Device for measuring thermal resistance of semiconductor device

Abstract

The invention provides semiconductor device thermal resistance measuring equipment, which is applied to the technical field of electrical variable measurement and comprises a case, a workbench fixed at the top of the case, a constant-temperature base arranged in the middle of the workbench, a rack arranged on one side of the workbench and erected above the constant-temperature base, a thermal resistance detector matched with the rack, and a temperature sensor arranged on the thermal resistance detector. The top of the rack is provided with a pressing mechanism which can press and abut against the semiconductor device to be tested towards the upper end face of the constant-temperature base. The middle part of the upper end surface of the constant-temperature base is provided with a flexible heat-conducting contact pad used for self-adapting to the shape of a semiconductor device to be tested, and the flexible heat-conducting contact pad is internally provided with a temperature control assembly; and an environment simulation mechanism is matched on the pressing mechanism. The thermal resistance testing device has a high-adaptability and high-precision thermal resistance testing structure, can adapt to semiconductor devices in various shapes for testing, can simulate the actual application environment of the semiconductor devices, can provide reliable data support for thermal management design of the semiconductor devices, and is good in overall use effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of measuring electrical variables, and particularly relates to a thermal resistance measurement device for semiconductor devices. Background Art

[0002] The measurement of the thermal resistance of semiconductor devices is a key technology for evaluating the heat transfer efficiency of devices during operation. Its purpose is to quantify the thermal resistance of the device from the heat generation site (such as the chip junction area) to the external environment or the heat dissipation device. The smaller the thermal resistance, the stronger the heat dissipation ability of the device, the lower the temperature rise, and the higher the reliability.

[0003] Currently, in the prior art, the thermal resistance test equipment for semiconductor devices usually adopts a rigid planar constant-temperature base, and then collects temperature and power data through a thermal resistance tester for detection. However, it is difficult for the rigid planar constant-temperature base to adapt to irregularly packaged devices (such as curved substrates, flexible electronics, or asymmetric power modules). An air gap is generated at the contact interface due to geometric shape mismatch, resulting in a significant increase in contact thermal resistance and the measurement result deviating from the true value.

[0004] In addition, such traditional constant-temperature bases mainly rely on a single temperature control unit and cannot simulate different heat dissipation conditions (such as vacuum or forced convection), resulting in a large difference between the thermal resistance measurement result and the actual application environment of the device. Especially for the thermal resistance measurement of semiconductor devices in high-reliability scenarios such as automotive electronics and aerospace equipment, the ordinary thermal resistance measurement data is not conducive to supporting the semiconductor thermal management design in such environments.

[0005] Therefore, the present invention proposes a thermal resistance measurement device for semiconductor devices to solve the above technical problems. Summary of the Invention

[0006] In view of the above problems in the prior art, the purpose of the present invention is to provide a thermal resistance measurement device for semiconductor devices, which has a highly adaptable and highly accurate thermal resistance test structure, can adapt to semiconductor devices of various shapes for testing, and provides reliable data support for the thermal management design of semiconductor devices in different application environments.

[0007] A thermal resistance measurement device for semiconductor devices includes: A chassis, on the top of which a workbench is fixed. In the middle of the workbench, a constant-temperature base is provided. On one side of the workbench, a frame is erected above the constant-temperature base. A thermal resistance detector is cooperated on the frame, and a pressing mechanism is arranged on the top of the frame and can press downward against the upper end surface of the constant-temperature base to hold the semiconductor device to be tested. In the middle of the upper end surface of the constant-temperature base, a flexible heat-conducting contact pad for adapting to the shape of the semiconductor device to be tested is provided, and a temperature control component is arranged in the flexible heat-conducting contact pad. An environmental simulation mechanism is cooperated with the pressing mechanism. When the environmental simulation mechanism presses the semiconductor device to be tested together with the pressing mechanism, a simulation environment applied to the semiconductor device to be tested is formed on the constant temperature base.

[0008] Optionally, a cylinder is fixed to the top of the frame. The shaft of the cylinder is vertically downward and is fixed with the pressing mechanism to form the downward pressing drive control of the pressing mechanism.

[0009] Optionally, the pressing mechanism includes a fixing frame. The fixing frame is fixed to the lower end of the shaft of the cylinder, and a pressure sensor is installed in the fixing frame. The lower end of the pressure sensor is connected with a pressing head, and the pressing head is located at the bottom of the fixing frame.

