Liquid cooling systems and data centers

Abstract

This invention provides a liquid cooling system and a data center, relating to the field of heat dissipation technology. The liquid cooling system includes an immersion liquid-cooled blade box, a heat exchanger, and a liquid storage buffer tank, connected sequentially through pipes to form a loop. The immersion liquid-cooled blade box houses the motherboard to be cooled, and the motherboard is immersed in a first refrigerant. The heat exchanger, liquid storage buffer tank, and immersion liquid-cooled blade box are arranged at varying heights, allowing the first refrigerant to circulate in the loop under gravity. In this liquid cooling system, the first refrigerant circulates in the loop under gravity, meaning the system does not require a pump or similar power source; circulation is achieved solely through the pressure difference generated by the height difference of the first refrigerant level. This effectively reduces the electrical losses of the cooling system and achieves energy savings.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a liquid cooling heat dissipation system and a data center. Background Technology

[0002] With the rapid advancement of 5G, artificial intelligence, and big data, the data center industry is expanding rapidly. As computer equipment is upgraded, the power density of IT equipment is increasing, server rooms are becoming larger, and the number of server rooms is growing, while global energy resources are becoming increasingly strained. Given the growing global energy crisis, how to utilize new technologies to reduce the electricity consumption for server room cooling and build green and environmentally friendly server rooms has become a core issue of concern for server room builders.

[0003] Cooling and heat dissipation account for the vast majority of power consumption in data centers, excluding server power consumption. Therefore, how to solve the heat dissipation problem of data centers with low energy consumption has become a key factor in reducing PUE (Power Usage Effectiveness). Summary of the Invention

[0004] The purpose of this invention is to provide a liquid cooling heat dissipation system and a data center to reduce the power loss of the heat dissipation system and achieve energy saving.

[0005] In a first aspect, embodiments of the present invention provide a liquid cooling heat dissipation system, including an immersion liquid-cooled blade box, a heat exchanger, and a liquid storage buffer tank connected in sequence through pipelines to form a loop. The immersion liquid-cooled blade box is used to accommodate a motherboard to be cooled, and the motherboard is immersed in a first refrigerant. The heat exchanger, the liquid storage buffer tank, and the immersion liquid-cooled blade box are arranged at heights from high to low, so that the first refrigerant circulates in the loop under the action of gravity.

[0006] Furthermore, the immersion liquid-cooled blade box includes a blade box housing, and a liquid inlet, a steam outlet, a low-pressure through-wall sealing plug, and a high-pressure through-wall sealing plug disposed on the blade box housing; the liquid inlet is located at the bottom of the side wall of the blade box housing, the steam outlet is located at the top of the side wall of the blade box housing, the low-pressure through-wall sealing plug is used to connect to the low-pressure plug of the main board via a flexible cable, and the high-pressure through-wall sealing plug is used to connect to the high-pressure plug of the main board via a flexible cable.

[0007] Furthermore, the immersion liquid-cooled knife box also includes a first level gauge, a first temperature sensor, and a first pressure sensor disposed inside the knife box housing, as well as a pressure relief valve disposed on the knife box housing.

[0008] Furthermore, a limiting reinforcement plate is also provided inside the tool box housing. The limiting reinforcement plate is used to divide the internal space of the tool box housing into multiple sub-spaces, and each sub-space is used to accommodate one of the main boards.

[0009] Furthermore, the limiting reinforcement plate includes a structural reinforcement plate, and a main board slot, a connecting hole, and a manifold disposed on the structural reinforcement plate; the structural reinforcement plate is fixed to the inner wall of the tool box housing, the main board slot is used to fix and limit the position of the main board, and the manifold is disposed at the bottom of the structural reinforcement plate.

[0010] Furthermore, the heat exchanger includes a first refrigerant storage area and a second refrigerant storage area; the first refrigerant storage area is used to store a first refrigerant from the immersion liquid-cooled blade box, and the steam inlet of the first refrigerant storage area is located above the liquid outlet of the first refrigerant storage area; the second refrigerant storage area is used to store a second refrigerant, which absorbs heat from the first refrigerant to cool the first refrigerant; a first electric valve and a flow meter are provided at the liquid inlet of the second refrigerant storage area, the first electric valve is used to regulate the flow rate of the second refrigerant, and the flow meter is used to detect the flow rate of the second refrigerant.

