A nested radiation array

Abstract

The present invention provides a nested radiation array, comprising: a metal outer frame having a receiving cavity with an opening at the top; a metal mounting plate installed in the receiving cavity of the metal outer frame, including a metal substrate which divides the receiving cavity into a first receiving cavity located below and a second receiving cavity located above; a plurality of low-frequency antenna arrays vertically inserted into the receiving cavity; a plurality of high-frequency antenna arrays vertically inserted into the receiving cavity; the high-frequency antenna arrays are nested in the low-frequency antenna arrays; a plurality of high-frequency power combining modules arranged at the bottom side of the high-frequency antenna arrays, which include metal frames; a plurality of energy storage material pieces arranged between the metal frames of the high-frequency power combining modules and the metal mounting plate; and a low-frequency transceiver assembly composed of a power amplifier, a low-noise amplifier, a switch, and an amplitude-phase control circuit, horizontally arranged in the first receiving cavity, and connectors of each of the low-frequency antenna arrays penetrate through the substrate and are electrically connected to the low-frequency transceiver assembly. The structure is compact, which is beneficial to miniaturization.

Description

Technical Field

[0001] The present invention relates to a transmission device for wireless signals, and particularly to a radar and a mobile communication system. Background Art

[0002] Existing antennas are usually limited by difficulties in system layout and heat dissipation requirements under high-power conditions, and generally have problems such as large volume, complex structure, and difficulty in maintenance. It is difficult to miniaturize, and it is difficult to achieve multi-frequency phase scanning and multi-frequency combination. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a nested radiation array, which has a compact structure, is beneficial to miniaturization, and can achieve multi-frequency phase scanning and multi-frequency combination in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by the present invention to solve its technical problems includes: providing a nested radiation array, comprising:

[0005] A metal outer frame having a receiving cavity with an opening at the top;

[0006] A metal mounting plate installed in the receiving cavity of the metal outer frame, including a metal substrate, which divides the receiving cavity into a first receiving cavity located below and a second receiving cavity located above;

[0007] A plurality of low-frequency antenna arrays vertically inserted into the receiving cavity, including: a first circuit, a first metal frame disposed outside the first circuit, and a plurality of connectors disposed at the bottom side of the first circuit. The first circuit includes a filter disposed inside the first metal frame and a low-frequency passive radiator at the top of the first metal frame;

[0008] A plurality of high-frequency antenna arrays vertically inserted into the receiving cavity, including: a second circuit and a second metal frame disposed outside the second circuit. The second circuit includes a transceiver circuit composed of a high-frequency power amplifier, a low-noise amplifier, a switch, and a amplitude-phase control circuit disposed inside the second metal frame and a high-frequency passive radiator at the top of the second metal frame;

[0009] A plurality of high-frequency power combining modules disposed at the bottom side of the high-frequency antenna array, which include a high-frequency power combining circuit electrically connected to the high-frequency transceiver circuit of the high-frequency antenna array and a metal frame disposed outside the high-frequency processing circuit;

[0010] A plurality of energy storage material components are disposed between the metal frame of the high-frequency power combining module and the metal mounting plate; and a low-frequency transceiver assembly is horizontally disposed in the first receiving cavity, which includes a plurality of power amplifiers, a plurality of low-noise amplifiers, a plurality of switches, and a plurality of amplitude-phase control circuits. The connectors of each low-frequency antenna array pass through the substrate and are electrically connected to the low-frequency transceiver circuit.

[0011] In some embodiments, two high-frequency antenna arrays are arranged in parallel between two adjacent low-frequency antenna arrays, and the two high-frequency antenna arrays arranged in parallel share one high-frequency power combining module.

[0012] In some embodiments, fixing members integrally formed with the first metal frame are provided at both ends of the first metal frame.

[0013] In some embodiments, the metal outer frame includes a rectangular bottom plate and four side plates extending upward from four sides of the bottom plate; two stepped portions are formed between the bottom plate and two longitudinally extending side plates; the fixing members are correspondingly fixed to the stepped portions.

[0014] In some embodiments, the longitudinal dimension of the fixing member corresponds to the sum of the longitudinal dimension of one low-frequency antenna array and the longitudinal dimensions of two high-frequency antenna arrays respectively located on both sides of the low-frequency antenna array.

[0015] In some embodiments, the first metal frame is composed of two metal members located outside the first circuit, and the metal members have a base with a transverse thickening; the high-frequency power combining module is supported on the top side of the base.

