An optical module

Abstract

The optical module provided by the present application includes: a circuit board; a light receiving component, which is arranged on the circuit board and is used to receive signal light from outside the optical module; the light receiving component includes: a light receiving chip, which is arranged on the circuit board and is electrically connected to the circuit board; a fourth shell, which is arranged on the circuit board and covers the light receiving chip; a reflective prism, which is connected to the inner wall of the fourth shell and includes a reflective surface, and the reflective surface is projected on the circuit board to cover the light receiving chip. In the optical module provided by the present application, the reflective prism is arranged on the fourth shell and covers the top of the light receiving chip through the fourth shell. The reflective prism is driven to move by clamping the fourth shell, which can avoid direct clamping of the reflective prism and causing damage to the reflective prism.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. In addition, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing.

[0003] In order to improve the transmission rate of an optical module, the transmission channels in the optical module can be increased. For example, the traditional optical module including a group of optical transmitting submodules (emitting light of one wavelength) and a group of optical receiving submodules (receiving light of one wavelength) can be improved to include two groups of optical transmitting submodules (each group emitting light of one wavelength) and two groups of optical receiving submodules (each group receiving light of one wavelength). In this way, the volume occupied by the optical transmitting submodule and the optical receiving submodule in the optical module will continue to increase, which is not conducive to the further development of the optical module. Summary of the invention

[0004] An embodiment of the present application provides an optical module to prevent damage to a reflecting prism when the reflecting prism is coupled and installed.

[0005] The present application provides an optical module, comprising:

[0006] Circuit boards;

[0007] A light receiving component, disposed on the circuit board, for receiving signal light from outside the optical module;

[0008] The light receiving component comprises:

[0009] A light receiving chip, arranged on the circuit board and electrically connected to the circuit board;

[0010] A fourth housing is disposed on the circuit board and covers the light receiving chip;

[0011] A reflecting prism is connected and arranged on the inner wall of the fourth shell, and comprises a reflecting surface, and the reflecting surface is projected onto the circuit board to cover the light receiving chip.

[0012] The optical module provided by the present application includes a circuit board and a light receiving component, and the light receiving component includes a light receiving chip, a fourth shell and a reflective prism. The fourth shell is arranged on the circuit board and the cover is arranged on the light receiving chip, and then the reflective prism is arranged on the fourth shell and covers the top of the light receiving chip through the fourth shell. During the assembly process of the optical module, when the reflective prism needs to be moved for coupling and installing the reflective prism, the fourth shell is clamped and moved to move the reflective prism. In this way, by clamping the fourth shell to move the reflective prism to drive the movement of the reflective prism, it is possible to avoid directly clamping the reflective prism and causing damage to the reflective prism. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 It is a schematic diagram of the connection relationship of optical communication terminals;

[0015] Figure 2 is a schematic diagram of the structure of an optical network unit;

[0016] Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0017] Figure 4 A schematic diagram of the decomposed structure of an optical module provided in an embodiment of the present application;

[0018] Figure 5 A schematic diagram of the assembly of an optical transceiver sub-module and a circuit board in an optical module provided in an embodiment of the present application;

[0019] Figure 6 A partial exploded schematic diagram of an optical transceiver sub-module and a circuit board in an optical module provided in an embodiment of the present application;

[0020] Figure 7 For the general Figure 6 Schematic diagram of local decomposition after the perspective is flipped;

[0021] Figure 8 A partial schematic diagram of an optical transceiver submodule in an optical module provided in an embodiment of the present application Figure 1 ;

[0022] Fig. 9 A schematic diagram of the structure of a second housing in an optical module provided in an embodiment of the present application;

[0023] Fig.10A schematic diagram of the structure of a second housing in an optical module provided in an embodiment of the present application from another angle;

[0024] Fig.11 A schematic cross-sectional view of the assembly of a first optical fiber adapter and a second housing in an optical module provided in an embodiment of the present application;

[0025] Fig.12 A schematic cross-sectional view of the assembly of a second optical fiber adapter and a second housing in an optical module provided in an embodiment of the present application;

[0026] Fig.13 A partially exploded schematic diagram of a first housing and a circuit board in an optical module provided in an embodiment of the present application;

[0027] Fig.14 A schematic diagram of the distribution of optical components in a first housing of an optical module provided in an embodiment of the present application;

[0028] Fig.15 A schematic diagram of an emission light path in an optical module provided in an embodiment of the present application;

[0029] Fig.16 A schematic diagram of the structure of a protective cover in an optical module provided in an embodiment of the present application;

[0030] Fig.17 A schematic diagram of the structure of a protective cover in an optical module provided in an embodiment of the present application from another angle;

[0031] Fig.18 A partially exploded schematic diagram of a circuit board and a light receiving component in an optical module provided in an embodiment of the present application;

[0032] Fig.19 A partial enlarged view of a light receiving component in an optical module provided in an embodiment of the present application;

[0033] Fig. 20 A schematic diagram of a receiving optical path in an optical module provided in an embodiment of the present application;

[0034] Fig.21 A schematic diagram of a receiving light path in an optical module provided in an embodiment of the present application from another angle;

[0035] Fig. 22 A schematic diagram of the structure of a first housing in an optical module provided in an embodiment of the present application;

[0036] Fig.23 A schematic diagram of the assembly and decomposition of a first housing and a circuit board in an optical module provided in an embodiment of the present application;

[0037] Fig.24A schematic diagram of another angle of assembly of a first housing and a circuit board in an optical module provided in an embodiment of the present application;

[0038] Fig.25 An assembly cross-sectional view of a first housing and a third housing in an optical module provided in an embodiment of the present application;

[0039] Fig.26 A schematic diagram of a structure in which a local light receiving component in an optical module provided in an embodiment of the present application is assembled on a circuit board;

[0040] Fig. 27 A schematic diagram of the structure of the fourth housing in an optical module provided in an embodiment of the present application Figure 1 ;

[0041] Fig.28 A schematic diagram of the structure of the fourth housing in an optical module provided in an embodiment of the present application Figure 2 ;

[0042] Fig.29 This is an exploded view of a fourth shell, a lens array, and a reflective prism in an optical module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0044] One of the core links of fiber-optic communication is the conversion between optical and electrical signals. Fiber-optic communication uses optical signals carrying information to transmit in optical fiber / optical waveguide and other information transmission equipment. The passive transmission characteristics of light in optical fiber / optical waveguide can achieve low-cost and low-loss information transmission; while information processing equipment such as computers use electrical signals. In order to establish an information connection between information transmission equipment such as optical fiber / optical waveguide and information processing equipment such as computers, it is necessary to achieve the conversion between electrical and optical signals.

[0045] Optical modules realize the above-mentioned mutual conversion function of optical and electrical signals in the field of optical fiber communication technology. The mutual conversion of optical signals and electrical signals is the core function of optical modules. Optical modules realize electrical connection with external host computers through the gold fingers on their internal circuit boards. The main electrical connections include power supply, I2C signals, data signals and grounding. The electrical connection method realized by gold fingers has become the mainstream connection method in the optical module industry. Based on this, the definition of the pins on the gold fingers has formed a variety of industry protocols / specifications.

[0046] Figure 1 Figure 1 is a schematic diagram of the connection relationship of optical communication terminals. Figure 1 As shown, the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

[0047] One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0048] The optical port of the optical module 200 is connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is connected to the optical network terminal 100 to establish a bidirectional electrical signal connection with the optical network terminal 100; the mutual conversion between the optical signal and the electrical signal is realized inside the optical module, so as to establish an information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.

[0049] The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a bidirectional electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used to access the network cable 103 and establish a bidirectional electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network terminal 100. Specifically, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module. The optical network terminal acts as a host computer of the optical module to monitor the operation of the optical module.

[0050] At this point, the remote server establishes a two-way signal transmission channel with the local information processing device through optical fiber, optical module, optical network terminal and network cable.

[0051] Common information processing equipment includes routers, switches, and electronic computers. The optical network terminal is the host computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module. Other common optical module host computers include optical line terminals.

