An optical module in-mold copper die-casting molding mechanism

Abstract

The present invention discloses a die-casting mechanism for inserting copper in an optical module mold. By arranging a molding insert in the main body of the mold core, a slot is concavely provided on the molding surface of the molding insert, so that the copper block can be clamped on the molding insert. At the same time, a ventilation block is arranged in the assembly groove of the movable template, and a first air path is provided in the ventilation block. A second air path connected to the first air path is arranged in the molding insert, and a third air path connected to the first air path is arranged on the movable template, and the third air path is connected to an external negative pressure generator through an air pipe. Thus, the negative pressure can be guided to the slot through the air path to quickly adsorb and fix the copper block insert, thereby realizing the inlay and bonding of the copper block and the zinc alloy & aluminum alloy optical module through die-casting, greatly improving the production efficiency and yield rate of the copper-inlaid optical module housing, and providing a good market prospect for the production and application of optical modules in the field of precision die-casting.

Description

Technical Field

[0001] The invention relates to the technical field of die-casting equipment and molds, and in particular to a copper-inlaid die-casting molding mechanism for an optical module. Background Art

[0002] With the advancement of science and technology, a large number of high-conductivity materials have been widely used. However, due to their physical properties and high melting points, most of these materials are difficult to mass-produce with current technology.

[0003] For example, the thermal conductivity of zinc alloy is about 110W / m·K, which has reached the ceiling stage in the field of high power and high thermal conductivity of 5G optical modules. The thermal conductivity of copper alloy is much higher than that of zinc alloy and aluminum alloy, and the thermal conductivity of copper alloy is about 397W / m·K. However, pure copper has a high melting point of about 1000℃, which makes it difficult to make. Die casting is affected by many factors. In order to fully connect the advantages of copper to the 5G optical module shell made of zinc alloy and aluminum alloy die casting, Fig.11 As shown, the general practice is to set a copper block at the heat-conducting part at the bottom of the 5G optical module housing to improve the thermal conductivity of the 5G optical module.

[0004] At present, the soldering process is generally used to connect the copper block to the zinc alloy & aluminum alloy 5G optical module shell to achieve the connection and coordination between the copper block and the zinc alloy & aluminum alloy 5G optical module shell. This connection method has many disadvantages in the production process. For example, the soldering process needs to pass through a high-temperature conveyor furnace, the shell is easy to deform, and the defective rate is relatively high; secondly, the soldering process is prone to environmental pollution; thirdly, due to the incoherence between the materials in the connection between copper and zinc alloy & aluminum alloy, the soldering connection often causes the shell and copper to separate. It can be seen that the soldering process has low yield, low production efficiency, high cost, and serious safety hazards.

[0005] Therefore, it is necessary to provide a new method to achieve the coordinated application of copper and zinc alloy & aluminum alloy shells. Summary of the invention

[0006] The main purpose of the present invention is to provide an optical module in-mold copper die-casting molding mechanism, which can realize the die-casting cooperation between the copper block insert and the zinc alloy & aluminum alloy shell, subverting the manufacturing process of the optical module zinc alloy die-casting parts connecting copper and non-ferrous metals through the soldering process in the subsequent process.

[0007] To achieve the above-mentioned purpose, the present invention proposes a die-casting mechanism for inserting copper in a light module mold, which is applied to a die-casting mold for a light module. The die-casting mold for a light module includes a movable mold plate, which has an assembly groove, a mold core body assembled in the assembly groove, and a molding insert for molding the bottom features of the light module is arranged in the mold core body; a groove is concavely arranged on the molding surface of the molding insert, the depth of the groove is less than the thickness of the copper block insert, and when the copper block insert is placed in the groove, the upper end portion of the copper block clamp protrudes from the groove;

[0008] A vent block is provided in the assembly groove, and the lower end of the molding insert passes through the mold core body and abuts against the vent block; a first air path is provided in the vent block, and a second air path connected to the slot is provided in the molding insert, and the second air path is connected to the first air path;

[0009] The movable template is provided with a third air path connected with the first air path, and the air outlet end of the third air path is connected with an external negative pressure generator through an air pipe.

[0010] Optionally, the molding insert has a molding portion and a mounting portion, the molding portion is arranged at the upper end of the mounting portion, and its upper surface has a molding surface with the same characteristic contour as the bottom of the optical module, and the card slot is arranged in the molding surface;

[0011] The mounting portion is vertically arranged, and a lower end portion thereof passes through the mold core body and abuts against the ventilation block, and the second air path is arranged in the mounting portion.

