A swing mechanism capable of separating silicon wafers

Abstract

The present invention relates to a swing mechanism for a silicon wafer that can be divided into columns, which is arranged upstream of a silicon wafer basket and includes a water injection base plate, a water spray cover plate and a swing device. The water injection base plate is arranged obliquely, a water trough is arranged on the water injection base plate, a water injection pipe is arranged through the water injection base plate, and the water injection pipe is connected to the water trough. The water spray cover plate is arranged to cover the water injection base plate, and a through water outlet pipe is arranged on the water spray cover plate, and the positions of multiple water outlet pipes match the water trough; the swing device is arranged on the outside of the water spray cover plate, and the swing device includes a crossbeam, a swing cylinder and a swing rod, the swing rod is arranged on the lower side of the crossbeam, the swing cylinder is arranged on the upper surface of the crossbeam, the swing cylinder is connected to the swing rod, and the swing rod is close to the water spray cover plate. The beneficial effects of the present invention are: the wafer loading on both sides can be changed by the swing of the swing rod, and continuous wafer loading can be realized, which reduces the time required to wait for the empty wafer basket to be in place when taking away the wafer basket full of silicon wafers; increases the wafer basket storage capacity of the equipment, and reduces the manual frequent blue taking and basket loading operation time.

Description

Technical Field

[0001] The invention belongs to the field of silicon wafer manufacturing equipment, and in particular relates to a swing mechanism capable of separating silicon wafers. Background Art

[0002] In the existing technology, when a film basket is full during film loading, a new film basket must be replaced before the film can be loaded again. The empty film baskets are arranged in sequence. Since the position of the film basket lifting mechanism is limited, the number of film baskets that can be accommodated is limited, and the film baskets need to be replaced frequently, which easily affects the film loading efficiency. Summary of the invention

[0003] The problem to be solved by the present invention is to provide a swing mechanism capable of separating silicon wafers.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: a swing mechanism capable of separating silicon wafers, arranged upstream of a silicon wafer basket, comprising a water injection base plate, a water spray cover plate and a swing device, the water injection base plate is arranged obliquely, a water trough is arranged on the water injection base plate, a water injection pipe is arranged through the water injection base plate, the water injection pipe is connected with the water trough, the water spray cover plate is arranged to cover the water injection base plate, a water outlet pipe is arranged through the water spray cover plate, and the positions of the multiple water outlet pipes match the water trough;

[0005] The swing device is arranged outside the water spray cover plate, and the swing device comprises a crossbeam, a swing cylinder and a swing rod, the swing rod is arranged on the lower side of the crossbeam, the swing cylinder is arranged on the upper surface of the crossbeam, the swing cylinder is connected to the swing rod, and the swing rod is close to the water spray cover plate.

[0006] Preferably, the water injection substrate has the same shape as the water spray cover plate, and the two sides are tightly fixed by pressing blocks. The crossbeam is fixed on the pressing blocks. The pressing blocks on both sides of the front end of the water spray cover plate form the silicon wafer inlet, and the pressing blocks on both sides of the rear end of the water spray cover plate form the silicon wafer outlet.

[0007] Preferably, the rear end of the water injection substrate is separated into two silicon wafer outlets by an isolation plate, the isolation plate is fixedly connected to the crossbeam, and the widths of the two silicon wafer outlets and the silicon wafer inlet are both greater than the side length of the silicon wafer.

[0008] Preferably, the water tank includes a first water tank arranged in front of the water injection base plate and a second water tank arranged at two branch outlets. The first water tank is connected to a first water injection pipe, and the second water tank is connected to a second water injection pipe. The water spray cover plate is respectively provided with a first water outlet pipe and a second water outlet pipe matching the positions of the first water tank and the second water tank.

[0009] Preferably, the two second branch outlets are provided with detection gaps, the isolation plate is provided with two main beam sensors, the bottom surface of the water injection substrate is provided with two sub-beam sensors, and the main beam sensors and the sub-beam sensors can be beamed against each other through the detection gaps.

[0010] Preferably, a stopper is provided on the lower surface of the swing arm, and a stopper groove is provided on the water spray cover plate, and the stopper can slide in the stopper groove as the swing arm rotates.

