Temperature characteristic detection method, system, controller and temperature characteristic detection device

Abstract

A temperature characteristic detection method, its system, controller and temperature characteristic detection device provided by the present application determine whether the device under test is a light source or a photodetector; control the temperatures of the light source and the photodetector to fit the relationship curve between the output temperature and the detected quantity; and regard the light source or photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve. The present application can be used as an independent experimental device for device screening, temperature aging experiments, and output temperature performance curve of light sources and photodetectors, and can achieve the best cost performance.

Description

Technical Field

[0001] This application relates to the field of optoelectronic sensing technology, and particularly to a temperature characteristic detection method, its system, a controller, and a temperature characteristic detection device. Background Art

[0002] In the light sources and photodetectors used in the field of optoelectronic detection, their performance varies with temperature. If the light sources and photodetectors are used for a long time, problems such as device temperature aging may occur. Therefore, a simple experimental device is needed for device screening of light sources and photodetectors, temperature aging experiments, and outputting temperature performance curves. Summary of the Invention

[0003] In view of the above-mentioned disadvantages of the prior art, the purpose of this application is to provide a temperature characteristic detection method, its system, a controller, and a temperature characteristic detection device to solve the problems in the prior art.

[0004] To achieve the above purpose and other related purposes, this application provides a temperature characteristic detection method, which is applied to a temperature characteristic detection device including a light source and a photodetector; the method includes: determining whether the device under test is a light source or a photodetector; controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity; and regarding the light source or the photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve.

[0005] In an embodiment of this application, the temperature characteristic detection device further includes: a first temperature control unit connected to the light source, a second temperature control unit connected to the photodetector, and an analog-to-digital conversion unit; the step of controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity includes: when the light source is the device under test, controlling the photodetector to be at a constant temperature through the second temperature control unit; controlling the temperature of the light source to perform a triangular wave scan through the first temperature control unit, and collecting the detected quantity values according to the analog-to-digital conversion unit; performing multi-period triangular wave mathematical averaging, linearly fitting between the highest temperature and the lowest temperature, and only using the section with the best linearity in the middle considering the hysteresis of temperature transfer; fitting between the light source temperature and the detected quantity by the least squares method to output the relationship curve between the output temperature and the detected quantity.

[0006] In an embodiment of the present application, the optoelectronic sensing device further includes: a first temperature control unit connected to the light source, a second temperature control unit connected to the photodetector, and an analog-to-digital conversion unit; controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity, including: when the photodetector is the device under test, controlling the light source to be at a constant temperature through the first temperature control unit; controlling the temperature of the photodetector to perform a triangular wave scan through the second temperature control unit, and collecting the detected quantity values according to the analog-to-digital conversion unit; using multi-period triangular wave mathematical averaging to linearly fit between the highest temperature and the lowest temperature, and only using the section with the best linearity in the middle considering the hysteresis of temperature transfer; using the least squares method to fit between the photodetector and the detected quantity, and outputting the relationship curve between the output temperature and the detected quantity.

[0007] To achieve the above object and other related objects, the present application provides a temperature characteristic detection system, characterized in that the system includes: a determination module for determining whether the device under test is a light source or a photodetector; a processing module for controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity; and regarding the light source or the photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve.

[0008] To achieve the above object and other related objects, the present application provides a controller, the controller includes: a memory and a processor; the memory is used to store computer instructions; the processor runs the computer instructions to implement the method as described above.

[0009] To achieve the above object and other related objects, the present application provides a computer storage medium storing a computer program, and the computer program executes the method as described above when running.

[0010] To achieve the above object and other related objects, the present application provides a temperature characteristic detection device, the device includes: a light source, a photodetector, a signal amplification circuit, an analog-to-digital conversion unit, a first temperature control unit, a second temperature control unit, and the controller as described above; the light source is used to emit measurement light to the photodetector; the photodetector is used to convert the optical signal of the received measurement light into an electrical signal; the electrical signal is amplified by the signal amplification circuit and converted by the analog-to-digital conversion unit to obtain a digital signal; the first temperature control unit and the second temperature control unit are used to achieve temperature control according to the target temperature sent by the controller and obtain the actual temperature and send it to the controller; the controller is used to connect the first temperature control unit and the second temperature control unit through a digital signal to respectively send the target temperature of the light source and obtain the current temperature.

