A kind of anti-sulfurization jumper resistor and its preparation method

Abstract

The present invention discloses an anti-sulfurization jumper resistor and a preparation method thereof, wherein the jumper resistor comprises a ceramic substrate, a back electrode, a silver paste layer, a high palladium electrode layer, a protective layer, a terminal electrode layer, a nickel layer and a tin layer; the back electrodes are respectively arranged on both sides of the lower surface of the ceramic substrate, the upper surface of the ceramic substrate is covered with a silver paste layer, the other side of the silver paste layer is covered with a high palladium electrode layer, and the other side of the high palladium electrode layer is covered with a protective layer; the left and right ends of the ceramic substrate are respectively provided with a conductive terminal electrode layer, the back electrode, the terminal electrode layer and the high palladium electrode layer not covered by the protective layer are covered with a nickel layer, and the nickel layer is covered with a tin layer. The anti-sulfurization jumper resistor made by the present invention completely covers the easily sulfidized silver paste with the high palladium electrode paste, and uses a resin protective layer and a nickel-tin layer to protect the resistor, while ensuring that the resistance value of the jumper resistor meets the requirements, further improves the anti-sulfurization ability, high temperature and high humidity resistance and corrosion resistance of the jumper resistor.

Description

Technical Field

[0001] The invention relates to the technical field of resistor manufacturing, and in particular to an anti-sulfurization jumper resistor and a preparation method thereof. Background Art

[0002] Chip resistors, also known as chip resistors, are widely used in the Internet of Things, new energy, artificial intelligence, industrial control, aerospace, home appliances, computers, communication equipment, automotive electronics, medical electronics, portable wearable electronic devices and other fields due to their small size, light weight, adaptability to reflow soldering and wave soldering, stable electrical performance, high reliability, low assembly cost, matching with automatic mounting equipment, high mechanical strength and superior high-frequency characteristics. However, in some places with high concentrations of sulfide gases, such as volcanic gas emissions, farms, wine brewing, parking lots, chemical plants, mining and thermal power plants, electronic devices using chip resistors often produce sulfide reactions and cause the resistors to open circuit. Therefore, in these special places, thick film anti-sulfurization chip resistors have very wide practical applications and are also valued by more and more electronic equipment manufacturers.

[0003] In the process of research and practice of the prior art, the inventor of the present invention found that the traditional thick film chip jumper resistors below 01005 and 03015 are prone to silver sulfide causing resistance value deviation or even open circuit when working in high sulfur content, humid and high temperature environments such as tropical seaside, rainy season, volcanic group, etc., which directly greatly reduces the reliability of the jumper resistor in harsh environment and shortens its service life. In addition, the anti-sulfurization thick film chip jumper resistors below 01005 and 03015 are required to have a resistance value below 50mΩ, while one of the traditional methods for preparing anti-sulfurization chip resistors is to directly use high palladium electrode paste to print the resistor body, and the resistance value is prone to the problem of not being able to reach below 50mΩ due to the high resistivity of the high palladium electrode paste; the second method is to increase the climbing size of the electroplating layer covering the secondary protective layer, but it is extremely difficult to prepare small-sized thick film chip fixed resistors. Summary of the invention

[0004] The technical problem to be solved by the embodiments of the present invention is to provide a sulfur-resistant jumper resistor and a preparation method thereof, which can solve the problem that the existing traditional thick-film chip jumper resistor is prone to silver sulfide in an environment with high sulfur content, high temperature and high humidity, resulting in a large resistance value or even an open circuit.

[0005] To solve the above problems, an embodiment of the present invention provides an anti-sulfurization jumper resistor, comprising a ceramic substrate, a back electrode, a silver paste layer, a high-palladium electrode layer, a protective layer, a terminal electrode layer, a nickel layer and a tin layer; wherein, back electrodes are respectively arranged on both sides of the lower surface of the ceramic substrate, the upper surface of the ceramic substrate is covered with a silver paste layer, the other side of the silver paste layer not in contact with the ceramic substrate is covered with a high-palladium electrode layer, and the other side of the high-palladium electrode layer not in contact with the silver paste layer is covered with a protective layer;

[0006] A conductive terminal electrode layer is respectively disposed at the left and right ends of the ceramic substrate, and the terminal electrode layer extends to cover the surfaces of the left and right ends of the ceramic substrate;

[0007] The back electrode, the end electrode layer and the high palladium electrode layer not covered by the protective layer are covered with a nickel layer, the nickel layer completely covers the back electrode, the end electrode layer and the high palladium electrode layer not covered by the protective layer, and the nickel layer overlaps the end surface of the protective layer; the nickel layer is covered with a tin layer, the tin layer completely covers the nickel layer, and the tin layer overlaps the end surface of the protective layer.

