Antenna Package

Abstract

The present invention provides an antenna package, which includes: a substrate; a wiring pattern bonded to the substrate; a first organic insulating film formed on the substrate and sealing the wiring pattern; an antenna pattern formed on the first organic insulating film; a conductive through hole passing through the first organic insulating film to connect the wiring pattern and the antenna pattern; and a second organic insulating film formed on the first organic insulating film and sealing the antenna pattern.

Description

Technical Field

[0001] The present invention relates to an antenna package, and more particularly, to an antenna package having a thin thickness to improve flexibility. Background Art

[0002] Ultra-high frequencies of 20 GHz or higher (i.e., frequencies in the millimeter wave band) are used as the main frequency resources for next-generation information and communication services. By using broadband characteristics, frequencies in the millimeter wave band can transmit a large amount of information at high speed.

[0003] In the millimeter wave band, the electrical connection distance between the antenna and the IC chip is very important. That is, since the loss increases with the distance between the antenna and the IC chip, it is preferred to electrically connect the antenna of the millimeter wave band (especially the 60 GHz band) to the vicinity of the IC chip.

[0004] Korean Patent Publication No. 2014-0015607 (Semiconductor package and its manufacturing method) includes: a semiconductor chip, a packaging part for packaging the semiconductor chip, a substrate part including an upper substrate formed on the upper surface of the packaging part and a lower substrate formed on the lower surface of the packaging part, an antenna part formed in the packaging part or the substrate part and electrically connected to the semiconductor chip, and a through-hole connection part formed through the packaging part, etc.

[0005] However, in Korean Patent Publication No. 2014-0015607, the antenna part is formed on the outer surface of the upper substrate. In addition, the upper substrate is thick, and the upper substrate is composed of a multi-layer substrate. As a result, the connection distance between the antenna part and the semiconductor chip (IC chip) is long. However, there are limitations in reducing their connection distance. Summary of the invention

[0006] Technical issues

[0007] The present invention aims to solve the problems of the prior art, and the antenna package of the present invention aims to shorten the connection distance between the antenna and the IC chip by reducing the thickness of the antenna forming area.

[0008] Secondly, the antenna package of the present invention reduces the thickness of the antenna forming area. In this way, the flexibility of the antenna package is increased, and as a result, it can be easily applied to foldable devices and the like.

[0009] Technical Solution

[0010] The antenna package of the present invention for achieving the above-mentioned object may include a substrate, a wiring pattern, a first organic insulating film, an antenna pattern, a conductive via, a second organic insulating film, and the like.

[0011] The substrate may include an IC chip, connection pads, etc.

[0012] A wiring pattern is formed on a substrate, and may be combined with a connection pad or the like.

[0013] A first organic insulating film may be formed on the substrate while sealing the wiring pattern.

[0014] The antenna pattern may be formed on the first organic insulating film.

[0015] A conductive via may penetrate the first organic insulating film to connect the wiring pattern and the antenna pattern.

[0016] A second organic insulating film may be formed on the first organic insulating film while sealing the antenna pattern.

[0017] In the antenna package of the present invention, the first organic insulating film and the second organic insulating film may be cured layers of a photosensitive resin composition containing an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent.

[0018] In the antenna package of the present invention, the first organic insulating film and the second organic insulating film may each have a thickness of 0.1 to 2.5 μm.

[0019] In the antenna package of the present invention, the conductive via and the antenna pattern may be the same electrode.

[0020] In the antenna package of the present invention, the substrate may include an IC chip.

[0021] In the antenna package of the present invention, the conductive via may have a tapered shape.

[0022] The manufacturing method of the antenna package according to the present invention includes the following steps: forming a wiring pattern on a substrate; forming a first organic insulating film that seals the wiring pattern on the substrate; forming a contact hole for opening the wiring pattern in the first organic insulating film by photolithography; forming a conductive through hole in the contact hole; forming an antenna pattern connected to the conductive through hole on the first organic insulating film; and forming a second organic insulating film that seals the antenna pattern on the first organic insulating film.

[0023] In the method of manufacturing the antenna package according to the present invention, the step of forming the conductive path and the step of forming the antenna pattern may be performed in a single process.

