induction cooker
By forming a boss on the bottom shell of the induction cooker and setting air inlet holes on the side walls, the problem of poor heat dissipation of circuit board components is solved, the heat dissipation effect is improved, the service life is extended and the appearance is enhanced.
Patent Information
- Application Number
- CN201911265535.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-10-29
- Filing Date
- 2019-12-11
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2039-12-11
AI Technical Summary
In existing induction cookers, the heat dissipation effect of circuit board components is poor, resulting in excessive temperature rise of electronic components, which may lead to malfunction or damage, affecting the normal use of the induction cooker.
By forming a first boss on the bottom shell, the bottom wall of the circuit board assembly protrudes downward and approaching the heat dissipation fan, the air inlet space is increased and the air volume of the cooling air is increased; at the same time, an air inlet hole is provided on the side wall , avoid the entry of water on the table area; optional options include setting the first barrier rib and the second barrier rib to guide the wind and enhance the heat dissipation effect.
It improves the heat dissipation effect of circuit board components, extends the service life of electronic devices, avoids unsafe accidents, enhances the appearance aesthetics of the induction cooker, and reduces production costs.
Smart Images

Figure CN112747343B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of household appliances, and in particular to an induction cooker. Background Art
[0002] Induction cookers have the advantages of fast heating, no open flame, no smoke and dust, safety and convenience, and are increasingly favored and recognized by consumers.
[0003] The induction cooker mainly includes: a bottom shell, a panel located on the bottom shell, a coil disk located in the inner cavity of the bottom shell, a circuit board assembly and a heat dissipation fan; wherein the coil disk and the circuit board assembly are heating elements, and the heat dissipation fan is used to dissipate heat for the heating elements. The bottom shell is provided with air inlet and air outlet. When the induction cooker is working, the cooling air outside the induction cooker enters the bottom shell from the air inlet on the bottom shell under the action of the heat dissipation fan, takes away the heat of the heating elements such as the coil disk and the circuit board assembly, and then the hot air is blown out from the air outlet of the bottom shell to the outside of the induction cooker, thereby achieving the heat dissipation of the induction cooker.
[0004] However, in the induction cooker of the prior art, the amount of cooling air blown to the circuit board assembly is small, while the heat generated by the circuit board assembly is large, resulting in the heat on the circuit board assembly cannot be dissipated in time, which in turn causes the electronic components on the circuit board assembly to overheat and malfunction or be damaged, affecting the normal use of the induction cooker. Summary of the invention
[0005] In order to solve at least one of the problems mentioned in the background technology, the present invention provides an induction cooker capable of improving the heat dissipation effect of a circuit board assembly.
[0006] In order to achieve the above-mentioned purpose, the present invention provides an induction cooker, comprising a bottom shell and a coil disk, a circuit board assembly and a heat dissipation fan located in the bottom shell; the bottom shell is provided with an air inlet hole and an air outlet hole, and the bottom wall of the bottom shell corresponding to at least part of the circuit board assembly protrudes toward the bottom of the bottom shell to form a first boss, and the first boss is arranged close to the heat dissipation fan.
[0007] The induction cooker of the present invention forms a first boss by making the bottom wall of the bottom shell corresponding to at least a part of the circuit board assembly protrude toward the bottom of the bottom shell, and the first boss is arranged close to the heat dissipation fan, that is, the bottom wall of the bottom shell below the circuit board assembly is sunken at least at a position close to the heat dissipation fan, thereby increasing the space below the circuit board assembly, that is, increasing the air inlet space at the circuit board assembly, making the amount of cooling air entering the circuit board assembly larger, thereby improving the heat dissipation effect of the circuit board assembly and ensuring the normal use of the induction cooker; moreover, by arranging the first boss, the appearance of the induction cooker is made more unique and beautiful.
[0008] Optionally, the sinking height of the first boss ranges from 2 mm to 10 mm.
[0009] By setting the sinking height of the first boss within this range, not only the air inlet space at the bottom of the circuit board assembly is increased, and the air inlet volume is increased, but also the situation where the bottom shell is too thick can be avoided, so that the induction cooker can be developed to be thinner.
[0010] Optionally, the air inlet hole is opened on the side wall of the bottom shell.
[0011] By opening the air inlet hole on the side wall of the bottom shell, the distance between the air inlet hole and the desktop is higher than the bottom wall of the bottom shell, which can to a certain extent prevent the accumulated water on the desktop from being sucked into the bottom shell when the induction cooker is working, thereby extending the service life of the electronic components in the induction cooker and avoiding the occurrence of unsafe accidents.
[0012] Optionally, the bottom surface of the first boss is an inclined surface, and the inclined surface is inclined upward in a direction from a side close to the heat dissipation fan to a side away from the heat dissipation fan.
[0013] This makes the entrance space of the air inlet space below the circuit board assembly larger, which is more conducive to air intake and allows the wind to enter the bottom of the circuit board assembly more smoothly, that is, more cooling air reaches the circuit board assembly, further improving the heat dissipation effect of the circuit board assembly.
[0014] Optionally, the first boss is formed by a position of the bottom wall of the bottom shell corresponding to the entire circuit board assembly protruding toward the bottom of the bottom shell.
[0015] In this way, the bottom wall of the bottom shell corresponding to the bottom of the entire circuit board assembly sinks, thereby further increasing the space below the circuit board assembly and further improving the heat dissipation effect of the circuit board assembly.
[0016] Optionally, the first boss includes a bottom wall and a side wall, and the side wall of the first boss is an inclined surface.
[0017] By setting the side wall of the first boss as an inclined surface, the area of the air inlet space surrounded by the first boss can be further increased, that is, the air inlet space of the circuit board assembly is further increased, thereby further improving the heat dissipation effect of the circuit board assembly; and, by setting the side wall of the first boss as an inclined surface, the aesthetic appearance of the induction cooker is improved.
[0018] Optionally, a width of a projection of a side wall of the first boss on the bottom wall of the bottom shell is in a range of 1 mm to 5 mm.
[0019] In this way, the structural strength of the entire structure can be ensured on the basis of increasing the air inlet space of the circuit board assembly.
[0020] Optionally, an angle between the side wall of the first boss and the bottom wall of the bottom shell is an obtuse angle.
[0021] This can further increase the air inlet space of the circuit board assembly, make it easier to manufacture, and ensure the structural strength of the first boss.
[0022] Optionally, the circuit board assembly includes a power board, and a bottom wall of the bottom shell corresponding to at least a portion of the power board protrudes toward the bottom of the bottom shell to form the first boss.
[0023] Since the power board generates a large amount of heat, the above arrangement can increase the air inlet space corresponding to the power board, further improving the heat dissipation effect of the power board.