[0008] Furthermore, the protective layer is a resin protective layer.

[0009] Furthermore, the terminal electrode layer is a nickel-chromium alloy layer.

[0010] Furthermore, the silver paste layer includes strip-shaped silver paste or granular silver paste.

[0011] Furthermore, the resistance of the anti-sulfurization jumper resistor does not exceed 50 mΩ.

[0012] An embodiment of the present invention further provides a method for preparing an anti-sulfurization jumper resistor, which comprises at least the following steps:

[0013] By drawing a preset dividing line on the ceramic substrate, the ceramic substrate is divided into a plurality of basic carrier units;

[0014] Printing a back electrode on one side of the ceramic substrate, and printing a silver paste layer on the other side of the ceramic substrate;

[0015] Printing a strip-shaped high-palladium electrode layer on the silver paste layer, and printing a resin protective layer on the high-palladium electrode layer;

[0016] Performing a splitting process on the ceramic substrate to split the block-shaped ceramic substrate into a plurality of strip-shaped ceramic substrates;

[0017] Sputtering a conductive terminal electrode nickel-chromium alloy layer at both ends of the strip-shaped ceramic substrate;

[0018] Performing a secondary segmentation process on the strip-shaped ceramic substrate so as to segment the strip-shaped ceramic substrate into a plurality of granular ceramic substrates;

[0019] A nickel layer and a tin layer are electroplated on the conductor of the granular ceramic substrate in an electrochemical manner to obtain an anti-sulfurization jumper resistor.

[0020] Furthermore, printing a silver paste layer on the other side of the ceramic substrate specifically includes: printing strip-shaped silver paste or granular silver paste.

[0021] Furthermore, the step of printing a strip-shaped high-palladium electrode layer on the silver paste layer specifically includes:

[0022] Forming printed graphics on the screen by applying photosensitive glue and exposing;

[0023] Spread the slurry on the screen and place the scraper on the corresponding printed pattern position;

[0024] Fixing the substrate below the corresponding printed pattern and applying force to the squeegee;

[0025] The printed pattern is printed on the substrate by moving the scraper to form a high-palladium electrode layer.

[0026] Furthermore, the first segmentation process and the second segmentation process both adopt a mechanical segmentation method.

[0027] Furthermore, the method for preparing the anti-sulfurization jumper resistor further includes:

[0028] The silver paste layer and the high palladium electrode layer are electrically connected in parallel so that the resistance of the crossover resistor does not exceed 50 mΩ.

[0029] Implementing the embodiments of the present invention has the following beneficial effects:

[0030] The embodiment of the present invention provides an anti-sulfurization jumper resistor and a preparation method thereof, wherein the jumper resistor includes a ceramic substrate, a back electrode, a silver paste layer, a high palladium electrode layer, a protective layer, a terminal electrode layer, a nickel layer and a tin layer; wherein the back electrodes are respectively arranged on both sides of the lower surface of the ceramic substrate, the upper surface of the ceramic substrate is covered with a silver paste layer, the other side of the silver paste layer is covered with a high palladium electrode layer, and the other side of the high palladium electrode layer is covered with a protective layer; the left and right ends of the ceramic substrate are respectively provided with a conductive terminal electrode layer, the back electrode, the terminal electrode layer and the high palladium electrode layer not covered by the protective layer are covered with a nickel layer, and the nickel layer is covered with a tin layer. Compared with the prior art, the embodiment of the present invention can completely cover the easily sulfidized silver paste with high palladium electrode paste, and use a resin protective layer and a nickel-tin layer to protect the resistor, while ensuring that the resistance value of the jumper resistor meets the requirements, further improve the anti-sulfurization ability, high temperature and high humidity resistance and corrosion resistance of the jumper resistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A diagram showing the decomposition of each printed film layer of an anti-sulfurization jumper resistor provided in the first embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the structure of an anti-sulfurization jumper resistor provided by the first embodiment of the present invention;