[0010] Optionally, the environmental simulation mechanism includes a simulation chamber cover elastically installed at the lower end of the fixing frame. The simulation chamber cover covers the pressing head, and the covering area of the simulation chamber cover is adapted to the size of the upper end surface of the constant temperature base.

[0011] Optionally, a spring is fixed to the top of the simulation chamber cover. The top end of the spring is installed at the lower end of the fixing frame to form the elastic installation of the simulation chamber cover, and springs are fixedly arranged around the bottom edge of the simulation chamber cover.

[0012] Optionally, convection air boxes are symmetrically fixed to both sides of the bottom of the simulation chamber cover. A plurality of air outlet holes are formed on the side of the convection air box facing the inside of the simulation chamber cover, and a ventilation pipe is fixed to the other side of the convection air box.

[0013] Optionally, a connection port for connecting a simulation device through a hose is arranged in the middle of the ventilation pipe, and a sealing plug for blocking the connection port is slidably arranged in the ventilation pipe. A screw rod is threadedly inserted into one end of the ventilation pipe away from the convection air box, and the screw rod is fixed to one end of the sealing plug.

[0014] Optionally, a plurality of pressing plates are arranged around the edge of the upper end surface of the flexible heat-conducting contact pad, and an air chamber for pushing the pressing plates to extrude the flexible heat-conducting contact pad is fixed to the edge of the upper end surface of the constant temperature base.

[0015] Optionally, a plurality of air chambers corresponding to the number of the pressing plates are provided, and a movable shaft movable with air pressure is inserted into one end of the air chamber. The movable shaft is fixed to the upper end surface of the pressing plate to form pushing and pressing downward.

[0016] Optionally, the temperature control component arranged in the flexible heat-conducting contact pad includes a semiconductor refrigeration matrix. A fixing seat is cooperated with the bottom of the flexible heat-conducting contact pad. A heat insulation layer is fixed to the inner bottom surface of the fixing seat, and the semiconductor refrigeration matrix is arranged between the flexible heat-conducting contact pad and the heat insulation layer.

[0017] The beneficial effects of the present invention are as follows: For the thermal resistance measurement device of the semiconductor device, by installing an environment simulation mechanism at the lower end of the pressing mechanism, when using the indenter to abut against the semiconductor device to be measured placed on the constant temperature base, the environment simulation mechanism can completely cover the constant temperature base and the semiconductor device to be measured, and cooperate with the air outlet holes arranged on both sides of the bottom of the simulation chamber cover. Furthermore, a hot air pump or a vacuum pump can be connected to achieve forced convection or vacuum and other actual application scenarios of the semiconductor device, which is beneficial to reproduce the heat transfer mode under extreme working conditions, and thus can provide reliable data support for the thermal management design of semiconductor devices in high-reliability scenarios such as automotive electronics and aerospace equipment.

[0018] At the same time, thanks to the flexible heat-conducting contact pad arranged on the constant temperature base, the flexible heat-conducting contact pad can be used to adaptively wrap and support semiconductor devices of different shapes, effectively avoiding the possible poor contact problem in plane contact, and further avoiding the problem that the measurement result deviates from the true value due to the increase of contact thermal resistance, that is, it is beneficial to ensure the thermal resistance measurement accuracy of the semiconductor device.

[0019] In summary, the present invention not only has a highly adaptable and high-precision thermal resistance test structure, which can be adapted to test semiconductor devices of various shapes, but also can simulate the actual application environment of the semiconductor device, and can provide reliable data support for the thermal management design of the semiconductor device, and the overall use effect is good. Description of the Drawings

[0020] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. In the drawings: Figure 1 is a schematic structural diagram of the thermal resistance measurement device of the semiconductor device in Embodiment 1 of the present invention; Figure 2 is a schematic structural diagram of the pressing mechanism and the environment simulation mechanism in Embodiment 1 of the present invention; Figure 3 is a schematic internal structure diagram of the environment simulation mechanism in Embodiment 1 of the present invention; Figure 4 is a schematic internal structure diagram of the ventilation pipe in Embodiment 1 of the present invention; Figure 5 is a schematic internal structure diagram of the flexible heat-conducting contact pad in Embodiment 1 of the present invention; Figure 6 is a schematic structural diagram of the thermal resistance measurement device of the semiconductor device in Embodiment 2 of the present invention; Figure 7 is a schematic structural diagram of the constant temperature base in Embodiment 2 of the present invention.

