A flip structure and semiconductor packaging board processing device

Abstract

The present invention relates to a flipping structure and a semiconductor packaging board processing device, the flipping structure comprises two support frames fixed on the base, a threaded rotating member is rotatably installed between the two support frames through a connecting shaft, one end of the threaded rotating member is rotatably installed with a driving sleeve through a sliding component, and the other end of the driving sleeve is rotatably installed with a connecting sleeve through another sliding component, and a clamping mechanism is fixed on the connecting sleeve; the inner side of the threaded rotating member is threadedly connected with a threaded rod, the threaded rod is slidably connected with a limiting sleeve fixed in the connecting sleeve through a sliding limiting component, and the threaded rotating member is also slidably matched with the driving sleeve, and the outer side of the driving sleeve is connected with a first gear through a ratchet mechanism, and the first gear is adapted to an arc-shaped toothed plate fixed on one of the support frames; the connecting shaft connecting the threaded rotating member and the support frame is connected to a driving mechanism installed on the base.

Description

Technical Field

[0001] The present invention relates to the technical field related to packaging board processing equipment, and in particular to a flip structure and a semiconductor packaging board processing device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators.

[0003] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors.

[0004] The package board is also called the package substrate, which is the term used in printed circuit boards. The substrate can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the size of the packaged product, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization. The package substrate should be an interdisciplinary technology, which involves knowledge of electronics, physics, chemical engineering, etc.

[0005] During the processing of the packaging plate, both sides of the packaging plate need to be processed according to the needs, so the packaging plate needs to be turned over. However, during the existing processing, the packaging plate needs to be removed, turned over, and then fixed to the clamping mechanism, which affects the processing efficiency. Summary of the invention

[0006] The object of the present invention is to provide a flip structure and a semiconductor package board processing device to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A flip structure is installed on a base, the flip structure includes two support frames fixed on the base, a threaded rotating member is rotatably installed between the two support frames through a connecting shaft, a driving sleeve is rotatably installed on one end of the threaded rotating member through a sliding assembly, a connecting sleeve is rotatably installed on the other end of the driving sleeve through another sliding assembly, and a clamping mechanism is fixed on the connecting sleeve;

[0009] The inner side of the threaded rotating member is threadedly connected with a threaded rod, and one end of the threaded rod away from the threaded rotating member is slidably connected with a limit sleeve fixed in the connecting sleeve through a sliding limit assembly, and the threaded rotating member is also slidably matched with the driving sleeve, and the outer side of the driving sleeve is connected with a first gear through a ratchet mechanism, and the first gear is adapted to an arc-shaped toothed plate fixed on one of the supporting frames;

[0010] The connecting shaft connecting the threaded rotating part and the supporting frame is connected to the driving mechanism installed on the base. The driving mechanism drives the connecting shaft to rotate to drive the threaded rotating part to rotate, and drives the clamping mechanism to rotate through the driving sleeve and the connecting sleeve. When the first gear engages with the arc-shaped tooth plate, the driving sleeve rotates, and the clamping mechanism is driven to rotate through the threaded rod, thereby realizing the flipping of the packaging plate clamped on the clamping mechanism.

[0011] As a further solution of the present invention: the clamping mechanism includes an adjustment cavity fixed on the connecting sleeve and two oppositely arranged clamping jaws hinged on the adjustment cavity, and the clamping jaws are connected to the adjustment component installed in the adjustment cavity.

[0012] As a further solution of the present invention: the adjustment assembly includes a bidirectional threaded rod rotatably installed in the adjustment cavity, two threaded sleeves are threadedly connected to the bidirectional threaded rod, the threaded sleeve is hinged to the clamping jaw through a connecting rod hinged thereto, and one end of the bidirectional threaded rod is fixedly connected to a turntable arranged at the end of the adjustment cavity.

[0013] As a further solution of the present invention: the sliding limit assembly includes a strip limit block fixed on the threaded rod and a strip limit groove arranged in the limit sleeve and slidingly matched with the strip limit block.

[0014] As a further solution of the present invention: at least two limit blocks are fixed on the inner wall of the driving sleeve, and the limit blocks are slidably matched with the sliding grooves arranged on the threaded rod.

[0015] As a further solution of the present invention: the driving mechanism includes a second gear fixed on the connecting shaft and a rack plate meshing with the second gear, and the rack plate is slidably matched with the base through a guide assembly and is fixedly connected to the movable end of the electric telescopic rod fixed on the base.

