Electrical device, interlayer plate including the electrical device, and method for manufacturing the electrical device and the interlayer plate

Abstract

A method of manufacturing an electrical device is described. The method comprises the following steps: (i) providing an interlayer material layer having a first major surface and an opposing second major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first interlayer material layer, the first electrically operable component being mounted on a first circuit board; and (iii) providing an adhesive material layer, preferably a liquid, to cover at least a portion of the first major surface of the interlayer material layer and at least a portion of the first electrically operable component and / or a portion of the first circuit board, such that after step (iii), the first electrically operable component is fixed to the interlayer material layer by at least a portion of the adhesive material layer.

Description

Technical Field

[0001] The present invention relates to an electrical device, an interlaminar ply incorporating the electrical device which can be used to manufacture laminated glazing, and methods of manufacturing such an electrical device and interlaminar ply. Background Art

[0002] It is known to incorporate electronic components between two glass panels in a laminated glazing.

[0003] US2016 / 0313587A1 describes a laminated automotive glazing in which a power supply functional component is inserted. WO2018 / 025051A1 describes a laminated glazing comprising: a first glazing sheet and a second glazing sheet, with at least one adhesive interlayer sheet between the first glazing sheet and the second glazing sheet; a first electric actuation device; and a first receiver coil electrically connected to the first electric actuation device. A method for manufacturing such a laminated glazing is also described in WO2018 / 025051A1.

[0004] In EP1534513B1, a laminated glazing panel is described, which comprises two glass plies, a plastic ply and one or more light emitting diodes mounted on a circuit board laminated between the glass plies. Such a laminated glazing can be produced using a process comprising the following steps: a cut-out area is prepared in the plastic ply to accommodate the circuit board before the lamination process. The circuit board and the one or more light emitting diodes can be at least partially coated with a material compatible with the material of the plastic ply. The circuit board is located in the cut-out area in the plastic ply.

[0005] EP1534513B1 also describes another process for producing a laminated glazing, the process comprising pairing two plastic plies, preparing a cutout area in the upper plastic ply to accommodate a circuit board having one or more light-emitting diodes mounted thereon, positioning the circuit board in the cutout area, joining another plastic ply to the paired plastic ply to form a composite ply, interlacing the composite ply between two glass plies, and laminating the plies. The circuit board and the one or more light-emitting diodes together may be at least partially coated with a material compatible with the material of the plastic ply, and preferably the overall thickness of the coated circuit board having one or more light-emitting diodes mounted thereon is comparable to the thickness of the plastic ply in which it is positioned.

[0006] A problem with such a manufacturing process is that when the plastic ply with the cut-out area therein is placed on the first glass sheet, it may be difficult to insert the circuit board into the hole without the risk of stretching the cut-out area and / or stretching the plastic ply. This problem may be exacerbated when the first glass sheet is curved, which is often the case in the automotive glazing sector. Summary of the invention

[0007] Therefore, the present invention provides a method for manufacturing an electrical device from a first aspect, the method comprising the following steps:

[0008] (i) providing an interlayer material layer having a first major surface and an opposing second major surface;

[0009] (ii) positioning at least a first electrically operable component on a first major surface of a first interlayer material layer, the first electrically operable component being mounted on a first circuit board; and

[0010] (iii) providing a layer of adhesive material to cover at least a portion of the first major surface of the first interlayer material layer and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board.

[0011] For the avoidance of doubt, during step (iii), the adhesive material layer provided may (a) cover at least a portion of the first major surface of the interlayer material layer and at least a portion of the first electrically operable component, or (b) cover at least a portion of the first major surface of the first interlayer material layer and at least a portion of the first electrically operable component and at least a portion of the first circuit board, or (c) cover at least a portion of the first major surface of the first interlayer material layer and at least a portion of the first circuit board.

[0012] The adhesive material layer provided in step (iii) is used to fix the first electrically operable component on the interlayer material layer after step (iii). That is, after step (iii), the first electrically operable component is fixed to the first interlayer material layer by at least a portion of the adhesive material layer.

[0013] The first electrically operable component has first and second electrical input terminals for connection to a suitable power source having first and second output terminals, such that electrical power is provided to the at least one electrically operable component when the first input terminal of the at least one electrically operable component is electrically connected to the first output terminal of the suitable power source and the second input terminal of the first electrically operable component is electrically connected to the second output terminal of the suitable power source.

[0014] An electrical device produced using the method according to the first aspect of the present invention can be used in the form in which it is produced, or can be used as a mother electrical device for producing a daughter electrical device therefrom, the mother device and the daughter device each having a corresponding first main surface and a relative second main surface, wherein at least one of the first main surface and the second main surface of the daughter electrical device has an area smaller than the first main surface or the second main surface of the mother electrical device.

[0015] Preferably, the interlayer material layer is provided as a sheet.

[0016] Preferably, the interlayer material layer comprises a unitary sheet or a multi-layer sheet.

[0017] Preferably, the interlayer material comprises polyvinyl butyral (PVB), a copolymer of ethylene, such as ethylene vinyl acetate (EVA), or a polyurethane, in particular a thermoplastic polyurethane (TPU).

[0018] Preferably, the interlaminar material layer comprises a polyvinyl butyral (PVB) sheet, a copolymer sheet of ethylene, such as ethylene vinyl acetate (EVA), or a polyurethane sheet, in particular thermoplastic polyurethane (TPU).

[0019] Preferably, the first circuit board comprises a substrate having a first major surface and an opposing second major surface, wherein during step (ii) the second major surface of the substrate faces the interlayer material layer, and wherein the electrically operable component is preferably mounted on the first major surface of the substrate.

[0020] Preferably, in step (ii), the first circuit board is positioned on the first major surface of the interlayer material layer such that the first circuit board is located between the interlayer material layer and the first electrically operable component.

[0021] Preferably, after step (iii), the layer of adhesive material directly contacts the first major surface of the layer of interlayer material and the first electrically operable component and / or the first circuit board.

[0022] Preferably, the adhesive material is a plastics material.

[0023] Preferably, the adhesive material comprises polyvinyl butyral (PVB), a copolymer of ethylene, such as ethylene vinyl acetate (EVA), or a polyurethane, in particular a thermoplastic polyurethane (TPU).

[0024] Preferably, in step (iii), the adhesive material layer is provided as a liquid (i.e., in liquid form). By providing the adhesive material layer in liquid form, the adhesive material can be poured or sprayed to cover at least a portion of the first major surface of the interlayer material layer and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board.

[0025] When the adhesive material layer is initially provided in liquid form (i.e. as a liquid), the liquid covers at least a portion of the first major surface of the interlayer material layer and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board, after which the liquid is preferably subjected to a curing step. Preferably, the curing step of the liquid comprises a setting step and / or a curing step. Preferably, the curing step of the liquid comprises a thermal heating step and / or an irradiation step, preferably an ultraviolet irradiation step.

[0026] When the layer of adhesive material is initially provided as a liquid and then undergoes a curing step, the surface of the cured layer of adhesive material which does not face the layer of interlayer material is preferably textured and / or is preferably provided with a coating.

[0027] When the layer of adhesive material is initially provided as a liquid, preferably the liquid comprises a two-component system comprising at least a first component and a second component, preferably wherein the first component is mixed with the second component before or after being provided during step (iii).

[0028] When the adhesive material layer is initially provided as a liquid, preferably the liquid is leveled to achieve a uniform thickness relative to the first interlayer material layer, more preferably relative to the first major surface and / or the second major surface of the first interlayer material layer.

[0029] In some embodiments, the thickness of the adhesive material layer is between 0.3 mm and 3.0 mm, preferably between 0.3 mm and 2.0 mm, more preferably between 0.3 mm and 1.6 mm. Preferably, the thickness of the plastic material layer is 0.38 mm, or 0.76 mm, or 1.14 mm or 1.52 mm.

[0030] Preferably, the layer of adhesive material has a uniform thickness.

[0031] Preferably, the layer of adhesive material is optically clear or tinted.

[0032] Preferably, the layer of adhesive material covers the entire electrically operable component and / or the entire first circuit board.

[0033] In some embodiments, after step (i), a first barrier is provided on the first major surface of the interlayer material layer or around the periphery of the interlayer material layer, and after step (ii), at least a portion of the first circuit board is inboard of the first barrier.

[0034] Preferably, the first barrier surrounds the first circuit board so that the entire first circuit board is on the inner side of the first barrier.

[0035] Preferably, a second barrier is further provided on the first main surface of the interlayer material layer, the second barrier being in communication with the first barrier to define a space in which at least a portion of the first circuit board is positioned after step (ii).

[0036] In some embodiments following step (ii), at least a second electrically operable component is positioned on the interlayer material layer, the second electrically operable component being mounted on the first circuit board and spaced apart from the first electrically operable device.

[0037] In some embodiments after step (ii), at least a second electrically operable component is positioned on the interlayer material layer, the second electrically operable component is mounted on the second circuit board, the second electrically operable component is spaced apart from the first electrically operable device and / or the first circuit board is spaced apart from the second circuit board.

[0038] Preferably, the first electrically operable component is mounted on the first circuit board and the second electrically operable component is mounted on the second circuit board, and the first circuit board is spaced apart from the second circuit board when the first and second electrically operable components are positioned on the first interlayer material layer.

[0039] In an embodiment where the first electrically operable component is mounted on the first circuit board and the second electrically operable component is mounted on the second circuit board, preferably, the first barrier and the second barrier are provided on the first major surface of the interlayer material layer, and after step (iii), the first circuit board is on the inner side of the first barrier, and the second circuit board is on the inner side of the second barrier. Preferably, the second barrier is not within the periphery defined by the first barrier.