[0011] Furthermore, the liquid storage buffer tank is provided with an evacuation port, which is used to realize the closure and opening of the liquid cooling heat dissipation system; a second liquid level gauge and a second pressure sensor are provided inside the liquid storage buffer tank.

[0012] Furthermore, a second electric valve is installed on the steam pipeline between the immersion liquid-cooled knife box and the heat exchanger. The second electric valve is used to adjust the resistance of the first refrigerant steam moving from the immersion liquid-cooled knife box to the heat exchanger. A one-way valve, a filter, and a second temperature sensor are installed on the pipeline between the liquid storage buffer tank and the immersion liquid-cooled knife box.

[0013] Furthermore, the liquid cooling system includes one immersion liquid-cooled blade box; or, the liquid cooling system includes multiple immersion liquid-cooled blade boxes connected in parallel, with the multiple immersion liquid-cooled blade boxes located at the same horizontal level.

[0014] In a second aspect, embodiments of the present invention provide a data center, including a motherboard and the liquid cooling system described in the first aspect above, wherein the motherboard is immersed in a first refrigerant within the immersion liquid cooling box of the liquid cooling system; the motherboard includes a high-voltage module, a low-voltage module, and one or more high heat flux density chips.

[0015] In the liquid cooling system and data center provided by this invention, the liquid cooling system includes an immersion liquid-cooled blade box, a heat exchanger, and a liquid storage buffer tank connected sequentially through pipelines to form a loop. The immersion liquid-cooled blade box is used to accommodate the motherboard to be cooled, and the motherboard is immersed in a first refrigerant. The heat exchanger, liquid storage buffer tank, and immersion liquid-cooled blade box are arranged at varying heights, allowing the first refrigerant to circulate in the loop under gravity. In this liquid cooling system, the first refrigerant circulates in the loop under gravity, meaning that the liquid cooling system does not require a pump or other power device; it relies solely on the pressure difference generated by the height difference of the first refrigerant level to achieve circulation, effectively reducing the power loss of the cooling system and achieving energy-saving effects. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a liquid cooling heat dissipation system provided in an embodiment of the present invention;

[0018] Figure 2 A side cross-sectional view of an immersion liquid-cooled knife box provided in an embodiment of the present invention;

[0019] Figure 3 A top cross-sectional view of an immersion liquid-cooled knife box provided in an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of a motherboard structure provided in an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of a flexible cable strip provided in an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of a limiting reinforcement plate provided in an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the structure of a heat exchanger provided in an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of the structure of a liquid storage buffer tank provided in an embodiment of the present invention.

[0025] Icons: 100-Immersed liquid-cooled knife box; 101-Knife box housing; 102-Liquid inlet; 103-Steam outlet; 104-Low-pressure through-wall sealing insert; 105-High-pressure through-wall sealing insert; 106-First liquid level gauge; 107-First temperature sensor; 108-First pressure sensor; 109-Pressure relief valve; 110-Limit reinforcing plate; 1101-Structural reinforcing plate; 1102-Main board slot; 1103-Connecting hole; 1104-Manifold; 200-Heat exchanger; 201-Evaporator 202-Liquid outlet; 203-First electric valve; 204-Flow meter; 205-Third temperature sensor; 206-Third pressure sensor; 300-Liquid storage buffer tank; 301-Vacuum port; 302-Second level gauge; 303-Second pressure sensor; 400-Main board; 401-High heat flux density chip; 402-Low pressure connector; 403-High pressure connector; 500-Second electric valve; 600-Check valve; 700-Filter; 800-Second temperature sensor. Detailed Implementation

[0026] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Currently, data center cooling consumes a lot of energy, and in order to improve computing power, data center chips are becoming increasingly powerful, resulting in higher and higher heat flux densities. The heat flux density of supercomputer GPUs (Graphics Processing Units) has already reached 100W / cm². 2 Traditional air-cooling methods are no longer sufficient to handle such high heat flux densities. Solving the data center heat dissipation problem with low energy consumption within a smaller volume and with higher chip density has become an urgent issue.