[0024] In the method of manufacturing the antenna package according to the present invention, the step of forming the first organic insulating film and the second organic insulating film may include applying and curing a photosensitive resin composition including an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent.

[0025] In the method of manufacturing the antenna package according to the present invention, in the step of forming the first organic insulating film and the second organic insulating film, the first organic insulating film and the second organic insulating film may be formed to each have a thickness of 0.1 to 2.5 μm.

[0026] Effects of the Invention

[0027] In the antenna package of the present invention having such a structure, a conductive via and an antenna pattern are formed by photolithography using an organic insulating film. As a result, the present invention can reduce the connection distance between the antenna pattern and the IC chip. In this way, the present invention can minimize signal loss in ultra-high frequency communication.

[0028] In addition, the antenna package of the present invention can reduce the overall thickness of the antenna package by thinning the antenna forming area. As a result, the present invention can increase the flexibility of the antenna package. In addition, the present invention is easily applicable to foldable devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a cross-sectional view of an antenna package according to the present invention.

[0030] Figures 2a to 2i is a cross-sectional view showing a method of manufacturing an antenna package according to the present invention. DETAILED DESCRIPTION

[0031] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0032] Figure 1 is a cross-sectional view of an antenna package according to the present invention.

[0033] Reference Figure 1 The antenna package of the present invention includes a substrate 110, a wiring pattern 140, a first organic insulating film 121, an antenna pattern 130, a conductive via 150, a second organic insulating film 123, and the like.

[0034] The substrate 110 may be a flexible substrate. The substrate 110 may use a flexible substrate such as PI (polyimide), MPI (modified polyimide), LCP (liquid crystal polymer), COP (cycloolefin polymer), TAC (cellulose triacetate), PET (polyethylene terephthalate), PC (polycarbonate), PCT (polycyclohexadiene dimethylene terephthalate), etc.

[0035] The substrate 110 may include an IC chip 111 , connection pads 113 , a packaging portion 115 , and the like.

[0036] The IC chip 111 may perform wireless communication with the outside through electrical connection with the antenna pattern 130 .

[0037] The connection pad 113 may be connected to the wiring pattern 140 to transmit a wireless signal, power, etc. between the IC chip 111 and the antenna pattern 130. The connection pad 113 may have a solder bump shape, etc., in addition to a pad shape.

[0038] The package part 115 may protect the IC chip 111 from external impact by internally embedding and sealing the IC chip 111. The package part 115 may be formed by a method such as molding, etc. The package part 115 may use epoxy molding compound (EMC) or the like.

[0039] like Figure 1 As shown, the substrate 110 may be formed in a form in which the IC chip 111 is built in. In addition, the substrate 110 may be configured in a form in which the IC chip 111, the connection pad 113, etc. are bonded to the surface.

[0040] The wiring pattern 140 may be formed on the substrate 110 and the organic insulating film 120. The wiring pattern 140 may be combined with the connection pad 113 and the antenna pattern 130, etc. In addition, the wiring pattern 140 may be combined with an external power source, an external device, etc. to transmit power and data signals, etc.

[0041] The first organic insulating film 121 may be formed on the substrate 110 while sealing the wiring pattern 140 .

[0042] The first organic insulating film 121 may be formed of a material to which photolithography can be applied. The first organic insulating film 121 may be a cured layer of a photosensitive resin composition including an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent.

[0043] The alkali-soluble resin is generally reactive under the action of light or heat. The alkali-soluble resin is a component that imparts solubility to an alkali developer in a development step when forming a pattern.

[0044] The alkali-soluble resin can be used by selecting a resin having an acid value of 10 to 200 (KOH mg / g). The acid value is a value measured as the amount of potassium hydroxide (mg) required to neutralize 1 gram of polymer, and relates to solubility. If the acid value of the alkali-soluble resin is less than the above range, it may be difficult to ensure a sufficient development speed. On the contrary, if the acid value of the alkali-soluble resin exceeds the above range, the adhesion with the substrate 110 is reduced, and pattern short circuits are likely to occur. In addition, if the acid value of the alkali-soluble resin exceeds the above range, the storage stability of the entire composition may be reduced and the viscosity may increase.

