A reflux tank, a mating structure and an electroplating production line
By designing separate reflow tank structures and flow blocking parts in the electroplating production line, the problem of extrusion and crushing of the workpiece in the reflow tank is solved, the smooth transportation of the workpiece and solution circulation are achieved, and the electroplating yield and electroplating effect are improved.
Patent Information
- Application Number
- CN202110030567.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-01-11
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2041-01-11
AI Technical Summary
In the existing electroplating production lines, the workpiece is extruded in the guide roller in the reflow tank and breaks, which affects the electroplating effect and reduces the yield rate, especially on silicon wafers made of thin sheet materials.
A reflow tank structure is designed, including a first plate in the groove body that separates the inner cavity of the groove body into a first reflow chamber and a through plate channel side by side. The through plate channel penetrates the side wall of the groove body, a liquid port is provided to connect to the reflow chamber, and a flow blocker is provided in the reflow chamber to separate the branch cavity, combining the spray mechanism and the circulation mechanism to maintain the flow of the solution, reducing solution impact and bubbles.
Realize smooth conveying of workpieces in the return tank, reduce the crushing rate, improve the plating yield, and maintain the plating tank level through solution circulation to ensure the plating effect.
Smart Images

Figure CN112746305B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electroplating, and particularly relates to a reflux tank, a matching structure and an electroplating production line. Background Art
[0002] Electroplating refers to the electrolysis reaction in a solution with the help of an external direct current, so that a metal or alloy layer is deposited on the surface of a conductor. During electroplating, the anode of the electrode is electrically connected to the electroplating solution, and the cathode of the electrode is connected to the workpiece with conductivity. When the current is turned on, the positively charged cations in the solution swim towards the cathode of the circuit, are reduced on the surface of the workpiece to be processed, and form an electroplating layer covering the surface of the workpiece to be processed.
[0003] In the existing electroplating production line, in order to keep the liquid level in the electroplating tank within a certain height range, a reflux tank is arranged at the outlet or inlet of the electroplating tank. The reflux tank is hermetically connected to the electroplating tank. In order to prevent the solution in the electroplating tank from flowing into the reflux tank too fast, resulting in a rapid drop in the liquid level in the electroplating tank and not meeting the liquid level requirements of the electroplating solution, at least two relatively contacting and relatively rolling guide rollers are arranged at the inlet of the tank body of the reflux tank. Since the two relatively arranged guide rollers are in contact, the width of the solution flow channel is reduced, so that the flow rate of the solution entering the reflux tank is slowed down, and thus the drop rate of the liquid level in the electroplating tank can be slowed down.
[0004] However, the workpiece needs to pass through between the two guide rollers to enter the next process. When the workpiece passes through between the two guide rollers, it will be subjected to the squeezing force of the two guide rollers towards the workpiece, and this squeezing force will damage the workpiece, causing the workpiece to break. Especially when the electroplated workpiece is a silicon wafer, since the silicon wafer is relatively thin, when the silicon wafer enters between the two relatively arranged guide rollers, the two guide rollers will squeeze the silicon wafer, resulting in the breakage of the silicon wafer, affecting the electroplating effect of the workpiece and reducing the electroplating yield of the electroplating production line. Summary of the Invention
[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect that when electroplating a workpiece, the workpiece is squeezed by the guide rollers in the reflux tank and broken, which affects the electroplating effect of the workpiece and reduces the electroplating yield of the electroplating production line in the prior art, so as to provide a reflux tank, a matching structure and an electroplating production line.
[0006] A reflux tank, comprising: a tank body, a first plate is arranged in the tank body to divide the inner cavity of the tank body into a first reflux cavity and a plate-passing channel arranged side by side. The two ends of the plate-passing channel in its length direction penetrate through two opposite side walls of the tank body, and a first inlet and a first outlet are respectively formed on the two side walls of the tank body corresponding to the above, for the workpiece to pass through the plate-passing channel;
[0007] At least one first liquid passing port is provided on the first plate to communicate the plate passing channel with the first reflux cavity.
[0008] Optionally, in the above-mentioned reflux tank, a second plate provided in the tank body is further included. The second plate is distributed opposite to the first plate, and the plate passing channel is formed between the first plate and the second plate. A second reflux cavity is defined between the second plate and the tank body. The second reflux cavity and the first reflux cavity are arranged side by side on both sides of the plate passing channel.
[0009] At least one second liquid passing port is provided on the second plate to communicate the plate passing channel with the second reflux cavity.
[0010] Optionally, in the above-mentioned reflux tank, at least one flow blocking member is provided in the first reflux cavity and / or the second reflux cavity. The flow blocking member divides the reflux cavity where it is located into at least two branch cavities. At least two liquid passing ports are provided on the corresponding first plate or second plate of the branch cavities, and each branch cavity corresponds to at least one liquid passing port.
[0011] Optionally, in the above-mentioned reflux tank, for the liquid passing ports of two adjacent branch cavities, the liquid passing port closer to the first inlet is higher than the liquid passing port closer to the first outlet.
[0012] Optionally, in the above-mentioned reflux tank, the flow blocking member is in the shape of a plate.
[0013] Optionally, in the above-mentioned reflux tank, the plate passing channel includes a first channel located below and a second channel located above, and the width of the first channel is smaller than the width of the second channel.