[0024] Optionally, a first retaining rib is provided between the coil disk and the heat dissipation fan;
[0025] The first barrier rib extends between the coil disk and the circuit board assembly.
[0026] By arranging the first barrier rib between the coil disk and the heat dissipation fan, the wind-generating effect of the heat dissipation fan is improved, and the cooling wind can flow along a preset path; by extending the first barrier rib between the coil disk and the circuit board assembly, the heat radiation between the coil disk and the circuit board assembly can be reduced to a certain extent, avoiding the heat from both affecting each other, and further ensuring that the circuit board assembly can obtain sufficient cooling airflow, further improving the heat dissipation effect.
[0027] Optionally, a second retaining rib is further provided between the heat dissipation fan and the circuit board assembly;
[0028] One end of the second retaining rib is connected to the first retaining rib, or one end of the second retaining rib is arranged close to the first retaining rib;
[0029] The other end of the second blocking rib extends in a direction away from the heat dissipation fan, and an angle is formed between the second blocking rib and the first blocking rib.
[0030] The wind blowing toward the circuit board assembly is further gathered and guided by the second baffle ribs, so that the wind volume and wind speed blowing toward the circuit board assembly are larger, and the heat dissipation effect of the circuit board assembly is further improved.
[0031] Optionally, the angle between the second retaining rib and the first retaining rib ranges from 5° to 90°.
[0032] Optionally, the angle between the second retaining rib and the first retaining rib ranges from 10° to 30°.
[0033] By setting the included angle between the second barrier rib and the first barrier rib within the above range, the wind gathering and guiding effects of the second barrier rib are improved.
[0034] Optionally, a length of the second retaining rib along an extension direction of the second retaining rib ranges from 5 mm to 30 mm.
[0035] By setting the length of the second baffle within this range, the wind gathering and guiding effects are ensured without causing excessive waste of consumables.
[0036] Optionally, the lower surface of the heat dissipation fan is formed as an air inlet surface, and the upper surface of the heat dissipation fan is formed as an air outlet surface.
[0037] That is, the bottom of the heat dissipation fan is formed as an air inlet area, so that the cooling air entering from the air inlet hole enters the bottom of the heat dissipation fan, and then after being pressurized by the heat dissipation fan, it is blown out from the top of the heat dissipation fan to the heating elements such as the coil disk and the circuit board assembly to dissipate heat for the heating elements. In other words, the heat dissipation fan is an axial flow fan, which reduces the production cost of the induction cooker while ensuring normal heat dissipation.
[0038] Optionally, a position of the bottom wall of the bottom shell corresponding to the heat dissipation fan protrudes toward the bottom of the bottom shell to form a second boss.
[0039] A second boss is formed by sinking the position of the bottom wall corresponding to the heat dissipation fan, thereby increasing the distance between the air inlet surface of the heat dissipation fan and the bottom wall of the bottom shell, thereby further increasing the area of the air inlet region, making the air volume reaching the air inlet surface of the heat dissipation fan larger, and further making the air volume blowing toward the coil disk and circuit board assembly larger, thereby improving the heat dissipation effect.
[0040] Optionally, the second boss is connected to the first boss.
[0041] By connecting the second boss to the first boss, the air volume blowing toward the circuit board assembly is further increased, thereby further improving the heat dissipation effect of the circuit board assembly.
[0042] Optionally, the first boss extends toward the bottom of the heat dissipation fan, so that a position of the bottom wall of the bottom shell corresponding to the heat dissipation fan is formed as the second boss.
[0043] This can further improve the smoothness of the airflow, increase the amount of air entering under the circuit board assembly, and improve the aesthetic appearance of the induction cooker, making it more convenient to manufacture.
[0044] Optionally, the sinking height of the first boss is consistent with the sinking height of the second boss.
[0045] This not only increases the space size of the entire air inlet area, making the air flow more uniform, but also improves the appearance of the induction cooker.
[0046] Optionally, the bottom shell has a first side wall and a second side wall that are arranged opposite to each other, the circuit board assembly is arranged close to the first side wall, and the heat dissipation fan is arranged close to the second side wall;
[0047] The first boss extends to the first side wall; and / or the first boss extends to the second side wall.
[0048] In this way, the area of the first boss can be further increased, thereby further improving the heat dissipation effect.
[0049] Optionally, when the first boss extends to the first side wall, a portion of the first side wall protrudes toward the bottom of the bottom shell to form a third boss, and the third boss is connected to the first boss;
[0050] When the first boss extends to the second side wall, a portion of the second side wall protrudes toward the bottom of the bottom shell to form a fourth boss, and the fourth boss is connected to the first boss.
[0051] This arrangement can further increase the area of the air inlet region, improve the smoothness of the air flow, and further improve the heat dissipation effect of the induction cooker.
[0052] Optionally, an air storage area connected to a fan cavity of the heat dissipation fan is provided between the air inlet hole and the heat dissipation fan;
[0053] The position of the bottom wall of the bottom shell corresponding to at least a portion of the air storage area protrudes toward the bottom of the bottom shell to form a fifth boss.
[0054] By setting up an air storage area, the cooling air entering from the air inlet is stored and guided through the air storage area, thereby increasing the air volume and speed of the cooling air entering the fan chamber of the heat dissipation fan; by forming a fifth boss at the corresponding position of the air storage area, the existence of the fifth boss increases the area of the air storage area, further increasing the air volume of the cooling air entering the air storage area, thereby further improving the heat dissipation effect.
[0055] Optionally, the bottom shell has a first side wall, a second side wall and a third side wall, the first side wall and the second side wall are arranged opposite to each other, the third side wall is connected between the first side wall and the second side wall, the circuit board assembly is arranged near the first side wall, and the heat dissipation fan is arranged near the connection between the second side wall and the third side wall;
[0056] The air inlet holes are provided on the second side wall and the third side wall, and the air storage area includes a first air storage area between the air inlet hole on the third side wall and the heat dissipation fan and a second air storage area between the air inlet hole on the second side wall and the heat dissipation fan.
[0057] By setting the first air storage area and the second air storage area, the cooling air outside the induction cooker can enter from the air inlet hole on the second side wall and the air inlet hole on the third side wall respectively, that is, the air inlet duct is increased, so that the cooling air outside the induction cooker can enter the first air storage area and the second air storage area respectively, the cooling air is gathered and guided by the first air storage area and the second air storage area, and then the cooling air enters the fan cavity of the heat dissipation fan, thereby further increasing the air volume and wind speed of the cooling air entering the fan cavity of the heat dissipation fan, and further improving the heat dissipation effect of the induction cooker.
