Base, camera module and electronic device

Abstract

A base includes: a bearing portion, the bearing portion is used to bear a filter, the bearing portion includes an arc surface; and a first receiving groove, the bearing portion is located at the bottom of the first receiving groove, the first receiving groove is used to receive a photosensitive chip, the photosensitive chip has a photosensitive area and a reflective area arranged around the photosensitive area, the arc surface faces the photosensitive chip, and the center of the arc surface falls within the reflective area of ​​the photosensitive chip, so that light incident in the reflective area falls outside the photosensitive chip after being reflected by the arc surface. The present invention also relates to a camera module and an electronic device. The base, camera module and electronic device provided by the present invention can prevent light incident in the reflective area from being reflected into the photosensitive area, thereby preventing the light spot phenomenon and eliminating the risk of dark edges, further improving the imaging quality of the camera module.

Description

Technical Field

[0001] The present invention relates to the field of electronic and optical devices, and in particular to a base, a camera module and an electronic device using the camera module. Background Art

[0002] Currently, most camera modules on the market are composed of six major parts: lens, motor, filter, photosensitive chip, base, and circuit board. The photosensitive chip includes a photosensitive area and a non-photosensitive area. A bearing portion for bearing the filter is formed inside the base. The bearing portion has an inclined surface that is inclined toward the circuit board and faces the photosensitive chip. External light passes through the lens and hits the photosensitive area of ​​the photosensitive chip to form an image. However, some light will hit the non-photosensitive area of ​​the photosensitive chip. These lights that hit the non-photosensitive area are reflected by the non-photosensitive area and hit the inclined surface of the bearing portion of the base. After being reflected by the inclined surface, the light will fall within the photosensitive area, thereby forming a light spot. The light spot will affect the imaging quality of the camera module.

[0003] In the prior art, the non-photosensitive area of ​​the photosensitive chip is generally painted black or matte, or the size of the screen-printed window is reduced, or the inclined surface is painted black or matte. However, these processing methods have the following disadvantages: 1. Painting the non-photosensitive area of ​​the photosensitive chip black or matte may cause the risk of dark edges in the imaging, and the width of the non-photosensitive area is narrow, making the operation more difficult. 2. Painting the inclined surface of the supporting part of the base black or matte may result in incomplete matting, and the light spot phenomenon is still serious. 3. Reducing the size of the light hole will weaken the light spot phenomenon, but there is a risk of dark edges. Summary of the invention

[0004] In view of this, the present invention provides a base which can prevent the light spot phenomenon, has no dark edge risk and has good imaging quality.

[0005] The present invention also provides a camera module using the base.

[0006] The invention also provides an electronic device using the camera module.

[0007] A base comprises: a bearing portion, the bearing portion is used to bear a filter, the bearing portion comprises an arc surface; and a first receiving groove, the bearing portion is located at the bottom of the first receiving groove, the first receiving groove is used to receive a photosensitive chip, the photosensitive chip has a photosensitive area and a reflective area arranged around the photosensitive area, the arc surface faces the photosensitive chip, the center of the arc surface falls within the reflective area of ​​the photosensitive chip, so that light incident in the reflective area is reflected by the arc surface and falls outside the photosensitive chip.

[0008] Furthermore, the base also includes a second receiving groove, the bearing portion is formed at the junction of the first receiving groove and the second receiving groove, a light-through hole is formed in the middle portion of the bearing portion, the first receiving groove and the second receiving groove are connected through the light-through hole, and the light-through hole is opposite to the photosensitive area of ​​the photosensitive chip.

[0009] A camera module, the camera module comprising: a base, the base comprising a bearing portion and a first receiving groove, the bearing portion being located at the bottom of the first receiving groove; the bearing portion comprising an arc surface; and a photosensitive chip, the photosensitive chip being received in the first receiving groove, the photosensitive chip having a photosensitive area and a reflective area arranged around the photosensitive area, the arc surface facing the photosensitive chip, the center of the arc surface falling within the reflective area of ​​the photosensitive chip, so that light incident in the reflective area is reflected by the arc surface and falls outside the photosensitive chip.