[0014] Optionally, in the above-mentioned reflux tank, the bottom of the first channel and the top of the second channel are connected by a transition channel that slopes downward from top to bottom.
[0015] Optionally, in the above-mentioned reflux tank, a reflux port is provided on the side wall where the first inlet of the reflux tank is located or the side wall where the first outlet is located.
[0016] The reflux port is located below the corresponding first inlet or first outlet.
[0017] A matching structure of a reflux tank and an electroplating tank includes at least one electroplating tank having an electroplating cavity; at least one reflux tank is provided at both ends of each electroplating tank. The reflux tank is the above-mentioned reflux tank, and the plate passing channel of any one of the reflux tanks is hermetically communicated with the electroplating cavity of the electroplating tank.
[0018] Optionally, in the above-mentioned cooperating structure of the reflux tank and the electroplating tank, a spraying mechanism is further included in each of the electroplating tanks. The spraying mechanism is used to spray the solution into the corresponding tank to keep the solution in each tank in a flowing state; and a circulation mechanism with both ends connected to the electroplating cavity and the spraying mechanism.
[0019] An electroplating production line includes
[0020] At least one of the above-mentioned cooperating structures of the reflux tank and the electroplating tank; and a conveying mechanism for driving the workpiece to move vertically and horizontally to pass through the reflux tank and the electroplating tank in the cooperating structure.
[0021] Optionally, in the above-mentioned electroplating production line, a frame is further included. The frame has a loading area, at least one electroplating area, and an unloading area. At least one of the above-mentioned cooperating structures is arranged in each electroplating area;
[0022] The conveying mechanism is arranged on the frame and spans the loading area, the electroplating area, and the unloading area. The conveying mechanism is suspended above the electroplating area and is used to drive the workpiece to be electroplated to pass through the loading area, at least sequentially through the electroplating area and the unloading area vertically.
[0023] Optionally, in the above-mentioned electroplating production line, at least one processing area is further included on the frame;
[0024] The processing area is located between the loading area and the electroplating area, or the processing area is located between the electroplating area and the unloading area; or the processing area is located between two adjacent electroplating areas;
[0025] A processing structure corresponding to the processing area is further included. The processing structure includes a processing tank communicated with the reflux tank in any one of the cooperating structures.
[0026] Optionally, in the above-mentioned electroplating production line, at least one transition tank is further included. The reflux tank of any one of the cooperating structures is hermetically communicated with the processing tank of the processing structure through the transition tank for the workpiece to pass through driven by the conveying mechanism;
[0027] First communication ports and second communication ports are respectively arranged at both ends of the transition tank. The bottom of the first communication port or the second communication port close to the reflux tank is higher than the height of the reflux port of the reflux tank.
[0028] Optionally, in the above-mentioned electroplating production line, at least one of the processing areas is a cleaning area, the processing structure is a cleaning structure, and the processing tank is a cleaning tank.
[0029] Optionally, in the above-mentioned electroplating production line, at least one processing area is arranged in the electroplating area and the unloading area. The processing structure is a drying structure, and the processing tank is a drying tank.
[0030] Optionally, in the above electroplating production line, the conveying mechanism includes a driving wheel and a driven wheel, and a conveyor belt wound around the driving wheel and the driven wheel in a closed loop; and a jig fixed on the conveyor belt for clamping a workpiece.
[0031] Optionally, in the above electroplating production line, the conveying mechanism further includes a guiding member provided on the frame and horizontally extending between the loading area and the unloading area;
[0032] A first roller and a second roller are rotatably provided on the inner wall of the conveyor belt on the guiding member, and a first groove and a second groove for either the first roller and the second roller to roll in or out are provided on the outer peripheral walls of the driving wheel and the driven wheel;
[0033] The first groove and the second groove are flared arc-shaped grooves.
[0034] Optionally, in the above electroplating production line, the conveyor belt includes at least three layers of structures, which are an inner layer, a middle layer, and an outer layer stacked from the inside to the outside. The first roller and the second roller fixedly connect the three-layer structure, and the jig is located between the inner layer and the middle layer.
[0035] The technical solution of the present invention has the following advantages:
[0036] 1. A reflux tank provided by the present invention includes: a tank body, a first plate is provided in the tank body to divide the inner cavity of the tank body into a first reflux cavity and a plate-passing channel arranged side by side. The two ends of the plate-passing channel in its length direction penetrate through the opposite two side walls of the tank body, and a first inlet and a first outlet are respectively formed on the two side walls of the tank body for a workpiece to pass through the plate-passing channel; at least one first liquid-passing port is provided on the first plate to communicate the plate-passing channel with the first reflux cavity.
[0037] In the return flow tank of this structure, by arranging a first plate inside the tank body, the first plate divides the inner cavity of the tank body into a first return flow cavity and a plate-passing channel arranged side by side. Moreover, the first inlet and the first outlet of the plate-passing channel penetrate through two opposite side walls of the tank body. When the workpiece enters the plate-passing channel from the previous process, it can enter the plate-passing channel along the first inlet and output from the first outlet. During the conveying process, the workpiece can be smoothly conveyed in the plate-passing channel, overcoming the defect of the existing return flow tank. When the workpiece passes between two relatively arranged and contacting guide rollers in the return flow tank, it will be subjected to the extrusion force towards the workpiece by the two guide rollers, and this extrusion force will damage the workpiece, causing the workpiece to break. The breakage rate of the workpiece is reduced, especially for some relatively thin workpieces, such as silicon wafers, achieving the effect that the workpiece can be stably and safely conveyed from the return flow tank, reducing the problem of affecting the electroplating effect of the workpiece due to workpiece breakage, improving the electroplating yield of the electroplating production line. Moreover, during the electroplating process, the solution flowing into the plate-passing channel can also enter the first return flow cavity along the first liquid-passing port and will not stay in the plate-passing channel. At the same time, the solution in the first return flow cavity can also be recycled back to the corresponding electroplating tank, keeping the liquid level in the electroplating tank always at a certain height and enabling the solution to be recycled.
