Display device manufacturing method

Abstract

This invention relates to a method for manufacturing a display device. The method may include the following steps: preparing a mother substrate defining a first unit region and a second unit region, wherein a first target region is defined in the first unit region and a second target region is defined in the second unit region; providing an encapsulating material to a first printed area within the first target region to form a first encapsulation layer; and providing the encapsulating material to a second printed area within the second target region to form a second encapsulation layer, wherein the center of the second printed area is offset in a predetermined direction relative to the center of the second target region.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a display device with improved precision. Background Technology

[0002] The light-emitting layer of an organic light-emitting display device may include organic materials. To protect organic materials susceptible to oxygen and moisture, various technologies are being developed for sealing organic light-emitting elements. Among these, thin-film encapsulation technology blocks the penetration pathways of air and moisture by arranging an encapsulation layer on the organic light-emitting element. The encapsulation layer may include a structure in which inorganic encapsulation layers containing inorganic materials are alternately stacked with organic encapsulation layers containing organic materials. Summary of the Invention

[0003] The purpose of this invention is to provide a method for manufacturing a display device, including a step of forming an encapsulation layer with improved precision.

[0004] A method for manufacturing a display device according to an embodiment of the present invention may include the following steps: preparing a mother substrate having a first unit region and a second unit region defined therein, wherein a first target region is defined in the first unit region and a second target region is defined in the second unit region; providing an encapsulating material to a first printing area within the first target region to form a first encapsulation layer; and providing the encapsulating material to a second printing area within the second target region to form a second encapsulation layer, wherein the center of the second printing area is offset in a predetermined direction relative to the center of the second target region.

[0005] The second printing area can overlap with the second target area, and the center of the second printing area is offset from the center of the second target area toward the center of the mother substrate.

[0006] The mother substrate can be defined with 2m+1 portions defined along a first direction and n portions defined along a second direction intersecting the first direction, thereby defining a total of (2m+1)×n portions including the first unit region and the second unit region, where m is a positive integer and n is a positive integer.

[0007] The first unit region can be arranged in the (m+1)th part defined along the first direction, and the center of the first printing region and the center of the first target region are arranged on the same line extending along the second direction.

[0008] The n can be 2k+1, where k is a positive integer. The first unit region is arranged in the (k+1)th part defined along the second direction. The center of the first printing region and the center of the first target region are arranged on the same line extending along the first direction.

[0009] The second unit region may be arranged in the area surrounding the mother substrate, and the center of the second printed region is offset from the center of the second target region toward the center of the mother substrate.

[0010] A first hole region may be defined in the first target region, a second hole region may be defined in the second target region, a first non-printed hole larger than the first hole region may be defined in the first printing region, and a second non-printed hole larger than the second hole region may be defined in the second printing region.

[0011] The position of the first non-printed hole relative to the first printed area can be the same as the position of the second non-printed hole relative to the second printed area.

[0012] A first additional printing area may be defined within the first target area. The first additional printing area has a first outer boundary with a size corresponding to the first non-printed hole and a first inner boundary with a size smaller than the first non-printed hole. A second additional printing area may also be defined within the second target area. The second additional printing area has a second outer boundary with a size corresponding to the second non-printed hole and a second inner boundary with a size smaller than the second non-printed hole. The display device manufacturing method further includes the following steps: providing the encapsulating material to the first additional printing area; and providing the encapsulating material to the second additional printing area.

[0013] The position of the first additional printing area relative to the first target area and the position of the second additional printing area relative to the second target area can be the same as each other.

[0014] The position of the first additional printing area relative to the first printing area and the position of the second additional printing area relative to the second printing area may be different.

[0015] A portion of the second additional printing area may overlap with the second printing area.

[0016] The encapsulating material can be provided to the first printed area, the first additional printed area, the second printed area, and the second additional printed area in the same process.

[0017] The encapsulating material can be a monomer.

[0018] A method for manufacturing a display device according to an embodiment of the present invention may include the following steps: preparing a mother substrate having a first unit region and a second unit region defined thereon, wherein a first target region is defined in the first unit region and a second target region is defined in the second unit region; defining a first printing region in the first target region; defining a second printing region in the second target region; printing an encapsulating material in the first printing region to form a first encapsulation layer; and printing the encapsulating material in the second printing region to form a second encapsulation layer, wherein the position of the first printing region relative to the first target region is different from the position of the second printing region relative to the second target region.

[0019] The area of ​​the first target area can be the same as the area of ​​the second target area, the area of ​​the first printing area can be the same as the area of ​​the second printing area, and the area of ​​the first target area can be larger than the area of ​​the first printing area.

[0020] The method for manufacturing the display device may further include the following steps: a first hole region may be defined in the first target region, a second hole region may be defined in the second target region, a first non-printed hole larger than the first hole region may be defined in the first printed region, and a second non-printed hole larger than the second hole region may be defined in the second printed region, wherein the position of the first non-printed hole relative to the first printed region is the same as the position of the second non-printed hole relative to the second printed region.

[0021] The method for manufacturing the display device may further include the following steps: defining a first additional printing area within the first target area, the first additional printing area having a first outer boundary with a size corresponding to the first non-printed hole and a first inner boundary with a size smaller than the first non-printed hole; defining a second additional printing area within the second target area, the second additional printing area having a second outer boundary with a size corresponding to the second non-printed hole and a second inner boundary with a size smaller than the second non-printed hole.