[0011] In an embodiment of the present application, the first temperature control unit includes: a TEC device, a drive circuit, a thermistor, a heat sink, and a heat conduction structure; wherein, one side of the TEC device is connected to the heat sink, and the other side serves as a working surface and is tightly connected to the light source through the heat conduction structure; after receiving the target temperature sent by the controller through a digital signal, the drive circuit controls the TEC device to reach the target temperature at its working surface; the thermistor is closely attached to the heat conduction structure, and the temperature detected by it represents the real temperature of the light source and is transmitted to the controller through a digital quantity.

[0012] In an embodiment of the present application, the second temperature control unit includes: a TEC device, a drive circuit, a thermistor, a heat sink, and a heat conduction structure; wherein, one side of the TEC device is connected to the heat sink, and the other side serves as a working surface and is tightly connected to the photodetector through the heat conduction structure; after receiving the target temperature sent by the controller through a digital signal, the drive circuit controls the TEC device to reach the target temperature at its working surface; the thermistor is closely attached to the heat conduction structure, and the temperature detected by it represents the real temperature of the photodetector and is transmitted to the controller through a digital quantity.

[0013] In an embodiment of the present application, the controller includes any one of a single-chip microcomputer, an ARM, a PLC, and an FPGA.

[0014] In summary, the present application provides a temperature characteristic detection method, its system, a controller, and a temperature characteristic detection device, which determine the device under test as a light source or a photodetector; control the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity; and regard the light source or the photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve.

[0015] It has the following beneficial effects:

[0016] It can be used as a separate experimental device for device screening, temperature aging experiments, and output temperature performance curve of light sources and photodetectors, and can achieve the best cost performance. Description of the Drawings

[0017] Figure 1 It shows a schematic structural diagram of the temperature characteristic detection device in an embodiment of the present application.

[0018] Figure 2 It shows a schematic circuit diagram of the photodetector and the signal amplification circuit in an embodiment of the present application.

[0019] Figure 3 It shows a schematic structural diagram of the temperature control unit in an embodiment of the present application.

[0020] Figure 4 It shows a schematic flowchart of the temperature characteristic detection method in an embodiment of the present application.

[0021] Figure 5 It shows a schematic block diagram of the temperature characteristic detection system in an embodiment of the present application.

[0022] Figure 6 It shows a schematic structural diagram of the controller in an embodiment of the present application. Detailed implementation manners

[0023] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0024] The following takes the attached drawings as a reference and details the embodiments of the present application so that those skilled in the technical field to which the present application belongs can easily implement it. The present application can be embodied in many different forms and is not limited to the embodiments described herein.

[0025] To clearly illustrate the present application, components irrelevant to the description are omitted, and the same or similar constituent elements throughout the specification are given the same reference numerals.

[0026] Throughout the specification, when it is said that a certain component is "connected" to another component, this includes not only the case of "direct connection", but also the case of "indirect connection" with other elements placed in between. In addition, when it is said that a certain component "includes" a certain constituent element, unless there is a particularly contrary record, it does not exclude other constituent elements, but means that other constituent elements can also be included.

[0027] When it is said that a certain component is "above" another component, this can be directly above the other component, but there can also be other components in between. When it is said that a certain component is "directly" "above" another component, there are no other components in between.

[0028] Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the description of a first interface and a second interface, etc. Further, as used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the stated features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are to be construed as inclusive, or meaning any one or any combination. Thus, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". An exception to this definition occurs only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0029] The technical terms used herein are only for referring to specific embodiments and are not intended to limit this application. The singular forms used herein also include the plural forms as long as the statements do not explicitly indicate the contrary meaning. The meaning of "including" used in the specification is to embody specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.

