Measuring Device and Characterization and Determination Methods for the Cutting Ability of Diamond Wire

Abstract

The present application provides a measuring device, a characterization method and a determination method for the cutting ability of a diamond wire. The measuring device includes a fixing mechanism, a slider and a friction coefficient detector. The fixing mechanism is used to fix a plurality of diamond wires to configure a suspended diamond wire mesh; the slider is slidably arranged on the diamond wire mesh; the friction coefficient detector is connected to the slider and is used to pull the slider to slide on the diamond wire mesh and measure the friction coefficient between the diamond wire and the slider, so as to characterize the cutting ability of the diamond wire through the friction coefficient. The measuring device is used to solve the technical problem of high test cost for the cutting ability of diamond wires in the prior art.

Description

Technical Field

[0001] This application relates to the technical field of diamond wire cutting. Specifically, it relates to a measuring device, a characterization method, and a determination method for the cutting ability of diamond wire. Background Art

[0002] Diamond wire is short for diamond cutting wire. Many hard materials in industry are cut by diamond wire, such as polysilicon wafers, monocrystalline silicon, and ingots in the photovoltaic field. In the photovoltaic field, the thickness and cutting loss of upstream silicon wafers are important factors affecting battery cost, even system quality, and power generation cost. Diamond wire has a fast cutting speed and high efficiency, which can reduce the demand for silicon material per unit silicon wafer, and thus reduce the investment cost per unit silicon wafer. The cutting efficiency of diamond wire is mainly determined by its cutting ability. Therefore, the cutting force of diamond wire is an important index for diamond wire quality control.

[0003] In the prior art, the cutting ability of diamond wire is mainly tested through the experiment of cutting silicon rods by a slicing machine. However, the slicing machine equipment is not only complex in structure but also expensive, and the length of diamond wire used in a single cutting test needs to be several kilometers, resulting in high test costs, which is not conducive to the quality control of diamond wire manufacturing enterprises. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a measuring device, a characterization method, and a determination method for the cutting ability of diamond wire to solve the technical problem of high test costs for the cutting ability of diamond wire in the prior art.

[0005] The embodiments of this application provide a measuring device, which includes a fixing mechanism, a slider, and a friction coefficient detector. The fixing mechanism is used to fix a plurality of diamond wires to form a suspended diamond wire mesh; the slider is slidably arranged on the diamond wire mesh; the friction coefficient detector is connected to the slider and is used to pull the slider to slide on the diamond wire mesh and measure the friction coefficient between the diamond wire and the slider, so as to characterize the cutting ability of the diamond wire through the friction coefficient.

[0006] In the above implementation process, a plurality of diamond wires are selected and fixed on the fixing mechanism to form a diamond wire mesh, and the friction coefficient detector pulls the slider to slide on the diamond wire mesh, and then the friction coefficient between the diamond wire and the slider is measured. The measuring device has a simple structure and only needs a friction coefficient detector, a fixing mechanism, and a slider to realize the characterization of the cutting ability of diamond wire. Moreover, the diamond wire required in the measuring process is shorter. Compared with the slicing machine equipment, the measuring device reduces the test cost of the cutting ability of diamond wire and is conducive to the quality control of diamond wire manufacturing enterprises.

[0007] In addition, the diamond wire mesh is suspended, which can ensure that when the slider slides on the diamond wire mesh, the slider only contacts the diamond wire mesh, and the frictional force measured by the friction coefficient detector is the frictional force between the slider and the diamond wire mesh, avoiding contact between the slider and other surfaces, and effectively improving the measurement accuracy.

[0008] In a possible implementation, the cutting ability of the diamond wire is positively correlated with the friction coefficient.

[0009] In the above implementation process, under certain conditions, the more protruding diamonds and the higher the protruding height, the better the cutting ability of the diamond wire, and the rougher the surface of the diamond wire. Thus, it can be known that the cutting ability of the diamond wire is positively correlated with the friction coefficient. Therefore, under certain conditions, when using the same slider or the same sliders to measure the friction coefficients between multiple different diamond wires and the slider, the greater the friction coefficient, the greater the cutting ability of the diamond wire.

[0010] In a possible implementation, the fixing mechanism may include a diamond wire carrier; the diamond wire carrier includes two carrier plates arranged oppositely and connected to each other; each diamond wire is wound around the two carrier plates to form a suspended diamond wire mesh between the two carrier plates.