[0040] In an embodiment in which the first electrically operable component is mounted on the first circuit board and the second electrically operable component is mounted on the second circuit board, preferably, a first barrier is provided on the first major surface of the interlayer material layer or around the periphery of the interlayer material layer, and after step (iii), the first and second circuit boards are on the inner side of the first barrier.

[0041] In an embodiment where the first electrically operable component is mounted on a first circuit board and the second electrically operable component is mounted on a second circuit board, preferably, during step (iii), the layer of adhesive material also covers at least a portion of the second electrically operable component and / or at least a portion of the second circuit board, more preferably, wherein the layer of adhesive material also covers the entire second electrically operable component and / or the entire second circuit board.

[0042] In an embodiment in which the first electrically operable component is mounted on a first circuit board and the second electrically operable component is mounted on a second circuit board, preferably, after step (iii), a second adhesive material layer is provided to cover at least a portion of the second electrically actuated device and / or at least a portion of the second circuit board. Preferably, the second adhesive material layer is provided as a liquid, preferably by pouring or spraying. When the second layer is initially provided as a liquid, the liquid of the second adhesive material layer is preferably subjected to a subsequent curing step. Preferably, the subsequent curing step of the liquid of the second adhesive material layer comprises a solidification step and / or a hardening step. Preferably, the subsequent curing step of the liquid of the second adhesive material layer comprises a thermal heating step and / or an irradiation step, preferably an ultraviolet irradiation step.

[0043] Preferably, the liquid of the second adhesive material layer is leveled to achieve a uniform thickness relative to the first interlayer material layer, more preferably, relative to the first major surface and / or the second major surface of the first interlayer material layer.

[0044] In embodiments where the second adhesive material layer is initially provided as a liquid and then undergoes a subsequent curing step, the surface of the second adhesive material layer not facing the first interlayer material layer is textured and / or provided with a coating.

[0045] In some embodiments, after step (iii), the first circuit board on which the first electrically operable component is mounted is removed from the interlayer material layer, preferably by a cutting step or a punching step, thereby producing a sub-electrical device.

[0046] In some embodiments, when the first circuit board having the first electrically operable component mounted thereon is removed from the interlayer material layer, at least a portion of the first circuit board is between a portion of the adhesive material layer and a portion of the interlayer material layer, and at least a portion of the interlayer material layer is connected to at least a portion of the adhesive material layer.

[0047] In some embodiments in which a first electrically operable component is mounted on a first circuit board and a second electrically operable component is mounted on a second circuit board, and after step (iii), one side of the first circuit board is covered by the first interlayer material layer and the opposite side is covered by at least a portion of the adhesive material layer, and one side of the second circuit board is covered by the first interlayer material layer and the opposite side is covered by at least a portion of the adhesive material layer, and wherein at least a portion of the adhesive material layer contacts the first main surface of the interlayer material layer, thereby fixing the first circuit board and the second circuit board to the interlayer material layer, and wherein the first circuit board is spaced apart from the second circuit board, preferably, the method includes a separation step after step (iii) to separate the first electrically operable component and / or the second electrically operable component from the interlayer material layer, thereby producing at least one sub-electrical device.

[0048] During the separation step, preferably, the entire first and / or second circuit board on which the first and second electrically operable components are respectively mounted is separated from the interlayer material layer.

[0049] Preferably, during the separation step, the first electrically operable component mounted on the first circuit board and / or the second electrically operable component mounted on the second circuit board is separated from the interlayer material layer, thereby producing a first child electrical device and / or a second daughter electrical device.

[0050] Preferably, the separating step comprises a cutting step or a punching step.

[0051] When the separating step includes a cutting step, preferably, the cutting step includes at least one of a laser cutting step, a thermal cutting step, and a mechanical cutting step.

[0052] In other embodiments, the first adhesive material layer is provided as an adhesive material sheet and, after step (iii), the adhesive material sheet is heated to fuse the adhesive material sheet to said portion of the first major surface of the interlayer material layer and said portion of the first electrically operable device and / or said portion of the first circuit board.

[0053] In some embodiments, after step (iii), the method includes bonding the electrical device into a hole in the interlayer material sheet, wherein bonding the electrical device into the hole in the interlayer material sheet includes the following steps: providing an interlayer material sheet having a first major surface and an opposing second major surface; removing at least a first portion of the interlayer material sheet to form a hole in the interlayer material sheet, the hole of the interlayer material sheet having at least a first wall between the first major surface and the second major surface of the interlayer material sheet; positioning at least a portion of the electrical device in the hole; and securing the electrical device to at least a portion of the first major surface and / or the second major surface of the interlayer material sheet and / or at least a portion of the first wall of the hole in the interlayer material sheet using bonding means. For the avoidance of doubt, in such embodiments in which the interlayer material layer in step (i) is provided as an interlayer material sheet, the sheet may be referred to as a first interlayer material sheet, and the interlayer material sheet in which the hole is formed to bond the electrical device may be referred to as a second interlayer material sheet.

[0054] In these embodiments, an interlayer ply comprising an interlayer material sheet and an electrical device according to one aspect of the present invention is produced, which can be used for the subsequent production of a laminated glazing comprising at least one sheet of glazing material, preferably glass, in particular soda-lime-silica glass, to which the interlayer ply is attached.

[0055] The electrical device may be a mother electrical device, or a daughter electrical device produced from a mother electrical device (ie, removed from the mother electrical device by cutting).

[0056] By bonding the electrical device to the first wall of the aperture in the ply of interlaminar material and / or to the first and / or second major surface of the sheet of interlaminar material, the subsequent lamination process with the sheet of glazing material is simplified.

[0057] Preferably, the first electrically operable component is at least partially positioned in a hole in the interlaminar material ply.

[0058] Preferably, the joining means comprises an adhesive for attaching the first circuit board of the electrical device to the first major surface of the interlayer material ply and / or the first wall of the hole in the interlayer material ply.

[0059] Preferably, the joining means comprises an adhesive for attaching the electrical device to the first major surface of the interlayer material ply and / or the first wall of the hole in the interlayer material ply.

[0060] Preferably, the adhesive bonding means is initially provided as a liquid which is subsequently allowed to solidify or harden.

[0061] Preferably, the adhesive bonding means comprises polyvinyl butyral (PVB), a copolymer of ethylene, such as ethylene vinyl acetate (EVA) or a polyurethane, in particular a thermoplastic polyurethane (TPU).

[0062] The first circuit board of the electrical device has a first major surface and an opposite second major surface, and preferably the entire first major surface and / or the second major surface of the first circuit board is covered with a layer of adhesive bonding means.

[0063] In other embodiments, the joining means comprises a fusion step to fuse at least a portion of the interlayer material layer of the electrical device to the wall of the hole in the interlayer material sheet and / or the first main surface and / or the second main surface of the interlayer material sheet. Preferably, the fusion step comprises a thermal fusion step. Preferably, the thermal fusion step comprises a laser heating step.

[0064] In some embodiments, before step (iii), a flexible circuit is positioned on an interlayer material layer or a first circuit board, the flexible circuit comprising a substrate having a first main surface and an opposite second main surface, the first main surface or the second main surface of the substrate of the flexible circuit comprising a first electrical connector area thereon which is electrically connected to a second electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit through a conductive track; wherein the flexible circuit is positioned so that the second electrical connector area on the substrate of the flexible circuit is electrically connected to the first electrical connector area on the first circuit board.

[0065] Preferably, the flexible circuit is positioned so that the second electrical connector area on the substrate of the flexible circuit is in mechanical communication with the first electrical connector area on the first circuit board.

[0066] Preferably, the substrate of the flexible circuit includes a third electrical connector area on its first main surface or second main surface, which is electrically connected to a fourth electrical connector area on the first main surface or second main surface of the substrate of the flexible circuit through a conductive track; wherein the flexible circuit is positioned so that the fourth electrical connector area on the substrate of the flexible circuit is electrically connected to the second electrical connector area on the first circuit board.

[0067] Preferably, the flexible circuit is positioned so that the fourth electrical connector area on the substrate of the flexible circuit is in mechanical communication with the second electrical connector area on the first circuit board.

[0068] The first electrically operable component has first and second electrical input terminals for connection to a suitable power source having first and second output terminals, such that electrical power is provided to the at least one electrically operable component when the first input terminal of the at least one electrically operable component is electrically connected to the first output terminal of the suitable power source and the second input terminal of the first electrically operable component is electrically connected to the second output terminal of the suitable power source.

[0069] The first electrical connector region on the first circuit board is in electrical communication with a first input terminal of the first electrically operable device, and when present, the second electrical connector region on the first circuit board is in electrical communication with a second input terminal of the first electrically operable device. When the first electrical connector region on the first circuit board is in electrical communication with a first output terminal of a suitable power source and the second input terminal of the first electrically operable component is in electrical communication with a second output terminal of a suitable power source (which may be via the second electrical connector region when present), power is provided to at least one electrically operable component.

[0070] The present invention also provides an electrical device from a second aspect, comprising: at least one electrically operable component mounted on a first circuit board, the first circuit board having a first main surface and a relative second main surface; at least one interlayer material layer having an outer main surface; and at least one adhesive material layer having an outer main surface; wherein the first circuit board on which the at least one electrically operable component is mounted is between the outer main surface of at least one interlayer material layer and the outer main surface of at least one adhesive material layer; further, wherein the first circuit board is fixed to the interlayer material layer by at least the adhesive material layer; characterized in that the electrical device has a first outer surface and a relative second outer surface, wherein (a) the first outer surface of the electrical device includes the outer main surface of at least one interlayer material layer, and the second outer surface of the electrical device includes at least the outer main surface of the adhesive material layer, or (b) the first outer surface of the electrical device includes the outer main surface of at least one adhesive material layer, and the second outer surface of the electrical device includes the outer main surface of at least one interlayer material layer.