[0058] Optionally, a position of at least a portion of the bottom wall of the bottom shell corresponding to the second air storage area protrudes toward the bottom of the bottom shell to form at least a portion of the fifth boss.
[0059] And / or, the circuit board assembly includes a light board, and the light board is located in the first air storage area.
[0060] By making at least part of the bottom wall of the second air storage area bulge downward to form a fifth boss, the space of the second air storage area is increased, that is, the air inlet space is increased, thereby increasing the amount of air blowing toward the circuit board assembly and the coil disk.
[0061] Optionally, the bottom wall of the bottom shell protrudes toward the bottom of the bottom shell corresponding to the position of the heat dissipation fan to form a second boss.
[0062] The second boss extends toward the second side wall to form at least a portion of the fifth boss.
[0063] In this way, the second boss is directly connected to the fifth boss, which increases the space of the entire air inlet area, so that the cooling air in the air storage area can enter the fan cavity of the heat dissipation fan more smoothly, further increasing the air volume and wind speed of the cooling air entering the fan cavity of the heat dissipation fan, and making it more convenient to manufacture.
[0064] Optionally, the first air storage area and the second air storage area are connected.
[0065] In this arrangement, if one of the first air storage area and the second air storage area is accidentally blocked, cooling air will enter from the other of the first air storage area and flow to the fan cavity of the heat dissipation fan, ensuring normal heat dissipation of the induction cooker.
[0066] Optionally, the third side wall is a front side wall facing the user.
[0067] When the air inlet is opened on the third side wall, since the third side wall faces the user, the user can intuitively and conveniently see the air inlet, and can easily see whether the air inlet is blocked, and can then clean the air inlet in time to avoid air intake being affected. In addition, when the air inlet is opened on the third side wall, the distance between the air inlet and the desktop is higher than the position of the bottom wall of the bottom shell, thereby preventing the accumulated water on the desktop from being sucked into the bottom shell when the induction cooker is working.
[0068] Optionally, the bottom shell is provided with wind shielding ribs, the wind shielding ribs include first wind shielding ribs provided between the first air storage area and the fan cavity of the heat dissipation fan, and a first vent is formed between the first wind shielding rib and the inner bottom wall of the bottom shell;
[0069] And / or, the wind shielding rib includes a second wind shielding rib arranged between the second air storage area and the fan cavity of the heat dissipation fan, and a second ventilation opening is formed between the second wind shielding rib and the inner bottom wall of the bottom shell.
[0070] By arranging wind shielding ribs, the cooling air entering into the fan cavity of the heat dissipation fan can be prevented from being blown back to the air storage area. At the same time, the first vent and the second vent are arranged on the wind shielding ribs, so that the cooling air in the first air storage area can smoothly enter the heat dissipation fan through the first vent, and the cooling air in the second air storage area can smoothly enter the heat dissipation fan through the second vent, thereby ensuring the air volume blowing to the heating element, making effective use of the cooling air, and further improving the heat dissipation effect.
[0071] Optionally, a position of the bottom wall of the bottom shell corresponding to the coil disk protrudes toward the bottom of the bottom shell to form a sixth boss.
[0072] This arrangement increases the air inlet space at the corresponding position of the coil disk, that is, increases the air volume entering the bottom of the coil disk, and improves the heat dissipation efficiency of the coil disk.
[0073] The construction of the present invention as well as other objects and advantageous effects thereof will become more apparent through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0074] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0075] Figure 1 An exploded structural diagram of an induction cooker provided by an embodiment of the present invention;
[0076] Figure 2A top view of the internal structure of an induction cooker provided by an embodiment of the present invention;
[0077] Figure 3 for Figure 2 The corresponding structural diagram after removing the light board;
[0078] Figure 4 A top view of the bottom shell of an induction cooker provided by an embodiment of the present invention;
[0079] Figure 5 A three-dimensional structure of a bottom shell of an induction cooker provided by an embodiment of the present invention Figure 1 ;
[0080] Figure 6 A three-dimensional structure of a bottom shell of an induction cooker provided by an embodiment of the present invention Figure 2 ;
[0081] Figure 7 A schematic structural diagram of a bottom shell of an induction cooker provided by an embodiment of the present invention in which a coil disk and a circuit board assembly are arranged;
[0082] Figure 8 for Figure 7 The corresponding partial cross-sectional view;
[0083] Fig. 9 for Figure 8 Corresponding side view.
[0084] Description of reference numerals:
[0085] 1—bottom shell;
[0086] 11—Upper cover;
[0087] 12—lower cover;
[0088] 10—Bottom wall;
[0089] 101—the first wind storage area;
[0090] 102—Second wind storage area;
[0091] 121 — third side wall;
[0092] 122 —second side wall;
[0093] 123 —first side wall;
[0094] 110—air inlet;
[0095] 120—air outlet;
[0096] 13—first boss;
[0097] 131—side wall;
[0098] 132—Bottom wall;
[0099] 14—second boss;
[0100] 16—third boss;
[0101] 17—fourth boss;
[0102] 15—fifth boss;
[0103] 2—coil disk;
[0104] 31—Light board;
[0105] 32—circuit board assembly;
[0106] 4—Cooling fan;
[0107] 51 - first rib;
[0108] 52—second rib;
[0109] 61 - partition;
[0110] 62—first wind rib;
[0111] 63—second wind rib;
[0112] 601—first vent;
[0113] 602—second vent;
[0114] a—angle. DETAILED DESCRIPTION
[0115] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0116] Figure 1 An exploded structural diagram of an induction cooker provided by an embodiment of the present invention; Figure 2 A top view of the internal structure of an induction cooker provided by an embodiment of the present invention; Figure 3 for Figure 2 The corresponding structural diagram after removing the light board; Figure 4 A top view of the bottom shell of an induction cooker provided by an embodiment of the present invention; Figure 5 A three-dimensional structure of a bottom shell of an induction cooker provided by an embodiment of the present invention Figure 1 ; Figure 6A three-dimensional structure of a bottom shell of an induction cooker provided by an embodiment of the present invention Figure 2 ; Figure 7 A schematic structural diagram of a bottom shell of an induction cooker provided by an embodiment of the present invention in which a coil disk and a circuit board assembly are arranged; Figure 8 for Figure 7 The corresponding partial cross-sectional view; Fig. 9 for Figure 8 Corresponding side view. Figures 1 to 9 As shown, this embodiment provides an induction cooker.
[0117] The induction cooker may specifically include: a bottom shell 1, a panel (not shown) covering the bottom shell 1, a coil disk 2 located in the bottom shell 1, a circuit board assembly 32, and a heat dissipation fan 4. The panel may be a ceramic panel or a glass panel, and the present invention does not limit the material of the panel.
