Cooling systems for immersion cooling of IT equipment

Abstract

The present invention relates to an IT equipment cooling system, a data center cooling system and an IT cooling system module. The IT equipment cooling system includes an IT cooling module, a condenser, a return line and a supply line and an accumulator. The IT cooling module has one or more IT equipment, which is configured to provide IT services and is at least partially immersed in a liquid coolant. When the IT equipment provides IT services, the heat generated by the IT equipment is transferred to the liquid coolant, causing at least some of the liquid coolant to become vapor. The condenser is located above the IT cooling module and is configured to condense the vapor back into the liquid coolant. The return line and the supply line are both connected to the condenser and the IT cooling module to create a heat exchange loop. The return line is configured to provide vapor to the condenser, and the supply line is configured to provide condensed liquid coolant to the IT cooling module. The accumulator is configured to accumulate condensed liquid coolant before the coolant is provided to the IT cooling module by the supply line.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to cooling systems for immersion cooling of information technology (IT) equipment. Specifically, the present invention relates to an information technology (IT) equipment cooling system, a data center cooling system, and an information technology (IT) cooling system module. Background Art

[0002] For a data center that includes multiple operating electronic racks, thermal management is critical to ensuring the proper performance of servers and other IT equipment operating in the racks (e.g., performing IT services). However, without proper thermal management, the thermal environment (e.g., temperature) within the rack may exceed the thermal operating threshold, which may lead to adverse consequences (e.g., server failure, etc.). One way to manage the thermal environment is to use cooled air to cool the IT equipment. The cooled air is recirculated through a cooling unit. The heat generated by the IT equipment is captured by the cooled air and extracted by the cooling unit. A common cooling unit is a computer room air conditioning (CRAC) unit, which is a device that draws in hot exhaust return air and supplies cooled air to maintain the thermal environment of the data center.

[0003] Recently, data centers have deployed more high-power density electronic racks, packing more high-density chips more tightly together to provide higher processing power. Cooling these high-density racks by maintaining an appropriate thermal environment can be a problem for existing cooling systems, such as CRAC units. For example, although a CRAC unit can maintain a thermal environment with more conventional (or lower density) racks, the unit may not be able to effectively cool high-power density racks because they may generate heat loads at a higher rate due to the higher density of electronic devices. Or upgrading the CRAC system to meet the cooling requirements of high-density deployments may require significant costs. Another challenge with air cooling high-density racks is moving large amounts of airflow sufficient to cool the racks.

[0004] On the other hand, immersion cooling is a viable solution for high-density electronic devices, which at least partially immerses the electronic devices in a dielectric solution. However, there are challenges in implementing immersion cooling in existing data centers. For example, the cooling infrastructure of the data center may need to be modified to support the operation of the immersion cooling system, because the existing data center is designed for air cooling or other types of liquid cooling. In addition, immersion cooling is a more complex cooling solution than existing air / liquid solutions. For example, single-phase immersion cooling requires complex electronic component hardware design, mechanical pumps that may fail / leak, and major space modifications when deployed in the data center. As another example, a conventional two-phase immersion cooling system includes a condenser that is packaged in an immersion box together with the immersed electronic devices (e.g., located above the electronic devices). When performing maintenance (e.g., when a server needs to be replaced), the data center technician must remove the condenser from the box, thereby disconnecting the existing cooling loop. In order to prevent overheating when performing maintenance, the electronic devices in the box must be turned off, which will cause service interruption.

[0005] The existing data center cooling market lacks an end-to-end complete system solution to address immersion cooling design and deployment challenges. As mentioned earlier, most existing solutions focus on the modification of electronic racks or have immersion box designs to fit into existing infrastructure. Summary of the invention

[0006] The present invention provides an information technology (IT) equipment cooling system, a data center cooling system and an information technology (IT) cooling system module.

[0007] In a first aspect, the present invention provides an information technology (IT) equipment cooling system, the system comprising an IT cooling module, a condenser, a return line and a supply line, and an accumulator. The IT cooling module has one or more IT equipment, the IT equipment is configured to provide IT services and is at least partially immersed in a liquid coolant, wherein when the IT equipment provides the IT services, the IT equipment generates heat, the heat is transferred to the liquid coolant, thereby causing at least some of the liquid coolant to become vapor. The condenser is located above the IT cooling module and is configured to condense the vapor back into liquid coolant. The return line and the supply line are both connected to the condenser and the IT cooling module to create a heat exchange loop, wherein the return line is configured to provide the vapor to the condenser, and the supply line is configured to provide the condensed liquid coolant to the IT cooling module. The accumulator is configured to accumulate the condensed liquid coolant before the coolant is provided to the IT cooling module by the supply line.

[0008] In some embodiments, the IT cooling module includes a coolant tank and a tank cover on top of the coolant tank. The coolant tank has the one or more pieces of IT equipment at least partially immersed in the liquid coolant. The return line and the supply line are coupled to the tank cover, the tank cover having a vapor region configured to collect vapor provided to the condenser via the return line.

[0009] In some embodiments, the tank cover includes a first portion fixedly coupled to the coolant tank top and a second portion removably coupled to the coolant tank top.

[0010] In some embodiments, the return line and the supply line are coupled to the first portion of the tank cover.

[0011] In some embodiments, the IT equipment cooling system further includes a valve, a liquid level sensor, and a controller. The valve is connected between the accumulator and the IT cooling module. The liquid level sensor is disposed in the IT cooling module and is configured to generate a signal indicating a coolant level of the liquid coolant in the IT cooling module. The controller is configured to maintain the coolant level in the IT cooling module by controlling an opening ratio of the valve in response to the signal generated by the liquid level sensor.

[0012] In some embodiments, the condenser is tilted relative to the IT cooling module, wherein the return line is coupled to the condenser at a first position and the supply line is coupled to the condenser at a second position lower than the first position.

[0013] In some embodiments, the condenser is a gas-to-liquid heat exchanger or a liquid-to-liquid heat exchanger.

[0014] In some embodiments, the IT cooling module includes a supply connector and a return connector, wherein the supply connector and the return connector are configured to removably couple to the supply line and the return line, respectively.