[0030] Relative spatial terms such as "lower", "upper", etc. may be used to more easily describe the relationship of one component relative to another component illustrated in the drawings. Such terms refer to not only the meaning indicated in the drawings, but also other meanings or operations of the device in use. For example, if the device in the drawing is flipped, a certain component that was described as "lower" than other components is then described as "upper" than other components. Therefore, the exemplary term "lower" includes both upper and lower. The device may be rotated 90° or other angles, and the relative spatial terms are interpreted accordingly.

[0031] As described above, to solve the problems in the prior art, this application provides a temperature characteristic detection method, its system, a controller, and a temperature characteristic detection device, which can be used for device screening of light sources and photodetectors, temperature aging experiments, and outputting temperature performance curves.

[0032] For ease of understanding, this application first describes the temperature characteristic detection device described in this application.

[0033] As Figure 1As shown, it is a schematic structural diagram of a temperature characteristic detection device in an embodiment of the present application. As shown in the figure, the device 100 includes: a light source 101, a photodetector 102, a signal amplification circuit 103, an analog-to-digital conversion unit 104, a first temperature control unit 105, a second temperature control unit 106, and a controller 107.

[0034] Among them, the light source 101 is used to emit measurement light and transmit it to the photodetector 102;

[0035] The photodetector 102 is used to convert the optical signal received by the measurement light into an electrical signal;

[0036] The electrical signal is amplified by the signal amplification circuit 103 and converted by the analog-to-digital conversion unit 104 to obtain a digital signal;

[0037] The first temperature control unit 105 and the second temperature control unit 106 are used to achieve temperature control according to the target temperature sent by the controller 107 and obtain the actual temperature and transmit it to the controller 107;

[0038] The controller 107 is used to connect to the first temperature control unit 105 and the second temperature control unit 106 through a digital signal to respectively send the target temperature of the light source 101 and obtain the current temperature.

[0039] In this embodiment, the light source 101 includes any one of the following devices: a laser diode, a laser, an SLD, and a light bulb. The measurement light emitted by the light source 101 is transmitted to the photodetector 102 through spatial coupling or fiber coupling.

[0040] In this embodiment, the photodetector 102 includes, but is not limited to, devices such as a PD, an APD, and a photomultiplier tube. The PD is a photodiode, and the APD is an avalanche photodiode. The photodetector 102 is used to convert the received optical signal into an electrical signal.

[0041] In this embodiment, the signal amplification circuit 103 includes: a signal amplification circuit 103 and a signal conditioning circuit. The signal amplification circuit 103 is used to amplify the weak electrical signal obtained by the photodetector 102 and filter out noise.

[0042] See Figure 2 , which shows a circuit schematic diagram of the photodetector 102 and the signal amplification circuit 103.

[0043] In this embodiment, the analog-to-digital conversion unit 104 is used to convert an analog signal into a digital signal.

[0044] In an embodiment of the present application, both the first temperature control unit 105 and the second temperature control unit 106 include: a TEC device, a drive circuit, a thermistor, a heat sink, and a heat conduction structure. Specifically, reference can be made to Figure 3 the structural schematic diagram shown. The difference is that the first temperature control unit 105 is connected to the light source 101, and the second temperature control unit 106 is connected to the photodetector 102.

[0045] In the first temperature control unit 105, one side of the TEC device is connected to the heat sink, and the other side serves as a working surface and is tightly connected to the light source 101 through the heat conduction structure; after receiving the target temperature sent by the controller 107 through a digital signal, the drive circuit controls the TEC device to reach the target temperature at its working surface; the thermistor is closely attached to the heat conduction structure, and the temperature it detects represents the real temperature of the light source 101 and is transmitted to the controller 107 in digital quantity.

[0046] In the second temperature control unit 106, one side of the TEC device is connected to the heat sink, and the other side serves as a working surface and is tightly connected to the photodetector 102 through the heat conduction structure; after receiving the target temperature sent by the controller 107 through a digital signal, the drive circuit controls the TEC device to reach the target temperature at its working surface; the thermistor is closely attached to the heat conduction structure, and the temperature it detects represents the real temperature of the photodetector 102 and is transmitted to the controller 107 in digital quantity.

[0047] In this embodiment, the TEC device is preferably a Peltier device.

