Display device

Abstract

A display device is provided. The display device includes a display panel including a plurality of pixels, a panel lower plate disposed on one face of the display panel and including a flat coil, and a bracket disposed apart from the display panel, the panel lower plate being sandwiched between the bracket and the display panel, and the bracket being provided with a magnet.

Description

Technical Field

[0001] This invention relates to display devices. Background Technology

[0002] With the development of the information society, the requirements for display devices used to display images are increasing in various ways. For example, display devices are used in various electronic devices such as smartphones, digital cameras, laptops, navigators, and smart TVs. Display devices may include display panels for displaying images and sound generating devices for providing sound.

[0003] The sound generating device has a predetermined volume in order to produce vibrations. Various studies are underway to reduce the volume of the sound generating device, especially its thickness. Summary of the Invention

[0004] The problem to be solved by the present invention is to provide a display device that reduces the thickness of the sound generating device to reduce the overall thickness.

[0005] The subject matter of this invention is not limited to the subject matter mentioned above, and those skilled in the art should be able to understand other subject matters not mentioned through the following description.

[0006] An embodiment of the display device for solving the aforementioned problem includes: a display panel including a plurality of pixels; a lower panel disposed on one side of the display panel and including a flat coil; and a bracket disposed away from the display panel and clamping the lower panel between the bracket and the display panel, the bracket being provided with a magnet.

[0007] Alternatively, the flat coil may be disposed inside the lower plate of the panel.

[0008] Alternatively, the lower panel may include a heat dissipation layer, and the flat coil may be disposed on the same layer as the heat dissipation layer.

[0009] The heat dissipation layer may include a lower heat dissipation layer and an upper heat dissipation layer disposed between the lower heat dissipation layer and the display panel. The lower heat dissipation layer may include copper or silver, and the upper heat dissipation layer may include graphite or carbon nanotubes.

[0010] Alternatively, the lower heat dissipation layer and the flat coil may be disposed on the same layer, and the lower heat dissipation layer may be disposed away from the flat coil.

[0011] Alternatively, the upper heat dissipation layer and the flat coil may be disposed on the same layer, and the upper heat dissipation layer may be disposed away from the flat coil.

[0012] Alternatively, the magnet may be configured to overlap with the flat coil in the thickness direction.

[0013] Alternatively, the bracket may include a first bracket area where the magnet is disposed and a second bracket area where the magnet is not disposed, the first bracket area having a shape that is recessed further downward than the second bracket area, and the magnet being attached to and embedded in the first bracket area.

[0014] It may also include a speaker frame disposed on and covering the magnet and the flat coil.

[0015] It may also include a damper disposed between the second bracket area and the speaker frame and connected to both the second bracket area and the speaker frame.

[0016] Alternatively, the magnet may be disposed inside the bracket.

[0017] It may also include a buffer component disposed between the lower panel and the bracket, the buffer component being connected to the lower panel and the bracket.

[0018] It may also include a printed circuit board attached to one end of the display panel and bent and disposed between the bracket and the lower plate of the panel, wherein the flat coil is electrically connected to the printed circuit board via a connecting member.

[0019] Other embodiments for solving the aforementioned problem involve a display device comprising: a display panel including a plurality of pixels; a lower panel plate disposed on one side of the display panel and including a flat coil; a bracket disposed away from the display panel and clamping the lower panel plate between the bracket and the display panel, the bracket being provided with a magnet; and a printed circuit board attached to one end of the display panel and bent and disposed between the bracket and the lower panel plate, the flat coil being disposed overlapping the magnet in the thickness direction, and the printed circuit board being disposed overlapping the flat coil in the thickness direction.

[0020] Alternatively, the flat coil may be disposed inside the printed circuit board.

[0021] Alternatively, the flat coil may be disposed between the printed circuit board and the lower panel of the panel, and attached to the printed circuit board.

[0022] Alternatively, the flat coil may be disposed between the printed circuit board and the magnet, and attached to the printed circuit board.

[0023] Alternatively, the flat coil may be disposed inside the lower plate of the panel.

[0024] Alternatively, the lower panel may include a heat dissipation layer, which includes a lower heat dissipation layer and an upper heat dissipation layer disposed between the lower heat dissipation layer and the display panel. The lower heat dissipation layer may include copper or silver, and the upper heat dissipation layer may include graphite or carbon nanotubes.

[0025] Alternatively, the flat coil may be disposed on the same layer as the lower heat dissipation layer or the upper heat dissipation layer.

[0026] (Invention Effects)

[0027] According to one embodiment of the display device, the overall thickness can be reduced. The effects of each embodiment are not limited to those illustrated above, and further effects are included in this specification. Attached Figure Description

[0028] Figure 1 This is a perspective view illustrating a display device according to an embodiment.

[0029] Figure 2 This is an exploded perspective view of a display device according to an embodiment.

[0030] Figure 3 It means attached to Figure 2 A bottom view of an example of a display panel with a cover window.

[0031] Figure 4 It's enlarged. Figure 3 The diagram of region A.

[0032] Figure 5 It means attached to Figure 3 The bottom view of an example of the bracket at the bottom of the display panel and the main circuit board configured on the bracket.

[0033] Figure 6 It is along Figure 3 A sectional view taken from line I-I'.

[0034] Figure 7 It is a detailed representation Figure 6 A cross-sectional view of the display area of ​​the display panel.

[0035] Figure 8 It's enlarged. Figure 6 The diagram of region B.

[0036] Figure 9 It is along Figure 3 A sectional view taken from line II-II'.

[0037] Figure 10 This is a plan view of the fixed magnetic field generating component involved in other embodiments.

[0038] Figure 11 yes Figure 10 A sectional view.

[0039] Figure 12 as well as Figure 13 It is a plan view of the deformation of the fixed magnetic field generating component.

[0040] Figure 14 This is a cross-sectional view of a display device involved in other embodiments.

[0041] Figure 15 It means attached to Figure 2 Bottom view of another embodiment of the display panel of the overlay window.

[0042] Figure 16 Other embodiments involve along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0043] Figure 17 This is yet another embodiment involving along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0044] Figure 18 This is yet another embodiment involving along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0045] Figure 19 This is a cross-sectional view of a display device according to yet another embodiment.

[0046] Figure 20 This is a cross-sectional view of a display device according to yet another embodiment.

[0047] Figure 21 This is a cross-sectional view of a display device according to yet another embodiment.

[0048] Figure 22 This is yet another embodiment involving along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0049] (Symbol Explanation)

[0050] 10: Display device; 100: Covering window; 300: Display panel; 310: Display circuit board; 320: Display driving circuit; 330: Touch driving circuit; 340: Audio driving unit; 400: Lower panel; 510: Sensing magnetic field generating component; 520: Fixed magnetic field generating component. Detailed Implementation

[0051] References and Appendix Figure 1As will become clear from the detailed description of the embodiments described below, the advantages, features, and methods of achieving these advantages and features of the invention will become apparent. However, the invention is not limited to the embodiments disclosed below and may be implemented in various forms. The embodiments are provided merely to complete the disclosure of the invention and to fully inform those skilled in the art of the scope of the invention. The invention should be defined only by the scope of the claims.