[0015] In a second aspect, the present invention provides a data center cooling system, the system comprising an information technology (IT) area, a cooling area, at least one IT equipment cooling system according to the first aspect, and a cooling source. The cooling area is located above the IT area. The IT cooling module is in the IT area, the condenser is in the cooling area, the return line and the supply line enter the IT area from the cooling area and are both connected to the IT cooling module to create a first heat exchange loop, and the accumulator is located in the IT area. The cooling source is connected to the condenser of each of the at least one IT equipment cooling system to create a second heat exchange loop.

[0016] In some embodiments, the condenser is a liquid-to-liquid heat exchanger and the cooling source includes a data center liquid cooling system / cooling liquid source, wherein the cooling zone includes a liquid distribution manifold that couples the condenser to the data center liquid cooling system / cooling liquid source to create the second heat exchange loop for liquid-to-liquid heat exchange.

[0017] In some embodiments, the condenser is an air-liquid heat exchanger and the cooling source includes an air cooling unit, wherein the cooling area includes an air duct system, which is configured to supply cooling air from the air cooling unit or an external cooling air source to the inlet of the condenser and to direct hot exhaust air from the outlet of the condenser to the air cooling unit or the external cooling air source.

[0018] In some embodiments, the cooling area is separate from the IT area.

[0019] In a third aspect, the present invention provides an information technology (IT) cooling system module, the module comprising a cooling portion, an IT portion, a return line and a supply line, and an accumulator. The cooling portion comprises a condenser. The IT portion is configured to hold an IT cooling module, the IT cooling module having one or more pieces of IT equipment, the IT equipment being configured to provide IT services and being at least partially immersed in a liquid coolant, wherein when the IT equipment provides the IT services, the IT equipment generates heat, the heat being transferred to the liquid coolant, thereby causing at least some of the liquid coolant to become vapor. The return line and the supply line are both connected to the condenser, enter the IT portion from the cooling portion, and are both configured to be removably connected to the IT cooling module to create a heat exchange loop, the return line being configured to provide vapor to the condenser, the condenser being configured to condense the vapor back into liquid coolant, and the supply line being configured to provide the condensed liquid coolant to the IT cooling module. The accumulator is located in the IT section and is configured to accumulate the condensed liquid coolant before the condensed liquid coolant is provided by the supply line to the IT cooling module.

[0020] In some embodiments, the heat exchange circuit is a first heat exchange circuit, wherein the cooling portion includes a cooling distribution system and a cooling port, wherein the cooling distribution system couples the condenser to the cooling port to create a second heat exchange circuit.

[0021] In some embodiments, the condenser is a liquid-liquid heat exchanger, the liquid coolant is a first liquid coolant, and the cooling distribution system is a liquid distribution manifold, wherein the cooling port is configured to couple to a liquid cooling system to allow a second liquid coolant to circulate through the second heat exchange circuit.

[0022] In some embodiments, the condenser is an air-liquid heat exchanger and the cooling distribution system is an air duct system, wherein the cooling port is configured to be connected to an external air cooling unit, the external air cooling unit is configured to supply cooling air into the air duct system and receive hot exhaust air from the air duct system.

[0023] In some embodiments, the cooling section is above and separate from the IT section. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In the views of the accompanying drawings, these aspects are shown by way of example and not limitation, in which like reference numerals refer to like elements. It should be noted that reference to "one" or "an" aspect of the present disclosure does not necessarily refer to the same aspect, but rather to at least one aspect. In addition, for simplicity and to reduce the total number of figures, a given figure may be used to illustrate features of more than one aspect, and not all elements in a figure are required for a given aspect.

[0025] Figure 1 is a block diagram illustrating an example of an information technology (IT) equipment cooling system according to one embodiment.

[0026] Figure 2 is a block diagram illustrating another example of an IT equipment cooling system according to one embodiment.

[0027] Figure 3 is a block diagram illustrating an example of an IT equipment cooling system with a tilted condenser according to one embodiment.

[0028] Figure 4 Multiple stages of closing and then opening of a lid of an IT equipment cooling system are shown according to one embodiment.

[0029] Figure 5 Various stages are shown according to one embodiment wherein the valve is controlled to maintain the liquid coolant level.

[0030] Figure 6 is a block diagram of an example of a data center cooling system according to one embodiment.

[0031] Figure 7 is a block diagram of another example of a data center cooling system according to one embodiment.

[0032] Figure 8 is a block diagram of an example of a cooling system module according to one embodiment. DETAILED DESCRIPTION

[0033] Aspects of the present disclosure are now explained with reference to the accompanying drawings. As long as the shapes, relative positions and other aspects of the components described in a given aspect are not clearly defined, the scope disclosed herein is not limited to the components shown, which are only for illustrative purposes. In addition, although many details are set forth, it should be understood that some aspects can be implemented without these details. In other cases, well-known circuits, structures and technologies are not shown in detail to avoid obscuring the understanding of this specification. In addition, unless the meaning is obviously contrary, all ranges set forth herein are considered to include the endpoints of each range.

[0034] References in the specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0035] The present disclosure solves the above-mentioned problems by providing a full-horizontal end-to-end cooling system that can easily deploy immersion cooling with little or no complexity, and can quickly and flexibly deploy immersion cooling solutions. In addition, the cooling system enables technicians to maintain the system without disrupting the existing cooling loop. Specifically, the present disclosure describes an IT cooling system that maintains the coolant level when the box is open, allowing IT equipment cooled by the system to remain operational. In addition, the IT cooling system can be deployed in an (existing) data center, or in a separate module, which allows the user to place the IT cooling system at any location.

[0036] According to one embodiment, an information technology (IT) equipment cooling system has a heat transfer loop architecture for immersion cooling deployment, the system includes an IT cooling module having one or more IT equipment, the IT equipment being configured to provide IT services and at least partially immersed in a liquid coolant. When the IT equipment provides IT services, the IT equipment generates heat, which is transferred to the liquid coolant, causing at least some of the liquid coolant to become vapor. The system also includes a condenser located above the IT cooling module and configured to condense the vapor back into the liquid coolant. The system also includes a return line and a supply line, both of which are connected to the condenser and the IT cooling module to create a heat exchange loop. The return line is configured to provide vapor to the condenser, and the supply line is configured to provide condensed liquid coolant to the IT cooling module. The system also includes an accumulator, which is configured to accumulate condensed liquid coolant before the coolant is provided to the IT cooling module by the supply line.