[0016] In some embodiments, a downwardly protruding step formed by the base of the first metal frame and the metal frame of the high-frequency power combining module is correspondingly matched.

[0017] In some embodiments, the metal mounting plate further includes a plurality of heat dissipation teeth protruding upward from the metal substrate, and the top and bottom ends of the energy storage material member are respectively in contact with the metal frame of the high-frequency power combining module and the heat dissipation teeth.

[0018] In some embodiments, it further includes: a low-frequency control circuit module, a high-frequency control circuit module, a low-frequency frequency conversion transceiver component, and a high-frequency frequency conversion transceiver component, which are arranged below the low-frequency transceiver component and located in the first accommodation cavity.

[0019] In some embodiments, the first circuit includes a first circuit board, a filter formed on the first circuit board, and a plurality of low-frequency passive radiators; the second circuit includes a second circuit board and a transceiver circuit composed of a plurality of high-frequency power amplifiers, a plurality of low-noise amplifiers, a plurality of switches, and a plurality of amplitude-phase control circuits formed on the second circuit board, and a plurality of high-frequency passive radiators.

[0020] Compared with the prior art, the nested radiation array of the present invention has a compact structure through the ingenious cooperation of the metal outer frame, the metal mounting plate, a plurality of low-frequency antenna arrays, a plurality of high-frequency antenna arrays, a plurality of high-frequency power combining modules, a plurality of energy storage material members, and the low-frequency transceiver component, which is beneficial to miniaturization, and realizes multi-frequency phase scanning and multi-frequency combination. Description of the Drawings

[0021] Figure 1 It is a schematic cross-sectional structure diagram of the nested radiation array of the present invention.

[0022] Figure 2 It is a schematic side view structure diagram of the nested radiation array of the present invention.

[0023] Figure 3 It is a schematic top view structure diagram of the nested radiation array of the present invention.

[0024] Figure 4 It is a schematic enlarged partial structure diagram of the nested radiation array of the present invention.

[0025] Figure 5 It is a schematic combined structure diagram of the low-frequency antenna array and the low-frequency transceiver module of the present invention.

[0026] Figure 6 It is a schematic side view structure diagram of the low-frequency antenna array of the present invention.

[0027] Figure 7 and Figure 8 It is a schematic combined structure diagram of the high-frequency antenna array and the high-frequency power combining module of the present invention from two different perspectives.

[0028] Among them, the reference signs are explained as follows: 10 nested radiation array, 1 metal outer frame, 11 bottom plate, 12 side plates, 13 stepped portion, 19 receiving cavity, 191 first receiving cavity, 192 second receiving cavity, 2 metal mounting plate, 21 substrate, 22 heat dissipation teeth, 3 low-frequency antenna array, 31 first circuit, 32 first metal frame, 321, 322 metal parts, 3211, 3221 bases, 3212, 3222 bodies, 33 connector, 4 high-frequency antenna array, 41 second circuit, 42 second metal frame, 5 high-frequency power combining module, 53 step portion, 6 energy storage material part, 7 low-frequency transceiver module, 8 RF connector, 9 fixing part. Detailed Embodiment

[0029] In order to illustrate the structure and characteristics of the present invention in detail, the following preferred embodiments are given and described in conjunction with the accompanying drawings as follows.

[0030] Refer to Figures 1 to 4 , Figure 1 It is a schematic cross-sectional structure diagram of the nested radiation array of the present invention. Figure 2 It is a schematic side view structure diagram of the nested radiation array of the present invention. Figure 3 It is a schematic top view structure diagram of the nested radiation array of the present invention. Figure 4It is a schematic enlarged view of the partial structure of the nested radiation array of the present invention. The present invention provides a multi-nested radiation array 10, which includes: a metal outer frame 1, a metal mounting plate 2, a plurality of low-frequency antenna arrays 3, a plurality of high-frequency antenna arrays 4, a plurality of high-frequency power combining modules 5, a plurality of energy storage material components 6, a low-frequency transceiver component 7, a plurality of RF connectors 8, and a plurality of fixing members 9.

[0031] The metal outer frame 1 has a receiving cavity 19 with an opening at the top. The receiving cavity 19 is vertically partitioned by the metal mounting plate into a first receiving cavity 191 located below and a second receiving cavity 192 located above.