[0052] Figure 2 Figure 1 is a schematic diagram of the optical network terminal structure. Figure 2 As shown, the optical network terminal 100 has a circuit board 105, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged inside the cage 106 for connecting to the electrical port of the optical module such as the gold finger; a heat sink 107 is arranged on the cage 106, and the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0053] The optical module 200 is inserted into the optical network terminal. Specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .

[0054] The cage 106 is located on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the optical module is inserted into the cage, and the cage fixes the optical module, and the heat generated by the optical module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

[0055] Figure 3 A schematic diagram of an optical module structure provided in an embodiment of the present application is provided. Figure 4 A schematic diagram of the optical module decomposition structure is provided for the embodiment of the present application. Figure 3 , Figure 4 As shown, the optical module 200 provided in the embodiment of the present application includes an upper housing 201 , a lower housing 202 , an unlocking component 203 , a circuit board 300 , an optical transceiver sub-module 400 , a first optical fiber adapter 500 and a second optical fiber adapter 600 .

[0056] The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body. Specifically, the lower shell includes a main board and two side panels located on both sides of the main board and perpendicular to the main board; the upper shell includes a third shell, and the third shell is covered on the two side panels of the upper shell to form a wrapping cavity; the upper shell may also include two side walls located on both sides of the third shell and perpendicular to the third shell, and the two side walls are combined with the two side panels to realize the upper shell covering the lower shell.

[0057] The two openings can be two end openings (204, 205) in the same direction, or two openings in different directions; one of the openings is an electrical port 204, and the gold finger of the circuit board extends from the electrical port 204 and is inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect the optical transceiver submodule 400 inside the optical module; the optoelectronic devices such as the circuit board 300 and the optical transceiver submodule 400 are located in the encapsulated cavity.

[0058] The upper shell and the lower shell are combined to facilitate installation of components such as the circuit board 300 and the optical transceiver submodule 400 into the shell. The upper shell and the lower shell form the outermost packaging protection shell of the optical module. The upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation. The shell of the optical module is generally not made into an integrated component. In this way, when assembling components such as circuit boards, positioning components, heat dissipation and electromagnetic shielding components cannot be installed, which is not conducive to production automation.

[0059] The unlocking component 203 is located on the outer wall of the cavity / lower shell 202 and is used to achieve a fixed connection between the optical module and the host computer, or to release the fixed connection between the optical module and the host computer.

[0060] The unlocking component 203 has a locking component that matches the cage of the host computer; pulling the end of the unlocking component can make the unlocking component move relatively on the surface of the outer wall; the optical module is inserted into the cage of the host computer, and the locking component of the unlocking component fixes the optical module in the cage of the host computer; by pulling the unlocking component, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module and the host computer, so that the optical module can be pulled out of the cage of the host computer.

[0061] The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.

[0062] The circuit board connects the electrical components in the optical module according to the circuit design through circuit routing to achieve electrical functions such as power supply, electrical signal transmission and grounding.

[0063] The chip on the circuit board 300 can be a multi-functional integrated chip, such as integrating the laser driver chip and the MCU chip into one chip, or integrating the laser driver chip, the limiting amplifier chip and the MCU into one chip. The chip is an integration of circuits, but the functions of each circuit do not disappear due to the integration, but the circuit presentation form changes, and the chip still has the circuit form. Therefore, when three independent chips, MCU, laser driver chip and limiting amplifier chip, are set on the circuit board, this is equivalent to setting a single chip with three functions in one on the circuit board 300.

[0064] Circuit boards are generally rigid circuit boards. Rigid circuit boards can also perform load-bearing functions due to their relatively hard material. For example, rigid circuit boards can stably carry chips. When optical transceivers are located on the circuit boards, rigid circuit boards can also provide stable load-bearing. Rigid circuit boards can also be inserted into electrical connectors in the cage of the host computer. Specifically, metal pins / gold fingers are formed on the end surface of one side of the rigid circuit board for connecting to the electrical connector. These are not easy to achieve with flexible circuit boards.

[0065] Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards. For example, flexible circuit boards can be used to connect rigid circuit boards to optical transceiver devices.

[0066] Figure 5FIG. 1 is a schematic diagram of assembling an optical transceiver submodule 400 and a circuit board 300 in an optical module provided in an embodiment of the present application. Figure 5 As shown, the optical module provided in the embodiment of the present application integrates the optical transmitting component and the optical receiving component into an optical transceiver submodule 400, and the optical transceiver submodule 400 is located at the edge of the circuit board 300. The optical transceiver submodule 400 includes a first shell 410, a second shell 420 and a third shell 430. The upper end of the first shell 410 is open, the lower end of the second shell 420 is open, and the lower end of the third shell 430 is open. The second shell 420 and the third shell 430 are both covered above the first shell 410, so that the first shell 410, the second shell 420 and the third shell 430 form a housing cavity, and the optical transmitting component and the optical receiving component are both arranged in the housing cavity. An opening is provided on one side of the housing cavity, and the circuit board 300 is inserted into the housing cavity through the opening to facilitate the electrical connection between the optical transmitting component, the optical receiving component and the circuit board 300.

[0067] Figure 5 The left-right direction and the front-back direction of the optical module are agreed upon, such as Figure 5 In the embodiment of the present application, a first optical fiber adapter 500 and a second optical fiber adapter 600 are disposed on a side of the optical transceiver submodule 400 away from the circuit board 300. The first optical fiber adapter 500 and the second optical fiber adapter 600 are disposed side by side, that is, the first optical fiber adapter 500 and the second optical fiber adapter 600 are located at the same height, side by side ( Figure 5 The first optical fiber adapter 500 and the second optical fiber adapter 600 are arranged side by side in the front and rear direction as shown in the figure, and are arranged on the end face of the housing of the optical transceiver submodule 400, and the first optical fiber adapter 500 and the second optical fiber adapter 600 are both inserted into the accommodating cavity. The first optical fiber adapter 500 and the second optical fiber adapter 600 are respectively used to connect with the optical fiber connector outside the optical module, and the optical fiber connector outside the optical module is a standard part commonly used in the industry. The shape and size of the external optical fiber connector limit the positions of the two optical fiber adapters inside the optical module, so the first optical fiber adapter 500 and the second optical fiber adapter 600 are arranged at the same height in the product.

[0068] After the first optical fiber adapter 500 is inserted into the accommodating cavity, it corresponds to the optical transmitting assembly in the accommodating cavity, and is used to transmit the signal light generated by the optical transmitting assembly to the external optical fiber to achieve light transmission. After the second optical fiber adapter 600 is inserted into the accommodating cavity, it corresponds to the optical receiving assembly in the accommodating cavity, and is used to transmit the signal light transmitted by the external optical fiber to the optical receiving assembly to achieve light reception.

[0069] In the embodiment of the present application, each optical device of the light emitting assembly needs to ensure high precision of the optical path, while the surface precision of the circuit board is not very high. If the optical devices of the light emitting assembly are arranged on the circuit board 300, it may cause low optical path alignment precision between the optical devices of the light emitting assembly. To avoid this situation, some optical devices of the light emitting assembly are supported by metal plates and are arranged separately from the circuit board 300, and electrical connection is achieved by wiring.

[0070] Figure 6 This is a partial exploded schematic diagram of an optical transceiver sub-module 400 and a circuit board 300 in an optical module provided in an embodiment of the present application. Figure 7 For the general Figure 6 Schematic diagram of local decomposition after the perspective is flipped. Figure 6 , Figure 7 As shown, in the optical module provided by the embodiment of the present application, the optical emission component includes a laser driver chip, a laser chip, a lens and other devices related to optical emission. One end of the accommodating cavity is connected to the first optical fiber adapter 500. The laser driver chip drives the laser chip to work. The light beam generated by the laser chip is coupled to the first optical fiber adapter 500 via a lens and other devices, and the light beam is transmitted through the first optical fiber adapter 500. The optical receiving component includes a lens, an optical receiving chip, a transimpedance amplifier and other devices related to optical reception. One end of the accommodating cavity is connected to the second optical fiber adapter 600, and the signal light from the outside of the optical module is received through the second optical fiber adapter 600, and the received signal light is transmitted to the optical receiving chip through optical devices such as a lens arranged in the accommodating cavity, and the optical receiving chip realizes photoelectric conversion.