[0045] In addition, the weight average molecular weight of the alkali soluble resin may be 3000 to 200000 Da, preferably 5,000 to 100,000 Da. The alkali soluble resin may be directly polymerized or purchased and used so that the molecular weight distribution is in the range of 1.5 to 6.0, preferably in the range of 1.8 to 4.0. When an alkali soluble resin having a molecular weight and a molecular weight distribution within this range is used, the hardness is improved, the residual film rate is high, the solubility of the unexposed portion in the developer is excellent, and the resolution can be improved.

[0046] The alkali-soluble resin can be prepared by copolymerizing a monomer having a carboxyl group and an unsaturated bond and a monomer having an unsaturated bond copolymerizable therewith.

[0047] Monomers having a carboxyl group and an unsaturated bond include: monocarboxylic acids, such as acrylic acid, methacrylic acid and crotonic acid; dicarboxylic acids, such as fumaric acid, mesaconic acid and itaconic acid; anhydrides of these dicarboxylic acids; mono(meth)acrylates of polymers having carboxyl groups and hydroxyl groups at both ends, such as ω-carboxy polycaprolactone mono(meth)acrylate, etc.

[0048] The copolymerizable monomer may be one selected from the group consisting of an aromatic vinyl compound, an unsaturated carboxylic acid ester compound, an unsaturated carboxylic acid aminoalkyl ester compound, an unsaturated carboxylic acid glycidyl ester compound, a carboxylic acid vinyl ester compound, an unsaturated ether compound, a vinyl cyanide compound, an unsaturated imide compound, an aliphatic conjugated diene compound, a macromonomer having a monoacryloyl group or a monomethacryloyl group at the end of the molecular chain, a bulky monomer, and a combination thereof.

[0049] The content of the alkali-soluble resin is not particularly limited, and the content can be 2 to 80% by weight, preferably 10 to 70% by weight, based on 100% by weight of the total solid content of the photosensitive resin composition. When the content of the alkali-soluble resin is within the above range, a pattern layer is easily formed. In addition, when the content of the alkali-soluble resin is within the above range, the film reduction of the exposed portion during development can be prevented, so that the omission of the unexposed portion can be improved.

[0050] The photopolymerizable compounds can increase the crosslinking density and enhance the mechanical properties of the photocurable films during the manufacturing process.

[0051] The photopolymerizable compound is a compound that can be polymerized by the action of light and a photopolymerization initiator described below, and includes monofunctional monomers, bifunctional monomers, and other polyfunctional monomers.

[0052] As the monofunctional monomer, nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, N-vinyl pyrrolidone, and the like can be used.

[0053] As the bifunctional monomer, 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyl)ethoxy ether of bisphenol A, 3-methylpentanediol di(meth)acrylate, and the like can be used.

[0054] As the polyfunctional monomer, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, or the like can be used.

[0055] The content of the photopolymerizable compound is not particularly limited, but may be contained in a range of 5 to 45 wt % relative to 100 wt % of the total solid content in the photosensitive resin composition. When the photopolymerizable compound is contained in the above content, durability is good and developability is improved.

[0056] A photopolymerization initiator may be used without any particular limitation on the type thereof, as long as it can polymerize a photopolymerizable compound. From the viewpoint of polymerization properties, initiation efficiency, absorption wavelength, availability, price, etc., the photopolymerization initiator may use one or more compounds selected from the group consisting of acetophenone-based compounds, benzophenone-based compounds, triazine-based compounds, biimidazole-based compounds, oxime-based compounds, and thioxanthone-based compounds.

[0057] In addition, the photopolymerization initiator may further include a photopolymerization initiation aid to improve the sensitivity of the photosensitive resin composition. The photosensitive resin composition includes the photopolymerization initiation aid, whereby the sensitivity is further improved and the productivity can be improved.

[0058] As the photopolymerization initiation aid, one or more compounds selected from the group consisting of an amine compound, a carboxylic acid compound, and an organic sulfur compound having a thiol group may be used.