[0028] Based on this, the liquid cooling heat dissipation system and data center provided by the embodiments of the present invention can effectively reduce the power loss of the heat dissipation system and achieve energy saving effect. At the same time, it meets the chip stacking density requirements of the data center, improves the short-distance data transmission capability of computing nodes, and improves the computing power of the data center.

[0029] To facilitate understanding of this embodiment, a liquid cooling heat dissipation system disclosed in this embodiment of the invention will first be described in detail.

[0030] See Figure 1The diagram shows a liquid cooling system, which includes an immersion liquid-cooled blade box 100, a heat exchanger 200, and a liquid storage buffer tank 300 connected in sequence through pipes to form a loop. The immersion liquid-cooled blade box 100 is used to accommodate the main board 400 to be cooled, and the main board 400 is immersed in a first refrigerant. The heat exchanger 200, the liquid storage buffer tank 300, and the immersion liquid-cooled blade box 100 are arranged in descending order of height, that is, the height of the three from high to low is heat exchanger 200, liquid storage buffer tank 300, and immersion liquid-cooled blade box 100, so that the first refrigerant circulates in the loop by gravity.

[0031] In this liquid cooling system, the evaporation section and condensation section of the first refrigerant are separate. The evaporation section can be the immersion liquid-cooled blade box 100 located inside the data center cabinet, and the condensation section can be the heat exchanger 200 located outside the cabinet or outside the computer room. The piping between the immersion liquid-cooled blade box 100 and the heat exchanger 200 can be called a steam riser or steam piping. The piping between the heat exchanger 200 and the liquid storage buffer tank 300, and the piping between the liquid storage buffer tank 300 and the immersion liquid-cooled blade box 100 can both be called liquid piping.

[0032] The working principle of the above-mentioned liquid cooling heat dissipation system is as follows: the first refrigerant immersed in the liquid-cooled blade box 100 absorbs the heat generated by the motherboard 400 inside the cabinet and evaporates, which increases the pressure inside the liquid-cooled blade box 100. The vapor generated by the first refrigerant reaches the condensation section through the vapor riser pipe, releases latent heat and condenses into liquid. Under the action of gravity, the liquid first refrigerant returns to the evaporation section of the liquid-cooled blade box 100 through the liquid pipeline, and so on.

[0033] This liquid cooling system provides the pressure head based on the height difference of the liquid level. The pressure head can be specifically expressed as: ρ × g × H = ΔP, where ρ represents the density of the refrigerant liquid at its design boiling point (kg / m³). 3 ), where g represents the gravitational acceleration of the refrigerant liquid at its design boiling point (m / s²). 2 H represents the height difference of the refrigerant liquid level (m), and ΔP represents the pressure difference of the refrigerant vapor between the evaporation section and the condensation section (Pa).

[0034] In this embodiment of the invention, the first refrigerant in the liquid cooling system circulates in the loop under the action of gravity. That is, the liquid cooling system does not require a power device such as a pump. It only relies on the pressure difference generated by the height difference of the first refrigerant liquid level to achieve circulation, which effectively reduces the power loss of the cooling system and achieves energy saving.

[0035] The aforementioned liquid cooling system may include one immersion liquid-cooled blade holder 100, or multiple immersion liquid-cooled blade holders 100 connected in parallel, with the multiple immersion liquid-cooled blade holders 100 located at the same horizontal level. Multiple immersion liquid-cooled blade holders 100 can improve the liquid cooling system's capacity to accommodate the motherboard 400.

[0036] Optionally, the shape of the immersion liquid cooling box 100 can be square, cylindrical, or spherical. Among them, the cylindrical and spherical immersion liquid cooling box 100 have better pressure resistance.