[0012] Optionally, a vacuum valve is provided in the second gas circuit.

[0013] Optionally, a receiving groove is concavely arranged at the bottom of the assembly groove, and the ventilation block is arranged in the receiving groove.

[0014] Optionally, the gas outlet of the first gas path is located at the bottom of the accommodating groove, the bottom of the accommodating groove is provided with an annular groove surrounding the gas outlet of the first gas path, and a sealing ring is provided in the annular groove.

[0015] Optionally, two inclined top blocks are provided in the mold core body, and the inclined top blocks are respectively provided on both sides of the forming insert and are inclined outwardly relative to the forming insert;

[0016] A side molding ejection block for molding the side features of the optical module is provided on one side of the two inclined ejection blocks close to the molding insert;

[0017] The bottoms of the two inclined ejector blocks extend downward along their inclined direction and are inserted into the movable template. The movable template is provided with two avoidance grooves for avoiding the two inclined ejector blocks. The bottoms of the inclined ejector blocks pass through their corresponding avoidance grooves and are connected to the ejection mechanism of the optical module die-casting mold.

[0018] Optionally, the avoidance groove is a straight groove, and the bottom of the movable template is recessed with a horizontal bottom groove connected to the avoidance groove, and the bottom groove and the two avoidance grooves form an inverted π-shaped groove;

[0019] Side bottom plates are provided on both sides of the bottom groove, and a central bottom plate is provided in the middle area of ​​the bottom groove; the free ends of the side bottom plates extend toward the inclined surface of the inclined top block passing through the avoidance groove and abut against the inclined top block, and the central bottom plate has an extension portion extending toward the inclined surface of the inclined top block passing through the avoidance groove and abutting against the inclined top block, and the end surface of the extension portion forms a bayonet with the free end surface of the side bottom plate to clamp the inclined portion of the inclined top block.

[0020] Optionally, the side bottom plate and the center bottom are both fixed to the bottom of the bottom groove by bolts.

[0021] Optionally, the side molding ejection block is fixed to its corresponding inclined ejection block by bolts.

[0022] Optionally, a horizontally arranged guide block is provided at the lower end of the inclined lift block, a T-shaped connecting portion is provided on the upper end surface of the guide block, a T-shaped slot is recessed at the bottom of the inclined lift block, and the inclined lift block and the guide block are slidably connected by the engagement of the T-shaped slot and the T-shaped connecting portion.

[0023] The present invention provides an in-mold copper-inlaid die-casting forming mechanism capable of connecting a copper block to an optical module housing in the form of an insert die-casting, thereby realizing the inlay connection of the copper block and the zinc alloy & aluminum alloy optical module through die-casting cooperation, subverting the manufacturing process of the zinc alloy & aluminum alloy optical module die-casting housing connecting copper and other non-ferrous metals through a soldering process in the subsequent process, greatly improving the production efficiency and yield rate of the copper-inlaid optical module housing, and providing a good market prospect for the production and application of optical modules in the field of precision die-casting.

[0024] Specifically, a forming insert is arranged in the mold body, and a slot is concavely arranged on the forming surface of the forming insert, so that the copper block can be snapped onto the forming insert. At the same time, a ventilation block is arranged in the assembly groove of the movable template, and a first air path is provided in the ventilation block, a second air path connected to the first air path is arranged in the forming insert, and a third air path connected to the first air path is arranged on the movable template, and the third air path is connected to an external negative pressure generator through an air pipe. Thus, negative pressure can be guided into the slot through the air path to quickly adsorb and fix the copper block insert, thereby realizing the inlay joint of the copper block and the zinc alloy & aluminum alloy optical module through die-casting.

[0025] Moreover, by setting the depth of the slot to be smaller than the thickness of the copper block insert, after the copper block insert is fixed in the slot, the upper end portion of the copper block protrudes from the molding surface of the molding insert. In this way, after the optical module is die-cast, the portion of the copper block insert protruding from the molding surface will be embedded in the molded optical module shell, forming an embedded die-cast fit with the optical module shell, greatly improving the tightness of the combination of the copper block insert and the optical module shell, thereby greatly improving the overall thermal conductivity efficiency of the optical module shell molding.

