Mixing light structure of a phosphor-free multi-primary-color LED lamp and preparation method thereof

Abstract

The present invention discloses a light mixing structure and a preparation method thereof for a phosphor-free multi-primary-color LED lamp. The light mixing structure includes a bottom plate, a substrate, a first light mixing unit, and a second light mixing unit. The first light mixing unit includes phosphor-free multi-primary-color LED lamp beads, and the phosphor-free multi-primary-color LED lamp beads include four different main wavelength LED chips. The second light mixing unit is composed of the first light mixing units distributed in a quadrilateral shape, and a complementary color unit is arranged therein. When preparing the light mixing structure, different LED chip arrangement structures are designed according to the complementary color unit, and the first light mixing unit is fabricated by using die bonding, soldering, and encapsulation processes. Then, according to the design of the complementary color unit, the second light mixing unit is fabricated and arranged by using reflow soldering and installation processes. The present invention can eliminate the obvious light mixing color deviation phenomenon in some areas of the lamp caused by the enrichment of different monochromatic lights in different directions in the phosphor-free multi-primary-color LED lamp, and improve the color uniformity of the emitted light.

Description

Technical Field

[0001] The present invention relates to semiconductor lighting technology, and in particular to a light mixing structure for improving the light color uniformity of phosphor-free multi-primary color LED lamps and a preparation method thereof. Background Art

[0002] According to the semiconductor lighting research plan of the US Energy Department, the efficiency limit value of phosphor-free multi-primary color LED synthesized white light is 350 lm / W, which is greater than the efficiency limit value of 250 lm / W for phosphor-excited white light illumination. Currently, research institutions at home and abroad are paying more and more attention to the research and development in the field of phosphor-free multi-primary color LED lighting. Phosphor-free multi-primary color LED white light illumination is the development trend of the next generation of semiconductor lighting technology. However, when multiple main wavelength LED chips are packaged into an all-in-one phosphor-free multi-primary color LED lamp bead, due to the difference in the spatial layout of different main wavelength LED chips in the phosphor-free multi-primary color LED lamp bead, the light pattern of monochromatic light will shift towards the direction of the position where the LED chip itself is located. Eventually, it leads to the enrichment of lights of different colors in different directions in the lamp, and the phenomenon of light mixing color deviation occurs at the lamp mask, panel or lamp edge position. If a large-angle lens is added to the phosphor-free multi-primary color LED lamp bead, the light pattern eccentricity phenomenon is more obvious, and it will shift in the opposite direction of the position where the LED chip itself is located, and the light mixing color deviation phenomenon is more serious.

[0003] Chinese Patent Authorization Publication No. CN103280443B, with the publication date of October 05, 2016, discloses a multi-primary color combination COB and its manufacturing method. A light-emitting area is demarcated on a substrate, and LED chips are welded on the light-emitting area. The LED lamp bead is composed of at least three colors of LED chips; each different color of LED chip forms a light mixing unit, and the light mixing units are evenly distributed in the light-emitting area. First, the first light mixing is carried out with the light mixing unit, and the multi-color LED chips are mixed to obtain the required color, and then the light emitted by each light mixing unit is evenly mixed to ensure that the monochromatic light is evenly emitted within the entire light-emitting surface. However, in the light source layout of this method, the relative positions between the monochromatic light LED chips in the LED lamp bead are the same, and there will still be a phenomenon of enrichment of a single color light in a certain direction, and the regional light mixing color deviation phenomenon caused by using all-in-one phosphor-free multi-primary color pure LEDs cannot be eliminated. Summary of the Invention

[0004] The first object of the present invention is to provide a light mixing structure that can improve the light color uniformity of light output. By rearranging the LED chips and lamp beads, this light mixing structure solves the problem of uneven light color on the mask or panel of phosphor-free multi-primary color LED lamps.

[0005] The second object of the present invention is to provide a method for preparing a light mixing structure of a phosphor-free multi-primary-color LED lamp, which can improve the light color uniformity of the phosphor-free multi-primary-color LED lamp and effectively improve the obvious light mixing color deviation phenomenon of the phosphor-free multi-primary-color LED lamp. This preparation method can solve the problem of spatial color uniformity deviation faced by the lamp made of the phosphor-free multi-primary-color LED light source.