[0037] In one embodiment, an IT cooling module includes a coolant tank and a tank cover, the coolant tank having one or more IT equipment at least partially immersed in a liquid coolant, the tank cover being located on top of the coolant tank, and a return line and a supply line being coupled to the tank cover. The tank cover has a vapor region configured to collect vapor provided to a condenser via a return line. In another embodiment, the tank cover includes a first portion fixedly coupled to the top of the coolant tank and a second portion removably coupled to the top of the coolant tank. In some embodiments, the return line and the supply line are coupled to the first portion of the tank cover.

[0038] In one embodiment, the system further includes a valve, a liquid level sensor, and a controller, the valve being coupled between the accumulator and the IT cooling module, the liquid level sensor being disposed within the IT cooling module and configured to generate a signal indicating a coolant liquid level of the liquid coolant within the IT cooling module, and the controller being configured to maintain the coolant liquid level within the IT cooling module by controlling an opening ratio of the valve in response to the signal generated by the liquid level sensor.

[0039] In another embodiment, the condenser is tilted relative to the IT cooling module, the return line is coupled to the condenser at a first position, and the supply line is coupled to the condenser at a second position lower than the first position. In one embodiment, the condenser is an air-to-liquid heat exchanger or a liquid-to-liquid heat exchanger. In some embodiments, the IT cooling module includes a supply connector and a return connector, wherein the supply connector and the return connector are configured to be removably coupled to the supply line and the return line, respectively.

[0040] According to another embodiment, a data center cooling system includes an IT area, a cooling area located above the IT area, a cooling source, and at least one IT equipment cooling system, which is similar to the aforementioned IT equipment cooling system. In particular, an IT cooling module of the IT equipment cooling system is in the IT area, a condenser is in the cooling area, and the area can be understood as a data center area, and a return / supply line enters the IT area from the cooling area to connect the condenser and the IT cooling module together. In addition, the cooling source is connected to the condenser to create a heat exchange loop.

[0041] In one embodiment, the condenser is a liquid-liquid heat exchanger and the cooling source includes a data center liquid cooling system / cooling liquid source, wherein the cooling zone includes a liquid distribution manifold that connects the condenser to the data center liquid cooling system to create a second heat exchange loop for liquid-liquid heat exchange. In another embodiment, the condenser is an air-liquid heat exchanger and the cooling source includes an air cooling unit, wherein the cooling zone includes an air duct system that is configured to supply cooling air from the air cooling unit or an external cooling air source to the inlet of the condenser and direct hot exhaust air from the outlet of the condenser to the air cooling unit or the external cooling air source. In one embodiment, the cooling zone is separated from the IT area. In one embodiment, using the container design concept, the two areas can be considered as two separate modules.

[0042] According to another embodiment, an IT cooling system module includes a cooling portion and an IT portion, the cooling portion including a condenser, the IT portion being configured to hold an IT cooling module, the IT cooling module having one or more pieces of IT equipment, the IT equipment being configured to provide IT services and being at least partially immersed in a liquid coolant, wherein when the IT equipment provides IT services, the IT equipment generates heat, the heat being transferred to the liquid coolant, thereby causing at least some of the liquid coolant to become vapor. The module also includes a return line and a supply line, both of which are connected to the condenser, enter the IT portion from the cooling portion, and are both configured to be removably connected to the IT cooling module to create a heat exchange loop. The return line is configured to provide vapor to the condenser, the condenser is configured to condense the vapor back into the liquid coolant, and the supply line is configured to provide condensed liquid coolant to the IT cooling module. The system also includes an accumulator, which is disposed on the supply line in the IT portion and is configured to accumulate condensed liquid coolant before the condensed liquid coolant is provided to the IT cooling module.

[0043] In one embodiment, the heat exchange circuit is a first heat exchange circuit, wherein the cooling portion includes a cooling distribution system and a cooling port, wherein the cooling distribution system connects the condenser to the cooling port to create a second heat exchange circuit. In another embodiment, the condenser is a liquid-liquid heat exchanger, the liquid coolant is a first liquid coolant, and the cooling distribution system is a liquid distribution manifold. The cooling port is configured to be connected to a liquid coolant supply and return loop to allow the secondary cooling liquid coolant to circulate through the second heat exchange circuit. In some embodiments, the condenser is an air-liquid heat exchanger, and the cooling distribution system is an air duct system. The cooling port is configured to be connected to an external air cooling unit, which is configured to supply cooling air to the air duct system and receive hot exhaust from the air duct system. In another embodiment, the cooling portion is above the IT portion and separated from the IT portion.

[0044] Figure 1 is a block diagram showing an example of an IT equipment cooling system according to one embodiment. Specifically, the figure shows an IT equipment cooling system 10 (hereinafter may be referred to as a cooling system) configured for immersion cooling of one or more pieces of IT equipment. The system includes a condenser 1, an IT cooling module 2, a return line 9, a supply line 11, and an accumulator 12. In one embodiment, the system may include more or fewer elements as described herein. For example, the system may include multiple accumulators, or may not include an accumulator at all. In one embodiment, the system is a single-loop immersion cooling system that can be deployed in any (e.g., existing) data center and / or deployed in separate prefabricated modules (e.g., containers). More information about system deployment is described herein.

[0045] The IT cooling module 2 mainly includes a coolant tank 3 and a tank cover 4. In one embodiment, the module can be formed by any type of material (e.g., plastic, metal, etc.). In another embodiment, the box can be formed by one type of material (e.g., alloy, etc.), and the cover is formed by the same or different types of materials (e.g., plastic, etc.). The coolant tank is configured to hold one or more pieces of IT equipment and liquid coolant. As shown in the figure, there are multiple (e.g., 11 pieces) of IT equipment 7 in the coolant tank, which are at least partially immersed in the liquid coolant 8. In one embodiment, the module can have any shape and configuration. For example, as shown in the figure, the module is a square box. However, in other embodiments, the module can be a rectangular box or a cylinder. As described herein, the module includes one or more pieces of IT equipment. Therefore, the size of the IT cooling module can be different to accommodate more (or less) IT equipment.

[0046] In one embodiment, these IT devices are configured to provide IT services. Specifically, the IT devices may include a host server (referred to as a host node) connected to one or more computing servers (also referred to as computing nodes, such as CPU servers and GPU servers). The host server (having one or more CPUs) is usually connected to the client through a network (e.g., the Internet) to receive requests for specific services, such as storage services (e.g., cloud-based storage services, such as backup and / or recovery), and execute applications to implement specific operations (e.g., image processing, deep data learning algorithms or modeling, etc., as part of a software as a service or SaaS platform). In response to the request, the host server assigns the task to one or more performance computing nodes or computing servers (having one or more GPUs) managed by the host server. In one embodiment, these IT devices can perform any type of computing tasks and / or can be any type of computing device (e.g., server, storage device, etc.). In one embodiment, the IT device can be an edge computing device. Therefore, when the IT device provides IT services, the device generates heat, which is transferred to the liquid coolant. This article will describe this process in detail.