[0052] The presence of elements or layers on other elements or layers includes not only cases where they are directly on other elements, but also cases where other layers or elements exist in between. Throughout this specification, the same symbol refers to the same constituent element. The shapes, sizes, ratios, angles, numbers, etc., disclosed in the drawings used to illustrate the various embodiments are illustrative, and the invention is not limited to the illustrated cases.

[0053] Although terms such as "first" and "second" can be used to describe various constituent elements, these constituent elements should not be limited to these terms. These terms are only used to distinguish one constituent element from another. Therefore, the "first constituent element" mentioned below can, of course, also be a "second constituent element" within the technical concept of this invention.

[0054] The various features of the embodiments of the present invention can be partially or completely combined with each other, and various linkages and drives can be realized technically. The embodiments can be implemented independently of each other, or they can be implemented together in an associated relationship.

[0055] Figure 1 This is a perspective view illustrating a display device according to an embodiment. Figure 2 This is an exploded perspective view of a display device according to an embodiment.

[0056] Reference Figure 1 as well as Figure 2 One embodiment of the display device 10 includes a cover window 100, a display panel 300, a display circuit board 310, a display driving circuit 320, a flexible film 390, a magnetic field generating component 510, a bracket 600, a main circuit board 700, and a lower cover 900. Another embodiment of the display device 10 may further include a sound generating device. The sound generating device may include the magnetic field generating component 510 and the fixed magnetic field generating component 520, described later.

[0057] In this specification, "upper part" refers to the direction in which the cover window 100 is arranged with the display panel 300 as a reference, i.e., the Z-axis direction, and "lower part" refers to the direction in which the bracket 600 is arranged with the display panel 300 as a reference, i.e., the opposite direction of the Z-axis direction. Furthermore, "left," "right," "up," and "down" refer to the directions when viewing the display panel 300 on a flat surface. For example, "left" refers to the opposite direction of the X-axis direction, "right" refers to the X-axis direction, "up" refers to the Y-axis direction, and "down" refers to the opposite direction of the Y-axis direction.

[0058] The display device 10 can be formed into a rectangular shape on a plane. For example, the display device 10 can be as follows: Figure 1 as well as Figure 2 The display device 10 has a rectangular planar shape, as shown, comprising a short side in the first direction (X-axis direction) and a long side in the second direction (Y-axis direction). The corner where the short side in the first direction (X-axis direction) and the long side in the second direction (Y-axis direction) meet can be rounded with a predetermined curvature, or it can be formed as a right angle. The planar shape of the display device 10 is not limited to a rectangle; it can be formed as other polygons, circles, or ellipses.

[0059] The display device 10 may include a first region DR1 formed flat and a second region DR2 extending from the left and right sides of the first region DR1. The second region DR2 may be formed flat or curved. When the second region DR2 is formed flat, the angle between the first region DR1 and the second region DR2 may be an obtuse angle. When the second region DR2 is formed curved, it may have a fixed curvature or a variable curvature.

[0060] exist Figure 1 The diagram shows the second region DR2 extending from the left and right sides of the first region DR1, but it is not limited to this. That is, the second region DR2 may extend from only one of the left and right sides of the first region DR1. Alternatively, the second region DR2 may extend not only from the left and right sides of the first region DR1, but also from one of the top and bottom sides. Hereinafter, the description will focus on the case where the second region DR2 is positioned at the left and right edges of the display device 10.

[0061] The cover window 100 can be configured on the upper part of the display panel 300 to cover the upper surface of the display panel 300. Thus, the cover window 100 can function to protect the upper surface of the display panel 300.

[0062] The cover window 100 may include a transmissive portion DA100 corresponding to the display panel 300 and a light-shielding portion NDA100 corresponding to an area other than the display panel 300. The cover window 100 may be disposed in a first region DR1 and a second region DR2. The transmissive portion DA100 may be disposed in a portion of the first region DR1 and a portion of the second region DR2. The light-shielding portion NDA100 may be formed as opaque. Alternatively, the light-shielding portion NDA100 may be formed of a decorative layer having a pattern that can be viewed by the user when no image is displayed.

[0063] The display panel 300 can be disposed at the lower part of the cover window 100. The display panel 300 can be disposed overlapping with the transparent portion DA100 of the cover window 100. The display panel 300 can be disposed in a first region DR1 and a second region DR2. Thus, the image of the display panel 300 can be viewed not only in the first region DR1, but also in the second region DR2.

[0064] Display panel 300 can be a light-emitting display panel that includes a light-emitting element. For example, display panel 300 can be an organic light-emitting display panel that uses an organic light-emitting diode (OLED) including an organic light-emitting layer, an ultra-small light-emitting diode (µLED) display panel that uses a micro LED, a quantum dot light-emitting display panel that uses a quantum dot light-emitting diode (QLED) including a quantum dot light-emitting layer, or an inorganic light-emitting display panel that uses an inorganic light-emitting element that includes an inorganic semiconductor. Hereinafter, the description will focus on the case where display panel 300 is an organic light-emitting display panel.

[0065] A display circuit board 310 and a display driving circuit 320 can be attached to one side of the display panel 300. One end of the display circuit board 310 can be attached to a pad disposed on one side of the display panel 300 using an anisotropic conductive film. The display circuit board 310 can be a flexible printed circuit board (FPCB), a rigid printed circuit board (PCB), or a composite printed circuit board including a rigid printed circuit board and a flexible printed circuit board.

[0066] The display driving circuit 320 receives control signals and power supply voltage from the display circuit board 310, and generates signals and voltages for driving the display panel 300 for output. The display driving circuit 320 is formed of an integrated circuit (IC) and can be attached to the display panel 300 via COG (chip on glass), COP (chip on plastic), or ultrasonic methods, but is not limited to these methods. For example, the display driving circuit 320 can be attached to the display circuit board 310. A touch driving circuit 330 and an audio driving unit 340 can be configured on the display circuit board 310.

[0067] The touch driving circuit 330 can be formed by an integrated circuit and attached to the upper surface of the display circuit board 310. The touch driving circuit 330 can be electrically connected to the touch electrodes of the touch sensing layer of the display panel 300 through the display circuit board 310. The touch driving circuit 330 applies a touch driving signal to the driving electrode in the touch electrode, and senses the charge change of the electrostatic capacitance between the driving electrode and the sensing electrode through the sensing electrode in the touch electrode, thereby outputting touch data including the user's touch coordinates.

[0068] The audio driver unit 340 receives first audio data input from the main circuit board 700. The audio driver unit 340 generates an audio signal based on the audio data and outputs it to the induction magnetic field generating unit 510. The audio driver unit 340 can be formed using an integrated circuit.