[0059] The content of the photopolymerization initiator may be 0.1 to 40 parts by weight, preferably 1 to 30 parts by weight, relative to 100 parts by weight of the total amount of the alkali-soluble resin and the photopolymerizable compound. When the photopolymerization initiator is included within the above range, since the photosensitive resin composition is highly sensitive, exposure time is shortened, and as a result, productivity can be improved.

[0060] In addition, when a photopolymerization initiation aid is further used, the content of the photopolymerization initiation aid may be 0.1 to 40 parts by weight, preferably 1 to 30 parts by weight, relative to 100 parts by weight of the total amount of the alkali-soluble resin and the photopolymerizable compound. When the amount of the photopolymerization initiation aid is within the above range, the sensitivity of the photosensitive resin composition becomes high, and the productivity of the photocurable film can be improved.

[0061] There is no particular limitation on the solvent, and an organic solvent commonly used in the art can be used. As the solvent, ethers, aromatic hydrocarbons, ketones, alcohols, esters, amides, etc. can be used.

[0062] In view of coating performance and drying performance, among the above solvents, an organic solvent having a boiling point of 100° C. to 200° C. is preferred. As the organic solvent, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, etc. can be used. These solvents can be used alone or in combination of two or more.

[0063] The content of the solvent may be 40 to 95% by weight, preferably 45 to 85% by weight, relative to 100% by weight of the total photosensitive resin composition. When the content of the solvent is within the above range, the coating property can be improved when the coating is applied by a coating device such as a roll coater, a spin coater, a slit spin coater, a slit coater (sometimes referred to as a die coater) or an inkjet.

[0064] In an embodiment of the present invention, a polymer material may be used as a material of the first organic insulating film 121. The polymer material may use one or more substances selected from the group consisting of polyacrylate, polymethacrylate (e.g., PMMA), polyimide, polyamide, polyvinyl alcohol, polyamic acid, polyolefin (e.g., PE, PP), polystyrene, polynorbornene, phenylmaleimide copolymer, polyazobenzene, polyphthalamide, polyester (e.g., PET, PBT), polyarylate, cinnamate polymer, coumarin polymer, phthalimide polymer, chalcone polymer, and aromatic acetylene polymer.

[0065] Table 1 below shows the results of the deflection test according to the thickness of the first organic insulating film 121. In the deflection test, when bending at each radius of curvature 100,000 times, it was checked whether cracks occurred. If cracks occurred, it was marked as X (bad), and if no cracks occurred, it was marked as ○ (normal).

[0066]

Table 1

[0067]

[0068]

[0069] As can be seen from Table 1 above, when the thickness of the first organic insulating film 121 is 2.7 μm or less, it passes the 3R curvature test. When the thickness of the first organic insulating film 121 is 2.5 μm or less, it passes the 2R curvature test. On the other hand, when the first organic insulating film 121 is formed to be less than 0.1 μm, due to the thickness of the wiring pattern 140 and the first antenna pattern 131, difficulties occur in sealing the wiring pattern 140 and the antenna pattern 130, etc.

[0070] Considering the above experimental results and the difficulty of realizing products, the thickness of the first organic insulating film 121 is preferably configured in the range of 0.1 to 2.7 μm. Considering the launch of 2R curvature products in the future, it may be desirable to configure the first organic insulating film 121 to have a thickness of 0.1 to 2.5 μm.

[0071] The first antenna pattern 131 may be formed on the first organic insulating film 121. The first antenna pattern 131, as a radiator, may include a microstrip antenna, a patch antenna, a dipole, a monopole, a loop antenna, etc. The first antenna pattern 131 may have various shapes, such as a linear shape, a polygonal shape, and a circular shape.

[0072] The conductive via 150 can penetrate the first organic insulating film 121 to connect the wiring pattern 140 and the first antenna pattern 131, and can connect the wiring pattern 140 and the wiring pattern 140 arranged separately up and down. The conductive via 150 can have a tapered shape. The tapered shape can be a positive / reverse tapered shape, but the positive tapered shape can be more preferred. The tapered shape can stably connect the circuit connected to the conductive via 150 without short circuit. The tapered shape can realize a circuit that is resistant to electrostatic discharge (ESD). The cone angle is preferably 5 to 70°, more preferably 15 to 50°.