[0037] Optionally, see Figure 2 The diagram shows a side cross-sectional view of an immersion liquid-cooled knife box 100. The immersion liquid-cooled knife box 100 includes a knife box housing 101, and a liquid inlet 102, a steam outlet 103, a low-pressure through-wall sealing plug 104, and a high-pressure through-wall sealing plug 105 disposed on the knife box housing 101. The liquid inlet 102 is located at the bottom of the side wall of the knife box housing 101, the steam outlet 103 is located at the top of the side wall of the knife box housing 101, the low-pressure through-wall sealing plug 104 is used to connect with the low-pressure plug of the main board 400, and the high-pressure through-wall sealing plug 105 is used to connect with the high-pressure plug of the main board 400.

[0038] The aforementioned liquid inlet 102, steam outlet 103, low-pressure wall-penetrating sealing plug 104, and high-pressure wall-penetrating sealing plug 105 are all hot-swappable, meaning they can be connected and disconnected simultaneously. Optionally, such as Figure 2 As shown, the liquid inlet 102, the steam outlet 103, the low-pressure wall penetration sealing plug 104, and the high-pressure wall penetration sealing plug 105 can be located on the same side wall of the knife box housing 101.

[0039] Furthermore, such as Figure 2 As shown, the aforementioned immersion liquid-cooled knife box 100 further includes a first level gauge 106, a first temperature sensor 107, and a first pressure sensor 108 disposed inside the knife box housing 101, and a pressure relief valve 109 disposed on the knife box housing 101. The first level gauge 106 is used to detect the height of the liquid level inside the immersion liquid-cooled knife box 100; the first temperature sensor 107 is used to detect the steam temperature inside the immersion liquid-cooled knife box 100; the first pressure sensor 108 is used to detect the steam pressure inside the immersion liquid-cooled knife box 100; and the pressure relief valve 109 is used to release pressure when the pressure inside the immersion liquid-cooled knife box 100 is too high, so as to protect the safety of the immersion liquid-cooled knife box 100.

[0040] See Figure 3The diagram shows a top cross-sectional view of an immersion liquid-cooled knife box 100. The immersion liquid-cooled knife box 100 can accommodate one or more mainboards 400. The number of mainboards 400 can be adjusted according to the actual design. The mainboards 400 can be vertically inserted into the immersion liquid-cooled knife box 100. The distance between the mainboards 400 can be 5-100mm.

[0041] See Figure 4 The diagram illustrates the structure of a motherboard 400. Each motherboard 400 includes a high-voltage connector 403, a low-voltage connector 402, and one or more high heat flux density chips 401. The high heat flux density chip 401 can be a CPU (central processing unit) and / or a GPU. In the immersion liquid-cooled blade enclosure 100, each low-voltage through-wall sealing connector 104 and each high-voltage through-wall sealing connector 105 corresponds to the low-voltage connector 402 and high-voltage connector 403 of one motherboard 400, respectively. The shape of the motherboard 400 can be, but is not limited to, rectangular or circular.

[0042] Optionally, the aforementioned low-pressure through-wall sealing plug 104 can be achieved through, for example... Figure 5 The shown flexible cable connector connects to the low-voltage connector 402 of the corresponding motherboard 400. The high-voltage through-wall sealing connector 105 can also be connected via... Figure 5 The shown flexible cable connects to the high-voltage connector 403 of the corresponding motherboard 400, which facilitates the replacement of a single motherboard 400.

[0043] To facilitate the placement of multiple motherboards 400, such as Figure 2 and Figure 3 As shown, a limiting reinforcement plate 110 is also provided inside the tool box housing 101. The limiting reinforcement plate 110 is used to divide the internal space of the tool box housing 101 into multiple sub-spaces, each of which is used to accommodate a motherboard 400.

