Method for manufacturing card module and module obtained

Abstract

A method for manufacturing an electronic module, the method comprising in combination at least the following steps: using a substrate (1), the substrate (1) comprising one or more conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c) on at least one face (1a), connecting an integrated circuit (3) to at least one contact pad (2c), providing one or more conductive elements (6), connecting the one or more conductive elements (6) to the conductive pad (2b) of the substrate (1) using a conductive adhesive (7).

Description

[0001] The invention relates to a method for producing a module for a portable object, such as a chip card.

[0002] The card may be a dual interface card (having both contactless and contact functionality), a hybrid card for use in banking or other applications, or a card having contact functionality.

[0003] There are many technologies that can be used to produce cards with contactless and contact functions. Typically, a chip card or a card with an integrated circuit consists of a micromodule including a chip and a flexible printed circuit board whose one or two layers are made of metallized etched copper.

[0004] These production techniques often prove to be expensive.

[0005] One of the objects of the present invention is to provide a manufacturing method which is cheaper than the methods commonly used in the prior art while retaining the contact or contactless functionality.

[0006] The subject matter of the invention is based on a novel structure for an electronic module intended to be integrated into a portable object.

[0007] The present invention relates to a method for manufacturing an electronic module, the method comprising at least a combination of the following steps:

[0008] using a substrate comprising, on at least one face, one or more conductive tracks, at least one conductive strip and at least one connection pad,

[0009] · connecting the integrated circuit to at least one connection pad,

[0010] providing one or more conductive elements,

[0011] • Connecting the one or more conductive elements to the conductive strips of the substrate using a conductive adhesive.

[0012] According to one embodiment, the one or more conductive elements are connected to the one or more connection pads using an anisotropic conductive adhesive or an isotropic conductive adhesive.

[0013] According to one embodiment, the conductive track is located in the continuation of the conductive strip and comprises a connection pad at at least one of its ends.

[0014] For example, a double-sided substrate is used which comprises, in addition to the conductive tracks, one or more turns forming an antenna arranged on the second side of the substrate, one end of the turn being connected to an integrated circuit.

[0015] A substrate can be used which, in addition to the conductive tracks connected to the connection pads, comprises one or more conductive strips which are connected to the integrated circuit.

[0016] The connection of the integrated circuit to the conductive tracks of the substrate is performed, for example, using conductive wires, which is usually referred to as "wire bonding" by those skilled in the art.

[0017] The connection of the integrated circuit to the conductive tracks of the substrate can also be performed, for example, using "flip-chip" technology.

[0018] The conductive tracks of the substrate can be made of aluminum, copper or of printed conductive material.

[0019] The invention also relates to an electronic module obtained by means of the method according to the invention, characterised in that it comprises at least the following elements:

[0020] a substrate comprising, on at least one face, one or more conductive tracks, the conductive tracks being situated in the continuation of the conductive strips and comprising a connection pad at at least one of their ends,

[0021] an integrated circuit connected to at least one connection pad,

[0022] one or more conductive elements,

[0023] The one or more conductive elements are connected to the conductive strips of the substrate using a conductive adhesive.

[0024] The electronic module comprises a double-sided substrate comprising said metal tracks on a first side and one or more electrically conductive surfaces on a second side.

[0025] The conductive track is located in the continuation of the conductive strip and comprises a connection pad at at least one of its ends.

[0026] The electronic module may be inserted into a cavity in the contactless and / or contact portable object.

[0027] The portable object used may be an object having a dual communication interface including an antenna.

[0028] The present invention also relates to a manufacturing method, wherein:

[0029] Using the electronic module according to the invention,

[0030] burying one or more carriers in the portable object, said carriers comprising an antenna and / or a plurality of metal surfaces suitable for establishing a capacitive connection between the antenna and the electronic module,

[0031] - Bonding the electronic module to a support using an adhesive layer.

[0032] According to one embodiment, the electronic module is arranged in a cavity of a portable object comprising a buried carrier on which are deposited an antenna and means suitable for providing a connection between the antenna of said portable object and the electronic module by inductive coupling.

[0033] For example, the electronic module is inserted into a card having dual communication interfaces, and an antenna of the card is connected to two of the pads of the substrate using a conductive adhesive.

[0034] Other characteristics and advantages of the invention will become more apparent from a reading of the description of exemplary embodiments provided by way of a purely non-limiting illustration in conjunction with the accompanying drawings, in which:

[0035] · Figure 1A shows several front views of an electronic module according to the invention,

[0036] · Figure 1B is a cross-sectional view showing the connection pads of the frame and the connection strips of the chip,

[0037] · Figure 2 is a cross-sectional view of a card comprising a module according to FIG. 1 ,

[0038] · Figure 3 is a cross-sectional view of a version in which the chip mounting is a flip chip type,

[0039] · Figure 4 is a cross-sectional view of a variant of a double-sided electronic module with a capacitive type connection integrated into a card with contactless functionality,

[0040] · Figure 5 is a cross-sectional view of a variation of a double-sided electronic module having connections using physical connection technology to connect an antenna of a card providing contactless functionality to the module, and

[0041] · Figure 6 is a cross-sectional view of a double-sided module with inductive coupling that provides the contactless functionality of the card.