[0011] In the above implementation process, the two carrier plates are arranged oppositely, and a cavity is formed between the two carrier plates. Therefore, by winding each diamond wire around the two carrier plates, a suspended diamond wire mesh can be formed between the two carrier plates, with a simple structure and convenient operation.

[0012] In a possible implementation, a plurality of first wire grooves are respectively formed on the upper side edges of the two carrier plates, and the first wire grooves on the two carrier plates correspond to each other. Each diamond wire passes through the corresponding two first wire grooves and is distributed in parallel to form a suspended diamond wire mesh between the two upper side edges.

[0013] In the above implementation process, the diamond wire is wound through the first wire grooves on the two carrier plates. The first wire grooves can fix the diamond wire, preventing the position of the diamond wire from moving during the measurement process, which may lead to inaccurate measurement results, maintaining the stability of the measurement process, and improving the measurement accuracy. Since during the process of using the diamond wire for cutting, the cutting movement direction of the diamond wire is parallel to the length direction of the diamond wire, a plurality of diamond wires wound through the first wire grooves are arranged in parallel. When measuring the friction coefficient, the moving direction of the slider can be limited to be parallel to the diamond wire, so that the measured friction coefficient is closer to the cutting ability of the diamond wire.

[0014] In a possible implementation, second wire grooves corresponding to the first wire grooves are respectively formed on the lower side edges of each carrier plate, and each diamond wire passes through the first wire grooves and the second wire grooves and is wound around the two carrier plates.

[0015] In the above implementation process, a second wire groove corresponding to the first wire groove is opened on the lower side edge of the carrier plate, and each diamond wire passes through the first wire groove and the second wire groove at the same time and winds around the two carrier plates, which can further fix the diamond wire and improve the stability during the measurement process.

[0016] In a possible implementation manner, the first wire groove is a triangular groove, and the first wire groove includes a first groove bottom line located at the bottom of the groove. The first groove bottom lines of several of the first wire grooves on each upper side edge are in the same plane.

[0017] In the above implementation process, the first wire groove is set as a triangular groove, and the bottom of the triangular groove is a pointed part, which can effectively fix the diamond wire and prevent the diamond wire from moving left and right in the first wire groove. At the same time, by setting the first groove bottom lines of several first wire grooves in the same plane, several diamond wires can be laid in the same plane, and then the slider can contact each diamond wire.

[0018] In a possible implementation manner, the second wire groove is a triangular groove, and the second wire groove includes a second groove bottom line located at the bottom of the groove. The second groove bottom lines of several of the second wire grooves on each lower side edge are in the same plane.

[0019] In the above implementation process, the second wire groove is set as a triangular groove, and the bottom of the triangular groove is a pointed part, which can effectively fix the diamond wire and prevent the diamond wire from moving left and right in the second wire groove.

[0020] In a possible implementation manner, the fixing mechanism further includes a fixing seat for fixing the diamond wire carrier; the fixing seat includes an upper top plate, a lower bottom plate, a support plate, and an installation cavity configured between the upper top plate and the lower bottom plate; the support plate is arranged in the installation cavity, the diamond wire carrier is arranged between the support plate and the upper top plate, and a sliding groove for exposing the diamond wire mesh is opened on the upper top plate; the support plate is configured to be movable relative to the upper top plate to cooperate with the upper top plate to clamp the diamond wire carrier.

[0021] In the above implementation process, in order to ensure the stability of the diamond wire mesh during the measurement process, the fixing mechanism needs to have a certain weight. In some cases, it is necessary to lift the diamond wire carrier and then wind the diamond wire around the diamond wire carrier. However, if the weight of the diamond wire carrier is set to be large, it is not easy to lift the diamond wire carrier. Therefore, a fixing seat is additionally provided to fix the diamond wire carrier. The weight of the fixing seat can be set to be large, and correspondingly, the weight of the diamond wire carrier can be reduced, which is convenient for winding the diamond wire. The support plate in the fixing seat and the upper top plate cooperate to clamp the diamond wire carrier, effectively fix the diamond wire carrier, ensure the stability during the measurement process, and improve the measurement accuracy.

[0022] In a possible implementation, the above-mentioned measuring device further includes a pressing member, which is connected to the lower base plate and includes a pressing end for abutting against the support plate. The pressing end can move relative to the lower base plate to drive the support plate to clamp or loosen the wire carrier in cooperation with the upper top plate.