[0033] Figure 3 A schematic diagram of the structure of another anti-sulfurization jumper resistor provided in the first embodiment of the present invention;

[0034] Figure 4 A schematic flow chart of a method for preparing an anti-sulfurization jumper resistor provided in accordance with a second embodiment of the present invention;

[0035] Figure 5 A schematic diagram of the division of a ceramic substrate provided in a second embodiment of the present invention;

[0036] Figure 6 A schematic diagram of a printed back electrode provided in a second embodiment of the present invention;

[0037] Figure 7 A schematic diagram of printing strip silver paste provided by the second embodiment of the present invention;

[0038] Figure 8 A schematic diagram of printing granular silver paste provided in a second embodiment of the present invention;

[0039] Fig. 9 A schematic diagram of a printed high-palladium electrode layer provided in a second embodiment of the present invention;

[0040] Fig.10 A schematic diagram of a printed resin protective layer provided in a second embodiment of the present invention;

[0041] Fig.11 A schematic diagram of a split strip product provided by a second embodiment of the present invention;

[0042] Fig.12 A schematic diagram of dividing a granular product provided in a second embodiment of the present invention.

[0043] Explanation of the main component symbols in the accompanying drawings: ① ceramic substrate; ② back electrode; ③ silver paste layer; ④ high palladium electrode layer; ⑤ protective layer; ⑥ terminal electrode layer; ⑦ nickel layer; ⑧ tin layer. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0045] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0046] First, the application scenarios that the present invention can provide are introduced, such as providing an anti-sulfurization jumper resistor and a preparation method thereof. The first embodiment of the present invention:

[0047] See also Figure 1 to Figure 3 .

[0048] This embodiment provides an anti-sulfurization jumper resistor, including a ceramic substrate ①, a back electrode ②, a silver paste layer ③, a high-palladium electrode layer ④, a protective layer ⑤, a terminal electrode layer ⑥, a nickel layer ⑦ and a tin layer ⑧; wherein,

[0049] Back electrodes ② are respectively arranged on both sides of the lower surface of the ceramic substrate ①, a silver paste layer ③ is covered on the upper surface of the ceramic substrate ①, a high-palladium electrode layer ④ is covered on the other side of the silver paste layer ③ not in contact with the ceramic substrate ①, and a protective layer ⑤ is covered on the other side of the high-palladium electrode layer ④ not in contact with the silver paste layer ③;

[0050] A conductive terminal electrode layer ⑥ is respectively disposed at the left and right ends of the ceramic substrate ①, and the terminal electrode layer ⑥ extends to cover the surfaces of the left and right ends of the ceramic substrate ①;

[0051] The back electrode ②, the end electrode layer ⑥ and the high palladium electrode layer not covered by the protective layer are covered with a nickel layer ⑦, the nickel layer ⑦ completely covers the back electrode ②, the end electrode layer ⑥ and the high palladium electrode layer not covered by the protective layer, and the nickel layer ⑦ overlaps the end surface of the protective layer ⑤; the nickel layer ⑦ is covered with a tin layer ⑧, the tin layer ⑧ completely covers the nickel layer ⑦, and the tin layer ⑧ overlaps the end surface of the protective layer ⑤.