[0038] 2. In the return flow tank provided by the present invention, at least one flow-blocking member is arranged in the first return flow cavity and / or the second return flow cavity. The flow-blocking member divides the return flow cavity where it is located into at least two branch cavities. At least two liquid-passing ports are arranged on the corresponding first plate or second plate of each branch cavity, and each branch cavity corresponds to at least one liquid-passing port. In the return flow tank of this structure, by correspondingly arranging flow-blocking members in the first return flow cavity and the second return flow cavity, the flow-blocking members divide the corresponding return flow cavity into at least two branch cavities, and at least one liquid-passing port is correspondingly arranged inside each branch cavity. When the solution flows into the branch cavity from the plate-passing channel along the liquid-passing port, the solution pours into the interior of the corresponding branch cavity in a semi-parabolic shape (or waterfall shape) from the liquid-passing port. When it collides with the flow-blocking member, it is blocked by the flow-blocking member and flows down along the plate surface of the flow-blocking member. According to the principle of gravitational acceleration of an object, the instantaneous velocity of the fluid pouring into the branch cavity under the block of the flow-blocking member is less than the instantaneous velocity of directly pouring to the bottom of the corresponding return flow cavity. Therefore, when the solution pours onto the plate surface of the flow-blocking member and flows down into the corresponding branch cavity, no sputtering will occur, effectively reducing the impact force on the solution and at the same time reducing the number of bubbles generated by the solution.
[0039] 3. In the return tank provided by the present invention, the board-passing channel includes a first channel located below and a second channel located above, and the width of the first channel is smaller than the width of the second channel. In the return tank with this structure, by setting the width of the first channel smaller than that of the second channel, on the basis of ensuring that both the workpiece and the fixture can stably pass through the first channel and the second channel, setting the first channel smaller can reduce the channel width of the solution flowing into the board-passing channel along with the workpiece, and further reduce the amount of solution entering the return cavity from the board-passing channel along the liquid passing port, achieving the effect of reducing the falling speed of the solution level in the electroplating tank.
[0040] 4. The present invention provides a cooperative structure between a return tank and an electroplating tank, including at least one electroplating tank with an electroplating cavity; at least one return tank is provided at both ends of each electroplating tank, and the return tank is the return tank as described above, and the board-passing channel of any one of the return tanks is sealed and communicated with the electroplating cavity of the electroplating tank. In the cooperative structure with this structure, by sealing and communicating the electroplating cavity of the electroplating tank and the board-passing channel of the return tank, and by cooperatively arranging the return tank and the electroplating tank, the solution in the return tank can be recycled into the electroplating cavity of the electroplating tank to maintain the liquid level height in the electroplating cavity. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0042] Figure 1 It is a schematic diagram of the overall structure of the electroplating production line provided in the third embodiment of the present invention;
[0043] Figure 2 is Figure 1 a schematic diagram of the connection structure between the driving wheel and the conveyor belt in the shown conveying mechanism;
[0044] Figure 3 is Figure 2 a schematic diagram of the connection structure between the conveyor belt, the fixture and the guiding component shown;
[0045] Figure 4 is Figure 3 a schematic diagram of the overall position structure between the conveyor belt, the fixture and the guiding component shown;
[0046] Figure 5 is a schematic diagram of the connection structure between the transition tank and the return tank;
[0047] Figure 6Schematic diagram of the positional structures of the first channel and the second channel;
[0048] Figure 7 Schematic diagram of the positional structures of the flow blocking member, the first plate and the second plate in the first embodiment of the present invention;
[0049] Figure 8 is Figure 7 Schematic diagram of the positional structures of the first liquid passing port and the second liquid passing port in
[0050] Figure 9 Schematic diagram of the positional structure of the first outlet;
[0051] Figure 10 Overall structure schematic of the cooperation structure in the second embodiment of the present invention.
[0052] Explanation of reference numerals:
[0053] 1 - reflux tank; 2 - tank body; 3 - first plate; 4 - first reflux cavity; 5 - through - plate channel; 6 - first inlet; 7 - first outlet; 8 - first liquid passing port; 9 - second plate; 10 - second reflux cavity; 11 - second liquid passing port; 12 - flow blocking member; 13 - first channel; 14 - second channel; 15 - reflux port; 16 - electroplating tank; 17 - frame; 18 - loading area; 19 - electroplating area; 20 - unloading area; 22 - transition tank; 23 - first communication port; 24 - second communication port; 25 - driving wheel; 26 - driven wheel; 27 - conveyor belt; 28 - fixture; 29 - guiding member; 30 - first roller; 31 - second roller; 32 - first groove; 33 - second groove; 34 - cleaning area; 35 - drying area. Detailed embodiments
[0054] Next, the technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0055] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0056] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0057] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0058] Figures 1 to 10 An embodiment of a reflux tank, a matching structure, and an electroplating production line provided by the present invention is shown.