[0044] Optionally, see Figure 6The diagram shows a structural reinforcing plate 110, which includes a structural reinforcing plate 1101, a main board slot 1102, a connecting hole 1103, and a manifold 1104 disposed on the structural reinforcing plate 1101. The structural reinforcing plate 1101 is fixed to the inner wall of the blade box housing 101. The structural reinforcing plate 1101 and the blade box housing 101 can be fixed by welding or screws. The structural reinforcing plate 1101 is used to ensure that the blade box housing 101 does not deform under high or low pressure conditions in the immersion liquid-cooled blade box 100. The main board slot 1102 is used to fix and limit the position of the main board 400. The connecting hole 1103 is used to allow the first refrigerant to pass through each main board 400, thereby achieving a uniform liquid level in the immersion liquid-cooled blade box 100. The manifold 1104 is disposed at the bottom of the structural reinforcing plate 1101. There can be one or more manifolds 1104, which facilitate the uniform discharge of the first refrigerant liquid in the immersion liquid-cooled blade box 100. The shape of the limiting reinforcement plate 110 may be, but is not limited to, rectangular or circular.

[0045] This liquid cooling system can accommodate multiple motherboards 400 within a single immersion liquid cooling blade box 100. The motherboards 400 can be tightly stacked, allowing for more motherboards 400 to be accommodated per unit volume. Furthermore, the immersion liquid cooling blade boxes 100 can be connected in parallel, thus meeting the chip stacking density requirements of data centers, improving the short-distance data transmission capability of computing nodes, and enhancing the computing power of data centers.

[0046] The heat exchanger 200 described above can be any one of a shell-and-tube heat exchanger, a plate heat exchanger, a coaxial tube heat exchanger, and a spiral plate heat exchanger. Alternatively, see [link to relevant documentation]. Figure 7 The diagram shows a heat exchanger 200, which includes a first refrigerant storage area and a second refrigerant storage area. The first refrigerant storage area stores first refrigerant from an immersed liquid cooling box 100, and its steam inlet 201 is located above its liquid outlet 202. The second refrigerant storage area stores second refrigerant, which absorbs heat from the first refrigerant to cool it down. A first electric valve 203 and a flow meter 204 are installed at the liquid inlet of the second refrigerant storage area. The first electric valve 203 regulates the flow rate of the second refrigerant, and the flow meter 204 detects the flow rate of the second refrigerant. The second refrigerant may be, but is not limited to, cooling water.

[0047] This liquid cooling system can stabilize the liquid level of the first refrigerant in the system by adjusting the flow rate of the second refrigerant at a certain boiling point of the first refrigerant and the temperature of the second refrigerant at the inlet of the heat exchanger 200, thereby achieving dynamic stability of the system. Therefore, this system is simple to operate.

[0048] like Figure 7As shown, the heat exchanger 200 also includes a third temperature sensor 205 and a third pressure sensor 206 disposed in the first refrigerant storage area. The third temperature sensor 205 is used to detect the temperature inside the first refrigerant storage area, and the third pressure sensor 206 is used to detect the pressure inside the first refrigerant storage area.

[0049] See Figure 8 The diagram shows a structural schematic of a liquid storage buffer tank 300. The liquid storage buffer tank 300 is equipped with an evacuation port 301, which is used to control the opening and closing of the liquid cooling system. Inside the liquid storage buffer tank 300, there is a second liquid level gauge 302 and a second pressure sensor 303. The second liquid level gauge 302 is used to detect the liquid level height inside the liquid storage buffer tank 300; the second pressure sensor 303 is used to detect the pressure inside the liquid storage buffer tank 300.

[0050] The vent 301 is equipped with a valve (not shown in the figure) to allow for the sealing and opening of the entire system. When this liquid cooling system starts operating, the air inside the system is vented through the vent 301, leaving only the first refrigerant vapor present. This regulates the pressure of the entire system. Simultaneously, the overall system pressure is regulated by adjusting the flow rate of the second refrigerant at the inlet of the heat exchanger 200 and the temperature of the second refrigerant, thereby changing the boiling point of the first refrigerant. In other words, this system can achieve different phase change evaporation temperatures for the same refrigerant, exhibiting a wide range of chip temperature control capabilities and applicable to evaporative cooling in various environments and operating conditions.

