Blood pressure measurement module

Abstract

A blood pressure measurement module, comprising: a top cover having an air inlet hole, a receiving groove and an air outlet channel, wherein a gas collecting chamber is recessed in the receiving groove, which is communicated with the air inlet hole, and the air outlet channel is connected to an air bag for blood pressure measurement; a micro pump disposed in the receiving groove and covering the gas collecting chamber; a driving circuit board covering the receiving groove; and a pressure sensor disposed on and electrically connected to the driving circuit board, and the driving circuit board covers the receiving groove of the top cover to detect the pressure of the gas introduced into the receiving groove; wherein, the micro pump is driven by the driving circuit board to form gas transmission, so that the gas outside the top cover is introduced into the receiving groove through the air inlet hole, and then continuously introduced into the air outlet channel through the micro pump and gathered in the air bag, so that the air bag expands to measure blood pressure, and when the gas pressure of the air bag reaches a threshold value through the pressure sensor, the micro pump stops operating.

Description

Technical Field

[0001] This case relates to a blood pressure measurement module, especially an extremely thin one for combining with wearable electronic devices or mobile devices.

Background Art

[0002] In recent years, the awareness of personal physical health care has gradually increased. As a result, there is a hope to regularly detect one's own physical condition. However, most of the current instruments for detecting physical conditions are fixed, and almost all require going to fixed medical service stations or hospitals. Even if there are home-use detection instruments, they are relatively large in size and not easy to carry. In today's fast-paced society, it is difficult to meet the needs of users.

[0003] Among them, nothing can reflect the physical condition better than blood pressure. The blood vessels in everyone's body are like roads spreading all over the body, and blood pressure is like the road conditions, which can understand the blood delivery state. Therefore, if there is any problem with the body, blood pressure knows it best.

[0004] In view of this, how to provide a device that can measure blood pressure accurately at any time and can be combined with wearable devices or portable electronic devices, so that users can confirm their blood pressure conditions quickly anytime and anywhere, is indeed a problem that needs to be solved currently.

Summary of the Invention

[0005] The main purpose of this case is to provide a blood pressure measurement module that can be combined with wearable electronic devices or portable electronic devices, which is convenient for users to carry and can complete blood pressure measurement without being restricted by time, location, etc.

[0006] A general implementation aspect of this case is a blood pressure measurement module, including: a top cover having an air inlet hole, a receiving groove, and an air outlet channel, where the air inlet hole and the air outlet channel are respectively provided on different surfaces and are respectively connected to the receiving groove, and a gas collecting chamber is recessed in the receiving groove and is connected to the air inlet hole, and the air outlet channel is connected to an airbag for blood pressure measurement; a micro pump disposed in the receiving groove and covering the gas collecting chamber; a driving circuit board covering the receiving groove on the top cover to provide a driving signal for the micro pump to control the driving operation of the micro pump; and a pressure sensor positioned and electrically connected to the driving circuit board, and the driving circuit board covers the receiving groove of the top cover to detect the pressure of the gas introduced into the receiving groove; wherein, the micro pump is controlled by the driving circuit board to drive and operate to form a gas transmission, so that the gas outside the top cover is introduced from the air inlet hole into the receiving groove area, and then continuously introduced into the air outlet channel by the micro pump and gathered into the airbag, so as to form an expansion of the airbag for blood pressure measurement operation. The gas gathered in the airbag is monitored by the pressure sensor for a threshold value to control the micro pump to stop driving and operating, and thus the pressure collection operation of the airbag can be completed.

Description of the Drawings

[0007] Figure 1A This is a three-dimensional schematic diagram of the blood pressure measurement module in this case.

[0008] Figure 1B This is an exploded schematic diagram of the blood pressure measurement module in this case.

[0009] Figure 1C This is an exploded schematic diagram of the blood pressure measurement module from another angle in this case.

[0010] Figure 2 This is a schematic diagram of the pressure sensor of the blood pressure measurement module in this case being arranged on the drive circuit board.