[0047] In another embodiment, at least one of the IT devices may be a battery backup unit (BBU) configured to provide battery backup power to another electronic device (e.g., an electronic rack including one or more pieces of IT equipment) when a power source (e.g., alternating current (AC) mains) to the electronic rack is unavailable (e.g., during a power outage).

[0048] In one embodiment, the liquid coolant 8 can be any type of thermally conductive dielectric liquid. In another embodiment, the coolant can be a non-toxic fluid. In some embodiments, the coolant can be designed and operated to have a low boiling point (e.g., below a threshold operating temperature for at least some of the major components of the IT equipment in the IT cooling module).

[0049] As shown, the box cover 4 is located on top of the cooling box 3 and is configured to create an airtight seal to prevent liquid (e.g., coolant 8) and / or gas (e.g., vapor coolant 16) from leaking out of the IT cooling module. In one embodiment, the cover is removably connected to the coolant box. For example, in order to allow a technician to perform maintenance on the module to access IT equipment (e.g., to add / remove IT equipment), the cover can be removed. In another embodiment, the cover can be connected to the coolant box using any method (e.g., a clamp, etc.). In one embodiment, the cover can be configured to be completely removed (e.g., lifted) from the coolant box, while in another embodiment, a portion of the cover can be fixedly connected to the coolant box (e.g., by a hinge fixed to the box), wherein the fixed portion enables thermal recirculation to continue to function.

[0050] In one embodiment, the tank cover 4 can have an interior hollow (e.g., vapor) region 18 that opens to (or is in fluid communication with) the interior of the coolant tank. As described herein, the interior (or vapor region) of the cover is configured to collect vapor coolant 16, which is the result of heat transferred from the IT equipment 7 to the liquid coolant 8 and will be provided to the condenser via a return line. In another embodiment, the cover can be solid.

[0051] As shown, both the return line 9 and the supply line 11 connect the condenser 1 and the IT cooling module 2 together to create a (secondary) heat exchange loop. Specifically, one end of each of the return line 9 and the supply line 11 is connected to the condenser 1, and the other end (opposite end) of these lines is connected to the module. The return line 9 is configured to provide a vapor coolant 16 to the condenser 1, and the supply line 11 is configured to provide a condensed liquid coolant 17 from the condenser to the IT cooling module 2. In one embodiment, the return line can be different from the supply line. For example, the diameter of the return line can be greater than the diameter of the supply line. In one embodiment, the supply line 11 and the return line 9 can be composed of any material. For example, these lines can be composed of metals (e.g., copper), polymers (e.g., EPDM rubber) and / or plastics. In one embodiment, these lines can be composed of flexible materials such as rubber. In some embodiments, a line (e.g., a supply line) can be composed of a material different from another line (e.g., a return line).

[0052] Supply line 11 includes an accumulator 12 (or reservoir) configured to accumulate condensed liquid coolant 17 before the coolant is provided by the supply line to IT cooling modules 2. In one embodiment, the accumulator provides backup cooling liquid capacity for the system. More information about accumulators is described herein.

[0053] In another embodiment, the supply line 11 may include two sections, a first section of the supply line coupled between the condenser 1 and the accumulator, and a second section of the supply line coupled between the accumulator and the IT cooling module. In one embodiment, the size and / or diameter of the two sections may be different. For example, the first section may have a larger diameter than the second section. In another embodiment, the two sections have the same diameter.

[0054] In one embodiment, the return line 9 and the supply line 11 are connected to the IT cooling module 2 via the return connector 5 and the supply connector 6, respectively. These connectors are located on the top of the box cover 4 and connect the box cover (and / or the coolant tank) (the inside) with the corresponding pipeline fluid. In particular, the return connector 5 and the supply connector 6 are configured to be removably connected to the return line 9 and the supply line 11, respectively. Therefore, both connectors are able to disconnect the IT cooling module (box cover) from the heat exchange circuit. In one embodiment, the connector can be a drip-free blind-mate quick disconnect. In another embodiment, the connector can be any type of connector that enables a technician to connect the supply / return line to the module 2. In one embodiment, the return / supply line can be connected to the condenser via a similar (or different) connector. In one embodiment, a connector is assembled on either side of the supply line 11 and the return line 9 (e.g., the IT cooling module side or the condenser side). Therefore, any one of these lines can be fixedly assembled with an IT cooling module or a condenser.

[0055] The condenser 1 is a two-phase liquid-liquid heat exchanger configured to condense vapor into a cooled (condensed) liquid. As described herein, the condenser is connected to the IT cooling module 2 via a return / supply line to create a secondary heat exchange loop. In addition, the condenser 1 is connected to an external cooling source 13 via a supply line 14 and a return line 15 to create another (primary) heat exchange loop. In one embodiment, the supply line 14 is configured to supply cooled coolant to the condenser, and the return line 15 is configured to draw warm coolant from the condenser. For example, during operation (e.g., when the IT equipment 7 is working), the heat generated by the equipment causes at least some of the liquid coolant 8 to become (e.g., phase change into) vapor coolant 16. The vapor collects in the vapor region 18 and travels through the return line 9 and enters the condenser, which condenses the vapor into a liquid coolant 17 by transferring heat from the vapor to the coolant circulating in the primary heat exchange loop. The condensed liquid coolant 17 travels through the supply line 11 and returns to the coolant tank 3 .

[0056] In one embodiment, the condenser can be any type of cooling unit configured to extract thermal energy. For example, the condenser can be a single-phase liquid-liquid heat exchanger / liquid-cooled condenser. Thus, a single-phase immersion cooling liquid can be used for IT cooling modules. In another embodiment, the system 10 can include one or more pumps (e.g., as part of one or both of the return line 9 and the supply line 11) configured to pump the liquid coolant 8 from the coolant tank 3 into the condenser 1.