[0016] As a further solution of the present invention: the guide assembly includes a guide rod fixed on the base and a sliding sleeve sleeved on the guide rod and fixedly connected to the rack plate.

[0017] A semiconductor package board processing device comprises the flip structure.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention is novel in design, and the threaded rotating part is driven to rotate by the arranged driving mechanism, and when the threaded rotating part rotates, the clamping mechanism is driven to rotate and follow the rotation through the driving sleeve and the connecting sleeve, and when the first gear on the driving sleeve is meshed with the arc-shaped toothed plate, and the threaded rotating part continues to rotate, the driving sleeve rotates under the action of the first gear and the arc-shaped toothed plate, thereby driving the threaded rod to rotate, and when the threaded rod rotates, the connecting sleeve and the clamping mechanism are driven to rotate along the axis of the connecting sleeve through the action of the limiting sleeve, thereby realizing the flipping of the packaging plate clamped on the clamping mechanism, and the present invention flips the packaging plate after the packaging plate follows the threaded rotating part to rotate a certain angle, which can effectively prevent the packaging plate from interfering with the workbench, and the position of the clamping mechanism is fixed through the action of the threaded rod and the threaded rotating part, and when the threaded rotating part rotates in the opposite direction, the driving sleeve does not rotate under the action of the ratchet mechanism, and the packaging plate remains in the flipped state, which is convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the flip structure.

[0020] Figure 2 It is a schematic diagram of the connection status between the threaded rotating part and the support frame in the flip structure.

[0021] Figure 3 It is a schematic diagram of the connection status of the threaded rotating part, the connecting sleeve, the driving sleeve and the threaded rod in the flip structure.

[0022] Figure 4 It is a cross-sectional view of the first gear in the flip structure.

[0023] Figure 5 It is a cross-sectional view of the clamping mechanism in the flip structure.

[0024] In the figure: 1-clamping claw, 2-connecting rod, 3-adjusting chamber, 4-turntable, 5-packaging plate, 6-connecting sleeve, 7-first gear, 8-driving sleeve, 9-arc gear plate, 10-rack plate, 11-second gear, 12-guide rod, 13-sliding sleeve, 14-electric telescopic rod, 15-support frame, 16-base, 17-threaded rotating part, 18-threaded rod, 19-sliding assembly, 20-limiting block, 21-ratchet mechanism, 22-limiting sleeve, 23-bidirectional threaded rod, 24-threaded sleeve. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0027] See also Figures 1 to 5 In the embodiment of the present invention, a flip structure is installed on a base 16, and the flip structure includes two support frames 15 fixed on the base 16, a threaded rotating member 17 is rotatably installed between the two support frames 15 through a connecting shaft, one end of the threaded rotating member 17 is rotatably installed with a driving sleeve 8 through a sliding component 19, and the other end of the driving sleeve 8 is rotatably installed with a connecting sleeve 6 through another sliding component 19, and a clamping mechanism is fixed on the connecting sleeve 6;

[0028] The inner side of the threaded rotating member 17 is threadedly connected with a threaded rod 18, and one end of the threaded rod 18 away from the threaded rotating member 17 is slidably connected with a limiting sleeve 22 fixed in the connecting sleeve 6 through a sliding limiting assembly, and the threaded rotating member 17 is also slidably matched with the driving sleeve 8, and the outer side of the driving sleeve 8 is connected with a first gear 7 through a ratchet mechanism 21, and the first gear 7 is adapted to an arc-shaped toothed plate 9 fixed on one of the supporting frames 15;

[0029] The connecting shaft connecting the threaded rotating member 17 and the support frame 15 is connected to the driving mechanism installed on the base 16. The driving mechanism drives the connecting shaft to rotate to drive the threaded rotating member 17 to rotate, and drives the clamping mechanism to rotate through the driving sleeve 8 and the connecting sleeve 6. When the first gear 7 is engaged with the arc-shaped tooth plate 9, the driving sleeve 8 is rotated, and the clamping mechanism is driven to rotate through the threaded rod 18, thereby realizing the flipping of the packaging plate 5 clamped on the clamping mechanism.