[0022] The step of forming the first encapsulation layer may further include printing the first encapsulation material in the first additional printing area, and the step of forming the second encapsulation layer may further include printing the second encapsulation material in the second additional printing area.

[0023] The position of the first additional printing area relative to the first target area may be the same as the position of the second additional printing area relative to the second target area, and the position of the first additional printing area relative to the first printing area may be different from the position of the second additional printing area relative to the second printing area. A portion of the second additional printing area overlaps with the second printing area.

[0024] According to the present invention, the position of the printing area to be printed can be adjusted considering the deviation in the malleability of the monomer. The malleability of the monomer can vary depending on the position of the area to be printed on the mother substrate. Therefore, the position of the printing area relative to the target area can be designed differently depending on the position of the target area on the mother substrate, so that the monomer is uniformly formed on the target area. As a result, the deviation in the distance between the end of the organic encapsulation layer formed by the monomer and the target area can be reduced. That is, the process precision of the organic encapsulation layer can be further improved. Therefore, even if the width of the area surrounding the display panel is reduced, the probability of the organic encapsulation layer being exposed to the outside is reduced, thereby improving the reliability of the display device. Attached Figure Description

[0025] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention.

[0026] Figure 2 This is a cross-sectional view of a display device according to an embodiment of the present invention.

[0027] Figure 3 This is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0028] Figure 4 This is a cross-sectional view of the encapsulation layer according to an embodiment of the present invention.

[0029] Figure 5 This is a plan view of a display panel according to an embodiment of the present invention.

[0030] Figure 6 This is a magnified image. Figure 5 The diagram shown is of AA'.

[0031] Figure 7 This is a plan view of a mother substrate according to an embodiment of the present invention.

[0032] Figure 8A This is a magnified image. Figure 7 A picture of BB'.

[0033] Figure 8B This is a magnified image. Figure 7 The image of CC'.

[0034] Figure 9 This is a plan view of a display panel according to an embodiment of the present invention.

[0035] Figure 10 This is a magnified image. Figure 9 The diagram shown is of DD'.

[0036] Figure 11This is a plan view of a mother substrate according to an embodiment of the present invention.

[0037] Figure 12A This is a magnified image. Figure 11 The diagram of EE'.

[0038] Figure 12B This is a magnified image. Figure 11 The image of FF'.

[0039] Figure 13 This is a plan view of a mother substrate according to an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures

[0041] 1000: Display device; 1100: Mother substrate

[0042] 100C: Cell region; 100Ta: Target region

[0043] 100Pa: Printing area 100Apa: Additional printing area Detailed Implementation

[0044] In this specification, when it is mentioned that a certain component (or region, layer, part, etc.) is "above", "connected" or "combined" with another component, it means that it can be directly arranged on or directly connected / combined with another component, or a third component can be arranged between them.

[0045] The same reference numerals refer to the same constituent elements. Furthermore, in the drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for the purpose of effectively illustrating the technical content.

[0046] "And / or" includes all combinations of more than one that can be defined in relation to the related composition.

[0047] The terms "first," "second," etc., can be used to describe multiple constituent elements, but the constituent elements should not be limited by the terms. The terms are used only to distinguish one constituent element from another. For example, without departing from the scope of the invention, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element. Singular expressions include plural expressions unless the context explicitly indicates a different meaning.

[0048] Furthermore, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are explained based on the directions indicated in the accompanying drawings.

[0049] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms identical to those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the context of the relevant art, and are hereby expressly defined unless interpreted as having an ideal or overly formal meaning.

[0050] Terms such as “including” or “having” should be understood as: used to specify the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, rather than precluding the presence or possibility of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0051] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0052] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention. Figure 2 This is a cross-sectional view of a display device according to an embodiment of the present invention. Figure 3 This is a cross-sectional view of a display panel according to an embodiment of the present invention. Figure 4 This is a cross-sectional view of the encapsulation layer according to an embodiment of the present invention.

[0053] Reference Figure 1 The display device 1000 can be a device activated by an electrical signal. The display device 1000 can be applied to large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablet computers, car navigation systems, game consoles, and smartwatches. In this embodiment, the display device 1000 is exemplarily illustrated as a smartphone.

[0054] The display device 1000 can display an image 1000-I facing a third direction DR3 from a display surface that is parallel to the first direction DR1 and the second direction DR2, respectively. The display surface of the image 1000-I can correspond to the front surface of the display device 1000.

[0055] In this embodiment, the front surface (or upper surface) and back surface (or lower surface) of each component are defined with reference to the direction of the displayed image 1000-I. The front surface and the back surface may be opposite to each other in the third direction DR3, and the normal directions of the front surface and the back surface may be parallel to the third direction DR3.

[0056] Reference Figure 2The display device 1000 may include a display panel 100, an input sensor 200, and a window 300.

[0057] Display panel 100 may be configured to substantially generate image 1000-I. Display panel 100 may be a light-emitting display panel. For example, display panel 100 may be an organic light-emitting display panel or a quantum dot light-emitting display panel.

[0058] The input sensor 200 can be disposed on the display panel 100. The display panel 100 and the input sensor 200 can be formed by a continuous process, or the display panel 100 and the input sensor 200 can be bonded together by an adhesive component. The adhesive component can typically include an adhesive or glue. For example, the adhesive component can be a transparent adhesive component such as a pressure-sensitive adhesive film (PSA), an optically clear adhesive film (OCA), or an optically clear resin (OCR).