[0059] Embodiment 1
[0060] This embodiment records a reflux tank 1, see Figures 5 - 9 , the reflux tank 1 includes a tank body 2 and a first plate 3. The first plate 3 is arranged in the tank body 2, and divides the inner cavity of the tank body 2 into a first reflux cavity 4 and a plate passing channel 5 arranged side by side. The plate passing channel 5 penetrates through two opposite side walls of the tank body 2 at both ends along its length direction, and after the plate passing channel 5 corresponds to the two side walls of the tank body 2, a first inlet 6 and a first outlet 7 are respectively formed, so that the workpiece can pass through the plate passing channel 5. That is, the workpiece enters the plate passing channel 5 along the first inlet 6, and is conveyed in the plate passing channel 5 to the first outlet 7, completing the effect of passing through the reflux tank 1.
[0061] In the reflux tank 1 with this structure, by arranging the first plate 3 in the tank body 2, the first plate 3 divides the inner cavity of the tank body 2 into a first reflux cavity 4 and a plate passing channel 5 arranged side by side, and the first inlet 6 and the first outlet 7 of the plate passing channel 5 penetrate through two opposite side walls of the tank body 2. When the workpiece enters the plate passing channel 5 from the previous process, it can enter the plate passing channel 5 along the first inlet 6 and output from the first outlet 7 of the plate passing channel 5. During the conveying process, the workpiece can be smoothly conveyed in the plate passing channel 5, overcoming the defect of the existing reflux tank 1 that when the workpiece passes between two relatively arranged and contacting guide rollers in the reflux tank 1, it will be subjected to the extrusion force of the two guide rollers towards the workpiece, and this extrusion force will damage the workpiece and cause the workpiece to break. The breakage rate of the workpiece is reduced, especially for some relatively thin workpieces, such as silicon wafers, realizing the effect that the workpiece can be smoothly and safely conveyed in the reflux tank 1, reducing the problem that the electroplating effect of the workpiece is affected due to the breakage of the workpiece, and improving the electroplating yield of the electroplating production line.
[0062] Specifically, in order to connect the through-board channel 5 and the first reflux chamber 4 so that when the workpiece is conveyed through the feeding channel, after the workpiece brings the solution into the through-board channel 5, the solution can be recycled from the reflux tank 1 back to the corresponding electroplating tank 16. A first liquid passing port 8 is provided on the first plate 3. The number of the first liquid passing ports 8 is set to at least one, or can also be set to two. The specific number is set according to actual applications. During electroplating, the solution flowing into the through-board channel 5 can enter the first reflux chamber 4 along the first liquid passing port 8 without staying in the through-board channel 5. At the same time, the solution in the first reflux chamber 4 can also be recycled back to the corresponding electroplating tank 16, keeping the liquid level in the electroplating tank 16 always at a certain height and enabling the solution to be recycled.
[0063] In this embodiment, a second plate 9 is further provided in the tank body 2 of the reflux tank 1. The second plate 9 is arranged opposite to the first plate 3. The through-board channel 5 is formed between the first plate 3 and the second plate 9 for the workpiece to pass through the through-board channel 5 formed by the first plate 3 and the second plate 9. After the first plate 3 and the second plate 9 are arranged opposite to each other, the first inlet 6 and the first outlet 7 are respectively located at both ends of the through-board channel 5. Among them, a second reflux chamber 10 is formed between the second plate 9 and the tank body 2. The second reflux chamber 10 and the first reflux chamber 4 are arranged side by side on both sides of the through-board channel 5. A second liquid passing port 11 is provided on the second plate 9. The second liquid passing port 11 connects the through-board channel 5 and the second reflux chamber 10. During electroplating, the solution flowing into the through-board channel 5 can enter the second reflux chamber 10 along the second liquid passing port 11 without staying in the through-board channel 5. At the same time, the solution in the second reflux chamber 10 can also be recycled back to the corresponding electroplating tank 16, keeping the liquid level in the electroplating tank 16 always at a certain height and enabling the solution to be recycled. By adding the second liquid passing port 11 on the basis of the first liquid passing port 8 and using the two liquid passing ports in cooperation, the rate of the solution entering the corresponding reflux chamber can be increased.
[0064] In this embodiment, in order to prevent the solution from splashing in the first reflux chamber 4 and the second reflux chamber 10 after entering the corresponding first reflux chamber 4 and second reflux chamber 10 along the first liquid passing port 8 and the second liquid passing port 11, at least one flow-blocking member 12 can be provided in at least one of the first reflux chamber 4 and the second reflux chamber 10. The flow-blocking member 12 can divide the respective corresponding reflux chamber into at least two branch cavities. At least two liquid passing ports are provided on the first plate 3 and the second plate 9 corresponding to the branch cavities, so that there is at least one liquid passing port corresponding to each branch cavity.