[0069] A power supply unit for supplying the display driving voltage used to drive the display driving circuit 320 can be configured on the display circuit board 310. If the display driving voltage and the audio signal are generated by a single circuit, they may interfere with each other. However, the display driving voltage for driving the display panel 300 and the audio signal for driving the magnetic field generating unit 510 can be generated by different circuits. Therefore, it is possible to prevent the display driving voltage and the audio signal from interfering with each other.

[0070] One side of the flexible film 390 can be attached to the upper surface of the display panel 300 from the underside using an anisotropic conductive film. The other side of the flexible film 390 can be attached to the upper surface of the display circuit board 310 from the upper side using an anisotropic conductive film. The flexible film 390 can be a flexible film capable of bending.

[0071] On the other hand, the flexible film 390 can be omitted, and the display circuit board 310 can be directly attached to one side of the display panel 300. In this case, one side of the display panel 300 can be configured to be bent toward the lower surface of the display panel 300.

[0072] The display panel 300 may include the lower panel described later (see reference). Figure 6 (of the "400").

[0073] The lower panel 400 may include a magnetic field generating component 510. The magnetic field generating component 510 may be disposed inside the lower panel 400. This reduces the overall thickness of the sound generating device, thereby reducing the overall thickness of the display device 10.

[0074] An inductive magnetic field generating component 510 can be disposed inside the display panel 300. The inductive magnetic field generating component 510 may include a flat coil. Attraction and repulsion forces can be repeatedly generated between the inductive magnetic field generating component 510 and the fixed magnetic field generating component 520. As a result, the display device 10, especially the display panel 300, can vibrate due to the attraction and repulsion forces. Thus, the display device 10 can use the vibration to generate sound.

[0075] A bracket 600 may be configured on the lower part of the display panel 300. The bracket 600 may be made of plastic, metal, or a combination of plastic and metal. The bracket 600 may form a first camera hole CMH1 for inserting the camera device 720, a battery hole BH for configuring the battery 790, and a cable hole CAH through which the cable 314 connected to the display circuit board 310 passes.

[0076] The bracket 600 may include a fixed magnetic field generating component 520. The fixed magnetic field generating component 520 may include magnets. The magnets may include a first polarity portion and a second polarity portion having different polarities from each other. For example, the first polarity portion may be an N pole, and the second polarity portion may be an S pole. Alternatively, the first polarity portion may be an S pole, and the second polarity portion may be an N pole. In some embodiments, the fixed magnetic field generating component 520 may include multiple magnets. Each magnet may have either the first polarity portion or the second polarity portion. In the embodiments described, magnets having the first polarity portion and magnets having the second polarity portion may be arranged alternately.

[0077] The main circuit board 700 and the battery 790 can be configured at the lower part of the bracket 600. The main circuit board 700 can be a printed circuit board or a flexible printed circuit board.

[0078] The main circuit board 700 may include a main processor 710, a camera device 720, a main connector 730, and a memory 740. The main processor 710 may be formed of an integrated circuit.

[0079] The camera device 720 can be configured on both the upper and lower surfaces of the main circuit board 700. The main processor 710 and the memory 740 can be configured on the upper surface of the main circuit board 700, and the main connector 730 can be configured on the lower surface of the main circuit board 700.

[0080] The main processor 710 can control all functions of the display device 10. For example, the main processor 710 can output digital video data to the display driver circuit 320 through the display circuit board 310, so that the display panel 300 displays an image. In addition, the main processor 710 can receive touch data input from the touch driver circuit 330, determine the user's touch coordinates, and then execute the application program indicated by the icon displayed at the user's touch coordinates.

[0081] The main processor 710 receives audio source data from an external source and outputs the audio source data to the memory 740. The memory 740 stores the audio source data according to its frequency, and therefore can use the frequency of the audio source data as the input address to output the audio data.

[0082] The main processor 710 can be an application processor, a central processing unit, or a system chip formed by integrated circuits.

[0083] The camera device 720 processes image frames, such as still images or moving images, acquired by the image sensor in camera mode and outputs them to the main processor 710.

[0084] The main connector 730 can be connected to the cable 314 passing through the cable hole CAH of the bracket 600. Thus, the main circuit board 700 can be electrically connected to the display circuit board 310.

[0085] Battery 790 can be configured not to overlap with main circuit board 700 in the third direction (Z-axis direction). Battery 790 can overlap with battery hole BH of bracket 600.

[0086] The lower cover 900 can be disposed below the main circuit board 700 and the battery 790. The lower cover 900 can be fastened to the bracket 600 and thus secured. The lower cover 900 can form the appearance of the lower surface of the display device 10. The lower cover 900 can include plastic, metal, or a combination of plastic and metal.

[0087] A second camera aperture CMH2 can be formed in the lower cover 900 to expose the lower surface of the camera device 720. The position of the camera device 720 and the positions of the corresponding first camera aperture CMH1 and second camera aperture CMH2 are not limited to... Figure 2 The example shown.

[0088] The fixed magnetic field generating component 520 and the inductive magnetic field generating component 510 can be arranged to overlap in the thickness direction (Z direction).

[0089] Figure 3 It means attached to Figure 2 A bottom view of an example of a display panel covering a window. Figure 4 It's enlarged. Figure 3 The diagram of region A, Figure 5 It means attached to Figure 3 The bottom view of an example of the bracket at the bottom of the display panel and the main circuit board configured on the bracket.

[0090] Reference Figures 3 to 5 On the substrate of the display panel 300 (refer to...) Figure 6 The lower part of the panel (SUB1) can be configured with a lower panel 400. As described above, the lower panel 400 can be included in the display panel 300. However, it is not limited to this, and it can also be understood that the lower panel 400 is a separate configuration separate from the display panel 300. In this case, it should be understood that the aforementioned inductive magnetic field generating component 510 is included in the lower panel 400, which is separate from the display panel 300.

[0091] The lower panel 400 can be attached to the lower surface of the substrate SUB1 of the display panel 300 via an adhesive component. The adhesive component can be a pressure-sensitive adhesive (PSA).

[0092] The lower panel 400 may include at least one of a light-absorbing component for absorbing light incident from the outside, a buffer component for absorbing impacts from the outside, and a heat dissipation component for effectively dissipating heat from the display panel 300.

[0093] The flexible film 390 attached to one side of the display panel 300 can be like... Figure 3 As shown, it is bent and disposed on the lower part of the lower panel 400. Therefore, the display circuit board 310 attached to one side of the flexible film 390 can be disposed on the lower part of the lower panel 400. The display circuit board 310 can be fixed or bonded to the lower surface of the lower panel 400 by a fixing component such as a screw or an adhesive component such as pressure-sensitive adhesive.

[0094] The display circuit board 310 may include a first circuit board 311 and a second circuit board 312. The first circuit board 311 and the second circuit board 312 may be rigid printed circuit boards or flexible printed circuit boards, respectively. When one of the first circuit board 311 and the second circuit board 312 is a rigid printed circuit board and the other is a flexible printed circuit board, the display circuit board 310 may be a composite printed circuit board.