[0118] The coil disk 2 may specifically include a coil disk frame and a coil wound on the coil disk frame, and the coil is electrically connected to the circuit board assembly 32. When the induction cooker is working, the coil disk 2 and the circuit board assembly 32 are the main heating elements, and the heat dissipation fan 4 is used to dissipate heat for the heating elements such as the coil disk 2 and the circuit board assembly 32. When using the induction cooker for cooking, a pot containing food is placed on the panel of the induction cooker, and the induction cooker is powered on, that is, a high-frequency current will flow through the coil on the coil disk 2, and the generated magnetic lines of force will cut the pot, thereby forming countless small eddy currents on the bottom surface of the pot, thereby heating the pot.
[0119] Among them, the bottom shell 1 is provided with an air inlet 110 and an air outlet 120. It can be understood that the air inlet 110 and the air outlet 120 are both connected to the outside. When the induction cooker is working, the cooling air outside the induction cooker enters the bottom shell 1 from the air inlet 110 under the action of the heat dissipation fan 4. After being pressurized by the heat dissipation fan, part of the cooling air is blown to the coil disk 2, and part of the cooling air is blown to the circuit board assembly 32, etc., to take away the heat of the heating elements such as the coil disk 2 and the circuit board assembly 32, and then the hot air is blown out from the air outlet 120, thereby realizing the heat dissipation of the induction cooker. Specifically, the coil disk 2, the circuit board assembly 32 and the heat dissipation fan 4 can be arranged in a triangle as a whole.
[0120] When the induction cooker is working, the circuit board assembly 32 generates a lot of heat, especially the IGBT, bridge stack and other electronic components with high heat generation on the circuit board assembly 32. If the heat cannot be dissipated in time, the electronic components of the circuit board assembly 32 will be overheated and fail or be damaged. Based on this, in this embodiment, the bottom wall of the bottom shell 1 corresponding to at least part of the circuit board assembly 32 protrudes toward the bottom of the bottom shell 1 to form a first boss 13, and the first boss 13 is arranged close to the heat dissipation fan 4.
[0121] That is to say, at least the portion of the bottom wall of the bottom shell below the circuit board assembly 32 close to the heat dissipation fan 4 sinks. From the inside of the bottom shell 1, the position sinks to form a concave cavity, and from the outside of the bottom shell 1, the position sinks to form a convex boss.
[0122] It should be noted here that the bottom wall of the bottom shell 1 corresponding to at least part of the circuit board assembly 32 sinks to form the first boss 13. It can be understood that the bottom wall of the bottom shell corresponding to the entire circuit board assembly 32 may sink as a whole to form the first boss 13, or only the bottom wall of the bottom shell corresponding to the part of the circuit board assembly 32 close to the heat dissipation fan 4 may sink to form the first boss 13, or the bottom wall of the bottom shell corresponding to the part of the circuit board assembly 32 close to the heat dissipation fan 4 and the bottom wall of the bottom shell near the part may sink together to form the first boss 13. This arrangement increases the space between the circuit board assembly 32 and the bottom wall of the bottom shell. That is, the air inlet space at the circuit board assembly 32 is increased, so that the cooling air pressurized by the heat dissipation fan 4 can enter more below the circuit board assembly 32 to take away the heat of the circuit board assembly 32, thereby improving the heat dissipation effect of the circuit board assembly 32.
[0123] The bottom shell 1 may specifically include a lower cover 12 and an upper cover 11 located above the lower cover 12. In this embodiment, the lower cover 12 is specifically a cavity structure, the upper cover 11 is a frame-shaped cover, the bottom wall of the lower cover 12 is formed as the bottom wall of the bottom shell 1, and the side wall of the lower cover 12 is formed as at least part of the side wall of the bottom shell 1. In other implementations, the lower cover 12 may specifically include a lower cover body and a middle cover body, the middle cover body is arranged around the outer periphery of the lower cover body, the bottom wall of the lower cover body is formed as the bottom wall of the bottom shell 1, and the side wall of the middle cover body is formed as at least part of the side wall of the bottom shell 1.
[0124] The induction cooker provided in the present embodiment forms a first boss 13 by making the bottom wall of the bottom shell 1 corresponding to at least part of the circuit board assembly 32 protrude toward the bottom of the bottom shell 1, and the first boss 13 is arranged close to the heat dissipation fan 4, that is, the position of the bottom wall of the bottom shell below the circuit board assembly 32 close to the heat dissipation fan 4 is sunken, thereby increasing the space below the circuit board assembly 32, that is, increasing the air inlet space at the circuit board assembly 32, making the amount of cooling air entering the circuit board assembly 32 larger, thereby improving the heat dissipation effect of the circuit board assembly 32 and ensuring the normal use of the induction cooker; moreover, by providing the first boss 13, the appearance of the induction cooker is made more unique and beautiful.
[0125] In the induction cooker of the prior art, the air inlet hole is generally arranged on the bottom wall of the bottom shell. The cooling air outside the induction cooker enters the bottom shell through the air inlet hole on the bottom wall of the bottom shell under the action of the heat dissipation fan. However, the bottom wall of the bottom shell is relatively close to the desktop. Especially for the induction cooker with a thinner appearance, the space from the bottom wall to the desktop is particularly narrow. When the heat dissipation fan is working, it is easy to suck the accumulated water on the desktop into the inner cavity of the bottom shell, causing the electronic components in the bottom shell to be damp or short-circuited, resulting in damage to the induction cooker and the occurrence of unsafe accidents. Based on this, in this embodiment, the air inlet hole 110 can be specifically opened on the side wall of the bottom shell 1. By opening the air inlet hole 110 on the side wall of the bottom shell 1, compared with the prior art, since the distance between the air inlet hole 110 and the desktop in the present invention is higher than the position of the bottom wall 10 of the bottom shell, it can avoid the situation that the accumulated water on the desktop is sucked into the bottom shell 1 when the induction cooker is working to a certain extent, prolonging the service life of the electronic components in the induction cooker and avoiding the occurrence of unsafe accidents.
[0126] In specific implementation, the sinking height of the first boss 13 can be set between 2 mm and 10 mm. This not only increases the air intake space at the bottom of the circuit board assembly 32 and the air intake volume, but also avoids the bottom shell 1 from being too thick, so that the induction cooker can be developed to be thinner.