[0071] In the embodiment of the present application, in order to improve the transmission rate of the optical module, the transmission channel in the optical module is increased, that is, the optical module includes multiple laser chips (each laser chip emits light of one wavelength) and multiple light receiving chips (each receives light of one wavelength). Specifically, in the optical module provided in the embodiment of the present application, multiple laser chips are arranged in the accommodating cavity to emit multiple light beams, and the multiple light beams are multiplexed into one light beam, which are finally converged and coupled to the first optical fiber adapter 500 to realize that the multiple light beams are emitted through one optical fiber. Multiple light receiving chips are arranged in the accommodating cavity, and one light beam transmitted by the second optical fiber adapter 600 is demultiplexed into multiple light beams, and the multiple light beams are respectively transmitted to multiple light receiving chips to realize that one optical fiber receives multiple light beams.

[0072] The optical emission component includes a plurality of laser chips 450, a plurality of collimating lenses 470, an optical multiplexer 4205 and a first displacement prism 4204. The plurality of laser chips 450 are used to emit multiple light beams of different wavelengths. In the embodiment of the present application, the optical emission component includes four laser chips 450, each laser chip 450 emits one light beam, each collimating lens 470 is arranged in the direction of the light output of each laser chip 450, and is used to convert the light beam output from the laser chip 450 into a collimated light beam; the optical multiplexer 4205 is arranged in the direction of the light output of the collimating lens 470, and is used to multiplex multiple light beams of different wavelengths into one composite light beam; the first displacement prism 4204 is arranged in the light output direction of the optical multiplexer 4205, and is used to couple one composite light beam output from the optical multiplexer 4205 into the first optical fiber adapter 500 after refraction and reflection, so as to realize light emission.

[0073] In the embodiment of the present application, multiple laser chips 450 and multiple collimating lenses 470 are all arranged in the cavity of the first shell 410, and the optical multiplexer 4205 and the first displacement prism 4204 are all arranged in the cavity of the second shell 420, and are installed according to the light path emission direction. When the second shell 420 is covered on the first shell 410, the laser chip 450, the collimating lens 470, the optical multiplexer 4205, the first displacement prism 4204 and the first optical fiber adapter 500 are arranged in sequence along the light emission direction.

[0074] The optical receiving component includes a second displacement prism 4206, an optical demultiplexer 4207, and multiple optical receiving chips. The second displacement prism 4206 is used to transmit a light beam transmitted by the second optical fiber adapter 600 to the optical demultiplexer 4207; the optical demultiplexer 4207 is used to demultiplex one light beam into multiple light beams; and the multiple optical receiving chips are used to respectively receive the multiple light beams to realize light reception.

[0075] In the embodiment of the present application, the second displacement prism 4206 and the optical demultiplexer 4207 are both arranged in the cavity of the second shell 420, and the optical receiving chip is arranged on the circuit board 300 inserted into the accommodating cavity. When the second shell 420 and the third shell 430 are covered on the first shell 410, the second displacement prism 4206, the optical demultiplexer 4207 and the optical receiving chip are arranged sequentially along the light receiving direction.

[0076] Figure 8 FIG. 4 is a schematic diagram of the assembly of the first housing 410, the laser chip 450 and the circuit board 300 in the optical module provided in the embodiment of the present application. Figure 8As shown, the first shell 410 includes a first base plate 4110, a first side plate 4120 and a second side plate 4130, the bottom surface of the first base plate 4110 is connected to the lower shell 202, the bottom surface of the first side plate 4120 is connected to the first base plate 4110, the bottom surface of the second side plate 4130 is connected to the first base plate 4110, and the first side plate 4120 and the second side plate 4130 are arranged opposite to each other, so that the first shell 410 is a shell with openings on the left side, right side and top side formed by the first base plate 4110, the first side plate 4120 and the second side plate 4130, and multiple laser chips 450 and multiple collimating lenses 470 are all carried by the first base plate 4110. The left opening of the first shell 410 faces the first fiber optic adapter 500 and the second fiber optic adapter 600; the right opening of the first shell 410 faces the circuit board 300, and the circuit board 300 is inserted into the first shell 410 through the right opening; the upper opening of the first shell 410 faces the upper shell 201, and the second shell 420 and the third shell 430 are covered at the upper opening, so that the first shell 410, the second shell 420 and the third shell 430 form a accommodating cavity.

[0077] Fig. 9 FIG. 4 is a schematic diagram of the partial assembly of the first housing 410 and the laser chip 450 in the optical module of the present application embodiment. Fig. 9 As shown, the laser chip 450 is arranged near the right opening of the first bottom plate 4110 and is electrically connected to the circuit board 300. The circuit board 300 supplies power to the laser chip 450 to drive the laser chip 450 to generate a laser beam. In order to facilitate the fixing of the laser chip 450 on the first bottom plate 4110 of the first housing 410, a semiconductor refrigerator 490 is arranged near the right opening of the first bottom plate 4110. The bottom surface of the semiconductor refrigerator 490 is pasted on the first bottom plate 4110. A substrate 4901 is arranged on the top surface of the semiconductor refrigerator 490 away from the lower housing 202. The laser chip 450 is pasted on the substrate 4901. In this way, the heat generated by the operation of the laser chip 450 can be transferred to the semiconductor refrigerator 490 through the substrate 4901. Heat exchange is performed through the semiconductor refrigerator 490 to reduce the operating temperature of the laser chip 450 and ensure the life of the laser chip 450. In the embodiment of the present application, the substrate 4901 is generally a plate made of aluminum nitride or silicon.

[0078] The laser beam generated by the laser chip 450 is transmitted in the left-right direction. The laser beam generated by the laser chip 450 is a divergent beam. Therefore, a first converging lens 460 is provided in the light emission direction of the laser chip 450. The first converging lens 460 is attached to the semiconductor refrigerator 490. The first converging lens 460 is used to convert the divergent beam generated by the laser chip 450 into a parallel beam. In the embodiment of the present application, the light emission component includes 4 laser chips 450 and 4 first converging lenses 460. The 4 laser chips 450 are arranged side by side on the semiconductor refrigerator 490. Each first converging lens 460 is arranged in the emission direction of each laser chip 450, and is used to convert the divergent beam generated by each laser chip 450 into a parallel beam.

[0079] A plurality of collimating lenses 470 are also disposed on the first bottom plate 4110, each collimating lens 470 is disposed in the emission direction of each laser chip 450, and the laser chip 450, the first converging lens 460 and the collimating lens 470 are sequentially disposed along the light emission direction. Since the outer surface of the collimating lens 470 is a curved surface, in order to fix the collimating lens 470 on the first bottom plate 4110, a plurality of glass blocks 480 are disposed on the first bottom plate 4110, the bottom surface of each glass block 480 is adhered to the first bottom plate 4110, and the right side surface of each collimating lens 470 is adhered to the left side surface of each glass block 480, so that the collimating lens 470 is fixed to the first bottom plate 4110 through the glass block 480.

[0080] In the embodiment of the present application, the glass block 480 is not only used to fix the collimating lens 470, but the laser beam generated by the laser chip 450 is converted into a parallel beam via the first converging lens 460, and the parallel beam is emitted into the collimating lens 470 via the glass block 480. The glass block 480 will not perform displacement conversion on the parallel beam, and the beam will be directly transmitted out of the glass block 480.

[0081] Fig.10 FIG. 4 is a schematic diagram of a partial structure of an optical transceiver submodule 400 in an optical module provided in an embodiment of the present application. Fig.10As shown, the second housing 420 of the optical module provided in the embodiment of the present application is provided with a first cavity 4201 and a second cavity 4202, the first cavity 4201 and the second cavity 4202 are arranged side by side front and back, and a partition 4203 is provided between the first cavity 4201 and the second cavity 4202; the first displacement prism 4204 and the optical multiplexer 4205 of the optical transmitting assembly are both located in the first cavity 4201, the first optical fiber adapter 500 is inserted into the first cavity 4201 of the second housing 420, and the optical multiplexer 4205 is pasted on The first displacement prism 4204 is located between the first optical fiber adapter 500 and the optical multiplexer 4205. The first displacement prism 4204 is attached to the bottom surface of the first cavity 4201, and the light input surface of the first displacement prism 4204 is attached to the light output surface of the optical multiplexer 4205, so that one composite light beam output by the optical multiplexer 4205 is input into the first displacement prism 4204, and the composite light beam is coupled to the first optical fiber adapter 500 through reflection and refraction of the first displacement prism 4204.