[0095] exist Figure 3 The illustration shows a second circuit board 312 extending from one side of the first circuit board 311 in a second direction (Y-axis direction). The width of the second circuit board 312 in the first direction (X-axis direction) may be smaller than the width of the first circuit board 311 in the first direction (X-axis direction).

[0096] A touch driving circuit 330 and an audio driving unit 340 can be configured on one side of the second circuit board 312, and a first connector 313 and a second connector 316 can be configured on the other side. The first connector 313 may include an insertion portion that connects to a first connection terminal provided at one end of a cable 314. The second connector 316 may include an insertion portion that connects to a connection terminal provided at one end of the first flexible circuit board 570.

[0097] A first connecting terminal located at one end of the cable 314 can be inserted into the insertion portion of the first connector 313. A second connecting terminal located at the other end of the cable 314 can be inserted into the insertion portion of the first connector 313. Figure 5 As shown, the cable through the cable hole CAH of the through bracket 600 bends toward the lower part of the main circuit board 700 and is inserted into the insertion part of the main connector 730.

[0098] A magnetic field generating component 510 can be disposed on the lower surface of the lower panel 400. The magnetic field generating component 510 can be attached to the lower surface of the lower panel 400 by a first adhesive component such as pressure-sensitive adhesive. As a result, the display panel 300 can vibrate in the thickness direction (Z-axis direction) by means of the magnetic field generating component 510.

[0099] A connection terminal located at one end of the first flexible circuit board 570 can be inserted into the insertion portion of the second connector 316. The other end of the first flexible circuit board 570 can be connected to the induction magnetic field generating component 510. The first flexible circuit board 570 can be a flexible printed circuit board or a flexible printed circuit (FPC).

[0100] The bracket 600 may include a battery hole BH, a cable hole CAH, and a first camera hole CMH1. The battery hole BH, cable hole CAH, and first camera hole CMH1 are holes that pass through the bracket 600.

[0101] Battery port BH is for storing battery 790, so battery 790 can be inserted as follows: Figure 5 As shown, it overlaps with the battery hole BH in the third direction (Z-axis direction). The size of the battery hole BH can be larger than the size of the battery 790.

[0102] The first camera hole CMH1 of the bracket 600 is a hole for housing the camera device 720 of the main circuit board 700, so the camera device 720 can overlap with the first camera hole CMH1 in the third direction (Z-axis direction).

[0103] according to Figure 3 as well as Figure 4 In the illustrated embodiment, the magnetic field generating component 510 can be electrically connected to the display circuit board 310 or the printed circuit board via the first flexible circuit board 570. The main circuit board 700 and the display circuit board 310 can be electrically connected via a cable 314.

[0104] like Figure 4 As shown, the inductive magnetic field generating component 510, which is electrically connected to the display circuit board 310 via the first flexible circuit board 570, can be a flat coil. That is, the inductive magnetic field generating component 510 can be an integrally formed coil, and the coil can be located approximately on the same plane. Thus, the inductive magnetic field generating component 510 can have a thin thickness. One end and the other end of the inductive magnetic field generating component 510 are connected to the first flexible circuit board 570 and have a curved shape.

[0105] Starting from one end of the induction magnetic field generating component 510, the induction magnetic field generating component 510 can be drawn with a curve based on the center point of the induction magnetic field generating component 510. Gradually, the induction magnetic field generating component 510 can have a curve shape with a radius decreasing from the center point.

[0106] The portion adjacent to the other end of the induced magnetic field generating component 510 is different from the remaining induced magnetic field generating component 510 and is disposed on another layer, which can prevent short circuits with the remaining induced magnetic field generating component 510.

[0107] exist Figure 4 The example shown illustrates a case where the inductive magnetic field generating component 510 has a curved shape with the center point as a reference, but it is not limited to this. The inductive magnetic field generating component 510 can be configured as a plurality of straight lines extending in a first direction (X direction) and a second direction (Y direction).

[0108] Figure 6 It is along Figure 3 A sectional view taken from line I-I'.

[0109] Reference Figure 6The display panel 300 may include a substrate SUB1, a pixel array layer PAL, and a polarizing film PF.

[0110] Substrate SUB1 can be a rigid substrate or a flexible substrate that is bending, folding, or rolling. Substrate SUB1 can be formed from insulating materials such as glass, quartz, or polymer resins. Examples of polymer materials include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof. Substrate SUB1 may also include metallic materials.

[0111] A pixel array layer (PAL) can be configured on the substrate SUB1. The pixel array layer (PAL) can be a layer that displays an image by including pixels (PX). The pixel array layer (PAL) is as follows: Figure 7 As shown, it may include a thin-film transistor layer 303, a light-emitting element layer 304, and a thin-film encapsulation layer 305.

[0112] To prevent a decrease in visual recognizability caused by external light reflection, a polarizing film PF can be configured on the pixel array layer PAL. The polarizing film PF can include phase retardation films such as linear polarizers and quarter-wave plates. For example, the phase retardation film can be configured on the pixel array layer PAL, and the linear polarizer can be configured between the phase retardation film and the cover window 100.

[0113] A lower panel plate 400 can be disposed on a first surface of the substrate SUB1 of the display panel 300, and a cover window 100 can be disposed on a second surface opposite to the first surface. That is, the cover window 100 can be disposed on the upper surface of the polarizing film PF.

[0114] One side of the flexible film 390 can be attached to one side of the substrate SUB1, and the other side can be attached to one side of the display circuit board 310. One side of the flexible film 390 can be attached to one side of the substrate SUB1 using an anisotropic conductive film. The other side of the flexible film 390 can be attached to one side of the display circuit board 310 using an anisotropic conductive film. The opposite side of the display circuit board 310 can face the lower panel 400.

[0115] exist Figure 6 The illustration shows the display driving circuit 320 disposed on one side of the flexible film 390, but is not limited thereto. The display driving circuit 320 may be disposed on the opposite side of the flexible film 390. The other side of the flexible film 390 may be the side attached to the substrate SUB1 and the side of the display circuit board 310.

[0116] A display circuit board 310 may be disposed on the lower surface of the lower panel 400. The display circuit board 310 may be fixed to the lower surface of the lower panel 400 by means of a fixing component such as a screw or an adhesive component.

[0117] The touch driving circuit 330 and the audio driving unit 340 can be configured on one side of the display circuit board 310. The first connector 313 and the second connector 316 can be configured on the other side of the display circuit board 310.

[0118] The magnetic field generating component 510 can be disposed within the lower panel 400 of the panel. Since the magnetic field generating component 510 is fixedly disposed within the lower panel 400, the display panel 300 can vibrate due to the vibration of the magnetic field generating component 510. That is, the magnetic field generating component 510 can cause the display panel 300 to vibrate to output sound. The magnetic field generating component 510 can be electrically connected to the first flexible circuit board 570.