[0030] When the first gear 7 on the driving sleeve 8 is meshed with the arc-shaped toothed plate 9 and the threaded rotating member 17 continues to rotate, the driving sleeve 8 rotates under the action of the first gear 7 and the arc-shaped toothed plate 9, thereby driving the threaded rod 18 to rotate. When the threaded rod 18 rotates, the connecting sleeve 6 and the clamping mechanism are driven to rotate along the axis of the connecting sleeve 6 through the action of the limiting sleeve 22, thereby realizing the flipping of the packaging plate 5 clamped on the clamping mechanism. In the present invention, the packaging plate 5 is flipped after following the threaded rotating member 17 to rotate a certain angle, which can effectively prevent the packaging plate 5 from interfering with the workbench, and the position of the clamping mechanism is fixed through the action of the threaded rod 18 and the threaded rotating member 17. When the threaded rotating member 17 rotates in the opposite direction, the driving sleeve 8 does not rotate under the action of the ratchet mechanism 21, and the packaging plate 5 remains unchanged in the flipped state, which is convenient to use.

[0031] In the embodiment of the present invention, it should be noted that the threaded rotating member 17 is arranged in a rectangular parallelepiped structure, a cylindrical through hole penetrating the body thereof is arranged on the inner side thereof, and an internal thread adapted to the threaded rod 18 is arranged in the cylindrical through hole.

[0032] In the embodiment of the present invention, it is also necessary to explain that the two sliding components 19 have the same structure. Therefore, this application only describes in detail the sliding component 19 connecting the drive sleeve 8 and the connecting sleeve 6. The sliding component 19 includes an annular slider fixed on the connecting sleeve 6, and the annular slider slides in cooperation with an annular groove provided on the drive sleeve 8.

[0033] As another embodiment of the present invention, the clamping mechanism includes an adjustment cavity 3 fixed on the connecting sleeve 6 and two oppositely arranged clamping jaws 1 hinged on the adjustment cavity 3 , and the clamping jaws 1 are connected to the adjustment assembly installed in the adjustment cavity 3 .

[0034] In the embodiment of the present invention, the two clamping jaws 1 are driven to move toward or in opposite directions by the provided adjustment mechanism, so as to clamp or release the packaging plate 5 , which is convenient to control.

[0035] As another embodiment of the present invention, the adjustment assembly includes a bidirectional threaded rod 23 rotatably installed in the adjustment chamber 3, two threaded sleeves 24 are threadedly connected to the bidirectional threaded rod 23, and the threaded sleeve 24 is hinged to the clamping jaw 1 through a connecting rod 2 hinged thereto, and one end of the bidirectional threaded rod 23 is fixedly connected to a turntable 4 arranged at the end of the adjustment chamber 3.

[0036] In the embodiment of the present invention, the turntable 4 is rotated to drive the bidirectional threaded rod 23 to rotate. When the bidirectional threaded rod 23 rotates, the two threaded sleeves 24 are driven to move toward or oppositely, thereby driving the two clamping jaws 1 to move toward or oppositely through the action of the connecting rod 2 to achieve the clamping requirement. It should be noted that a through groove is provided on the side of the adjusting chamber 3 facing the clamping jaw 1, and a movable block connecting the threaded sleeve 24 and the connecting rod 2 is slidably installed in the through groove.

[0037] As another embodiment of the present invention, the sliding limit assembly includes a strip limit block fixed on the threaded rod 18 and a strip limit groove disposed in the limit sleeve 22 and slidably matched with the strip limit block.

[0038] In the embodiment of the present invention, the bar-shaped limiting block and the bar-shaped limiting groove are slidably matched to realize that when the threaded rod 18 rotates, the limiting sleeve 22 and the connecting sleeve 6 are driven to rotate accordingly without affecting the axial movement of the threaded rod 18 along the connecting sleeve 6.

[0039] As another embodiment of the present invention, at least two limit blocks are fixed on the inner wall of the driving sleeve 8 , and the limit blocks are slidably matched with the sliding grooves provided on the threaded rod 18 .

[0040] In the embodiment of the present invention, the limit block is provided to slide in cooperation with the slide groove to realize driving the threaded rod 18 to rotate when the drive sleeve 8 rotates, without affecting the axial movement of the threaded rod 18 along the drive sleeve 8 .

[0041] As another embodiment of the present invention, the driving mechanism includes a second gear 11 fixed on the connecting shaft and a rack plate 10 meshing with the second gear 11, and the rack plate 10 is slidably matched with the base 16 through a guide assembly and is fixedly connected to the movable end of the electric telescopic rod 14 fixed on the base 16.