[0026] Moreover, the copper block insert and the optical module housing are combined together by inlay die-casting, which has a good bonding effect and can effectively avoid the problem of separation between the housing and the copper block when soldering is used, greatly improving the yield rate of the copper-inlaid optical module. At the same time, it also avoids the pollution problem caused by the soldering process.

[0027] Moreover, by adsorbing and fixing the copper block insert by negative pressure, the phenomenon of defective products caused by displacement of the copper block insert during the die-casting process can be effectively reduced or avoided.

[0028] Moreover, the copper block insert is adsorbed and fixed by negative pressure, so that the copper block insert can be quickly adsorbed and fixed when it is located near the slot, which greatly reduces the placement requirements of the copper block insert. The in-mold copper die-casting molding mechanism provided by the present invention can also cooperate with the automatic insert implantation technology to further improve the production efficiency of the optical module.

[0029] In addition, the in-mold copper-inlaid die-casting molding mechanism provided by the present invention can also realize the automated production of optical module inlay molding, greatly improve the production efficiency of copper-inlaid optical modules, and significantly improve the economic benefits of the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0031] Figure 1 This is a schematic diagram of the structure of the die-casting mold for the optical module of the present invention;

[0032] Figure 2 It is a structural schematic diagram of the mold core body in the optical module die-casting mold of the present invention;

[0033] Figure 3 This is a schematic diagram of the structure of the copper-inlaid die-casting molding mechanism in the optical module die-casting mold of the present invention.

[0034] Figure 4It is a structural schematic diagram of another perspective of the die-casting molding mechanism of the optical module die-casting mold of the present invention;

[0035] Figure 5 It is a front view of the die-casting mechanism of copper inlay in the die-casting mold of the optical module of the present invention;

[0036] Figure 6 It is a structural schematic diagram of a copper block insert being embedded in a mold copper-inlaid die-casting molding mechanism;

[0037] Figure 7 It is a schematic diagram of the structure of the optical module after being formed in the in-mold copper die-casting molding mechanism;

[0038] Figure 8 This is a schematic diagram of the installation of the inclined ejector block on the moving template;

[0039] Fig. 9 Schematic cross-sectional view of the die-casting mold for an optical module of the present invention;

[0040] Fig.10 for Fig. 9 A partial enlarged view of the middle A;

[0041] Fig.11 The utility model discloses an optical module housing with a copper block.

[0042] Description of Figure Numbers:

[0043] 100-movable template, 100a-assembly groove, 100b-accommodation groove, 100c-third gas path, 100d-avoidance groove, 100e-bottom groove, 100f-gas outlet end of the third gas path, 110-ventilation block, 111-sealing ring, 120-side bottom plate, 120a-free end surface of the side bottom plate, 130-center bottom plate, 130a-extension end surface of the center bottom plate;

[0044] 200- mold body;

[0045] 300-in-mold copper die-casting molding mechanism, 310-molding insert, 3101-molding portion, 3101a-slot, 3102-installation portion, 3102a-second gas path, 311-vacuum valve, 320, 330-inclined ejector blocks, 320a-T-slot, 321, 331-side molding ejector blocks, 322, 332-guide blocks, 322a-T-connecting portion;

[0046] 400- optical module housing, 401- copper block insert.

[0047] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0050] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0051] The invention provides a die-casting mold for an optical module.

[0052] like Figure 1-2 As shown, in an embodiment of the present invention, the optical module die-casting mold includes a movable platen and a mold body. The movable platen 100 has an assembly groove 100a, and the mold body 200 is assembled in the assembly groove 100a. The mold body 200 is provided with an in-mold copper die-casting molding mechanism 300. The present invention provides an in-mold copper die-casting molding mechanism 300 provided in the mold body 200, and the in-mold copper die-casting molding mechanism 300 can connect the copper block to the optical module housing 400 in the form of an insert die-casting. This inlay joint of the copper block insert 401 and the zinc alloy & aluminum alloy optical module housing 400 is achieved by die-casting, which can subvert the manufacturing process of the zinc alloy & aluminum alloy optical module die-casting housing in the subsequent process of connecting copper and other non-ferrous metals through the soldering process, greatly improving the production efficiency and yield rate of the copper-inlaid optical module housing 400, and providing a good market prospect for the production and application of optical modules in the field of precision die-casting.