[0006] The first object of the present invention is achieved as follows:

[0007] A light mixing structure of a phosphor-free multi-primary-color LED lamp, characterized in that: it includes a bottom plate, a substrate, a first light mixing unit, and a second light mixing unit. The first light mixing unit includes a number of phosphor-free multi-primary-color LED lamp beads, and each phosphor-free multi-primary-color LED lamp bead contains four LED chips with different dominant wavelengths; the first light mixing unit is installed on the substrate, and the substrate is evenly distributed on the bottom plate; the second light mixing unit is composed of four first light mixing units arranged in a quadrilateral and includes a complementary color unit.

[0008] Further, the four adjacent first light mixing units that make up the second light mixing unit are arranged in one of a square, a rectangle, or a parallelogram, so that a complementary color unit can be formed in the second light mixing unit to improve the spatial color uniformity of the lamp.

[0009] Further, the complementary color unit in the second light mixing unit is composed of different dominant wavelength LED chips in adjacent first light mixing units in the second light mixing unit. The first light mixing unit has different LED chip arrangement methods, so that the complementary color unit includes a number of monochromatic light LED chips with a total of four different dominant wavelengths from different first light mixing units.

[0010] Preferably, the four different dominant wavelength ranges of the LED chips included in the first light mixing unit are within 380 - 780 nm. The phosphor-free multi-primary-color LED lamp beads adopt a phosphor-free process, and the encapsulation glue is silicone, epoxy resin, or polyurethane, or silicone, epoxy resin, or polyurethane doped with a diffusion material, to form a primary optical lens of the phosphor-free multi-primary-color LED lamp bead; the encapsulation method adopts one of direct chip on board encapsulation, silicon substrate encapsulation, metal substrate encapsulation, ceramic substrate encapsulation, or glass fiber substrate encapsulation; the diffusion material is one of silicon dioxide, titanium dioxide, or organosilicon resin micro-nano scattering particles, to improve the light mixing effect of the first light mixing unit.

[0011] Preferably, the first light mixing unit can also selectively include a secondary lens, and the secondary lens covers the phosphor-free multi-primary-color LED lamp beads. The material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, silicone, or epoxy resin.

[0012] The second object of the present invention is achieved as follows:

[0013] A preparation method for a light mixing structure of a phosphor-free multi-primary-color LED lamp, the specific steps are as follows:

[0014] A. First, according to the designed complementary color unit, adjust the die bonding sequence of monochromatic lights with different dominant wavelengths, and respectively form a chip layout or several different chip layouts of the first light mixing unit for each monochromatic light LED chip in the first light mixing unit through the die bonding process; after die bonding, use a wire bonding machine to weld the gold wires to the chip electrodes and the bracket electrodes; use the encapsulation glue as a primary lens for the chip to emit and mix light, and adopt the potting process to encapsulate the bracket into a phosphor-free multi-primary-color LED lamp bead to complete the production of the first light mixing unit; if the first light mixing unit includes a secondary lens, install the secondary optical lens on the substrate through a through hole or adhesive, and cover the phosphor-free multi-primary-color LED lamp bead to complete the production of the first light mixing unit including the secondary lens.

[0015] B. Secondly, print solder paste on the substrate, place the substrate printed with solder paste at the chip placement position on the chip mounter, and successively adsorb the first light mixing units with different chip arrangements on the corresponding substrate according to the design of the complementary color unit by the chip mounter; set the temperature of the reflow oven, and place the substrate with the first light mixing unit attached in the reflow oven for reflow soldering; after the soldered substrate cools, evenly arrange it on the bottom plate by means of screw fixation or colloid fixation, so that four first light mixing units arranged in a quadrilateral distribution adjacent to each other in adjacent substrates form the second light mixing unit, and the complementary color unit in the second light mixing unit includes a total of four monochromatic light LED chips with different dominant wavelengths from two adjacent first light mixing units. Finally, complete the production of the light mixing structure.