[0011] Figure 3 This is a cross-sectional schematic diagram of the blood pressure measurement module in this case.

[0012] Figure 4 This is a schematic diagram of the blood pressure measurement module in this case connecting to the airbag.

[0013] Figure 5A This is an exploded schematic diagram of the micro pump of the gas detection module in this case.

[0014] Figure 5B This is an exploded schematic diagram of the micro pump of the gas detection module from another angle in this case.

[0015] Figure 6A This is a cross-sectional schematic diagram of the micro pump of the gas detection module in this case.

[0016] Figure 6B This is a cross-sectional schematic diagram of another embodiment of the gas detection module in this case.

[0017] Figures 6C to 6E This is a schematic diagram of the operation of the micro pump.

[0018] Figure 7A This is a cross-sectional schematic diagram of the micro-electromechanical pump.

[0019] Figure 7B This is an exploded schematic diagram of the micro-electromechanical pump.

[0020] Figures 8A to 8C This is a schematic diagram of the operation of the micro-electromechanical pump.

[0021] Figure 9 This is a schematic diagram of the blood pressure measurement module connecting to an external device.

Detailed Description of the Invention

[0022] Some typical embodiments demonstrating the features and advantages of this case will be described in detail in the following description.

[0023] It should be understood that the present case can have various variations in different aspects, all of which do not deviate from the scope of the present case, and the descriptions and illustrations therein are essentially for illustrative purposes rather than for limiting the present case.

[0024] Please refer to Figures 1A to 1C As shown, the present case provides a blood pressure measurement module, which includes a top cover 1, a micro pump 2, a driving circuit board 3 and a pressure sensor 4.

[0025] The top cover 1 includes an air inlet hole 11, a receiving groove 12, an air outlet channel 13, a top plate 14 and a side wall portion 15. The side wall portion 15 extends vertically from the periphery of the top plate 14, and a receiving groove 12 is formed between the side wall portion 15 and the top plate 14. The receiving groove 12 includes a gas collecting chamber 12a, a micro pump area 12b, a partition plate 12c and a sensor area 12d. The receiving groove 12 is partitioned by the partition plate 12c into the micro pump area 12b and the sensor area 12d, and the gas collecting chamber 12a is recessed in the micro pump area 12b. Among them, the partition plate 12c has a notch 121c to connect the micro pump area 12b and the sensor area 12d; the air inlet hole 11 is located on the surface of the top plate 14 and is connected to the receiving groove 12 and its gas collecting chamber 12a. The air outlet channel 13 is arranged on the surface of the side wall portion 15 and is connected to the receiving groove 12. In addition, the air outlet channel 13 is for connecting an airbag 10 used to measure blood pressure (as Figure 4 shown).

[0026] Please refer to Figure 1C , the micro pump 2 is accommodated in the micro pump area 12b of the receiving groove 12 and covers the gas collecting chamber 12a. In addition, the side wall portion 15 has a groove 151, and the driving circuit board 3 is arranged in the groove 151 to cover the receiving groove 12, and the driving circuit board 3 is also electrically connected to the micro pump 2 to provide a driving signal for the micro pump 2 and control the driving operation of the micro pump 2.

[0027] Please refer to Figure 2 and Figure 3 , the pressure sensor 4 is arranged on the driving circuit board 3 and is electrically connected thereto. When the driving circuit board 3 covers the receiving groove 12, the pressure sensor 4 will be accommodated in the sensor area 12d of the receiving groove 12 to detect the pressure of the gas introduced into the receiving groove 12.

[0028] Please refer to Figure 3 and Figure 4, the circuit board 3 drives the micro pump 2 to start transmitting gas, causing the gas outside the top cover 1 to start being introduced into the accommodation groove 12 through the air inlet hole 11, and continuously introduced into the air outlet channel 13 through the micro pump 2, causing the gas to converge into the airbag 10, causing the airbag 10 to start expanding and closely adhering to the user's skin, and performing the blood pressure measurement action through the pressure sensor 4. In addition, the pressure sensor 4 monitors the gas pressure in the airbag 10, and when it reaches a threshold value, it drives the circuit board 3 to control the micro pump 2 to stop operating to complete the pressure collection operation of the airbag 10.