[0073] The second organic insulating film 123 may be formed on the first organic insulating film 121 while sealing the first antenna pattern 131 and the wiring pattern 140 , etc., formed on the first organic insulating film 121 .

[0074] Similar to the first organic insulating film 121 , the second organic insulating film 123 may be formed of a cured layer of a photosensitive resin composition including an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent, or may be formed of a polymer material.

[0075] Table 2 below shows the results of the flexure test according to the thickness in the case where the first organic insulating film 121 and the second organic insulating film 123 have the same thickness. In the flexure test, similar to the flexure test of the first organic insulating film 121, when bending 100,000 times at each radius of curvature, it was checked whether cracks occurred. If cracks occurred, it was marked as X (bad), and if no cracks occurred, it was marked as ○ (normal).

[0076]

Table 2

[0077] Each organic insulating film thickness\test curvature 2R 3R 5R 3.5μm X X ○ 3.0μm X X ○ 2.8μm X X ○ 2.7μm X X ○ 2.6μm X X ○ 2.5μm X ○ ○ 2.4μm X ○ ○ 2.3μm X ○ ○ 2.2μm ○ ○ ○

[0078] As can be seen from Table 2 above, when the thickness of the first organic insulating film 121 and the second organic insulating film 123 are 2.5 μm or less, respectively, they pass the 3R curvature test. When the thickness of the first organic insulating film 121 and the second organic insulating film 123 are 2.2 μm or less, respectively, they pass the 2R curvature test. Therefore, when the organic insulating film is stacked into two layers, it is preferred that the thickness of the first organic insulating film 121 and the second organic insulating film 123 are respectively set in the range of 0.1 to 2.5 μm. Considering the future launch of 2R curvature products on the market, the thickness of the first organic insulating film 121 and the second organic insulating film 123 are preferably 0.1 to 2.2 μm, respectively.

[0079] exist Figure 1 In the embodiment, the antenna pattern 130 and the conductive via 150 may be formed separately through separate processes, or may be formed simultaneously through the same process to form an integrated electrode, ie, a common electrode.

[0080] exist Figure 1 In the embodiment, on the second organic insulating film 123, similar to the above-mentioned combined structure of the first antenna pattern 131, the conductive via 150 and the second organic insulating film 123, the second antenna pattern 133, the conductive via 150 and the third organic insulating film 125 can be formed to have two or more antenna patterns. Through this stacking structure, a multi-channel antenna package can be configured.

[0081] Figures 2a to 2i is a cross-sectional view showing a method of manufacturing an antenna package according to the present invention.

[0082] In the method for manufacturing the antenna package according to the present invention, first in a first step, for example, Figure 2a As shown, a substrate 110 in which an IC chip 111 is sealed to a package part 115 and a portion of a connection pad 113 is exposed may be prepared.

[0083] In the second step, if Figure 2bAs shown, a wiring pattern 140 may be formed on the substrate 110. The wiring pattern 140 may be connected to the connection pad 113.

[0084] In the third step, if Figure 2c As shown, a first organic insulating film 121 can be formed, which simultaneously seals the wiring pattern 140 on the substrate 110. The first organic insulating film 121 can be formed by applying and curing a photosensitive resin composition by a method such as coating. The coating step may include pre-drying the applied photosensitive resin composition. Thus, a smooth coating film can be obtained by removing volatile components such as solvents. At this time, the thickness of the coating film can be 0.1 to 2.5 μm. Curing can be performed using a UV light source or a heat source, etc.

[0085] In the fourth step, if Figure 2d As shown, the first contact hole CH1 for forming the conductive path 150 may be formed by selectively exposing and developing a partial region of the photosensitive resin composition.

[0086] In the exposure step, a pattern mask, an ultraviolet irradiator, or the like may be used.

[0087] In the development step, the first contact hole CH1 may be formed by dissolving and removing the unexposed region by contacting an alkaline aqueous solution as a developer with the cured coating film by ultraviolet irradiation. After development, drying may be performed at 150 to 230° C. for 10 to 60 minutes as needed.