[0052] Specifically, Figure 1The split diagram of each printed film layer shown includes a ceramic substrate ①, a back electrode ②, a silver paste layer ③, a high palladium electrode layer ④ and a protective layer ⑤; wherein, the back electrode ② is arranged at the left and right ends of the lower surface of the ceramic substrate ①, the silver paste layer ③ is arranged on the upper surface of the ceramic substrate ①, the upper surface of the silver paste layer ③ is covered with a high palladium electrode layer ④, the upper surface of the high palladium electrode layer ④ is covered with a protective layer ⑤, and a conductive end electrode layer ⑥ is respectively arranged at the left and right ends of the ceramic substrate ① and extends to cover the surfaces of the left and right ends of the ceramic substrate ①. At the same time, a nickel layer ⑦ and a tin layer ⑧ are electroplated on the conductor. In this embodiment, a layer of resistor is printed on a blank ceramic substrate by silver paste, and then a layer of high palladium electrode layer covering the silver paste is printed on the resistor (silver paste). For example, for a 01005 model thick film chip jumper resistor, when the silver paste width is set to 110μm, the high palladium electrode layer width is usually set to 140μm to ensure complete coverage of the silver paste. A layer of resin protective paste is printed on the high palladium electrode layer, and finally a nickel and tin layer is electroplated on the conductor by electrochemistry. Since the high palladium electrode paste has high anti-sulfurization ability, the high palladium electrode paste completely covers the easily sulfidized silver paste, and the resin protective paste and the nickel-tin layer also have excellent anti-sulfurization ability, the thick film chip jumper resistor manufactured in this embodiment has the characteristics of strong anti-sulfurization ability, high temperature and high humidity resistance, and corrosion resistance.

[0053] In a preferred embodiment, the protective layer ⑤ is a resin protective layer.

[0054] In a preferred embodiment, the terminal electrode layer ⑥ is a nickel-chromium alloy layer.

[0055] In a preferred embodiment, the silver paste layer ③ includes strip-shaped silver paste or granular silver paste.

[0056] Specifically, when the printed silver paste layer is a strip-shaped silver paste, the structural schematic diagram of the anti-sulfurization jumper resistor provided in this embodiment is as follows: Figure 2 As shown, the silver paste layer ③ at this time is a strip-shaped silver paste, and its width is smaller than the width of the high-palladium electrode layer ④. The high-palladium electrode layer ④ completely covers the top of the silver paste layer ③ and both ends in the width direction.

[0057] When the printed silver paste layer is a granular silver paste, the structural schematic diagram of the anti-sulfurization jumper resistor provided in this embodiment is as follows: Figure 3 As shown, the silver paste layer ③ at this time is a granular silver paste, and its length and width are smaller than the high palladium electrode layer ④. The high palladium electrode layer ④ completely covers the top of the silver paste layer ③ and both ends in the length and width directions.

[0058] The above two structures, Figure 2 The stripe structure of silver paste is relative to Figure 3 The granular silver paste structure has lower molding process requirements and is easier to obtain a lower resistance value. However, after the high palladium electrode layer is superimposed, the total thickness is thicker, and the one-time split ratio is Figure 3 The granular silver paste structure is difficult. Figure 3 The granular silver paste structure has only a high palladium electrode layer because the dividing groove is not covered with silver paste. Figure 2 The strip-shaped silver paste structure is easier to split at one time, but the resistance value is relatively Figure 2 The stripe silver paste structure is slightly higher.

[0059] In a preferred embodiment, the resistance of the anti-sulfurization jumper resistor does not exceed 50 mΩ.

[0060] Specifically, the resistance of the anti-sulfurization jumper resistor provided in this embodiment can reach below 50mΩ; at the same time, the silver paste can be appropriately thickened according to the resistance requirement to achieve a smaller target resistance, thereby obtaining high anti-sulfurization ability and high temperature and high humidity resistance.

[0061] The present embodiment provides an anti-sulfurization jumper resistor, which includes a ceramic substrate, a back electrode, a silver paste layer, a high-palladium electrode layer, a protective layer, a terminal electrode layer, a nickel layer and a tin layer; wherein, back electrodes are respectively arranged on both sides of the lower surface of the ceramic substrate, the upper surface of the ceramic substrate is covered with a silver paste layer, the other side of the silver paste layer is covered with a high-palladium electrode layer, and the other side of the high-palladium electrode layer is covered with a protective layer; a conductive terminal electrode layer is respectively arranged at the left and right ends of the ceramic substrate, a nickel layer is covered on the back electrode, the terminal electrode layer and the high-palladium electrode layer not covered by the protective layer, and a tin layer is covered on the nickel layer.