[0071] Preferably, the at least one electrically operable component is between the first circuit board and the at least one layer of adhesive material.

[0072] The first circuit board has a periphery, and preferably, at least one adhesive material layer covers the first circuit board and extends beyond its periphery to contact at least one interlayer material layer to fix the first circuit board to the at least one interlayer material layer, more preferably, at least one adhesive material layer covers the entire first circuit board and extends beyond its periphery to contact at least one interlayer material layer to fix the first circuit board to the at least one interlayer material layer.

[0073] The at least one electrically operable component has first and second electrical input terminals for connection to a suitable power source having first and second output terminals, such that electrical power is provided to the at least one electrically operable component when the first input terminal of the at least one electrically operable component is brought into electrical communication with the first output terminal of the suitable power source and the second input terminal of the at least one electrically operable component is brought into electrical communication with the second output terminal of the suitable power source.

[0074] Preferably, the first circuit board comprises a first electrical connector area which is in electrical communication with a first input terminal of the at least one electrically operable component, preferably via a first conductive track on the first circuit board.

[0075] Preferably, the first circuit board comprises a second electrical connector area which is in electrical communication with a second input terminal of the at least one electrically operable component, preferably via a second conductive track on the first circuit board.

[0076] Preferably, the first circuit board comprises a substrate, in particular a substrate comprising polyethylene terephthalate, having a first main surface and an opposite second main surface, and wherein preferably, the first circuit board comprises a first and a second electrical connector area on the first main surface of the substrate, the first electrical connector area on the substrate being electrically connected to a first input terminal of at least one electrically operable component through a first conductive coating or a first conductive track on at least a portion of the first main surface or the second main surface of the substrate, and the second electrical connector area on the substrate being electrically connected to a second input terminal of at least one electrically operable component through a second conductive coating or a second conductive track on at least a portion of the first main surface or the second main surface of the substrate.

[0077] In some embodiments, a first electrical connector area is provided on a first circuit board, which is electrically connected to a first input terminal of at least one electrically operable component. Preferably, the electrical device includes a flexible circuit, which includes a substrate having a first main surface and an opposite second main surface. The first main surface or the second main surface of the substrate of the flexible circuit includes a first electrical connector area thereon, and the first electrical connector area is electrically connected to the second electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit through a conductive track. The first electrical connector area on the substrate of the flexible circuit is electrically and mechanically connected to the first electrical connector area on the first circuit board, so that when the second input terminal of the at least one electrically operable component is electrically connected to the first output terminal of a suitable power supply and the second electrical connector area of ​​the flexible circuit is electrically connected to the second output terminal of a suitable power supply, power is provided to the at least one electrically operable component.

[0078] Preferably, the first electrical connector area of ​​the flexible circuit and the second electrical connector area of ​​the flexible circuit are on the second major surface of the substrate of the flexible circuit, and preferably, the first electrical connector area of ​​the flexible circuit is electrically connected to the second electrical connector area of ​​the flexible circuit through conductive tracks on the second major surface of the substrate of the flexible circuit.

[0079] Preferably, the substrate of the flexible circuit includes a third electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit, which is electrically connected to the fourth electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit through a conductive track, the third electrical connector area on the substrate of the flexible circuit is electrically and mechanically connected to the second electrical connector area on the first circuit board, and the second electrical connector area on the first circuit board is electrically connected to the second input terminal of at least one electrically operable component, wherein when the fourth electrical connector area of ​​the flexible circuit is electrically connected to the first output terminal of a suitable power supply and the second electrical connector area of ​​the flexible circuit is electrically connected to the second output terminal of a suitable power supply, power is provided to the at least one electrically operable component.

[0080] Preferably, the third electrical connector area of ​​the flexible circuit and the fourth electrical connector area of ​​the flexible circuit are on the second major surface of the substrate of the flexible circuit, and preferably, the third electrical connector area of ​​the flexible circuit is electrically connected to the fourth electrical connector area of ​​the flexible circuit through conductive tracks on the second major surface of the substrate of the flexible circuit.

[0081] Preferably, the second major surface of the substrate of the flexible circuit faces the first major surface of the first circuit board.

[0082] Preferably, the second major surface of the substrate of the flexible circuit is in direct contact with at least a portion of the first major surface of the first circuit board.

[0083] Preferably, temporary adhesive means is between at least a portion of the first major surface of the first circuit board and the second major surface of the substrate of the flexible circuit, preferably wherein the temporary adhesive means is a re-stickable adhesive.

[0084] In some embodiments, the electrical device is part of an interlayer ply suitable for connecting two glass windows together, wherein the interlayer ply includes an interlayer material sheet having a first major surface and an opposing second major surface, there is a hole in the interlayer material sheet, the hole having a wall extending between the first major surface and the second major surface of the interlayer material sheet, the electrical device is positioned in the hole in the interlayer material sheet and is joined to at least a portion of the wall of the hole and / or at least a portion of the first major surface and / or the second major surface of the interlayer material sheet.

[0085] Preferably, the interlayer material sheet comprises polyvinyl butyral (PVB), a copolymer of ethylene, such as ethylene vinyl acetate (EVA) or a polyurethane, in particular thermoplastic polyurethane (TPU).

[0086] When the electrical device is part of an interlayer ply, the interlayer ply may be incorporated into a laminated glazing using appropriate high temperature and high pressure lamination conditions well known in the art such that the interlayer ply is located between first and second sheets of glazing material (such as glass). There may be one or more other interlayer material plies (with or without the electrical device incorporated in the aperture therein) between the electrical device and the first and / or second sheets of glazing material.

[0087] When the electrical device is part of an interlayer, the interlayer can be laminated to a single sheet of glazing material (such as glass) for subsequent use in a window, which may require laminating the electrical device in the interlayer to a second sheet of glazing material (such as glass), or a single sheet of glazing material with the interlayer laminated thereto can be used as a pane in a window, for example a window having one pane or two or more panes, such as an insulating glazing unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] The invention will now be described with reference to the following drawings (not to scale), in which:

[0089] Figure 1 shows a schematic isometric representation of an electrically operable device that may be used with the present invention;

[0090] Figure 2 Shows Figure 1 A plan view of the electrically operable device shown in;

[0091] Figure 3a shows a schematic side view of an electrically operable device on a sheet of interlayer material;

[0092] Figure 3b It shows that Figure 3a A schematic plan view of an electrically operable device on an interlayer material sheet shown in;

[0093] Figure 4a shows a schematic side view of an electrically operable device on a sheet of interlayer material covered with a layer of liquid plastic;

[0094] Figure 4b It shows that Figure 4a A schematic plan view of an electrically operable device on a sheet of interlayer material covered with a layer of liquid plastic as shown in;

[0095] Figure 5a shows a schematic side view of an electrically operable device on a sheet of interlaminar material covered with a uniform plastic layer;

[0096] Figure 5b It shows that Figure 5a A schematic plan view of an electrically operable device on a sheet of interlayer material covered with a uniform layer of liquid plastic as shown in;

[0097] Figure 6a shows a schematic side view of a child electrical device cut from a larger parent electrical device;

[0098] Figure 6b Shows that from Figure 6a A schematic plan view of a sub-electrical device cut out of a larger parent electrical device shown in FIG.

[0099] 7-12 show a plurality of electrically operable devices on a sheet of interlayer material and illustrate the manufacturing steps for making a mother electrical device from which daughter electrical devices may be cut;

[0100] Fig.13a -c is a schematic plan view of sixteen electrically operable devices which are encapsulated in a plastic layer and subsequently removed therefrom;

[0101] FIG14 illustrates how an electrical device is positioned in a hole in an interlayer material sheet;

[0102] Figure 15-17 shows how to fix an electrical device in a hole in an interlayer material sheet to manufacture an interlayer board layer according to an aspect of the present invention;

[0103] 18-20 show schematic side views and exploded side views of different laminated glazings incorporating two glass panes and an interlayer ply according to an aspect of the present invention;

[0104] Fig.21 is a schematic exploded isometric representation of an electrically operable device between a sheet of interlayer material and a flexible circuit that can be used to provide power to the electrically operable device;

[0105] Fig. 22 yes Fig.21 A schematic side view of

[0106] Fig.23 yes Fig.21 A schematic side view of a device with an electrically operable device on the interlayer material sheet and a flexible circuit on the electrically operable device;

[0107] Fig.24 and Fig.23 Similar, except that a barrier is provided on the sheet of interlayer material surrounding the electrically operable device and circuit board, and liquid plastic is poured into the area defined by the barrier;

[0108] Fig.25ashows a schematic side view of an electrical device according to an aspect of the present invention;

[0109] Fig.25b Shows Fig.25a A schematic isometric representation of the electrical equipment shown in;

[0110] Fig.26a Shown by Fig.25a and 25b A schematic side view of an interlayer board layer consisting of an electrical device incorporated in a hole in an interlayer material sheet as shown in;

[0111] Figure 26b Shows Figure 26b Schematic isometric representation of;

[0112] Fig. 27 The laminated glazing is shown Fig.26a A schematic side view of an interlayer plate layer;

[0113] Fig.28 yes Fig. 27 an enlarged view of a portion of

[0114] Fig.29 yes Fig. 27 Schematic side view of an end of a laminated glazing shown in , illustrating how a flexible circuit may be used to provide power to electrically operable components. DETAILED DESCRIPTION

[0115] Figure 1 Shown are schematic isometric representations of electrically operable devices that may be used with the present invention. Figure 2 is a plan view of the electrically operable device 1 when viewed from the direction of arrow 2 .