[0010] Furthermore, the base also includes a second receiving groove, the bearing portion is formed at the junction of the first receiving groove and the second receiving groove, a light-through hole is formed in the middle portion of the bearing portion, the first receiving groove and the second receiving groove are connected through the light-through hole; the light-through hole is opposite to the photosensitive area of ​​the photosensitive chip.

[0011] Furthermore, the camera module also includes a filter, which is received in the second receiving groove and located on the bearing portion; the filter is directly opposite to the light hole.

[0012] Furthermore, the camera module also includes a lens, which is formed on the base, and the filter is facing the lens.

[0013] Furthermore, the camera module also includes a circuit board, and the photosensitive chip is fixed on the circuit board and electrically connected to the circuit board.

[0014] Furthermore, the camera module also includes a voice coil motor, which is fixed on the base and electrically connected to the circuit board.

[0015] Furthermore, the voice coil motor includes a lens receiving groove, and the lens is received in the lens receiving groove; an internal thread is formed on the inner wall of the lens receiving groove, and an external thread is formed on the outer wall of the lens, and the external thread is matched with the internal thread.

[0016] An electronic device comprises a main body, and the electronic device also comprises the camera module as described above, wherein the camera module is installed in the main body.

[0017] A camera module provided by the present invention designs the inclined surface of the bearing part of the base facing the photosensitive chip to be an arc surface with the center falling within the reflective area of ​​the photosensitive chip, so that the light irradiated in the reflective area is reflected by the arc surface to the outside of the photosensitive chip, thereby preventing the light irradiated in the reflective area from being reflected into the photosensitive area, thereby preventing the light spot phenomenon and eliminating the risk of dark edges, thereby further improving the imaging quality of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the three-dimensional structure of a camera module provided in a preferred embodiment of the present invention.

[0019] Figure 2 yes Figure 1 The camera module shown is a cross-sectional schematic diagram along the II-II direction.

[0020] Figure 3 yes Figure 1 An exploded view of the camera module is shown.

[0021] Figure 4 This is an application provided by a preferred embodiment of the present invention Figure 1 The three-dimensional structural schematic diagram of the electronic device of the camera module is shown.

[0022] Main component symbols

[0023] Camera module 100

[0024] Shot 10

[0025] External thread 11

[0026] Voice Coil Motor 20

[0027] Lens receiving slot 21

[0028] Internal thread 22

[0029] Base 30

[0030] First surface 31

[0031] Second surface 32

[0032] The first receiving groove 33

[0033] Second receiving slot 34

[0034] Light hole 35

[0035] Carrying part 36

[0036] Arc surface 361

[0037] Circuit board 40

[0038] First hard plate portion 41

[0039] Second hard plate portion 42

[0040] Soft board 43

[0041] Electrical connection part 421

[0042] Filter 50

[0043] Photosensitive chip 60

[0044] Photosensitive area 61

[0045] Reflective area 62

[0046] The first adhesive layer 71

[0047] Second adhesive layer 72

[0048] The third adhesive layer 73

[0049] Electronic components 80

[0050] Reinforcement glue 90

[0051] Electronic device 200

[0052] Ontology 201

[0053] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0054] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following is combined with the attached Figure 1-4 And the preferred embodiment, the specific implementation manner, structure, characteristics and functions of the camera module provided by the present invention are described in detail as follows.

[0055] See also Figure 1-3 The preferred embodiment of the present invention provides a camera module 100. In this embodiment, the camera module 100 is an auto-focus camera module. In other embodiments, the camera module 100 can also be a fixed-focus camera module.

[0056] In this embodiment, the camera module 100 includes a lens 10 , a voice coil motor 20 , a base 30 , a circuit board 40 , a filter 50 and a photosensitive chip 60 .

[0057] The lens 10 is accommodated in the voice coil motor 20, and the voice coil motor 20 is fixed on the base 30. The base 30 is fixed on the circuit board 40. The filter 50 is accommodated and fixed in the base 30. The photosensitive chip 60 is fixed on the circuit board 40 and accommodated in the base 30.

[0058] Wherein, an external thread 11 is formed on the outer wall of the lens 10 .