[0065] See Figure 7 and Figure 8, two flow restrictors 12 can be respectively arranged corresponding to the first return cavity 4 and the second return cavity 10. The two flow restrictors 12 corresponding in the first return cavity 4 and the second return cavity 10 respectively divide the first return cavity 4 and the second return cavity 10 into three branch cavities. A first liquid passing port 8 is opened on the first plate 3 corresponding to each branch cavity, and a second liquid passing port 11 is opened on the second plate 9. Of course, two or three first liquid passing ports 8 and second liquid passing ports 11 can also be opened on the first plate 3 and the second plate 9 corresponding to each branch cavity. The number of the first liquid passing ports 8 and the second liquid passing ports 11 can be the same or different, and the specific number is set according to actual needs. The flow restrictor 12 can be arranged in a plate shape.
[0066] By correspondingly arranging the flow restrictor 12 in the first return cavity 4 and the second return cavity 10, the flow restrictor 12 divides the corresponding return cavity into at least two branch cavities. At least one liquid passing port is correspondingly arranged inside each branch cavity. When the solution flows into the branch cavity from the over-plate channel 5 along the liquid passing port, the solution pours into the interior of the corresponding branch cavity in a semi-parabolic shape (or waterfall shape) at the liquid passing port. When it collides with the flow restrictor 12, it is blocked by the flow restrictor 12 and flows down along the plate surface of the flow restrictor 12. According to the principle of the gravitational acceleration of an object, the instantaneous velocity of the fluid pouring into the branch cavity under the block of the flow restrictor 12 is less than the instantaneous velocity of directly pouring to the bottom of the corresponding return cavity. Therefore, when the solution pours onto the plate surface of the flow restrictor 12 and flows down along the plate surface into the corresponding branch cavity, sputtering will not occur, which can effectively reduce the impact force received by the solution and at the same time reduce the number of bubbles generated by the solution.
[0067] Among them, when specifically setting each liquid passing port, for the liquid passing ports of two adjacent branch cavities, the liquid passing port close to the first inlet 6 is set higher than the liquid passing port close to the first outlet 7. That is, in this embodiment, when the number of the flow restrictors 12 is two, the heights of the liquid passing ports correspondingly arranged on the first plate 3 and the second plate 9 decrease from the liquid passing port at the first inlet 6 to the liquid passing port at the first outlet 7.
[0068] In this embodiment, the above-mentioned over-plate channel 5 includes a first channel 13 located below and a second channel 14 located above. The width of the first channel 13 is set smaller than the width of the second channel 14. In the reflux groove 1 with this structure, the jig 28 passes through the second channel 14, and the workpiece passes through the first channel 13. By setting the width of the first channel 13 smaller than the width of the second channel 14, on the basis of ensuring that both the workpiece and the jig 28 can stably pass through the first channel 13 and the second channel 14, setting the first channel 13 smaller can reduce the channel width of the solution flowing into the over-plate channel 5 along with the workpiece, and further can reduce the amount of solution entering the return cavity from the over-plate channel 5 along the liquid passing port, achieving the effect of reducing the falling speed of the solution height in the electroplating tank 16.
[0069] Specifically, the bottom of the first channel 13 is connected to the top of the second channel 14 through a transition channel that slopes downward from top to bottom, and a guiding surface is provided at the position of the first channel 13 corresponding to the first inlet 6, so that the workpiece can smoothly enter the plate passing channel 5 along the guiding surface.
[0070] In this embodiment, in order to prevent the solution in the reflux tank 1 from flowing out from the first inlet 6 or the first outlet 7 and then entering the processing tank communicated with the reflux tank 1 when the workpiece enters or exits the reflux tank 1, a reflux port 15 is provided on the side wall where the first inlet 6 of the reflux tank 1 is located or on the side wall where the first outlet 7 is located. The reflux port 15 is located below the corresponding first outlet 7 or first inlet 6, and the reflux port 15 is in the shape of a long waist hole. The solution flowing out from the first inlet 6 or the first outlet 7 can flow out along the reflux port 15 and will not enter the processing tank.
[0071] Embodiment 2:
[0072] This embodiment describes a matching structure having a reflux tank 1 and a plating tank 16. The matching structure includes at least one plating tank 16 having a plating cavity. At least one reflux tank 1 is provided at both ends of each plating tank 16. The reflux tank 1 is the reflux tank 1 described in Embodiment 1. The plate passing channel 5 of the reflux tank 1 can be hermetically communicated with the plating cavity of the plating tank 16. By arranging the reflux tank 1 and the plating tank 16 in cooperation, the solution in the reflux tank 1 can be recycled to the plating cavity of the plating tank 16 to maintain the liquid level height in the plating cavity, and thus the plating effect of the workpiece in the plating tank 16 can be ensured.
[0073] See Figure 10 , the number of plating tanks 16 can be set to two, and one reflux tank 1 is provided on both sides of each plating tank 16. The plate passing channel 5 of the reflux tank 1 is hermetically communicated with the plating cavity. Among them, the feeding end of each plating tank 16 is communicated with the first outlet 7 of the reflux tank 1, and the discharging end of the plating tank 16 is communicated with the first inlet 6 of the reflux tank 1, so as to realize stable transportation of the workpiece when entering and exiting the plating tank 16.
[0074] In this embodiment, a spraying mechanism (not shown in the figure) is provided in each plating tank 16. The spraying mechanism is used to spray the solution into the respective plating tank 16 to keep the solution in each plating tank 16 in a flowing state, so as to avoid the problem of poor plating effect of the workpiece caused by the deposition of the solution. Specifically, the spraying mechanism can be a spraying pipe, and the spraying outlet of the spraying pipe is arranged facing the workpiece.