[0119] The first flexible circuit board 570 can be electrically connected to the induction magnetic field generating component 510 using an anisotropic conductive film. The leads of the first flexible circuit board 570 can be connected to one end and the other end of the induction magnetic field generating component 510, respectively. A connection terminal located at one end of the first flexible circuit board 570 can be connected to the leads. The connection terminal of the first flexible circuit board 570 can be inserted into the insertion portion of the second connector 316. The first flexible circuit board 570 can be a flexible printed circuit (FPC) or a flexible film.

[0120] The bracket 600 may include a recessed portion along the thickness direction in the region overlapping with the inductive magnetic field generating component 510. The fixed magnetic field generating component 520 may be disposed within the recessed portion of the bracket 600. In this case, it can be represented as the fixed magnetic field generating component 520 being built into the bracket 600.

[0121] The fixed magnetic field generating component 520 can be attached to the surface of the recess in the bracket 600 via an adhesive component 521. The adhesive component 521 can be a pressure-sensitive adhesive (PSA).

[0122] A speaker frame 530 can be installed between the bottom surface of the lower panel 400 and the bracket 600 (see reference). Figure 9 The speaker frame 530 can be attached to the bottom surface of the lower panel 400 via an adhesive component. The adhesive component can be a pressure-sensitive adhesive. Alternatively, the speaker frame 530 can be attached to one side of the fixed magnetic field generating component 520 via an adhesive component. This adhesive component can also be a pressure-sensitive adhesive. The speaker frame 530 can have a shape that protrudes from the bottom surface of the lower panel 400 toward the fixed magnetic field generating component 520. That is, the portion of the speaker frame 530 that overlaps with the fixed magnetic field generating component 520 in the thickness direction can be configured to have a predetermined gap between it and the bottom surface of the lower panel 400.

[0123] A damper 540 may also be disposed between the periphery of the recess or the flat portion of the bracket 600 and the bottom surface of the lower panel 400 (see reference). Figure 9 The damper 540 serves to prevent excessive floating of a portion of the display panel 300 when it floats via the sound generating device. The damper 540 can be configured to be attached to both the sound frame 530 and the flat portion, respectively, around the periphery of the recess. The damper 540 can be positioned on one side and the other side, with reference to the fixed magnetic field generating component 520.

[0124] Figure 7 It is a detailed representation Figure 6 A cross-sectional view of the display area of ​​the display panel.

[0125] Reference Figure 7 The display panel 300 may include a substrate SUB1 and a pixel array layer PAL. The pixel array layer PAL is as follows: Figure 7 As shown, it may include a thin-film transistor layer 303, a light-emitting element layer 304, and a thin-film encapsulation layer 305.

[0126] A buffer film 302 can be formed on the substrate SUB1. The buffer film 302 is formed on the substrate SUB1 to protect the multiple thin-film transistors 335 and light-emitting elements from moisture that permeates through the moisture-sensitive substrate SUB1. The buffer film 302 can be formed from multiple inorganic films alternately stacked. For example, the buffer film 302 can be formed from alternately stacked silicon oxide films (SiO2). x ), silicon nitride film (SiN) x Multiple membrane formation consisting of one or more inorganic membranes, such as silicon oxynitride (SiON) membrane, is possible. Buffer membrane 302 can be omitted.

[0127] A thin-film transistor layer 303 is formed on the buffer film 302. The thin-film transistor layer 303 includes a plurality of thin-film transistors 335, a gate insulating film 336, an interlayer insulating film 337, a protective film 338, and a planarization film 339.

[0128] Each thin-film transistor 335 includes an active layer 331, a gate electrode 332, a source electrode 333, and a drain electrode 334. Figure 7 The illustration shows a case where the thin-film transistor 335 is formed with the gate electrode 332 located on the upper part of the active layer 331 as a top gate, but it should be noted that this is not a limitation. That is, each thin-film transistor 335 can also be formed with the gate electrode 332 located on the lower part of the active layer 331 as a bottom gate, or with the gate electrode 332 located on both the upper and lower parts of the active layer 331 as a double gate.

[0129] An active layer 331 is formed on the buffer film 302. The active layer 331 can be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light-shielding layer for blocking external light incident on the active layer 331 can be formed between the buffer film 302 and the active layer 331.

[0130] A gate insulating film 336 can be formed on the active layer 331. The gate insulating film 336 can be made of an inorganic film, such as a silicon oxide film (SiO2). x ), silicon nitride film (SiN) x (or their multiple membrane formation.)

[0131] A gate electrode 332 and a gate line can be formed on the gate insulating film 336. The gate electrode 332 and the gate line can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0132] An interlayer insulating film 337 can be formed on the gate electrode 332 and the gate line. The interlayer insulating film 337 can be an inorganic film, such as a silicon oxide film (SiO2).x ), silicon nitride film (SiN) x (or their multiple membrane formation.)

[0133] A source electrode 333, a drain electrode 334, and data lines can be formed on the interlayer insulating film 337. The source electrode 333 and the drain electrode 334 can be connected to the active layer 331 through contact holes penetrating the gate insulating film 336 and the interlayer insulating film 337, respectively. The source electrode 333, the drain electrode 334, and the data lines can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0134] A protective film 338 for insulating the thin-film transistor 335 can be formed on the source electrode 333, drain electrode 334, and data lines. The protective film 338 can be made of an inorganic film, such as a silicon oxide film (SiO2). x ), silicon nitride film (SiN) x (or their multiple membrane formation.)

[0135] A planarization film 339 for planarizing the height differences caused by the thin-film transistor 335 can be formed on the protective film 338. The planarization film 339 can be formed from an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0136] A light-emitting element layer 304 is formed on the thin-film transistor layer 303. The light-emitting element layer 304 includes a light-emitting element and a pixel definition film 344.

[0137] The light-emitting element and pixel definition film 344 are formed on the planarization film 339. An example is shown where the light-emitting element is an organic light-emitting device including an anode 341, a light-emitting layer 342, and a cathode 343.

[0138] The anode 341 can be formed on the planarization film 339. The anode 341 can be connected to the source electrode 333 of the thin-film transistor 335 through a contact hole that penetrates the protective film 338 and the planarization film 339.

[0139] The pixel definition film 344 can be formed on the planarization film 339 to cover the edge position of the anode 341 in order to divide each pixel PX. That is, the pixel definition film 344 serves as a pixel definition film for defining each pixel PX. Each pixel PX represents the region where holes from the anode 341 and electrons from the cathode 343 combine with each other in the light-emitting layer 342 to emit light, which is formed by the sequential stacking of the anode 341, the light-emitting layer 342, and the cathode 343.

