Techniques for processing diced wafers of integrated circuits

Abstract

A technique for processing an integrated circuit / tape assembly having a plurality of integrated circuits supported by an underlying dicing tape involves: placing the integrated circuit / tape assembly on a bottom file frame carrier (FFC) frame having a structure (e.g., an inner edge or a flexible peg); placing a top FFC frame having a central opening over the integrated circuit / tape assembly; and mating the top and bottom FFC frames such that the dicing tape is pulled on the structure, thereby laterally stretching the dicing tape, which causes a wafer saw frame holding the integrated circuits together to break. The lateral stretching of the dicing tape increases the distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby preventing the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than a conventional FFC configuration, which makes shipment and storage more efficient.

Description

Technical Field

[0001] The present invention relates to integrated circuits, and more particularly but not exclusively, to techniques for handling singulated wafers of integrated circuits for storage and shipment. Background Art

[0002] This section presents aspects that may aid in a better understanding of the present disclosure. Accordingly, statements in this section are to be read in this light and should not be construed as admitting what is or is not prior art.

[0003] In integrated circuit (IC) fabrication, it is known to form a number of instances of integrated circuits on a single substrate wafer, and subsequently separate those instances for packaging into individual packaged IC devices. In some IC fabrication techniques, after forming the integrated circuits on the wafer, a dicing tape is applied to one surface of the wafer, and plasma dicing is applied to the other side of the wafer to remove most but not all of the substrate material that holds the different instances of the integrated surface together. The remaining substrate material, referred to as a sawbow, is an elongated substrate material that connects adjacent integrated circuits. Next, the singulated wafer / tape assembly is fastened within a film frame carrier (FFC), which allows the dicing tape to be stretched in all directions within the plane of the wafer and thereby stretch the wafer, causing the sawbow to break and establishing a physical separation between adjacent integrated circuits. This stretching of the dicing tape requires fixation / fastening. Now the assembly consisting of the dicing tape that supports a number of separated integrated circuits and is fastened within the FFC can be stored and / or shipped for subsequent processing (i.e., packaging individual integrated circuits) without the risk of damage to the integrated circuits due to adjacent integrated circuits colliding with each other during movement of the assembly.

[0004] Figure 1 is a plan view of a conventional single-piece FFC frame 100 having a circular opening 102. The FFC frame 100, which can be made of metal or plastic, can hold the dicing tape, but is not usable for stretching the dicing tape and fixing the stretch alone.

[0005] Figure 2A is a cross-sectional side view showing a singulated wafer / tape assembly 210 having integrated circuits 212 interconnected by a sawbow 214 and supported by a dicing tape 216. As Figure 2A shown, an FFC outer ring 220 and Figure 1 the FFC frame 100 of are positioned above the assembly 210, and an FFC inner ring 230 is positioned below. The FFC outer clamping ring 220 and the inner clamping ring 230 form a clamping ring set that allows the dicing tape 216 to be stretched and fastened between the two rings, after which the FFC frame 100 can be cut off from the assembly. As Figure 2AAs shown, the inner diameter of both the FFC outer ring 220 and the circular opening 102 in the FFC frame 100 is slightly larger than the outer diameter of the FFC inner ring 230. It should be noted that the dicing tape 216 extends horizontally beyond the integrated circuit 212 such that at least some of the bottom surfaces of the FFC frame 100 rest on the periphery of the dicing tape 216. To secure the component 210 within the FFC frame 100, for example, an eccentric press (not shown) is used to push the FFC inner ring 230 through the circular opening 102 of the FFC frame 100 and into the FFC outer ring 220.

[0006] Figure 2B is a cross-sectional side view of the configuration after the FFC inner ring 230 has been pushed into the FFC outer ring 220. When the FFC inner ring 230 is pushed through the circular opening 102 of the FFC frame 100 and into the FFC outer ring 220, the tight fit between those components ensures that the dicing tape 216 is stretched horizontally, thereby causing Figure 2A the saw frame 214 to break and leaving a gap 215 between adjacent integrated circuits 212 in the resulting integrated circuit / tape assembly 240, which is now secured to the FFC frame 100 as an assembly 250 for further processing (e.g., storage and / or shipment). Figure 2A is a cross-sectional side view of three instances of the assembly 250 that are stacked on top of each other for storage and / or shipment.