[0021] The markings in the figure are as follows: 1. Chassis; 2. Workbench; 3. Constant temperature base; 4. Flexible heat-conducting contact pad; 401. Fixed seat; 402. Heat insulation layer; 403. Semiconductor refrigeration matrix; 5. Frame; 501. Thermal resistance detector; 6. Cylinder; 7. Pressing mechanism; 701. Fixed frame; 702. Pressure sensor; 703. Pressing head; 8. Environment simulation mechanism; 801. Simulation cabin cover; 802. Spring; 803. Heat insulation rubber ring; 9. Convection air box; 901. Air outlet hole; 10. Vent pipe; 1001. Connection port; 1002. Sealing plug; 1003. Screw; 11. Pressing plate; 12. Air cabin; 13. Movable shaft. Detailed implementation mode

[0022] Embodiment 1: As Figure 1 shown, a semiconductor device thermal resistance measurement device includes a chassis 1, a workbench 2 is fixed on the top of the chassis 1, a constant temperature base 3 is arranged in the middle of the workbench 2, and a frame 5 erected above the constant temperature base 3 is arranged on one side of the workbench 2. A thermal resistance detector 501 is fitted on the frame 5, and a pressing mechanism 7 capable of pressing down against the upper end surface of the constant temperature base 3 to receive the semiconductor device to be measured is arranged on the top of the frame 5. Specifically in implementation, a cylinder 6 is fixed on the top of the frame 5, the shaft of the cylinder 6 is vertically downward, and the pressing mechanism 7 is fixed, forming the downward pressing drive control of the pressing mechanism 7.

[0023] Cooperate with Figure 2 shown, the pressing mechanism 7 includes a fixed frame 701, the fixed frame 701 is fixed at the lower end of the shaft of the cylinder 6, and a pressure sensor 702 is installed in the fixed frame 701. The lower end of the pressure sensor 702 is connected with a pressing head 703, and the pressing head 703 is located at the bottom of the fixed frame 701. The pressure sensor 702 is used to detect the pressure for pressing the semiconductor device, facilitating the measurement of the thermal resistance of the semiconductor device under different pressure conditions. And an environment simulation mechanism 8 is fitted on the pressing mechanism 7. The environment simulation mechanism 8 is used to form a simulated environment for the semiconductor device to be measured on the constant temperature base 3 when the pressing mechanism 7 receives the semiconductor device to be measured.

[0024] Specifically as Figure 3As shown, the environment simulation mechanism 8 includes a simulation chamber cover 801 elastically mounted at the lower end of the fixed frame 701 (the simulation chamber cover 801 can be made of materials such as nickel-plated stainless steel or ceramic coating to ensure high temperature resistance and corrosion resistance). The indenter 703 is located inside the simulation chamber cover 801, so that when the indenter 703 is driven to move downward to abut against the semiconductor device to be tested, the simulation chamber cover 801 can first abut against the constant temperature base 3, and the covering area of the simulation chamber cover 801 is adapted to the size of the upper end surface of the constant temperature base 3, so that when the pressing mechanism 7 moves downward, the simulation chamber cover 801 can completely cover the upper end surface of the constant temperature base 3.

[0025] In this embodiment, a spring 802 is fixed to the top of the simulation chamber cover 801, and the top end of the spring 802 is mounted at the lower end of the fixed frame 701 to form the elastic mounting of the simulation chamber cover 801. And a heat insulation rubber ring 803 is fixedly arranged around the bottom edge of the simulation chamber cover 801, so that when the simulation chamber cover 801 abuts against and covers the upper end surface of the constant temperature base 3, the heat insulation rubber ring 803 is used to improve the sealing effect of the covering connection, which is beneficial to ensuring the environment simulation effect inside the simulation chamber cover 801.

[0026] Among them, convection air boxes 9 are symmetrically fixed to both sides of the bottom of the simulation chamber cover 801. A plurality of air outlet holes 901 are formed on the side of the convection air box 9 facing the inside of the simulation chamber cover 801, and a ventilation pipe 10 is fixed to the other side of the convection air box 9. Specifically as Figure 4 shown, a connection port 1001 for connecting a simulation device through a hose is arranged in the middle of the ventilation pipe 10. The simulation device can specifically be a hot air pump or a vacuum machine. During specific implementation, the connection port 1001 can be connected to a hot air pump to form convection simulation according to actual needs, or connected to a vacuum pump to form vacuum simulation, and devices such as a hot air pump and a vacuum pump can be integrated in the chassis 1.

[0027] In addition, a sealing plug 1002 for blocking the connection port 1001 is slidably arranged in the ventilation pipe 10, and a screw rod 1003 is threadedly inserted into one end of the ventilation pipe 10 away from the convection air box 9, and the screw rod 1003 is fixed to one end of the sealing plug 1002. Therefore, by screwing the screw rod 1003, the movement of the sealing plug 1002 in the ventilation pipe 10 can be controlled, and thus the on-off of the connection port 1001 can be controlled.