[0023] In the above implementation process, by arranging a pressing member on the lower base plate to push the support plate to move below the support plate so as to clamp the wire carrier, the structure is simple and the operation is simple and convenient.

[0024] The embodiment of the present application also provides a method for characterizing the cutting ability of a wire saw. This characterization method uses the measuring device described in any of the above embodiments for measurement. The method includes: a fixing mechanism fixes a plurality of wire saws to configure a suspended wire saw mesh; a friction coefficient detector pulls the slider to slide on the wire saw mesh to measure the friction coefficient between the wire saw and the slider; the cutting ability of the wire saw is characterized by the friction coefficient.

[0025] The embodiment of the present application also provides a method for measuring the cutting ability of a wire saw. The method includes: selecting a plurality of wire saw samples; measuring the cutting ability of the wire saw samples; using the measuring device described in any of the above embodiments to measure the friction coefficient; corresponding the cutting ability of each wire saw sample to the friction coefficient one by one to determine the corresponding relationship between the friction coefficient and the cutting ability.

[0026] In the above implementation process, the cutting ability of a plurality of wire saw samples is measured by an existing wire saw cutting ability measuring device, and the friction coefficient of a plurality of wire saw samples is measured by the measuring device in the above embodiment. The corresponding relationship between the friction coefficient and the cutting ability can be obtained by corresponding the cutting ability to the friction coefficient one by one. Subsequently, the cutting ability of the corresponding wire saw can be directly obtained according to the above corresponding relationship through the friction coefficient. The entire process only uses a slicing machine once, effectively reducing the test cost of the cutting ability of the wire saw. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0028] Figure 1 The structural diagram of a measuring device provided by the embodiment of the present application;

[0029] Figure 2Structural diagram of a wire carrier for this application embodiment;

[0030] Figure 3 Flowchart of a method for characterizing the cutting ability of a wire for this application embodiment;

[0031] Figure 4 Structural diagram of a method for measuring the cutting ability of a wire for this application embodiment.

[0032] Icons: 100 - fixing mechanism; 200 - wire; 300 - wire mesh; 400 - slider; 110 - wire carrier; 111 - carrier plate; 112 - upper side; 113 - lower side; 114 - first wire groove; 115 - second wire groove; 116 - first bottom line of the groove; 117 - second bottom line of the groove; 120 - fixing seat; 121 - upper top plate; 122 - lower bottom plate; 123 - support plate; 124 - installation cavity; 125 - sliding groove; 126 - pressing member. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application.

[0034] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0035] Please refer to Figure 1 and Figure 2 , this application embodiment provides a measuring device, which includes a fixing mechanism 100, a slider 400, and a friction coefficient detector (not shown in the figure). The fixing mechanism 100 is used to fix a plurality of wires 200 to form a suspended wire mesh 300. The slider 400 is slidably arranged on the wire mesh 300. The friction coefficient detector is connected to the slider 400 and is used to pull the slider 400 to slide on the wire mesh 300 and measure the friction coefficient between the wire 200 and the slider 400, so as to characterize the cutting ability of the wire 200 through the friction coefficient.

[0036] In the above implementation process, a plurality of wires 200 are selected and fixed on the fixing mechanism 100 to form a wire mesh 300. The friction coefficient detector pulls the slider 400 to slide on the wire mesh 300, and then measures the friction coefficient between the wire 200 and the slider 400.

[0037] The magnitude of the friction coefficient is related to the roughness of the contact surfaces of two objects. The rougher the objects are, the greater the friction coefficient. The cutting ability of the wire saw 200 is determined by the diamonds protruding on the surface of the wire. Under certain conditions, the more the protruding diamonds and the higher the protruding height, the better the cutting ability of the wire saw 200. The degree of protrusion of the diamonds also determines the roughness of the surface of the wire saw 200. It can be seen that a characterization relationship can be established between the friction coefficient and the cutting ability. Therefore, the friction coefficient measured by the above measurement device can be used to characterize the cutting ability of the wire saw 200.

[0038] When using the same slider 400 or using the same sliders 400 to measure the friction coefficients between multiple different wire saws 200 and the slider 400, the magnitude relationship between the cutting abilities of different wire saws 200 can be determined by comparing the magnitudes of the friction coefficients of different wire saws 200.

