first processing position of the machine base. A guide groove in the second direction that cooperates with the guide rails is provided at the bottom of the fine grinding tool. The driving motor drives the gear to rotate. The two ends of the pair of racks that are opposite to the driving gear are engaged. When the driving gear rotates, the pair of racks approach or move away from each other under the drive of the linear speeds in opposite directions at both ends of the gear. In one implementation of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end is respectively connected to a fine grinding tool, so that the pair of fine grinding tools approach or move away from each other along the guide rails in the second direction.

[0138] In an embodiment of the present application, the fine grinding device further includes a cooling device to cool the at least one pair of fine grinding tools, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and service life of the grinding wheel. In one implementation of this embodiment, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole. In some implementations, a protective cover for the rotating drive motor for placing cooling water into the grinding wheel is provided on the outer circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The diversion groove is provided on the protective cover as the contact point between the protective cover and the cooling water pipe. The diversion hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source. The cooling water sucked through the cooling water pipe reaches the diversion groove and the diversion hole on the surface of the grinding wheel, and is guided directly to the contact surface between the grinding wheel and the silicon rod being ground for cooling. During the grinding of the grinding wheel, the cooling water in the diversion hole enters the interior of the grinding wheel by centrifugal force for sufficient cooling.

[0139] The at least one pair of fine grinding tools corresponds to the at least one pair of clamping arms. During the grinding process, a silicon rod is clamped by a pair of oppositely arranged clamping arms and moves in the first direction to control the order of grinding and chamfering the side and edges of the silicon rod. Reciprocating motion can ensure sufficient grinding of the silicon rod in the length direction. A pair of oppositely arranged fine grinding tools move in the second direction to determine the feed amount of the grinding surface between the grinding tool and the silicon rod.

[0140] The silicon rod grinding machine provided by the present application can have the first processing area and the second processing area in a working state simultaneously during actual grinding, and can perform rough grinding and fine grinding on different silicon rods respectively. In one embodiment, a single crystal silicon rod to be ground is transferred to the first processing area, and the silicon rod is ground by the rough grinding device under the clamping of the first silicon rod clamp. After the rough grinding is completed, the clamp of the first silicon rod clamp drives the clamping arm and the clamped silicon rod to rise to a certain height under the drive of the lifting device, and then the first drive device drives the first silicon rod clamp and the clamped silicon rod to move along the first transfer guide rail, so that the first silicon rod clamp and the clamped silicon rod are transferred from the first processing area to the second processing area. At the second processing area, the clamping arm of the first silicon rod clamp descends along its lifting guide rail to realize the grinding of the fine grinding device and the clamped silicon rod; while the silicon rod clamped by the first silicon rod clamp is being finely ground, a silicon rod is clamped by the second silicon rod clamp and rough ground at the first processing area. When the rough grinding is completed, the fine grinding of the silicon rod at the second processing area is completed; the silicon rod after rough grinding is transferred to the second processing area for fine grinding by the second transfer device, and the silicon rod finely ground by the first transfer device is transferred out of the silicon rod processing platform. During the transfer process, the lifting devices of the first silicon rod clamp and the second silicon rod clamp respectively adjust the heights of the clamping arm and the clamped silicon rod, so that the first transfer path, the second transfer path and the silicon rods and clamping structures on the transfer path are staggered with each other; then the first transfer device continues to clamp the silicon rod that has not been ground, that is, the above process is repeated.

[0141] In some embodiments of the present application, the first silicon rod clamp and the second silicon rod clamp include multiple pairs of clamping arms arranged opposite to each other in the first direction, and multiple pairs of relatively arranged rough grinding tools and fine grinding tools are respectively arranged at the rough grinding device and the fine grinding device. In some implementation manners, the number of pairs of clamping arms on the first silicon rod clamp, the second silicon rod clamp, the rough grinding device and the fine grinding device is the same as the number of pairs of grinding tools. The driving mechanisms of each pair of clamping arms and each pair of grinding tools are relatively independent, and multiple silicon rods can be transferred and ground between the first processing area and the second processing area relatively independently at the same time.