[0059] Input sensor 200 senses external input 2000 applied from the outside. External input 2000 can be user input. User input includes various forms of external input such as a part of the user's body, light, heat, a pen, or pressure. In this embodiment, external input 2000 is illustrated as a user's hand. However, this is only an exemplary illustration, and as described above, external input 2000 can be provided in various forms, and can also sense external input 2000 applied to the side or back of the display device 1000 depending on the structure of the display device 1000, and is not limited to any one embodiment.

[0060] Window 300 may be disposed on input sensor 200. Window 300 may include an optically transparent insulating material. For example, window 300 may include glass or plastic. Window 300 may have a multilayer structure or a single-layer structure. For example, window 300 may include multiple plastic films bonded by adhesive, or include a glass substrate and plastic films bonded by adhesive.

[0061] Reference Figure 3 The display panel 100 may include a substrate layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0062] The substrate layer 110 can be a glass substrate, an organic / inorganic composite material substrate, a plastic substrate, or a laminated structure including multiple insulating layers.

[0063] The circuit layer 120 may be disposed on the substrate layer 110. The circuit layer 120 may include at least one insulating layer, at least one conductive layer, and at least one semiconductor layer. The circuit layer 120 may include signal lines and pixel driving circuits, etc.

[0064] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include display elements, such as organic light-emitting diodes.

[0065] Encapsulation layer 140 seals light-emitting element layer 130. Encapsulation layer 140 may include multiple inorganic layers and at least one organic layer disposed therebetween.

[0066] Reference Figure 4 The encapsulation layer 140 may include a first inorganic encapsulation layer 141, an organic encapsulation layer 142, and a second inorganic encapsulation layer 143. However, it is not limited to this, and the encapsulation layer 140 may also include multiple organic encapsulation layers and multiple inorganic encapsulation layers.

[0067] The first inorganic encapsulation layer 141 may cover the light-emitting element layer 130. The first inorganic encapsulation layer 141 may prevent external moisture or oxygen from penetrating into the light-emitting element layer 130. The first inorganic encapsulation layer 141 may include compounds of silicon nitride, silicon oxide, or combinations thereof. The first inorganic encapsulation layer 141 may be formed by a chemical vapor deposition process.

[0068] An organic encapsulation layer 142 may be disposed on the first inorganic encapsulation layer 141. The organic encapsulation layer 142 may contact the first inorganic encapsulation layer 141. The organic encapsulation layer 142 may form a flat surface on the first inorganic encapsulation layer 141. Bending or particles present on the upper surface of the first inorganic encapsulation layer 141 may be covered by the organic encapsulation layer 142, thereby preventing the surface condition of the first inorganic encapsulation layer 141 from affecting the structure formed on the organic encapsulation layer 142.

[0069] The organic encapsulation layer 142 may include an encapsulating material, such as a monomer. In one embodiment of the invention, the organic encapsulation layer 142 may be formed by a solution process, such as inkjet printing. The formation process of the organic encapsulation layer 142 will be described in detail below.

[0070] The second inorganic encapsulation layer 143 may be disposed on and cover the organic encapsulation layer 142. The second inorganic encapsulation layer 143 can prevent external moisture or oxygen from penetrating into the organic encapsulation layer 142. The second inorganic encapsulation layer 143 may include compounds of silicon nitride, silicon oxide, or combinations thereof.

[0071] Figure 5 This is a plan view of a display panel according to an embodiment of the present invention. Figure 6 This is a magnified image. Figure 5 The diagram shown is of AA'.

[0072] Reference Figure 5 The display panel 100 can be defined as an active area 100A and a surrounding area 100N.

[0073] The active region 100A can be a region activated by an electrical signal. For example, the active region 100A can be a display image 1000-I (see reference). Figure 1 (area).

[0074] The surrounding area 100N can be the area that surrounds the active area 100A. Drive circuits or drive lines for driving the active area 100A can be arranged in the surrounding area 100N.

[0075] The display panel 100 includes a substrate layer 110, multiple signal lines 121, 122, 123, multiple pads 124, multiple pixels 131, and multiple protrusions 150. The multiple protrusions 150 may be referred to as multiple dams. The multiple protrusions 150 may be composed of at least one layer.

[0076] Multiple signal lines 121, 122, 123, multiple pads 124, and multiple protrusions 150 may be included. Figure 3 The configuration in the circuit layer 120. Multiple pixels 131 may include light-emitting elements and pixel circuitry, and the light-emitting elements may be included in... Figure 3 The pixel circuit in the light-emitting element layer 130 may be included in the configuration of the light-emitting element layer 130. Figure 3 The configuration of the circuit layer 120.

[0077] Pixel 131 can be arranged in the active region 100A. Figure 5 Only one pixel, 131, is illustrated. Signal lines 121, 122, and 123 are connected to pixel 131 to transmit electrical signals to it. Figure 5 The illustration exemplarily depicts signal lines 121, 122, and 123 comprising a data line 121, a scan line 122, and a power line 123. However, this is merely an exemplary illustration, and signal lines 121, 122, and 123 may also include at least one of an initialization voltage line and a light emission control line, and are not limited to any particular embodiment.