[0116] The electrically operable device 1 comprises a substrate 3 having a first main surface 5 and an opposite second main surface 7. On the first main surface 5 of the substrate 3 is an electrically operable component 9, such as a light emitting diode or a sensor. Moreover, on the first main surface 5 of the substrate 3 are first and second electrical connector areas 11, 13. The first electrical connector area 11 is in electrical communication with a first input terminal 19 of the electrically operable component 9 via a first conductive track 15. The second electrical connector area 13 is in electrical communication with a second input terminal 21 of the electrically operable component 9 via a second conductive track 17.

[0117] When the first electrical connector region 11 and the second electrical connector region 13 are connected to the output terminals of a suitable power source, power can be supplied to the electrically operable component 9, thereby switching the electrically operable component from a non-powered state to a powered state. For example, when the electrically operable component 9 is a light emitting diode and the first electrical connector region 11 is connected to the positive terminal of a suitable power source and the second electrical connector region 13 is connected to the negative terminal of the suitable power source, power is supplied to the light emitting diode 9, and light is emitted from the light emitting diode 9. After disconnection from the suitable power source, light is no longer emitted from the light emitting diode. Suitable switching means may be included as part of the electrically operable device 1 or separate therefrom to allow switching of a suitable power source.

[0118] One or more electrically operable components 9 may be mounted on the base plate 3 .

[0119] A substrate 3 having at least one conductive track on its main surface is a circuit board. For example, a substrate 3 having first and second electrical connector areas 11, 13 and first and second conductive tracks 15, 17 on its first main surface 5 is a circuit board.

[0120] exist Figure 1 , arrow 2 is perpendicular to the first main surface 5 .

[0121] The substrate 3 is typically optically transparent and may be a plastic material such as polyethylene terephthalate (PET). Figure 1 and 2 In the example shown in , the substrate is PET, which is approximately 0.2 mm thick and is relatively flexible.

[0122] The first electrically operable component 9 may be mounted on the first major surface 5 of the substrate 3 by a suitable adhesive. The first and second electrical connector regions 11, 13 and the first and second conductive tracks 15, 17 may be in the form of conductive ink provided on the first major surface 5 by a screen printing process or the like.

[0123] The electrically operable component 9 may be mounted on the second main surface 7 of the substrate 3, and at least one of the conductive tracks 15, 17 and / or the electrical connector areas 11, 13 may also be on the second main surface 7. For example, if the electrically operable component 9 is on the second main surface 7 of the substrate 3 and the first electrical connector area 11 is on the first main surface 5 of the substrate 3, then the first conductive track 15 passes between the first and second main surfaces 5, 7 of the substrate 3 through suitable openings in the first and second main surfaces 5, 7.

[0124] Instead of the conductive tracks 15, 17, electrically isolated coated areas may be in electrical communication with the electrical connector area and the input terminal of the electrically operable component 9. For example, the substrate 3 may be a coated substrate having a conductive coating thereon, for example on the first major surface 5. In such an example, the conductive coating on the first major surface 5 may have two electrically isolated areas, a first electrically isolated area being in electrical communication with the first input terminal 19 of the electrically operable component, and a second electrically isolated area being in electrical communication with the second input terminal 21 of the electrically operable component. Each electrically isolated area of ​​the coating may be in electrical communication with a corresponding electrical connector area.

[0125] Figures 3-6 are used to illustrate the steps involved in manufacturing an electrical device according to an aspect of the present invention. In each of Figures 3-6, the corresponding figure "a" is a side view thereof, and the corresponding figure "b" is a plan view thereof, i.e. a cross-sectional view along line ZZ'.

[0126] Figure 3a Shows Figure 1 and 2 Schematic diagram of an electrically operable device 1a of the type shown in FIG, which is positioned on a major surface 22' of a sheet of interlayer material 22, which in this example is a sheet of ethylene vinyl acetate (EVA) having a thickness of approximately 0.2 mm. Figure 3b Shows Figure 3a , i.e., a view along the direction of arrow 2a, which is perpendicular to the main surface 22'. Figure 3a In the embodiment, the electrically operable device 1a has not been fixed to the EVA sheet 22. However, the electrically operable device 1a can be fixed to the EVA sheet 22 by using a suitable adhesive.

[0127] Figure 4 is used to illustrate another step in the production of an electrical device according to an aspect of the present invention. An assembly of an EVA sheet 22 having an electrically operable device 1a thereon is provided, and a liquid adhesive layer 24 (EVA in this example) is deposited (i.e., by pouring) on ​​the electrically operable device 1a, thereby covering the electrically operable device 1a and also contacting a portion of the major surface 22' of the EVA sheet 22. Other suitable materials for layer 24 include suitable resin or epoxy materials (which may be multi-component epoxy materials).

[0128] In this example, a hot glue gun or the like may be used to apply a layer 24 of liquid EVA, which is initially in solid form and then melted for subsequent deposition onto the electrically operable device 1a as described above.

[0129] Due to the viscosity of EVA, layer 24 has a non-uniform thickness relative to EVA sheet 22 (or major surface 22' of EVA sheet 22), instead the layer has a convex surface and may be referred to in the art as a "blob", i.e., a mass of liquid EVA covering the electrically operable device 1a. Figure 4b In the plan view shown in , the mass of liquid EVA is shown to have a circular periphery, but the shape of the periphery of the mass of liquid EVA may be non-circular.

[0130] Figure 5 is used to illustrate the subsequent steps in the production of an electrical device according to one aspect of the present invention. Before the layer 24 of liquid EVA is cured, a leveling means is applied to flatten the layer 24 to provide a layer 24a of liquid EVA having a uniform (or substantially uniform) thickness relative to the EVA sheet 22. In this example, the layer 24a has a thickness of 0.56 mm, so that the thickness 27 is about 0.76 mm.

[0131] The layer 24a of liquid EVA is hardened to form a solid layer of EVA. The layer 24a of solid EVA adheres and fixes the electrically operable device 1a to the EVA sheet 22, that is, encapsulates the electrically operable device on the EVA sheet 22.

[0132] exist Figure 5a In the form shown in , once the layer 24a is a solid EVA layer, the assembly of the EVA sheet 22 with the electrically operable device 1a fixed thereto by the layer 24a of solid EVA can be used as an electrical device 28 according to one aspect of the present invention. However, it is preferred to use additional processing steps to reduce the size of the electrical device 28 for subsequent use, as will be described in more detail below. In this way, the electrical device 28 is a mother electrical device from which a daughter electrical device can be produced.

[0133] FIG. 6 serves to illustrate another step in the production of an electrical device according to an aspect of the present invention.

[0134] 5 and 6 , starting from the electrical device 28 (which is the mother electrical device), smaller electrical devices 30 (child electrical devices) may be removed therefrom by cutting, stamping, or the like.

[0135] In this example, a knife is used to cut the electrical device 30 from the parent electrical device 28 to leave a hole (or hole) 23 extending through the cured layer of EVA 24a and the EVA sheet 22. Assuming that the electrically operable device 1a has been removed, the portion 29 consisting of a portion 22a of the EVA sheet 22 and a portion 24c of the cured layer of EVA 24a joined thereto can no longer be used as an electrical device and is redundant and can be discarded.

[0136] The electrical device 30 that has been removed from the original electrical device 28 consists of a portion 24b of the cured layer of EVA 24a covering and bonded to the electrically operable device 1a. The portion 24b is also bonded to the portion 22c of the EVA sheet 22. The thickness of the electrical device 30 is shown by arrow 27 and is approximately 0.76 mm in this example (same as the electrical device 28).

[0137] The electrical device 30 has smaller outer dimensions than the electrical device 28 and is therefore a sub-electrical device.

[0138] Although only one electrically operable device 1a positioned on the EVA sheet 22 is shown in Figures 3-6, there may be two or more such devices positioned on the EVA sheet 22. In such an example, the liquid layer 24 may extend over all electrically operable devices, or there may be one or more such liquid layers covering each electrically operable device, that is, each electrically operable device may be covered by a corresponding liquid layer, and two or more of the corresponding liquid layers may be isolated from each other.

[0139] Figure 7-9 shows the Figure 1 and Figure 2 An example of a plurality of electrically operable devices 1b of the type shown being positioned on a sheet of suitable interlayer material such as EVA. In this example, there are sixteen electrically operable devices 1b.

[0140] Referring to Figure 7, Figure 7a A schematic plan view of an EVA sheet 32 ​​is shown positioned in the bottom of a suitable tray 33. Positioned on the EVA sheet 32 ​​are sixteen electrically operable devices, only four of which are labeled 1b and have reference Figure 1 and 2 The type described. There may be more or fewer electrically operable devices on the EVA sheet 32. The electrically operable devices may be of the same type or of different types. In this example, the electrically operable devices are positioned on the EVA sheet 32 ​​in a grid-like manner, but the electrically operable devices may be positioned on the EVA sheet 32 ​​in any other configuration (which may be random).

[0141] Figure 7b Shown along line A-A' Figure 7a The EVA sheet 32 ​​has a thickness of about 0.2 mm and lies flat on the bottom of the tray 33.

[0142] The tray 33 has a peripheral wall 33a extending upwardly from the bottom of the tray by approximately 0.76 mm.