[0142] In some embodiments of the present application, the silicon rod grinding machine further includes a silicon rod transfer device. The silicon rod transfer device is used to transfer the silicon rod to be processed to the first processing area or transfer the silicon rod after grinding out of the silicon rod processing platform.

[0143] Please refer to Figure 10 , which shows a simplified structural schematic diagram of the silicon rod grinding machine of the present application in one embodiment. As Figure 10As shown, the silicon rod transfer device 6 is adjacent to the first processing location of the silicon rod processing platform 11 and penetrates through the first transfer device 2 and the second transfer device 3. In an embodiment of the present application, the silicon rod transfer device 6 can be set as a conveyor belt mechanism, and its conveying direction is along the second direction, transporting the silicon rod located on the transfer device to the first processing location. The two end points of the conveyor belt can be set on the left and right sides of the machine base, and the conveying distance covers the width of the silicon rod grinding machine. According to the processing requirements, the silicon rod can be transferred from the loading position to the first transfer guide rail or the second transfer guide rail at the first processing location, or the silicon rod at the first processing location or the second processing location can be transferred out of the silicon rod processing platform to the unloading position. The loading position and the unloading position can be the same position, set at the same end of the silicon rod transfer device; or can be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

[0144] In some implementation manners of the present application, the silicon rod transfer device 6 can also be set as a chain conveyor mechanism or a double-speed chain mechanism to realize the transfer of the silicon rod between different processing locations and the loading position or the unloading position in the second direction.

[0145] In some embodiments of the present application, the silicon rod processing platform 11 is also provided with a waiting location (not shown in the figure), and the silicon rod grinding machine also includes the silicon rod transfer device 6. The waiting location is set beside the machine base in the second direction and can be used as the loading position for the silicon rod to be processed and the unloading position for the processed silicon rod.

[0146] The silicon rod transfer device 6 is adjacent to the waiting location of the silicon rod processing platform 11, and is used to transfer the silicon rod to be processed to the waiting location of the silicon rod processing platform 11 or transfer the processed silicon rod on the waiting location out of the silicon rod processing platform 11. In an implementation manner, the silicon rod transfer device 6 can be set as a conveyor belt mechanism, and its conveying direction is along the second direction, transporting the silicon rod located on the transfer device to the first processing location. The two end points of the conveyor belt can be set on the left and right sides of the machine base, and the conveying distance covers the width of the silicon rod grinding machine. According to the processing requirements, the silicon rod can be transferred from the loading position to the first transfer guide rail or the second transfer guide rail at the first processing location, or the silicon rod at the first processing location or the second processing location can be transferred out of the silicon rod processing platform 11 to the unloading position. The loading position and the unloading position can be the same position, set at the same end of the silicon rod transfer device; or can be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

[0147] In some implementation manners of the present application, the silicon rod transfer device can also be set as a chain conveyor mechanism or a double-speed chain mechanism to realize the transfer of the silicon rod between different processing locations and the loading position or the unloading position in the second direction.

[0148] With the silicon rod grinding machine provided by this application, during the grinding process of the silicon rod, the rough grinding devices and fine grinding devices at the first working position and the second working position can respectively grind the silicon rods in different grinding stages, doubling the grinding efficiency while maintaining the size specifications and costs of the silicon rod grinding machine, reducing the time-consuming of silicon rod processing, and improving economic benefits.

[0149] To implement the use of the silicon rod grinding machine provided by this application, the present application also provides a silicon rod grinding method in a second aspect. The silicon rod grinding method can be used in a silicon rod grinding machine. The silicon rod grinding machine includes a machine base with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing position and a second processing position; the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device. Among them, the first transfer device includes a liftable first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, and the second transfer device includes a liftable second silicon rod clamp, a second transfer guide rail, and a second driving mechanism.