[0029] Please refer to Figure 5A and Figure 5B , the micro pump 2 includes structures such as an air inlet plate 21, a resonance piece 22, a piezoelectric actuator 23, a first insulating piece 24, a conductive piece 25, and a second insulating piece 26. Among them, the piezoelectric actuator 23 is arranged corresponding to the resonance piece 22, and the air inlet plate 21, resonance piece 22, piezoelectric actuator 23, first insulating piece 24, conductive piece 25, and second insulating piece 26 are stacked in sequence.

[0030] The air inlet plate 21 has at least one air inlet hole 211, at least one confluence row groove 212, and a confluence chamber 213. In this embodiment, the number of air inlet holes 211 is preferably 2, but not limited thereto. The air inlet hole 211 penetrates the air inlet plate 21 for the gas to flow into the micro pump 2 from the air inlet hole 211 under the action of atmospheric pressure. The air inlet plate 21 has at least one confluence row groove 212, and its number and position correspond to the air inlet holes 211 on the other surface of the air inlet plate 21. In this embodiment, the number of air inlet holes 211 is 4, and the number of corresponding confluence row grooves 212 is also 4; the confluence chamber 213 is located at the center of the air inlet plate 21. One end of the aforementioned 4 confluence row grooves 212 communicates with the corresponding air inlet hole 211, and the other end communicates with the confluence chamber 213 at the center of the air inlet plate 21, thereby guiding and converging the gas entering the confluence row groove 212 from the air inlet hole 211 to the confluence chamber 213. In this embodiment, the air inlet plate 21 has integrally formed air inlet holes 211, confluence row grooves 212, and a confluence chamber 213.

[0031] In some embodiments, the material of the air inlet plate 21 can be made of stainless steel material, but not limited thereto. In other embodiments, the depth of the confluence chamber 213 is the same as the depth of the confluence row groove 212, but not limited thereto.

[0032] The resonance piece 22 is made of a flexible material, but not limited thereto, and has a hollow hole 221 on the resonance piece 22, which is arranged corresponding to the confluence chamber 213 of the air inlet plate 21 for the gas to pass through. In other embodiments, the resonance piece 22 can be made of a copper material, but not limited thereto.

[0033] The piezoelectric actuator 23 is assembled by a suspension plate 231, an outer frame 232, at least one bracket 233 and a piezoelectric element 234; the suspension plate 231 is in a square shape and can bend and vibrate, the outer frame 232 is arranged around the suspension plate 231, and at least one bracket 233 is connected between the suspension plate 231 and the outer frame 232 to provide an elastic support effect. The piezoelectric element 234 is also in a square shape and is attached to one surface of the suspension plate 231 to apply a voltage to generate deformation to drive the suspension plate 231 to bend and vibrate, and the side length of the piezoelectric element 234 is less than or equal to the side length of the suspension plate 231; wherein, there are a plurality of gaps 235 between the suspension plate 231, the outer frame 232 and the bracket 233, and the gaps 235 allow gas to pass through; in addition, the piezoelectric actuator 23 further includes a convex portion 236, and the convex portion 236 is arranged on the other surface of the suspension plate 231 and is oppositely arranged with the piezoelectric element 234 on the two surfaces of the suspension plate 231.

[0034] As Figure 6A shown, the intake plate 21, the resonance piece 22, the piezoelectric actuator 23, the first insulating sheet 24, the conductive sheet 25, and the second insulating sheet 26 are stacked in sequence. The thickness of the suspension plate 231 of the piezoelectric actuator 23 is less than the thickness of the outer frame 232. When the resonance piece 22 is stacked on the piezoelectric actuator 23, a chamber space 27 can be formed between the suspension plate 231, the outer frame 232 of the piezoelectric actuator 23 and the resonance piece 22.