[0057] In one embodiment, external cooling source 13 can be any source configured to extract heat from the coolant circulating through the primary heat exchange loop. For example, source 13 can be a data center cooling water system or an IT liquid cooling water system, or any type of cooling fluid source. As another example, source 13 can include a liquid distribution manifold (not shown) that couples the heat exchange source with one or more other IT cooling systems.

[0058] Figure 2is a block diagram showing another example of an IT equipment cooling system 20 according to one embodiment. As shown, the system 20 includes a condenser 21 and one or more fans 22, the condenser 21 being a two-phase gas-liquid heat exchanger. In one embodiment, the fan 22 can be coupled to the condenser 21. For example, the fan can be part of the condenser. As another example, the fan can be part of a data center air cooling system, and the fan is coupled to the inlet 23 of the condenser via an air duct (not shown). More information about the air duct is described herein. Thus, during operation, the fan pushes (cooled) air into the inlet 23 of the condenser 21. The air travels through the condenser, draws heat from the vapor, and condenses the vapor into a liquid coolant. The condenser 21 discharges hot exhaust from an outlet 24 (e.g., into an air duct that discharges the hot air into the environment). For a single-sided deployment, the condenser may be directly exposed to the ambient air.

[0059] Figure 3 is a block diagram illustrating an example of an IT equipment cooling system 30 with an inclined condenser according to one embodiment. Specifically, the figure shows a condenser (e.g., condenser 1) that is inclined relative to an IT cooling module 2. Thus, a return line is coupled to the condenser at a first position and a supply line is coupled to the condenser at a second position that is lower than the first position. In one embodiment, the supply line is lower because the condensed liquid coolant will naturally travel downward after being condensed by the condenser. In one embodiment, the condenser can be assembled on the return line in a vertical manner to better assist in fluid transport.

[0060] Figure 4 The multiple stages of closing and then opening the lid of an IT equipment cooling system 40 according to one embodiment are shown. Specifically, the figure shows two stages 41 and 42, which show that the lid is closed and then opened. As shown, the lid 4 includes two parts: a (first) fixed part 44 and a (second) adjustable part 43. The fixed part is fixedly connected to the top of the coolant tank 3. For example, the fixed part can be a part of the coolant tank (for example, both are an integrated unit). As another example, the fixed part and the coolant tank can be joined together via fasteners (for example, rivets, screws, adhesives, etc.). In contrast, the adjustable part 43 is removably connected to the top of the coolant tank. As shown, the adjustable part is connected to the fixed part via a hinge. In one embodiment, the adjustable part can be completely removed (for example, separated from the fixed part and the coolant tank). In one embodiment, the adjustable part can be connected to the top (and / or fixed part) of the coolant tank via any type of coupling mechanism (for example, a clamp, etc.). It is also shown that the return line 9 and the supply line 11 are connected to the fixed part 44 of the lid 4. In one embodiment, either line may be coupled to the adjustable portion or the fixed portion.

[0061] The first stage 41 shows the tank cover closed. Specifically, the adjustable portion 43 is coupled to the top of the coolant tank. As described herein, when the adjustable portion is coupled to the top of the coolant tank, an airtight seal is created that prevents liquids / gases from entering / leaving the cooling system. The second stage 42 shows the tank cover open. Specifically, the adjustable portion 43 is separated from the coolant tank, thereby allowing access to the interior of the coolant tank.

[0062] Figure 5 Multiple stages according to one embodiment are shown in which a valve is controlled to maintain a liquid coolant level in conjunction with a fluid accumulator when a piece of IT equipment is removed from an IT cooling module. The figure shows a cooling system 50 that includes a valve 53, a controller 54, and a level sensor 55. The valve 53 is coupled to the supply line 11 and is configured to allow (or prevent) condensed liquid coolant 17 (from the accumulator) from traveling through (the remainder of) the supply line to the coolant tank 3. Specifically, the valve is coupled between the accumulator 12 and (the supply connector 6 of) the IT cooling module 2. As described herein, the opening ratio of the valve can be adjusted (by the controller 54) to control (or adjust) the flow rate of the condensed liquid coolant entering the coolant tank. In one embodiment, instead of (or in addition to) the valve 53, the system may include a valve on the return line 9.

[0063] The level sensor 55 is disposed within (the coolant tank of) the IT cooling module and is configured to sense the (current) level of the liquid coolant and generate an electrical signal indicating (or representing) the coolant level within the coolant tank. In one embodiment, the sensor 55 may be any type of sensor (e.g., a float switch, an ultrasonic level sensor, etc.) configured to detect the level of the liquid coolant 8 within the IT cooling module 2. In one embodiment, the level sensor (and / or additional level sensors) may be disposed within the accumulator.

[0064] The controller 54 can be a dedicated processor, such as an application specific integrated circuit (ASIC), a general purpose microprocessor, a field programmable gate array (FPGA), a digital signal controller, or a set of hardware logic structures (e.g., filters, arithmetic logic units, and dedicated state machines). In one embodiment, the controller can be a circuit having a combination of analog elements (e.g., resistors, capacitors, inductors, etc.) and / or digital elements (e.g., logic-based elements such as transistors, etc.). The controller can also include a memory. In one embodiment, the controller can be part of (or integrated into) an IT cooling module. In another embodiment, the controller can be one of a plurality of pieces of IT equipment at least partially immersed in the coolant 8.

[0065] In one embodiment, the controller 54 is communicatively coupled (e.g., wired and / or wirelessly connected) to the valve 53 and / or the level sensor 55. Specifically, the controller is configured to receive the current coolant level (as an electrical signal) from the sensor and control the valve (e.g., by transmitting the control signal to the control circuit of the valve, such as an electronic switch) so as to adjust the opening ratio of the valve (e.g., at least partially open the valve, fully open the valve, or close the valve). In one embodiment, the controller can control the valve based on the current coolant level. More information about how the controller controls the valve is described herein.

[0066] As described herein, a controller may control a valve to maintain a minimum coolant level within the coolant tank. Figure 5 The two stages of 51 illustrate this situation. Stage 51 shows that when the cooling system is operating (e.g., the IT equipment is working (e.g., providing IT services) and therefore generating heat, which causes liquid vapor to be generated), the tank cover is opened (e.g., an adjustable portion of the cover is opened). When the cover is opened, the fluid recirculation loop is disconnected. The liquid continues to evaporate, and therefore, less condensed liquid coolant flows back to the tank. Therefore, the control valve needs to adjust its opening ratio to maintain the coolant level. Just before the cover is opened, the vapor is contained within the IT cooling module (e.g., within a portion of the cover and / or coolant tank), and the system may have been in a stable state. In other words, the condenser is condensing a steady flow of cooling liquid, and the controller has set the valve to a certain opening ratio (e.g., 50%) based on the coolant level. This allows the condensed coolant from the accumulator to enter the coolant tank at a first flow rate, which can ensure that the coolant level in the tank does not drop below a threshold. This stage also illustrates that the coolant level in the accumulator is approximately half.