[0053] Specifically, Figure 3-5As shown in Figures 9-10, the in-mold copper die-casting molding mechanism 300 includes a molding insert 310, which has a molding portion 3101 and a mounting portion 3102. The molding portion 3101 is arranged at the upper end of the mounting portion 3102, and its upper surface has a molding surface with the same characteristic contour as the bottom of the optical module, and the molding surface is concavely provided with a groove 3101a, and the depth of the groove 3101a is less than the thickness of the copper block insert 401.

[0054] The vent block 110 is provided in the assembly groove 100a, and the mounting portion 3102 of the molding insert 310 is vertically arranged, and its lower end passes through the mold core body 200 and abuts against the vent block 110. A first air path (as shown in the figure) is provided in the vent block 110, and a second air path 3102a communicating with the card slot 3101a is provided in the mounting portion 3102 of the molding insert 310, and the air outlet end of the second air path 3102a is connected to the air intake end of the first air path.

[0055] A third air path 100c connected to the first air path is provided on the movable template 100, and an air outlet end 100f of the third air path 100c is exposed to the outside of the side of the automatic template 100 and is connected to an external negative pressure generator through an air pipe.

[0056] like Figure 6 As shown, before the optical module housing 400 is die-casted, the copper block insert 401 is placed in the slot 3101a, and the negative pressure is introduced into the slot 3101a by the negative pressure generator, so that the copper block insert 401 is quickly adsorbed and fixed on the molding insert 310 by the negative pressure. Figure 7 As shown, after the mold is closed and die-casted, the optical module housing 400 is die-casted in the mold body 200 .

[0057] In this embodiment, the negative pressure generated by the negative pressure generator can be guided into the card slot 3101a through the first gas path, the second gas path 3102a and the third gas path 100c to quickly adsorb and fix the copper block insert 401, thereby realizing the inlay bonding of the copper block and the zinc alloy & aluminum alloy optical module through die-casting.

[0058] Moreover, by setting the depth of the slot 3101a to be smaller than the thickness of the copper block insert 401, after the copper block insert 401 is fixed in the slot 3101a, the upper end portion of the copper block insert 401 protrudes from the molding surface of the molding insert 310. In this way, after the optical module shell 400 is die-cast, the portion of the copper block insert 401 protruding from the molding surface will be embedded in the molded optical module shell 400, forming an embedded die-cast fit with the optical module shell 400, thereby greatly improving the tightness of the combination of the copper block insert 401 and the optical module shell 400, thereby greatly improving the thermal conductivity efficiency of the overall molding of the optical module shell 400.

[0059] Moreover, the copper block insert 401 and the optical module housing 400 are combined together by inlay die-casting, which has a good bonding effect and can effectively avoid the problem of separation between the housing and the copper block when soldering is used, greatly improving the yield rate of the copper-inlaid optical module. At the same time, it also avoids the pollution problem caused by the soldering process.

[0060] Furthermore, by adsorbing and fixing the copper block insert 401 by negative pressure, the phenomenon of displacement of the copper block insert 401 during the die-casting process leading to defective products can be effectively reduced or avoided.

[0061] Moreover, the copper block insert 401 is adsorbed and fixed by negative pressure, so that the copper block insert 401 can be quickly adsorbed and fixed when it is located near the slot 3101a, which greatly reduces the placement requirements of the copper block insert 401, so that the in-mold copper die-casting molding mechanism 300 provided by the present invention can also cooperate with the automatic insert implantation technology to further improve the production efficiency of the optical module.

[0062] In addition, the in-mold copper-inlaid die-casting molding mechanism 300 provided by the present invention can also realize the automated production of optical module inlay molding, greatly improve the production efficiency of copper-inlaid optical modules, and significantly improve the economic benefits of the enterprise.

[0063] Alternatively, if Fig. 9 As shown, in this embodiment, a vacuum valve 311 is provided in the second gas path 3102a to adjust the negative pressure in the card slot 3101a.

[0064] Alternatively, if Fig. 9 As shown, in this embodiment, the bottom of the assembly groove 100a is concavely provided with a receiving groove 100b, and the ventilation block 110 is arranged in the receiving groove 100b. By providing the receiving groove 100b, it is convenient to arrange the ventilation block 110 in the assembly groove 100a, and the ventilation block 110 is pressed into the receiving groove 100b through the mold core body 200, thereby reducing the complexity of mold assembly.