[0082] The second displacement prism 4206 and the optical demultiplexer 4207 of the optical receiving assembly are both located in the second cavity 4202, the second optical fiber adapter 600 is inserted into the second cavity 4202 of the second housing 420, and the optical demultiplexer 4207 is pasted on the bottom surface of the second cavity 4202; the second displacement prism 4206 is located between the second optical fiber adapter 600 and the optical demultiplexer 4207, and the second displacement prism 4206 is pasted on the bottom surface of the second cavity 4202, so that one composite light beam transmitted by the second optical fiber adapter 600 is coupled to the optical demultiplexer 4207 through reflection and refraction of the second displacement prism 4206, and one composite light beam is demultiplexed into multiple light beams of different wavelengths through the optical demultiplexer 4207.

[0083] Fig.11 Schematic diagram of the structure of the second housing 420 in the optical module provided in the embodiment of the present application. Fig.11The second shell 420 includes a second bottom plate 4210, a third side plate 4220 and a fourth side plate 4230. The second bottom plate 4210 is connected to the upper shell 201. The third side plate 4220 faces the first optical fiber adapter 500 and the second optical fiber adapter 600. The top surface of the third side plate 4220 is fixedly connected to the second bottom plate 4210, and the third side plate 4220 is provided with a first through hole 4208 and a second through hole 4209. The first optical fiber adapter 500 is fixed to the third side plate 4220 through the first through hole 4208, and the second optical fiber adapter 600 is fixed to the third side plate 4220 through the second through hole 4209; the top surface of the fourth side plate 4230 is fixedly connected to the second bottom plate 4210, and the left side surface of the fourth side plate 4230 (the side surface facing the optical fiber adapter) is fixedly connected to the right side surface of the third side plate 4220. Therefore, the second shell 420 is a shell with openings on the right side, the front side, and the lower side formed by the second bottom plate 4210 , the third side plate 4220 , and the fourth side plate 4230 .

[0084] A first cavity 4201 is formed between the front opening end surface of the second housing 420 and the partition 4203. A first protrusion 4211 is provided at a position of the second bottom plate 4210 near the first through hole 4208. The right side of the first protrusion 4211 is a plane. The bottom surface of the optical multiplexer 4205 is attached to the second bottom plate 4210, the rear side surface is attached to a side surface of the partition 4203, and the left side surface is attached to the right side surface of the first protrusion 4211, so that the optical multiplexer 4205 is fixed to the second bottom plate 4210. A light outlet is provided on the left side of the optical multiplexer 4205. The right side of the first displacement prism 4204 is attached to the left side of the optical multiplexer 4205 and corresponds to the light outlet to receive a composite light beam output by the optical multiplexer 4205. The left side surface (light emitting surface) of the first displacement prism 4204 corresponds to the first through hole 4208 . The composite light beam is refracted and reflected by the first displacement prism 4204 and then enters the first optical fiber adapter 500 in the first through hole 4208 .

[0085] A second cavity 4202 is formed between the other side of the partition 4203 and the side of the fourth side plate 4230. The bottom surface of the optical demultiplexer 4207 is adhered to the second bottom plate 4210, the rear side is adhered to the side of the fourth side plate 4230, and the front side is adhered to the side of the partition 4203, thereby fixing the optical demultiplexer 4207 on the second bottom plate 4210. A second protrusion 4212 is provided on the second bottom plate 4210 near the second through hole 4209, and the rear side surface of the second protrusion 4212 is a plane. The bottom surface of the second displacement prism 4206 is attached to the second bottom plate 4210, the front side surface is attached to the rear side surface of the second protrusion 4212, the left side surface (light incident surface) corresponds to the second through hole 4209, and the right side surface (light emitting surface) corresponds to the light entrance of the optical demultiplexer 4207. A signal light transmitted by the second optical fiber adapter 600 is refracted and reflected by the second displacement prism 4206 and then incident into the optical demultiplexer 4207, and the signal light is demultiplexed into multiple light beams of different wavelengths by the optical demultiplexer 4207.

[0086] Fig.12 FIG. 4 is a schematic diagram of another angle structure of the second housing 420 in the optical module provided in the embodiment of the present application. Fig.12 As shown, the top surface of the first cavity 4201 in the second shell 420 may be at a different height from the top surface of the second cavity 4202, such as the second cavity 4202 is recessed in the first cavity 4201, and the second shell 420 is covered above the first shell 410, and the second bottom plate 4210 of the second shell 420 faces the upper shell 201, so that the optical demultiplexer 4207 in the second cavity 4202 is higher than the optical multiplexer 4205 in the first cavity 4201, which can facilitate the transmission of the multiple light beams output by the optical demultiplexer 4207 to the light receiving chip, and prevent the light emitting light beam from causing crosstalk to the light receiving light beam.

[0087] In addition, the optical receiving chip receives the light beam through the top light incident surface, so there is a height difference between the light beam output by the optical demultiplexer 4207 and the optical path of the light beam received by the optical receiving chip; while the laser chip emits the light beam through the side light emitting surface, so the light beam output by the laser chip and the optical path of the light beam received by the optical multiplexer 4205 are at the same height. Therefore, in order to achieve the emission and reception of light, the top surface of the second cavity 4202 fixing the optical demultiplexer 4207 is recessed in the top surface of the first cavity 4201 fixing the optical multiplexer 4205.

[0088] In the embodiment of the present application, the first displacement prism 4204 and the optical multiplexer 4205 of the optical transmitting component and the second displacement prism 4206 and the optical demultiplexer 4207 of the optical receiving component are all placed on the second shell 420, and then the second shell 420 fixed with the first displacement prism 4204, the optical multiplexer 4205, the second displacement prism 4206 and the optical demultiplexer 4207 is installed on the first shell 410, so that the optical transceiver sub-module 400 can be installed from multiple angles, so that the operating space is large, which is conducive to improving the assembly efficiency of the optical transceiver sub-module 400.

[0089] Fig.13 Schematic cross-sectional view of the first optical fiber adapter 500 and the second housing 420 in the optical module provided in the embodiment of the present application. Fig.13 As shown, when a composite light beam is incident on the first optical fiber adapter 500 via the first displacement prism 4204, the light beam is easily reflected on the end face of the optical fiber ferrule of the first optical fiber adapter 500. The reflected light beam is incident on the optical multiplexer 4205 via the first displacement prism 4204, which is easy to interfere with the emission light beam. Therefore, an isolator 510 is embedded in the first through hole 4208. The isolator 510 is located between the first displacement prism 4204 and the end face of the optical fiber ferrule, and can be used to eliminate the light beam reflected by the end face of the optical fiber ferrule, so as to prevent the reflected light beam from causing crosstalk to the emission light beam.

[0090] In order to facilitate coupling the composite light beam output by the first displacement prism 4204 into the first optical fiber adapter 500, a second converging lens 520 is also embedded in the first through hole 4208. The second converging lens 520 is arranged between the isolator 510 and the end face of the optical fiber ferrule, and is used to couple the composite light beam passing through the isolator 510 to the end face of the optical fiber ferrule of the first optical fiber adapter 500, so as to realize light emission through the first optical fiber adapter 500.

[0091] Fig.14 Schematic cross-sectional view of the second optical fiber adapter 600 and the second housing 420 in the optical module provided in the embodiment of the present application. Fig.14 As shown, when the signal light transmitted by the second optical fiber adapter 600 is incident on the optical demultiplexer 4207, the signal light transmitted by the second optical fiber adapter 600 is a divergent light beam. In order to facilitate the emission light beam to be incident on the optical demultiplexer 4207 via the second displacement prism 4206, a second lens 610 is embedded in the second through hole 4209. The second lens 610 is located between the second displacement prism 4206 and the end face of the optical fiber ferrule of the second optical fiber adapter 600, and is used to convert the light beam transmitted in the second optical fiber adapter 600 into parallel light. The parallel light is refracted and reflected by the second displacement prism 4206 and then incident on the optical demultiplexer 4207. The optical demultiplexer 4207 demultiplexes one parallel light beam into multiple light beams with different wavelengths.