[0007] Figure 2C is a cross-sectional side view of three instances of the assembly 250 that are stacked on top of each other for storage and / or shipment. Figure 2B is a cross-sectional side view of three instances of the assembly 250 that are stacked on top of each other for storage and / or shipment.

[0008] Figure 1 - One of the problems in conventional FFCs with -2 is that the height of the resulting assembly 250 is undesirably large. In a typical embodiment, Figure 2B the height of the conventional assembly 250 is approximately 3.5 mm. Thus, the assembly 250 occupies a relatively large volume of space for shipment and storage. In addition, the clamping rings 220 and 230 are expensive compared to the cost of the FFC frame 100.

[0009] Figure 2D is a cross-sectional side view of the assembly 260 after (i) the dicing tape 216 at the junction between the FFC frame 100 and the two concentric rings 220 and 230 has been cut off and (ii) the FFC frame 100 has been removed. These steps are performed after shipment and / or storage and just before the assembly 260 is placed into a die bonder. This technique is not preferred for high-density wafers and / or for wafers having a diameter of 300 mm or greater than 300 mm. Figure 2B is a cross-sectional side view of the assembly 260 after (i) the dicing tape 216 at the junction between the FFC frame 100 and the two concentric rings 220 and 230 has been cut off and (ii) the FFC frame 100 has been removed. These steps are performed after shipment and / or storage and just before the assembly 260 is placed into a die bonder. This technique is not preferred for high-density wafers and / or for wafers having a diameter of 300 mm or greater than 300 mm. SUMMARY OF THE INVENTION

[0010] According to a first aspect of the present invention, there is provided an apparatus for holding an integrated circuit / tape assembly including a plurality of integrated circuits supported by a lower dicing tape, the apparatus comprising:

[0011] a top film frame carrier (FFC) frame having a central opening; and

[0012] a bottom FFC frame having a structure on which the dicing tape is latched when the top and bottom FFC frames are mated with the integrated circuit / tape assembly, thereby laterally stretching the dicing tape.

[0013] In one or more embodiments, the lateral stretching of the dicing tape occurs in at least two mutually orthogonal lateral directions to break a wafer saw frame that holds the integrated circuits together.

[0014] In one or more embodiments, the central opening in the top FFC frame is a circular opening for receiving the integrated circuits in the integrated circuit / tape assembly.

[0015] In one or more embodiments, the bottom FFC frame has a circular central opening.

[0016] In one or more embodiments, the apparatus further includes a structure for holding the mated top and bottom FFC frames together.

[0017] In one or more embodiments, the structure is a barbed stud integral with the bottom FFC frame and configured to be inserted through a peripheral hole in the top FFC frame.

[0018] In one or more embodiments, the structure is a barbed stud configured to be inserted through a peripheral hole in the bottom FFC frame and a corresponding peripheral hole in the top FFC frame.

[0019] In one or more embodiments, the structure is a barbed structure integral with the bottom FFC frame and configured to engage the periphery of the top FFC frame.

[0020] In one or more embodiments, the lateral stretching of the dicing tape increases the distance between adjacent integrated circuits, thereby preventing the adjacent integrated circuits from colliding during shipment or storage.

[0021] In one or more embodiments, the inner diameter of the central opening in the top FFC is greater than the outer diameter of the structure of the bottom FFC such that when the bottom FFC is mated to the top FFC, the dicing tape is stretched over the structure.

[0022] In one or more embodiments, the structure includes a plurality of flexible studs that stretch the dicing tape and fasten the matching top and bottom FFC frames together.

[0023] According to a second aspect of the present invention, there is provided a method for processing an integrated circuit / tape assembly including a plurality of integrated circuits supported by a lower dicing tape, the method comprising:

[0024] Placing the integrated circuit / tape assembly on a bottom FFC frame having a structure;

[0025] Placing a top FFC frame having a central opening above the integrated circuit / tape assembly; and

[0026] Matching the top and bottom FFC frames such that the dicing tape is pulled on the structure, thereby laterally stretching the dicing tape.

[0027] In one or more embodiments, the lateral stretching of the dicing tape occurs in at least two mutually orthogonal lateral directions to break a wafer saw frame that holds the integrated circuits together.

[0028] In one or more embodiments, the central opening in the top FFC frame is a circular opening for receiving the integrated circuits in the integrated circuit / tape assembly.

[0029] In one or more embodiments, the bottom FFC frame has a circular central opening.

[0030] In one or more embodiments, the method further includes using a structure to hold the matching top and bottom FFC frames together.