[0075] In order to enable the solution to circulate, a circulation mechanism is also connected between each electroplating chamber and the spraying mechanism. The circulation mechanism can be a delivery pipeline, and a pump body is arranged on the delivery pipeline. One end of the delivery pipeline is connected to the bottom of the electroplating chamber, and the other end is communicated with the spray pipe of the spraying mechanism. When the solution is sprayed from the spray pipe onto the workpiece and flows down along the plate surface of the workpiece into the electroplating chamber, under the action of the pump body, the solution in the electroplating chamber can enter the spray pipe of the spraying mechanism again along the delivery pipeline to spray the workpiece, enabling the solution to be in a circulating flow state and avoiding poor electroplating effect caused by solution deposition.
[0076] Specifically, a filter can also be arranged on the delivery pipeline of the circulation mechanism to filter impurities in the solution and avoid contamination of the plate surface of the workpiece by the impurities.
[0077] Embodiment 3:
[0078] This embodiment describes an electroplating production line. Refer to Figures 1 - 10 , the electroplating production line includes the matching structure of at least one reflux tank 1 and electroplating tank 16 described in Embodiment 2, and also includes a frame 17 and a conveying mechanism arranged on the frame 17. The conveying mechanism is used to drive the workpiece to move vertically and horizontally to pass through the reflux tank 1 and electroplating tank 16 in the matching structure. There is a loading area 18, an unloading area 20 and at least one electroplating area 19 located between the loading area 18 and the unloading area 20 on the frame 17. At least one matching structure is arranged in each electroplating area 19. The workpiece is loaded in the loading area 18, then enters the electroplating area 19 under the drive of the conveying mechanism for electroplating treatment, and then is output from the electroplating area 19 to the unloading area 20.
[0079] Specifically, after the above-mentioned conveying mechanism is arranged on the frame 17, it straddles the loading area 18, all electroplating areas 19 and the unloading area 20, and the conveying mechanism is suspended above the electroplating area 19 to achieve the effect of driving the workpiece to be electroplated to pass vertically through the loading area 18, at least sequentially through the electroplating areas 19 and the unloading area 20.
[0080] Among them, the above-mentioned conveying mechanism includes a driving wheel 25 and a driven wheel 26, and a conveyor belt 27 wound around the driving wheel 25 and the driven wheel 26 in a closed loop. The driving wheel 25 is connected to the output shaft of the driving motor to drive the driving wheel 25 to rotate. The inner wall surface of the conveyor belt 27 can be attached to the outer wall surfaces of the driving wheel 25 and the driven wheel 26, so as to realize that under the self-rotation drive of the driving wheel 25 and the driven wheel 26, the conveyor belt 27 can perform reciprocating conveying motion. A fixture 28 is also fixed on the conveyor belt 27 for clamping the workpiece. After the workpiece is clamped on the fixture 28, the conveyor belt 27 performs reciprocating conveying motion between the driving wheel 25 and the driven wheel 26, driving the fixture 28 to move between the loading area 18, all the electroplating areas 19, and the unloading area 20, thereby realizing the effect of being able to convey the workpiece between the loading area 18, all the electroplating areas 19, and the unloading area 20.
[0081] Specifically, the distance between the driven wheel 26 and the driving wheel 25 can be adjusted to achieve the effect of adjusting the tension of the conveyor belt 27. The driven wheel 26 can be adjusted on the frame 17 to achieve the effect of adjusting the distance between the driving wheel 25 and the driven wheel 26. For example, a hydraulic telescopic rod is connected to the driven wheel 26. The telescopic end of the telescopic rod can be abutted against the frame 17 after extending, and the fixed end is fixed to the driven wheel 26. During the reciprocating telescoping process of the telescopic section of the telescopic rod, the distance between the driven wheel 26 and the driving wheel 25 can be adjusted.
[0082] In this embodiment, the above-mentioned conveying mechanism further includes a guiding member 29. The guiding member 29 is arranged on the frame 17 and horizontally extends between the loading area 18 and the unloading area 20. The guiding member 29 can be a guiding plate, which is vertically arranged between the loading area 18 and the unloading area 20. On the inner wall of the above-mentioned conveyor belt 27, a first roller 30 and a second roller 31 that can roll on the guiding member 29 are provided. That is, the first roller 30 and the second roller 31 are carried on the upper and lower sides of the guiding plate. When the conveyor belt 27 performs conveying motion between the loading area 18 and the unloading area 20, the first roller 30 and the second roller 31 also move along the guiding plate, avoiding the situation that the overall structure is skewed when the conveyor belt 27 carries the fixture 28 and the workpiece and moves.
[0083] Specifically, referring to Figure 2 , a first groove 32 and a second groove 33 for any one of the first roller 30 and the second roller 31 to roll in or out can also be provided on the outer peripheral walls of the driving wheel 25 and the driven wheel 26. The first groove 32 and the second groove 33 are flared arc-shaped grooves. When the first roller 30 and the second roller 31 on the conveyor belt 27 turn when moving to the loading area 18 and the unloading area 20, a smooth turning transition can be performed. The first roller 30 is correspondingly arranged with the first groove 32, and the second roller 31 is correspondingly arranged with the second groove 33.
[0084] On the frame 17 between the loading area 18 and the unloading area 20, at least two oppositely distributed guiding blocks are further provided. A guiding channel is formed between the two guiding blocks for the conveyor belt 27 to be conveyed along the guiding channel, playing a guiding role.