[0127] The circuit board assembly 32 may specifically include a power board, which is generally provided with electronic components such as an insulated gate bipolar transistor (IGBT) and a rectifier bridge stack. The IGBT and the rectifier bridge stack generate a lot of heat. In specific implementation, the electronic components on the power board that generate a lot of heat are generally arranged in an area close to the power board and close to the heat dissipation fan 4. A heat sink may also be arranged on the power board, and the heat sink is in contact with the electronic components on the power board. The heat generated by the electronic components is quickly transferred to the heat sink, and the heat is dissipated through the heat sink.
[0128] Specifically, the bottom wall of the bottom shell 1 corresponding to at least part of the power board can be made to protrude toward the bottom of the bottom shell 1 to form a first boss 13. Since the power board generates a large amount of heat, the above arrangement can increase the air inlet space corresponding to the power board, that is, increase the air volume entering the corresponding position of the power board, and improve the heat dissipation effect of the power board.
[0129] In specific implementation, the bottom surface of the first boss 13 can be set as an inclined surface. Specifically, the inclined surface is set to be inclined upward in the direction from the side close to the heat dissipation fan 4 to the side away from the heat dissipation fan 4. By setting the first boss 13 as the above inclined surface, the entrance space of the air inlet space below the circuit board assembly 32 is larger, which is more conducive to air intake, so that more cooling air reaches the circuit board assembly 32, and the heat dissipation effect of the circuit board assembly 32 is further improved. Of course, the bottom surface of the first boss 13 can also be a plane.
[0130] Specifically, the first boss 13 includes a bottom wall 132 and a side wall 131. The side wall 131 of the first boss 13 is specifically an inclined surface, which can further increase the area of the air inlet space surrounded by the first boss 13, that is, further increase the air inlet space of the circuit board assembly 32, thereby further improving the heat dissipation effect of the circuit board assembly 32; and, by setting the side wall of the first boss 13 as an inclined surface, the aesthetic appearance of the induction cooker is improved.
[0131] The width of the projection of the side wall 131 of the first boss 13 on the bottom wall 10 of the bottom shell 1 can be set between 1 mm and 5 mm, so that the structural strength of the entire structure can be ensured while increasing the air intake space of the circuit board assembly 32. Figures 1 to 9 Preferably, the angle between the side wall 131 of the first boss 13 and the bottom wall 10 of the bottom shell 1 is an obtuse angle. That is, the angle between the side wall of the first boss 13 and the bottom wall of the bottom shell 1 connected thereto is an obtuse angle, which can further increase the air inlet space of the circuit board assembly 32, is more convenient to manufacture, and can also ensure the structural strength of the first boss 13.
[0132] In the present embodiment, the heat dissipation fan 4 can specifically be an axial flow fan. The heat dissipation fan 4 is set as an axial flow fan, which reduces the production cost of the induction cooker while ensuring normal heat dissipation. Specifically, in the present embodiment, the lower surface of the heat dissipation fan 4 is formed as an air inlet surface, and the upper surface of the heat dissipation fan 4 is formed as an air outlet surface. In other words, the bottom of the heat dissipation fan 4 is formed as an air inlet area, so that the cooling air entering from the air inlet hole 110 of the side wall of the bottom shell 1 enters the bottom of the heat dissipation fan 4, and then after being pressurized by the heat dissipation fan 4, it is blown out from the top of the heat dissipation fan 4 to the heating elements such as the coil disk 2 and the circuit board assembly 32 to dissipate heat for the heating elements.
[0133] Further, the bottom wall 10 of the bottom shell 1 corresponding to the heat dissipation fan 4 protrudes toward the bottom of the bottom shell 1 to form a second boss 14. More preferably, the second boss 14 can be connected to the first boss 13. That is to say, in the induction cooker of this embodiment, the position of the bottom wall 10 corresponding to the heat dissipation fan 4 is sunken at the same time, that is, the distance between the air inlet surface of the heat dissipation fan 4 and the bottom wall of the bottom shell 1 is increased, thereby increasing the area of the air inlet area, making the air volume reaching the air inlet surface of the heat dissipation fan 4 larger, and thus making the air volume blowing to the coil disk 2 and the circuit board assembly 32 larger. At the same time, since the bottom wall corresponding to the area of the circuit board assembly 32 close to the heat dissipation fan 4 sinks, the air volume entering the bottom of the circuit board assembly 32 is further increased, and the heat dissipation effect of the circuit board assembly 32 is further improved. By connecting the first boss 13 and the second boss 14, the air volume blowing to the circuit board assembly 32 is further increased, and the heat dissipation effect of the circuit board assembly 32 is further improved.
[0134] In a specific implementation, the first boss 13 may be extended toward the bottom of the heat dissipation fan 4, so that the position of the bottom wall 10 of the bottom shell 1 corresponding to the heat dissipation fan 4 is formed as the second boss 14, that is, the first boss 13 is directly connected to the second boss 14. Of course, in other implementations, the first boss 13 may not extend to the bottom of the heat dissipation fan 4.
[0135] The sinking height of the first boss 13 can be made consistent with the sinking height of the second boss 14, which not only increases the space size of the entire air inlet area, making the airflow more uniform, but also improves the aesthetic appearance of the induction cooker.
[0136] Of course, in other implementations, the upper surface of the heat dissipation fan 4 may be formed as an air inlet surface, and the lower surface of the heat dissipation fan 4 may be formed as an air outlet surface.
[0137] Continue to refer to Figure 1 , Figures 4 to 8As shown, in this embodiment, a first barrier rib 51 is provided between the coil disk 2 and the heat dissipation fan 4, and the first barrier rib 51 extends between the coil disk 2 and the circuit board assembly 32. By providing the first barrier rib 51 between the coil disk 2 and the heat dissipation fan 4, the wind-generating effect of the heat dissipation fan 4 is improved, and the cooling wind can flow in a preset path; by extending the first barrier rib 51 between the coil disk 2 and the circuit board assembly 32, the heat radiation between the coil disk 2 and the circuit board assembly 32 can be reduced to a certain extent, avoiding the heat of the two from affecting each other, and further ensuring that the circuit board 321 of the circuit board assembly 32 and the heat sink 322 located at the front end of the circuit board 321 can obtain sufficient cooling airflow, further improving the heat dissipation effect of the circuit board assembly 32. Among them, the first barrier rib 51 can be specifically integrally formed with the bottom shell 1, for example, the lower cover 12 is a plastic lower cover, and the first barrier rib 51 is formed on the lower cover 12 while the lower cover is being injected. Of course, the first barrier rib 51 can also be subsequently installed on the bottom shell 1.