[0078] The display panel 100 can provide externally supplied electrical signals to the pixels 131 via pad 124. Pad 124 may include a first pad 125 and a second pad 126. Multiple first pads 125 may be provided and connected to data lines 121 respectively. The second pad 126 may be electrically connected to power lines 123. In addition to the first pad 125 and the second pad 126, pad 124 may also include other pads for receiving electrical signals, and is not limited to any particular embodiment.

[0079] The plurality of protrusions 150 may include a first protrusion 151, a second protrusion 152, and a third protrusion 153. In a plane, the first protrusion 151 may surround the active region 100A, the second protrusion 152 may surround the first protrusion 151, and the third protrusion 153 may surround the second protrusion 152.

[0080] Reference Figure 6 When the organic encapsulation layer 142 is formed, the first protrusion 151, the second protrusion 152, and the third protrusion 153 can control the flow of the organic encapsulation layer 142. The end of the organic encapsulation layer 142 can be disposed inside the third protrusion 153. The inside is defined as the region separated from the edge of the substrate layer 110 in the direction toward the active region 100A. For example, the end of the organic encapsulation layer 142 can be disposed between the second protrusion 152 and the third protrusion 153.

[0081] First inorganic encapsulation layer 141 (refer to) Figure 4 The first protrusion 151, the second protrusion 152, and the third protrusion 153 can be completely covered. The second inorganic encapsulation layer 143 (see reference) Figure 4 This can completely cover the organic encapsulation layer 142. Therefore, it can prevent the organic encapsulation layer 142 from being exposed to the outside, thereby preventing external moisture from penetrating into the organic encapsulation layer 142.

[0082] Figure 7 This is a plan view of a mother substrate according to an embodiment of the present invention.

[0083] Reference Figure 3 , Figure 4 and Figure 7 Prepare a mother substrate 1100. Multiple unit regions 100C can be defined on the mother substrate 1100. Each of the multiple unit regions 100C can be separated from the mother substrate 1100 to form a display panel 100.

[0084] The cell regions 100C can be defined on the mother substrate 1100, spaced apart from each other along the first direction DR1 and the second direction DR2. For example, 20 cell regions 100C can be defined on the mother substrate 1100 along the first direction DR1 and 5 cell regions 100C can be defined along the second direction DR2, and the embodiment is not limited to any one of them.

[0085] A circuit layer 120 may be formed on each unit region 100C, a light-emitting element layer 130 may be formed on the circuit layer 120, and a first inorganic encapsulation layer 141 may be formed on the light-emitting element layer 130.

[0086] An organic encapsulation layer 142 can be formed on the first inorganic encapsulation layer 141. Before forming the organic encapsulation layer 142, printing areas can be defined in each unit region 100C. The position of the printing area relative to each unit region 100C can be adjusted differently for each predetermined region on the mother substrate 1100. For example, 2m+1 portions (m is a positive integer) can be defined on the mother substrate 1100 along the first direction DR1, and n portions (n ​​is a positive integer) can be defined along the second direction DR2. That is, a total of (2m+1)×n regions can be defined on the mother substrate 1100.

[0087] In one embodiment of the present invention, m can be 1 and n can be 3. Therefore, a first region 111, a second region 112, a third region 113, a fourth region 114, a fifth region 115, a sixth region 116, a seventh region 117, an eighth region 118, and a ninth region 119 can be defined on the mother substrate 1100, and are not limited to any one embodiment.

[0088] Region 111, Region 112, and Region 113 can be defined sequentially along the first direction DR1 and form the first row. Region 114, Region 115, and Region 116 can be defined sequentially along the first direction DR1 and form the second row. Region 117, Region 118, and Region 119 can be defined sequentially along the first direction DR1 and form the third row.

[0089] An organic encapsulation layer 142 may be formed on each cell region 100C. The organic encapsulation layer 142 may include monomers. During the formation of the organic encapsulation layer 142, the malleability of the monomers may vary depending on the position of the cell region 100C. For example, in the cell region 100C defined in the first region 111, the malleability on the left side may be better than that on the right side, and the malleability on the upper side may be better than that on the lower side.

[0090] Good ductility can be judged by the distance between the reference position and the end of the organic encapsulation layer 142. For example, refer to... Figure 6The reference position is defined as the position of one side 152S of the second protrusion 152. One side 152S can be defined as the side of the second protrusion 152 adjacent to the first protrusion 151. The ductility can be judged relative to the distance DT between one side 152S and the end of the organic encapsulation layer 142. It can be said that the larger the distance DT, the better the ductility.

[0091] For example, when the position of one side 152S is defined as 0, and the end of the organic encapsulation layer 142 is separated from one side 152S in the direction toward the third protrusion 153, the distance DT can be a positive value. When the end of the organic encapsulation layer 142 is separated from one side 152S in the direction toward the first protrusion 151, the distance DT can be a negative value.

[0092] In the unit region 100C defined in the second region 112, the extensibility on the left and right sides may not differ significantly, and the extensibility on the upper side may be better than that on the lower side. In the unit region 100C defined in the third region 113, the extensibility on the right side may be better than that on the left side, and the extensibility on the upper side may be better than that on the lower side. In the unit region 100C defined in the fourth region 114, the extensibility on the left side may be better than that on the right side, and the extensibility on the upper side and the lower side may not differ significantly. In the unit region 100C defined in the fifth region 115, the extensibility on the right, left, upper, and lower sides may not differ significantly.