[0150] The fine grinding device and the rough grinding device are respectively located in different processing positions; in the embodiment provided by the present application, the rough grinding device and the fine grinding device are respectively arranged corresponding to the first processing position and the second processing position. The fine grinding device includes at least a pair of fine grinding tools, which can grind the opposite sides of the silicon rod simultaneously; the rough grinding device includes at least a pair of rough grinding tools, which can grind the opposite sides of the silicon rod simultaneously. In some implementation manners, at least one of the pair of grinding tools of the rough grinding device has a degree of freedom of movement in the second direction, and at least one of the pair of grinding tools of the rough grinding device has a degree of freedom of movement in the second direction, and the grinding amount of the silicon rod can be controlled during the grinding processes of the rough grinding operation and the fine grinding operation.

[0151] The first driving mechanism drives the first silicon rod clamp to move along the first transfer guide rail; the second driving mechanism drives the second silicon rod clamp to move along the second transfer guide rail. The first transfer guide rail and the first transfer guide rail are arranged in parallel on the machine base and are both arranged along the first direction.

[0152] The first direction and the second direction are perpendicular to each other. In the embodiment provided by the present application, the first direction is along the length direction of the machine base, and the second direction is the width direction of the machine base.

[0153] In some embodiments, the silicon rod grinding machine to which the silicon rod grinding method can be applied includes any one of the silicon rod grinding machines in the embodiments as Figures 1 to 10 shown in the embodiments.

[0154] The silicon rod grinding method includes the following steps:

[0155] Please refer to Figure 11, showing a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. In the state as shown in Figure 11 , the first silicon rod 71 is loaded on the first processing station, the first silicon rod clamp 21 in the first transfer device clamps the first silicon rod 71, and the rough grinding device 4 performs rough grinding on the first silicon rod 71 located at the first processing position. In some implementation manners, the first silicon rod 71 moves along the first direction under the clamping of the first silicon rod clamp 21. During the rough grinding process and the subsequent fine grinding process, the first silicon rod clamp 21 drives the first silicon rod 71 to move, so that the contact surface between the first silicon rod 71 and the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of two opposite side surfaces is completed; or, the first silicon rod clamp 21 drives the first silicon rod 71 to move circuitously in the first direction, so that the contact surface between the first silicon rod 71 and the rough grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The first silicon rod clamp 21 includes at least a pair of clamping arms, the clamping arms are rotatable, and the first silicon rod 71 can rotate along the axis line in the first direction under the clamping of the clamping arms, that is, the switching and chamfering of the grinding of different side surfaces of the first silicon rod 71 are realized.

[0156] Please refer to Figure 12 , showing a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. In the state as shown in Figure 12 , after the rough grinding of the first silicon rod 71 at the first processing position is completed, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 clamped by it to move along the first transfer guide rail, so as to transfer the first silicon rod 71 from the first processing position to the second processing position, and the fine grinding device 5 performs fine grinding on the first silicon rod 71; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp to move along the second transfer path, so that the second silicon rod clamp is transferred from the second processing area to the first processing position; the second silicon rod 72 is loaded on the first processing position, the second silicon rod clamp 31 in the second transfer device clamps the second silicon rod 72, and the rough grinding device 4 performs rough grinding on the second silicon rod 72 located at the first processing position. During the transfer process, the lifting device of the first silicon rod clamp 21 controls its clamping arms and the first silicon rod 71 clamped by it to rise to a certain height, so that the first silicon rod 71, the clamping arms of the first silicon rod clamp 21, the clamping arms of the second silicon rod clamp 31, and the second silicon rod clamped by it are on different horizontal planes, and then the first driving device drives the first silicon rod clamp 21 to move in the first direction from the first processing position to the second processing position.

[0157] In some implementations, the second silicon rod 72 moves along a first direction under the clamping of the second silicon rod clamp 31. During the rough grinding process and the subsequent fine grinding process, the second silicon rod clamp 31 drives the second silicon rod 72 to move, so that the contact surface between the second silicon rod 72 and the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of two opposite side surfaces is completed; alternatively, the second silicon rod clamp 31 drives the second silicon rod 72 to move circuitously in the first direction, so that the contact surface between the second silicon rod 72 and the grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The second silicon rod clamp 31 includes at least a pair of clamping arms, the clamping arms are rotatable, and the second silicon rod 72 can rotate along the axis line in the first direction under the clamping of the clamping arms, that is, the grinding switching and chamfering of different side surfaces of the clamped second silicon rod 72 are realized.