[0143] Figure 81a shows when a volume of liquid plastic has been deposited in the tray to cover the electrically operable device 1b and the exposed portions of the EVA sheet 32 ​​(ie, those portions of the EVA sheet 32 ​​on which there is no electrically operable device). Figure 7b The volume of liquid plastic forms layer 34, and due to its viscosity, the thickness of layer 34 may not be uniform relative to EVA sheet 32. Fig. 9 As shown in , the liquid can be leveled to the height of the peripheral wall 33a of the tray 33 using suitable leveling means. The liquid plastic can then be hardened to form a solid plastic layer 34' that encapsulates the electrically operable device 1b. In this example, the combined thickness of the EVA sheet 32 ​​and the solid layer 34' is about 0.76mm and is substantially set by the height of the peripheral wall 33a of the tray 33.

[0144] Although Fig. 9 It can be used to illustrate that the liquid forming layer 34 has been leveled. Figure 8 , but the same figure can be used to illustrate an assembly in which the liquid forming layer 34' has a relatively low viscosity so that once the liquid has been deposited (i.e., by pouring) into the tray to cover the electrically operable device 1b and the EVA sheet 32, the liquid self-levels to the height of the peripheral wall 33a of the tray 33.

[0145] Then, by appropriate cutting, punching, etc. Fig. 9 Each electrically operable device 1b is removed from the assembly shown in . It may not be possible to remove parts of the base of the tray 33 from an electrical device produced in this way. Moreover, the solidified layer of liquid in the area of ​​the peripheral wall 33a of the tray will adhere thereto, making it difficult to separate therefrom.

[0146] Fig.10 Steps in an alternative method of carrying out an aspect of the present invention are shown.

[0147] exist Fig.10 In the embodiment, the EVA sheet 32 ​​has been placed on a suitable support (ie a table) (not shown). The electrically operable devices 1c (only two of which are marked) are then positioned at the desired locations on the EVA sheet 32.

[0148] A suitable barrier 36 is then positioned on the EVA sheet 32 ​​around the electrically operable device positioned on the EVA sheet 32. The barrier 36 may be positioned on the EVA sheet 32 ​​before the electrically operable device is positioned thereon, in which case the electrically operable device is positioned on the EVA sheet 32 ​​inside the barrier 36.

[0149] The barrier 36 may be formed of any suitable material, ie plastic, polyethylene, polycarbonate, and suitably bonded to, preferably forming a seal with, the upper surface of the EVA sheet 32. The barrier 36 may be of unitary construction, or formed of two or more sections suitably coupled together.

[0150] Fig.11 It is shown that when a suitable liquid adhesive is poured into the area defined by the barrier 36 Fig.10 The liquid adhesive forms a layer 34a covering the electrically operable device 1c and the EVA sheet 32. Depending on the viscosity of the liquid adhesive forming the layer 34a, it may be necessary to level the liquid to form a layer such as Fig.12 34a' of uniform thickness as shown in . Layer 34a is then hardened to form a solid layer 34a' which encapsulates the electrically operable device 1c positioned on the EVA sheet 32. Alternatively, the liquid may have a low viscosity, in which case no additional leveling step is required. If desired, layer 34a may not be leveled before being cured, wherein after being cured, layer 34a is made to have a uniform thickness by using suitable grinding means or cutting.

[0151] Fig.12 An assembly 38 of EVA sheets 32 is shown having sixteen electrically operable devices 1c encapsulated by solid layer 34a' and bounded by barrier 36. Assembly 38 may be used as an electrical device according to an embodiment of the present invention. However, it is preferred to remove one or more of the electrically operable devices 1c from assembly 38 for subsequent use, as will be described below, i.e., electrical device 38 is a parent electrical device for subsequent production of child electrical devices therefrom.

[0152] Fig.13a Shows Fig.12 6. The assembly 38 is used as a parent electrical device for preparing sixteen sub-electrical devices, each of which is similar to the electrical device 30 shown in FIG.

[0153] In the central region 38a of the assembly 38, inside the barrier 36 there are sixteen enclosed electrically operable devices 1c (in Fig.13a Only one of them is marked). The central region 38a is removed from the assembly 38 by cutting along a line 38b just inside the barrier 36 but spaced apart from the electrically operable device 1c. Using an appropriate cutting procedure (such as laser cutting, mechanical cutting, or thermal cutting, etc.), the central region 38a of the assembly 38 can be removed to leave a portion 39 that does not contain an electrically operable device, such as Fig.13b as shown in . Fig.13c The removed portion 40 shown in FIG. 4 contains sixteen encapsulated electrically operable devices 1c (only one of which is labeled in this figure).

[0154] In this example, if Fig.13c As shown in FIG. 1 , the electrically operable devices are arranged in linear rows and columns. There are four rows a, b, c and d and four columns i, ii, iii and iv. Fig.13c The dashed line cut shown in FIG. 4 removes each electrically operable device 1 c from portion 40 , for example each row a may be removed from portion 40 by cutting along dashed line CC′.

[0155] In this example, rows a and d have the same height, and rows b and c have the same height. Columns i, ii, iii, and iv each have the same width, but can be different. Rows a, b, c, d can each have the same height.

[0156] By following Fig.13c 6, sixteen electrical devices of the type marked 30 in FIG. 6 are produced for subsequent use. Each electrical device thus obtained is a sub-electrical device, because it is produced from a component 38 (which is a mother electrical device).

[0157] FIG. 14 is used to illustrate how an electrical device 30 of the type shown in FIG. 6 may be used to form an interlayer board layer including the electrical device 30 and an interlayer material sheet 50 in accordance with an aspect of the present invention. Fig.14a is a plan view, and Fig.14b 13 is a cross-sectional view along line DD'. As is apparent from the above, the electrical device 30 may be a sub-electrical device produced from components of the type shown in FIG.

[0158] A hole 52 is made in the interlayer material sheet 50 to leave a void therein. In this example, the void extends between the two major surfaces of the interlayer material sheet 50, but the void may not extend between the two major surfaces of the interlayer material sheet 50. The hole 52 has a wall 52a extending between the major surfaces of the interlayer material sheet 50.

[0159] The interlayer material sheet 50 having the hole 52 therein is placed on a suitable support (i.e., a table) (not shown). The electrical device 30 is then positioned in the hole 52. The outer dimensions of the electrical device are slightly smaller than the major dimensions of the hole 52, so that the electrical device is not fixed in the hole 52.

[0160] The electrical device 30 has been manufactured so that its thickness (see label 27 on FIG. 6 ) is the same or substantially the same as the thickness of the interlayer material sheet 50 , which may be between 0.38 mm and 0.76 mm.

[0161] According to one aspect of the present invention, the electrical device 30 is secured within the aperture 52 in the interlayer material sheet 50 using suitable bonding means.

[0162] exist Fig.15 In the embodiment shown in , a localized heat source is applied to the upper edge of the hole 52 and / or the electrical device 30, i.e., in the areas indicated by labels 53, 54. The localized heating locally softens and / or melts the interlayer material 50, thereby bonding the upper portion of the electrical device 30 to the wall 52a of the hole 52. The localized heating applied in the areas 53, 54 may also locally soften and / or melt the adhesive layer 24b.

[0163] Similarly, localized heating can be applied to the lower edge of the hole 52 and / or the electrical device 30, i.e., in the area indicated by the labels 55, 56. Such localized heating can locally soften and / or melt the interlayer material 50 and / or the interlayer material 22c to engage the electrical device in the hole 52.

[0164] In such Fig.16 In the alternative embodiment shown in FIG, an adhesive is used to join the electronic device 30 in the hole 52 in the interlayer material sheet 50. When the electrical device 30 is located in the hole 52 in the interlayer material sheet 50, adhesives 57, 58 can be applied to the upper surface of the interlayer material sheet 50 so as to also contact at least a portion of the electrical device 30, thereby joining the electrical device to the hole 52. Similarly, adhesives 59, 60 can be applied to the lower surface of the interlayer material sheet 50.

[0165] Adhesives 57, 58 may be applied as a joint strip (i.e., adhesive strip) that connects interlayer material sheet 50 to electrical device 30. In such an embodiment, the joint strip need not extend over the entire major surface of electrical device 30. However, in alternative embodiments, a sheet having contact adhesive on a major surface thereof may be used to connect interlayer material sheet 50 to electrical device 30, in which case the sheet having contact adhesive thereon may cover the entire electrical device 30 on one side to secure electrical device 30 into hole 52.

[0166] like Fig.16 As shown in , adhesive 59, 60 can extend into any gap between the wall 52a of the hole 52 and the outer wall of the electrical device 30 to provide a bond therebetween. The amount of adhesive 59, 60 that extends into any gap between the wall 52a of the hole 52 and the outer wall of the electrical device 30 can depend on the viscosity of the adhesive 59, 60.

[0167] Fig.17 Another embodiment is shown in which adhesive layers 61, 62 are used to bond the electrical device 30 in the hole 52 in the interlayer material sheet 50. Prior to positioning the electrical device in the hole 52, the adhesive 61, 62 is applied to the outer wall of the electrical device 30. Thereafter, the adhesive 61, 62 contacts the wall 52a of the hole 52 to bond the electrical device 30 thereto.

[0168] As shown in Figures 14-17, the purpose is to use a bonding means to fix the electrical device 30 in the hole 52 in the interlayer material sheet 50 to make an interlayer board layer including the electrical device and the interlayer material sheet. Although it is preferred to use a bonding means such as an adhesive to fix the electrical device 30 in the hole 52 in the interlayer material sheet, the adhesive can be a re-bondable adhesive so that the electrical device 30 can be removably fixed in the hole 52.