[0039] In addition, by suspending the wire saw mesh 300, it can be ensured that when the slider 400 slides on the wire saw mesh 300, the slider 400 only contacts the wire saw mesh 300, and the frictional force measured by the friction coefficient detector is the frictional force between the slider 400 and the wire saw mesh 300, avoiding contact between the slider 400 and other surfaces, and effectively improving the measurement accuracy.

[0040] It can be seen that the above measurement device has a simple structure and only requires a friction coefficient detector, a fixing mechanism 100, and a slider 400 to realize the characterization of the cutting ability of the wire saw 200. Moreover, the required wire saw 200 is shorter during the measurement process. Compared with slicing machine equipment, this measurement device reduces the test cost of the cutting ability of the wire saw 200 and is conducive to the quality control of wire saw 200 manufacturing enterprises.

[0041] It should be noted that the slider 400 and the friction coefficient detector are matched, or an input module is set on the friction coefficient detector to input other parameters such as the weight or surface smoothness of the slider 400, so that the friction coefficient detector is matched with the characteristics of the slider 400.

[0042] In a possible implementation, the cutting ability of the wire saw 200 is positively correlated with the friction coefficient.

[0043] In the above implementation process, under certain conditions, the more the protruding diamonds and the higher the protruding height, the better the cutting ability of the wire saw 200, and the higher the roughness of the surface of the wire saw 200. It can be seen that the cutting ability of the wire saw 200 is positively correlated with the friction coefficient. Therefore, under certain conditions, when using the same slider 400 or using the same sliders 400 to measure the friction coefficients between multiple different wire saws 200 and the slider 400, the greater the friction coefficient, the greater the cutting ability of the wire saw 200.

[0044] In a possible implementation, the fixing mechanism 100 may include a wire carrier 110; the wire carrier 110 includes two carrier plates 111 that are oppositely arranged and connected to each other; each wire 200 is wound around the two carrier plates 111 to form a suspended wire mesh 300 between the two carrier plates 111.

[0045] In the above implementation process, the two carrier plates 111 are oppositely arranged, and a cavity is formed between the two carrier plates 111. Therefore, by winding each wire 200 around the two carrier plates 111, a suspended wire mesh 300 can be formed between the two carrier plates 111, with a simple structure and convenient operation.

[0046] In a possible implementation, a plurality of first wire grooves 114 are respectively formed on the upper side edges 112 of the two carrier plates 111, and the first wire grooves 114 on the two carrier plates 111 correspond to each other. Each wire 200 passes through the corresponding two first wire grooves 114 and is distributed in parallel to form a suspended wire mesh 300 between the two upper side edges 112.

[0047] In the above implementation process, the wire 200 passes through and winds around the first wire grooves 114 on the two carrier plates 111. The first wire grooves 114 can fix the wire 200, preventing the position of the wire 200 from moving during the measurement process, which may lead to inaccurate measurement results, maintaining the stability of the measurement process, and improving the measurement accuracy. Since during the process of cutting with the wire 200, the cutting movement direction of the wire 200 is parallel to the length direction of the wire 200, a plurality of wires 200 passing through and winding around the first wire grooves 114 are distributed in parallel. When measuring the friction coefficient, the movement direction of the slider 400 can be limited to be parallel to the wire 200, so that the measured friction coefficient is closer to the cutting ability of the wire 200.

[0048] In a possible implementation, second wire grooves 115 corresponding to the first wire grooves 114 are respectively formed on the lower side edges 113 of the carrier plates 111, and each wire 200 passes through the first wire grooves 114 and the second wire grooves 115 and winds around the two carrier plates 111.

[0049] In the above implementation process, by forming the second wire grooves 115 corresponding to the first wire grooves 114 on the lower side edges 113 of the carrier plates 111, and each wire 200 passes through the first wire grooves 114 and the second wire grooves 115 and winds around the two carrier plates 111, the wire 200 can be further fixed, improving the stability during the measurement process.

[0050] In a possible implementation, the first wire groove 114 is a triangular groove. The first wire groove 114 includes a first groove bottom line 116 located at the bottom of the groove. The first groove bottom lines 116 of several of the first wire grooves 114 on each of the upper side edges 112 are in the same plane.