[0093] In cell region 100C defined in region 116 (sixth region), the extensibility on the right side can be better than that on the left side, and the extensibility on the upper side can be roughly the same as that on the lower side. In cell region 100C defined in region 117 (seventh region), the extensibility on the left side can be better than that on the right side, and the extensibility on the lower side can be better than that on the upper side. In cell region 100C defined in region 118 (eighth region), the extensibility on the left side can be roughly the same as that on the right side, and the extensibility on the lower side can be better than that on the upper side. In cell region 100C defined in region 119 (ninth region), the extensibility on the right side can be better than that on the left side, and the extensibility on the lower side can be better than that on the upper side.

[0094] According to one embodiment of the present invention, the position of the printed area relative to the target area can be adjusted based on the position of the target area within the mother substrate 1100, taking into account the ductility deviations described above. The target area can be defined as the area surrounded by one side 152S of the second protrusion 152. The printed area can be defined as the area where the monomer will be printed.

[0095] According to an embodiment of the present invention, since the position of the printed area relative to the target area is adjusted according to the position of the target area within the mother substrate 1100, the reduction in the position of the organic encapsulation layer 142 (see reference) formed by the monomer can be achieved. Figure 4 The deviation between the end of the organic encapsulation layer 142 and the outer edge of the target region. That is, the deviation between the distance between the end of the organic encapsulation layer 142 and the outer edge of the target region can be improved. Figure 4 The precision of the manufacturing process. Therefore, even if the display panel 100 (refer to) has a high degree of precision in its manufacturing process. Figure 5 The surrounding area 100N (refer to) Figure 5 The width of the organic encapsulation layer 142 is reduced (refer to...). Figure 4 The probability of exposure to the outside will also decrease, thus improving the display device 1000 (refer to...). Figure 1 The reliability of ).

[0096] Figure 8A This is a magnified image. Figure 7 A picture of BB'. Figure 8B This is a magnified image. Figure 7 The image of CC'.

[0097] like Figure 8A As shown, the BB' region may include cell regions 100Ca, 100Cb, 100Cc, 100Cd, 100Ce, and 100Cf, such as... Figure 8B As shown, the CC' region includes unit regions 100Ca, 100Cb, 100Cc, 100Cg, 100Ch, and 100Ci. Target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can be defined at the ends of the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti, respectively. Figure 5 ) and the second protrusion 152 (refer to Figure 5 Between. However, this is only an example, and the position of the end of the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, 100Ti can be varied depending on the number or product of the protrusions 151, 152, 153.

[0098] The areas of unit regions 100Ca, 100Cb, 100Cc, 100Cd, 100Ce, 100Cf, 100Cg, 100Ch, and 100Ci can be the same as each other, and the areas of target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can be the same as each other. The target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti are all identical to the unit regions 100Ca, 100Cb, 100Cc, 100Cd, 100Ce, 100Cf, 100Cg, 100Ch, and 100Ci in the first region 111, the second region 112, the third region 113, the fourth region 114, the fifth region 115, the sixth region 116, the seventh region 117, the eighth region 118, and the ninth region 119.

[0099] According to one embodiment of the present invention, the positions of the printed regions 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Th, and 100Ti relative to the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can be adjusted based on the positions of the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti within the mother substrate 1100, taking into account deviations in ductility. For example, after dividing the mother substrate 1100 into predetermined, easily manageable regions, the positions of the printed regions relative to the target regions can be applied uniformly within a single region. For instance, within a first region 111, the positions of the printed regions 100Pe can all be offset by the same degree relative to the position of the target region 100Te.

[0100] The fifth region 115 may be the central region of the mother substrate 1100. For example, the fifth region 115 (e.g., its center) may overlap with the center of the mother substrate 1100. The unit region 100Ca defined in the fifth region 115 is referred to as the first unit region 100Ca. The target region 100Ta defined in the first unit region 100Ca is referred to as the first target region 100Ta. The printing region 100Pa defined within the first target region 100Ta is referred to as the first printing region 100Pa. The area of ​​the first printing region 100Pa may be smaller than the area of ​​the first target region 100Ta. Therefore, the entire first printing region 100Pa may overlap with the first target region 100Ta.

[0101] The center 100Pa-c of the first printing area 100Pa and the center 100Ta-c of the first target area 100Ta can overlap with each other. That is, the first printing area 100Pa can be without offset relative to the first target area 100Ta.

[0102] The first region 111, the second region 112, the third region 113, the fourth region 114, the sixth region 116, the seventh region 117, the eighth region 118, and the ninth region 119 can be surrounding regions that do not overlap with the center of the mother substrate 1100.

[0103] The first region 111 is used as an example for explanation. The unit region 100Ce defined in the first region 111 is called the second unit region 100Ce. The target region 100Te defined in the second unit region 100Ce is called the second target region 100Te. The printing region 100Pe defined within the second target region 100Te is called the second printing region 100Pe.

[0104] The center 100Pe-c of the second printed region 100Pe and the center 100Te-c of the second target region 100Te may not overlap. That is, the center 100Pe-c of the second printed region 100Pe may be offset in a predetermined direction relative to the center 100Te-c of the second target region 100Te. For example, the center 100Pe-c may be closer to the center region of the mother substrate 1100 (e.g., the fifth region 115) than the center 100Te-c. That is, the center 100Pe-c may be offset from the center 100Te-c toward the center of the mother substrate 1100.

