A vehicle drive module assembly

Abstract

The present invention discloses a vehicle-mounted drive module assembly, which includes a capacitor assembly, a water-cooling plate assembly, an IGBT single tube arranged in parallel, and a PCBA from bottom to top. A capacitor thermal pad is arranged below the capacitor assembly, and a temperature sampling device connected to the PCBA is arranged on the water-cooling plate assembly. The IGBT single tube is correspondingly arranged on the upper surface of the water-cooling plate assembly, and the IGBT single tube pin is connected to the PCBA. The present invention ensures that the current consistency passing through all the IGBT single tubes on the upper bridge arm and the lower bridge arm is good by using a single-tube IGBT arranged in parallel. By integrating the drive board, the control board and the adapter board into a PCBA, the wiring harness connection between the components is reduced, and the cost is reduced; by arranging the three-phase copper busbar outside the capacitor housing, the heat on the three-phase copper busbar is transferred to the water-cooling plate, and the various parts are formed into modular products, which are easy to transplant and install.

Description

Technical Field

[0001] The invention belongs to the technical field of controllers, and in particular relates to a vehicle-mounted drive module assembly. Background Art

[0002] The on-board motor controller currently on the market is composed of an insulated gate bipolar transistor (IGBT) module, a thin film capacitor, a driver board, a heat sink, a main control board, a copper busbar, etc. The structural design and adjustment are designed according to customer needs, which is a large workload and high cost. In addition, the heat dissipation performance of the thin film capacitor used to connect to the insulated gate bipolar transistor in the prior art is poor, which can easily cause damage to the single tube of the insulated gate bipolar transistor, causing the entire system to fail. At the same time, the existing mechanism for capacitor heat dissipation is relatively complex in structure, cumbersome to install, and high in manufacturing cost. In addition, the existing on-board motor controller heat sink generally adopts an internal rib structure for heat dissipation. This structure has the problem of insufficient heat exchange between the heat dissipation rib and the cooling water, and has a poor cooling effect on the IGBT module, which can easily cause the IGBT module to overheat or be damaged. Summary of the invention

[0003] In view of the problems existing in the prior art, the present invention is designed to provide a vehicle-mounted drive module assembly.

[0004] The present invention is achieved through the following technical solutions:

[0005] The vehicle-mounted drive module assembly is characterized in that the vehicle-mounted drive module assembly includes a capacitor assembly, a water-cooling plate assembly, an IGBT single tube arranged in parallel, and a PCBA from bottom to top, a capacitor thermal pad is arranged below the capacitor assembly, a temperature sampling device connected to the PCBA is arranged on the water-cooling plate assembly, the IGBT single tube is correspondingly arranged on the upper surface of the water-cooling plate assembly, and the IGBT single tube pin is connected to the PCBA.

[0006] The vehicle-mounted drive module assembly is characterized in that the capacitor assembly includes a capacitor housing, a positive copper bar and a negative copper bar encapsulated inside the capacitor housing, and a capacitor, and a three-phase copper bar is installed on the upper surface of the capacitor housing by screws, and insulating thermal pads are attached to the upper and lower surfaces of the three-phase copper bar.

[0007] The vehicle-mounted drive module assembly is characterized in that a positive input copper bar is welded on the positive copper bar, a negative input copper bar is welded on the negative copper bar, and the positive input copper bar and the negative input copper bar pass through the outside of the capacitor housing; a positive pin is provided on the positive copper bar, a negative pin is provided on the negative copper bar, and a three-phase pin is provided on the three-phase copper bar, and the positive copper bar and the negative copper bar extend to the upper part of the capacitor housing and are arranged crosswise with the three-phase copper bar; after the IGBT single tube is installed in parallel, the C pole of the upper bridge arm IGBT single tube is connected to the positive pin of the capacitor, and the C pole of the lower bridge arm IGBT single tube is connected to the three-phase pin.

[0008] The vehicle-mounted drive module assembly is characterized in that the water-cooling plate assembly includes a water-cooling plate and a U-shaped cooling water channel arranged inside the water-cooling plate, and prismatic heat dissipation columns and triangular heat dissipation columns are evenly distributed in the U-shaped cooling water channel, and the triangular heat dissipation columns are arranged along the edge of the U-shaped cooling water channel.