[0158] Please refer to Figure 13 , which shows a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment. When the fine grinding operation of the first silicon rod 71 located in the second processing area is completed, the rough grinding operation of the second silicon rod 72 located in the first processing area is completed. As Figure 13As shown, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 it holds to move along the first transfer guide rail, so as to transfer the first silicon rod 71 from the second processing location to the first processing location, and then unload the first silicon rod 71 from the first processing location and load the third silicon rod. The first silicon rod clamp 21 in the first transfer device holds the third silicon rod, and the rough grinding device 4 performs rough grinding operations on the third silicon rod located at the first processing location; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 it holds to move along the second transfer guide rail, so as to transfer the second silicon rod 72 from the first processing location to the second processing location, and the fine grinding device 5 performs fine grinding operations on the second silicon rod 72 located at the second processing location. During the process of transferring the first silicon rod 71 from the second processing location to the first processing location and simultaneously transferring the second silicon rod 72 from the first processing location to the second processing location, the displacements of the first silicon rod clamp 21 and the second silicon rod clamp 31 and the first and second silicon rods they hold respectively all include moving along the first direction. The first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 it holds to move along the first transfer path, and the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 it holds to move along the second transfer path. The height of the clamping arm of the first silicon rod clamp 21 and the horizontal plane where the first silicon rod 71 is located is controlled by the lifting device of the first silicon rod clamp 21, and the height of the clamping arm of the second silicon rod clamp 31 and the horizontal plane where the second silicon rod 72 it holds is located is controlled by the lifting device of the second silicon rod clamp 31. During the movement, the first transfer path and the second transfer path are on horizontal planes at different heights, that is, in a state of being staggered in the third direction in space, so as to avoid the paths of the two silicon rod clamps overlapping and colliding during the movement along the first direction.

[0159] When the fine grinding operation of the second silicon rod 72 located at the second processing location is completed, the rough grinding operation of the third silicon rod located at the first processing location is completed. The second driving mechanism of the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 it holds to transfer from the second processing location to the first processing location along the second transfer guide rail, and at the same time, the height of its corresponding second transfer path is adjusted by the lifting device, so as to unload the ground second silicon rod 72 and load a new silicon rod to be ground.

[0160] The silicon rod grinding method provided by the present application realizes rough grinding and fine grinding of different silicon rods respectively on the same silicon rod grinding equipment at the same time, reduces the waiting time for grinding, and repeats the above grinding steps, that is, realizes the grinding and transfer of a large number of silicon rods.

[0161] The third aspect of the present application also provides a silicon rod grinding method, which can be used in a silicon rod grinding machine.

[0162] The silicon rod grinding machine includes a machine base having a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area, a second processing area, and a waiting area; the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device; wherein, the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, and the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism.

[0163] The waiting area is adjacent to the first processing area and is used for loading silicon rods to be ground that need to be transferred into the processing area or for unloading the ground silicon rods.

[0164] The fine grinding device and the rough grinding device are located in different processing areas respectively; in the embodiments provided in the present application, the rough grinding device and the fine grinding device respectively correspond to the first processing area and the second processing area.

[0165] The fine grinding device includes at least a pair of fine grinding tools, which can grind the opposite sides of the silicon rod simultaneously; the rough grinding device includes at least a pair of rough grinding tools, which can grind the opposite sides of the silicon rod simultaneously. In some implementation manners, the grinding tools of the rough grinding device and the fine grinding device both have the freedom of movement in the second direction. For the silicon rod clamped in the first processing area, at least one of the pair of rough grinding tools of the rough grinding device can move along the second direction to control the grinding amount of the silicon rod being ground during the rough grinding operation; for the silicon rod clamped in the second processing area, at least one of the pair of fine grinding tools of the fine grinding device can move along the second direction to control the grinding amount of the silicon rod being ground during the fine grinding operation.