[0011] The advantages and positive effects of the present invention are as follows: by swinging the swing rod, the wafer loading on both sides can be changed in direction, and continuous wafer loading can be achieved, which reduces the time required to wait for an empty wafer basket to be in place when taking out a wafer basket full of silicon wafers; the wafer basket storage capacity of the equipment is increased, and the time for frequent manual operations of taking out the basket and loading the wafer basket is reduced; silicon wafer transmission is achieved through water overflow, and the probability of silicon wafer fragmentation is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of a slicing device according to an embodiment of the present invention;

[0013] Figure 2 It is a schematic diagram of the structure of a swing mechanism for a split silicon wafer according to an embodiment of the present invention;

[0014] Figure 3 It is a schematic diagram of the structure of a water-filled substrate according to an embodiment of the present invention.

[0015] In the figure:

[0016] 1. Frame 2. Water tank 3. Swing mechanism

[0017] 31. Water injection substrate 311, first water tank 312, second water tank

[0018] 32. Spray cover plate 33. Press block 341. Crossbeam

[0019] 342, swing cylinder 343, swing rod 344, stopper

[0020] 345, block groove 351, detection notch 352, beam sensor

[0021] 4. Film basket lifting mechanism DETAILED DESCRIPTION

[0022] like Figure 1 As shown, the present invention relates to a swing mechanism for separable silicon wafers, which is arranged upstream of a silicon wafer basket loading device. The wafer separation equipment includes a frame 1, a water tank 2, a swing mechanism 3 for separable silicon wafers and a wafer basket lifting mechanism 4. The water tank 2 is arranged at the bottom of the frame 1, the swing mechanism 3 for separable silicon wafers and the wafer basket lifting mechanism are arranged on the upper part of the frame 1, and the wafer basket carried on the wafer basket lifting mechanism corresponds to the silicon wafer outlet of the swing mechanism 3 for separable silicon wafers.

[0023] like Figure 2 Figure 3As shown, the swing mechanism for separating the silicon wafers comprises a water injection base plate 31, a water spray cover plate 32 and a swing device. The water injection base plate 31 is tilted, and a fixed column is provided on the back of the water injection base plate 31 to fix the water injection base plate 31 on the frame 1. The upper surface of the water injection base plate 31 is covered with a water spray cover plate 32. The water injection base plate 31 and the water spray cover plate 32 have the same shape. The two side pressing blocks 33 at the front end of the water spray cover plate 32 form the silicon wafer inlet, and the two side pressing blocks 33 at the rear end of the water spray cover plate 32 form the silicon wafer outlet; the water injection base plate 31 is milled with water grooves, and the water grooves can be staggered and connected to form a grid. The upper surface of the water injection substrate 31 is covered with a water injection pipe that penetrates the water injection substrate 31, and the water injection pipe is connected to the water tank. Water can be injected into the water tank through the water injection pipe from the back of the water injection substrate 31, and water can flow through the grid-shaped water tank. The water spray cover 32 is tightly covered on the water injection substrate 31, and the two sides are tightly fixed by the pressing blocks 33 to try to keep no water flowing outside the water tank. The water spray cover 32 is provided with a through water outlet pipe, and the positions of multiple water outlet pipes match the water tank. The water in the water tank can overflow the water spray cover 32 through the water outlet pipe, forming a water film on the water spray cover 32. With the assistance of the water film, the silicon wafer moves toward the silicon wafer outlet along the inclined water spray cover 32. The water spray cover 32 can be a transparent acrylic plate, which is convenient for observing the water flow in the water tank.

[0024] In order to ensure the smooth movement of the silicon wafer, an upper and lower overflow system can be set. The water tank includes a first water tank 311 set at the front of the water injection base plate 31 and a second water tank 312 set at two branch outlets. The first water tank 311 is connected to a first water injection pipe, and the second water tank 312 is connected to a second water injection pipe. In order to ensure the water film effect, multiple first water injection pipes and second water injection pipes can be set. The water spray cover 32 is respectively provided with a first water outlet pipe and a second water outlet pipe matching the positions of the first water tank 311 and the second water tank 312. Water flows through the first water tank 311 and overflows from the first water outlet to assist the movement of the silicon wafer that has just entered. When the water flow force is insufficient when it moves to the middle, water flows through the second water tank 312 and overflows from the second water outlet to assist the silicon wafer after the fence to continue to move smoothly.