[0009] The vehicle-mounted drive module assembly is characterized in that the two open ends of the U-shaped cooling water channel are respectively connected to the water inlet and the water outlet to achieve the circulation of cooling water.

[0010] The vehicle-mounted drive module assembly is characterized in that the temperature sampling device includes a PCB board, a temperature sensor welded at one end of the PCB board, and a pin vertically welded at the other end of the PCB board. The PCB board is pre-buried in the water cooling plate groove, and the other end of the pin is welded on the PCBA board.

[0011] The vehicle-mounted drive module assembly is characterized in that the PCB board is fixed in the water-cooling plate groove by means of sealant, and the PCB board is flattened by means of a ceramic sheet, on which a thermal conductive pad is pasted.

[0012] The vehicle-mounted drive module assembly is characterized in that the IGBT single tube is fixed on the mounting surface of the water-cooling plate by a pressure strip, and the other end of the pressure strip is fixedly connected to the water-cooling plate by screws, the surroundings and upper surface of the IGBT single tube are filled and covered with thermal conductive adhesive, and the upper and lower surfaces of the IGBT pins are covered with thermal conductive adhesive.

[0013] The vehicle-mounted drive module assembly is characterized in that a drive board, a control board and an adapter board are integrated on the PCBA.

[0014] The present invention ensures good consistency of current passing through all IGBT single tubes on the upper bridge arm and the lower bridge arm by means of single-tube IGBTs arranged in parallel, and reduces the wiring harness connection between components and reduces costs by integrating the driving board, the control board and the adapter board into a PCBA; and realizes heat conduction from the three-phase copper busbar to the water cooling plate by arranging the three-phase copper busbar outside the capacitor housing, and at the same time forms each part into a modular product for easy transplantation and installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The structure diagram of the present invention is developed;

[0016] Figure 2 It is a top view of the structure of the present invention;

[0017] Figure 3 This is a parallel structure diagram of the IGBT single tube of the present invention;

[0018] Figure 4 It is the side view of a single IGBT tube;

[0019] Figure 5 It is a cross-sectional view of the present invention;

[0020] Figure 6 for Figure 5 The expanded diagram of

[0021] Figure 7-Figure 8 This is the structural diagram of the water cooling plate;

[0022] In the figure, 1-capacitor assembly, 101-capacitor housing, 2-water cooling plate assembly, 201-water cooling plate, 202-U-shaped cooling water channel, 203-prismatic heat dissipation column, 204-triangular heat dissipation column, 3-IGBT single tube, 4-PCBA, 5-capacitor thermal pad, 6-temperature sampling device, 601-PCB board, 602-temperature sensor, 603-pin, 604-ceramic sheet, 605-thermal pad, 7-IGBT single tube pin, 8-three-phase copper busbar, 9-insulated thermal pad, 10-positive input copper busbar, 11-negative input copper busbar, 12-positive pin, 13-negative pin, 14-three-phase pin, 15-C pole of upper bridge arm IGBT single tube, 16-C pole of lower bridge arm IGBT single tube, 17-pressing strip. DETAILED DESCRIPTION

[0023] The present invention is further described below in conjunction with the accompanying drawings to provide a better understanding of the technical solution.

[0024] like Figure 1As shown, the present invention provides a vehicle-mounted drive module assembly, which replaces the IGBT module with IGBT single tubes in parallel, welds specially designed film capacitors and IGBT single tubes, and finally forms a drive module assembly with the film capacitors, IGBT single tubes, PCBA, and water cooling plates.

[0025] Continue reading Figure 1 The vehicle drive module assembly includes, from bottom to top, a capacitor assembly, a water-cooling plate assembly, an IGBT single tube arranged in parallel, and a PCBA integrated with a drive board, a control board and an adapter board. A capacitor thermal pad is arranged below the capacitor assembly, and a temperature sampling device connected to the PCBA is arranged on the water-cooling plate assembly to monitor the capacitor temperature in real time. The IGBT single tube is correspondingly arranged on the upper surface of the water-cooling plate assembly, and the IGBT single tube pin is connected to the PCBA.