[0088] In the fifth step, if Figure 2e As shown, by depositing a conductive material on the top surface of the first contact hole CH1 and the first organic insulating film 121, a conductive via 150, a first antenna pattern 131, a wiring pattern 140, etc. may be formed. In this step, the conductive via 150, the first antenna pattern 131, and the wiring pattern 140 formed at the same layer as the first antenna pattern 131 may be simultaneously formed by the same process. The conductive via 150 may be formed by a separate process, and then the first antenna pattern 131 or the wiring pattern 140 formed at the same layer as the first antenna pattern 131 may be sequentially formed.

[0089] In the sixth step, if Figure 2f As shown, a second organic insulating film 123 may be formed, which simultaneously seals the first antenna pattern 131 and the wiring pattern 140, etc., on the first organic insulating film 121. Similar to the first organic insulating film 121, the second organic insulating film 123 may be formed by applying and curing a photosensitive resin composition by a method such as coating. The second organic insulating film 123 may be formed to a thickness of 0.1 to 2.5 μm.

[0090] Meanwhile, a multi-layer (multi-channel) antenna structure may be formed by additionally forming a second antenna pattern 133 on the second organic insulating film 123. Figure 2g to Figure 2i As shown, the following steps may be additionally performed: forming a second contact hole CH2 in the second organic insulating film 123; forming a second antenna pattern 133 and a wiring pattern 140, etc.; and forming a third organic insulating film 125 on the second organic insulating film 123 while sealing the second antenna pattern 133. Figure 2g to Figure 2i The steps are the same as above Figure 2d to Figure 2f The steps are the same, so Figure 2g to Figure 2i A detailed description of the steps will be used Figure 2d to Figure 2f Replace with the relevant description.

[0091] Above, the present invention has been described in an exemplary manner, and these examples are intended to illustrate the present invention. Those skilled in the art will be able to transform or modify these embodiments in other forms. However, since the scope of the present invention is limited by the appended claims, these variations can be interpreted as being included within the scope of the present invention.

[0092] [Description of Reference Numerals]

[0093] 110: substrate 111: IC chip

[0094] 113: connection pad 115: packaging part

[0095] 120: organic insulating film 121, 123, 125: first to third organic insulating films

[0096] 130: antenna pattern 131, 133: first antenna pattern, second antenna pattern

[0097] 140: Wiring pattern 150: Conductive via

[0098] CH1, CH2: contact holes.

Claims

1. An antenna package, the antenna package include: substrate; a wiring pattern bonded to the substrate; a first organic insulating film formed on the substrate with a thickness of 0.1 to 2.5 μm while sealing the wiring pattern, and the first organic insulating film is a cured layer of a photosensitive resin composition containing an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent; an antenna pattern formed on the first organic insulating film; a conductive via penetrating the first organic insulating film to connect the wiring pattern and the antenna pattern; as well as A second organic insulating film is formed on the first organic insulating film with a thickness of 0.1 to 2.5 μm while sealing the antenna pattern, and is a cured layer of a photosensitive resin composition containing an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent.

2. The antenna package according to claim 1, in, The conductive via and the antenna pattern are the same electrode.

3. The antenna package according to claim 1, in, The substrate includes an IC chip.

4. The antenna package according to claim 1, in, The conductive via has a tapered shape.

5. A method for manufacturing an antenna package, the manufacturing method The following steps are involved: forming a wiring pattern on a substrate; forming a first organic insulating film sealing the wiring pattern on the substrate with a thickness of 0.1 to 2.5 μm, wherein the first organic insulating film is a cured layer of a photosensitive resin composition containing an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent; forming a contact hole for opening the wiring pattern in the first organic insulating film by photolithography; forming a conductive via in the contact hole; forming an antenna pattern connected to the conductive via on the first organic insulating film; as well as A second organic insulating film sealing the antenna pattern is formed on the first organic insulating film with a thickness of 0.1 to 2.5 μm and is a cured layer of a photosensitive resin composition including an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent.

6. The method for manufacturing the antenna package according to claim 5, in, The step of forming the conductive via and the step of forming the antenna pattern are a single process.

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