[0025] The swing device is arranged on the outside of the water spray cover plate 32, and the swing device includes a cross beam 341, a swing cylinder 342 and a swing rod 343. The cross beam 341 is fixedly arranged on the pressure block 33, and a gap is left between the cross beam 341 and the water spray cover plate 32 for accommodating the silicon wafer to pass through. The swing rod 343 is arranged on the lower side of the cross beam 341 and can rotate in a circle. The swing rod 343 is close to the water spray cover plate 32 to form baffles in two directions, so that the silicon wafer can move to the left and right directions respectively under the action of the swing rod 343. The swing cylinder 342 is arranged on the upper surface of the cross beam 341, and the swing cylinder 342 is connected to the swing rod 343. The swing rod 343 can swing left and right under the action of the swing cylinder 342. A stopper 344 is provided on the lower surface of the pendulum rod 343 to block the silicon wafer and prevent the silicon wafer from being inserted into the gap at the bottom of the pendulum rod 343 when it moves to the position of the pendulum rod 343. A stopper groove 345 with a lower limit is provided on the water spray cover plate 32. The stopper groove 345 is arc-shaped, with the center of the circle being the base point of the pendulum rod 343. The stopper 344 can slide in the stopper groove 345 as the pendulum rod 343 rotates; the silicon wafer can be blocked by the stopper 344 when it moves to the position of the pendulum rod 343, thereby realizing a change in the moving direction; the stopper 344 can be a whole piece that matches the shape of the pendulum rod 343, or 3-4 evenly arranged round or square stoppers 344 to avoid affecting the water flow.

[0026] The rear end of the water injection substrate 31 is separated by an isolation plate to form two silicon wafer outlets. The isolation plate is fixedly connected to the crossbeam 341. The widths of the two silicon wafer outlets and the silicon wafer inlet are both greater than the side length of the silicon wafer. When the swing rod 343 rotates to the leftmost end, the silicon wafer enters from the silicon wafer inlet and is discharged from the silicon wafer outlet on the right. When the corresponding swing rod 343 rotates to the rightmost end, the silicon wafer enters from the silicon wafer inlet and is discharged from the silicon wafer outlet on the left. The two second outlets are provided with a detection notch 351, which is detected by a cross-beam sensor 352. Two mother cross-beam sensors are provided on the isolation plate, and two sub-cross-beam sensors are provided on the bottom surface of the water injection substrate 31. The two mother cross-beam sensors and the two sub-cross-beam sensors are all arranged obliquely. The mother cross-beam sensor and the sub-cross-beam sensor can cross-beam through the detection notch 351, thereby detecting whether the silicon wafer is discharged from the silicon wafer outlet on that side.

[0027] Embodiment: A swing mechanism for separating silicon wafers is arranged upstream of a silicon wafer basket, and includes a water injection base plate 31, a water spray cover plate 32 and a swing device. The water injection base plate 31 is arranged tilted, and the water injection base plate 31 and the water spray cover plate 32 have the same shape, and the two sides are tightly fixed by pressing blocks 33. The two side pressing blocks 33 at the front end of the water spray cover plate 32 form a silicon wafer inlet, and the two side pressing blocks 33 at the rear end of the water spray cover plate 32 form a silicon wafer outlet. A water trough is arranged on the water injection base plate 31, and a water injection pipe is arranged on the water injection base plate 31, and the water injection pipe is connected to the water trough. A water spray cover plate 32 is covered and arranged on the water injection base plate 31, and a through water outlet pipe is arranged on the water spray cover plate 32, and the positions of multiple water outlet pipes match the water trough; the water trough includes a first water trough 311 arranged at the front of the water injection base plate 31 and a second water trough 312 arranged at two branch outlets, the first water trough 311 is connected to a first water injection pipe, and the second water trough 312 is connected to a second water injection pipe, and the water spray cover plate 32 is respectively provided with a first water outlet pipe and a second water outlet pipe matching the positions of the first water trough 311 and the second water trough 312.

[0028] The swing device is arranged on the outside of the water spray cover plate 32, and the swing device includes a cross beam 341, a swing cylinder 342 and a rocker arm 343. The cross beam 341 is fixedly arranged on the pressure block 33, the rocker arm 343 is arranged on the lower side of the cross beam 341, the swing cylinder 342 is arranged on the upper surface of the cross beam 341, the swing cylinder 342 is connected to the rocker arm 343, the rocker arm 343 is close to the water spray cover plate 32, a stopper 344 is arranged on the lower surface of the rocker arm 343, and a stopper groove 345 is arranged on the water spray cover plate 32. The stopper 344 can slide in the stopper groove 345 as the rocker arm 343 rotates. The rear end of the water injection substrate 31 is separated into two silicon wafer outlets by an isolation plate, and the isolation plate is fixedly connected to the crossbeam 341. The widths of the two silicon wafer outlets and the silicon wafer inlet are both greater than the side length of the silicon wafer. The two second outlets are provided with a detection gap 351, and two mother-to-mood sensors are provided on the isolation plate. Two sub-to-mood sensors are provided on the bottom surface of the water injection substrate 31. The mother-to-mood sensor and the sub-to-mood sensor can be projected through the detection gap 351.