[0065] Alternatively, if Fig. 9 As shown, in this embodiment, the gas outlet of the first gas path is located at the bottom of the accommodating groove 100b, and the bottom of the accommodating groove 100b is provided with an annular groove (not shown) surrounding the gas outlet of the first gas path, and a sealing ring 111 is provided in the annular groove. Thus, the sealing ring 111 is used to improve the sealing performance of the connection between the first gas path and the third gas path 100c, thereby reducing gas leakage.

[0066] Alternatively, if Figure 3-5As shown, in this embodiment, two inclined top blocks (320, 330) are provided in the mold core body 200, and the inclined top blocks (320, 330) are respectively provided on both sides of the molding insert 310 and are inclined outward relative to the molding insert 310. The two inclined top blocks (320, 330) are provided with side molding ejection blocks (321, 331) for molding the side features of the optical module on one side close to the molding insert 310. The molding ejection blocks (321, 331) on both sides and the molding insert 310 form a dynamic mold cavity to form the structural features of the lower surface of the optical module housing 400.

[0067] The bottoms of the two inclined ejector blocks (320, 330) extend downward along their inclination direction and are inserted into the movable template 100. The movable template 100 is provided with two avoidance grooves 100d for avoiding the two inclined ejector blocks (320, 330). The bottoms of the inclined ejector blocks (320, 330) pass through their corresponding avoidance grooves 100d and are connected to the ejection mechanism of the optical module die-casting mold.

[0068] By setting the molding surface for molding the side features of the optical module housing 400 on the side molding ejection blocks (321, 331), when the mold is opened, the side molding ejection blocks (321, 331) can be ejected by the ejection mechanism, so that the optical module housing 400 molded by the molding surface of the side molding ejection blocks (321, 331) is separated, so as to avoid the side features of the optical module housing 400 being pulled when the optical module housing 400 is ejected, thereby improving the yield rate of the molding of the optical module housing 400. At the same time, it can also provide convenience for the ejection of the optical module housing 400, so as to improve the ejection efficiency of the optical module housing 400 and improve the production efficiency of the optical module housing 400.

[0069] In this embodiment, if Figure 5 and Figure 8 As shown, the avoidance groove 100d is set as a straight groove and can allow the inclined top blocks (320, 330) to move. A horizontal bottom groove 100e connected to the avoidance groove 100d is recessed at the bottom of the movable template 100, and the bottom groove 100e and the two avoidance grooves 100d form an inverted π-shaped groove.

[0070] Side bottom plates 120 are provided on both sides of the bottom groove 100e, and a central bottom plate 130 is provided in the middle area of ​​the bottom groove 100e. The free ends of the side bottom plates 120 extend toward the inclined surface of the inclined top block passing through the avoidance groove 100d and abut against the inclined top blocks (320, 330), and the central bottom plate 130 has an extension portion (not shown) extending toward the inclined surface of the inclined top block (320, 330) passing through the avoidance groove 100d and abutting against the inclined top blocks (320, 330), and the end surface 130a of the extension portion forms a bayonet with the free end surface 130a of the side bottom plate 120 to clamp the inclined portion of the inclined top block (320, 330).

[0071] The extensions of the side bottom plate 120 and the central bottom plate 130 are provided to limit the swing of the inclined ejector blocks (320, 330), so that the inclined ejector blocks (320, 330) can only perform ejection actions along their inclined surfaces, thereby improving the stability of the actions of the inclined ejector blocks (320, 330).

[0072] Furthermore, the side bottom plate 120 and the center bottom plate are both fixed to the bottom of the bottom groove 100e by bolts, so that different side bottom plates 120 and center bottom plates 130 can be replaced according to the inclination of the inclined top blocks (320, 330), so as to quickly adapt to different types of inclined top blocks (320, 330) and improve the application range of the mold.

[0073] At the same time, in this embodiment, the side molding ejection blocks (321, 331) are also fixed to their corresponding inclined ejection blocks (320, 330) by bolts to facilitate replacement and maintenance.

[0074] Alternatively, if Figure 4 As shown, in this embodiment, horizontally arranged guide blocks (322, 332) are provided at the lower ends of the inclined ejector blocks (320, 330), and the guide blocks (322, 332) are connected to the ejection mechanism of the mold. The two guide blocks (322, 332) have the same structure. Taking the guide block 322 as an example, a T-shaped connecting portion 322a is provided on its upper end surface, and a T-shaped groove 320a is recessed at the bottom of the inclined ejector block 320. The inclined ejector block 320 and the guide block 322 are slidably connected by the engagement of the T-shaped groove 320a and the T-shaped connecting portion 322a.