[0140] A light-emitting layer 342 is formed on the anode 341 and the pixel definition film 344. The light-emitting layer 342 can be an organic light-emitting layer. The light-emitting layer 342 can emit one of red, green, or blue light. Alternatively, the light-emitting layer 342 can be a white light-emitting layer that emits white light, in which case it can have a configuration where red, green, and blue light-emitting layers are stacked, and it can be a common layer formed on each pixel PX. In this case, the display panel 300 may also include separate color filters for displaying red, green, and blue.

[0141] The light-emitting layer 342 may include a hole transporting layer, a light-emitting layer, and an electron transporting layer. Furthermore, the light-emitting layer 342 may be formed by a series structure of two or more stacks, in which case a charge-generating layer may be formed between the stacks.

[0142] A cathode 343 is formed on the light-emitting layer 342. The cathode 343 is formed to cover the light-emitting layer 342. The cathode 343 can be a common layer formed together in each pixel PX.

[0143] When the light-emitting element layer 304 is formed in a top-emission manner, emitting light upwards, the anode 341 can be formed of a highly reflective metallic material such as a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a laminated structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). Furthermore, the cathode 343 can be formed of a transparent conductive material such as ITO or IZO (TCO), or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the cathode 343 is formed of a semi-transmissive conductive material, the light extraction efficiency can be increased through the microcavity.

[0144] When the light-emitting element layer 304 is formed in a bottom emission manner, emitting light downwards, the anode 341 can be formed of a transparent conductive material such as ITO or IZO, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). The cathode 343 can be formed of a highly reflective metallic material such as a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a laminated structure of APC alloy and ITO (ITO / APC / ITO). When the anode 341 is formed of a semi-transmissive metallic material, the light extraction efficiency can be increased through the microcavity.

[0145] A thin-film encapsulation layer 305 is formed on the light-emitting element layer 304. The thin-film encapsulation layer 305 serves to prevent oxygen or moisture from penetrating into the light-emitting layer 342 and the cathode 343. For this purpose, the thin-film encapsulation layer 305 may include at least one inorganic film. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. Furthermore, the thin-film encapsulation layer 305 may also include at least one organic film. The organic film may be formed to a sufficient thickness to prevent foreign matter (particles) from penetrating through the thin-film encapsulation layer 305 into the light-emitting layer 342 and the cathode 343. The organic film may include any one of epoxy resin, acrylate, or urethane acrylate.

[0146] A touch-sensing layer can be formed on the thin-film encapsulation layer 305. When the touch-sensing layer is formed directly on the thin-film encapsulation layer 305, the advantage is that the thickness of the display device 10 can be reduced compared to the case where a separate touch panel is attached to the thin-film encapsulation layer 305.

[0147] The touch sensing layer may include touch electrodes that sense the user's touch using electrostatic capacitance and touch lines connecting the pads to the touch electrodes. For example, the touch sensing layer may sense the user's touch using self-capacitance or mutual capacitance.

[0148] Figure 8 It's enlarged. Figure 6 The diagram of region B, Figure 9 It is along Figure 3 A sectional view taken from line II-II'.

[0149] Reference Figure 8 as well as Figure 9 The lower panel 400 may include multiple stacked films or components. The lower panel 400 may include a first heat dissipation layer 410, a first adhesive component AM1 disposed on the first heat dissipation layer 410, a second heat dissipation layer 420 disposed on the first adhesive component AM1, a heat dissipation substrate 430 disposed on the second heat dissipation layer 420, a second adhesive component AM2 disposed on the heat dissipation substrate 430, a buffer component 440 disposed on the second adhesive component AM2, a third adhesive component AM3 disposed on the buffer component 440, a buffer substrate 450 disposed on the third adhesive component AM3, and a top bonding layer 460 disposed on the buffer substrate 450.

[0150] The first heat dissipation layer 410 may include a thin metal film with excellent thermal conductivity, such as copper, nickel, ferrite, or silver.

[0151] The second heat dissipation layer 420 may include graphite or carbon nanotubes, etc. The second heat dissipation layer 420 may be an electromagnetic wave blocking layer.

[0152] The first adhesive component AM1 can be disposed between the first heat dissipation layer 410 and the second heat dissipation layer 420 to bond the first heat dissipation layer 410 and the second heat dissipation layer 420 together. The first adhesive component AM1 may include pressure-sensitive adhesive.

[0153] The heat dissipation substrate 430 may include polyimide or the like, serving to support the lower first heat dissipation layer 410 and the second heat dissipation layer 420. The heat dissipation substrate 430 may be omitted if necessary. In this case, the second heat dissipation layer 420 may be directly bonded to the second adhesive member AM2, and then directly bonded to the buffer member 440 via the second adhesive member AM2.

[0154] A buffer component 440 is disposed on the heat dissipation substrate 430. The buffer component 440 absorbs external impacts to prevent damage to the display panel 300. The buffer component 440 can be formed of a single layer or multiple layers. For example, the buffer component 440 can be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, polyethylene, etc., or it can be formed of an elastic material such as a sponge made by foaming rubber, urethane-based materials, or acrylic-based materials. The buffer component 440 can be a pad.

[0155] A second adhesive component AM2 may be disposed between the buffer component 440 and the heat dissipation substrate 430. In other words, the second adhesive component AM2 can serve to bond the buffer component 440 and the heat dissipation substrate 430 together. The second adhesive component AM2 may include pressure-sensitive adhesive.

[0156] A buffer substrate 450 may be disposed on the buffer member 440. The buffer substrate 450 may include polyimide or the like and serves to support the lower buffer member 440. The buffer substrate 450 may be omitted if necessary.

[0157] A third adhesive component AM3 can be disposed between the buffer substrate 450 and the buffer component 440 to bond the buffer substrate 450 and the buffer component 440 together. The third adhesive component AM3 may include pressure-sensitive adhesive. If the buffer substrate 450 is omitted, the third adhesive component AM3 may be omitted, and the buffer component 440 may be directly attached to the substrate SUB1 by contacting the top bonding layer 460.

[0158] A top bonding layer 460 may be disposed between the buffer substrate 450 and the substrate SUB1 to bond the buffer substrate 450 and the substrate SUB1 to each other. The top bonding layer 460 may include pressure-sensitive adhesive.

[0159] Although not shown, a light-absorbing component may also be disposed between the buffer substrate 450 and the top bonding layer 460. This light-absorbing component blocks light transmission to prevent the identification of components disposed below the light-absorbing component, such as the display circuit board 310 and the magnetic field generating component 510, from the upper part of the display panel 300. The light-absorbing component may include a light-absorbing material such as black pigment or dye.