[0026] Continue reading Figure 1 , 2 , 5, 6, the capacitor assembly includes a capacitor housing, a positive copper bar and a negative copper bar encapsulated inside the capacitor housing, and a capacitor. A three-phase copper bar is installed on the upper surface of the capacitor housing by screws, and insulating thermal pads are attached to the upper and lower surfaces of the three-phase copper bar. A positive input copper bar is welded on the positive copper bar, and a negative input copper bar is welded on the negative copper bar. The positive input copper bar and the negative input copper bar pass through the outside of the capacitor housing; a positive pin is provided on the positive copper bar, a negative pin is provided on the negative copper bar, and a three-phase pin is provided on the three-phase copper bar. The positive copper bar and the negative copper bar extend to the upper part of the capacitor housing and are arranged crosswise with the three-phase copper bar; after the IGBT single tube is installed in parallel, the C pole of the upper bridge arm IGBT single tube is connected to the positive pin of the capacitor, and the C pole of the lower bridge arm IGBT single tube is connected to the three-phase pin.

[0027] The above design integrates the positive and negative copper bars with the film capacitor, and the bottom heat dissipation surface of the insulated gate bipolar transistor IGBT is connected to the collector C, the upper bridge arm collector C of the insulated gate bipolar transistor IGBT is connected to the positive copper bar of the film capacitor, and the lower bridge arm collector C of the insulated gate bipolar transistor IGBT is connected to the three-phase copper bar of the film capacitor. In the output circuit, the heat is transferred to the water cooling plate through the three-phase copper bar through the upper surface thermal pad, and part of the heat is transferred to the film capacitor through the lower surface thermal pad. The film capacitor transfers the heat to the water cooling plate through the thermal pad under the water cooling plate, and the lower surface of the film capacitor is in contact with the capacitor shell through the thermal pad to transfer the heat to the casing.

[0028] Continue reading Figure 7-Figure 8 The water-cooling plate assembly includes a water-cooling plate and a U-shaped cooling water channel arranged inside the water-cooling plate. The U-shaped cooling water channel is evenly provided with prismatic heat dissipation columns and triangular heat dissipation columns, and the triangular heat dissipation columns are arranged along the edge of the U-shaped cooling water channel. The two opening ends of the U-shaped cooling water channel are respectively connected to the water inlet and the water outlet to realize the circulation of cooling water.

[0029] Continue reading Figure 1 and Figure 6 The temperature sampling device includes a PCB board, a temperature sensor welded at one end of the PCB board, and a pin welded vertically at the other end of the PCB board. The PCB board is embedded in the water cooling plate slot, and the other end of the pin is welded on the PCBA board. The PCB board is fixed in the water cooling plate slot by a sealant, and the PCB board is flattened by a ceramic sheet, and a thermal pad is pasted on the ceramic sheet.

[0030] Continue reading Figure 2-4 The IGBT single tube is fixed on the mounting surface of the water-cooled plate through a pressure strip, and the other end of the pressure strip is fixedly connected to the water-cooled plate through screws. The surroundings and upper surface of the IGBT single tube are filled and covered with thermal conductive adhesive, and the upper and lower surfaces of the IGBT pins are covered with thermal conductive adhesive. The full coverage of thermal conductive adhesive not only plays a role in heat conduction, but also makes the IGBT, pressure strip, and ceramic sheet form a whole, increasing its firmness and vibration resistance, and reducing the risk of ceramic sheet breakage. At the same time, the upper surface of the IGBT is covered with thermal conductive adhesive, so that the IGBT achieves the effect of double-sided cooling.