[0031] In one or more embodiments, the structure is a barbed stud that is integral with the bottom FFC frame and inserted through peripheral holes in the top FFC frame.

[0032] In one or more embodiments, the structure is a barbed stud inserted through peripheral holes in the bottom FFC frame and corresponding peripheral holes in the top FFC frame.

[0033] In one or more embodiments, the structure is a barbed structure that is integral with the bottom FFC frame and engages the periphery of the top FFC frame.

[0034] In one or more embodiments, the lateral stretching of the dicing tape increases the distance between adjacent integrated circuits, thereby preventing the adjacent integrated circuits from colliding during shipping or storage.

[0035] In one or more embodiments, the structure includes an edge, and an inner diameter of the central opening in the top FFC is greater than an outer diameter of the edge of the bottom FFC such that when the bottom FFC is mated to the top FFC, the dicing tape is stretched over the edge.

[0036] In one or more embodiments, the structure includes a plurality of flexible studs that stretch the dicing tape and fasten the mated top and bottom FFC frames together.

[0037] These and other aspects of the invention will be apparent from, and elucidated with reference to, the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Embodiments of the present disclosure will become more fully apparent from the following detailed description, the appended claims, and the accompanying drawings in which like reference numerals identify similar or identical elements.

[0039] Figure 1 is a plan view of a conventional single-piece FFC frame;

[0040] Figure 2A is a cross-sectional side view of a diced wafer / tape assembly having an FFC outer ring positioned above the components and Figure 1 an FFC frame and an FFC inner ring positioned below;

[0041] Figure 2B is a cross-sectional side view of the configuration after the FFC inner ring has been pushed into the FFC outer ring Figure 2A ;

[0042] Figure 2C is a cross-sectional side view of three instances of the components stacked on top of each other for storage and / or shipment Figure 2B ;

[0043] Figure 2D is a cross-sectional side view of the assembly after (i) the dicing tape at the junction between the FFC frame and the two concentric rings has been cut away and (ii) the FFC frame has been removed Figure 2B ;

[0044] Figure 3A and 3B show corresponding plan views of a top FFC frame and a bottom FFC frame of a membrane frame carrier according to one embodiment of the present disclosure;

[0045] Figure 4A is a top FFC frame located above the bottom FFC frame along Figure 3A and 3BCross-sectional side view of the cutting line A-A;

[0046] Figure 4B is a cross-sectional side view corresponding to after the top and bottom FFC frames have been joined with the cutting wafer / tape assembly positioned therebetween and mated together, the cutting wafer / tape assembly being similar to Figure 4A the assembly of; Figure 2A ;

[0047] Figure 4C is Figure 4A and 4B a cross-sectional side view of the integrated circuit / tape assembly with the top and bottom FFC frames joined and positioned therebetween and mated together; Figure 2B ;

[0048] Figure 5 is a cross-sectional side view of a top FFC frame mated to a bottom FFC frame according to another embodiment of the present disclosure, the bottom FFC frame stretching the dicing tape of the cutting wafer / tape assembly positioned therebetween;

[0049] Figure 6 is a cross-sectional side view of a top FFC frame mated to a bottom FFC frame according to yet another embodiment of the present disclosure, the bottom FFC frame stretching the dicing tape of the cutting wafer / tape assembly positioned therebetween;

[0050] Figure 7A is a cross-sectional side view of a top FFC frame mated to a bottom FFC frame according to yet another embodiment of the present disclosure, the bottom FFC frame stretching the dicing tape of the cutting wafer / tape assembly positioned therebetween;

[0051] Figure 7B is Figure 7A a plan view of the top FFC frame of;

[0052] It should be noted that the figures in the present disclosure are not necessarily drawn to scale. Detailed Description

[0053] Illustrative embodiments of the present disclosure are disclosed herein. However, for the purpose of describing example embodiments of the present disclosure, the specific structural and functional details disclosed herein are merely representative. The present disclosure may be embodied in many alternative forms and should not be construed as limited to the embodiments set forth herein. Additionally, the terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the example embodiments of the present disclosure.

[0054] As used herein, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" also include the plural forms. It will also be understood that the terms "comprises," "comprising," "includes," and / or "including" specify the presence of the stated features, steps, or components, but do not preclude the presence or addition of one or more other features, steps, or components. It should also be noted that in some alternative embodiments, the functions / actions recited may not occur in the order noted in the figures. For example, depending on the functions / actions involved, two figures shown as consecutive may in fact be performed substantially simultaneously or sometimes in the reverse order.