[0051] Furthermore, such as Figure 1 As shown, a second electric valve 500 is installed on the steam pipeline between the submerged liquid cooling knife box 100 and the heat exchanger 200. The second electric valve 500 is used to adjust the opening and closing degree of the steam pipeline, thereby adjusting the resistance of the first refrigerant steam from the submerged liquid cooling knife box 100 to the heat exchanger 200. A one-way valve 600, a filter 700, and a second temperature sensor 800 are installed on the pipeline between the liquid storage buffer tank 300 and the submerged liquid cooling knife box 100. The one-way valve 600 is used to prevent the first refrigerant liquid in the submerged liquid cooling knife box 100 from flowing back into the liquid storage buffer tank 300; the filter 700 is used to filter impurities; and the second temperature sensor 800 is used to detect the temperature of the first refrigerant liquid in the corresponding pipeline.

[0052] For ease of understanding, taking cooling water as the second refrigerant as an example, this embodiment also provides the circulation process of the above-mentioned liquid cooling heat dissipation system, as follows:

[0053] (1) Upon power-on, the heat source (such as the GPU) of the motherboard 400 generates heat and maintains a certain heating power. At the same time, the vacuum device is activated to expel the air in the system through the vacuum port 301, so that the system contains only the first refrigerant liquid and the first refrigerant gas. After the vacuuming is completed, the valve of the vacuum port 301 is closed to maintain the system in a vacuum state.

[0054] (2) The temperature and flow rate of the cooling water at the inlet of the heat exchanger 200 are controlled under certain conditions until the system maintains a balanced state.

[0055] (3) The first refrigerant in the immersion liquid-cooled knife box 100 is heated by the heat source on the main board 400 and vaporizes, generating steam that enters the steam pipeline from the steam outlet 103. It condenses into the first refrigerant liquid in the heat exchanger 200. Due to gravity, the liquid flows into the liquid storage buffer tank 300, causing the liquid level in the liquid storage buffer tank 300 to rise, forcing the liquid to flow into the immersion liquid-cooled knife box 100 connected to the liquid storage buffer tank 300. After the cycle stabilizes, a height difference H is generated between the first refrigerant liquid in the liquid storage buffer tank 300 and the first refrigerant liquid in the immersion liquid-cooled knife box 100. The pressure difference ΔP provided by the height difference H is the difference between the pressure of the steam in the immersion liquid-cooled knife box 100 and the pressure of the steam in the liquid storage buffer tank 300. It is also the flow resistance of the steam in the process of the steam from the immersion liquid-cooled knife box 100 to the liquid storage buffer tank 300. Therefore, the entire circulation system maintains dynamic balance.

[0056] In addition, a second electric valve 500 is installed on the steam pipeline between the immersion liquid-cooled knife box 100 and the heat exchanger 200 to adjust the opening and closing degree of the steam pipeline, thereby adjusting the flow resistance of the steam, and thus adjusting the pressure difference of the steam in the immersion liquid-cooled knife box 100 and the heat exchanger 200 to generate different height differences H.

[0057] (4) The process of adjusting the evaporation boiling point is as follows: by increasing the flow rate of cooling water in heat exchanger 200, the temperature of cooling water is reduced, and the whole system is in a negative pressure state, thereby reducing the evaporation temperature of the first refrigerant; conversely, by reducing the flow rate of cooling water in heat exchanger 200, the temperature of cooling water is increased, and the whole system is in a positive pressure state, thereby increasing the evaporation temperature of the first refrigerant.

[0058] For ease of understanding, this embodiment also provides a specific implementation of a liquid cooling heat dissipation system, as follows:

[0059] like Figure 2 and Figure 3 As shown, the immersion liquid-cooled knife box 100 is a square knife box; as Figure 4 and Figure 6As shown, both the main board 400 and the limiting reinforcement plate 110 are rectangular in shape. The tool box housing 101 is a sheet metal stainless steel housing with welded sealing; a single immersion liquid-cooled tool box 100 contains 5 main boards 400; the liquid inlet 102 is connected by an M10 quick connector and is located at the bottom of the tool box; the steam outlet 103 is connected by an M50 quick connector and is located at the top of the tool box; the liquid inlet 102 and the steam outlet 103 are located on the same side of the tool box. The low-pressure through-wall sealing plug 104 is a 30-pin plug used to transmit calculation information and sensor information, etc.; the high-pressure through-wall sealing plug 105 is a 10-pin high-pressure resistant plug used to transmit power. The pressure relief valve 109 opens at a high pressure of 3 bar to relieve pressure. The range of the first pressure sensor 108 is -100kPa to 400kPa.