[0138] Furthermore, a second barrier rib 52 is provided between the heat dissipation fan 4 and the circuit board assembly 32. In this embodiment, one end of the second barrier rib 52 is connected to the first barrier rib 51, and the other end of the second barrier rib 52 extends in a direction away from the heat dissipation fan 4, and an angle a is formed between the second barrier rib 52 and the first barrier rib 51. In other words, the cooling wind is gathered and guided by the second barrier rib 52, so that the air volume and wind speed of the cooling wind blowing toward the circuit board assembly 32 are larger, and the heat dissipation effect of the circuit board assembly 32 is further improved.
[0139] In specific implementation, the angle a between the second barrier rib 52 and the first barrier rib 51 can be set at 5° to 90°. Preferably, the angle a between the second barrier rib 52 and the first barrier rib 51 can be further set at 10° to 30°, so that the wind gathering and wind guiding effects are better. Among them, the second barrier rib 52 can be specifically integrally formed with the bottom shell 1. For example, the lower cover 12 is a plastic lower cover. When the lower cover is injection molded, the second barrier rib 52 is formed on the lower cover 12. Of course, the second barrier rib 52 can also be subsequently installed on the bottom shell 1. In addition, the length of the second barrier rib 52 along the extension direction of the second barrier rib 52 can be set between 5mm and 30mm. Setting the length of the second barrier rib 52 within this range ensures that the second barrier rib 52 guides and gathers the wind without causing excessive waste of consumables.
[0140] It should be noted that in other implementations, one end of the second barrier rib 52 may not be connected to the first barrier rib 51 , that is, one end of the second barrier rib 52 is disposed close to the first barrier rib 51 , which can also achieve the guidance and gathering of cooling air.
[0141] Continue to refer to Figures 1 to 9In this embodiment, the bottom shell 1 has a first side wall 123, a second side wall 122 and a third side wall 121, wherein the first side wall 123 and the second side wall 122 are arranged opposite to each other, and the third side wall 121 is connected between the first side wall 123 and the second side wall 122. The circuit board assembly 32 is arranged close to the first side wall 123, and the heat dissipation fan 4 is arranged close to the second side wall 122. Specifically, the heat dissipation fan 4 can be arranged close to the connection between the second side wall 122 and the third side wall 121.
[0142] The first boss 13 may specifically extend to the first side wall 123 and the second side wall 122. It is understandable that one end of the first boss 13 extends toward the first side wall 123 and extends to the first side wall 123, and the other end of the first boss 13 extends toward the second side wall 122 and extends to the second side wall 122. In this way, the area of the first boss 13 can be further increased, thereby further improving the heat dissipation effect.
[0143] Of course, in other implementations, the first boss 13 may only extend to the first side wall 123 in the direction of the first side wall 123 , or the first boss 13 may only extend to the second side wall 122 in the direction of the second side wall 122 .
[0144] Among them, when the first boss 13 extends to the first side wall 123, part of the first side wall 123 protrudes toward the bottom of the bottom shell 1 to form a third boss 16, and the third boss 16 is connected to the first boss 13. For example, the first boss 13 extends to the top of the first side wall 123, so that the third boss 16 is formed on the first side wall 123. When the first boss 13 extends to the second side wall 122, part of the second side wall 122 protrudes toward the bottom of the bottom shell 1 to form a fourth boss 17, and the fourth boss 17 is connected to the first boss 13. For example, the first boss 13 extends to the top of the second side wall 122, so that the fourth boss 17 is formed on the second side wall 122. The above arrangement can further increase the area of the air inlet area, further improve the heat dissipation effect of the induction cooker, and further improve the aesthetic appearance of the induction cooker.
[0145] In this embodiment, there is an air storage area between the air inlet 110 and the heat dissipation fan 4, which is connected to the fan cavity of the heat dissipation fan 4. The position of the bottom wall 10 of the bottom shell 1 corresponding to at least part of the air storage area protrudes toward the bottom of the bottom shell 1 to form a fifth boss 15.
[0146] The cooling air entering from the air inlet 110 is stored and guided by the air storage area, thereby increasing the air volume and wind speed of the air entering the fan cavity of the heat dissipation fan 4, thereby improving the heat dissipation effect. By forming the fifth boss 15 at the corresponding position of the air storage area, the presence of the fifth boss 15 increases the area of the air storage area, further increasing the air volume of the cooling air entering the air storage area, thereby further improving the heat dissipation effect.
[0147] In specific implementation, air inlet holes 110 are opened on the second side wall 122 and the third side wall 121, and the air storage area specifically includes a first air storage area 101 located between the air inlet hole 110 of the third side wall 121 and the heat dissipation fan 4 and a second air storage area 102 located between the air inlet hole 110 on the second side wall 122 and the heat dissipation fan 4.
[0148] By setting the first air storage area 101 and the second air storage area 102, the cooling air outside the induction cooker can enter from the air inlet hole 110 on the second side wall 122 and the air inlet hole 110 on the third side wall 121, that is, the air inlet duct is increased, so that the cooling air outside the induction cooker can enter the first air storage area 101 and the second air storage area 102 respectively, and the cooling air is gathered and guided by the first air storage area 101 and the second air storage area 102, and then the cooling air enters the fan cavity of the heat dissipation fan 4, thereby further increasing the air volume and wind speed of the cooling air entering the fan cavity of the heat dissipation fan 4, and further improving the heat dissipation effect of the induction cooker.
[0149] The position of the bottom wall 10 of the bottom shell 1 corresponding to at least a portion of the second air storage area 102 can be made to protrude downward from the bottom shell 1 to form at least a portion of the fifth boss 15. By making at least a portion of the bottom wall of the second air storage area 102 protrude downward to form the fifth boss 15, the space of the second air storage area 102 is increased, that is, the air inlet space is increased, thereby making the air volume blowing toward the circuit board assembly 32 and the coil disk larger.
[0150] Specifically, the second boss 14 can be extended toward the second side wall 122 to form at least a portion of the fifth boss 15, so that the second boss 14 is directly connected to the fifth boss 15, thereby increasing the space of the entire air inlet area, allowing the cooling air in the air storage area to enter the fan cavity of the heat dissipation fan 4 more smoothly, further increasing the air volume and wind speed of the cooling air entering the fan cavity of the heat dissipation fan 4.
[0151] Preferably, the first air storage area 101 and the second air storage area 102 can be connected. In this way, if one of the first air storage area 101 and the second air storage area 102 is accidentally blocked, cooling air will enter from the other of the first air storage area 101 and the second air storage area 102 and flow to the fan cavity of the heat dissipation fan 4, thereby ensuring normal heat dissipation of the induction cooker.