[0035] Please refer to Figure 6B , Figure 6B Another embodiment of the micro pump 2, its components are the same as those of the previous embodiment ( Figure 6A ), so they will not be described in detail. The difference is that when not actuated, the suspension plate 231 of its piezoelectric actuator 23 extends in a direction away from the resonance piece 22 in a stamping manner and is not on the same level as the outer frame 232. The extension distance can be adjusted by the bracket 233, and the bracket 233 and the suspension plate 231 are not parallel, so that the piezoelectric actuator 23 is convex.

[0036] To understand the output actuation method of the above-mentioned micro pump 2 for gas transmission, please continue to refer to Figures 6C to 6E shown, please refer to Figure 6CWhen a driving voltage is applied to the piezoelectric element 234 of the piezoelectric actuator 23, it deforms and drives the suspension plate 231 upward. At this time, the volume of the chamber space 27 increases, forming a negative pressure in the chamber space 27, which draws the gas in the confluence chamber 213 into the chamber space 27. At the same time, the resonance plate 22 is synchronously driven upward by the resonance principle, thereby increasing the volume of the confluence chamber 213. Because the gas in the confluence chamber 213 enters the chamber space 27, the confluence chamber 213 is also in a negative pressure state, and the gas is then drawn into the confluence chamber 213 through the air inlet 211 and the bus bar groove 212. Please refer to Figure 6D The piezoelectric element 234 drives the suspension plate 231 to move downward, compressing the chamber space 27. Similarly, the resonance plate 22 is displaced downward by the suspension plate 231 due to resonance, and simultaneously pushes the gas in the chamber space 27 downward through the gap 235 and transports it upward, and the gas is discharged by the micro pump 2. Figure 6E When the suspension plate 231 returns to its original position, the resonance plate 22 still moves downward due to inertia. At this time, the resonance plate 22 will make the gas in the compression chamber space 27 move to the gap 235 and increase the volume of the confluence chamber 213, so that the gas can continue to pass through the air inlet 211 and the bus groove 212 to converge in the confluence chamber 213. By repeating the above process, Figures 6C to 6E The micro pump 2 shown provides a gas transmission actuation step, enabling the micro pump 2 to continuously allow gas to enter the flow channel formed by the air inlet plate 21 and the resonance plate 22 from the air inlet hole 211 to generate a pressure gradient, and then be transported upward through the gap 235, so that the gas flows at a high speed, achieving the gas transmission effect of the micro pump 2.

[0037] Another embodiment of the micro pump 2 of the present invention may be a micro electromechanical pump 2a. Figure 7A and Figure 7B The MEMS pump 2a includes a first substrate 21a, a first oxide layer 22a, a second substrate 23a, and a piezoelectric element 24a. The MEMS pump 2a of this embodiment is manufactured through epitaxy, deposition, lithography, and etching in semiconductor manufacturing processes. It should not be disassembled. In order to describe its internal structure in detail, Figure 7B Exploded view details shown.

[0038] The first substrate 21a is a silicon chip (Si wafer) with a thickness ranging from 150 to 400 micrometers (μm). The first substrate 21a has a plurality of inflow holes 211a, a first surface 212a, and a second surface 213a. In this embodiment, the number of the plurality of inflow holes 211a is 4, but it is not limited thereto. Each inflow hole 211a penetrates from the second surface 213a to the first surface 212a. In order to improve the inflow effect, the inflow hole 211a is tapered from the second surface 213a to the first surface 212a.