[0029] The working process of this example is as follows: water is injected from the water tank to the first water injection pipe and the second water injection pipe through the water pipe, and the water overflows from the first water outlet pipe and the second water outlet pipe to ensure that there is a continuous water film on the water spray cover plate 32; the right lifting mechanism is lifted to the height of the first layer of the uppermost film basket just flush with the water spray cover plate 32 of the dividing mechanism, and the swing cylinder 342 controls the swing rod 343 to rotate to the leftmost side, which plays the role of guiding the silicon wafers. The silicon wafers enter from the silicon wafer entrance and move downward along the inclined water spray cover plate 32 under the action of the water film by their own gravity. The silicon wafers change their route under the action of the stopper 344, and are discharged from the silicon wafer outlet on the right side and inserted into the film basket in the film basket lifting mechanism on the right side; a beam sensor is installed at the front end of the dividing mechanism to confirm whether the silicon wafer slides smoothly into the film basket; then the screw lifting mechanism is lifted by one level to prepare for the next silicon wafer. When the uppermost film basket is full, the screw lifting mechanism is lifted to the height of the next film basket. When the two wafer baskets on the right are full, they wait in a high position for manual removal of the full baskets and placement of the empty baskets, and then descend to the waiting position. At the same time, the swing cylinder 342 controls the swing rod 343 to move to the right, so that the swing rod 343 moves to the far right, blocking the forward route of the silicon wafers on the right, keeping the left side connected, and the silicon wafers enter from the silicon wafer entrance and are discharged from the silicon wafer outlet on the left to be inserted into the wafer basket in the left wafer basket lifting mechanism. During the transmission process, the movement of the silicon wafers cuts off the left mother and child shooting sensors, thereby reflecting the state of the silicon wafer's route.

[0030] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A swing mechanism for separating silicon wafers, arranged upstream of a silicon wafer basket, characterized in that: It comprises a water injection base plate, a water spray cover plate and a swing device, wherein the water injection base plate is arranged obliquely, and a water trough is arranged on the water injection base plate, and the water trough is arranged in a staggered and through manner, covering the upper surface of the water injection base plate in the form of a grid, and a penetrating water injection pipe is arranged on the water injection base plate, and the water spray cover plate is covered and arranged on the water injection base plate, and a penetrating water outlet pipe is arranged on the water spray cover plate, and the positions of the multiple water outlet pipes match the water trough, and the water in the water trough can overflow the water spray cover plate through the water outlet pipe, and form a water film on the water spray cover plate; The swing device is arranged outside the water spray cover plate, and the swing device comprises a crossbeam, a swing cylinder and a swing rod, wherein the swing rod is arranged at the lower side of the crossbeam, the swing cylinder is arranged at the upper surface of the crossbeam, the swing cylinder is connected to the swing rod, and the swing rod is close to the water spray cover plate; The water injection substrate has the same shape as the water spray cover plate, and both sides are tightly fixed by pressing blocks. The crossbeam is fixedly arranged on the pressing blocks. The pressing blocks on both sides of the front end of the water spray cover plate form a silicon wafer inlet, and the pressing blocks on both sides of the rear end of the water spray cover plate form a silicon wafer outlet. The rear end of the water injection substrate is separated into two silicon wafer outlets by an isolation plate, and the isolation plate is fixedly connected to the crossbeam. The width of the two silicon wafer outlets and the silicon wafer inlet is greater than the side length of the silicon wafer.

2. The swing mechanism for a splittable silicon wafer according to claim 1, characterized in that: The water trough includes a first water trough arranged in front of the water injection base plate and a second water trough arranged at the two branch outlets, the first water trough is connected to a first water injection pipe, the second water trough is connected to a second water injection pipe, and the water spray cover plate is respectively provided with a first water outlet pipe and a second water outlet pipe matching the positions of the first water trough and the second water trough.

3. The swing mechanism for a separable silicon wafer according to claim 1, characterized in that: The two branch outlets are provided with detection gaps, the isolation plate is provided with two main beam sensors, and the bottom surface of the water injection substrate is provided with two sub-beam sensors. The main beam sensors and the sub-beam sensors can be beamed against each other through the detection gaps.

4. The swing mechanism for a splittable silicon wafer according to any one of claims 1 to 3, characterized in that: A stopper is provided on the lower surface of the swing arm, and a stopper groove is provided on the water spray cover plate. The stopper can slide in the stopper groove as the swing arm rotates.

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