[0028] As Figure 1 shown, a flexible heat-conducting contact pad 4 for adapting to the shape of the semiconductor device to be tested is further arranged in the middle of the upper end surface of the constant temperature base 3. The flexible heat-conducting contact pad 4 can specifically be selected from but not limited to silicone-based composite materials (such as boron nitride-filled silicone, alumina-filled silicone, etc.), and a temperature control component is arranged in the flexible heat-conducting contact pad 4.

[0029] Cooperate withFigure 5 As shown in the figure, the temperature control component arranged in the flexible heat-conducting contact pad 4 includes a semiconductor refrigeration matrix 403, and a fixing base 401 is fitted at the bottom of the flexible heat-conducting contact pad 4. An insulating layer 402 is fixed on the inner bottom surface of the fixing base 401, and the semiconductor refrigeration matrix 403 is arranged between the flexible heat-conducting contact pad 4 and the insulating layer 402 and is bonded to the flexible heat-conducting contact pad 4 with heat-conducting glue.

[0030] Embodiment Two: As Figure 6 shown in Figure 7 the figure, the structure of this Embodiment Two is basically the same as that in the above Embodiment One, and the difference lies in that: Four pressing plates 11 are arranged around the upper end face edge of the flexible heat-conducting contact pad 4, and an air chamber 12 for pushing and extruding the pressing plates 11 to extrude the flexible heat-conducting contact pad 4 is fixed on the upper end face edge of the constant temperature base 3. And the number of the air chambers 12 corresponding to the pressing plates 11 is also four.

[0031] Meanwhile, one end of the air chamber 12 is plugged with a movable shaft 13 that can move with air pressure. The movable shaft 13 is fixed to the upper end face of the pressing plate 11 to form a pushing and pressing down force. And a dust collecting pressure detector can be arranged inside the air chamber 12 to monitor the abutting pressure of the flexible heat-conducting contact pad 4 on the semiconductor device to be measured. Thus, by adjusting the extrusion of different positions of the flexible heat-conducting contact pad 4 by the pressing plate 11, the abutting pressure between the flexible heat-conducting contact pad 4 and the semiconductor device at the corresponding position can be adjusted, and further the pressure balance of the contact with the semiconductor device is ensured.

[0032] In addition, in other embodiments, a thermocouple or an infrared sensor can also be embedded inside the flexible heat-conducting contact pad 4 to facilitate multi-zone independent temperature control through the PID algorithm.

[0033] Working principle: When using this semiconductor device thermal resistance measurement equipment, the semiconductor device to be measured can be placed on the surface of the flexible heat-conducting contact pad 4 on the constant temperature base 3, and then the cylinder 6 is started to drive the pressure head 703 to move downward. During this process, the simulation cabin cover 801 will cover the upper end face of the constant temperature base 3 first as the fixing frame 701 moves downward, and then the pressure head 703 abuts against the semiconductor device to be measured to form a limit and fixation.

[0034] Meanwhile, the flexible heat-conducting contact pad 4 will ensure a wrapped contact with the bottom of the semiconductor device, effectively avoiding the occurrence of gaps. And the pressure of the air chamber 12 can also be controlled to push and extrude the pressing plate 11, adjusting the extrusion of different positions of the flexible heat-conducting contact pad 4, so that the contact pressure of each position of the flexible heat-conducting contact pad 4 on the semiconductor device tends to be balanced. Thus, the problem of poor contact that may exist in plane contact can be effectively avoided, ensuring the thermal resistance measurement accuracy of the semiconductor device.

[0035] After the above-mentioned abutment and limitation of the semiconductor device, according to the actual application environment of the semiconductor device to be measured, the hot air pump or the vacuum pump can be connected through the ventilation pipe 10 to simulate the actual application scenarios of the semiconductor device such as forced convection or vacuum, and reproduce the heat transfer mode under extreme working conditions, so as to provide reliable data support for the thermal management design of semiconductor devices in high-reliability scenarios such as automotive electronics and aerospace equipment.

[0036] In summary, the present invention not only has a thermal resistance test structure with high adaptability and high precision, which can be adapted to semiconductor devices of various shapes for testing, but also can simulate the actual application environment of semiconductor devices, and can provide reliable data support for the thermal management design of semiconductor devices, with good overall use effects.