[0039] The first oxide layer 22a is a silicon dioxide (SiO2) thin film with a thickness ranging from 10 to 20 micrometers (μm). The first oxide layer 22a is stacked on the first surface 212a of the first substrate 21a. The first oxide layer 22a has a plurality of converging channels 221a and a converging chamber 222a. The number and position of the converging channels 221a correspond to those of the inflow holes 211a of the first substrate 21a. In this embodiment, the number of the converging channels 221a is also 4. One ends of the 4 converging channels 221a are respectively connected to the 4 inflow holes 211a of the first substrate 21a, and the other ends of the 4 converging channels 221a are connected to the converging chamber 222a. After the gas enters through the inflow holes 211a respectively, it converges into the converging chamber 222a through the corresponding connected converging channels 221a.

[0040] The second oxide layer 232a is a silicon oxide layer with a thickness ranging from 0.5 to 2 micrometers (μm). It is formed on the silicon chip layer 231a, is in a hollow ring shape, and defines a vibration chamber 2321a with the silicon chip layer 231a. The silicon material layer 233a is circular, is located on the second oxide layer 232a and is bonded to the first oxide layer 22a. The silicon material layer 233a is a silicon dioxide (SiO2) thin film with a thickness ranging from 2 to 5 micrometers (μm). It has a perforation 2331a, a vibrating portion 2332a, a fixing portion 2333a, a third surface 2334a, and a fourth surface 2335a. The perforation 2331a is formed at the center of the silicon material layer 233a. The vibrating portion 2332a is located in the peripheral area of the perforation 2331a and is vertically corresponding to the vibration chamber 2321a. The fixing portion 2333a is the peripheral area of the silicon material layer 233a, and is fixed to the second oxide layer 232a by the fixing portion 2333a. The third surface 2334a is joined to the second oxide layer 232a, and the fourth surface 2335a is joined to the first oxide layer 22a; the piezoelectric component 24a is stacked on the actuating portion 2311a of the silicon chip layer 231a.

[0041] The piezoelectric component 24a includes a lower electrode layer 241a, a piezoelectric layer 242a, an insulating layer 243a, and an upper electrode layer 244a. The lower electrode layer 241a is stacked on the actuating portion 2311a of the silicon chip layer 231a, and the piezoelectric layer 242a is stacked on the lower electrode layer 241a, and the two are electrically connected through their contacting areas. In addition, the width of the piezoelectric layer 242a is smaller than the width of the lower electrode layer 241a, so that the piezoelectric layer 242a cannot completely cover the lower electrode layer 241a. The insulating layer 243a is stacked on a partial area of the piezoelectric layer 242a and the area of the lower electrode layer 241a not covered by the piezoelectric layer 242a. Finally, the upper electrode layer 244a is stacked on the insulating layer 243a and the area of the piezoelectric layer 242a not covered by the insulating layer 243a, so that the upper electrode layer 244a can be in contact with the piezoelectric layer 242a for electrical connection, and at the same time, the insulating layer 243a is used to block between the upper electrode layer 244a and the lower electrode layer 241a to prevent direct contact between the two from causing a short circuit.

[0042] Please refer to Figures 8A to 8C , Figures 8A to 8C which is a schematic diagram of the operation of the MEMS pump 2a.