[0160] The inductive magnetic field generating component 510 can be disposed inside the lower panel 400 of the panel. The inductive magnetic field generating component 510 can be disposed on the same layer as at least one of a plurality of films or components of the lower panel 400. For example... Figure 9 As shown, the induced magnetic field generating component 510 can be disposed on the same layer as the first heat dissipation layer 410. In the lower panel 400, the area where the induced magnetic field generating component 510 is disposed in the thickness direction is referred to as the first region, and the area where the induced magnetic field generating component 510 is not disposed is referred to as the second region. The first heat dissipation layer 410 may not be disposed in the first region where the induced magnetic field generating component 510 is disposed. The first heat dissipation layer 410 is located away from the induced magnetic field generating component 510, thereby achieving electrical insulation. Although not shown, an insulating component may also be disposed around the induced magnetic field generating component 510. The insulating component may include organic material. The insulating component may be disposed between the induced magnetic field generating component 510 and the first heat dissipation layer 410 to prevent short circuits between the first heat dissipation layer 410 and the induced magnetic field generating component 510.

[0161] Unlike the first heat dissipation layer 410, the second heat dissipation layer 420 can be configured in both the first region and the second region.

[0162] In some embodiments, the buffer member 440 can be removed from the first region. That is, the buffer member 440 may not be disposed in the first region. This prevents the vibration of the sound generating device from being reduced due to the buffer member 440.

[0163] In some embodiments, the second heat dissipation layer 420 can be removed from the first region. That is, the second heat dissipation layer 420 may not be disposed in the first region. This prevents the second heat dissipation layer 420 from cracking due to vibrations of the sound generating device.

[0164] In one embodiment of the display device, the magnetic field generating component 510 can be composed of a flat coil, thereby reducing the overall thickness of the sound generating device. Furthermore, the magnetic field generating component 510 is attached to the lower surface of the lower panel 400, and is not formed as a separate component distinct from the lower panel 400, but rather disposed within the lower panel 400, thus further reducing the overall thickness of the sound generating device. Consequently, the overall thickness of the display device can also be reduced.

[0165] Figure 10 This is a plan view of a fixed magnetic field generating component according to one embodiment. Figure 11 yes Figure 10 A sectional view.

[0166] Reference Figure 10 as well as Figure 11 In other embodiments, the fixed magnetic field generating component 520a is circular in shape and may have an annular shape with an opening at the center. The adhesive component 521 has substantially the same planar shape as the annular fixed magnetic field generating component 520a, and its size on the plane may also be substantially the same. The annular shape of the fixed magnetic field generating component 520a may include an inner circumferential surface and an outer circumferential surface. The inner side of the inner circumferential surface of the fixed magnetic field generating component 520a may be exposed to expose the bracket 600, and the outer side of the outer circumferential surface may also be exposed to expose the bracket 600.

[0167] In this embodiment, it is illustrated that the direction of the magnetic field of the sensing magnetic field generating component 510 can be adjusted by freely adjusting the planar shape and size of the fixed magnetic field generating component 520a.

[0168] Figure 12 as well as Figure 13 It is a plan view of the deformation of the fixed magnetic field generating component.

[0169] Reference Figure 12 According to a modified example, the fixed magnetic field generating component 520b may include multiple patterns, which can be arranged along the direction of drawing a circle to form a circular shape. Further, according to a modified example, the fixed magnetic field generating component 520b may include multiple circular shapes with different radii. In this embodiment, three circular shapes with different radii are illustrated, but the number of circular shapes is not limited to this; it can be one, two, or more than four.

[0170] The patterns can be rectangular or trapezoidal in shape. However, they are not limited to these; the patterns can also be rhomboid, other polygonal, circular, or elliptical. The patterns can be configured to be physically isolated from each other.

[0171] In this embodiment, it is also illustrated that the direction of the magnetic field of the sensing magnetic field generating component 510 can be adjusted by freely adjusting the planar shape and size of the fixed magnetic field generating component 520b.

[0172] Reference Figure 13 According to a modified example, the fixed magnetic field generating component 520c may include multiple patterns, which can be arranged along the direction of drawing a circle so that the multiple patterns form a circular shape. The fixed magnetic field generating component 520c is planar, and a triangular shape can be used. The patterns can be configured to be physically connected to each other rather than physically isolated.

[0173] In this embodiment, it is also illustrated that the direction of the magnetic field of the sensing magnetic field generating component 510 can be adjusted by freely adjusting the planar shape and size of the fixed magnetic field generating component 520c.

[0174] Other embodiments are described below. In the following embodiments, the same components as those described in the embodiments are omitted or simplified, and the main differences are explained.

[0175] Figure 14 This is a cross-sectional view of a display device involved in other embodiments.

[0176] Reference Figure 14 The display device involved in this embodiment and Figure 9 The difference in the embodiments involved is that the inductive magnetic field generating component 510_1 is disposed on the same layer as the second heat dissipation layer 420_1.

[0177] More specifically, in the display device of this embodiment, the induced magnetic field generating component 510_1 can be disposed on the same layer as the second heat dissipation layer 420_1. The second heat dissipation layer 420_1 can be removed from the first region and not disposed in the first region. The induced magnetic field generating component 510_1 can be disposed away from the second heat dissipation layer 420_1, thereby achieving electrical insulation. Although not shown, an insulating component can also be disposed around the induced magnetic field generating component 510_1. The insulating component may include organic material. The insulating component can be disposed between the induced magnetic field generating component 510_1 and the second heat dissipation layer 420_1, thereby preventing short circuits between the second heat dissipation layer 420_1 and the induced magnetic field generating component 510_1.

[0178] Figure 15 It means attached to Figure 2 Bottom view of another embodiment of the display panel covering the window. Figure 16 Other embodiments involve along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0179] Reference Figure 15 as well as Figure 16 The display device involved in this embodiment and Figure 3 as well as Figure 6 The difference in the embodiments is that the display circuit board 310_1 also includes a third circuit board 315, and the magnetic field generating component 510_1 is configured to overlap with the third circuit board 315 in the thickness direction.

[0180] More specifically, in the display device involved in this embodiment, the display circuit board 310_1 may further include a third circuit board 315, and the magnetic field generating component 510_1 may be configured to overlap with the third circuit board 315 in the thickness direction. The third circuit board 315 may be physically connected to the second circuit board 312.

[0181] The magnetic field generating component 510_1 can be disposed inside the display circuit board 310_1. The magnetic field generating component 510_1 can also be disposed inside the third circuit board 315 of the display circuit board 310_1.

[0182] In the display device of this embodiment, the magnetic field generating component 510_1 is configured to be built into the display circuit board 310_1. Therefore, it is not formed by attaching the magnetic field generating component 510_1 to the lower surface of the lower panel 400, or by forming a separate structure distinct from the lower panel 400. Thus, the overall thickness of the sound generating device can be reduced. Consequently, the overall thickness of the display device can also be reduced.

[0183] Figure 17 This is yet another embodiment involving along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0184] Reference Figure 17 The display device involved in this embodiment and Figure 16 The difference in the embodiments is that the magnetic field generating component 510_2 is disposed between the third circuit board 315 of the display circuit board 310_1 and the lower panel 400.

[0185] More specifically, in the display device involved in this embodiment, the magnetic field generating component 510_2 can be configured between the third circuit board 315 of the display circuit board 310_1 and the lower panel 400.