[0085] When the conveyor belt 27 is specifically arranged, it can be arranged as at least a three-layer structure. When it is a three-layer structure, the conveyor belt 27 is an inner layer, a middle layer, and an outer layer stacked from the inside to the outside. Among them, the first roller 30 and the second roller 31 can be used to fixedly connect the three-layer structure, and then the fixture 28 is arranged between the inner layer and the middle layer. Of course, the conveyor belt 27 with a three-layer structure can also be fixedly connected by fasteners.
[0086] In this embodiment, at least one processing area is further provided on the frame 17. This processing area is used to clean, dry, or perform other processing on the workpiece. Cleaning realizes removing the electroplating solution remaining on the workpiece, and then entering the next process to ensure the cleanliness of the workpiece surface. When specifically arranged, at least one processing area can be arranged between the loading area 18 and the electroplating area 19, or at least one processing area can be arranged between the electroplating area 19 and the unloading area 20, or at least one processing area can be arranged between two adjacent electroplating areas 19. A processing structure is correspondingly arranged in each processing area. This processing structure includes a processing tank communicated with the return tank 1 in any one of the matching structures.
[0087] See Figure 1 , at least one of the above-mentioned processing areas is set as a cleaning area 34, that is, the processing structure is a cleaning structure, the processing tank is a cleaning tank, and this cleaning structure is a cleaning pipe. The cleaning pipe is communicated with an external water source. Among them, one cleaning area 34 can be arranged to communicate with the feeding end of the electroplating tank 16 between the loading area 18, and the cleaning tank is communicated with the first inlet 6 of the return tank 1, which is used to pre-clean the workpiece that has not entered the electroplating tank 16 to remove the dust on the workpiece; it can also be communicated with the return tank 1 connected to the discharging end of the electroplating tank 16, and this cleaning tank is communicated with the first outlet 7 of the return tank 1, which can powerfully clean the workpiece output from the electroplating tank 16 to remove the electroplating solution remaining on the workpiece surface.
[0088] See Figure 1 , when two electroplating tanks 16 are provided, one cleaning area 34 can be arranged in the two return tanks 1 between the two electroplating tanks 16. One end of the cleaning tank of the cleaning mechanism in this cleaning area 34 is respectively communicated with the first outlet 7 of one return tank 1, and the other end of the cleaning tank is communicated with the first inlet 6 of the other return tank 1. When the workpiece is output from different electroplating tanks 16, the solution of the previous electroplating tank 16 remaining on the workpiece can be rinsed off, avoiding the mixing of electroplating solutions in different electroplating tanks 16 on the surface of the same workpiece and affecting the electroplating effect.
[0089] Of course, in this embodiment, referring to Figure 1 , at least one treatment area may also be provided in the electroplating area 19 and the blanking area 20. The treatment area is a drying area 35, and the treatment structure in the drying area 35 is a drying structure. The treatment tank is set as a drying tank, and the drying tank can be communicated with the discharge end of the cleaning area 34 provided between the electroplating area 19 and the blanking area 20, so as to dry the workpieces output from the cleaning area 34. The drying can be carried out by air drying or by using hot air to dry the solution on the workpieces.
[0090] In the electroplating production line of this embodiment, referring to Figure 1 and Figure 5 , it further includes at least one transition tank 22. The reflux tank 1 of any mating structure is hermetically communicated with the treatment tank of the treatment structure through the transition tank 22, so that the workpiece can pass through the treatment tank, the reflux tank 1 and the transition tank 22 driven by the conveying mechanism. The two ends of the transition tank 22 are respectively provided with a first communication port 23 and a second communication port 24. The bottom of the first communication port 23 or the second communication port 24 close to the reflux tank 1 is higher than the height of the reflux port 15 of the reflux tank 1, so that when the solution flows from one end of the reflux tank 1 to one side of the treatment tank, the solution can flow out from the reflux port 15 of the transition tank 22, and it is avoided that the solution enters the treatment tank along the transition tank 22 and mixes with the liquid in the treatment tank, resulting in the situation of polluting the liquid.
[0091] Obviously, the above embodiments are only examples given for clear illustration, and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the present invention.
Claims
1. A reflux tank, characterized in that, Comprising: A tank body (2), within which a first plate (3) is provided to divide the inner cavity of the tank body (2) into a first return cavity (4) and an over-plate channel (5) arranged side by side. The two ends of the over-plate channel (5) in its length direction penetrate through two opposite side walls of the tank body (2), and a first inlet (6) and a first outlet (7) are respectively formed on the two side walls of the tank body (2) corresponding thereto, for a workpiece to pass through the over-plate channel (5); At least one first liquid passing port (8) is provided on the first plate (3) to communicate the over-plate channel (5) with the first return cavity (4); It further includes a second plate (9) provided within the tank body (2). The second plate (9) is distributed opposite to the first plate (3). The over-plate channel (5) is formed between the first plate (3) and the second plate (9). A second return cavity (10) is formed between the second plate (9) and the tank body (2). The second return cavity (10) and the first return cavity (4) are arranged side by side on both sides of the over-plate channel (5); At least one second liquid passing port (11) is provided on the second plate (9) to communicate the over-plate channel (5) with the second return cavity (10); The over-plate channel (5) includes a first channel (13) located below and a second channel (14) located above. The width of the first channel (13) is smaller than the width of the second channel (14); A return port (15) is provided on the side wall where the first inlet (6) of the return tank (1) is located or on the side wall where the first outlet (7) is located; The return port (15) is located below the respective corresponding first inlet (6) or first outlet (7).