[0042] In the embodiment of the present invention, the electric telescopic rod 14 is configured to drive the rack plate 10 to move vertically when telescopically moving, and when the rack plate 10 moves vertically, it drives the second gear 11 to follow the rotation, and when the second gear 11 rotates, it drives the threaded rotating member 17 to rotate, thereby realizing the driving requirements.

[0043] As another embodiment of the present invention, the guide assembly includes a guide rod 12 fixed on the base 16 and a sliding sleeve 13 sleeved on the guide rod 12 and fixedly connected to the rack plate 10 .

[0044] In the embodiment of the present invention, the guide rod 12 and the sliding sleeve 13 are slidably matched to realize the directional sliding of the rack plate 10 , thereby ensuring the meshing effect between the rack plate 10 and the second gear 11 .

[0045] As another embodiment of the present invention, a semiconductor package board processing device is also provided. The semiconductor package board processing device includes the flip structure.

[0046] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0047] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A flip structure, mounted on a base (16), characterized in that: The flip structure comprises two support frames (15) fixed on the base (16), a threaded rotating member (17) is rotatably mounted between the two support frames (15) via a connecting shaft, a driving sleeve (8) is rotatably mounted on one end of the threaded rotating member (17) via a sliding assembly (19), a connecting sleeve (6) is rotatably mounted on the other end of the driving sleeve (8) via another sliding assembly (19), and a clamping mechanism is fixed on the connecting sleeve (6); The inner side of the threaded rotating member (17) is threadedly connected to a threaded rod (18); one end of the threaded rod (18) away from the threaded rotating member (17) is slidably connected to a limiting sleeve (22) fixed in the connecting sleeve (6) through a sliding limiting assembly; the threaded rotating member (17) is also slidably matched with the driving sleeve (8); the outer side of the driving sleeve (8) is connected to a first gear (7) through a ratchet mechanism (21); the first gear (7) is adapted to an arc-shaped toothed plate (9) fixed on one of the supporting frames (15); A connecting shaft connecting the threaded rotating member (17) and the support frame (15) is connected to a driving mechanism installed on the base (16); the driving mechanism drives the connecting shaft to rotate so as to drive the threaded rotating member (17) to rotate, and drives the clamping mechanism to rotate through the driving sleeve (8) and the connecting sleeve (6); and when the first gear (7) is engaged with the arc-shaped toothed plate (9), the driving sleeve (8) is rotated, and the clamping mechanism is driven to rotate through the threaded rod (18), so as to realize the flipping of the packaging plate (5) clamped on the clamping mechanism; The driving mechanism comprises a second gear (11) fixed on the connecting shaft and a rack plate (10) meshing with the second gear (11); the rack plate (10) is slidably matched with the base (16) through a guide assembly and is fixedly connected to the movable end of the electric telescopic rod (14) fixed on the base (16).

2. A flip structure according to claim 1, characterized in that: The clamping mechanism comprises an adjustment cavity (3) fixed on the connecting sleeve (6) and two clamping jaws (1) arranged opposite to each other and hinged on the adjustment cavity (3); the clamping jaws (1) are connected to an adjustment component installed in the adjustment cavity (3).

3. A flip structure according to claim 2, characterized in that: The adjustment assembly comprises a bidirectional threaded rod (23) rotatably mounted in the adjustment chamber (3); two threaded sleeves (24) are threadedly connected to the bidirectional threaded rod (23); the threaded sleeves (24) are hingedly connected to the clamping jaw (1) via a connecting rod (2) hinged thereto; one end of the bidirectional threaded rod (23) is fixedly connected to a rotating disk (4) arranged at the end of the adjustment chamber (3).

4. The flip structure according to claim 1, characterized in that: The sliding limit assembly comprises a strip-shaped limit block fixed on the threaded rod (18) and a strip-shaped limit groove arranged in the limit sleeve (22) and slidingly matched with the strip-shaped limit block.

5. The flip structure according to claim 1, characterized in that: At least two limit blocks are fixed on the inner wall of the driving sleeve (8), and the limit blocks are slidably matched with the sliding grooves arranged on the threaded rod (18).

6. The flip structure according to claim 1, characterized in that: The guide assembly comprises a guide rod (12) fixed on the base (16) and a sliding sleeve (13) sleeved on the guide rod (12) and fixedly connected to the rack plate (10).

7. A semiconductor package board processing device, characterized in that: The semiconductor package board processing device includes the flip structure as described in any one of claims 1-6.

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