[0016] Compared with the prior art, the above technical solutions proposed by the present invention have the following advantages:

[0017] Several monochromatic light LED chips with different dominant wavelengths are pre-mixed in the first light mixing unit. After the pre-mixing in the first light mixing unit, due to the different relative positions of the monochromatic light LED chips in two adjacent first light mixing units in the second light mixing unit, the complementary color unit formed thereby includes four monochromatic light LED chips with different dominant wavelengths. The light energy emitted by the first light mixing unit is further complementary color mixed in space, eliminating the enrichment phenomenon of the monochromatic light of the phosphor-free multi-primary-color LED lamp bead in a certain direction in space, and thus improving the spatial light color uniformity of the phosphor-free multi-primary-color LED lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a simplified schematic diagram of the layout of a conventional phosphor-free first light mixing unit;

[0019] Figure 2 It is a top view schematic diagram of the manufacturing process of the conventional first light mixing unit of the present invention;

[0020] Figure 3 It is a cross-sectional schematic diagram of the manufacturing process of the conventional first light mixing unit of the present invention;

[0021] Figure 4 It is a top view schematic diagram of the light mixing structure layout of Embodiment 1 of the present invention;

[0022] Figure 5 It is an enlarged schematic diagram of the second light mixing unit of Embodiment 1 of the present invention;

[0023] Figure 6 It is a top view schematic diagram of the light mixing structure layout of Embodiment 2 of the present invention;

[0024] Figure 7 It is an enlarged schematic diagram of the second light mixing unit of Embodiment 2 of the present invention. Detailed implementation manners

[0025] The technical solutions in the embodiments of the present invention will be further described below with reference to the accompanying drawings in the embodiments of the present invention. In addition, the accompanying drawings of the present invention all adopt very simplified non-precise scales, and are only used to facilitate and clearly assist in explaining the present invention.

[0026] Figure 1 It is a simplified schematic diagram of the layout of the first light mixing unit of a conventional phosphor-free multi-primary-color LED. The first light mixing unit 11 is placed on the substrate 12, and the substrates 12 are evenly arranged on the lamp base plate 13. Taking the monochromatic light LED chips of four different peak wavelengths, namely blue light chip (B), green light chip (G), yellow light chip (Y) and red light chip (R), as an example, the layout of the chip positions of the first light mixing unit of the conventional phosphor-free multi-primary-color LED is shown. It can be seen that in all the first light mixing units, the arrangement directions of the LED chips of each color are the same.

[0027] Figure 2 and Figure 3 They are a top view schematic diagram and a cross-sectional schematic diagram of the manufacturing process of the phosphor-free multi-primary-color LED lamp beads 111 in the first light mixing unit 11 of the conventional phosphor-free multi-primary-color LED of the present invention. The phosphor-free multi-primary-color LED lamp beads 111 include a bracket 1111 and four monochromatic light LED chips 1112, 1113, 1114, 1115 of different peak wavelengths, and also include a potting adhesive 1116 for encapsulating the phosphor-free multi-primary-color LED lamp beads 111. The manufacturing process is as follows:

[0028] A. Each monochromatic light LED chip 1112, 1113, 1114, 1115 in the first light mixing unit 11 is placed on the bracket 1111 through a die bonding process;

[0029] B. Using encapsulant 1116, the bracket 1111 is encapsulated into a phosphor-free multi-primary-color LED lamp bead 111 by a potting process to form a first light mixing unit 11;

[0030] C. If a secondary optical lens is selectively used, the secondary optical lens 112 is placed on the phosphor-free multi-primary-color LED lamp bead 111 to form a first light mixing unit 11 including the secondary optical lens.

[0031] Figure 2 Among them, since the LED chips are in four directions, the light output deviates towards the directions where the LED chips are located. If a secondary optical lens is added, since the LED chips are not at the exact center of the secondary optical lens, the light pattern will deviate in the direction opposite to the directions where the LED chips are located, and the deviation will be more obvious.

[0032] If the Figure 1 conventional first light mixing unit layout shown in is used as the light mixing structure, due to the Figure 2 light pattern deviation shown in, finally, color mixing deviation will occur on the mask of the entire lamp. will be Figure 1 used as the control diagram of the present invention, which is beneficial to understanding the two specific embodiments proposed by the present invention. Now, the two specific embodiments of the present invention are described as follows.

[0033] Embodiment 1:

[0034] Figure 4 is a top view schematic diagram of the light mixing structure layout of Embodiment 1. The first light mixing units 21 are placed on the substrate 22, and the substrate 22 is uniformly arranged on the lamp bottom plate 23. The four first light mixing units 21 in the upper left corner are combined into a second light mixing unit 24. It can be seen that the light source arrangement of the entire lamp is actually the result of replication and translation of the second light mixing unit 24.

[0035] Figure 5 is an enlarged schematic diagram of the second light mixing unit 24 of Embodiment 1, in which the second light mixing unit 24 includes first light mixing sub-units 241, 242, 243, and 244 respectively.