[0051] In the above implementation process, the first wire groove 114 is set as a triangular groove, and the bottom of the triangular groove is a pointed part, which can effectively fix the diamond wire 200 and prevent the diamond wire 200 from moving left and right within the first wire groove 114. At the same time, the first groove bottom lines 116 of several first wire grooves 114 are set in the same plane, so that several diamond wires 200 can be laid in the same plane, and then the slider 400 can contact each diamond wire 200.

[0052] In a possible implementation, the second wire groove 115 is a triangular groove. The second wire groove 115 includes a second groove bottom line 117 located at the bottom of the groove. The second groove bottom lines 117 of several of the second wire grooves 115 on each of the lower side edges 113 are in the same plane.

[0053] In the above implementation process, the second wire groove 115 is set as a triangular groove, and the bottom of the triangular groove is a pointed part, which can effectively fix the diamond wire 200 and prevent the diamond wire 200 from moving left and right within the second wire groove 115.

[0054] In a possible implementation, the fixing mechanism 100 further includes a fixing seat 120 for fixing the diamond wire carrier 110; the fixing seat 120 includes an upper top plate 121, a lower bottom plate 122, a support plate 123, and an installation cavity 124 configured between the upper top plate 121 and the lower bottom plate 122; the support plate 123 is disposed in the installation cavity 124, the diamond wire carrier 110 is disposed between the support plate 123 and the upper top plate 121, and a sliding groove 125 for exposing the diamond wire mesh 300 is formed on the upper top plate 121; the support plate 123 is configured to be movable relative to the upper top plate 121 to cooperate with the upper top plate 121 to clamp the diamond wire carrier 110.

[0055] In the above implementation process, in order to ensure the stability of the diamond wire net 300 during the measurement process, the fixing mechanism 100 needs to have a certain weight. In some cases, it is necessary to lift the diamond wire carrier 110, and then wind the diamond wire 200 on the diamond wire carrier 110, but if the weight of the diamond wire carrier 110 is set to be large, it is not easy to lift the diamond wire carrier 110. Therefore, a fixing seat 120 is set to fix the diamond wire carrier 110, and the weight of the fixing seat 120 can be set to be large, and the weight of the diamond wire carrier 110 can be reduced accordingly, which is convenient for winding the diamond wire 200. The support plate 123 in the fixing seat 120 cooperates with the upper top plate 121 to clamp the diamond wire carrier 110, effectively fix the diamond wire carrier 110, ensure stability during the measurement process, and improve measurement accuracy.

[0056] In a possible implementation, the measuring device further includes a clamping member 126, which is connected to the lower base plate 122 and includes a clamping end for abutting the support plate 123. The clamping end can move relative to the lower base plate 122 to drive the support plate 123 to cooperate with the upper top plate to clamp or release the diamond wire carrier 110.

[0057] In the above implementation process, a clamping member 126 is provided on the lower base plate 122 to push the support plate 123 to move below the support plate 123 so as to clamp the diamond wire carrier 110 . The structure is simple and the operation is simple and convenient.

[0058] Optionally, the above-mentioned fastening member 126 can be selected from bolts, screws or studs, and a threaded hole is opened on the lower base plate 122. The fastening member 126 is threadedly matched with the threaded hole. Rotating the fastening member 126 can make the fastening end of the fastening member 126 move relative to the lower base plate 122 and then push the support plate 123 to move up and down to clamp the diamond wire carrier 110.

[0059] The present application also provides a method for characterizing the cutting ability of the diamond wire 200. The method is measured by using the measuring device described in any of the above embodiments. Figure 3 , the method comprising:

[0060] S310: The fixing mechanism 100 fixes a plurality of diamond wires 200 to form a suspended diamond wire net 300;

[0061] S320: The friction coefficient detector pulls the slider 400 to slide on the diamond wire net 300 to measure the friction coefficient between the diamond wire 200 and the slider 400;

[0062] S330: Characterizing the cutting ability of the diamond wire 200 by the friction coefficient.

[0063] The embodiment of the present application also provides a method for measuring the cutting ability of the diamond wire 200. Please refer to Figure 4 , and the method includes:

[0064] S410: Select several diamond wire 200 samples;

[0065] S420: Measure the cutting ability of the diamond wire 200 samples;

[0066] Specifically, a device in the prior art that can directly obtain the cutting ability of the diamond wire 200 samples can be used for measurement, such as a slicing machine device, etc.

[0067] S430: Measure the friction coefficient by using the measuring device described in any of the above embodiments;

[0068] S440: Correlate the cutting ability of each diamond wire 200 sample with the friction coefficient one by one to determine the corresponding relationship between the friction coefficient and the cutting ability.