[0105] According to an embodiment of the present invention, the centers 100Pa-c, 100Pb-c, and 100Pc-c of the printing areas 100Pa, 100Pb, and 100Pc-c arranged in the (m+1)th region (e.g., the second region 112, the fifth region 115, and the eighth region 118) defined along the first direction DR1, and the centers 100Ta-c, 100Tb-c, and 100Tc-c of the target areas 100Ta, 100Tb, and 100Tc-c, can be arranged on the same line LN1 extending along the second direction DR2.

[0106] Furthermore, when n is 2k+1 (k is a positive integer), the centers 100Pd-c, 100Pa-c, and 100Pg of the printing areas 100Pd, 100Pa, and 100Pg-c arranged in the region (e.g., the fourth region 114, the fifth region 115, and the sixth region 116) along the second direction DR2, and the centers 100Td-c, 100Ta-c, and 100Tg-c of the target regions 100Td, 100Ta, and 100Tg, can be arranged on the same line LN2 extending along the first direction DR1.

[0107] Monomers are provided to printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi. The monomers can be provided using an inkjet process. For example, the printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi can be a diagram stored in a computer. That is, the monomers can be printed on the mother substrate 1100 according to the designed diagram. The organic encapsulation layer formed by the monomers provided to the first printing area 100Pa can be referred to as the first encapsulation layer, and the organic encapsulation layer formed by the monomers provided to the second printing area 100Pe can also be referred to as the second encapsulation layer.

[0108] According to one embodiment of the present invention, the positions of the printed regions 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi relative to the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can be adjusted based on the positions of the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti within the mother substrate 1100, taking into account deviations in ductility. Therefore, the deviation in distance between the end of the organic encapsulation layer formed by the monomer and the edges of the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can be reduced. Therefore, even if the display panel 100 (refer to...) Figure 5 The surrounding area 100N (refer to) Figure 5 The width of the organic encapsulation layer 142 is reduced (refer to...). Figure 4 The probability of exposure to the outside will also decrease, thus improving the display device 1000 (refer to...). Figure 1 The reliability of ).

[0109] Figure 9 This is a plan view of a display panel according to an embodiment of the present invention. Figure 10 This is a magnified image. Figure 9 The diagram shown is of DD'.

[0110] Reference Figure 9 An aperture 100-H can be defined within the active region 100A of the display panel 100-1. The aperture 100-H can be defined by removing at least a portion of the structure of the display panel 100-1. An electronic module can be arranged in the area overlapping with the aperture 100-H. The electronic module can be, for example, a camera module, but is not limited thereto.

[0111] A protrusion 160 surrounding the hole 100-H may be arranged. The protrusion 160 may be referred to as a dam, and the protrusion 160 may be composed of at least one layer. A groove 170, which is a recess formed by removing a portion of the substrate layer 110 in the thickness direction, may be defined around the protrusion 160.

[0112] Reference Figure 10 The end of the organic encapsulation layer 142 may be disposed inside the protrusion 160. The inside may represent a region separated from the hole 100-H, and the protrusion 160 is disposed between the hole 100-H and the end of the organic encapsulation layer 142. For example, the end of the organic encapsulation layer 142 may be disposed between the protrusion 160 and the groove 170.

[0113] In one embodiment of the invention, the groove 170 may also be omitted. In this case, the end of the organic encapsulation layer 142 may be closer to the active region 100A than the protrusion 160. Alternatively, the end of the organic encapsulation layer 142 may be further away from the hole 100-H than the protrusion 160.

[0114] Figure 11 This is a plan view of a mother substrate according to an embodiment of the present invention.

[0115] Reference Figure 11 Multiple unit regions 100C can be defined on the mother substrate 1100. Each of the multiple unit regions 100C can be separated from the mother substrate 1100 to form a display panel 100 (see reference). Figure 3 ).

[0116] Hole regions 100C-H can be defined in cell region 100C. Hole regions 100C-H can be regions to be removed. Hole regions 100C-H can be removed before cell region 100C is separated from mother substrate 1100, or they can be removed after cell region 100C is separated from mother substrate 1100.

[0117] Figure 12A This is a magnified image. Figure 11 The diagram of EE'. Figure 12B This is a magnified image. Figure 11 The image of FF'.

[0118] Reference Figure 12A and Figure 12BThe diagram illustrates unit regions 100Ca, 100Cb, 100Cc, 100Cd, 100Ce, 100Cf, 100Cg, 100Ch, and 100Ci. Within unit regions 100Ca, 100Cb, 100Cc, 100Cd, 100Ce, 100Cf, 100Cg, 100Ch, and 100Ci, target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can be defined respectively. Within target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti, a porous region 100C-H can be defined (refer to...). Figure 11 ).

[0119] In the printed areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi, non-printed holes 100NPa, 100NPb, 100NPc, 100NPd, 100NPe, 100NPf, 100NPg, 100NPh, and 100NPi can be defined respectively. The size of the non-printed holes 100NPa, 100NPb, 100NPc, 100NPd, 100NPe, 100NPf, 100NPg, 100NPh, and 100NPi can be larger than the hole area 100C-H (refer to...). Figure 11 The size of ).

[0120] The non-printed holes 100NPa, 100NPb, 100NPc, 100NPd, 100NPe, 100NPf, 100NPg, 100NPh, and 100NPi can all be in the same position relative to the printed areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi. For example, when the printed areas 100Pa and 100Pe overlap, they can completely overlap, and the non-printed holes 100NPa and 100NPe can also completely overlap.