[0042] The description given below is directed to the production of an electronic module comprising a chip or an integrated circuit comprising different variant embodiments.

[0043] Different variant embodiments will now be described, in which the conductive tracks may be situated in the continuation of the conductive strip, but also in the continuation of the antenna turns or of the conductive surface.

[0044] Figure 1A and Figure 1BAn exemplary electronic module 10 according to the invention is shown, comprising a substrate 1 on a first face 1a of which one or more conductive tracks 2 are deposited in a continuous portion of a conductive strip 2b and which comprises at one end a connection pad 2c itself arranged on the first face 1a. Similarly, conductive tracks 8 are arranged on this same first face 1a in order to connect the chip 3 and the card body. The conductive element 6 is connected to the conductive strip 2b of the substrate using conductive means, such as a conductive material, for example a conductive adhesive 7. The chip 3 is, for example, located between the conductive element 6 and one face of the substrate.

[0045] The conductive track is, for example, an antenna.

[0046] The conductive element may comprise one or more contact strips, for example 61 , 62 , 63 of ISO type.

[0047] The conductive means is, for example, an anisotropic conductive adhesive which facilitates conduction in a selected direction.

[0048] According to one embodiment, the substrate of the module is a double-sided substrate comprising connecting vias 10 on both sides of the substrate. One or more metal turns constituting the antenna 8 are deposited on a second face 1b of the substrate opposite to the first face 1a comprising the conductive elements, the one or more turns of the antenna having two ends 8a, each of which is connected to a pad 3p of the chip.

[0049] The conductive tracks of the substrate will be made of, for example, aluminium, copper or a printed conductive material.

[0050] The electronic module thus obtained is then positioned in Figure 2 The electronic module is inserted into a card 20 and held in a cavity 21 in the card body using hot melt glue 22 or "hot melt". Any means that allow the electronic module to be connected to an element of the card can be used. Conductive hot melt glue or ACF (Anisotropic Conductive Film) for example consists of small conductive elements present in an adhesive and forms a Z connection (direction perpendicular to the plane of the carrier) when pressed or laminated. This is why it can be placed between the frame and the connection strip without the risk of shorting the ISO contacts or tracks.

[0051] Figure 3 A variant embodiment is shown in which the connection of the chip 3 to the conductive tracks of the substrate is of the flip-chip type. The chip 3 is turned over onto pads or "bumps" of conductive glue (not shown for simplicity) to make connections with the connection pads of the underlying chip. Figure 4The positioning of a double-sided electronic module according to the invention inserted into a cavity 21 in a card 20 is shown. The production of such an electronic module uses a double-sided substrate 40. One or more conductive tracks 2 are deposited on a first side 40a of the substrate and one or more conductive surfaces 41 are deposited on a second side 40b opposite to the first side. The figure shows the connection of the chip using flip chip technology. It is also possible to use wiring technology or "wire bonding" to make the connection of the chip.

[0052] The "hot melt" acts as a dielectric insulator between the conductive surface 41 of the module on the face in contact with the hot melt and the metal surface 42 of the substrate 43 buried in the card body and having the function of making the capacitive connection. The hot melt acts as a dielectric insulator for forming two capacitors. The substrate of the card is the carrier of the antenna formed by the metal surface 42 and inserted into the card body.

[0053] Figure 5 A variant embodiment is schematically shown in which the antenna 51 of the card is physically connected to the metal part of the module through two areas 52 using techniques known to those skilled in the art, such as welding, conductive adhesives, conductive glues, conductive polymers or any other method.

[0054] Figure 6 A variant embodiment of a module consisting of a double-sided substrate is shown. The metal face 61 of the substrate forms an antenna which will allow capacitive coupling with an antenna 62 located on the substrate 63 of the card body.

[0055] The above description can be implemented for a single-sided substrate or a double-sided substrate.

[0056] The module produced by means of the method according to the present invention can be inserted into a card having a contactless function, and then the metal element connected to the pads of the substrate containing the chip is inserted into the body of the contactless card.

[0057] Another application consists in using the micromodule in a card having a dual communication interface including an antenna.

[0058] According to another application, the module is inserted into a card having a dual communication interface including an antenna, and wherein the communication interface between the antenna and two of the pads of the substrate is formed by capacitive coupling.

[0059] The module according to the present invention can also be inserted into a card for card applications having a dual communication interface including an antenna and connections between the antenna and two of the pads of the substrate using a conductive adhesive.