[0067] Stage 52 shows that a technician is removing a piece of IT equipment 7a from the cooling module. In this case, not only is the heat loop broken, resulting in less condensed coolant flowing back to the tank, but a larger volume of coolant is required to occupy the space to maintain the coolant level within the IT cooling module. For example, the equipment may not be operating and / or needs to be replaced with a different piece of equipment. Since this piece of IT equipment 7a displaced coolant when it was in the tank, when it is removed, the coolant is put back into the volume space that the equipment once occupied. In response, the coolant level may begin to drop, which is measured (or sensed) by the level sensor 55 and transmitted to the controller 54. In order to maintain the (predetermined) coolant level, the controller has adjusted the opening ratio of the valve 53 (e.g., with a new opening ratio of 75%), allowing more condensed coolant to enter the coolant tank from the accumulator at a second flow rate that is faster than the first flow rate. This is shown as five drops of coolant entering the tank from the supply line, rather than four drops as shown in stage 51. Therefore, the controller maintains the coolant level within the tank, ensuring that the existing IT equipment operating within the tank remains immersed in coolant. Additionally, the coolant level in the accumulator has dropped because coolant is flowing out of the accumulator faster.

[0068] In one embodiment, in order to adjust the opening ratio, the controller can compare the sensed coolant level with the threshold level. If the current coolant level is below the threshold, the controller can adjust the opening ratio by a predetermined amount (e.g., 1%, 2%, 3%, etc.). In another embodiment, the controller can use multiple coolant level readings from two or more level sensors to determine how to adjust the opening ratio of the valve. For example, as described herein, the coolant tank and the accumulator may include separate level sensors. The controller can compare the coolant levels in the coolant tank and the accumulator to adjust the opening ratio. For example, if the coolant tank coolant level is below the (first) threshold, but the accumulator coolant level is above the (second) threshold, the controller can increase the opening ratio to allow more coolant to enter the tank.

[0069] This stage also shows a reduction in the liquid coolant condensed by the condenser. Specifically, as described above, before the cover is opened, most of the vapor generated in the coolant tank is provided to the condenser. However, because the cover is opened in stage 52, a considerable amount of vapor escapes into the ambient environment instead of traveling through the return line to the condenser and becoming liquid again. This results in the condenser condensing less coolant than in the previous stage (this is shown as one drop of liquid coolant entering the accumulator instead of two drops).

[0070] In one embodiment, the accumulator 12 can have an entry point, such as an opening with a cap (e.g., a screwable cap) that is configured to be removably connected to the opening. The opening enables a technician to add coolant to the accumulator so that coolant is added to the system at any time under normal operating conditions or abnormal operating conditions. In one embodiment, the opening can be connected to a coolant source / coolant replenishment unit via a valve controlled by a controller. The controller can be configured to adjust the valve so that additional coolant is added to the accumulator as needed. In one embodiment, the controller can use a coolant level reading from a level sensor disposed in the accumulator to determine whether to add additional liquid coolant (e.g., adding coolant when the level in the accumulator is below a threshold).

[0071] In another embodiment, when a piece of IT equipment is added to the box, the IT equipment takes up more volume, so the liquid level increases after the cover is closed. Therefore, in order to reduce the liquid level within the IT cooling module, the opening ratio of the valve can be reduced for a certain period of time. During this period of time, more fluid from the condenser may accumulate in the accumulator. When the fluid level returns to a normal level, the valve adjusts its opening ratio back to the normal level.

[0072] In another embodiment, the coolant tank may include a drain valve (not shown) that is communicatively coupled to the controller 54 and configured to drain the coolant out of the coolant tank. Specifically, when the coolant level exceeds a threshold, the controller may control the drain valve to release coolant from the tank to ensure that the tank does not overflow when another piece of IT equipment replaces the removed equipment.

[0073] Figure 6 6 is a block diagram of an example of a data center cooling system according to an embodiment. Specifically, the figure shows a data center cooling system 61, which includes a data center building 62 having an IT area 63, a cooling area 64, and a cooling (liquid) source 65. As shown, the cooling area is located above the IT area. In one embodiment, both areas can be part of a data center room that is separated by a wall (or barrier) to create two areas. In another embodiment, the two areas are at least partially fluidly connected to each other. In some embodiments, the cooling area and the IT area can be independently designed and constructed and assembled with an existing cooling source (e.g., cooling source 65) of an existing data center building.

[0074] As shown, the data center cooling system 61 includes three cooling systems 10. In one embodiment, the data center cooling system may include more or fewer cooling systems. Each of the cooling systems 10 is separated between the cooling area and the IT area. For each cooling system, the condenser 1 is located in the cooling area 64, and the IT cooling module 2 (and the accumulator 12) is located in the IT area. The supply line 11 and the return line 9 both connect the condenser and the IT cooling module together and enter the IT area from the cooling area. In one embodiment, the arrangement of the cooling system may be different. For example, the accumulator may be located in the cooling area 64.

[0075] Cooling zone 64 includes a liquid distribution system (or manifold) 66 that couples each of the condensers to a data center supply line 67 and a data center return line 68. Supply line 67 and return line 68 are both coupled to cooling source 65, which can be any type of data center liquid cooling system. Cooling source 65 can be part of an existing data center infrastructure. Thus, each of the condensers is coupled to cooling source 65 to create a heat exchange loop for liquid-to-liquid heat exchange, as described herein.