[0186] The magnetic field generating component 510_2 can be attached to one side of the third circuit board 315 facing the lower panel 400.

[0187] In the display device of this embodiment, the magnetic field generating component 510_2 is disposed between the display circuit board 310_1 and the lower panel 400. The magnetic field generating component 510_2 is provided attached to the display circuit board 310_1. Therefore, it is not formed by a separate configuration distinct from the lower panel 400, such as the magnetic field generating component 510_2 being attached to the lower surface of the lower panel 400. This allows for a reduction in the overall thickness of the sound generating device. Consequently, the overall thickness of the display device can also be reduced.

[0188] Figure 18 This is yet another embodiment involving along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0189] Reference Figure 18 The display device involved in this embodiment and Figure 17 The difference in the embodiments is that the inductive magnetic field generating component 510_3 is disposed between the third circuit board 315 of the display circuit board 310_1 and the fixed magnetic field generating component 520.

[0190] More specifically, in the display device involved in this embodiment, the magnetic field generating component 510_3 is disposed between the third circuit board 315 of the display circuit board 310_1 and the fixed magnetic field generating component 520.

[0191] The magnetic field generating component 510_3 can be attached to the side of the third circuit board 315 facing the fixed magnetic field generating component 520.

[0192] In the display device of this embodiment, the magnetic field generating component 510_3 is disposed between the display circuit board 310_1 and the fixed magnetic field generating component 520. The magnetic field generating component 510_3 is provided in a form attached to the display circuit board 310_1. Therefore, it is not formed by a separate configuration from the lower panel 400, such as the magnetic field generating component 510_3 being attached to the lower surface of the lower panel 400. This allows for a reduction in the overall thickness of the sound generating device. Consequently, the overall thickness of the display device can also be reduced.

[0193] Figure 19 This is a cross-sectional view of a display device according to yet another embodiment.

[0194] Reference Figure 19 The display device involved in this embodiment and Figure 6 The difference in the embodiments involved is that the fixed magnetic field generating component 520_1 is disposed inside the bracket 600_1.

[0195] More specifically, in the display device of this embodiment, the fixed magnetic field generating component 520_1 can be disposed inside the bracket 600_1. Furthermore, since the fixed magnetic field generating component 520_1 is disposed inside the bracket 600_1, the speaker frame 530_1 can be attached to the side of the bracket 600_1 facing the lower panel 400.

[0196] like Figure 19 As shown, the bracket 600_1 may include: a first bracket region 610 or a first bracket portion 610 surrounding the side and upper surface (the side facing the lower panel of the panel) of the fixed magnetic field generating component 520_1; and a second bracket region 620 or a second bracket portion 620 surrounding the lower surface of the fixed magnetic field generating component 520_1, which is the opposite side of the upper surface.

[0197] When the fixed magnetic field generating component 520_1 is configured, since the second bracket area 620 is not configured, the fixed magnetic field generating component 520_1 can be configured in the internal storage space of the first bracket area 610 with the internal storage space provided by the first bracket area 610. Then, the fixed magnetic field generating component 520_1 can be stored inside the bracket 600_1 by inserting the second bracket area 620 into the lower surface of the fixed magnetic field generating component 520_1 and the first bracket area 610.

[0198] According to the display device involved in this embodiment, the fixed magnetic field generating component 520_1 can be configured to be housed inside the bracket 600_1, thereby reducing the overall thickness of the sound generating device and thus reducing the overall thickness of the display device.

[0199] Figure 20 This is a cross-sectional view of a display device according to yet another embodiment.

[0200] Reference Figure 20 The display device involved in this embodiment and Figure 19 The difference in the embodiment is that the speaker frame 530_1 and the damper 540 are omitted.

[0201] More specifically, in the display device involved in this embodiment, the speaker frame 530_1 and the damper 540 are omitted, and a speaker buffer component 550 is also disposed between the lower panel 400 and the bracket 600_1. The speaker buffer component 550 can be connected to the lower panel 400 and the bracket 600_1.

[0202] When the display device, including the display panel 300, vibrates due to the sound generating device, the sound damping component 550 can function as a damper 540. The sound damping component 550 can be formed of a single layer or multiple layers. For example, the sound damping component 550 can be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or it can be formed of an elastic material such as a sponge made by foaming rubber, urethane-based materials, or acrylic-based materials. The sound damping component 550 can be a padding layer.

[0203] Figure 21 This is a cross-sectional view of a display device according to yet another embodiment. Figure 22 This is yet another embodiment involving along Figure 15 A sectional view taken from line Ⅲ-Ⅲ'.

[0204] Reference Figure 21 and Figure 22 The display device involved in this embodiment and Figure 6 The difference in the embodiments involved is that the bracket 600_2 does not include Figure 6 Instead of the recessed portion shown, it is formed only by a flat portion, and the fixed magnetic field generating component 520_2 is disposed on the flat portion.

[0205] Other explanations and Figure 6 The descriptions are the same, so repeated descriptions will be omitted below.

[0206] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art should understand that the invention can be implemented in other specific ways without changing the technical concept or essential features. Therefore, the embodiments described above are illustrative in all respects and should not be construed as limiting.

Claims

1. A display device comprising: a display panel comprising a plurality of pixels; a panel lower plate provided on one surface of the display panel and comprising a flat coil; and a bracket provided apart from the display panel, sandwiching the panel lower plate between the bracket and the display panel, and provided with a magnet, the magnet is provided overlapping the flat coil in a thickness direction, the flat coil is provided inside the panel lower plate, the panel lower plate and the magnet being located in different layers in a thickness direction.

2. A display device comprising: a display panel comprising a plurality of pixels; a panel lower plate provided on one surface of the display panel and comprising a flat coil; and a bracket provided apart from the display panel, sandwiching the panel lower plate between the bracket and the display panel, and provided with a magnet, the panel lower plate comprises a heat dissipation layer, and the flat coil is provided in the same layer as the heat dissipation layer, the magnet is provided overlapping the flat coil in a thickness direction, the flat coil is provided inside the panel lower plate, the panel lower plate and the magnet being located in different layers in a thickness direction.

3. The display device according to claim 2, wherein the heat dissipation layer comprises a lower heat dissipation layer comprising copper or silver, and an upper heat dissipation layer comprising graphite or carbon nanotube, provided between the lower heat dissipation layer and the display panel.

4. The display device according to claim 3, wherein the lower heat dissipation layer and the flat coil are provided in the same layer, and the lower heat dissipation layer is provided apart from the flat coil.

5. The display device according to claim 3, wherein the upper heat dissipation layer and the flat coil are provided in the same layer, and the upper heat dissipation layer is provided apart from the flat coil.

6. The display device according to claim 5, wherein the bracket comprises a first bracket region provided with the magnet, and a second bracket region not provided with the magnet, the first bracket region has a shape sunk more in a lower direction than the second bracket region, and the magnet is built-in attached to the first bracket region. ​ ​

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