[0169] An interlaminar ply having an electrical device 30 secured in a hole 52 in an interlaminar sheet of material as described above may be used to construct a laminated glazing as shown in Figures 18, 19 and 20. Each of Figures 18-20 is a schematic side elevation view of a glazing.

[0170] exist Fig.18a , between the first glass sheet 72 and the second glass sheet 74 is shown. Fig.15 , 16 1 or 17. The interlayer ply 70 couples the first glass sheet 72 to the second glass sheet 74. Conventional lamination conditions, such as elevated temperature and pressure, can be used to produce the laminated glazing 76. The interlayer ply 70 provides adequate adhesive bonding with each of the first glass sheet 72 and the second glass sheet 74, in part because the major surface of the electrical device 30 is smaller than the major surface of the interlayer ply 70. In addition, the material forming the major surface of the electrical device 30 is itself an adhesive.

[0171] Suitable glasses for the first glass sheet 72 and the second glass sheet 74 include soda-lime-silica glass (commonly referred to as "soda-lime-silicate glass"). Typical soda-lime-silica glass compositions are (by weight) SiO2 69-74%; Al2O3 0-3%; Na2O 10-16%; K2O 0-5%; MgO 0-6%; CaO 5-14%; SO3 0-2% and Fe2O3 0.005-2%. The glass composition may also contain other additives, such as refining aids and other colorants, which are typically present in amounts of up to 2%. The color of the glass in transmission may be measured according to recognized standards such as BS EN410.

[0172] For clarity, Fig.18b An exploded view of a laminated glazing 76 is shown in FIG.

[0173] exist Fig.19a , between the first glass sheet 72 and the second glass sheet 74 is shown. Fig.15 , 161 or 17. In addition, there is another interlayer material ply 80, i.e., a ply (or sheet) of PVB, EVA, etc. Interlayer ply 80 is located between the first glass sheet 72 and interlayer ply 70. Interlayer ply 70 is located between the second glass sheet 74 and interlayer ply 80.

[0174] First glass sheet 72 is joined to second glass sheet 74 by an interlaminar structure comprised of interlaminar ply 70 made in accordance with the present invention and conventional interlaminar material ply 80. Conventional lamination conditions, such as elevated temperatures and pressures, may be used to produce laminated glazing 76'.

[0175] For clarity, Fig.19b An exploded view of a laminated glazing 76' is shown in FIG.

[0176] exist Fig.20a , between the first glass sheet 72 and the second glass sheet 74 is shown. Fig.15 , 16 Or an interlayer ply 70 of the type shown in Figure 17. In addition, between the first glass sheet 72 and the second glass sheet 74 there is a first interlayer material ply 80 and a second interlayer material ply 80'.

[0177] The first interlayer ply 80 is between the first glass sheet 72 and the interlayer ply 70. The interlayer ply 70 is between the first and second plies 80, 80' of conventional interlayer material. The second interlayer ply 80' is between the interlayer ply 70 and the second glass sheet 74.

[0178] The first glass sheet 72 is coupled to the second glass sheet 74 by an interlayer structure consisting of an interlayer ply 70 made according to the present invention, a first interlayer material ply 80, and a second interlayer material ply 80' arranged as described above. Conventional lamination conditions, such as elevated temperatures and pressures, may be used to produce the laminated glazing 76'.

[0179] For clarity, Fig.20b An exploded view of a laminated glazing 76' is shown in FIG.

[0180] In FIG. 19 , the interlayer material ply 80 may be replaced by another ply 70 that has been made in accordance with an aspect of the present invention.

[0181] In FIG. 20 , either or both of the interlayer material plies 80 , 80 ′ may be replaced by an interlayer ply that has been made in accordance with an aspect of the present invention.

[0182] Additional plies of interlaminar material (conventional or made in accordance with the present invention) may be used in the construction of the laminated glazing, as desired.

[0183] Figure 21-23For illustration purposes, an additional flexible circuit 90 may be provided to facilitate interfacing with an electrically operable component mounted on a substrate (e.g., as in Figure 1 and Figure 2 Electrical connections for electrically operable devices of the type shown in FIG.

[0184] exist Fig.21 In the figure, it is shown that Figure 1 and Figure 2 A schematic isometric representation of an electrically operable device 1 is shown in and described in its associated description. Fig. 22 yes Fig.21 , i.e. a view viewed along the direction of arrow 82.

[0185] refer to Fig.21 and 22 , located below the electrically operable device 1 is an EVA sheet 22. The EVA sheet 22 has an upper major surface 22' and an opposite lower major surface (not labeled). The electrically operable device 1 is positioned on the EVA sheet 22 by moving the electrically operable device 1 in the direction of arrow 84 so that the electrically operable device 1 is in the position shown by the dashed line on the EVA sheet 22'. Also refer to Figure 3b .

[0186] After the electrically operable device 1 is positioned on the EVA sheet 22 , the flexible circuit 90 is positioned on the electrically operable device 1 by moving the flexible circuit 90 in the direction of arrow 86 .

[0187] The flexible circuit 90 comprises a substrate 92 having a first major surface 92a and an opposing second major surface 92b. When the flexible circuit 90 is positioned on the electrically operable device 1, the second major surface 92b of the substrate 92 faces the first major surface 5 of the substrate 3.

[0188] At one end of the substrate 92 on the second major surface 92b of the substrate 92 are first and second electrical connector areas 94, 96. At the opposite end of the substrate 92 on the second major surface 92b of the substrate 92 are third and fourth electrical connector areas 98, 100.

[0189] First electrical connector region 94 is in electrical communication with third electrical connector region 98 via conductive tracks 102 on second major surface 92b of substrate 92 of flexible circuit 90. Second electrical connector region 96 is in electrical communication with third electrical connector region 100 via conductive tracks 104 on second major surface 92b of substrate 92 of flexible circuit 90.

[0190] The conductive tracks 102, 104 may be screen printed conductive inks.Any or all of the first, second, third and fourth electrical connector regions 94, 96, 98, 100 may be screen printed conductive inks.

[0191] The substrate 92 of the flexible circuit 90 is similar to the substrate 3 of the electrically operable device 1. However, it is preferred that the substrate 92 is mechanically stronger than the substrate 3. For example, if the same material is used for the substrate 3 and the substrate 92, then the substrate 92 is typically thicker than the substrate 3.

[0192] Alternatively, or in addition, the substrate 3 and the substrate 92 may be made of different materials, for example different plastic materials.In some embodiments, a useful property of the substrate 92 is the ability to bend without damaging the conductive tracks 102, 104 on the second major surface 92b.

[0193] The flexible circuit 90 serves as an integral electrical connector to help provide electrical power to the electrically operable component 9 of the electrically operable device 1 .

[0194] The first electrical connector area 94 on the substrate 92 of the flexible circuit 90 is arranged to align with the first electrical connector area 11 on the substrate 3 of the electrically operable device 1. The second electrical connector area 96 on the substrate 92 of the flexible circuit 90 is arranged to align with the second electrical connector area 13 on the substrate 3 of the electrically operable device 1 (at Fig.21 1 and 2.) When the flexible circuit 90 is positioned on the electrically operable device 1, as previously described, providing power to the third and fourth electrical connector regions 98, 100 on the substrate 92 of the flexible circuit 90 provides power to the electrically operable component 9 because the first and second electrical connector regions 94, 96 on the substrate 92 are in electrical and mechanical communication with the corresponding first and second electrical connector regions 11, 13 on the substrate 3.

[0195] The third and fourth electrical connector regions 98, 100 are spaced apart from the first and second electrical connector regions 94, 96. The third and fourth electrical connector regions 98, 100 are also spaced apart from the periphery of the substrate 92 so that a portion of the substrate 92 can be removed by cutting along an end of the substrate 92 and a line between the third and fourth electrical connector regions 98, 100 (as indicated by line M-M'). The third and fourth electrical connector regions 98, 100 are also positioned on the substrate 3 in an area where there are no conductive regions or tracks on the first major surface of the substrate 3.

[0196] The connection between the first electrical connector area 94 on the substrate 3 of the flexible circuit and the first electrical connector area 11 on the substrate 5 of the electrically operable device 1 can be enhanced by using known electrical connection methods, such as localized spots of conductive adhesive, anisotropic conductive adhesives such as CP923CM-25AC manufactured by Dexerials (http: / / www.dexerials.jp / en / products / ), or localized application of anisotropic conductive adhesive films.

[0197] exist Fig.23 , a schematic side view of a flexible circuit 90 on an electrically operable device 1 is shown, wherein the electrically operable device 1 is on an EVA sheet 22. In this figure, a space 105 between the flexible circuit 90 and the electrically operable device 1 is shown. Referring to the above, the space 105 is between the second major surface 92b of the substrate 92 of the flexible circuit 90 and the first major surface 5 of the substrate 3 of the electrically operable device 1. In an alternative embodiment, the second major surface 92b of the substrate 92 of the flexible circuit 90 or the first major surface 5 of the substrate 3 of the electrically operable device 1 may have a re-bondable adhesive thereon so that the substrate 92 is removably adhered to the substrate 3. In another alternative embodiment, there may be no space between the second major surface 92b of the substrate 92 of the flexible circuit 90 and the first major surface 5 of the substrate 3 of the electrically operable device 1.

[0198] Although in Fig.23 In the embodiment shown, the flexible circuit 90 is aligned with the periphery of the substrate 3 at one end, but the flexible circuit may extend beyond the periphery of the substrate 3 of the electrically operable device 1 .