[0048] In an embodiment of the present application, the controller 107 includes any one of a single-chip microcomputer, an ARM, a PLC, and an FPGA.

[0049] In this embodiment, the controller 107 is connected to the first temperature control unit 105 through a digital signal, sends the target temperature of the light source 101 to it and obtains the current real temperature, and realizes temperature control through a temperature control algorithm; is connected to the second temperature control unit 106 through a digital signal, sends the target temperature of the photodetector 102 to it and obtains the current real temperature, and realizes temperature control through a temperature control algorithm; and is connected to the analog-to-digital conversion unit 104 through a digital signal to obtain the signal quantity after photoelectric conversion.

[0050] As Figure 4 shown, it is a schematic flowchart of the temperature characteristic detection method in an embodiment of the present application.

[0051] It should be noted that the method of the present application is applied to a temperature characteristic detection device for a corresponding light source or photodetector as Figure 1 shown. As Figure 4As shown, the method includes:

[0052] Step S401: Determine whether the device under test is a light source or a photodetector.

[0053] In this embodiment, first, it is necessary to determine the device under test, that is, to detect the temperature characteristics of the light source or the photodetector, and then replace the original light source or photodetector with the light source or photodetector under test. In some embodiments, the replacement work can be pre-completed manually.

[0054] Step S402: Control the temperatures of the light source and the photodetector to fit the relationship curve between the output temperature and the detected quantity.

[0055] In an embodiment of the present application, as shown in Figure 1 it also includes: a first temperature control unit connected to the light source, a second temperature control unit connected to the photodetector, and an analog-to-digital conversion unit.

[0056] In an embodiment, the method corresponding to when the light source is the device under test in step S402 includes:

[0057] A. When the light source is the device under test, control the photodetector to be at a constant temperature through the second temperature control unit;

[0058] B. Control the temperature of the light source to perform a triangular wave scan through the first temperature control unit, and collect the detected quantity values according to the analog-to-digital conversion unit;

[0059] C. Adopt multi-period triangular wave mathematical averaging, linearly fit between the highest temperature and the lowest temperature, and only use the section with the best linearity in the middle considering the hysteresis of temperature transfer;

[0060] D. Fit between the light source temperature and the detected quantity using the least squares method, and output the relationship curve between the temperature and the detected quantity.

[0061] In this embodiment, combined with Figure 1 it can be realized that the controller controls the photodetector to be at a constant temperature through the second temperature control unit, and then the controller controls the temperature of the light source to perform a triangular wave scan through the first temperature control unit. The controller collects the values of the analog-to-digital conversion unit. The data processing adopts multi-period triangular wave mathematical averaging, linearly fits between the highest temperature and the lowest temperature and only uses the section with the best linearity in the middle, and fits between the temperature and the detected quantity using the least squares method to output the relationship curve between the temperature and the detected quantity.

[0062] In another embodiment, the method corresponding to when the photodetector is the device under test in step S402 includes:

[0063] A. When the photodetector is the device under test, control the light source to be at a constant temperature through the first temperature control unit;

[0064] B. Control the temperature of the photodetector to perform a triangular wave scan through the second temperature control unit, and collect the measured value according to the analog-to-digital conversion unit;

[0065] C. Use multi-period triangular wave mathematical averaging to linearly fit between the highest temperature and the lowest temperature, and only use the section with the best linearity in the middle considering the hysteresis of temperature transfer;

[0066] D. Use the least squares method to fit between the photodetector and the measured value, and output the relationship curve between the temperature and the measured value.

[0067] In this embodiment, in this embodiment, in combination with Figure 1 For example, the controller can achieve constant temperature of the light source through the first temperature control unit, and then the controller can control the temperature of the photodetector to perform a triangular wave scan through the second temperature control unit. The controller collects the values of the analog-to-digital conversion module, and the data processing uses multi-period triangular wave mathematical averaging. Linear fitting is performed between the highest temperature and the lowest temperature, and only the section with the best linearity in the middle is used. The least squares method is used to fit between the temperature and the measured value, and the relationship curve between the temperature and the measured value is output.