[0043] Please first refer to <� Figure 8A , when the lower electrode layer 241a and the upper electrode layer 244a of the piezoelectric component 24a receive the driving voltage and driving signal (not shown) transmitted by the driving circuit board 3, they conduct it to the piezoelectric layer 242a. After receiving the driving voltage and driving signal, the piezoelectric layer 242a starts to deform due to the influence of the inverse piezoelectric effect, which will drive the actuating portion 2311a of the silicon chip layer 231a to start to displace. When the piezoelectric component 24a drives the actuating portion 2311a to displace upward to increase the distance from the second oxide layer 232a, at this time, the volume of the vibration chamber 2321a of the second oxide layer 232a will increase, creating a negative pressure inside the vibration chamber 2321a to suck the gas in the confluence chamber 222a of the first oxide layer 22a into it through the perforation 2331a. Please continue to refer to Figure 8B , when the actuating portion 2311a is pulled upward by the piezoelectric component 24a, the vibrating portion 2332a of the silicon material layer 233a will displace upward due to the influence of the resonance principle. When the vibrating portion 2332a displaces upward, it will compress the space of the vibration chamber 2321a and push the gas in the vibration chamber 2321a to move toward the fluid channel 2314a of the silicon chip layer 231a, so that the gas can be discharged upward through the fluid channel 2314a. While the vibrating portion 2332a displaces upward to compress the vibration chamber 2321a, the volume of the confluence chamber 222a increases due to the displacement of the vibrating portion 2332a, creating a negative pressure inside it, and sucking the gas outside the MEMS pump 2a into it through the inflow hole 211a. Finally, as shown in Figure 8CAs shown, when the piezoelectric component 24a drives the actuating part 2311a of the silicon chip layer 231a to move downward, the gas in the vibration chamber 2321a is pushed toward the fluid channel 2314a and discharged. At the same time, the vibrating part 2332a of the silicon material layer 233a is also driven by the actuating part 2311a to move downward, synchronously compressing the gas in the confluence chamber 222a to move through the perforation 2331a toward the vibration chamber 2321a. Subsequently, when the piezoelectric component 24a drives the actuating part 2311a to move upward, the volume of the vibration chamber 2321a will increase significantly, and then a higher suction force will inhale the gas into the vibration chamber 2321a. Then, repeat the above actions. That is, by continuously driving the actuating part 2311a to move up and down by the piezoelectric component 24a and linking the vibrating part 2332a to move up and down, the internal pressure of the microelectromechanical pump 2a is changed, so that it continuously sucks and discharges gas, thereby completing the operation of the microelectromechanical pump 2a.

[0044] Finally, please refer to FIG. 1 again. The length of the blood pressure measurement module in this case is between 4 mm and 27 mm, the width is between 2 mm and 16 mm, and the height is between 1 mm and 8 mm, so that the blood pressure measurement module can be combined with a portable electronic device. In addition, in order to be combined with a smart watch, the length of the blood pressure measurement module can be between 24 mm and 27 mm, the width can be between 14 mm and 16 mm, and the thickness can be between 6 mm and 8 mm.

[0045] Please refer to Figure 9 As shown, the blood pressure measurement module may further include a microprocessor 5 and a communicator 6, which are disposed on the driving circuit board 3. The microprocessor 5 is used to receive the signal measured by the pressure sensor 4, calculate and convert it into an information data, and communicate and transmit the information data through the communicator 6 to an external device 7 for storage and processing applications. Among them, the communication transmission is at least one of a wired transmission and a wireless transmission, and the external device 7 is at least one of a cloud system, a portable device, a computer system, etc.

[0046] In summary, through the setting of the micro pump in the blood pressure measurement module provided in this case, the volume of the pump can be greatly reduced, and it is sufficient to achieve the effect of quickly inflating the airbag, so that the blood pressure measurement module can be set on wearable devices such as smart watches, which has great industrial utilization and progressiveness.

[0047]