[0199] Fig.24 It is used to illustrate how to produce an electrical device according to an aspect of the present invention. Fig.24 Similar to the previously described Fig.12 .

[0200] The plastic barrier 106 is positioned on the EVA sheet 22. An airtight seal is formed between the base of the barrier 106 and the first major surface 22' of the EVA sheet 22. Fig.10 In a manner similar to that shown in , the barrier 106 completely surrounds the electrically operable device 1 having the flexible circuit 90 thereon when viewed in plan.

[0201] A suitable liquid plastic is poured into the area defined by the barrier 106 to completely cover the electrically operable device 1 having thereon the flexible circuit 90. The layer of liquid plastic 108 is leveled to the height of the barrier 106 by a leveling step or by allowing the liquid to settle.

[0202] The liquid plastic layer 108 is suitably hardened to form a solid plastic layer 108 which encapsulates the electrically operable device 1 having the flexible circuit 90 thereon, i.e., the electrically operable device 1 having the flexible circuit 90 thereon is encapsulated between the solid plastic layer 108 and the EVA sheet 22. The solid plastic layer 108 is also bonded to the first major surface 22' of the EVA sheet 22. Obviously, the liquid plastic is an adhesive.

[0203] As discussed above, in Fig.23 and 24, a slight gap 105 is shown between the second major surface 92b of the substrate 92 and the first major surface 5 of the sheet of substrate 3 when the flexible circuit 90 is on the electrically operable device 1. The thickness of the gap 105 can be small enough so that when liquid plastic is poured into the area defined by the barrier 106, the liquid plastic cannot flow into the gap due to the viscosity of the liquid plastic. Alternatively, the flexible circuit 90 can be configured so that there is no gap between the second major surface 92b of the substrate 92 and the first major surface 5 of the substrate 3 when the flexible circuit 90 is on the electrically operable device 1. Alternatively or additionally, one or more areas of the second major surface 92b can be provided with a suitable re-bondable adhesive so that the substrate 92 can be removably attached to the substrate 3 and / or the EVA sheet 22 when the flexible circuit 90 is on the electrically operable device 1. The suitable re-bondable adhesive helps to form a seal when the liquid plastic is poured onto the electrically operable device 1.

[0204] The packaged electrically operable device 1 having the flexible circuit 90 thereon is used as a mother electrical device for producing a daughter electrical device. The electrically operable device 1 is fixed to the EVA sheet 22 by a solid layer of plastic 108 and by a line along the inside of the barrier 106, i.e., along Fig.24 The lines F-F' and G-G' shown in FIG. 1 are cut and removed therefrom. The electrical device 110 thus manufactured is as follows: Fig.25a , where it can be seen that substantially the electrically operable device 1 is encapsulated between a portion 108' of the cured plastic layer 108 and a portion 22' of the EVA sheet 22. If the sub-electrical device were produced by cutting along line H-H' rather than cutting along line F-F', a subsequent cutting step would be required to allow access to the flexible circuit 90, i.e. essentially by cutting along a portion of line F-F'.

[0205] In this example, the thickness 107 of the electrical device 110 is approximately 0.76 mm. A schematic isometric representation of the electrical device 110 is shown in FIG. Fig.25b Shown in.

[0206] According to one aspect of the present invention, an electrical device 110 may be incorporated into a large sheet of suitable interlayer material 112 having a thickness of approximately 0.76 mm in a manner similar to that described with respect to FIGS. 14-17. A schematic cross-sectional elevation view of an interlayer ply 114 so produced is shown in FIG. Fig.26a and a schematic isometric representation of the interlayer ply 114 is shown in Figure 26b In Figure 26b , the electrical device 110 is shown removed from a hole 116 in a large sheet of suitable interlayer material 112 for clarity.

[0207] The electrical device 110 may be bonded into the hole by using suitable adhesive means as previously described, such as using a patch or strip of adhesive.

[0208] Although in Fig.26a and 26b Only one electrical device 110 is shown incorporated into a suitable interlayer material sheet 112 , but there may be two or more such electrical devices incorporated into a suitable interlayer material sheet 112 .

[0209] Interlayer 114 may be used to construct laminated glazing of the type shown in FIGS. 18-20 . Fig. 27 A specific example is shown in , which helps illustrate the benefits of the additional flexible circuit 90.

[0210] As from Fig.26a and 26b As is apparent from FIG. 1 , when the electrical device 110 is incorporated into a suitable interlayer material sheet 112, the electrical device 110 can be moved along line H-H' instead of Fig.24 The electrical device thus produced is completely surrounded by the interlayer material 112 when in the hole 116 .

[0211] Fig. 27 A schematic cross-sectional representation of a laminated glazing 120 is shown. The laminated glazing comprises a first sheet of soda-lime-silica glass 122 having a thickness of 2.1 mm and a second sheet of soda-lime-silica glass 124 also having a thickness of 2.1 mm. The first sheet of soda-lime-silica glass 122 is coupled to the second sheet of soda-lime-silica glass by an interlayer ply 114 comprising an electrical device 110 secured in a hole 116 of a sheet of suitable interlayer material 112.

[0212] An expanded view of one end of the laminated glass window 120 is shown in FIG. Fig.28 1. A portion 114' of the interlayer ply 114 extends beyond the periphery of the first and second sheets of soda-lime-silica glass 122, 124. The portion 114' includes the end of the substrate 92 of the flexible circuit 90 having the third and fourth electrical connector regions 98, 100 thereon such that the third and fourth electrical connector regions 98, 100 are not between the first and second sheets of soda-lime-silica glass 122, 124. The first and second electrical connector regions 94, 96 are located between the first and second sheets of soda-lime-silica glass 122, 124, as is the electrically operable component 9. Access to the flexible circuit 90 is provided by removing a portion of the portion 114' by cutting along line J-J'.

[0213] Due to a weak bond between substrate 3 and substrate 92, for example, due to the provision of a re-bondable adhesive on the second major surface 92b of substrate 92 and / or the first major surface 5 of substrate 3 during production of the electrically operable device as described above (or there may be no bond between them), the end of the lower portion of the electrical device can be folded downward (i.e., in the direction of arrow 117), thereby allowing access to the third and fourth electrical connector areas 98, 100 on portion 92' of substrate 92 of the flexible circuit 90.

[0214] Since the substrate 92 is mechanically more rigid and / or mechanically stronger and / or mechanically / chemically more robust than the substrate 3, the addition of the flexible circuit 90 may allow a more reliable electrical connection to be made to power the electrically operable component 9. For example, if no additional flexible circuit is used, but the first and / or second electrical connector regions 11, 13 extend beyond the periphery of the first and second sheets of soda-lime-silica glass 122, 124, then there is a risk of damaging the first and / or second conductive tracks 15, 17 on the substrate 3 unless the tracks have appropriate mechanical robustness. Furthermore, without providing an additional flexible circuit 90, a portion of the substrate 3 may be exposed, making it possible to damage it and risk breaking any conductive tracks thereon. The provision of the flexible circuit 90 may reduce the occurrence of such damage, since the substrate 92 of the flexible circuit 90 is mechanically more rigid and / or mechanically stronger and / or mechanically / chemically more robust than the substrate 3.

[0215] The present invention provides an electrical device and a method for manufacturing the same. The electrical device can be incorporated into a sheet of interlayer material, and the interlayer ply so produced can be used in the manufacture of laminated glazing. Such interlayer glazing can be flat or curved and is particularly useful as a window for vehicles and / or buildings.

Claims

1. A method for manufacturing an electrical device, comprising the following steps: (i) providing an interlayer material layer having a first major surface and an opposing second major surface; (ii) positioning at least a first electrically operable component on a first major surface of the interlayer material layer, the first electrically operable component being mounted on a first circuit board; as well as (iii) providing a layer of adhesive material to cover at least a portion of the first major surface of the interlayer material layer and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board; such that after step (iii), the first electrically operable component is secured to the interlayer material layer by at least a portion of the adhesive material layer; Wherein, before step (iii), a flexible circuit is positioned on the interlayer material layer or the first circuit board, the flexible circuit comprising a substrate having a first main surface and an opposite second main surface, the first main surface or the second main surface of the substrate of the flexible circuit comprising a first electrical connector area thereon, the first electrical connector area being electrically connected to a second electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit through a conductive track; wherein the flexible circuit is positioned so that the second electrical connector area on the substrate of the flexible circuit is electrically connected to the first electrical connector area on the first circuit board.

2. The method according to claim 1, wherein: In step (ii), a first circuit board is positioned on the first major surface of the interlayer material layer such that the first circuit board is located between the interlayer material layer and the first electrically operable component.

3. The method according to claim 1 or claim 2, wherein: In step (iii), the adhesive material is provided as a liquid to provide the adhesive material layer.

4. The method according to claim 3, wherein: The liquid is provided by pouring or spraying.

5. The method according to claim 3, wherein: After step (iii), the liquid undergoes a solidification step.

6. The method according to claim 5, wherein the solidification step of the liquid comprises a setting step and / or a hardening step.

7. The method according to claim 5, wherein the solidification step of the liquid comprises a thermal heating step and / or a radiation step.

8. The method according to claim 5, wherein the step of curing the liquid comprises a step of ultraviolet irradiation.

9. The method according to claim 3, wherein: The liquid is leveled to achieve a uniform thickness relative to the interlayer material layer.

10. The method according to claim 3, wherein: The liquid is leveled to achieve a uniform thickness relative to the first major surface and / or the second major surface of the interlayer material layer.

11. The method according to claim 5, wherein: The surface of the solidified layer of adhesive material not facing the interlayer material layer is textured and / or provided with a coating.