[0055] Figure 3A and 3B shows respective plan views of a top FFC frame 310 and a bottom FFC frame 330 of a film frame carrier according to an embodiment of the present disclosure. As Figure 3A and 3B represented herein and further explained below, the bottom FFC frame 330 has a plurality of barbed studs 334 positioned around its periphery, and the top FFC frame 310 has a corresponding number of corresponding stud holes 314 positioned around its periphery. Additionally, each FFC frame 310 / 330 has a corresponding circular opening 312 / 332, and the bottom FFC frame 330 has a circular inner edge 336.

[0056] Figure 4A is a cross-sectional side view of the top FFC frame 310 positioned above the bottom FFC frame 330 along Figure 3A and 3B cutting line A-A. As Figure 4A shown, the barbed studs 334 of the bottom FFC frame 330 are aligned with the stud holes 314 of the top FFC frame 310. The barbed studs 334 have two opposing barbed teeth that deflect inwardly into the stud holes 314 when the top and bottom FFC frames are mated together. The bottom FFC frame 330 also has a circular inner edge 336 that aids in aligning the two FFC frames when they are mated together. It should be noted that the diameter of the circular opening 332 of the top FFC frame 310 is slightly larger than the outer diameter of the edge 336 of the bottom FFC frame 330, such that there will be a gap between the inner surface 318 of the top FFC frame 310 and the outer surface 338 of the edge 336 of the bottom FFC frame 330 when the two frames are mated together.

[0057] Figure 4B is corresponding to after the top FFC frame 310 and the bottom FFC frame 330 have been joined with a cutting wafer / tape assembly positioned therebetween and mated togetherFigure 4A Cross-sectional side view of the view, the diced wafer / tape assembly being similar to Figure 2A assembly 210, where Figure 4B only the dicing tape 216 of assembly 210 is shown. The ellipsis (...) indicates the remainder of assembly 210 / 240 is to the Figure 4B right of the view. Figure 4B Shows the barbed stud 334 of the bottom FFC frame 330 fully engaged within the stud hole 314 of the top FFC frame 310, where the barbed teeth keep the two FFC frames always mated together. Figure 4B Also shown is a gap 340 between the inner surface 318 of the top FFC frame 310 and the outer surface 338 of the edge 336 of the bottom FFC frame 330. When the two FFC frames 310 and 330 are mated together with the assembly 210 therebetween, the dicing tape 216 is pulled on the edge 336 of the bottom FFC frame 330, thereby laterally stretching the dicing tape 216 in all directions such that the saw frame 214 of assembly 210 breaks and creates Figure 2B a gap 215 between the integrated circuits 212. The mated FFC frames along with the intervening integrated circuit / tape assembly can then be processed for storage and / or shipment for subsequent processing.

[0058] Figure 4C is a cross-sectional side view of the top FFC frame 310 and the bottom FFC frame 330 mated together with the Figure 2B integrated circuit / tape assembly 240 positioned therebetween.

[0059] As Figure 4A - 4C shown, the bottom FFC frame 330 can have optional grooves 342 that allow Figure 4B multiple instances of the assembly to be stacked on top of each other for shipment and / or storage.

[0060] Figure 5 is a cross-sectional side view of the top FFC frame 510 mated to the bottom FFC frame 530 according to another embodiment of the present disclosure, the bottom FFC frame 530 stretching the dicing tape 216 of the intervening assembly 210 / 240. Different from Figure 3A and 4A -4C's bottom FFC frame 330 where the barbed stud 334 is integral with the bottom FFC frame, in Figure 5 the embodiment of, the barbed stud 550 is a separate element inserted through a hole 540 in the bottom FFC frame 530 and then through a corresponding hole 514 in the top FFC frame 510. It should be noted that the top FFC frame 510 can be the same as Figure 3B and 4A-4C has the same top FFC frame 310, and the bottom FFC frame 530 has a similar Figure 3A and 4A -4C bottom FFC frame 330 edge 336 edge 536. Ellipses (...) indicate the remainder of assembly 210 / 240 is at Figure 5 to the right of the view.