[0062] In this embodiment, the easily sulfided silver paste is completely covered by the high-palladium electrode paste, and the high-palladium electrode layer is protected by a resin protective layer. Finally, a nickel layer and a tin layer are electrochemically plated on the conductor. Since the high-palladium electrode paste has high anti-sulfidation ability, the high-palladium electrode paste completely covers the easily sulfided silver paste, and the resin protective paste and the nickel-tin layer also have excellent anti-sulfidation ability. Therefore, the anti-sulfurization jumper resistor provided by this embodiment further improves the anti-sulfurization ability, high temperature and high humidity resistance, and corrosion resistance of the jumper resistor while ensuring that the resistance value of the jumper resistor meets the requirements. Second embodiment of the present invention:

[0063] See also Figures 4 to 12 .

[0064] like Figure 4 As shown, this embodiment provides a method for preparing an anti-sulfurization jumper resistor, which at least includes the following steps:

[0065] S1, dividing the ceramic substrate into a plurality of basic carrier units by drawing a preset dividing line on the ceramic substrate;

[0066] S2, printing a back electrode on one side of the ceramic substrate, and printing a silver paste layer on the other side of the ceramic substrate;

[0067] S3, printing a strip-shaped high-palladium electrode layer on the silver paste layer, and printing a resin protective layer on the high-palladium electrode layer;

[0068] S4, performing a segmentation process on the ceramic substrate to segment the block-shaped ceramic substrate into a plurality of strip-shaped ceramic substrates;

[0069] S5, sputtering a conductive terminal electrode nickel-chromium alloy layer at both ends of the strip-shaped ceramic substrate;

[0070] S6, performing a secondary segmentation process on the strip-shaped ceramic substrate to segment the strip-shaped ceramic substrate into a plurality of granular ceramic substrates;

[0071] S7. Electrochemically plate a nickel layer and a tin layer on the conductor of the granular ceramic substrate to obtain an anti-sulfurization jumper resistor.

[0072] In a specific embodiment, the detailed steps of preparing the anti-sulfurization jumper resistor are as follows:

[0073] Step 1: If Figure 5 As shown, firstly, dividing lines are drawn on the ceramic substrate to form small units, and each small unit is the basic carrier of a resistor.

[0074] Step 2: If Figure 6 As shown, a back electrode is printed on one side of the substrate.

[0075] Step 3: Print silver paste on the other side of the substrate.

[0076] Among them, when printing silver paste, there are two printing schemes, such as Figure 7 The first solution shown is to print stripe silver paste on the other side of the substrate, such as Figure 8 The second solution shown is to print granular silver paste on the other side of the substrate.

[0077] Step 4: If Fig. 9 As shown, a stripe high palladium electrode layer is printed on the silver paste. For example, for a 01005 thick film chip jumper resistor, when the silver paste width is set to 110μm, the high palladium electrode layer width is usually set to 140μm to ensure full coverage of the silver paste.

[0078] Step 5: If Fig.10 As shown, a resin protective layer is printed on the high palladium electrode paste.

[0079] Step 6: If Fig.11 As shown, a division is performed to divide the block product into strip products.

[0080] Step 7: Sputter a conductive terminal electrode nickel-chromium alloy layer on both ends of the strip.

[0081] Step 8: If Fig.12 As shown, secondary segmentation is performed to segment the strip product into granular products.

[0082] Step 9: Electrochemically plate nickel and tin layers on the conductor to finally make the finished product.

[0083] The present embodiment provides a method for preparing a sulfur-resistant jumper resistor, which uses a thick film printing and sintering process to print the back electrode and front resistor silver paste on a ceramic substrate with a dividing line, and then prints a high palladium electrode paste on the silver paste; then prints a resin protective paste on the high palladium electrode paste, and then sputters a layer of conductive terminal electrode nickel-chromium alloy layer at both ends of the strip product, and finally electroplates nickel and tin layers on the conductor by electrochemistry. Since the high palladium electrode paste has high anti-sulfurization ability, the high palladium electrode paste completely covers the easily sulfurized silver paste, and the resin protective paste and the nickel-tin layer also have excellent anti-sulfurization ability, so that the thick film chip jumper resistor has the characteristics of anti-sulfurization ability, high temperature and high humidity resistance, and strong corrosion resistance, avoiding the problem of silver sulfide easily causing large resistance or even open circuit in an environment with high sulfur content and high temperature and high humidity.