[0092] Fig.15 This is a schematic diagram of the light emission path in the optical module provided in the embodiment of the present application. Fig.15 As shown, the laser chip 450, the first converging lens 460, the glass block 480, the collimating lens 470, the optical multiplexer 4205, the first displacement prism 4204, the isolator 510 and the first optical fiber adapter 500 are sequentially arranged along the light emission direction. The laser beam generated by the laser chip 450 is converted into a parallel beam by the first converging lens 460. The parallel beam passes through the glass block 480 and then enters the collimating lens 470. The collimated beam is converted into a collimated beam by the collimating lens 470. The collimated beam enters the light input port of the optical multiplexer 4205. The optical multiplexer 4205 multiplexes the multiple collimated beams into one composite beam. The composite beam enters the first displacement prism 4204 through the light output port of the optical multiplexer 4205. After being refracted and reflected by the first displacement prism 4204, it passes through the isolator 510. The composite beam passing through the isolator 510 is coupled to the first optical fiber adapter 500 via the second converging lens 520 to realize light emission.

[0093] In the embodiment of the present application, the optical emission assembly includes 4 laser chips 450, 4 first converging lenses 460, 4 glass blocks 480 and 4 collimating lenses 470. Each collimating lens 470 is fixed on each glass block 480. Each glass block 480 corresponds to each first converging lens 460, and each first converging lens 460 corresponds to each laser chip 450. The right side of the optical multiplexer 4205 is provided with 4 light inlets. The 4 collimated light beams output by the 4 collimating lenses 470 are injected into the 4 light inlets one by one, so as to inject the 4 collimated light beams into the optical multiplexer 4205. The left side of the optical multiplexer 4205 is provided with a light outlet. The 4 collimated light beams are synthesized into a composite light beam after being reflected in the optical multiplexer 4205. The composite light beam is emitted through the light outlet to enter the first displacement prism 4204.

[0094] The laser driver chip 310 is provided on the surface of the circuit board 300 inserted into the first housing 410. After the laser chip 450 is pasted on the substrate 4901, it needs to be electrically connected to the laser driver chip 310 through wire bonding (gold wire), so that the laser driver chip 310 drives the laser chip 450 to generate a laser beam. Specifically, the laser driver chip 310 is electrically connected to the circuit board 300 through wire bonding (gold wire), the circuit board 300 is electrically connected to the substrate 4901 through wire bonding (gold wire), and the substrate 4901 is electrically connected to the laser chip 450 through wire bonding (gold wire), so that the laser driver chip 310 is electrically connected to the laser chip 450 via wire bonding, the circuit board 30, the wire bonding, the substrate 4901, and the wire bonding.

[0095] After the laser driver chip 310 and the laser chip 450 are electrically connected by wire bonding, the wire bonding may be touched when installing other components of the optical module, causing damage to the wire bonding. In the embodiment of the present application, in order to prevent damage to the wire bonding on the circuit board 300, the laser chip 450, and the substrate 4901, a protective cover 440 is provided above the laser chip 450, the substrate 4901, and the circuit board 300, and the wire bonding is isolated from external components by the protective cover 440 to prevent damage to the wire bonding caused by external components.

[0096] Fig.16 This is a schematic diagram of the structure of the protective cover 440 in the optical module provided in the embodiment of the present application. Fig.17 This is a schematic diagram of the structure of the protective cover 440 in the optical module provided in the embodiment of the present application from another angle. Fig.16 , Fig.17 As shown, the protective cover 440 includes a top plate 4401, a first support plate 4402 and a second support plate 4403, wherein the first support plate 4402 is connected to the rear side of the top plate 4401, and the second support plate 4403 is connected to the front side of the top plate 4401. Thus, the protective cover 440 is a U-shaped cover body composed of the top plate 4401, the first support plate 4402 and the second support plate 4403, so as to cover the laser chip 450, the substrate 4901 and the laser driver chip 310 under the U-shaped cover body.

[0097] In the embodiment of the present application, the length dimension of the first support plate 4402 and the second support plate 4403 is smaller than the length dimension of the top plate 4401, that is, the first support plate 4402 and the second support plate 4403 are connected to the right side portion of the top plate 4401, and the bottom surfaces of the first support plate 4402 and the second support plate 4403 are both adhered to the surface of the circuit board 300, and the left side of the top plate 4401 is fixed to the glass block 480, thereby fixing the protective cover 440 above the circuit board 300 and the first shell 410.

[0098] In order to further support the top plate 4401, the protective cover 440 also includes a plurality of support columns 4405, one end of the support column 4405 is connected to the inner side surface of the top plate 4401, and the other end is adhered to the surface of the circuit board 300, and the support column 4405 is placed in the middle position of the top plate 4401, which can support the middle part of the top plate 4401 and prevent the left end of the top plate 4401 from touching the gold wire or other optical devices.

[0099] In the embodiment of the present application, a notch 4404 is provided on the rear side of the top plate 4401, the notch 4404 extends along the length direction (left-right direction) of the top plate 4401, and the size of the notch 4404 in the left-right direction is smaller than the size of the top plate 4401 in the left-right direction; the notch 4404 extends along the width direction (front-back direction) of the top plate 4401, and the size of the notch 4404 in the front-back direction is smaller than the size of the top plate 4401 in the front-back direction. The notch 4404 faces the light receiving assembly, and is used to avoid the area where the light receiving chip of the light receiving assembly is located.

[0100] The left side of the first support plate 4402 is flush with the right side of the notch 4404 , the right side of the second support plate 4403 is flush with the right side of the top plate 4401 , and the left-right dimension of the second support plate 4403 is the same as that of the first support plate 4402 .

[0101] The top plate 4401 is covered above the laser chip 450, the first converging lens 460, the substrate 4901, and the laser driver chip 310 on the circuit board 300 through the first support plate 4402, the second support plate 4403 and the support column 4405, and is used to protect the gold wires from the laser driver chip 310 to the circuit board 300, the gold wires from the circuit board 300 to the substrate 4901, and the gold wires from the laser chip 450 to the substrate 4901, while protecting fragile devices such as the laser driver chip 310, the laser chip 450 and the first converging lens 460.

[0102] In the embodiment of the present application, the top plate 4401 of the protective cover 440 can be a plastic plate or a metal plate, but generally needs to prevent contact with the circuit on the circuit board 300. The top plate 4401 is made of transparent plastic material, which can also facilitate observation of whether the gold wires and vulnerable components under the protective cover 440 are damaged.

[0103] Fig.18 This is a partial exploded schematic diagram of the circuit board 300 and the light receiving component in the optical module provided in the embodiment of the present application. Fig.18 As shown, a plurality of light receiving chips 740 are arranged along the light receiving direction on the circuit board 300, and the light receiving chip 740 is a PD (photodetector), such as an APD (avalanche diode) or a PIN-PD (photodiode), which is used to convert the received signal light into a photocurrent. Optionally, the plurality of light receiving chips 740 in the light receiving assembly are respectively arranged on the circuit board 300.

[0104] Furthermore, the optical receiving component further includes a transimpedance amplifier 750, which is mounted on the circuit board 300, and the plurality of optical receiving chips 740 are all connected to the transimpedance amplifier 750, for receiving the current signal generated by the optical receiving chip 740 and converting the received current signal into a voltage signal. Optionally, the transimpedance amplifier 750 is wired to the optical receiving chip 740, such as by a semiconductor bonding wire.

[0105] In an embodiment of the present application, four light receiving chips 740 are arranged on the circuit board 300, and the four light receiving chips 740 are connected to the transimpedance amplifier 750 through bonding. However, when the bonding length is longer, the inductance generated by the bonding is greater, and the signal mismatch will also be greater, and the signal output by the light receiving chip 740 is a small signal, which will cause the signal quality to deteriorate. Therefore, the light receiving chip 740 and the transimpedance amplifier 750 are as close as possible to reduce the bonding length and ensure the signal transmission quality, and then the transimpedance amplifier 750 is arranged on one side of the light receiving chip 740, so that the transimpedance amplifier 750 and the light receiving chip 740 are as close as possible. Optionally, the electrodes of the light receiving chip 740 and the pins on the transimpedance amplifier 750 are on the same plane to ensure that the bonding wire between the light receiving chip 740 and the transimpedance amplifier 750 is the shortest.