[0060] like Figure 4 As shown, the motherboard 400 includes 6 GPUs, 2 CPUs, 1 high-voltage module 403, and 1 low-voltage module 402. The motherboard 400 has a power density of 80W / cm². 2 The motherboard 400 is vertically inserted into the blade box housing 101, with a spacing of 30mm between motherboards 400.

[0061] like Figure 6 As shown, the limiting reinforcement plate 110 includes a structural reinforcement plate 1101, a main board slot 1102, a connecting hole 1103, and a manifold 1104. The structural reinforcement plate 1101 is welded to the inner wall of the blade box housing 101 to form a partition while ensuring that the blade housing does not deform under high or low pressure conditions inside the blade box. The main board slot 1102 is a Teflon slot, and each structural reinforcement plate 1101 has four Teflon slots. The connecting hole 1103 is a circular hole formed by laser cutting, which is used for the first refrigerant to pass through between the main boards 400, so that the liquid level in the immersion liquid-cooled blade box 100 is uniform. The manifold 1104 can be semi-circular to facilitate uniform liquid discharge and prevent liquid accumulation.

[0062] In summary, the liquid cooling heat dissipation system provided in the embodiments of the present invention has the following advantages:

[0063] (1) This liquid cooling heat dissipation system does not require a power device such as a pump. It relies solely on the pressure difference generated by the height difference of the refrigerant liquid level to achieve circulation, thus realizing energy-saving effect.

[0064] (2) Multiple motherboards 400 can be inserted into one immersion liquid-cooled knife box 100. The motherboards 400 can be tightly stacked, and more motherboards 400 can be accommodated in a unit volume. At the same time, the immersion liquid-cooled knife boxes 100 can also be connected in parallel, which meets the chip stacking density requirements of the data center, improves the short-distance data transmission capability of the computing node, and improves the computing power of the data center.

[0065] (3) Under a certain boiling point of the first refrigerant, this liquid cooling heat dissipation system can stabilize the liquid level of the first refrigerant in the system by adjusting the flow rate of the second refrigerant inlet of the heat exchanger 200 and the temperature of the second refrigerant, thereby achieving dynamic stability of the system. Therefore, this system has the advantage of simple conditions.

[0066] (4) This liquid cooling system can achieve different phase change evaporation temperatures for the same refrigerant, has a wide range of chip temperature control, and can be applied to evaporation heat dissipation in different environments and working conditions.

[0067] In addition, embodiments of the present invention also provide a data center, including a motherboard and the above-mentioned liquid cooling system, wherein the motherboard is immersed in a first refrigerant in the immersion liquid cooling box of the liquid cooling system; the motherboard includes a high-voltage module, a low-voltage module and one or more high heat flux density chips.

[0068] The data center provided in this embodiment has the same implementation principle and technical effect as the aforementioned liquid cooling system embodiment. For the sake of brevity, any parts not mentioned in the data center embodiment can be referred to the corresponding content in the aforementioned liquid cooling system embodiment.

[0069] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0070] Furthermore, in the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0071] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid cooling heat dissipation system, characterized in that, The immersion liquid cooling cutter tank, the heat exchanger and the liquid storage buffer tank are connected in sequence by pipelines to form a circuit, the immersion liquid cooling cutter tank is used for accommodating a mainboard to be cooled, the mainboard is immersed in first refrigerant, the heat exchanger, the liquid storage buffer tank and the immersion liquid cooling cutter tank are arranged from high to low in height position, so that the first refrigerant circulates in the circuit by gravity; The heat exchanger comprises a first refrigerant storage area and a second refrigerant storage area, the first refrigerant storage area is used for storing the first refrigerant from the immersion liquid cooling cutter tank, the second refrigerant storage area is used for storing second refrigerant, the second refrigerant is used for absorbing the heat of the first refrigerant to cool the first refrigerant, the liquid storage buffer tank is provided with a gas extraction hole, the gas extraction hole is used for realizing the closing and opening of the liquid cooling heat dissipation system, when the liquid cooling heat dissipation system starts to operate, the air in the liquid cooling heat dissipation system is exhausted through the gas extraction hole, so that only first refrigerant vapor exists in the liquid cooling heat dissipation system, the pressure of the entire liquid cooling heat dissipation system is adjusted, and the flow rate and the temperature of the second refrigerant of the liquid inlet of the second refrigerant storage area of the heat exchanger are adjusted to adjust the overall pressure of the liquid cooling heat dissipation system, so as to change the boiling point of the first refrigerant and realize different phase change evaporation temperatures of the first refrigerant.