[0084] In a preferred embodiment, printing a silver paste layer on the other side of the ceramic substrate specifically includes: printing strip-shaped silver paste or granular silver paste.

[0085] In the above step 3, Scheme 1 has lower requirements for the molding process than Scheme 2, and it is easier to obtain a lower resistance value, but after the high palladium electrode layer is superimposed, the total thickness is thicker, so it is more difficult to split at one time than Scheme 2. Scheme 2 is easier to split at one time than Scheme 1 because there is no silver paste on the dividing groove and only a high palladium electrode layer, but the resistance value is slightly higher than that of Scheme 1.

[0086] In a preferred embodiment, printing a strip-shaped high-palladium electrode layer on the silver paste layer specifically includes:

[0087] Forming a printed pattern on the screen by applying photosensitive resin and exposing;

[0088] Spread the slurry on the screen and place the scraper on the corresponding printed pattern position;

[0089] Fixing the substrate below the corresponding printed pattern and applying force to the squeegee;

[0090] The printed pattern is printed on the substrate by moving the scraper to form a high-palladium electrode layer.

[0091] Specifically, a printed pattern is formed on the silk screen by applying photosensitive resin, exposing and other steps; slurry is spread on the prepared silk screen; then the scraper is placed on the corresponding pattern position; the substrate is fixed under the corresponding pattern; then force is applied to the scraper; finally, the pattern is printed on the substrate by moving the scraper to form the required high palladium electrode layer.

[0092] For the forming process of silver paste and high palladium electrode layer, it can be directly printed or printed first to obtain higher dimensional accuracy. Then, the larger-sized graphics can be mechanically cut into the designed final size using tools such as lasers, thereby improving dimensional accuracy and resistance value consistency.

[0093] In a preferred embodiment, the first segmentation process and the second segmentation process are both performed by mechanical segmentation. In a preferred embodiment, the method for preparing the anti-sulfurization jumper resistor further includes:

[0094] The silver paste layer and the high palladium electrode layer are electrically connected in parallel so that the resistance of the crossover resistor does not exceed 50 mΩ.

[0095] Specifically, during the printing process, the main purpose of printing silver paste is to use low-resistivity silver paste and high-resistivity high-palladium electrode paste in parallel to make the cross-resistance value less than 50mΩ; at the same time, the silver paste can be appropriately thickened according to the resistance requirements to achieve a smaller target resistance value, and obtain high anti-sulfurization ability and high temperature and high humidity resistance. The present embodiment provides a method for preparing an anti-sulfurization jumper resistor, which includes at least the following steps: dividing the ceramic substrate into a plurality of basic carrier units by drawing a preset dividing line on the ceramic substrate; printing a back electrode on one side of the ceramic substrate and printing a silver paste layer on the other side of the ceramic substrate; printing a strip-shaped high-palladium electrode layer on the silver paste layer, and printing a resin protective layer on the high-palladium electrode layer; performing a primary dividing process on the ceramic substrate to divide the block-shaped ceramic substrate into a plurality of strip-shaped ceramic substrates; sputtering a conductive end electrode nickel-chromium alloy layer at both ends of the strip-shaped ceramic substrate; performing a secondary dividing process on the strip-shaped ceramic substrate to divide the strip-shaped ceramic substrate into a plurality of granular ceramic substrates; and electrochemically electroplating a nickel layer and a tin layer on the conductor of the granular ceramic substrate to obtain an anti-sulfurization jumper resistor.

[0096] Compared with the prior art, the present embodiment can completely cover the easily sulfided silver paste with high-palladium electrode paste, print a resin protective layer on the high-palladium electrode layer, and finally electroplate a nickel layer and a tin layer on the conductor by electrochemistry. Since the high-palladium electrode paste has high anti-sulfurization ability, the high-palladium electrode paste completely covers the easily sulfided silver paste, and the resin protective paste and the nickel-tin layer also have excellent anti-sulfurization ability. Therefore, the anti-sulfurization jumper resistor provided by the present embodiment can further improve the anti-sulfurization ability, high temperature and high humidity resistance and corrosion resistance of the jumper resistor while ensuring that the resistance value of the jumper resistor meets the requirements.