Symbol Explanation

[0048] 1: Top cover

[0049] 11: Air inlet hole

[0050] 12: Accommodation groove

[0051] 12a: Gas collection chamber

[0052] 12b: Micro pump area

[0053] 12c: Partition board

[0054] 121c: Notch

[0055] 12d: Sensor area

[0056] 13: Air outlet channel

[0057] 14: Top plate

[0058] 15: Side wall part

[0059] 151: Groove

[0060] 2: Micro pump

[0061] 21: Intake plate

[0062] 211: Intake hole

[0063] 212: Manifold groove

[0064] 213: Manifold chamber

[0065] 22: Resonance piece

[0066] 221: Hollow hole

[0067] 222: Movable part

[0068] 223: Fixed part

[0069] 23: Piezoelectric actuator

[0070] 231: Suspension plate

[0071] 232: Outer frame

[0072] 233: Bracket

[0073] 234: Piezoelectric element

[0074] 235: Gap

[0075] 236: Protrusion

[0076] 24: First insulating sheet

[0077] 25: Conductive sheet

[0078] 26: Second insulating sheet

[0079] 27: Chamber space

[0080] 2a: Microelectromechanical pump

[0081] 21a: First substrate

[0082] 211a: Inflow hole

[0083] 212a: First surface

[0084] 213a: Second surface

[0085] 22a: First oxide layer

[0086] 221a: Confluence channel

[0087] 222a: Confluence chamber

[0088] 23a: Second substrate

[0089] 231a: Silicon chip layer

[0090] 2311a: Actuating part

[0091] 2312a: Peripheral part

[0092] 2313a: Connecting part

[0093] 2314a: Fluid channel

[0094] 232a: Second oxide layer

[0095] 2321a: Vibration chamber

[0096] 233a: Silicon material layer

[0097] 2331a: Perforation

[0098] 2332a: Vibration part

[0099] 2333a: Fixing part

[0100] 2334a: Third surface

[0101] 2335a: Fourth surface

[0102] 24a: Piezoelectric component

[0103] 241a: Lower electrode layer

[0104] 242a: Piezoelectric layer

[0105] 243a: Insulating layer

[0106] 244a: Upper electrode layer

[0107] 3: Driving circuit board

[0108] 4: Pressure sensor

[0109] 5: Microprocessor

[0110] 6: Communicator

[0111] 7: External device

[0112] 10: airbag

Claims

1. A blood pressure measurement module, characterized in that, Comprising: A top cover having an air inlet hole, a receiving groove, and an air outlet channel, wherein the air inlet hole and the air outlet channel are respectively provided on different surfaces and are respectively connected to the receiving groove. A gas collecting chamber is recessed in the receiving groove and is connected to the air inlet hole. The receiving groove has a partition system that respectively demarcates a micro pump area and a sensor area. The micro pump area and the sensor area are connected through a notch in the partition, and the air outlet channel is connected to an airbag; A micro pump disposed in the micro pump area of the receiving groove to seal the gas collecting chamber; A driving circuit board provided at the bottom end of the top cover and covering the receiving groove to control the driving operation of the micro pump; and A pressure sensor positioned and electrically connected to the driving circuit board. The driving circuit board covers the receiving groove of the top cover, and the pressure sensor is located in the sensor area of the receiving groove for detecting the pressure of the gas introduced into the receiving groove; Wherein, the micro pump is controlled by the driving circuit board to drive and operate to form a gas transmission, allowing the gas outside the top cover to be introduced into the receiving groove through the air inlet hole, and then continuously introduced into the air outlet channel by the micro pump and gathered in the airbag to inflate the airbag and press against the user's skin, and the blood pressure of the user is detected by the pressure sensor in the receiving groove; when the gas gathered in the airbag passes through the pressure sensor, the pressure sensor monitors the gas pressure in the airbag until a threshold value is monitored, and the driving circuit board controls the micro pump to stop driving and operating, thereby completing the pressure collection operation of the airbag.

2. The blood pressure measurement module according to claim 1, wherein Further comprising a microprocessor and a communicator disposed on the driving circuit board. The microprocessor is used to receive the signal measured by the pressure sensor, calculate and convert it into an information data, and communicate and transmit the information data to an external device through the communicator for storage, processing, and application.

3. The blood pressure measurement module according to claim 2, wherein, The communication transmission is at least one of a wired transmission and a wireless transmission.

4. The blood pressure measurement module according to claim 2, wherein The external device is at least one of a cloud system, a portable device, and a computer system.

5. The blood pressure measurement module according to claim 1, wherein The micro pump includes: An air inlet plate having at least one air inlet hole, at least one bus bar groove corresponding to the position of the air inlet hole, and a bus bar chamber. The air inlet hole is used to introduce gas, and the bus bar groove is used to guide the gas introduced from the air inlet hole to the bus bar chamber; A resonance piece having a hollow hole. The hollow hole corresponds to the position of the bus bar chamber, and the periphery is a movable part; and A piezoelectric actuator disposed corresponding to the resonance piece in position; Wherein, the air inlet plate, the resonance piece, and the piezoelectric actuator are sequentially stacked, and a chamber space is formed between the resonance piece and the piezoelectric actuator. When the piezoelectric actuator is driven, gas is introduced from the air inlet hole of the air inlet plate, gathered in the bus bar chamber through the bus bar groove, and then passes through the hollow hole of the resonance piece, so that the piezoelectric actuator and the movable part of the resonance piece resonate to transmit gas.