[0166] The first driving mechanism drives the first silicon rod clamp to move along the first transfer guide rail; the second driving mechanism drives the second silicon rod clamp to move along the second transfer guide rail. The first transfer guide rail and the first transfer guide rail are arranged in parallel on the machine base and are both arranged along the first direction.

[0167] The first direction and the second direction are perpendicular to each other. In the embodiments provided in the present application, the first direction is along the length direction of the machine base, and the second direction is the width direction of the machine base.

[0168] In some embodiments, the silicon rod grinding machine to which the silicon rod grinding method can be applied includes any one of the silicon rod grinding machines in the embodiments Figures 1 to 10 shown in the embodiments.

[0169] The silicon rod grinding method includes the following steps:

[0170] Load the first silicon rod onto the waiting position area, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod clamped by it to move along the first transfer guide rail, so as to transfer the first silicon rod from the waiting position area to the first processing position area. As in Figure 11 the shown state, the first silicon rod 71 is transferred to the first processing position area, and make the rough grinding device 4 perform rough grinding operations on the first silicon rod 71 located at the first processing position area; at this stage, the second silicon rod 72 is loaded onto the waiting position area, and make the second silicon rod clamp 31 in the second transfer device clamp the second silicon rod 72.

[0171] In some implementation manners, the first silicon rod 71 moves along the first direction under the clamping of the first silicon rod clamp 21. During the rough grinding process and the subsequent fine grinding process, the first silicon rod clamp 21 drives the first silicon rod 71 to move from one end to the other end to complete the grinding of two opposite side surfaces; alternatively, the first silicon rod clamp 21 drives the first silicon rod 71 to move circuitously in the first direction, so that the contact surface between the first silicon rod 71 and the rough grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The first silicon rod clamp 21 includes at least a pair of clamping arms, the clamping arms are rotatable, and the first silicon rod 71 can rotate along the axis line in the first direction under the clamping of the clamping arms, that is, the switching and chamfering of the grinding of different side surfaces of the first silicon rod 71 are realized.

[0172] After the rough grinding of the first silicon rod 71 at the first processing position area is completed, make the first driving mechanism in the first transfer device drive the first silicon rod clamp 21 and the first silicon rod 71 clamped by it to move along the first transfer guide rail, so as to transfer the first silicon rod 71 from the first processing position area to the second processing position area along the first transfer path, and make the fine grinding device 5 perform fine grinding operations on the first silicon rod 71; at this stage, make the second driving mechanism in the second transfer device drive the second silicon rod clamp 31 to move along the second transfer path, so that the second silicon rod clamp 31 is transferred from the second processing area to the waiting position area; then make the second driving mechanism in the second transfer device drive the second silicon rod clamp 31 and the second silicon rod 72 clamped by it to move along the second transfer guide rail, so as to transfer the second silicon rod 72 from the waiting position area to the first processing position area, and make the rough grinding device 4 perform rough grinding operations on the second silicon rod 72 located at the first processing position area. As in Figure 12In the state shown, the first silicon rod 71 is transferred to the second processing location, and is ground by a fine grinding tool; the second silicon rod 72 is transferred to the first processing location, and is ground by a rough grinding tool. The lifting device of the first silicon rod clamp 21 controls the height of its clamping arm relative to the horizontal plane where the first silicon rod 71 is located, and the lifting device of the second silicon rod clamp 31 controls the height of its clamping arm relative to the horizontal plane where the second silicon rod 72 is located. During the movement, the first transfer path and the second transfer path are on horizontal planes at different heights, that is, they are in a staggered state in the third direction in space.

[0173] During the process of transferring the first silicon rod 71 from the second processing location to the first processing location and simultaneously transferring the second silicon rod 72 from the first processing location to the second processing location, the first silicon rod clamp 21, the second silicon rod clamp 31, the first silicon rod 71 and the second silicon rod 72 they respectively hold all move in the first direction. The first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 it holds to move along the first transfer path, and the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 it holds to move along the second transfer path. The lifting device of the first silicon rod clamp 21 controls the height of its clamping arm relative to the horizontal plane where the first silicon rod 71 is located, and the lifting device of the second silicon rod clamp 31 controls the height of its clamping arm relative to the horizontal plane where the second silicon rod 72 it holds is located. During the movement, the first transfer path and the second transfer path are on horizontal planes at different heights, that is, they are in a staggered state in the third direction in space, so as to avoid the paths of the two silicon rod clamps overlapping and colliding during the movement in the first direction.