[0097] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts not described in detail in a certain embodiment, reference can be made to the relevant description of other embodiments. In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways.

[0098] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

[0099] A person skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes of the embodiments of the above-mentioned methods. The storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM), etc.

Claims

1. A sulfur-resistant jumper resistor, characterized in that: It includes a ceramic substrate, a back electrode, a silver paste layer, a high-palladium electrode layer, a protective layer, a terminal electrode layer, a nickel layer and a tin layer; wherein, Back electrodes are respectively arranged on both sides of the lower surface of the ceramic substrate, the upper surface of the ceramic substrate is covered with a silver paste layer, the other side of the silver paste layer not in contact with the ceramic substrate is covered with a high palladium electrode layer, and the other side of the high palladium electrode layer not in contact with the silver paste layer is covered with a protective layer; A conductive terminal electrode layer is respectively disposed at the left and right ends of the ceramic substrate, and the terminal electrode layer extends to cover the surfaces of the left and right ends of the ceramic substrate; the terminal electrode layer is a nickel-chromium alloy layer; the silver paste layer includes strip-shaped silver paste or granular silver paste; The back electrode, the end electrode layer and the high palladium electrode layer not covered by the protective layer are covered with a nickel layer, the nickel layer completely covers the back electrode, the end electrode layer and the high palladium electrode layer not covered by the protective layer, and the nickel layer overlaps the end surface of the protective layer; the nickel layer is covered with a tin layer, the tin layer completely covers the nickel layer, and the tin layer overlaps the end surface of the protective layer.

2. The anti-sulfurization jumper resistor according to claim 1, characterized in that: The protective layer is a resin protective layer.

3. The anti-sulfurization jumper resistor according to claim 1, characterized in that: The resistance value of the anti-sulfurization jumper resistor does not exceed 50 mΩ.

4. A method for preparing an anti-sulfurization jumper resistor, characterized in that: At least the following steps are included: By drawing a preset dividing line on the ceramic substrate, the ceramic substrate is divided into a plurality of basic carrier units; Printing a back electrode on one side of the ceramic substrate, and printing a silver paste layer on the other side of the ceramic substrate; Printing a strip-shaped high-palladium electrode layer on the silver paste layer, and printing a resin protective layer on the high-palladium electrode layer; Performing a splitting process on the ceramic substrate to split the block-shaped ceramic substrate into a plurality of strip-shaped ceramic substrates; Sputtering a conductive terminal electrode nickel-chromium alloy layer at both ends of the strip-shaped ceramic substrate; Performing a secondary segmentation process on the strip-shaped ceramic substrate so as to segment the strip-shaped ceramic substrate into a plurality of granular ceramic substrates; A nickel layer and a tin layer are electroplated on the conductor of the granular ceramic substrate in an electrochemical manner to obtain an anti-sulfurization jumper resistor.

5. The method for preparing the anti-sulfurization jumper resistor according to claim 4, characterized in that: The printing of the silver paste layer on the other side of the ceramic substrate specifically includes: printing strip-shaped silver paste or granular silver paste.

6. The method for preparing the anti-sulfurization jumper resistor according to claim 4, characterized in that: The step of printing a strip-shaped high-palladium electrode layer on the silver paste layer specifically comprises: Forming printed graphics on the screen by applying photosensitive glue and exposing; Spread the slurry on the screen and place the scraper on the corresponding printed pattern position; Fixing the substrate below the corresponding printed pattern and applying force to the squeegee; The printed pattern is printed on the substrate by moving the scraper to form a high-palladium electrode layer.

7. The method for preparing the anti-sulfurization jumper resistor according to claim 4, characterized in that: The first segmentation process and the second segmentation process both adopt mechanical segmentation methods.

8. The method for preparing the anti-sulfurization jumper resistor according to claim 4, characterized in that: Also includes: The silver paste layer and the high palladium electrode layer are electrically connected in parallel so that the resistance of the crossover resistor does not exceed 50 mΩ.

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