2. The liquid cooling heat dissipation system of claim 1, wherein, The immersion liquid cooling cutter tank comprises a cutter tank shell, a liquid inlet, a vapor outlet, a low-pressure through-wall sealing plug and a high-pressure through-wall sealing plug arranged on the cutter tank shell, the liquid inlet is located at the bottom of the side wall of the cutter tank shell, the vapor outlet is located at the top of the side wall of the cutter tank shell, the low-pressure through-wall sealing plug is connected with the low-pressure plug of the mainboard through a soft wire, and the high-pressure through-wall sealing plug is connected with the high-pressure plug of the mainboard through a soft wire.

3. The liquid cooling heat dissipation system of claim 2, wherein, The immersion liquid cooling cutter tank further comprises a first liquid level meter, a first temperature sensor and a first pressure sensor arranged in the cutter tank shell, and a pressure relief valve arranged on the cutter tank shell.

4. The liquid cooling heat dissipation system of claim 2, wherein, The cutter tank shell further comprises a limiting reinforcing plate arranged in the cutter tank shell, the limiting reinforcing plate is used for dividing the internal space of the cutter tank shell into a plurality of subspaces, and each of the subspaces is used for accommodating one of the mainboards.

5. The liquid cooling heat dissipation system of claim 4, wherein, The limiting reinforcing plate comprises a structure reinforcing plate, a mainboard clamping groove, a communication hole and a confluence groove arranged on the structure reinforcing plate, the structure reinforcing plate is fixed on the inner wall of the cutter tank shell, the mainboard clamping groove is used for fixing and limiting the position of the mainboard, and the confluence groove is arranged at the bottom of the structure reinforcing plate.

6. The liquid cooling heat dissipation system of claim 1, wherein, The vapor inlet of the first refrigerant storage area is located above the liquid outlet of the first refrigerant storage area, a first electric valve and a flow meter are arranged at the liquid inlet of the second refrigerant storage area, the first electric valve is used for adjusting the flow rate of the second refrigerant, and the flow meter is used for detecting the flow rate of the second refrigerant.

7. The liquid cooling heat dissipation system of claim 1, wherein, The liquid storage buffer tank is internally provided with a second liquid level meter and a second pressure sensor.

8. The liquid cooling heat dissipation system of claim 1, wherein, A second electric valve is arranged on a steam pipeline between the immersed liquid-cooled knife tank and the heat exchanger, and is used to adjust the resistance of the steam of the first refrigerant moving from the immersed liquid-cooled knife tank to the heat exchanger; a one-way valve, a filter and a second temperature sensor are arranged on a pipeline between the liquid storage buffer tank and the immersed liquid-cooled knife tank.

9. The liquid cooling heat dissipation system of claim 1, wherein, The liquid cooling system comprises one immersed liquid-cooled knife tank; or the liquid cooling system comprises a plurality of parallel immersed liquid-cooled knife tanks, and the plurality of immersed liquid-cooled knife tanks are located at the same horizontal height.

10. A data center, characterized by, The liquid cooling system comprises a mainboard and the liquid cooling system according to any one of claims 1-9, the mainboard is immersed in the first refrigerant in the immersed liquid-cooled knife tank of the liquid cooling system; and the mainboard comprises a high-voltage plug-in, a low-voltage plug-in and one or more high-heat-flow-density chips.

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