[0152] Specifically, a partition 61 is provided in the bottom shell 1, and a first air storage area 101 connected to the fan cavity of the heat dissipation fan 4 is formed between the partition 61 and the third side wall 121. The heat dissipation fan 4 and the circuit board assembly 32 are located on the side of the partition 61 away from the third side wall 121, and part of the air inlet holes 110 are opened on the third side wall 121. By providing the partition 61, a first air storage area 101 is formed between the partition 61 and the third side wall 121, and the cooling air entering from the air inlet holes 110 is stored and guided by the first air storage area 101, thereby increasing the air volume and wind speed of the air entering the fan cavity of the heat dissipation fan 4, thereby improving the heat dissipation effect.
[0153] Specifically, the third side wall 121 may be a front side wall facing the user. When the air inlet 110 is provided on the third side wall 121, since the third side wall 121 faces the user, the user can intuitively and conveniently see the air inlet 110, and can easily see whether the air inlet 110 is blocked, and can clean the air inlet 110 in time to avoid air intake being affected.
[0154] The circuit board assembly 32 may further include a light board 31, on which control devices and / or display devices such as buttons and indicator lights may be provided. The light board 31 may be provided in the first air storage area 101 between the partition 61 and the third side wall 121. Since the third side wall 121 is a front side wall facing the user, that is, the light board 31 is close to the front side of the induction cooker, that is, the light board 31 will be closer to the cook, which is convenient for the cook to operate.
[0155] In specific implementation, the sinking heights of the fifth boss 15, the second boss 14, and the first boss 13 can be made consistent, which not only improves the uniformity of the airflow entering the fan cavity of the heat dissipation fan 4 from the second air storage area 102 and then entering the space under the circuit board assembly, but also improves the aesthetic appearance of the induction cooker.
[0156] Generally, the bottom of the bottom shell 1 of the induction cooker has a foot pad, which can ensure that the outer bottom surfaces of the first boss 13, the second boss 14, the third boss 16, the fourth boss 17, and the fifth boss 15 are at a height not lower than the bottom surface of the foot pad, thereby ensuring the stability of the induction cooker.
[0157] The bottom shell 1 is provided with wind shielding ribs, which specifically include a first wind shielding rib 62 provided between the first wind storage area 101 and the fan cavity of the heat dissipation fan 4 and a second wind shielding rib 63 provided between the second wind storage area 102 and the fan cavity of the heat dissipation fan 4. A first vent 601 is provided on the first wind shielding rib 62, and a second vent 602 is provided on the second wind shielding rib 63. The cooling air entering the first wind storage area 101 enters the fan cavity of the heat dissipation fan 4 through the first vent 601, and the cooling air entering the second wind storage area 102 enters the fan cavity of the heat dissipation fan 4 through the second vent 602.
[0158] By setting the wind shielding ribs, the cooling air entering the fan cavity of the heat dissipation fan 4 can be prevented from being blown back to the air storage area. At the same time, the first vent 601 and the second vent 602 are set on the wind shielding ribs, so that the cooling air of the first air storage area 101 can smoothly enter the heat dissipation fan 4 through the first vent 601, and the cooling air of the second air storage area 102 can smoothly enter the heat dissipation fan 4 through the second vent 602, thereby ensuring the air volume blowing to the heating element, making the cooling air effectively utilized, and further improving the heat dissipation effect.
[0159] More preferably, a first vent 601 is formed between the first wind shield rib 62 and the inner bottom wall of the bottom shell 1, and a second vent 602 is formed between the second wind shield rib 63 and the inner bottom wall of the bottom shell 1, so that the cooling air entering from the vent can directly and as much as possible reach the air inlet surface of the heat dissipation fan 4, and then be blown toward the heating element under the action of the heat dissipation fan 4, further improving the speed and smoothness of the air intake.
[0160] Among them, the top of the first vent 601 may extend to the top of the first wind shielding rib 62, or may not extend to the top of the first wind shielding rib 62, and the top of the second vent 602 may extend to the top of the second wind shielding rib 63, or may not extend to the top of the second wind shielding rib 63. Preferably, the plane where the top of the first vent 601 and the plane where the top of the second vent 602 are located are not higher than the plane where the lower surface of the heat dissipation fan 4 is located. That is, the plane where the top of the first vent 601 and the plane where the top of the second vent 602 are located are not higher than the lowest point of the air inlet surface of the heat dissipation fan. If the plane where the top of the vent is located is set to be higher than the plane where the lower surface of the heat dissipation fan 4 is located, the heat dissipation fan 4 may blow part of the wind back to the wind storage area, thereby causing the part of the wind to be unable to blow to the heating elements such as the coil disk 2 and the circuit board assembly, resulting in a smaller amount of wind blowing to the heating elements.
[0161] It should be noted that, in other implementations, only the first wind shielding rib 62 or only the second wind shielding rib 63 may be provided. Alternatively, no wind shielding rib is provided, in which case the first wind storage area 101 is directly connected to the fan cavity of the heat dissipation fan 4, and the second wind storage area 102 is directly connected to the fan cavity of the heat dissipation fan 4.
[0162] In addition, the position of the bottom wall 10 of the bottom shell 1 corresponding to the coil disk 2 can be made to protrude toward the bottom of the bottom shell 1 to form a sixth boss. That is, the position of the bottom wall 10 of the bottom shell 1 corresponding to the coil disk 2 is sunken, thereby increasing the air inlet space corresponding to the position of the coil disk 2, increasing the air volume blown to the coil disk, and thus improving the heat dissipation effect of the coil disk 2.
[0163] Among them, the air inlet 110 can be set to be multiple, and the multiple air inlet holes 110 are arranged at intervals on the bottom shell 1. For example, the multiple air inlet holes 110 are arranged in a grid shape, which not only ensures the air intake volume and air intake uniformity, but also improves the appearance of the induction cooker. The multiple air inlet holes 110 can also be arranged in multiple rows and columns or in a ring shape. Each air inlet hole 110 can be in a strip, a circle, etc., and the present invention is not limited to this. The air outlet 120 can also be set to be multiple, for example, the multiple air outlet holes 120 are arranged at intervals on the side wall of the bottom shell 1 opposite to the side wall with the air inlet holes 110, for example, the multiple air outlet holes 120 are arranged in a grid shape along the length direction of the side wall, and / or, the multiple air outlet holes 120 are arranged at intervals on the bottom wall of the bottom shell 1 away from the air inlet holes 110, for example, the multiple air outlet holes 120 are arranged in a radial shape.