[0174] In some implementation manners, the second silicon rod 72 moves in the first direction under the clamping of the second silicon rod clamp 31. During the rough grinding process and the subsequent fine grinding process, the second silicon rod clamp 31 drives the second silicon rod 72 to move, so that the contact surface between the second silicon rod 72 and the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of the two opposite side surfaces is completed; or, the second silicon rod clamp 31 drives the second silicon rod 72 to move circuitously in the first direction, so that the contact surface between the second silicon rod 72 and the grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The second silicon rod clamp 31 includes at least a pair of clamping arms, and the clamping arms are rotatable. Under the clamping of the clamping arms, the second silicon rod 72 can rotate along the axis in the first direction, that is, the grinding switching and chamfering of different side surfaces of the second silicon rod 72 held are realized.

[0175] When the fine grinding operation of the first silicon rod 71 located at the second processing location is completed, the rough grinding operation of the second silicon rod 72 located at the first processing location is completed. As in Figure 13In the state shown, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 held thereby to move along the first transfer guide rail, so as to transfer the first silicon rod 71 from the second processing position to the waiting position, and then unload the first silicon rod 71 from the waiting position and load the third silicon rod; the first silicon rod clamp 21 in the first transfer device is made to hold the third silicon rod, and the first driving device drives the first silicon rod clamp 21 and the third silicon rod held thereby to move along the first transfer guide rail, so as to transfer the third silicon rod from the waiting position to the first processing position, and the rough grinding device 4 is made to perform a rough grinding operation on the third silicon rod located at the first processing position; in this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 held thereby to move along the second transfer guide rail, so as to transfer the second silicon rod 72 from the first processing position to the second processing position, and the fine grinding device 5 is made to perform a fine grinding operation on the second silicon rod 72 located at the second processing position. In the process of transferring the first silicon rod clamp 21 and the first silicon rod 71 held thereby along the first transfer path from the second processing position to the first processing position, and simultaneously transferring the second silicon rod clamp 31 located at the second processing position and the second silicon rod 72 held thereby along the second transfer path from the first processing position to the first processing position, the height of the clamping arm of the first silicon rod clamp 21 with respect to the horizontal plane where the first silicon rod 71 is located is controlled by the lifting device of the first silicon rod clamp 21, and the height of the clamping arm of the second silicon rod clamp 31 with respect to the horizontal plane where the second silicon rod 72 held thereby is located is controlled by the lifting device of the second silicon rod clamp 31, so that in the movement, the first transfer path and the second transfer path are on horizontal planes at different heights, that is, in a state of being staggered in the third direction in space, and thus it is possible to avoid the paths of the two silicon rod clamps overlapping during the movement in the first direction and causing a collision.

[0176] After the first silicon rod clamp 21 and the first silicon rod 71 are transferred to the first processing position, they continue to move in the first direction under the drive of the first driving device to be transferred to the waiting position for subsequent unloading and loading of the third silicon rod.

[0177] When the fine grinding operation on the second silicon rod 72 located at the second processing position is completed, the rough grinding operation on the third silicon rod 73 located at the first processing position is completed. The second driving mechanism of the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 held thereby to move along the second transfer guide rail from the second processing position to the waiting position, and thus the ground second silicon rod 72 can be unloaded and a new silicon rod to be ground can be loaded.

[0178] The above embodiments are only illustrative of the principles and effects of the present application and are not intended to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present application should still be covered by the claims of the present application.