[0075] During ejection, the guide blocks (322, 332) move upwards under the drive of the ejection mechanism of the mold, driving the inclined ejection blocks (320, 330) to move. While the inclined ejection blocks (320, 330) move upwards, they slide to both sides along the T-slots of the guide blocks (322, 332), thereby ensuring the stability of the movement of the inclined ejection blocks (320, 330).

[0076] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An optical module in-mold copper die-casting molding mechanism, applied to an optical module die-casting mold, the optical module die-casting mold comprises a movable mold plate, the movable mold plate has an assembly groove, a mold core body is assembled in the assembly groove, and a molding insert for molding the bottom features of the optical module is arranged in the mold core body; It is characterized in that The molding surface of the molding insert is concavely provided with a slot, the depth of which is less than the thickness of the copper block insert, and when the copper block insert is placed in the slot, the upper end of the copper block clamp protrudes from the slot; A vent block is provided in the assembly groove, and the lower end of the molding insert passes through the mold core body and abuts against the vent block; a first air path is provided in the vent block, and a second air path connected to the slot is provided in the molding insert, and the second air path is connected to the first air path; The movable plate is provided with a third gas path connected to the first gas path, and the gas outlet end of the third gas path is connected to an external negative pressure generator through an air pipe; The molding insert has a molding part and a mounting part, the molding part is arranged at the upper end of the mounting part, and its upper surface has a molding surface with the same characteristic contour as the bottom of the optical module, and the card slot is arranged in the molding surface; The mounting portion is vertically arranged, and a lower end portion thereof passes through the mold core body and abuts against the ventilation block, and the second air path is arranged in the mounting portion; The bottom of the assembly groove is concavely provided with an accommodating groove, and the ventilation block is arranged in the accommodating groove; Two inclined top blocks are arranged in the mold body, and the inclined top blocks are arranged on both sides of the forming insert and are inclined outwardly relative to the forming insert; A side molding ejection block for molding the side features of the optical module is provided on one side of the two inclined ejection blocks close to the molding insert; The bottoms of the two inclined ejector blocks extend downward along their inclined direction and are inserted into the movable template. The movable template is provided with two avoidance grooves for avoiding the two inclined ejector blocks. The bottoms of the inclined ejector blocks pass through their corresponding avoidance grooves and are connected to the ejection mechanism of the optical module die-casting mold.

2. The optical module in-mold copper die-casting molding mechanism according to claim 1, It is characterized in that A vacuum valve is provided in the second gas circuit.

3. The optical module in-mold copper die-casting molding mechanism according to claim 1, It is characterized in that The gas outlet of the first gas path is located at the bottom of the accommodating groove, and the bottom of the accommodating groove is provided with an annular groove surrounding the gas outlet of the first gas path, and a sealing ring is provided in the annular groove.

4. The optical module in-mold copper die-casting molding mechanism according to claim 1, It is characterized in that The avoidance groove is a straight groove, and the bottom of the movable template is concavely provided with a bottom groove connected to the avoidance groove and arranged horizontally, and the bottom groove and the two avoidance grooves form an inverted π-shaped groove; Side bottom plates are provided on both sides of the bottom groove, and a central bottom plate is provided in the middle area of ​​the bottom groove; the free ends of the side bottom plates extend toward the inclined surface of the inclined top block passing through the avoidance groove and abut against the inclined top block, and the central bottom plate has an extension portion extending toward the inclined surface of the inclined top block passing through the avoidance groove and abutting against the inclined top block, and the end surface of the extension portion forms a bayonet with the free end surface of the side bottom plate to clamp the inclined portion of the inclined top block.

5. The optical module in-mold copper die-casting molding mechanism according to claim 4, It is characterized in that The side bottom plate and the center bottom plate are both fixed to the bottom of the bottom groove by bolts.

6. The optical module in-mold copper die-casting molding mechanism according to claim 1, It is characterized in that The side forming ejection block is fixed to its corresponding inclined ejection block by bolts.

7. The optical module in-mold copper die-casting molding mechanism according to claim 1, It is characterized in that A horizontally arranged guide block is provided at the lower end of the inclined lift block, a T-shaped connecting portion is provided on the upper end surface of the guide block, a T-shaped slot is recessed at the bottom of the inclined lift block, and the inclined lift block and the guide block are slidably connected by the engagement of the T-shaped slot and the T-shaped connecting portion.

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