6. The blood pressure measurement module according to claim 5, wherein The piezoelectric actuator includes: A suspension plate having a square shape and capable of bending and vibrating; An outer frame surrounding the outside of the suspension plate; At least one bracket connected between the suspension plate and the outer frame to provide elastic support; and A piezoelectric element has a side length that is less than or equal to a side length of the suspension plate, and the piezoelectric element is attached to a surface of the suspension plate to receive a voltage to drive the suspension plate to bend and vibrate.

7. The blood pressure measurement module according to claim 5, characterized in that, The micro pump includes: A suspension plate having a first surface and a second surface, and the first surface has a convex portion; An outer frame is disposed around the outside of the suspension plate and has a mating surface; At least one bracket is connected between the suspension plate and the outer frame to elastically support the suspension plate; and A piezoelectric element is attached to the second surface of the suspension plate to apply a voltage to drive the suspension plate to bend and vibrate; Wherein, the at least one bracket is formed between the suspension plate and the outer frame, and the first surface of the suspension plate and the mating surface of the outer frame form a non-coplanar structure, and a chamber spacing is maintained between the first surface of the suspension plate and the resonance piece.

8. The blood pressure measurement module according to claim 5, wherein The micro pump further includes a first insulating sheet, a conductive sheet, and a second insulating sheet, wherein the air inlet plate, the resonance piece, the piezoelectric actuator, the first insulating sheet, the conductive sheet, and the second insulating sheet are stacked in sequence.

9. The blood pressure measurement module according to claim 1, wherein, The micro pump is a microelectromechanical pump and includes: A first substrate having a plurality of inflow holes, and the plurality of inflow holes are conical; A first oxide layer is stacked on the first substrate, and the first oxide layer has a plurality of converging channels and a converging chamber, and the plurality of converging channels communicate between the converging chamber and the plurality of inflow holes; A second substrate is bonded to the first substrate and includes: A silicon chip layer having: An actuating portion that is circular; An outer peripheral portion that is a hollow ring and surrounds the periphery of the actuating portion; a plurality of connecting portions are respectively connected between the actuating portion and the outer peripheral portion; and A plurality of fluid channels surround the periphery of the actuating portion and are respectively located between the plurality of connecting portions; A second oxide layer is formed on the silicon chip layer, is a hollow ring, and defines a vibration chamber with the silicon chip layer; and A silicon material layer is circular, is located on the second oxide layer and is bonded to the first oxide layer, and has: A perforation is formed in the center of the silicon material layer; A vibrating portion is located in the peripheral area of the perforation; A fixing portion is located in the peripheral area of the silicon material layer; and A piezoelectric component is circular and is stacked on the actuating portion of the silicon chip layer.

10. The blood pressure measurement module according to claim 9, wherein The piezoelectric component includes: A lower electrode layer; A piezoelectric layer is stacked on the lower electrode layer; An insulating layer is laid on a partial surface of the piezoelectric layer and a partial surface of the lower electrode layer; And An upper electrode layer is stacked on the insulating layer and the remaining surface of the piezoelectric layer where the insulating layer is not provided to be electrically connected to the piezoelectric layer.

11. The blood pressure measurement module according to claim 1, having a length between 4 mm and 27 mm, a width between 2 mm and 16 mm, and a height between 1 mm and 8 mm.

12. The blood pressure measurement module according to claim 1, having a length between 24 mm and 27 mm, a width between 14 mm and 16 mm, and a height between 6 mm and 8 mm.

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