[0032] The metal outer frame 1 includes a rectangular bottom plate 11 and four side plates 12 extending upward from the four sides of the bottom plate 11. Two stepped portions 13 are formed between the bottom plate 11 and two longitudinally extending side plates 12.

[0033] The metal mounting plate 2 is installed in the receiving cavity 19 of the metal outer frame 1 and includes a substrate 21 and a plurality of heat dissipation teeth 22 protruding upward from the substrate 21. The substrate 21 partitions the receiving cavity 19 into the first receiving cavity 191 and the second receiving cavity 192. Specifically, the substrate 21 is fixed to the metal outer frame 1 by fasteners such as screws.

[0034] A plurality of low-frequency antenna arrays 3 are vertically inserted into the receiving cavity 19 and include: a first circuit 31, a first metal frame 32 disposed outside the first circuit 31, and a plurality of connectors 33 disposed on the bottom side of the first circuit 31. Specifically, the first circuit 31 includes a first circuit board and a filter disposed inside the first metal frame (32) and a low-frequency passive radiator at the top of the first metal frame (32).

[0035] For example, the first circuit board can be a multi-layer PCB board or a multi-layer LTCC (Low Temperature Co-fired Ceramic board). The low-frequency antenna array 3 is a rectangular thin plate (sheet), placed perpendicular to the bottom plate (i.e., the bottom plate 11 of the metal outer frame 1), and a metal frame (i.e., the first metal frame 32) is added to the RF circuit to form a modular structure, which is beneficial to avoid RF circuit short circuits.

[0036] A plurality of high-frequency antenna arrays 4 are vertically inserted into the receiving cavity 19 and include: a second circuit 41 and a second metal frame 42 disposed outside the second circuit 41. Specifically, the second circuit 41 includes a second circuit board and a transceiver circuit composed of a high-frequency power amplifier, a low-noise amplifier, a switch, and a phase and amplitude control circuit disposed inside the second metal frame, and a high-frequency passive radiator at the top of the second metal frame (42). Two high-frequency antenna arrays 4 are arranged in parallel between two adjacent low-frequency antenna arrays 3.

[0037] For example, the second circuit board can be a multi-layer PCB board or a multi-layer LTCC. The upper part is a radiator, and the lower part is a transceiver circuit formed by a power amplifier, a low-noise amplifier, a switch, and an amplitude-phase control circuit. The high-frequency antenna array 4 is a rectangular thin plate (sheet), placed perpendicular to the bottom plate, and a metal frame (i.e., the second metal frame 42) is added outside the RF circuit to form a modular structure, which is beneficial to ensuring electromagnetic compatibility. Between the second circuit 41 and the second metal frame 42, it can be welded, bonded with conductive glue, or fixed with fasteners such as flat head screws.

[0038] A number of high-frequency power combining modules 5, with a modular design, are arranged on the bottom side of the high-frequency antenna array 4. It includes a high-frequency power combining circuit electrically connected to the high-frequency transceiver circuit of the high-frequency antenna array 4 and a metal frame arranged outside the high-frequency power combining circuit. For example, two juxtaposed high-frequency antenna arrays 4 share a high-frequency power combining circuit 5.

[0039] A number of energy storage material components 6 are arranged between the metal frame of the high-frequency power combining module 5 and the metal mounting plate 2, which is beneficial to improving the heat dissipation capacity. Specifically, the energy storage material component 6 is a phase change material, and the heat generated by the RF circuit is conducted to the energy storage material 6 through the metal structure. The energy storage material converts the heat through phase change to achieve high-power heat dissipation.

[0040] For example, the energy storage material is a phase change energy storage material, such as: a high thermal conductivity inorganic phase change energy storage material, and its component composition and mass percentage content are: energy storage material 80 - 99.4%, nucleating agent 0.25 - 10%, modifier 0.1 - 15%, water 0.1 - 15%, thermal conductivity enhancing material 0.15 - 19%. Among them, the energy storage material is a hydrated salt with crystal water, the nucleating agent is a carbonate or borate, the modifier is a polyacrylic acid emulsion or a thickening powder, and the thermal conductivity enhancing material is one or a mixture of several of graphite, carbon powder, copper powder, carbon fiber, and silicon carbide powder.

[0041] The low-frequency transceiver component 7 is horizontally arranged in the first receiving cavity 191. It includes a number of power amplifiers, a number of low-noise amplifiers, a number of switches, and a number of amplitude-phase control circuits. The connector 13 of each low-frequency antenna array 1 penetrates through the substrate 21 and is electrically connected to the low-frequency transceiver circuit.