[0121] The size of each of the non-printed holes 100NPa, 100NPb, 100NPc, 100NPd, 100NPe, 100NPf, 100NPg, 100NPh, and 100NPi can be larger than each hole region 100C-H (refer to...). Figure 11 (size).

[0122] Within the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti, additional printing regions 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, and 100APi can be defined. Each of the additional printing regions 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, and 100APi can have an outer boundary 100OB and an inner boundary 100IB. For example, the outer boundary 100OB can have a size corresponding to the non-printed hole 100NPc, and the inner boundary 100IB can have a smaller size than the non-printed hole 100NPc. Preferably, the size of the inner boundary 100IB may not be smaller than that of the hole region 100C-H (refer to...). Figure 11 The dimensions are indicated by either diameter or width.

[0123] According to one embodiment of the present invention, deviations in ductility can be taken into account, and the positions of the printed areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi can be adjusted according to the area of ​​the mother substrate 1100.

[0124] In the area with the hole 100C-H (reference) Figure 11 The tendency of the adjacent portion to be malleable may differ from the tendency of the outer contour of the unit regions 100Ca, 100Cb, 100Cc, 100Cd, 100Ce, 100Cf, 100Cg, 100Ch, and 100Ci. According to an embodiment of the invention, this situation can be considered by further specifying the region adjacent to the hole region 100C-H (refer to...). Figure 11 The adjacent printing areas. Therefore, additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, and 100APi can be added and specified independently of printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi.

[0125] According to one embodiment of the present invention, the positions of the additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, and 100APi can be fixed independently of the area of ​​the mother substrate 1100. That is, the positions of the additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, and 100APi relative to the target areas 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can all be identical in the first area 111, the second area 112, the third area 113, the fourth area 114, the fifth area 115, the sixth area 116, the seventh area 117, the eighth area 118, and the ninth area 119.

[0126] In the fifth region 115, the printed region 100Pa can remain unoffset relative to the target region 100Ta, and the additional printed region 100APa also remains unoffset relative to the target region 100Ta. Therefore, the additional printed region 100APa and the printed region 100Pa can not overlap with each other. In other words, the additional printed region 100APa completely overlaps with the non-printed hole 100NPa.

[0127] In the first region 111, the printed region 100Pe may be offset relative to the target region 100Te, but the additional printed region 100APe is not offset relative to the target region 100Ta. Therefore, a portion of the additional printed region 100APe may overlap with the printed region 100Pe. In other words, the additional printed region 100APe only partially overlaps with the non-printed hole 100NPe (but non-overlap is not excluded).

[0128] Monomers are provided to the printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, 100Pi and the additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, 100APi. The monomers can be provided via inkjet printing. For example, the printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, 100Pi and the additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, 100APi can be a drawing designed on a computer. That is, monomers can be printed onto the mother substrate 1100 according to the designed drawing. Here, providing (or printing) monomers to the printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi means providing (or printing) monomers to the printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi, excluding the non-printing holes 100NPa, 100NPb, 100NPc, and 100NPd. The portion of the printing (or provision) of monomers outside of 100NPe, 100NPf, 100NPg, 100NPh, and 100NPi, and the provision (or printing) of monomers to additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, and 100APi, indicates the printing (or provision) of monomers between the outer boundary 100OB and the inner boundary 100IB.

[0129] According to an embodiment of the present invention, the positions of the printed regions 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi relative to the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti can be adjusted based on the positions of the target regions 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti within the mother substrate 1100, taking into account deviations in ductility. As a result, deviations in the ductility of the organic encapsulation layer 142 based on its position within the mother substrate 1100 can be reduced. Therefore, even if the display panel 100 (refer to...) Figure 5 The surrounding area 100N (refer to) Figure 5As the width of the organic encapsulation layer 142 decreases, the probability of it being exposed to the outside also decreases.

[0130] Unlike the printed areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi, the additional printed areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, and 100APi can be fixed in position relative to the target areas 100Ta, 100Tb, 100Tc, 100Td, 100Te, 100Tf, 100Tg, 100Th, and 100Ti. For regions with different extensibility tendencies, additional maps are provided that are separated from the printed areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, and 100Pi, thereby further improving the precision of the manufacturing process.

[0131] According to embodiments of the present invention, monomers can be printed in the printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, 100Pi and the additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, 100APi using the same process. That is, monomers can be provided simultaneously to the printing areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, 100Pi and the additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, 100APi. Therefore, the printed areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, 100Pi overlap with the additional printed areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, 100APi, or even if printed areas 100Pa, 100Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100APh, 100Pi exist... The portions of Pb, 100Pc, 100Pd, 100Pe, 100Pf, 100Pg, 100Ph, 100Pi and the additional printing areas 100APa, 100APb, 100APc, 100APd, 100APe, 100APf, 100APg, 100APh, 100APi that are separated from each other can have a thickness deviation of less than 0.5 micrometers due to the leveling phenomenon of monomers.

[0132] Figure 13 This is a plan view of a mother substrate according to an embodiment of the present invention.

[0133] Although in the above text Figure 6 and Figure 10 The example given is a case where the mother substrate 1100 is divided into 2m+1 portions (m is a positive integer) defined along the first direction DR1 and 2k+1 portions (k is a positive integer) defined along the second direction DR2, but it is not limited to this case.