[0106] The optical axis of the multiple signal lights output by the optical demultiplexer 4207 of the optical receiving component is parallel to the surface of the circuit board 300, and the photosensitive surfaces of the multiple optical receiving chips 740 are also parallel to the surface of the circuit board 300. However, the optical axis of the multiple signal lights output by the optical demultiplexer 4207 is higher than the photosensitive surface of the optical receiving chip 740. Therefore, in order to ensure that the optical receiving chip 740 normally receives the signal light, the optical receiving component also includes a reflecting prism 720. The reflecting prism 720 is arranged above the optical receiving chip 740 to cover the four optical receiving chips 740. The reflecting surface of the reflecting prism 720 changes the direction of the optical axis of the received light beam, so that the optical axis of the received light beam is converted from being parallel to the surface of the circuit board 300 to being perpendicular to the surface of the circuit board 300, thereby making the received light beam perpendicular to the photosensitive surface of the corresponding optical receiving chip 740.

[0107] In the embodiment of the present application, the reflective prism 720 is a prism including a reflective surface, which covers the light receiving chip 740 provided on the circuit board 300, and is used to change the transmission direction of the received light beam, that is, to reflect the received light beam toward the light receiving chip 740. Optionally, the reflective surface of the reflective prism 720 is a 40-45° reflective surface; taking a 45° reflective prism as an example, the reflective prism 720 includes a 45° reflective surface, and the 45° reflective surface covers the four light receiving chips 740 provided on the circuit board 300.

[0108] In order to converge the four receiving light beams onto the reflecting prism 720, the optical receiving assembly further includes a lens array 710, which is disposed on one side of the light incident surface of the reflecting prism 720; optionally, one side of the lens array 710 is adhered to the light incident surface of the reflecting prism 720. The lens array 710 may include a plurality of converging lenses, each of which corresponds to each light outlet of the optical demultiplexer 4207, and is used to converge each receiving light beam outputted from the light outlet of the optical demultiplexer 4207 into the reflecting prism 720, and convert the receiving light beam parallel to the surface of the circuit board 300 into a receiving light beam perpendicular to the surface of the circuit board 300 through the reflecting prism 720.

[0109] Furthermore, to facilitate the assembly of the lens array 710 and the optical path coupling, the lens array 710 is a long strip-shaped integrated structure, and a plurality of protrusions are arranged on the lens array 710 on the side close to the reflective prism 720, each protrusion corresponds to each light outlet of the optical demultiplexer 4207, and acts as a convergent lens, which is used to converge each receiving light beam output from the light outlet of the optical demultiplexer 4207 into the reflective prism 720, and convert the receiving light beam parallel to the surface of the circuit board 300 into a receiving light beam perpendicular to the surface of the circuit board 300 through the reflective prism 720. When the lens array 710 with an integrated structure is used, the receiving light beam output from the output light outlet of the optical demultiplexer 4207 can be adjusted as a whole when performing optical path coupling, and compared with the lens array 720 composed of a single converging lens, the optical path coupling efficiency is high and the assembly efficiency is high.

[0110] In the embodiment of the present application, in order to facilitate fixing the lens array 710 and the reflecting prism 720 and adjusting the coupling optical path of the lens array 710 and the reflecting prism 720, the optical receiving assembly further includes a fourth housing 700, which is a housing with an opening at the bottom. The fourth housing 700 is covered on the optical receiving chip 740 and the transimpedance amplifier 750 of the circuit board 300, and the lens array 710 and the reflecting prism 720 are fixed on the inner wall of the fourth housing 700, such as the top surface of the lens array 710 and the reflecting prism 720 are attached to the top surface inside the fourth housing 700. The receiving light beam outputted from the output light port of the optical demultiplexer 4207 is transmitted to the lens array 710 and the reflecting prism 720 through one end of the fourth housing 700.

[0111] The height of the lens array 710 and the reflective prism 720 can be adjusted according to the distance between the fourth housing 700 and the surface of the circuit board 300, so that the multi-channel signal light beams output by the optical demultiplexer 4207 can be accurately projected into the lens array 710 and the reflective prism 720. In addition, when it is necessary to couple the receiving optical path, the lens array 710 and the reflective prism 720 are first fixedly assembled on the fourth housing 700, and then the lens array 710 and the reflective prism 720 are moved by clamping the fourth housing 700, so as to facilitate the clamping and movement of the lens array 710 and the reflective prism 720, thereby improving the optical path coupling efficiency; at the same time, since the lens array 710 and the reflective prism 720 are usually made of silicon or other materials, if the lens array 710 and the reflective prism 720 are directly clamped, it is easy to cause scratches on the lens array 710 and the reflective prism 720, so the fourth housing 700 can be used to avoid scratches, clamping and other damages to the lens array 710 and the reflective prism 720. The lens array 710 and the reflective prism 720 are fixed by the fourth housing 700 , so as to simplify the process of coupling and installing the lens array 710 and the reflective prism 720 .

[0112] In order to adjust the distance between the top surface of the fourth shell 700 and the surface of the circuit board 300, a first adjustment plate 760 and a second adjustment plate 770 are provided on the circuit board 300. The first adjustment plate 760 and the second adjustment plate 770 are respectively located on both sides of the light receiving chip 740, and the first adjustment plate 760 is in contact with the bottom surface of the left side of the fourth shell 700, and the second adjustment plate 770 is in conflict with the bottom surface of the right side of the fourth shell, so that the fourth shell 700 is supported and fixed by the first adjustment plate 760 and the second adjustment plate 770, thereby increasing the distance between the top surface of the fourth shell 700 and the circuit board 300. Optionally, the first adjustment plate 760 and the second adjustment plate 770 are arranged on both sides of the light receiving chip 740 along the length direction of the circuit board 300, so that when the positions of the lens array 710 and the reflective prism 720 in the light path of the receiving light beam are adjusted by coupling, the fourth housing 700 moves on the first adjustment plate 760 and the second adjustment plate 770, which can effectively prevent the moving fourth housing 700 from touching the light receiving chip 740 and other devices, thereby causing damage to the light receiving chip 740 and other devices. The first adjustment plate 760 and the second adjustment plate 770 facilitate ensuring the flatness of the installation of the fourth housing 700, thereby improving the accuracy and flatness of the mounting positions of the lens array 710 and the reflective prism 720, reducing the error of the receiving light path, and increasing the stability of the light path.

[0113] In the embodiment of the present application, the optical demultiplexer 4207 is fixed to the second cavity 4202 of the second shell 420, and the optical receiving chip 740 is pasted on the surface of the circuit board 300. The distance between the top surface of the fourth shell 700 and the surface of the circuit board 300 is adjusted by the first adjustment plate 760 and the second adjustment plate 770, thereby adjusting the distance between the lens array 710 and the reflection prism 720 and the surface of the circuit board 300, so that the multiple signal light beams output by the optical demultiplexer 4207 are transmitted to the lens array 710, and the multiple signal light beams are coupled to the reflection prism 720 via the lens array 710. The signal light beams parallel to the surface of the circuit board 300 are converted into signal light beams perpendicular to the surface of the circuit board 300 by the reflection prism 720, so that the multiple signal light beams are respectively reflected to the corresponding optical receiving chips 740.

[0114] The signal light beam reflected by the reflecting prism 720 is radiated light. In order to transmit the reflected signal light beam to the optical receiving chip 740, the present application arranges a plurality of third converging lenses 730 between the reflecting prism 720 and the optical receiving chip 740. Each third converging lens 730 is located above each optical receiving chip 740. In this way, the signal light beam perpendicular to the surface of the circuit board 300 reflected by the reflecting prism 720 is coupled to the optical receiving chip 740 via the third converging lens 730, so that the reflected light beam can be accurately shot into the optical receiving chip 740, thereby improving the receiving efficiency of the optical receiving chip 740. Usually in a high-speed optical module, the photosensitive surface of the light receiving chip is smaller than that of the light receiving chip used in a traditional low-speed optical module. Statistics show that the photosensitive surface of the high-speed light receiving chip is nearly a quarter smaller than that of the low-speed light receiving chip. Therefore, by providing the third converging lens 730, it is convenient to ensure the receiving efficiency of the light receiving chip 740. At the same time, it is helpful to shorten the distance between the light receiving chip 740 and the reflecting prism 720, reduce the space between the light receiving chip 740 and the reflecting prism 720, and thus save the volume occupied by the light receiving component inside the optical module.