[0061] Figure 6 is a cross-sectional side view of a top FFC frame 610 mated to a bottom FFC frame 630 that stretches the dicing tape 216 of the intervening assembly 210 / 240 in accordance with yet another embodiment of the present disclosure. In this embodiment, the top FFC frame 610 need not have any peripheral holes similar to the holes 314 and 514 of the previous embodiments. Instead, the bottom FFC frame 630 has an external barbed structure 642 having a barbed top 644 that engages the outer diameter of the top FFC frame 610 and holds the mating FFC frames 610 and 630 together. Here, the bottom FFC frame 630 also has an edge 636 similar to the edges 336 and 536 of the previous embodiments. The ellipsis (...) indicates that the remainder of the assembly 210 / 240 is in Figure 6 to the right of the view.

[0062] Figure 7A 7 is a cross-sectional side view of a top FFC frame 710 mated to a bottom FFC frame 730 that stretches the dicing tape 216 of the intervening assembly 210 / 240 according to yet another embodiment of the present disclosure. In this embodiment, instead of an edge as in the previous embodiment, the bottom FFC frame 730 has a plurality of flexible pegs 736 positioned around the inner edge of the frame that perform the dual function of stretching the dicing tape 216 and fastening the two FFC frames 710 and 730 together. Figure 7A The arrows in the figure indicate the direction in which the flexible peg 736 bends when the two FFC frames are mated together. The ellipsis (...) indicates that the rest of the assembly 210 / 240 is in Figure 7A to the right of the view.

[0063] Figure 7B yes Figure 7A A plan view of the top FFC frame 710. Figure 7B As shown, the top FFC frame 710 has a plurality of notches 716 located around the inner edge of the frame and corresponding to the locations of the flex pegs 736 of the bottom FFC frame 730, wherein the notches 716 receive the flex pegs 736 to support mating the frames together.

[0064] In some embodiments, the FFC top frames 310, 510, and 610, the FFC bottom frames 330, 530, and 630, and the barbed studs 550 are made of a suitable type of plastic and formed by injection molding.

[0065] In some embodiments, the height of the FFC of the present disclosure, as indicated by the height of the corresponding structures 334, 550, 642, or 736, is approximately 3 mm. In this way, the height of the two-piece FFC of the present disclosure can be substantially equal to the height of the prior art FFC described above.

[0066] Although the present disclosure has been described in the context of an FFC in which the FFC frame has a circular opening, in alternative embodiments, the FFC frame can have an opening of a suitable shape other than circular (e.g., rectangular) as long as the edge of the bottom FFC frame or the flexible stud forms a suitable shape for stretching the dicing tape of the wafer / tape assembly in a proper manner. It should be noted that the circular or non-circular shape formed by the edge or the flexible stud should stretch the dicing tape at least in directions orthogonal to each other corresponding to the rows and columns of the IC dice on the diced wafer so as to break Figure 2A the saw frame 214.

[0067] Although the present disclosure has been described in the context of an FFC in which barbed structures 334, 550, and 642 are used to hold the top and bottom FFC frames together, in alternative embodiments, other mechanisms such as clips or clamps applied around the periphery of the matching FFC frames are used to hold the top and bottom FFC frames together. In some embodiments, the matching FFC frames can be held together by a friction fit between the intermediate dicing tape 216 in the gap (e.g., Figure 4B 340) between the top and bottom FFC frames and the filled FFC frame.

[0068] According to certain embodiments, there is disclosed an apparatus for holding an integrated circuit / tape assembly including a plurality of integrated circuits supported by a lower dicing tape. The apparatus includes: (i) a top film frame carrier (FFC) frame having a central opening; and (ii) a bottom FFC frame having a structure, wherein when the top and bottom FFC frames are mated together with the integrated circuit / tape assembly, the dicing tape is pulled on the structure, thereby stretching the dicing tape laterally.

[0069] According to certain embodiments, a method for processing an integrated circuit / tape assembly including a plurality of integrated circuits supported by a lower dicing tape is disclosed. The method includes (i) placing the integrated circuit / tape assembly on a bottom FFC frame having a structure; (ii) placing a top FFC frame having a central opening over the integrated circuit / tape assembly; and (iii) matching the top and bottom FFC frames so that the dicing tape is pulled on the structure, thereby stretching the dicing tape laterally.

[0070] Unless expressly stated otherwise, each numerical value and range should be interpreted as approximations as if the value or range were preceded by the word "about" or "approximately."

[0071] It will be further understood that persons skilled in the art may make various changes in the details, materials and arrangements of parts that have been described and shown to explain embodiments of the present disclosure without departing from the embodiments of the present disclosure covered by the appended claims.