[0069] In the above implementation process, the cutting ability of several diamond wire 200 samples is measured by an existing diamond wire 200 cutting ability measuring device, and the friction coefficient of several diamond wire 200 samples is measured by the measuring device in the above embodiments. The corresponding relationship between the friction coefficient and the cutting ability can be obtained by correlating the cutting ability with the friction coefficient one by one. Subsequently, the cutting ability of the corresponding diamond wire 200 can be directly obtained according to the above corresponding relationship through the friction coefficient. The slicing machine is only used once in the whole process, effectively reducing the test cost of the cutting ability of the diamond wire 200.

[0070] The corresponding relationship can be a corresponding table, a function curve, a relational formula, etc. The embodiment of the present application does not limit this.

[0071] The above are only the embodiments of the present application and are not used to limit the protection scope of the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0072] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or replacements, which should all be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0073] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

Claims

1. A measuring device, characterized in that, it includes: a fixing mechanism for fixing a plurality of wire saws to form a suspended wire saw mesh; a slider slidably arranged on the wire saw mesh; a friction coefficient detector connected to the slider, for pulling the slider to slide on the wire saw mesh and measuring the friction coefficient between the wire saw and the slider, so as to characterize the cutting ability of the wire saw through the friction coefficient; an input module is arranged on the friction coefficient detector for inputting the weight or surface smoothness of the slider, so that the friction coefficient detector matches the characteristics of the slider; the fixing mechanism includes: a wire saw carrier; the wire saw carrier includes two carrier plates arranged oppositely and connected to each other; each wire saw is wound around the two carrier plates to form a suspended wire saw mesh between the two carrier plates; a plurality of first wire grooves are respectively formed on the upper side edges of the two carrier plates, and the first wire grooves on the two carrier plates correspond to each other. Each wire saw passes through the corresponding two first wire grooves and is distributed in parallel to form a suspended wire saw mesh between the two upper side edges; a second wire groove corresponding to the first wire groove is respectively formed on the lower side edge of each carrier plate, and each wire saw passes through the first wire groove and the second wire groove and is wound around the two carrier plates; the first wire groove is a triangular groove, the first wire groove includes a first groove bottom line at the bottom of the groove, and the first groove bottom lines of the plurality of first wire grooves on each upper side edge are in the same plane; and / or, the second wire groove is a triangular groove, the second wire groove includes a second groove bottom line at the bottom of the groove, and the second groove bottom lines of the plurality of second wire grooves on each lower side edge are in the same plane.

2. The measuring device according to claim 1, characterized in that, the cutting ability of the wire saw is positively correlated with the friction coefficient.

3. The measuring device according to claim 1, characterized in that, the fixing mechanism further includes a fixing seat for fixing the wire saw carrier; the fixing seat includes an upper top plate, a lower bottom plate, a support plate and an installation cavity configured between the upper top plate and the lower bottom plate; the support plate is arranged in the installation cavity, the wire saw carrier is arranged between the support plate and the upper top plate, and a sliding groove for exposing the wire saw mesh is formed on the upper top plate; the support plate is configured to be movable relative to the upper top plate to cooperate with the upper top plate to clamp the wire saw carrier.

4. The measuring device according to claim 3, characterized in that, it further includes a pressing member, the pressing member is connected to the lower bottom plate, and includes a pressing end for abutting against the support plate. The pressing end is movable relative to the lower bottom plate to drive the support plate to cooperate with the upper top plate to clamp or loosen the wire saw carrier.

5. A method for characterizing the cutting ability of a wire saw, characterized in that, measuring by using the measuring device according to any one of claims 1-4, including: the fixing mechanism fixes a plurality of wire saws to form a suspended wire saw mesh; The friction coefficient detector pulls the slider to slide on the diamond wire mesh to measure the friction coefficient between the diamond wire and the slider; Characterize the cutting ability of the diamond wire by the friction coefficient.

6. A method for measuring the cutting ability of a diamond wire, characterized in that, comprising: selecting a plurality of diamond wire samples; measuring the cutting ability of the diamond wire samples; measuring the friction coefficient by using the measuring device according to any one of claims 1-4; corresponding the cutting ability of each diamond wire sample with the friction coefficient one by one to determine the corresponding relationship between the friction coefficient and the cutting ability.

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