[0037] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor device thermal resistance measurement device, characterized in that, Including: A chassis (1), on the top of which a workbench (2) is fixed. In the middle of the workbench (2), a constant-temperature base (3) is arranged. And on one side of the workbench (2), a frame (5) is arranged above the constant-temperature base (3). A thermal resistance detector (501) is fitted on the frame (5). On the top of the frame (5), a pressing mechanism (7) is arranged which can press down against the upper end face of the constant-temperature base (3) to receive the semiconductor device to be tested. In the middle of the upper end face of the constant-temperature base (3), a flexible heat-conducting contact pad (4) for adapting to the shape of the semiconductor device to be tested is arranged. A temperature control component is arranged in the flexible heat-conducting contact pad (4). An environment simulation mechanism (8) is fitted on the pressing mechanism (7). When the pressing mechanism (7) presses against the semiconductor device to be tested, the environment simulation mechanism (8) is used to form a simulation environment for the application of the semiconductor device to be tested on the constant-temperature base (3).

2. The semiconductor device thermal resistance measurement device according to claim 1, characterized in that, A cylinder (6) is fixed on the top of the frame (5). The shaft of the cylinder (6) is vertically downward and is fixed with the pressing mechanism (7) to form the downward pressing drive control of the pressing mechanism (7).

3. The semiconductor device thermal resistance measurement apparatus according to claim 2, wherein The pressing mechanism (7) includes a fixing frame (701). The fixing frame (701) is fixed at the lower end of the shaft of the cylinder (6). And a pressure sensor (702) is installed in the fixing frame (701). The lower end of the pressure sensor (702) is connected with a pressure head (703). The pressure head (703) is located at the bottom of the fixing frame (701).

4. The semiconductor device thermal resistance measuring device according to claim 3, characterized in that, The environment simulation mechanism (8) includes a simulation chamber cover (801) elastically installed at the lower end of the fixing frame (701). The simulation chamber cover (801) covers the pressure head (703). And the covering area of the simulation chamber cover (801) is adapted to the size of the upper end face of the constant-temperature base (3).

5. The semiconductor device thermal resistance measurement apparatus according to claim 4, wherein A spring (802) is fixed on the top of the simulation chamber cover (801). The top end of the spring (802) is installed at the lower end of the fixing frame (701) to form the elastic installation of the simulation chamber cover (801). And a heat insulation rubber ring (803) is fixedly arranged around the bottom edge of the simulation chamber cover (801).

6. The semiconductor device thermal resistance measurement device according to claim 4, characterized in that On both sides of the bottom of the simulation chamber cover (801), convection air boxes (9) are symmetrically fixed. On the side of the convection air box (9) facing the inside of the simulation chamber cover (801), a plurality of air outlet holes (901) are arranged. And on the other side of the convection air box (9), a ventilation pipe (10) is fixed.

7. The semiconductor device thermal resistance measurement apparatus according to claim 6, characterized in that, In the middle of the ventilation pipe (10), a connection port (1001) for connecting a simulation device through a hose is arranged. And a sealing plug (1002) for blocking the connection port (1001) is slidably arranged in the ventilation pipe (10). At the end of the ventilation pipe (10) far from the convection air box (9), a screw rod (1003) is threadedly inserted. The screw rod (1003) is fixed with one end of the sealing plug (1002).

8. The semiconductor device thermal resistance measuring apparatus according to claim 1, wherein A plurality of pressing plates (11) are arranged around the upper end face edge of the flexible heat-conducting contact pad (4), and an air chamber (12) for pushing the pressing plates (11) to extrude the flexible heat-conducting contact pad (4) is fixed to the upper end face edge of the constant-temperature base (3).

9. The semiconductor device thermal resistance measurement apparatus according to claim 8, wherein, A plurality of air chambers (12) are provided corresponding to the number of the pressing plates (11), and a movable shaft (13) that can move with the air pressure is inserted into one end of the air chamber (12). The movable shaft (13) is fixed to the upper end face of the pressing plate (11) to form a pushing and pressing downward force.

10. The semiconductor device thermal resistance measurement device according to claim 1, characterized in that, The temperature control component arranged in the flexible heat-conducting contact pad (4) includes a semiconductor refrigeration matrix (403). A fixing base (401) is provided in cooperation with the bottom of the flexible heat-conducting contact pad (4). A heat insulation layer (402) is fixed to the inner bottom surface of the fixing base (401), and the semiconductor refrigeration matrix (403) is arranged between the flexible heat-conducting contact pad (4) and the heat insulation layer (402).

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