[0072] In this specification, including any claims, the term "each" may be used to refer to one or more specified characteristics of a plurality of previously recited elements or steps. When used with the open-ended term "comprising," the recitation of the term "each" does not exclude additional unlisted elements or steps. Thus, it should be understood that an apparatus may have additional unlisted elements, and a method may have additional unlisted steps, where the additional unlisted elements or steps do not have the one or more specified characteristics.

[0073] The use of figure numbers and / or figure reference signs in the claims is intended to identify one or more possible embodiments of the claimed subject matter in order to facilitate the interpretation of the claims. Such use should not be construed as necessarily limiting the scope of those claims to the embodiments shown in the corresponding figures.

[0074] It should be understood that the steps of the exemplary methods set forth herein are not necessarily required to be performed in the order described, and the order of the steps of such methods should be understood to be exemplary only. Likewise, additional steps may be included in such methods, and certain steps may be omitted or combined in methods consistent with various embodiments of the present disclosure.

[0075] Although elements in the accompanying method claims, if present, are recited in a specific sequence by corresponding labels, those elements are not necessarily limited to being implemented in that specific sequence unless the claim recitation otherwise implies a specific sequence for implementing some or all of those elements.

[0076] All documents mentioned herein are hereby incorporated by reference in their entirety, or for the disclosure content for which specific reliance is given.

[0077] As used herein, the phrase "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The phrase "in one embodiment" that appears in various places in this specification does not necessarily refer to the same embodiment, nor is it necessarily a separate or alternative embodiment that is mutually exclusive with other embodiments. The same applies to the term "embodiment".

[0078] In the present application, the embodiments covered by the claims are limited to (1) the embodiments implemented by this specification and (2) the embodiments corresponding to statutory subject matter. Even within the scope of the claims, embodiments that are not implemented and embodiments corresponding to non-statutory subject matter are expressly disclaimed.

[0079] Unless otherwise specified herein, the use of the ordinal adjectives "first", "second", "third", etc. to refer to objects among a plurality of similar objects only indicates different instances of such similar objects being referred to, and does not imply that the similar objects so referred to must be in a corresponding order or sequence in time, in space, in ranking, or in any other way.

Claims

1. An apparatus for holding an integrated circuit / tape assembly including a plurality of integrated circuits supported by a lower dicing tape, characterized in that, The device includes: A top film frame carrier FFC frame having a central opening; and A bottom FFC frame having a structure, wherein when the top and bottom FFC frames are mated with the integrated circuit / tape assembly, the dicing tape is held on the structure, thereby laterally stretching the dicing tape. Wherein the device further includes a structure for holding the mated top and bottom FFC frames together. And wherein the structure is a barbed peg integral with the bottom FFC frame and configured to be inserted through peripheral holes in the top FFC frame.

2. The device according to claim 1, characterized in that, The lateral stretching of the dicing tape occurs in at least two mutually orthogonal lateral directions to break the wafer saw frame holding the integrated circuits together.

3. The device according to claim 1, characterized in that, The central opening in the top FFC frame is a circular opening for receiving the integrated circuit in the integrated circuit / tape assembly.

4. The device according to claim 3, characterized in that, The bottom FFC frame has a circular central opening.

5. The device according to claim 1, characterized in that, The lateral stretching of the dicing tape increases the distance between adjacent integrated circuits, thereby preventing the adjacent integrated circuits from colliding during shipment or storage.

6. The device according to claim 1, characterized in that, The inner diameter of the central opening in the top FFC is greater than the outer diameter of the structure of the bottom FFC such that when the bottom FFC is mated to the top FFC, the dicing tape is stretched over the structure.

7. The device according to claim 1, characterized in that, The structure includes a plurality of flexible pegs that stretch the dicing tape and fasten the mated top and bottom FFC frames together.

8. A method for processing an integrated circuit / tape assembly including a plurality of integrated circuits supported by an underlying dicing tape, characterized in that, The method includes: Placing the integrated circuit / tape assembly on a bottom FFC frame having a structure; Placing a top FFC frame having a central opening over the integrated circuit / tape assembly; and Mating the top and bottom FFC frames such that the dicing tape is held on the structure, thereby laterally stretching the dicing tape. Wherein the method further includes using a structure to hold the mated top and bottom FFC frames together. And wherein the structure is a barbed peg integral with the bottom FFC frame and inserted through peripheral holes in the top FFC frame.

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