[0076] Figure 7 6 is a block diagram of another example of a data center cooling system according to one embodiment. Specifically, the figure shows a data center cooling system 71 that uses air cooling in cooling area 64 instead of Figure 6 Liquid cooling shown. For example, a data center cooling system 71 includes a cooling system 20, and the cooling system 20 includes a condenser 21, which is an air-liquid heat exchanger. In the figure, a cooling source 72 is a data center air cooling unit, such as a computer room air conditioning (CRAC) unit, which cools hot air and circulates air to a cooling area or a fresh air wall from a direct free air cooling solution. In another embodiment, the cooling source can be an external cooling air source. For example, the cooling source 72 can provide cold air to the cooling area through a cooling air supply 74, and receive hot exhaust through an air return 75. As shown in the figure, the cooling area includes an air duct system 73, which is configured to guide (supply) cold air from an air cooling unit to at least one condenser, and to supply hot exhaust from at least one of the condensers to the air cooling unit. In particular, the system 73 can connect a cooling air supply 74 to the inlet of each condenser via at least one air duct, and return hot exhaust 75 to the outlet of each condenser via at least one air duct. In one embodiment, the air duct system 73 may only include air ducts coupled to the outlet of each condenser to the air return 75, while the air supply 74 provides cool air directly to the cooling area.

[0077] Figure 8 It is a block diagram of an example of a cooling system module according to an embodiment. Specifically, the figure shows a cooling system module 80, which includes one or more IT cooling systems as described herein. For example, module 80 includes a cooling section 84 and an IT section. As shown in the figure, the cooling section is above the IT section. The cooling section is configured to maintain one or more condensers, and the IT section 83 is configured to maintain one or more corresponding IT cooling modules of the IT cooling system. For each IT cooling system, the return line and the supply line are connected to the condenser and the IT cooling module, and enter the IT section 83 from the cooling section 84. In one embodiment, the two parts are separated from each other (for example, separated by a wall or ceiling). In another embodiment, the two parts are fluidly connected to each other. In some embodiments, the cooling system module 80 can be prefabricated with one or more elements described herein. For example, module 80 can be a container made of at least some of the elements of each of the parts 83 and 84 and the IT cooling system. Specifically, the module may include one or more condensers coupled to supply and return lines, and one or more IT cooling modules (eg, IT cooling module 2) may be added to module 80 (eg, after deployment at a designated location).

[0078] As described herein, the module 80 can be prefabricated. As a result, the module 80 can be relocated from one location to another. For example, once positioned at a desired location, the cooling port 82 can be coupled to an external cooling source 81 (via a cooling line 86) to enable immersion cooling of IT equipment. Thus, the module 80 allows immersion cooling to be performed at any location, rather than at a specific location, such as at a data center.

[0079] The cooling section 84 includes a cooling distribution system 85 and cooling ports 82. The cooling distribution system couples each of the condensers to the cooling ports 82, and the ports can be coupled to an external cooling source 81 (via cooling lines 86) to create a heat exchange loop, as described herein. In one embodiment, the module 80 can be manufactured to accommodate liquid cooling and / or air cooling. For example, when the condenser is a liquid-liquid heat exchanger, the cooling distribution system 85 can be a liquid distribution system, similar to Figure 6 system 66. The port (which in this case may be a connector as described herein) is configured to be coupled to an external cooling source 81, such as a liquid cooling system (which includes a liquid coolant supply and return loop) via a cooling line 86, which may be a liquid line to allow coolant to circulate through a liquid-liquid heat exchange loop.

[0080] As another example, when the condenser is an air-to-liquid heat exchanger, the cooling distribution system may be an air duct system similar to Figure 7 The ports (which in this case may be air inlets and air outlets) are configured to couple to an external cooling source, such as an external air cooling unit, which is configured to supply cooling air into the system 85 and receive hot exhaust gas from the system via a cooling line 86, which may be a separate air duct, thereby creating an air-liquid heat exchange loop.

[0081] In one embodiment, any of the IT cooling systems described herein (e.g., 10, 20, 30, 40, and 50) can be part of any of the data center cooling systems 61 and 71 and / or cooling system modules 80. In another embodiment, any of the IT cooling systems can include elements of the other systems. For example, cooling system 10 can include valve 53 and controller 54 of system 50.

[0082] As described above, embodiments of the present disclosure may be (or include) a non-transitory machine-readable medium (e.g., a microelectronic memory) having stored thereon instructions that program one or more data processing components (collectively referred to herein as "processors") to perform cooling operations, such as controlling the opening ratio of a valve disposed on a supply line to maintain the liquid coolant level within an IT cooling module. In other embodiments, some of these operations may be performed by specific hardware components that include hardwired logic. These operations may also be performed by any combination of programmed data processing components and fixed hardwired circuit components.

[0083] In the foregoing description, embodiments of the present disclosure have been described with reference to specific exemplary embodiments thereof. It will be apparent that various modifications may be made thereto without departing from the broader spirit and scope of the present disclosure as set forth in the appended claims. Therefore, the description and drawings are to be regarded as illustrative rather than restrictive.

[0084] Although certain aspects have been described and shown in the drawings, it should be understood that these aspects are merely illustrative and not limiting of the broad disclosure, and the disclosure is not limited to the specific constructions and arrangements shown and described, since various other modifications may occur to those skilled in the art. Therefore, the description is to be regarded as illustrative and not restrictive.

[0085] In some aspects, the disclosure may include language, such as, “at least one of [element A] and [element B]”. Such language may refer to one or more elements. For example, “at least one of A and B” may refer to “A”, “B”, or “A and B”. Specifically, “at least one of A and B” may refer to “at least one of A and at least one of B”, or “at least one of A or B”. In some aspects, the disclosure may include language, such as, “[element A], [element B], and / or [element C]”. Such language may refer to any one of the elements or any combination thereof. For example, “A, B, and / or C” may refer to “A”, “B”, “C”, “A and B”, “A and C”, “B and C”, or “A, B, and C”.

Claims

1. An IT equipment cooling system, comprising: An IT cooling module, comprising: a coolant tank and a tank cover on the top of the coolant tank; the coolant tank has one or more IT equipment, the IT equipment is configured to provide IT services and is at least partially immersed in a liquid coolant, wherein when the IT equipment provides the IT services, the IT equipment generates heat, the heat is transferred to the liquid coolant, thereby causing at least some of the liquid coolant to become vapor; the tank cover has a vapor area, the vapor area is configured to collect vapor, the tank cover includes a first part fixedly connected to the top of the coolant tank and a second part removably connected to the top of the coolant tank, wherein when the second part is removed from the top of the coolant tank, the tank cover is opened; a condenser located above the IT cooling module and configured to condense the vapor back into a liquid coolant; a return line and a supply line, both coupled to the condenser and the first portion of the tank cover to create a heat exchange circuit, wherein the return line is configured to provide the vapor from the vapor region to the condenser; and an accumulator coupled to the supply line, configured to receive and accumulate the condensed liquid coolant, and configured to provide the accumulated coolant to the coolant tank through the supply line; When the box cover is opened, the IT equipment is configured to continue to provide the IT service, the condenser is configured to continue to condense the vapor back into liquid coolant, and the accumulator is configured to continue to provide the accumulated coolant to the coolant tank. 2 . The IT equipment cooling system according to claim 1 , wherein the second part is connected to the first part by a hinge.