[0042] For example, the low-frequency transceiver component 7 is placed parallel to the bottom plate and is slightly smaller in size than the metal bottom plate. The low-frequency transceiver component 7 is a multi-layer PCB board or an LTCC low-temperature co-fired ceramic board, and can adopt a modular design, with a metal frame added, and is fixed to the metal outer frame 1 with screws.

[0043] It is worth mentioning that the nested radiation array 10 further includes: a frequency control circuit module, a high-frequency control circuit module, a low-frequency frequency conversion transceiver component, and a high-frequency frequency conversion transceiver component (not shown in the figure), which are arranged below the low-frequency transceiver component 7 and are located in the first receiving cavity 191.

[0044] A plurality of radio frequency connectors 8 are arranged on the side plate 12 of the metal outer frame 1 for connecting the circuit inside the nested radiation array 10 to the external circuit.

[0045] A plurality of fixing members 9 are arranged in an extending and arranging manner along the longitudinal line (see Figure 3 ), and are fixed to the stepped portion 13 of the metal outer frame 1 by fastening members such as screws. For example, fixing members 9 are provided at both ends of the first metal frame 32, that is, two fixing members 9 are integrally formed at both ends of the first metal frame 32. See Figure 4 , the longitudinal dimension of the fixing member 9 corresponds to the sum of the longitudinal dimension of a low-frequency antenna array 3 and the longitudinal dimensions of two high-frequency antenna arrays 4 respectively located on both sides of the low-frequency antenna array 3.

[0046] See Figure 5 , Figure 5 is a schematic view of the combined structure of the low-frequency antenna array and the low-frequency transceiver component of the present invention. The low-frequency transceiver component 7 is arranged on the bottom side of the low-frequency antenna array 1, and the low-frequency transceiver component 7 is electrically connected to the connector 13 of the low-frequency antenna array 1. The first circuit 31 includes a radiator formed on the first circuit board. The first metal frame 32 is in the shape of a thin plate, and a stepped portion is formed at the bottom.

[0047] See Figure 6 , Figure 6 is a schematic side view structure of the low-frequency antenna array of the present invention. The first metal frame 32 is composed of two metal parts 321, 322 located outside the first circuit 31, and the metal parts 321, 322 have laterally thickened bases 3211, 3221. The high-frequency power combining module 5 is supported on the top sides of the bases 3211, 3221. The first circuit 31 is connected to the connector 33 at the bottom side.

[0048] See Figure 7 and Figure 8 , Figure 7 and Figure 8 are schematic views of the combined structures of the high-frequency antenna array and the high-power combining module of the present invention from two different perspectives. The second circuit 41 includes a radiator formed on the second circuit board. Two juxtaposed high-frequency antenna arrays 4 share a high-frequency power combining module 5. The metal frame of the high-frequency power combining module 5 is formed with a stepped portion 53 protruding downward.

[0049] The beneficial effects of the nested radiation array 10 of the present invention include but are not limited to: through the ingenious cooperation of the metal outer frame 1, the metal mounting plate 2, several low-frequency antenna arrays 3, several high-frequency antenna arrays 4, several high-frequency power combining modules 5, several energy storage material components 6 and the low-frequency transceiver component 7, the high-frequency transceiver component (surrounded by the second metal frame 42) is vertically placed, and the low-frequency transceiver component 7 is horizontally placed, which can reduce the problem that the multi-frequency circuit of the active phased array antenna cannot be realized due to the complex circuit design. Moreover, the low-frequency antenna array 3 and the high-frequency antenna array 4 adopt a nested structure, which meets the problem of different frequency array spacings of the antenna array and realizes multi-frequency phased array scanning and multi-frequency combination. At the same time, adding the energy storage material component 6 at the junction gap between the horizontally arranged circuit and the vertically arranged circuit can improve the high-power tolerance ability of the active antenna array and solve the problem of high-power heat dissipation.

[0050] The above is only a preferred embodiment of the present invention, which is intended to further illustrate the present invention rather than limit it. All simple substitutions made according to the content disclosed in the above text and drawings are within the scope of the patent rights protection of this patent.