[0031] The arrangement of the present invention can achieve the following: better consistency of current passing through all IGBT single tubes on the upper bridge arm and the lower bridge arm; conduct the heat on the copper busbar inside the film capacitor to the radiator and the shell; integrate the drive board, the control board, and the adapter board into a PCBA, reduce the wiring harness connection between them, and reduce the cost; the three-phase copper busbar is arranged outside the capacitor to reduce the heat of the capacitor and conduct the heat of the three-phase copper busbar to the radiator; the radiator, the film capacitor, the PCBA, the single-tube IGBT, and the three-phase copper busbar are formed into a modular product, which can be very conveniently transplanted into the product required by the customer.

Claims

1. A vehicle-mounted drive module assembly, characterized in that The vehicle-mounted drive module assembly comprises, from bottom to top, a capacitor assembly (1), a water-cooling plate assembly (2), an IGBT single tube (3) arranged in parallel, and a PCBA (4); a capacitor thermal pad (5) is arranged below the capacitor assembly (1); a temperature sampling device (6) connected to the PCBA (4) is arranged on the water-cooling plate assembly (2); the IGBT single tube (3) is correspondingly arranged on the upper surface of the water-cooling plate assembly (2), and the IGBT single tube pin (7) is connected to the PCBA (4); The capacitor assembly (1) comprises a capacitor housing (101), a positive copper bar and a negative copper bar encapsulated in the capacitor housing (101), and a capacitor; a three-phase copper bar (8) is mounted on the upper surface of the capacitor housing (101) by means of screws; an insulating heat conductive pad (9) is attached to the upper and lower surfaces of the three-phase copper bar (8); a positive input copper bar (10) is welded to the positive copper bar, and a negative input copper bar (11) is welded to the negative copper bar; the positive input copper bar (10) and the negative input copper bar (11) extend out of the capacitor housing (101). 01) outside; a positive electrode pin (12) is provided on the positive copper bar, a negative electrode pin (13) is provided on the negative copper bar, and a three-phase pin (14) is provided on the three-phase copper bar (8); the positive copper bar and the negative copper bar extend to the upper part of the capacitor housing (101) and are arranged crosswise with the three-phase copper bar (8); after the IGBT single tubes (3) are installed in parallel, the C pole (15) of the upper bridge arm IGBT single tube is connected to the positive electrode pin (12) of the capacitor, and the C pole (16) of the lower bridge arm IGBT single tube is connected to the three-phase pin (14); The temperature sampling device (6) comprises a PCB board (601), a temperature sensor (602) welded to one end of the PCB board (601), and a plug pin (603) vertically welded to the other end of the PCB board (601); the PCB board (601) is pre-buried in a water-cooling plate slot, and the other end of the plug pin (603) is welded to the PCBA (4).

2. The vehicle-mounted drive module assembly according to claim 1, characterized in that The water-cooling plate assembly (2) comprises a water-cooling plate (201) and a U-shaped cooling water channel (202) arranged inside the water-cooling plate (201), wherein prismatic heat dissipation columns (203) and triangular heat dissipation columns (204) are evenly distributed inside the U-shaped cooling water channel (202), and the triangular heat dissipation columns (204) are arranged along the edge of the U-shaped cooling water channel (202).

3. The vehicle-mounted drive module assembly according to claim 2, characterized in that The two open ends of the U-shaped cooling water channel (202) are respectively connected to a water inlet and a water outlet, thereby achieving a circulating flow of cooling water.

4. The vehicle-mounted drive module assembly according to claim 1, characterized in that The PCB board (601) is fixed in the water-cooling plate groove by means of a sealant, and the PCB board (601) is flattened by means of a ceramic sheet (604), and a thermal conductive pad (605) is attached to the ceramic sheet (604).

5. The vehicle-mounted drive module assembly according to claim 1, characterized in that The IGBT single tube (3) is fixed on the mounting surface of the water cooling plate (201) via a pressure strip (17), and the other end of the pressure strip (17) is fixedly connected to the water cooling plate (201) via a screw, the surroundings and the upper surface of the IGBT single tube (3) are filled and covered with thermal conductive adhesive, and the upper and lower surfaces of the IGBT pins are covered with thermal conductive adhesive.

6. The vehicle-mounted drive module assembly according to claim 1, characterized in that The PCBA (4) is integrated with a drive board, a control board and an adapter board.

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