2. The return tank according to claim 1, characterized in that At least one flow blocking member (12) is provided in the first return cavity (4) and / or the second return cavity (10). The flow blocking member (12) divides the return cavity where it is located into at least two branch cavities. At least two liquid passing ports are provided on the first plate (3) or the second plate (9) corresponding to the branch cavities, and each branch cavity corresponds to at least one liquid passing port.
3. The reflux tank according to claim 2, wherein For the liquid passing ports of two adjacent branch cavities, the liquid passing port closer to the first inlet (6) is higher than the liquid passing port closer to the first outlet (7).
4. The reflux tank according to claim 2 or 3, characterized in that, The flow blocking member (12) is in the shape of a plate.
5. The reflux tank according to claim 1, characterized in that, The bottom of the first channel (13) and the top of the second channel (14) are connected by a transition channel that slopes downward from top to bottom.
6. A matching structure between a reflux tank and an electroplating tank, characterized in that Comprising At least one electroplating tank (16), having an electroplating cavity; At least one return tank (1) is provided at both ends of each electroplating tank (16). The return tank (1) is the return tank (1) according to any one of claims 1-5. The over-plate channel (5) of any one of the return tanks (1) is hermetically communicated with the electroplating cavity of the electroplating tank (16).
7. The mating structure of the reflux tank and the electroplating tank according to claim 6, characterized in that, It further includes a spraying mechanism provided in each electroplating tank (16). The spraying mechanism is used to spray a solution into the corresponding tank to make the solution in each tank in a flowing state; and a circulation mechanism connected to the electroplating cavity and the spraying mechanism at both ends.
8. An electroplating production line, characterized in that, Comprising The matching structure of the reflux tank and the electroplating tank according to at least one of claims 6 or 7; and A conveying mechanism for driving a workpiece to move vertically and horizontally to pass through the reflux tank (1) and the electroplating tank (16) in the matching structure.
9. The electroplating production line according to claim 8, wherein, It further includes a frame (17), and the frame (17) is provided with a loading area (18), at least one electroplating area (19) and an unloading area (20), and at least one of the matching structures is arranged in each electroplating area (19); The conveying mechanism is arranged on the frame (17) and straddles the loading area (18), the electroplating area (19) and the unloading area (20). The conveying mechanism is suspended above the electroplating area (19) and is used for driving the workpiece to be electroplated to pass vertically through the loading area (18), at least sequentially through the electroplating area (19) and the unloading area (20).
10. The electroplating production line according to claim 9, characterized in that, The frame (17) is further provided with at least one processing area; The processing area is located between the loading area (18) and the electroplating area (19), or the processing area is located between the electroplating area (19) and the unloading area (20); or the processing area is located between two adjacent electroplating areas (19); It further includes a processing structure correspondingly arranged in the processing area, and the processing structure includes a processing tank communicated with the reflux tank (1) in any one of the matching structures.
11. The electroplating production line according to claim 10, wherein, It further includes at least one transition tank (22), and the reflux tank (1) of any one of the matching structures is hermetically communicated with the processing tank of the processing structure through the transition tank (22) for the workpiece to pass through driven by the conveying mechanism; Both ends of the transition tank (22) are respectively provided with a first communication port (23) and a second communication port (24), and the bottom of the first communication port (23) or the second communication port (24) close to the reflux tank (1) is higher than the height of the reflux port (15) of the reflux tank (1).
12. The electroplating production line according to claim 10 or 11, characterized in that, At least one of the processing areas is a cleaning area (34), the processing structure is a cleaning structure, and the processing tank is a cleaning tank.
13. The electroplating production line according to any one of claims 9-11, characterized in that, At least one processing area is arranged in the electroplating area (19) and the unloading area (20), the processing structure is a drying structure, and the processing tank is a drying tank.
14. The electroplating production line according to any one of claims 9-11, characterized in that, The conveying mechanism includes a driving wheel (25) and a driven wheel (26), and a conveyor belt (27) wound in a closed loop around the driving wheel (25) and the driven wheel (26); and a jig (28) fixed on the conveyor belt (27), and the jig (28) is used for clamping the workpiece.
15. The electroplating production line according to claim 14, characterized in that, The conveying mechanism further includes a guiding member (29) arranged on the frame (17) and horizontally extending between the loading area (18) and the unloading area (20); On the inner wall of the conveyor belt (27), a first roller (30) and a second roller (31) are arranged to roll on the guiding member (29), and on the outer peripheral walls of the driving wheel (25) and the driven wheel (26), a first groove (32) and a second groove (33) are provided for any one of the first roller (30) and the second roller (31) to roll in or out; The first groove (32) and the second groove (33) are flared arc-shaped grooves.
16. The electroplating production line according to claim 15, characterized in that, The conveyor belt (27) includes at least three layers of structure, namely an inner layer, a middle layer, and an outer layer stacked from the inside out. The first roller (30) and the second roller (31) fixedly connect the three-layer structure, and the jig (28) is located between the inner layer and the middle layer.
Citation Information
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