[0036] The first light mixing sub-units 241, 242, 243, and 244 are the same type of light mixing units, that is, the first light mixing units 21 with the same arrangement position of LED chips.

[0037] Among them, the arrangement positions of the four LED chips with different dominant wavelengths in the first light mixing sub-unit 241 are the same as those in the first light mixing sub-unit 244.

[0038] Among them, the arrangement positions of the four LED chips with different dominant wavelengths in the first light mixing sub-unit 242 are the same as those in the first light mixing sub-unit 243.

[0039] Among them, the first hybrid photon unit 242 is formed by rotating the first hybrid photon unit 241 by 180 degrees, and the first hybrid photon unit 244 is formed by rotating the first hybrid photon unit 243 by 180 degrees.

[0040] Among them, the yellow light chip (Y) and green light chip (G) in the first hybrid photon unit 241, and the red light chip (R) and blue light chip (B) in the first hybrid photon unit 243 form a complementary color unit 245.

[0041] Among them, the red light chip (R), green light chip (G) in the first hybrid photon unit 241, and the yellow light chip (Y) and blue light chip (B) in the first hybrid photon unit 242 form a complementary color unit 246.

[0042] Since the light from the four LED chips with different dominant wavelengths in the complementary color units 245 and 246 can be mixed into white light in space, the phenomenon of color mixing and color deviation caused by the enrichment of single-color light in the same direction is eliminated.

[0043] Similarly, the first hybrid photon units 243 and 244, as well as the first hybrid photon units 242 and 244 in the second hybrid light unit 24, also improve the color mixing and color deviation phenomenon based on the same color mixing and complementary color principle.

[0044] The color mixing structure of Embodiment 1 can be realized by the following preparation method:

[0045] A. According to the design of the complementary color units 245 and 246, the monochromatic light LED chips of the first hybrid photon unit 241 are respectively placed on the bracket through the die bonding process, and the gold wires are welded to the chip electrodes and bracket electrodes by a wire bonder, finally forming an unencapsulated bracket with only one arrangement position of the LED chips.

[0046] B. The bracket is encapsulated into a phosphor-free multi-primary color LED lamp bead by the potting process using an encapsulation glue. The encapsulation glue is silicone, epoxy resin or polyurethane, or silicone, epoxy resin or polyurethane doped with a diffusion material, forming a primary optical lens for the light emission and color mixing of the LED chips; the diffusion material is one of silicon dioxide, titanium dioxide, and organic silicone resin micro-nano scattering particles, which is beneficial to further color mixing of the monochromatic light chips with four dominant wavelengths in the phosphor-free multi-primary color LED lamp bead; the bracket encapsulation adopts one of the forms of direct chip encapsulation, metal substrate encapsulation, silicon substrate encapsulation, ceramic substrate encapsulation, and glass fiber substrate encapsulation; the production of the first hybrid photon units 241, 242, 243, and 244 is completed.

[0047] C. Print solder paste on the substrate 22, and place the substrate 22 with the printed solder paste at the placement position on the mounter; according to the design of the color compensation units 245 and 246, successively adsorb different first hybrid photon units 241, 242, 243, and 244 with the mounter and paste them on the corresponding substrates respectively;

[0048] D. Set the temperature of the reflow oven, and place the substrate 22 with the first hybrid light unit 21 pasted thereon in the reflow oven for reflow soldering; after the soldered substrate 22 is cooled, uniformly arrange it on the lamp base plate 23 by means of screw fixation or colloid fixation according to the design of the color compensation units 245 and 246. The four first hybrid photon units 241, 242, 243, and 244 adjacent to each other and distributed in a quadrilateral shape between adjacent substrates 22 form the second hybrid light unit 24, and the designed color compensation units 245 and 246 are formed in the second hybrid light unit 24.

[0049] E. If the first hybrid photon units 241, 242, 243, and 244 include secondary lenses, install the secondary optical lenses on the substrate 22 through through holes or adhesive, and cover the phosphor-free multi-primary-color LED lamp beads; the material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, silica gel, or epoxy resin.

[0050] Finally, the preparation of the hybrid light structure of Example 1 is completed.

[0051] Example 2:

[0052] Figure 6 is a top view schematic diagram of the layout of the hybrid light structure of Example 2. The difference between Example 2 and Example 1 is that the layout of the LED chip orientations of the first hybrid light units in the second hybrid light unit of Example 2 is different, and the manufacturing method of the first hybrid light units is different.