Claims

1. A silicon rod grinding machine, characterized in that, Comprising: A machine base having a silicon rod processing platform; the silicon rod processing platform is provided with a first processing area and a second processing area; A first transfer device, including a liftable first silicon rod clamp, a first transfer guide rail arranged along a first direction, and a first driving mechanism for driving the first silicon rod clamp and the silicon rod clamped by it to move along a first transfer path and transfer between the first processing area and the second processing area; the first transfer path includes a first transfer section in the lifting direction, a second transfer section in the first direction, and a third transfer section in the lifting direction; A second transfer device, including a liftable second silicon rod clamp, a second transfer guide rail arranged along the first direction, and a second driving mechanism for driving the second silicon rod clamp and the silicon rod clamped by it to move along a second transfer path and transfer between the first processing area and the second processing area; wherein, the second transfer path includes a one-way transfer section in the first direction, and the one-way transfer section and the second transfer section in the first direction are located at different height positions; when the second transfer device and the first transfer device are in the transfer working state, the silicon rods clamped by the first silicon rod clamp and the second silicon rod clamp are located at different height positions; A rough grinding device, arranged at the first processing area of the silicon rod processing platform, for performing rough grinding operations on the silicon rod located at the first processing area; and A fine grinding device, arranged at the second processing area of the silicon rod processing platform, for performing fine grinding operations on the silicon rod located at the second processing area; Wherein, the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, and the first transfer device and the second transfer device are respectively arranged on opposite sides of the mounting frame.

2. The silicon rod grinding machine according to claim 1, characterized in that, The first silicon rod clamp includes: A clamp arm mounting seat arranged on the first transfer guide rail; At least two clamp arms arranged oppositely along the first direction for clamping two end faces of the silicon rod; and A clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

3. The silicon rod grinding machine according to claim 2, characterized in that, The clamp arm is of a rotary structure; the first silicon rod clamp further includes a clamp arm rotation mechanism for driving the clamp arm to rotate.

4. The silicon rod grinding machine according to claim 1, characterized in that, The second silicon rod clamp includes: A clamp arm mounting seat arranged on the second transfer guide rail; At least a pair of clamp arms arranged oppositely along the first direction for clamping two end faces of the silicon rod; and A clamp arm driving mechanism for driving at least one of the at least two clamp arms to move along the first direction.

5. The silicon rod grinding machine according to claim 4, characterized in that, The clamp arm is of a rotary structure; the second silicon rod clamp further includes a clamp arm rotation mechanism for driving the clamp arm to rotate.

6. The silicon rod grinding machine according to claim 1, characterized in that, The first driving mechanism includes: A first moving tooth rail arranged along the first direction; A first driving gear arranged on the first silicon rod clamp and meshing with the first moving tooth rail; and A first driving power source for driving the first driving gear.

7. The silicon rod grinding machine according to claim 1, characterized in that, The second driving mechanism includes: A second moving tooth rail arranged along the first direction; A second driving gear arranged on the second silicon rod clamp and meshing with the second moving tooth rail; and A first driving power source for driving the second driving gear.

8. The silicon rod grinding machine according to claim 1, characterized in that, The rough grinding device includes: At least one pair of rough grinding tools, oppositely arranged at the first processing area of the silicon rod processing platform; A rough grinding tool advancing and retreating mechanism for driving at least one rough grinding tool in the at least one pair of rough grinding tools to move laterally along a second direction, wherein the second direction is perpendicular to the first direction.

9. The silicon rod grinding machine according to claim 1, characterized in that, The fine grinding device includes: At least one pair of fine grinding tools, oppositely arranged at the first processing area of the silicon rod processing platform; A fine grinding tool advancing and retreating mechanism for driving at least one fine grinding tool in the at least one pair of fine grinding tools to move laterally along a second direction, wherein the second direction is perpendicular to the first direction.

10. The silicon rod grinding machine according to claim 1, characterized in that, It further includes: A silicon rod transfer device, adjacent to the first processing area of the silicon rod processing platform, for transferring a silicon rod to be processed to the first processing area of the silicon rod processing platform or transferring the processed silicon rod on the silicon rod processing platform out of the first processing area.

11. The silicon rod grinding machine according to claim 1, characterized in that, The silicon rod processing platform is further provided with a waiting area, and the silicon rod grinding machine further includes a silicon rod transfer device, adjacent to the waiting area of the silicon rod processing platform, for transferring a silicon rod to be processed to the waiting area of the silicon rod processing platform or transferring the processed silicon rod on the waiting area out of the silicon rod processing platform.