[0164] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. An induction cooker, comprising a bottom shell (1) and a coil disk (2), a circuit board assembly (32) and a heat dissipation fan (4) located in the bottom shell (1); the bottom shell (1) is provided with an air inlet (110) and an air outlet (120), characterized in that: A bottom wall of the bottom shell (1) corresponding to at least a portion of the circuit board assembly (32) protrudes toward the bottom of the bottom shell (1) to form a first boss (13), and the first boss (13) is arranged close to the heat dissipation fan (4); The first boss (13) comprises a bottom wall (132) and a side wall (131); the width of the projection of the side wall (131) of the first boss (13) on the bottom wall (10) of the bottom shell (1) ranges from 1 mm to 5 mm; and the angle between the side wall (131) of the first boss (13) and the bottom wall (10) of the bottom shell (1) is an obtuse angle; The bottom shell (1) has a first side wall (123) and a second side wall (122) which are arranged opposite to each other, and the first boss (13) extends to the first side wall (123); the first boss (13) extends to the second side wall (122); When the first boss (13) extends to the first side wall (123), part of the first side wall (123) protrudes toward the bottom of the bottom shell (1) to form a third boss (16), and the third boss (16) is connected to the first boss (13); When the first boss (13) extends to the second side wall (122), part of the second side wall (122) protrudes toward the bottom of the bottom shell (1) to form a fourth boss (17), and the fourth boss (17) is connected to the first boss (13); An air storage area connected to a fan cavity of the heat dissipation fan (4) is provided between the air inlet hole (110) and the heat dissipation fan (4); The position of the bottom wall (10) of the bottom shell (1) corresponding to at least a portion of the air storage area protrudes toward the bottom of the bottom shell (1) to form a fifth boss (15); The bottom wall (10) of the bottom shell (1) protrudes toward the bottom of the bottom shell (1) corresponding to the position of the heat dissipation fan (4) to form a second boss (14), and the second boss (14) extends toward the direction of the second side wall (122) to form at least a part of the fifth boss (15).
2. The induction cooker according to claim 1, characterized in that: The sinking height of the first boss (13) ranges from 2 mm to 10 mm; And / or, the air inlet hole (110) is opened on the side wall of the bottom shell (1).
3. The induction cooker according to claim 1, characterized in that: The bottom surface of the first boss (13) is an inclined surface, and the inclined surface is arranged to be inclined upward in a direction from a side close to the heat dissipation fan (4) to a side away from the heat dissipation fan (4); And / or, the first boss (13) is formed by a position of the bottom wall (10) of the bottom shell (1) corresponding to the entire circuit board assembly (32) protruding toward the bottom of the bottom shell (1).
4. The induction cooker according to claim 1, characterized in that: The side wall (131) of the first boss (13) is an inclined surface.
5. The induction cooker according to claim 1, characterized in that: The circuit board assembly (32) comprises a power board, and a bottom wall of the bottom shell (1) corresponding to at least a portion of the power board protrudes toward the bottom of the bottom shell (1) to form the first boss (13).
6. The induction cooker according to any one of claims 1 to 5, characterized in that: A first retaining rib (51) is provided between the coil disk (2) and the heat dissipation fan (4); The first barrier rib (51) extends between the coil disk (2) and the circuit board assembly (32); A second retaining rib (52) is also provided between the heat dissipation fan (4) and the circuit board assembly (32); One end of the second retaining rib (52) is connected to the first retaining rib (51), or one end of the second retaining rib (52) is arranged close to the first retaining rib (51); The other end of the second blocking rib (52) extends in a direction away from the heat dissipation fan (4), and an angle is formed between the second blocking rib (52) and the first blocking rib (51).
7. The induction cooker according to any one of claims 1 to 5, characterized in that: The lower surface of the heat dissipation fan (4) is formed as an air inlet surface, and the upper surface of the heat dissipation fan (4) is formed as an air outlet surface; The position of the bottom wall (10) of the bottom shell (1) corresponding to the heat dissipation fan (4) protrudes toward the bottom of the bottom shell (1) to form a second boss (14).
8. The induction cooker according to claim 7, characterized in that: The second boss (14) is in communication with the first boss (13).
9. The induction cooker according to claim 7, characterized in that: The first boss (13) extends toward the bottom of the heat dissipation fan (4), so that the position of the bottom wall (10) of the bottom shell (1) corresponding to the heat dissipation fan (4) is formed as the second boss (14); And / or, the sinking height of the first boss (13) is consistent with the sinking height of the second boss (14).
10. The induction cooker according to any one of claims 1 to 5, characterized in that: The circuit board assembly (32) is arranged close to the first side wall (123), and the heat dissipation fan (4) is arranged close to the second side wall (122).
11. The induction cooker according to claim 1, characterized in that: The bottom shell (1) comprises a first side wall (123), a second side wall (122) and a third side wall (121); the first side wall (123) and the second side wall (122) are arranged opposite to each other; the third side wall (121) is connected between the first side wall (123) and the second side wall (122); the circuit board assembly (32) is arranged close to the first side wall (123); and the heat dissipation fan (4) is arranged close to the connection between the second side wall (122) and the third side wall (121); The air inlet hole (110) is provided on the second side wall (122) and the third side wall (121), and the air storage area comprises a first air storage area (101) located between the air inlet hole (110) on the third side wall (121) and the heat dissipation fan (4), and a second air storage area (102) located between the air inlet hole (110) on the second side wall (122) and the heat dissipation fan (4).
12. The induction cooker according to claim 11, characterized in that: The position of the bottom wall (10) of the bottom shell (1) corresponding to at least a portion of the second air storage area (102) protrudes toward the bottom of the bottom shell (1) to form at least a portion of the fifth boss (15); And / or, the circuit board assembly (32) comprises a light board (31), and the light board (31) is located in the first air storage area (101).
13. The induction cooker according to claim 11, characterized in that: The first air storage area (101) and the second air storage area (102) are in communication; and / or, the third side wall (121) is a front side wall facing the user; And / or, wind shielding ribs are arranged in the bottom shell (1), the wind shielding ribs comprising a first wind shielding rib (62) arranged between the first wind storage area (101) and the fan cavity of the heat dissipation fan (4), and a first ventilation opening (601) is formed between the first wind shielding rib (62) and the inner bottom wall of the bottom shell (1); And / or, the wind shield rib comprises a second wind shield rib (63) arranged between the second air storage area (102) and the fan cavity of the heat dissipation fan (4), and a second ventilation opening (602) is formed between the second wind shield rib (63) and the inner bottom wall of the bottom shell (1).
14. The induction cooker according to any one of claims 1 to 5, characterized in that: The position of the bottom wall (10) of the bottom shell (1) corresponding to the coil disk (2) protrudes toward the bottom of the bottom shell (1) to form a sixth boss.
Citation Information
Patent Citations
Induction cooker
CN209310073U
Induction cooker
CN211695030U