[0053] Figure 6 In it, the first hybrid light unit 31 is placed on the substrate 32, and the substrate 32 is uniformly arranged on the lamp base plate 33; the four first hybrid light units 31 are combined into the second hybrid light unit 34. It can be seen that the light source arrangement of the lamp is actually the result of replication and translation of the second hybrid light unit 34.

[0054] Figure 7 is an enlarged schematic diagram of the second hybrid light unit 34 of Example 2, in which there are four first hybrid photon units 341, 342, 343, and 344 in the second hybrid light unit 34 respectively.

[0055] The four first hybrid photon units 341, 342, 343, and 344 belong to the hybrid light units with two different LED chip position arrangements, that is, the hybrid light units 31 with two different LED chip arrangement positions.

[0056] Among them, the relative arrangement positions of the four-color LED chips in the first mixed photon unit 344 are the same as those of the first mixed photon unit 341. The first mixed photon unit 344 can be formed by rotating the first mixed photon unit 341 by 180 degrees around the central origin. The arrangement positions of the four-color chips in the first mixed photon unit 343 are the same as those of the first mixed photon unit 342. The first mixed photon unit 343 can be formed by rotating the first mixed photon unit 342 by 180 degrees around the central origin.

[0057] Among them, the first mixed photon unit 342 is formed by swapping the positions of the first-row LED chips and the second-row LED chips in the first mixed photon unit 341. That is, the first mixed photon unit 342 and the first mixed photon unit 341 are respectively the first mixed light units 31 with two different LED chip position arrangements.

[0058] Among them, the yellow light chip (Y) and green light chip (G) in the first mixed photon unit 341, and the blue light chip (B) and red light chip (R) in the first mixed photon unit 343 also form a complementary color unit 345.

[0059] Among them, the red light chip (R) and green light chip (G) in the first mixed photon unit 341, and the blue light chip (B) and yellow light chip (Y) in the first mixed photon unit 342 form a complementary color unit 346.

[0060] Since the light of the four LEDs with different dominant wavelengths in the complementary color units 345 and 346 can be mixed into white light in space respectively, the phenomenon of color mixing and color deviation caused by the enrichment of single-color light in the same direction is eliminated.

[0061] Similarly, in the second mixed light unit 34, the first mixed photon unit 343 and the first mixed photon unit 344, as well as the first mixed photon unit 342 and the first mixed photon unit 344, also improve the color mixing and color deviation phenomenon based on the same color mixing and complementary color principle.

[0062] The color mixing structure of Embodiment 2 is realized by the following manufacturing method:

[0063] A. According to the design of the complementary color units 345 and 346, during die bonding, first complete the die bonding of the first type of first mixed light unit according to the LED chip arrangement method in the first mixed photon unit 341, and then switch the die bonding sequence of the monochromatic light LED chips with different dominant wavelengths, and complete the die bonding of the second type of first mixed light unit according to the LED chip arrangement method in the first mixed photon unit 342. Use a wire bonder to weld the gold wires to the chip electrodes and bracket electrodes of the two die bonding schemes to form two unencapsulated brackets with different LED chip arrangement positions.

[0064] B. Using encapsulant, the bracket is encapsulated into a phosphor-free multi-primary-color LED lamp bead by potting process. The encapsulant is silicone, epoxy resin or polyurethane, or silicone, epoxy resin or polyurethane doped with diffusion material, forming a primary optical lens for light mixing of the LED chip light output; the diffusion material is one of silicon dioxide, titanium dioxide, and micro-nano scattering particles of silicone resin, which is beneficial to further light mixing of monochromatic light chips with four main wavelengths in the phosphor-free multi-primary-color LED lamp bead; the bracket encapsulation can adopt one of the forms of direct chip encapsulation, metal substrate encapsulation, silicon substrate encapsulation, ceramic substrate encapsulation, and glass fiber substrate encapsulation; the production of the first light mixing sub-units 341, 342, 343, and 344 is completed.