12. A silicon rod grinding method, applied to a silicon rod grinding machine, the silicon rod grinding machine includes a machine base having a silicon rod processing platform, the silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein, The first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, and the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism. It is characterized in that the silicon rod grinding method includes the following steps: Loading a first silicon rod onto a first processing station, clamping the first silicon rod with the first silicon rod clamp in the first transfer device, and making the rough grinding device perform rough grinding operations on the first silicon rod located at the first processing area; Making the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod it clamps to move along a first transfer path and making the second driving mechanism in the second transfer device drive the second silicon rod clamp to move along a second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but vertically offset and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod it clamps are transferred from the first processing area to the second processing area and the second silicon rod clamp is transferred from the second processing area to the first processing area; Making the fine grinding device perform fine grinding operations on the first silicon rod located at the second processing area; at this stage, loading a second silicon rod onto the first processing station, clamping the second silicon rod with the second silicon rod clamp in the second transfer device, and making the rough grinding device perform rough grinding operations on the second silicon rod located at the first processing area; The first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod held thereby to move along the first transfer path, and the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod held thereby to move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but vertically offset and not on the same horizontal plane, such that the first silicon rod clamp and the first silicon rod held thereby are transferred from the second processing location to the first processing location, and the second silicon rod clamp and the second silicon rod held thereby are transferred from the first processing location to the second processing location; Unload the first silicon rod from the first processing location and load the third silicon rod. Have the first silicon rod clamp in the first transfer device hold the third silicon rod, and have the rough grinding device perform a rough grinding operation on the third silicon rod located at the first processing location; during this stage, have the fine grinding device perform a fine grinding operation on the second silicon rod located at the second processing location.

13. A silicon rod grinding method, applied to a silicon rod grinding machine, the silicon rod grinding machine includes a machine base having a silicon rod processing platform, the silicon rod processing platform is provided with a waiting area, a first processing area and a second processing area, and the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein, The first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism. The second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism. It is characterized in that the silicon rod grinding method includes the following steps: Load the first silicon rod at the waiting location. Have the first silicon rod clamp in the first transfer device hold the first silicon rod, and have the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod held thereby to move along the first transfer guide rail to be transferred from the waiting location to the first processing location. Have the rough grinding device perform a rough grinding operation on the first silicon rod located at the first processing location; The first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod held thereby to move along the first transfer path, and the second driving mechanism in the second transfer device drives the second silicon rod clamp to move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but vertically offset and not on the same horizontal plane, such that the first silicon rod clamp and the first silicon rod held thereby are transferred from the first processing location to the second processing location, and the second silicon rod clamp is transferred from the second processing location to the first processing location; Have the fine grinding device perform a fine grinding operation on the first silicon rod located at the second processing location; during this stage, load the second silicon rod at the waiting location. Have the second silicon rod clamp in the second transfer device hold the second silicon rod, and have the second driving mechanism in the second transfer device drive the second silicon rod clamp and the second silicon rod held thereby to move along the second transfer guide rail to be transferred from the waiting location to the first processing location. Have the rough grinding device perform a rough grinding operation on the second silicon rod located at the first processing location; Let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the first silicon rod held by it to move along the first transfer path, and let the second driving mechanism in the second transfer device drive the second silicon rod clamp and the second silicon rod held by it to move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but vertically offset and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod held by it are transferred from the second processing location to the first processing location, and the second silicon rod clamp and the second silicon rod held by it are transferred from the first processing location to the second processing location; Unload the first silicon rod from the waiting location and load the third silicon rod. Let the first silicon rod clamp in the first transfer device hold the third silicon rod. Let the first driving mechanism in the first transfer device drive the first silicon rod clamp and the third silicon rod held by it to move along the first transfer guide rail to be transferred from the waiting location to the first processing location. Let the rough grinding device perform rough grinding operations on the third silicon rod located at the first processing location; at this stage, let the fine grinding device perform fine grinding operations on the second silicon rod located at the second processing location.

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