12. The method according to claim 3, wherein: The liquid comprises a two-component system comprising at least a first component and a second component.

13. A method according to claim 12, wherein the first component is mixed with the second component before or after being provided during step (iii).

14. The method according to claim 1 or claim 2, wherein: The thickness of the adhesive material layer is between 0.3 mm and 3.0 mm, and / or the thickness of the interlayer material layer is between 0.3 mm and 2.0 mm, and / or the adhesive material layer covers the entire electrically operable component and / or the entire first circuit board.

15. The method according to claim 1 or claim 2, wherein: After step (i), a first barrier is provided on the first main surface of the interlayer material layer or around the periphery of the interlayer material layer, and after step (ii), at least a portion of the first circuit board is inside the first barrier.

16. The method of claim 15, wherein the first barrier surrounds the first circuit board such that the entire first circuit board is on the inner side of the first barrier.

17. The method according to claim 1 or claim 2, wherein: After step (ii), at least a second electrically operable component is positioned on the interlayer material layer, the second electrically operable component being mounted on the second circuit board, further wherein the second electrically operable component is spaced apart from the first electrically operable device and / or the first circuit board is spaced apart from the second circuit board.

18. The method according to claim 17, wherein: During step (iii), the layer of adhesive material also covers at least a portion of the second electrically operable component and / or at least a portion of the second circuit board.

19. The method of claim 18, wherein the layer of adhesive material also covers the entire second electrically operable component and / or the entire second circuit board.

20. The method according to claim 17, wherein: After step (iii), a second layer of adhesive material is provided to cover at least a portion of the second electrically operable component and / or at least a portion of the second circuit board.

21. The method of claim 20, wherein the second layer of adhesive material is provided as a liquid.

22. The method according to claim 1 or claim 2, wherein: After step (iii), at least a portion of the first circuit board on which the first electrically operable component is mounted is removed from the interlayer material layer to produce an electrical device as a sub-electrical device.

23. The method according to claim 1 or claim 2, wherein: After step (iii), at least a portion of the first circuit board on which the first electrically operable component is mounted is removed from the interlayer material layer by a cutting step or a punching step to produce an electrical device as a sub-electrical device.

24. The method of claim 1 or claim 2, wherein: The flexible circuit is positioned such that a second electrical connector area on the substrate of the flexible circuit is in mechanical communication with a first electrical connector area on the first circuit board.

25. The method of claim 1 or claim 2, wherein: The substrate of the flexible circuit includes a third electrical connector area on its first main surface or the second main surface, and the third electrical connector area is electrically connected to a fourth electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit through a conductive track; wherein the flexible circuit is positioned so that the fourth electrical connector area on the substrate of the flexible circuit is electrically connected to the second electrical connector area on the first circuit board.

26. The method of claim 25, wherein the flexible circuit is positioned such that a fourth electrical connector area on the substrate of the flexible circuit is in mechanical communication with a second electrical connector area on the first circuit board.

27. The method of claim 1 or claim 2, wherein: After step (iii), the method includes incorporating the electrical device into a hole in another interlayer material sheet, wherein incorporating the electrical device into the hole in another interlayer material sheet includes the following steps: providing an interlayer material sheet having a first major surface and an opposing second major surface; removing at least a first portion of the interlayer material sheet to make a hole in the interlayer material sheet, the hole in the interlayer material sheet having at least a first wall between the first major surface and the second major surface of the interlayer material sheet; positioning at least a portion of the electrical device in the hole; and fixing the electrical device to at least a portion of the first major surface and / or the second major surface of the interlayer material sheet and / or at least a portion of the first wall of the hole in the interlayer material sheet using a joining means.

28. The method according to claim 27, wherein: The entire electrical device is within said hole, and / or wherein said joining means comprises a fusion step and / or an adhesive.

29. The method of claim 1 or claim 2, wherein: In step (i), the interlayer material layer is provided as an interlayer material sheet.

30. The method of claim 1 or claim 2, wherein: The interlayer material includes polyvinyl butyral (PVB), a copolymer of ethylene, ethylene vinyl acetate (EVA), polyurethane, or thermoplastic polyurethane (TPU); and / or the adhesive material includes polyvinyl butyral (PVB), a copolymer of ethylene, ethylene vinyl acetate (EVA), polyurethane, or thermoplastic polyurethane (TPU).

31. An electrical device comprising: at least one electrically operable component mounted on a first circuit board, the first circuit board having a first major surface and an opposing second major surface; at least one interlaminar material layer having an outer major surface; as well as at least one layer of adhesive material having an outer major surface; wherein a first circuit board having the at least one electrically operable component mounted thereon is between an outer major surface of the at least one interlayer material layer and an outer major surface of the at least one adhesive material layer; Further, wherein the first circuit board is fixed to the at least one interlayer material layer by at least an adhesive material layer; It is characterized in that The electrical device has a first outer surface and an opposing second outer surface, wherein (a) a first outer surface of the electrical device comprises an outer major surface of the at least one interlaminar material layer, and a second outer surface of the electrical device comprises an outer major surface of the at least one adhesive material layer, or (b) a first outer surface of the electrical device comprises an outer major surface of the at least one adhesive material layer, and a second outer surface of the electrical device comprises an outer major surface of the at least one interlaminar material layer, wherein the electrically operable component has a first input terminal and a second input terminal for supplying power thereto, and wherein the first circuit board includes a first electrical connector area, the first electrical connector area of ​​the first circuit board being electrically connected to the first input terminal of the electrically operable device, further wherein the electrical device includes a flexible circuit, the flexible circuit including a substrate having a first main surface and an opposite second main surface, the first main surface or the second main surface of the substrate of the flexible circuit including a first electrical connector area thereon, the first electrical connector area being electrically connected to the second electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit through a conductive track, the first electrical connector area on the substrate of the flexible circuit being electrically and mechanically connected to the first electrical connector area on the first circuit board, so that when the second input terminal of the at least one electrically operable component is electrically connected to the first output terminal of a suitable power supply and the second electrical connector area of ​​the flexible circuit is electrically connected to the second output terminal of a suitable power supply, power is supplied to the at least one electrically operable component.

32. The electrical device of claim 31, wherein the first electrical connector region of the flexible circuit and the second electrical connector region of the flexible circuit are on a second major surface of the substrate of the flexible circuit.

33. The electrical device of claim 32, wherein the first electrical connector region of the flexible circuit is in electrical communication with the second electrical connector region of the flexible circuit via conductive tracks on the second major surface of the substrate of the flexible circuit.

34. An electrical device according to claim 31 or claim 32, wherein: The substrate of the flexible circuit includes a third electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit, the third electrical connector area is electrically connected to the fourth electrical connector area on the first main surface or the second main surface of the substrate of the flexible circuit through a conductive track, the third electrical connector area on the substrate of the flexible circuit is electrically and mechanically connected to the second electrical connector area on the first circuit board, and the second electrical connector area on the first circuit board is electrically connected to the second input terminal of the at least one electrically operable component, wherein when the fourth electrical connector area of ​​the flexible circuit is electrically connected to the first output terminal of a suitable power supply and the second electrical connector area of ​​the flexible circuit is electrically connected to the second output terminal of the suitable power supply, power is provided to the at least one electrically operable component.

35. The electrical device of claim 34, wherein the third electrical connector area of ​​the flexible circuit and the fourth electrical connector area of ​​the flexible circuit are on the second major surface of the substrate of the flexible circuit.

36. The electrical device of claim 35, wherein the third electrical connector region of the flexible circuit is in electrical communication with the fourth electrical connector region of the flexible circuit via conductive tracks on the second major surface of the substrate of the flexible circuit.

37. An electrical device according to claim 31 or claim 32, wherein: The second major surface of the substrate of the flexible circuit faces the first major surface of the first circuit board.

38. The electrical device of claim 37, wherein: The second major surface of the substrate of the flexible circuit is in direct contact with at least a portion of the first major surface of the first circuit board.

39. An electrical device according to claim 31 or claim 32, wherein temporary adhesive means is located between at least a portion of the first major surface of the first circuit board and the second major surface of the substrate of the flexible circuit.

40. An electrical device according to claim 39, wherein the temporary adhesive means is a re-stickable adhesive.

41. An electrical device according to claim 31 or claim 32, wherein: The electrical device is part of an interlayer layer, which is suitable for connecting two pieces of glass together, wherein the interlayer layer includes an interlayer material sheet having a first major surface and an opposite second major surface, there is a hole in the interlayer material sheet, the hole has a wall extending between the first major surface and the second major surface of the interlayer material sheet, and the electrical device is positioned in the hole in the interlayer material sheet and is joined to at least a portion of the wall of the hole and / or at least a portion of the first major surface and / or the second major surface of the interlayer material sheet.

42. The electrical device of claim 41, wherein the interlayer material sheet comprises polyvinyl butyral (PVB), a copolymer of ethylene, ethylene vinyl acetate (EVA), polyurethane, or thermoplastic polyurethane (TPU).

43. An electrical device according to claim 31 or claim 32, wherein: At least one of the at least one interlayer material layer and the at least one adhesive material layer includes polyvinyl butyral (PVB), a copolymer of ethylene, ethylene vinyl acetate (EVA), polyurethane, or thermoplastic polyurethane (TPU).

44. A laminated glazing comprising at least one sheet of glazing material and an electrical device according to claim 31 or claim 32, wherein the electrical device is coupled to the at least one sheet of glazing material via the at least one interlaminar material layer or the at least one adhesive material layer.

45. The laminated glazing unit of claim 44, wherein: The at least one sheet of glazing material is glass.

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