[0059] The voice coil motor 20 is fixed on the base 30 and electrically connected to the circuit board 40. Specifically, the voice coil motor 20 is fixed on the base 30 through a first adhesive layer 71. Preferably, the first adhesive layer 71 is a thermally conductive adhesive with good heat dissipation performance.

[0060] The voice coil motor 20 includes a lens receiving groove 21, and the lens 10 is received in the lens receiving groove 21. An internal thread 22 is formed on the inner wall of the lens receiving groove 21, and the internal thread 22 is engaged with the external thread 11 to fix the lens 10 in the lens receiving groove 21. The engagement of the internal thread 22 with the external thread 11 is conducive to the up and down movement of the lens 10 in the lens receiving groove 21, thereby realizing automatic focusing to make the image clearer.

[0061] The base 30 is used to support the voice coil motor 20 and place the filter 50. The base 30 is fixed on the circuit board 40. Specifically, the base 30 is fixed on the circuit board 40 through a second adhesive layer 72. Preferably, the second adhesive layer 72 is a thermally conductive adhesive with good heat dissipation performance.

[0062] Specifically, the base 30 is substantially square.

[0063] The base 30 includes a first surface 31 and a second surface 32 opposite to the first surface 31 . The voice coil motor 20 is fixed on the first surface 31 , and the second surface 32 is in contact with the circuit board 40 .

[0064] A first receiving groove 33 is formed from the second surface 32 to the first surface 31, and a second receiving groove 34 is formed from the first surface 31 to the second surface 32. A bearing portion 36 is formed at the intersection of the first receiving groove 33 and the second receiving groove 34. A light-through hole 35 is formed in the middle of the bearing portion 36. The first receiving groove 33 and the second receiving groove 34 are connected through the light-through hole 35. In other words, the bearing portion 36 can be regarded as the bottom of the first receiving groove 33 and the second receiving groove 34. The light-through hole 35 is directly opposite to the lens 10. The second receiving groove 34 is used to accommodate the optical filter 50. The first receiving groove 33 is used to accommodate the photosensitive chip 60, etc. The bearing portion 36 is used to carry the optical filter 50.

[0065] The bearing portion 36 includes an arc surface 361, the arc surface 361 faces the photosensitive chip 60, and the center of the arc surface 361 falls within the reflective area 62 (see below) of the photosensitive chip 60, so that the incident light L1 incident on the reflective area 62 is reflected by the arc surface 361, and the reflected light L2 falls outside the photosensitive chip 60.

[0066] The circuit board 40 may be a ceramic substrate, a soft board, a hard board or a hard-soft board. In this embodiment, the circuit board 40 is a hard-soft board.

[0067] Specifically, the circuit board 40 includes a first hard board portion 41 , a second hard board portion 42 , and a soft board portion 43 located between the first hard board portion 41 and the second hard board portion 42 .

[0068] A plurality of electronic components 80 are formed on the circuit board 40 and arranged around the photosensitive chip 60. The electronic components 80 are electrically connected to the circuit board 40. In this embodiment, the electronic components 80 are located on the first hard board portion 41. The electronic components 80 can be passive components such as resistors, capacitors, diodes, transistors, relays, and electrically erasable programmable read-only memories (EEPROM).

[0069] An electrical connection portion 421 is also installed on the second hard board portion 42. The electrical connection portion 421 is used for external electronic components (not shown). The electrical connection portion 421 can be a connector or a gold finger. The electrical connection portion 421 and the electronic component 80 can be located on the same surface of the circuit board 40, or on different surfaces. In this embodiment, the electrical connection portion 421 and the electronic component 80 are located on the same surface of the circuit board 40.

[0070] The optical filter 50 is received and fixed in the second receiving groove 34. The optical filter 50 is used to filter stray light and only allow light of a specific wavelength to pass through, so as to reduce the influence of stray light on imaging quality.

[0071] In this embodiment, the filter 50 is fixed on the supporting portion 36 via a third adhesive layer 73 .

[0072] The photosensitive chip 60 is fixed on the circuit board 40 and electrically connected to the circuit board 40. The photosensitive chip 60 includes a photosensitive area 61 and a reflective area 62 arranged around the photosensitive area 61. The photosensitive area 61 is directly opposite to the light through hole 35. The center of the arc surface 361 falls within the reflective area 62. Therefore, the incident light L1 incident on the reflective area 62 is reflected by the arc surface 361, and the reflected light L2 falls outside the photosensitive chip 60.