[0060] Metal tracks present on the substrate and connected to the connection pads and the chip are for example located on each of the two faces of the substrate.

[0061] The method according to the invention enables electronic modules intended for use in portable objects with contactless and / or contact functions to be produced at low cost relative to the techniques commonly used.

Claims

1. A method for manufacturing an electronic module, the method comprising in combination at least the following steps: Using a substrate (1) comprising, on at least one face (1a), one or more conductive tracks (2), at least one conductive strip (2b) and at least one connecting pad (2c), connecting the integrated circuit (3) to at least one connection pad (2c), providing one or more conductive elements (6), in, The method further comprises the following steps: connecting the one or more conductive elements (6) to the at least one conductive strip (2b) of the substrate (1) using a conductive adhesive (7), Wherein, relative to the substrate (1), the integrated circuit (3) and the conductive element (6) are located on the same side; Relative to the substrate (1), the conductive track (2), the at least one conductive strip (2b) and the at least one connecting pad (2c) are located on the same side as the conductive element (6).

2. The manufacturing method according to claim 1, characterized in that: The conductive adhesive (7) is an anisotropic conductive adhesive.

3. The manufacturing method according to claim 1, characterized in that: The conductive adhesive (7) is an isotropic conductive adhesive.

4. The method according to claim 1, characterized in that The conductive track (2) is located in the continuation of the conductive strip (2b) and comprises a connection pad at at least one of its ends.

5. The method according to any one of claims 1 to 4, characterized in that A double-sided substrate (1) is used which, in addition to the conductive tracks (2), comprises one or more turns (8) forming an antenna arranged on the second side (1b) of the substrate, one end (8a) of the turn being connected to the integrated circuit (3).

6. The method according to any one of claims 1 to 4, characterized in that A substrate (1) is used which, in addition to the conductive tracks (2) connected to the connection pads (2c), comprises one or more conductive surfaces (41), which are connected to the integrated circuit (3).

7. The method according to any one of claims 1 to 4, characterized in that The integrated circuit (3) is connected to the conductive tracks (2) of the substrate (1) using conductive wires (4) or "wire bonds".

8. The method according to any one of claims 1 to 4, characterized in that The integrated circuit (3) is connected to the conductive tracks (2) of the substrate (1) using flip chip technology.

9. The method according to any one of claims 1 to 4, characterized in that The conductive tracks (2) of the substrate (1) are made of aluminum.

10. The method according to any one of claims 1 to 4, characterized in that The conductive tracks (2) of the substrate (1) are made of copper.

11. The method according to any one of claims 1 to 4, characterized in that The conductive tracks (2) of the substrate (1) are made of printed conductive material.

12. An electronic module (10) obtained by means of a method according to any one of claims 1 to 10, characterized in that The electronic module comprises at least the following elements: A substrate (1) comprising, on at least one face (1a), one or more conductive tracks (2), at least one conductive strip (2b) and at least one connecting pad (2c), an integrated circuit (3), the integrated circuit (3) being connected to at least one connection pad (2c), one or more conductive elements (6), wherein the one or more conductive elements (6) are connected to the at least one conductive strip (2b) of the substrate (1) using a conductive adhesive (7), Wherein, relative to the substrate (1), the integrated circuit (3) and the conductive element (6) are located on the same side; Relative to the substrate (1), the conductive track (2), the at least one conductive strip (2b) and the at least one connecting pad (2c) are located on the same side as the conductive element (6).

13. The electronic module according to claim 12, characterized in that: An electronic module (10) is used, comprising a double-sided substrate (40) comprising the conductive tracks (2) on a first side (40a) and one or more conductive surfaces (41) on a second side (40b).

14. The electronic module according to claim 13, characterized in that: The conductive track (2) is located in the continuation of the conductive strip (2b) and comprises a connection pad at at least one of its ends.

15. A method of manufacturing a portable object, characterized in that The electronic module (10) according to claim 13 is inserted into a cavity (21) in the portable object using contactless and / or contact communication means.

16. The method according to claim 15, characterized in that A portable object having a dual communication interface including an antenna is used.

17. The method according to claim 15, characterized in that One or more carriers (43) are buried in the portable object, the carrier (3) comprising an antenna and / or a plurality of metal surfaces (42) suitable for establishing a capacitive connection between the antenna and the electronic module (10).

18. The method according to claim 15, characterized in that The electronic module (10) is arranged in a cavity of a portable object comprising a buried carrier on which is deposited an antenna and means suitable for providing a connection between the antenna of the portable object and the electronic module (10) by inductive coupling.

19. The method according to claim 15, characterized in that The electronic module (10) is inserted into a card having dual communication interfaces and an antenna, and the antenna of the card is connected to two pads of the substrate using a conductive device.

20. The method according to claim 19, characterized in that The conductive means is a conductive adhesive.

21. The method according to claim 19, characterized in that The conductive means is an anisotropic adhesive.

Images