3. The IT equipment cooling system of claim 1, wherein the accumulator includes an entry point for adding additional coolant to the accumulator.

4. The IT equipment cooling system according to any one of claims 1 to 3, further comprising: a valve coupled to the supply line and located between the accumulator and the IT cooling module; a level sensor disposed within the coolant tank and configured to generate a signal indicative of a coolant level of the liquid coolant within the coolant tank; and A controller is configured to maintain a coolant level in the coolant tank by controlling an opening ratio of the valve in response to the signal generated by the level sensor.

5. The IT equipment cooling system according to any one of claims 1 to 3, wherein the condenser is tilted relative to the IT cooling module, wherein the return line is connected to the condenser at a first position, and the supply line is connected to the condenser at a second position lower than the first position. 6 . The IT equipment cooling system according to claim 1 , wherein the condenser is an air-liquid heat exchanger or a liquid-liquid heat exchanger.

7. The IT equipment cooling system according to any one of claims 1 to 3, wherein the IT cooling module comprises a supply connector and a return connector, wherein: The supply connector and the return connector are configured to be removably coupled to the supply line and the return line, respectively.

8. A data center cooling system, comprising: IT area; a cooling area located above the IT area; At least one IT equipment cooling system according to any one of claims 1 to 7, wherein an IT cooling module is in the IT area, the IT cooling module comprising a coolant tank and a tank cover on the top of the coolant tank; the coolant tank has one or more pieces of IT equipment, the IT equipment is configured to provide IT services and is at least partially immersed in liquid coolant, wherein when the IT equipment provides the IT services, the IT equipment generates heat, the heat is transferred to the liquid coolant, thereby causing at least some of the liquid coolant to become vapor; the tank cover has a vapor area, the vapor area is configured to collect vapor, the tank cover comprises a first portion fixedly connected to the top of the coolant tank and a second portion removably connected to the top of the coolant tank, wherein when the second portion is removed from the top of the coolant tank, the tank cover is opened; the condenser being within the cooling region and configured to condense the vapor back into a liquid coolant; The return line and the supply line enter the IT area from the cooling area and are both coupled to the first portion of the cover to create a first heat exchange loop, the return line being configured to provide the vapor from the vapor area to the condenser; an accumulator disposed in the IT area, coupled to the supply line, configured to receive and accumulate the condensed liquid coolant, and configured to provide the accumulated coolant to the coolant tank through the supply line; and a cooling source coupled to the condenser of each of the at least one IT equipment cooling system to create a second heat exchange loop; When the box cover is opened, the IT equipment is configured to continue to provide the IT service, the condenser is configured to continue to condense the vapor back into liquid coolant, and the accumulator is configured to continue to provide the accumulated coolant to the coolant tank.

9. The data center cooling system of claim 8, wherein the condenser is a liquid-to-liquid heat exchanger and the cooling source comprises a data center liquid cooling system / cooling liquid source, wherein the cooling zone comprises a liquid distribution manifold coupling the condenser to the data center liquid cooling system / cooling liquid source to create the second heat exchange loop for liquid-to-liquid heat exchange.

10. The data center cooling system of claim 8, wherein the condenser is an air-to-liquid heat exchanger and the cooling source comprises an air cooling unit, wherein the cooling area comprises an air duct system configured to supply cooling air from the air cooling unit or an external cooling air source to an inlet of the condenser and to direct hot exhaust air from an outlet of the condenser to the air cooling unit or an external cooling air source.

11. The data center cooling system of any one of claims 8 to 10, wherein the cooling area is separate from the IT area.

12. An IT cooling system module, comprising: a cooling section, which includes a condenser; An IT portion configured to hold an IT cooling module, the IT cooling module comprising: a coolant tank and a tank cover on top of the coolant tank, the coolant tank having one or more pieces of IT equipment, the IT equipment being configured to provide IT services and at least partially immersed in a liquid coolant, wherein when the IT equipment provides the IT services, the IT equipment generates heat, the heat being transferred into the liquid coolant, thereby causing at least some of the liquid coolant to become vapor; the tank cover having a vapor region configured to collect vapor, the tank cover comprising a first portion fixedly coupled to the top of the coolant tank and a second portion removably coupled to the top of the coolant tank, wherein when the second portion is removed from the top of the coolant tank, the tank cover opens; a return line and a supply line, both coupled to the condenser, entering the IT section from the cooling section, and both configured to be removably coupled to the first portion of the tank cover to create a heat exchange loop, the return line being configured to provide vapor from the vapor region to the condenser, the condenser being configured to condense the vapor back into liquid coolant; and an accumulator coupled to the supply line, located in the IT section, and configured to receive and accumulate the condensed liquid coolant, and configured to provide the accumulated coolant to the coolant tank through the supply line; When the box cover is opened, the IT equipment is configured to continue to provide the IT service, the condenser is configured to continue to condense the vapor back into liquid coolant, and the accumulator is configured to continue to provide the accumulated coolant to the coolant tank.

13. The IT cooling system module of claim 12, wherein the heat exchange loop is a first heat exchange loop, wherein the cooling portion includes a cooling distribution system and a cooling port, wherein the cooling distribution system couples the condenser to the cooling port to create a second heat exchange loop.

14. The IT cooling system module of claim 13, wherein the condenser is a liquid-liquid heat exchanger, the liquid coolant is a first liquid coolant, and the cooling distribution system is a liquid distribution manifold, wherein the cooling port is configured to couple to a liquid cooling system to allow a second liquid coolant to circulate through the second heat exchange loop.

15. The IT cooling system module of claim 13, wherein the condenser is an air-to-liquid heat exchanger and the cooling distribution system is an air duct system, wherein the cooling port is configured to be coupled to an external air cooling unit, the external air cooling unit being configured to supply cooling air into the air duct system and receive hot exhaust air from the air duct system.

16. The IT cooling system module of any one of claims 12 to 15, wherein the cooling section is above and separate from the IT section.

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