[0073] The camera module 100 further includes a reinforcing glue 90, which is bonded to the base 30 and the circuit board 40 to enhance the strength and overall reliability of the camera module 100. Preferably, the reinforcing glue 90 is a thermally conductive glue with good heat dissipation performance to enhance the heat dissipation effect of the camera module 100.

[0074] See also Figure 4 The present invention also provides an electronic device 200 using the camera module 100. The electronic device 200 includes a body 201, and the camera module 100 is installed in the body 201. The electronic device 200 can be a mobile phone, a wearable device, a computer device, a vehicle, or a monitoring device. In this embodiment, the electronic device 200 is a mobile phone.

[0075] A camera module provided by the present invention designs the inclined surface of the bearing part of the base facing the photosensitive chip to be an arc surface with the center falling within the reflective area of ​​the photosensitive chip, so that the light irradiated in the reflective area is reflected by the arc surface to the outside of the photosensitive chip, thereby preventing the light irradiated in the reflective area from being reflected into the photosensitive area, thereby preventing the light spot phenomenon and eliminating the risk of dark edges, thereby further improving the imaging quality of the camera module.

[0076] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A base, comprising: a bearing portion, the bearing portion being used to bear a filter, the bearing portion comprising an arc surface; and A first receiving groove, wherein the bearing portion is located at the bottom of the first receiving groove; the first receiving groove is used to receive a photosensitive chip; the photosensitive chip has a photosensitive area and a reflective area arranged around the photosensitive area; the arc surface faces the photosensitive chip, and is characterized in that the center of the arc surface falls within the reflective area of ​​the photosensitive chip, so that light incident in the reflective area is reflected by the arc surface and falls outside the photosensitive chip.

2. The base according to claim 1, characterized in that The base also includes a second receiving groove, the bearing portion is formed at the intersection of the first receiving groove and the second receiving groove, a light-through hole is formed in the middle portion of the bearing portion, the first receiving groove and the second receiving groove are connected through the light-through hole, and the light-through hole is opposite to the photosensitive area of ​​the photosensitive chip.

3. A camera module, comprising: A base, the base comprising a bearing portion and a first receiving groove; The bearing portion is located at the bottom of the first receiving groove; the bearing portion includes an arc surface; and A photosensitive chip, which is accommodated in the first receiving groove; the photosensitive chip has a photosensitive area and a reflective area arranged around the photosensitive area; the arc surface faces the photosensitive chip, and is characterized in that the center of the arc surface falls within the reflective area of ​​the photosensitive chip, so that the light incident in the reflective area is reflected by the arc surface and falls outside the photosensitive chip.

4. The camera module according to claim 3, wherein: The base also includes a second receiving groove, the bearing portion is formed at the intersection of the first receiving groove and the second receiving groove, a light-through hole is formed in the middle portion of the bearing portion, the first receiving groove and the second receiving groove are connected through the light-through hole, and the light-through hole is opposite to the photosensitive area of ​​the photosensitive chip.

5. The camera module according to claim 4, wherein: The camera module also includes a filter, which is received in the second receiving groove and located on the bearing portion; the filter is directly opposite to the light hole.

6. The camera module according to claim 5, characterized in that: The camera module also includes a lens, which is formed on the base, and the filter is facing the lens.

7. The camera module according to claim 6, characterized in that: The camera module also includes a circuit board, and the photosensitive chip is fixed on the circuit board and electrically connected to the circuit board.

8. The camera module according to claim 7, wherein: The camera module also includes a voice coil motor, which is fixed on the base and electrically connected to the circuit board.

9. The camera module according to claim 8, wherein: The voice coil motor includes a lens receiving groove, and the lens is received in the lens receiving groove; an internal thread is formed on the inner wall of the lens receiving groove, and an external thread is formed on the outer wall of the lens, and the external thread is matched with the internal thread.

10. An electronic device, comprising a body, characterized in that: The electronic device also includes a camera module as described in any one of claims 3 to 9, and the camera module is installed in the body.

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