[0134] Reference Figure 13 The mother substrate 1100 can also be divided into 2m+1 parts (m is a positive integer) defined along the first direction DR1 and 2k parts (k is a positive integer) defined along the second direction DR2.

[0135] Figure 13 The illustration shows a mother substrate 1100 divided into a first region 111a, a second region 112a, a third region 113a, a fourth region 114a, a fifth region 115a, and a sixth region 116a. The first region 111a, the second region 112a, and the third region 113a can be defined sequentially along a first direction DR1, forming a first row. The fourth region 114a, the fifth region 115a, and the sixth region 116a can be defined sequentially along the first direction DR1, forming a second row.

[0136] The printing area defined in the first region 111a can be with Figure 8A The printing area 100Pe defined in the first region 111 is substantially the same as described above, and the printing area defined in the second region 112a can be the same as... Figure 8A The printing area 100Pb defined in the second region 112 is substantially the same as described above, and the printing area defined in the third region 113a can be the same as... Figure 8B The printing area 100Ph defined in the third region 113 is substantially the same as described above. Furthermore, the printing area defined in the fourth region 114a can be... Figure 8A The printing area 100Pf defined in the seventh region 117 is substantially the same as that described above, and the printing area defined in the fifth region 115a can be the same as that described above. Figure 8A The printing area 100Pc defined in the eighth region 118 is substantially the same as described above, and the printing area defined in the sixth region 116a can be the same as... Figure 8B The definition of printing area 100Pi in region 9, 119, is substantially the same as described above. That is, in Figure 13 In the mother substrate 1100, the center of the printing area can be offset from the center of all target areas.

[0137] While the preferred embodiments of the present invention have been described above, those skilled in the art or with ordinary knowledge of the art will understand that various modifications and alterations can be made to the present invention without departing from the spirit and technical scope of the invention as set forth in the claims. Therefore, the technical scope of the present invention should not be limited to the content described in the detailed specification, but should be determined by the scope of the claims.

Claims

1. A display device manufacturing method comprising the steps of: A mother substrate on which a first unit area and a second unit area are defined is prepared, wherein, defining a first target region in the first unit region and a second target region separated from the first target region in the second unit region; determining a position of a first printing region overlapping the first target region based on a position of the first target region in the mother substrate; determining a position of a second printing region overlapping the second target region based on a position of the second target region in the mother substrate; providing an encapsulating material to the first printing region in the first target region to form a first encapsulating layer; and providing the encapsulating material to the second printing region in the second target region to form a second encapsulating layer, wherein a center of the second printing region is offset from a center of the second target region in a predetermined direction.

2. The display device manufacturing method according to claim 1, wherein the positions of the first and second printing regions are determined taking into account the extensibility of a single body in forming the first and second encapsulating layers, the entire second printing region overlaps the second target region, and the center of the second printing region is offset from the center of the second target region in a direction toward the center of the mother substrate.

3. The display device manufacturing method according to claim 1, wherein 4. The display device manufacturing method according to claim 3, wherein In the mother substrate, 2m+1 portions defined along a first direction and n portions defined along a second direction intersecting the first direction are defined, thereby defining a total of (2m+1) n portions including the first unit region and the second unit region, where m is a positive integer and n is a positive integer. the first unit regions are arranged in an (m+1)th portion defined in the first direction, and the center of the first printing region is arranged on the same line as the center of the first target region in the second direction.

5. The display device manufacturing method according to claim 3, wherein the n is 2k+1 where k is a positive integer, the first unit regions are arranged in a (k+1)th portion defined in the second direction, and the center of the first printing region is arranged on the same line as the center of the first target region in the first direction.

6. The display device manufacturing method according to claim 3, wherein the second unit regions are arranged in a peripheral region of the mother substrate, the center of the second printing region is offset from the center of the second target region in a direction toward the center of the mother substrate.

7. The display device manufacturing method according to claim 1, wherein a first hole region is defined in the first target region, a second hole region is defined in the second target region, a first non-printing hole larger than the first hole region is defined in the first printing region, and a second non-printing hole larger than the second hole region is defined in the second printing region.

8. The display device manufacturing method according to claim 7, wherein the position of the first non-printing hole with respect to the first printing region is the same as the position of the second non-printing hole with respect to the second printing region.

9. The display device manufacturing method according to claim 7, wherein ​ a first additional printing region is defined in the first target region, the first additional printing region having a first outer boundary corresponding in size to the first non-printing hole and a first inner boundary smaller in size than the first non-printing hole, a second additional printing region is defined in the second target region, the second additional printing region having a second outer boundary corresponding in size to the second non-printing hole and a second inner boundary smaller in size than the second non-printing hole, and the display device manufacturing method further includes the steps of: providing the encapsulating material to the first additional printing region; and providing the encapsulating material to the second additional printing region.

10. The display device manufacturing method according to claim 9, wherein the position of the first additional printing region with respect to the first target region is the same as the position of the second additional printing region with respect to the second target region.

11. The display device manufacturing method according to claim 9, wherein the position of the first additional printing region with respect to the first printing region is different from the position of the second additional printing region with respect to the second printing region.

12. The display device manufacturing method according to claim 9, wherein a part of the second additional printing region overlaps the second printing region.

13. The display device manufacturing method according to claim 9, wherein the encapsulating material is provided to the first printing region, the first additional printing region, the second printing region, and the second additional printing region in the same process.

14. The display device manufacturing method according to claim 1, wherein the encapsulating material is a monomer.

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