Claims

1. A nested radiation array (10), characterized in that, Comprising: A metal outer frame (1) having a receiving cavity (19) with an upper opening; A metal mounting plate (2) installed in the receiving cavity (19) of the metal outer frame (1), including a metal substrate (21), and the metal substrate (21) divides the receiving cavity (19) into a first receiving cavity (191) located below and a second receiving cavity (192) located above; A plurality of low-frequency antenna arrays (3) vertically inserted in the receiving cavity (19), including: a first circuit (31), a first metal frame (32) disposed outside the first circuit (31), and a plurality of connectors (33) disposed at the bottom side of the first circuit (31), and the first circuit (31) includes a filter disposed inside the first metal frame (32) and a low-frequency passive radiator at the top of the first metal frame (32); A plurality of high-frequency antenna arrays (4) vertically inserted in the receiving cavity (19), including: a second circuit board (41) and a second metal frame (42) disposed outside the second circuit (41), and the second circuit (41) includes a transceiver circuit composed of a high-frequency power amplifier, a low-noise amplifier, a switch, and a amplitude-phase control circuit disposed inside the second metal frame (42) and a high-frequency passive radiator at the top of the second metal frame (42); A plurality of high-frequency power combining modules (5) disposed at the bottom side of the high-frequency antenna array (4), including a high-frequency power combining circuit electrically connected to the high-frequency transceiver circuit of the high-frequency antenna array (4) and a metal frame disposed outside the high-frequency power combining circuit; A plurality of energy storage material components (6) disposed between the metal frame of the high-frequency power combining module (5) and the metal mounting plate (2); and A low-frequency transceiver assembly (7) horizontally disposed in the first receiving cavity (191), including a plurality of power amplifiers, a plurality of low-noise amplifiers, a plurality of switches, and a plurality of amplitude-phase control circuits, and the connectors (13) of each low-frequency antenna array (1) pass through the substrate (21) and are electrically connected to the low-frequency transceiver assembly; Two adjacent high-frequency antenna arrays (4) are disposed side by side between two adjacent low-frequency antenna arrays (3), and the two side-by-side high-frequency antenna arrays (4) share one high-frequency power combining module (5); Fixing members (9) integral with the first metal frame (32) are disposed at both ends of the first metal frame (32).

2. The nested radiation array (10) according to claim 1, characterized in that: The metal outer frame (1) includes a rectangular bottom plate (11) and four side plates (12) extending upward from four sides of the bottom plate (11); two step portions (13) are formed between the bottom plate (11) and two longitudinally extending side plates (12); and the fixing member (9) is correspondingly fixed to the step portion (13).

3. The nested radiation array (10) according to claim 2, characterized in that: The longitudinal dimension of the fixing member (9) corresponds to the sum of the longitudinal dimension of one low-frequency antenna array (3) and the longitudinal dimensions of two high-frequency antenna arrays (4) respectively located on both sides of the low-frequency antenna array (3).

4. The nested radiation array (10) according to claim 1, wherein: The first metal frame (32) is composed of two metal parts (321, 322) located outside the first circuit (31), and the metal parts (321, 322) have laterally thickened bases (3211, 3221); the high-frequency power combining module (5) is supported on the top sides of the bases (3211, 3221).

5. The nested radiation array (10) according to claim 4, wherein: The bases (3211, 3221) of the first metal frame (32) are correspondingly matched with the downwardly protruding steps (53) formed by the metal frame of the high-frequency power combining module (5).

6. The nested radiation array (10) according to claim 1, characterized in that: The metal mounting plate (2) further includes a plurality of heat dissipation teeth (22) protruding upward from the substrate (21), and the top and bottom ends of the energy storage material part (6) are respectively in contact with the metal frame of the high-frequency power combining module (5) and the heat dissipation teeth (22).

7. The nested radiation array (10) according to claim 1, characterized in that: It further includes: A low-frequency control circuit module, a high-frequency control circuit module, a low-frequency frequency conversion transceiver component, and a high-frequency frequency conversion transceiver component, which are arranged below the low-frequency transceiver component (7) and are located in the first accommodation cavity 191.

8. The nested radiation array according to any one of claims 1 to 7, characterized in that: The first circuit (31) includes a first circuit board, a filter formed on the first circuit board, and a plurality of low-frequency passive radiators; the second circuit (41) includes a transceiver circuit composed of a high-frequency power amplifier, a low-noise amplifier, a switch, and a amplitude-phase control circuit arranged inside the second metal frame (42), and a high-frequency passive radiator on the top of the second metal frame (42).

Images