[0065] C. Solder paste is printed on the substrate 32, and the substrate 32 printed with solder paste is placed at the chip mounting position on the chip mounter; according to the design of the complementary color units 345 and 346, different first light mixing sub-units 341, 342, 343, and 344 are successively adsorbed by the chip mounter and respectively mounted on the corresponding substrates;

[0066] D. Set the temperature of the reflow oven, and place the substrate 32 with the first light mixing unit 31 mounted on it in the reflow oven for reflow soldering. After the soldered substrate 32 is cooled, it is evenly arranged on the lamp base plate 33 by means of screw mounting or colloid fixation according to the design of the complementary color units 345 and 346. The four adjacent first light mixing sub-units 341, 342, 343, and 344 distributed in a quadrilateral shape between adjacent substrates 32 constitute the second light mixing unit 34, and the designed complementary color units 345 and 346 are formed in the second light mixing unit 34.

[0067] E. If the first light mixing sub-units 341, 342, 343, and 344 contain secondary lenses, the secondary optical lenses are installed on the substrate 32 through through holes or adhesive, and cover the phosphor-free multi-primary-color LED lamp beads; the material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, silicone, or epoxy resin;

[0068] Finally, the preparation of the light mixing structure of Example 2 is completed.

[0069] The above are only two specific embodiments of the present invention, rather than all embodiments. Obviously, the present invention can have many similar modifications. For those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention, including other light mixing structures formed by using the complementary color principle, which all fall within the protection scope of the present invention.

Claims

1. Mixing light structure of a phosphor-free multi-primary-color LED lamp, Characterized in that: It includes a bottom plate, a substrate, a first mixing light unit, and a second mixing light unit. The first mixing light unit contains phosphor-free multi-primary-color LED lamp beads, and the phosphor-free multi-primary-color LED lamp beads contain four LED chips with different dominant wavelengths; the first mixing light unit is installed on the substrate, and the substrate is evenly distributed on the bottom plate; the second mixing light unit is composed of four first mixing light units arranged in a quadrilateral, and a complementary color unit is provided in the second mixing light unit; the LED chips in the complementary color unit are arranged in a vertical or horizontal direction, and the light energy of the four LED chips with different dominant wavelengths in the complementary color unit is mixed into white light in space.

2. The mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 1, Characterized in that: The four first mixing light units that make up the second mixing light unit are arranged in one of a square, a rectangle, or a parallelogram.

3. The mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 1, Characterized in that: The first mixing light unit has different chip arrangements, so that a complementary color unit is formed in the second mixing light unit.

4. The mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 3, Characterized in that: The complementary color unit in the second mixing light unit is composed of different dominant wavelength LED chips from adjacent first mixing light units in the second mixing light unit, and includes several LED chips with four different dominant wavelengths in the second mixing light unit.

5. The mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 1, Characterized in that: The encapsulation glue of the phosphor-free multi-primary-color LED lamp beads in the first mixing light unit uses silica gel, epoxy resin, or polyurethane, or silica gel, epoxy resin, or polyurethane doped with a diffusing material to form a primary optical lens of the phosphor-free multi-primary-color LED lamp beads.

6. Preparation method of the mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 5, Characterized in that: The encapsulation method used for the encapsulation glue is one of direct chip encapsulation on a board, silicon substrate encapsulation, metal substrate encapsulation, ceramic substrate encapsulation, or glass fiber substrate encapsulation.

7. The mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 5, Characterized in that: The diffusing material is one of silicon dioxide, titanium dioxide, and silicone resin micro-nano scattering particles.

8. The mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 1, Characterized in that: It includes a secondary optical lens, and the secondary optical lens is installed on the substrate and covers the phosphor-free multi-primary-color LED lamp beads.

9. The mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 8, Characterized in that: The material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, silica gel, or epoxy resin.

10. A preparation method of the mixing light structure of the phosphor-free multi-primary-color LED lamp according to claim 1, Characterized in that: First, according to the designed complementary color unit, adjust the die bonding sequence of monochromatic light LED chips with different dominant wavelengths. Through the die bonding process, form a layout of monochromatic light LED chips of the first light mixing unit or several different layouts of monochromatic light LED chips, and complete the production of the first light mixing unit using ultrasonic gold wire bonding and potting processes. Secondly, according to the design of the complementary color unit, successively place the first light mixing units with different arrangements of monochromatic light LED chips on the corresponding positions of the substrate printed with solder paste using a pick-and-place machine, place the substrate in a reflow oven for reflow soldering, and evenly arrange the substrate on the bottom plate by means of screw fixation or colloid fixation. Finally, the complementary color unit in the second light mixing unit contains several LED chips with four different dominant wavelengths, completing the production of the light mixing structure.

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