[0115] In the embodiment of the present application, the optical receiving chip 740 is a single optical receiving chip, and the mounting tolerance of the single optical receiving chip relative to the integrated optical receiving chip array is increased, which makes it more difficult to couple the reflecting prism 720 to the optical receiving chip 740. Therefore, by making the third converging lens 730 an independent single converging lens, it is convenient to achieve the optical path coupling from the reflecting prism 720 to the optical receiving chip 740; at the same time, the coupling tolerance is increased, which facilitates reducing the difficulty of the optical receiving component assembly process.

[0116] Furthermore, to facilitate the installation of the third converging lens 730 , a pad 780 is provided on the circuit board 300 . Fig.19 This is a partial enlarged view of the light receiving component in the optical module provided in the embodiment of the present application. Fig.19As shown, the pad 780 is arranged on one side of the light receiving chip 740, one end of the third converging lens 730 is arranged on the pad 780 and the other end is located above the light receiving chip 740, and the signal light whose transmission direction is changed by the reflection prism 720 is converged and transmitted to the photosensitive surface of the light receiving chip 740 through the third converging lens 730. The third converging lens 730 is fixedly installed by providing the pad 780 on the circuit board 300, and the height of the pad 780 can be adjusted according to the installation height requirement of the third converging lens 730, so as to facilitate the installation of each third converging lens 730 to the accurate position, thereby ensuring the light receiving efficiency of the light receiving chip 740.

[0117] Fig. 20 A schematic diagram of an optical receiving circuit in an optical module provided in an embodiment of the present application, Fig.21 This is a side view of the optical receiving circuit in the optical module provided in the embodiment of the present application. Fig. 20 , Fig.21 As shown, the second optical fiber adapter 600, the second displacement prism 4206, the optical demultiplexer 4207, the lens array 710, the reflection prism 720, the third convergent lens 730, and the optical receiving chip 740 are sequentially arranged along the light receiving direction. The signal light beam transmitted by the second optical fiber adapter 600 is transmitted to the second displacement prism 4206. After being refracted and reflected by the second displacement prism 4206, one signal light beam is emitted into the optical demultiplexer 4207. The optical demultiplexer 4207 demultiplexes one signal light beam into multiple signal light beams. The multiple signal light beams are coupled to the reflection prism 720 via the lens array 710. The reflection prism 720 converts the multiple signal light beams parallel to the surface of the circuit board 300 into multiple signal light beams perpendicular to the surface of the circuit board 300. The reflected signal light beams are converged and coupled to the corresponding optical receiving chip 740 via the third convergent lens 730 to realize the reception and photoelectric conversion of the signal light.

[0118] In the embodiment of the present application, since the received signal light beam is converted from a parallel light beam to a vertical light beam via the reflective prism 720, the height of the light receiving chip 740 from the surface of the circuit board 300 is lower than the height of the optical demultiplexer 4207 from the surface of the circuit board 300. The present application increases the fixed height of the optical demultiplexer 4207 on the second housing 420 by recessing the second cavity 4202 on the second housing 420 into the first cavity 4201.

[0119] Fig. 22 This is a schematic diagram of the structure of the first housing 410 in the optical module provided in an embodiment of the present application. Fig.23 FIG. 4 is a schematic diagram of the assembly of the first housing 410 and the circuit board 300 in the optical module provided in the embodiment of the present application. Fig.11 , Fig.23As shown, the first shell 410 is a shell with openings on the left side, right side and top side, which is composed of a first bottom plate 4110, a first side plate 4120 and a second side plate 4130. A third bottom plate 4140 is provided at the right opening of the first bottom plate 4110. The third bottom plate 4140 is recessed in the first bottom plate 4110 so that a step surface exists between the third bottom plate 4140 and the first bottom plate 4110.

[0120] The left side of the circuit board 300 inserted into the first housing 410 abuts against the left side of the third bottom plate 4140, thereby positioning the circuit board 300. That is, after the circuit board 300 is inserted into the first housing 410, it moves from right to left along the surface of the first bottom plate 4110 of the first housing 410 by rubbing against it, until the side of the circuit board 300 corresponding to the light emitting part abuts against the side of the third bottom plate 4140 and is positioned, and then the lower surface of the circuit board 300 is bonded to the third bottom plate 4140 with glue, thereby fixing the circuit board 300 to the first housing 410.

[0121] When the first shell 410 is fixedly connected to the second shell 420, the third side panel 4220 of the second shell 420 corresponds to the left opening of the first shell 410, and the third side panel 4220 and the left sides of the first side panel 4120 and the second side panel 4130 of the first shell 410 can be bonded together by glue to block the left opening of the first shell 410 through the third side panel 4220, thereby achieving the fixation of the first shell 410 and the second shell 420.

[0122] The circuit board 300 is provided with electronic devices such as capacitors, resistors, triodes, MOS tubes, clock data recovery CDR, power management chips, data processing chips DSP, etc. In order to ensure that there is enough space on the circuit board 300 to accommodate the electronic devices, a protrusion 320 is provided on the circuit board 300. The protrusion 320 extends along the left and right directions of the circuit board 300, that is, the left side of the protrusion 320 is close to the left opening of the first housing 410, and the right side is connected to the circuit board 300 as a whole. The size of the protrusion 320 in the front-to-back direction is smaller than the size of the circuit board 300 in the front-to-back direction, so that a gap is left between the right side of the protrusion 320 and the right side of the circuit board 300. The gap corresponds to the light emitting assembly and is used to avoid the semiconductor refrigerator 490, substrate 4901, laser chip 450, first convergent lens 460, glass block 480, collimating lens 470, optical multiplexer 4205 and first displacement prism 4204 of the light emitting assembly.

[0123] In the embodiment of the present application, the protrusion 320 is located below the second displacement prism 4206 and the optical demultiplexer 4207 of the optical receiving component, that is, after the second shell 420 is installed above the first shell 410, there is a gap between the bottom surface of the second displacement prism 4206 and the optical demultiplexer 4207 in the second shell 420 and the first bottom plate 4110 of the first shell 410, and the protrusion 320 of the circuit board 300 is embedded in the gap to increase the area for setting electronic devices on the circuit board 300.

[0124] Fig.24 This is another angled assembly diagram of the first housing 410 and the circuit board 300 in the optical module provided in the embodiment of the present application. Fig.24 As shown, since an electronic device 330 is provided on the protrusion 320 of the circuit board 300, in order to avoid the electronic device 330 on the protrusion 320, an avoidance hole 4150 is provided on the first bottom plate 4110 of the first shell 410. The avoidance hole 4150 corresponds to the electronic device 330 on the protrusion 320, so that a partial area on the protrusion 320 can be exposed, which facilitates the arrangement of the electronic device 330 on the exposed surface of the protrusion 320, thereby making full use of the narrow space of the optical module, ensuring the connection strength between the circuit board 300 and the first shell 410 and the rationality of the layout of the electronic devices on the circuit board 300.

[0125] The laser chip 450, the first converging lens 460, the substrate 4901, the semiconductor refrigerator 490, the glass block 480 and the collimating lens 470 of the optical emitting component are fixed on the first bottom plate 4110 of the first shell 410, the first displacement prism 4204 and the optical multiplexer 4205 of the optical emitting component and the second displacement prism 4206 and the optical demultiplexer 4207 of the optical receiving component are fixed on the second bottom plate 4210 of the second shell 420, one side of the circuit board 300 is fixed inside the first shell 410, and the third converging lens 730, the optical receiving chip 740, the transimpedance amplifier 750 and the fourth shell equipped with the lens array 710 and the reflecting prism 720 are fixed on the circuit board 300, and then the first shell 410 and the second shell 420 are bonded together, and then the third shell 430 and the first shell 410 are fixed together, so as to assemble and form the optical transceiver sub-module 400, and realize the electrical connection between the optical transceiver sub-module 400 and the circuit board 300.