[0068] In this embodiment, the principles of steps B, C, and D in the above two embodiments are actually the same. The following is an example through a unified calculation relationship:

[0069] The start time and end time of each period of the triangular wave temperature scan are: ti0 and ti1, respectively, where i is the triangular wave order number.

[0070] The data of the photodetector collected is f(t). Considering the hysteresis of temperature transfer, this application takes the section of data with the best linearity in each period, that is, only takes the data between (ti0 + Δt1) and (ti1 - Δt2) in each period. According to the sampling rate of the analog-to-digital conversion unit, an array F[j] can be obtained in each period, and an array Mi,j can be obtained from i arrays. The average of each column of data is obtained to get an array MA, and the number of its elements is j. The temperatures corresponding to the respective element data MA[j] of the array MA are T[j]. Select the MA element value MA(25°C) corresponding to 25°C as the reference value, and divide all other elements of MA by this reference value to obtain a compensation coefficient array MC. Use the least squares method to fit the relationship between the temperature T and MC, which can be a binomial or a polynomial with more terms, or exponential fitting, logarithmic fitting, to obtain the relationship curve.

[0071] Step S403: Regard the light source or photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve.

[0072] In this embodiment, for the relationship curve of the light source or the photodetector, a corresponding temperature preset threshold is set. For example, the normal measurement value corresponding to the lowest temperature must be greater than or equal to a preset threshold; or the normal measurement value corresponding to the standard temperature must be within a preset threshold range; or the normal prediction value corresponding to the highest temperature must be less than or greater than or equal to a preset threshold.

[0073] For example, according to the relationship between temperature and the detected quantity in the obtained relationship curve of the corresponding light source or photodetector, preferably three temperature points, namely the lowest temperature, the standard temperature (usually room temperature, 20 °C or 25 °C, and of course other special temperature values may be selected due to the special working environment of the sensor), and the highest temperature, are used to compare whether the corresponding detected quantities in the relationship curve are within the preset threshold range. If they are not within the preset threshold range, the relationship curve between the temperature and the detected quantity corresponding to the light source or photodetector does not meet the requirements, and the device can be determined as a non-conforming device.

[0074] It should be noted that whether to choose greater than or less than depends on whether the device characteristic is a positive temperature coefficient or a negative temperature coefficient. In addition, the threshold is statistically obtained from mainstream devices, taking into account both performance and cost considerations.

[0075] As Figure 5 shown, a schematic block diagram of the temperature characteristic detection system in an embodiment of the present application is presented. As shown in the figure, the system 500 includes:

[0076] A determination module 501, configured to determine that the device under test is a light source or a photodetector;

[0077] A processing module 502, configured to control the temperature of the light source and the photodetector to fit the relationship curve between the output temperature and the detected quantity; and regard the light source or the photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve.

[0078] It should be noted that for the information interaction, execution process, etc. between the above-mentioned device modules / units, since they are based on the same concept as the method embodiment of the present application, the technical effects brought by them are the same as those of the method embodiment of the present application. For the specific content, reference can be made to the description in the method embodiment shown above in the present application.

[0079] It should also be noted that it should be understood that the division of each module of the above device is only a logical function division. In actual implementation, it can be fully or partially integrated into a physical entity, or physically separated. And these units can all be implemented in the form of software called by a processing element; they can also all be implemented in the form of hardware; or some modules can be implemented in the form of software called by a processing element, and some modules can be implemented in the form of hardware.

[0080] For example, the processing module 502 can be a separately established processing element, or can be implemented by being integrated into a certain chip of the above device. In addition, it can also be stored in the memory of the above device in the form of program code, and the function of the above processing module 502 is called and executed by a certain processing element of the above device. The implementation of other modules is similar. In addition, all or part of these modules can be integrated together or can be independently implemented. The processing element described here can be an integrated circuit with signal processing capabilities. In the implementation process, each step of the above method or each of the above modules can be completed by the integrated logic circuit in the processor element or the instruction in the form of software.

[0081] For example, the above modules can be one or more integrated circuits configured to implement the above method, such as: one or more Application Specific Integrated Circuits (ASICs), or, one or more digital signal processors (DSPs), or, one or more Field Programmable Gate Arrays (FPGAs), etc. Again, when a certain module above is implemented in the form of a processing element scheduling program code, the processing element can be a general-purpose processor, such as a Central Processing Unit (CPU) or other processors that can call program code. Again, these modules can be integrated together and implemented in the form of a system-on-a-chip (SOC).

[0082] As Figure 6 shown, it is a schematic structural diagram of the controller in an embodiment of the present application. As shown in the figure, the controller 600 includes: a memory 601 and a processor 602; the memory 601 is used to store computer instructions; the processor 602 runs the computer instructions to implement as Figure 4 the method described above.

[0083] In some embodiments, the number of the memories 601 in the controller 600 can be one or more, and the number of the processors 602 can be one or more, while Figure 6 one is taken as an example in each case.

[0084] In an embodiment of the present application, the processor 602 in the controller 600 will, according to the steps as Figure 1 described above, load the instructions corresponding to the processes of one or more application programs into the memory 601, and the processor 602 runs the application programs stored in the memory 602, so as to implement as Figure 4The method described above.

[0085] The memory 601 may include a random access memory (RAM), or may also include a non-volatile memory, such as at least one disk memory. The memory 601 stores an operating system, operation instructions, executable modules, or data structures, or subsets thereof, or extended sets thereof, where the operation instructions may include various operation instructions for implementing various operations. The operating system may include various system programs for implementing various basic services and processing hardware-based tasks.

[0086] The processor 602 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), discrete gate or transistor logic devices, discrete hardware components, etc.

[0087] In some specific applications, the various components of the controller 600 are coupled together through a bus system, where the bus system may include, in addition to a data bus, a power bus, a control bus, a status signal bus, etc. However, for the sake of clarity, in Figure 6 all the various buses are referred to as the bus system.

[0088] It should also be noted that Figure 1 the controller in the temperature characteristic detection device shown in Figure 6 may be the controller shown in

[0089] In summary, a temperature characteristic detection method, its system, controller, and temperature characteristic detection device provided by this application determine whether the device under test is a light source or a photodetector; control the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity; and regard the light source or photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve.

[0090] In an embodiment of this application, a computer-readable storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, it implements the temperature characteristic detection method as described in Figure 4 above.

[0091] The computer-readable storage medium is preferably a non-volatile computer storage medium.

[0092] Those of ordinary skill in the art can understand that the embodiments for implementing the functions of the above system and each unit can be completed by hardware related to a computer program. The foregoing computer program can be stored in a computer-readable storage medium. When the program is executed, it implements the embodiments including the functions of the above system and each unit; and the foregoing storage medium includes: ROM, RAM, magnetic disk, or optical disc and other media that can store program codes.

[0093] In addition, it should be noted that for the implementation of the system, computer device, etc. in the above embodiments, the computer programs involved can all be loaded on a computer-readable storage medium, and the computer-readable storage medium can be a tangible device that can hold and store instructions used by an instruction execution device. The computer-readable storage medium can be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the above. More specific examples (non-exhaustive list) of the computer-readable storage medium include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital versatile disc (DVD), memory stick, floppy disk, mechanical encoding devices, such as punch cards or raised structures in grooves storing instructions thereon, and any suitable combination of the above. The computer-readable storage medium used herein is not construed as an instantaneous signal itself, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagated through a waveguide or other transmission medium (e.g., optical pulses through an optical fiber cable), or electrical signals transmitted through wires.

[0094] In summary, the present application effectively overcomes various drawbacks in the prior art and has high industrial utilization value.

[0095] The above embodiments are only illustrative of the principles and effects of the present application and are not used to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present application should still be covered by the claims of the present application.

Claims

1. A temperature characteristic detection method, characterized in that, it is applied to a temperature characteristic detection device including a light source and a photodetector; the method includes: determining whether the device under test is a light source or a photodetector; controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity; regarding the light source or the photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve; the temperature characteristic detection device further includes: a first temperature control unit connected to the light source, a second temperature control unit connected to the photodetector, and an analog-to-digital conversion unit; the controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity includes: when the light source is the device under test, controlling the photodetector to be at a constant temperature through the second temperature control unit; controlling the temperature of the light source to perform a triangular wave scan through the first temperature control unit, and collecting the detected quantity values according to the analog-to-digital conversion unit; adopting multi-period triangular wave mathematical averaging, linearly fitting between the highest temperature and the lowest temperature, and only using the segment with the best linearity in the middle considering the hysteresis of temperature transfer; fitting between the light source temperature and the detected quantity by the least squares method, and outputting the relationship curve between the output temperature and the detected quantity.

2. The temperature characteristic detection method according to claim 1, characterized in that, the controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity includes: when the photodetector is the device under test, controlling the light source to be at a constant temperature through the first temperature control unit; controlling the temperature of the photodetector to perform a triangular wave scan through the second temperature control unit, and collecting the detected quantity values according to the analog-to-digital conversion unit; adopting multi-period triangular wave mathematical averaging, linearly fitting between the highest temperature and the lowest temperature, and only using the segment with the best linearity in the middle considering the hysteresis of temperature transfer; fitting between the temperature of the photodetector and the detected quantity by the least squares method, and outputting the relationship curve between the output temperature and the detected quantity.

3. A temperature characteristic detection system, characterized in that, using the temperature characteristic detection method according to any one of claims 1 to 2, the system includes: a determination module for determining whether the device under test is a light source or a photodetector; a processing module for controlling the temperatures of the light source and the photodetector to fit a relationship curve between the output temperature and the detected quantity; regarding the light source or the photodetector that does not meet the corresponding temperature characteristic requirements as a non-conforming device according to the relationship curve.

4. A controller, characterized in that, the controller includes: a memory and a processor; the memory is used for storing computer instructions; the processor runs the computer instructions to implement the method according to any one of claims 1 to 2.

5. A computer storage medium, characterized in that, storing a computer program, and when the computer program is run, it executes the method according to any one of claims 1 to 2.

6. A temperature characteristic detection device, characterized in that, The device includes: a light source, a signal amplification circuit, an analog-to-digital conversion unit, a first temperature control unit, a second temperature control unit, and a controller as claimed in claim 4; The light source is used to emit measurement light onto the photodetector; the photodetector is used to convert the optical signal received from the measurement light into an electrical signal; the electrical signal is amplified by the signal amplification circuit and converted by the analog-to-digital conversion unit to obtain a digital signal; The first temperature control unit and the second temperature control unit are used to achieve temperature control according to the target temperature sent by the controller, and obtain the actual temperature and transmit it to the controller; The controller is used to connect to the first temperature control unit through a digital signal, send the target temperature of the light source to it and obtain the current actual temperature; connect to the second temperature control unit through a digital signal, send the target temperature of the photodetector to it and obtain the current actual temperature.

7. The device according to claim 6, wherein, The first temperature control unit includes: a TEC device, a drive circuit, a thermistor, a heat sink, and a heat conduction structure; wherein, One side of the TEC device is connected to the heat sink, and the other side serves as a working surface and is closely connected to the light source through the heat conduction structure; After receiving the target temperature sent by the controller through the digital signal, the drive circuit controls the TEC device to reach the target temperature on its working surface; The thermistor is closely attached to the heat conduction structure, and the temperature detected by it represents the actual temperature of the light source and is transmitted to the controller through a digital quantity.

8. The device according to claim 6, wherein, The second temperature control unit includes: a TEC device, a drive circuit, a thermistor, a heat sink, and a heat conduction structure; wherein, One side of the TEC device is connected to the heat sink, and the other side serves as a working surface and is closely connected to the photodetector through the heat conduction structure; After receiving the target temperature sent by the controller through the digital signal, the drive circuit controls the TEC device to reach the target temperature on its working surface; The thermistor is closely attached to the heat conduction structure, and the temperature detected by it represents the actual temperature of the photodetector and is transmitted to the controller through a digital quantity.

9. The device according to claim 6, wherein, The controller includes any one of a single-chip microcomputer, an ARM, a PLC, and an FPGA.

Images