[0126] Fig.25 FIG. 4 is a cross-sectional view of the assembly of the first housing 410 and the third housing 430 in the optical module provided in the embodiment of the present application. Fig. 22 , Fig.25As shown, a support platform 4160 is provided on the first bottom plate 4110, the left side of the support platform 4160 abuts against the right side of the first side plate 4120, and the right side is flush with the left side of the third bottom plate 4140. The support platform 4160 is used to place the semiconductor refrigerator 490 and the glass block 480, that is, the bottom surfaces of the semiconductor refrigerator 490 and the glass block 480 are attached to the support platform 4160. In addition, the rear side surface of the support platform 4160 abuts against the front side surface of the protrusion 320 of the circuit board 300 to position the protrusion 320.

[0127] The third shell 430 is a shell formed by assembling a top plate and two opposite side plates, the top plate faces the upper shell 201, and the two opposite side plates are respectively connected to the first side plate 4120 and the second side plate 4130 of the first shell 410. Specifically, a first boss 4170 is provided on the support platform 4160 of the first bottom plate 4110, the front side of the first boss 4170 abuts against the inner wall of one side plate of the third shell 430, and the contact portion is fixed by laser welding; a second boss 4180 is provided on the second side plate 4130 of the first shell 410, the second boss 4180 is arranged opposite to the first boss 4170, and the rear side of the second boss 4180 abuts against the inner wall of the other side plate of the third shell 430, and the contact portion is fixed by laser welding, thereby realizing the fixed connection between the first shell 410 and the third shell 430.

[0128] In the optical module provided by the embodiment of the present application, a accommodating cavity is formed by assembling a first shell, a second shell and a third shell, an optical emitting component and an optical receiving component are arranged in the accommodating cavity, a plurality of laser chips, a plurality of first converging lenses and a plurality of collimating lenses of the optical emitting component are fixed in the cavity of the first shell, an optical multiplexer and a first displacement prism of the optical emitting component are fixed in the cavity of the second shell, and when the second shell cover is arranged above the first shell, the plurality of laser chips, the plurality of first converging lenses, the plurality of collimating lenses, the optical multiplexer, the first displacement prism and the first optical fiber adapter are located in the same optical emitting direction, so that multi-path emission light beams are transmitted. Transmitted through one optical fiber; the second displacement prism and the optical demultiplexer of the optical receiving component are fixed in the cavity of the second shell, the lens array and the reflecting prism of the optical receiving component are fixed in the cavity of the fourth shell, and the multiple optical receiving chips and the transimpedance amplifier of the optical receiving component are fixed on the surface of the circuit board inserted into the first shell. When the second shell cover is arranged above the first shell and the fourth shell cover is arranged above the optical receiving chip and the transimpedance amplifier, the second optical fiber adapter, the second displacement prism, the optical demultiplexer, the lens array, the reflecting prism, the multiple optical receiving chips, and the transimpedance amplifier are located in the same optical receiving direction, so that multiple receiving light beams are received through one optical fiber. The present application belongs to the field of optical device structure design and assembly of optical communication devices, such as 100G products, 400G FR4, etc. The optical transmitting component and the optical receiving component are respectively fixed in the first shell, the second shell, and the fourth shell, which improves the integration of the optical transceiver submodule and is conducive to the miniaturization of the optical module.

[0129] Fig.26 This is a schematic diagram of the structure of the local light receiving component in the optical module provided in the embodiment of the present application being assembled on the circuit board. Fig.26 As shown, the fourth shell 700 is covered on the circuit board 300; wherein, a lens array 710 and a reflective prism 720 are arranged inside the fourth shell 700, one end of the fourth shell 700 is connected to the first adjustment plate 760, and the other end is connected to the second adjustment plate 770, and then the fourth shell 700 covers the reflective prism 720 above the light receiving chip 740.

[0130] Fig. 27 Schematic diagram of the structure of the fourth housing in the optical module provided in the embodiment of the present application Figure 1 , Fig.28 Schematic diagram of the structure of the fourth housing in the optical module provided in the embodiment of the present application Figure 2 , Fig.29 This is an exploded view of the fourth housing, the lens array, and the reflective prism in the optical module provided in the embodiment of the present application. Figure 27-29As shown, the fourth housing 700 provided in the embodiment of the present application includes a fourth bottom plate 701 and a fifth side plate 702 and a sixth side plate 703 arranged on both sides, the fourth bottom plate 701 is used to fix and install the lens array 710 and the reflective prism 720, the fifth side plate 702 and the sixth side plate 703 are used to support the fourth bottom plate 701 so that the fourth bottom plate 701 floats above the light receiving chip 740 and other devices; at the same time, the fifth side plate 702 and the sixth side plate 703 are also used for limiting the position of the lens array 710 and the reflective prism 720; so as to simplify the process of coupling installation of the lens array 710 and the reflective prism 720. Generally, the distance between the fifth side plate 702 and the sixth side plate 703 is greater than the length of the lens array 710 and the reflective prism 720, which is convenient for the installation of the lens array 710 and the reflective prism 720. Optionally, the ends of the lens array 710 and the reflective prism 720 abut against the fifth side plate 702 or the sixth side plate 703.

[0131] To facilitate the installation of the lens array 710 and the reflection prism 720, a first slot 704 is provided on the fifth side plate 702, and a second slot 705 is provided on the sixth side plate 703. The first slot 704 and the second slot 705 are symmetrically arranged on the fourth housing 700, and the lens array 710 and the reflection prism 720 enter and exit the fourth housing 700 through the first slot 704 and the second slot 705. Further, the depth of the first slot 704 and the second slot 705 is less than the height of the fifth side plate 702 and the sixth side plate 703, so that when the lens array 710 and the reflection prism 720 are assembled on the fourth housing 700, the ends of the lens array 710 and the reflection prism 720 abut against the fifth side plate 702 or the sixth side plate 703 at the bottom of the first slot 704 or the second slot 705.

[0132] In order to facilitate the accurate installation of the lens array 710 and the reflection prism 720 on the fourth housing 700, a positioning post is provided on the fourth bottom plate 701, and the positioning post can be used to position the lens array 710 or the reflection prism 720, that is, the positioning post is close to the positioning lens array 710 or the reflection prism 720. Taking the positioning of the reflection prism 720 by the positioning post as an example, the positioning post 706 is arranged on one side of the reflection prism 720, and the cylindrical surface of the reflection prism 720 connected to its reflection surface is bonded and connected to the positioning post 706. In this way, when the reflection prism 720 is installed on the fourth housing 700, the fifth side plate 702 or the sixth side plate 703 positions the reflection prism 720 in the width direction of the fourth housing 700, and the positioning post 706 positions the reflection prism 720 in the length direction of the fourth housing 700, thereby facilitating the accurate installation of the reflection prism 720 on the fourth housing 700. The lens array 710 is mounted on one side of the reflective prism 720 , which facilitates accurate installation of the lens array 710 on the fourth housing 700 and ensures that the lens array 710 is mounted accurately and flatly at the mounting position of the reflective prism 720 .

[0133] When arcs appear at the connection between the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701 due to poor right-angle processing, the installation of the lens array 710 and the reflective prism 720 may be interfered. In order to avoid arcs appearing at the connection between the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701 due to poor right-angle processing, a sink groove may be provided at the connection between the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701. For example, a sink groove 707 is provided at the connection between the fifth side plate 702 and the fourth bottom plate 701. The sink groove 707 can effectively avoid the arcs appearing at the connection between the fifth side plate 702 and the fourth bottom plate 701 and interfere with the installation of the lens array 710 and the reflective prism 720, thereby increasing the stability of the receiving optical path. When one end of the lens array 710 and the reflecting prism 720 abuts against the fifth side panel 702, a recessed groove 707 may be provided only at the connection between the fifth side panel 702 and the fourth bottom panel 701. Of course, recessed grooves may be provided at the connection between the fifth side panel 702 and the sixth side panel 703 and the fourth bottom panel 701. According to specific usage requirements, one end of the lens array 710 and the reflecting prism 720 may abut against the fifth side panel 702 or the sixth side panel 703.

[0134] To facilitate the installation of the fourth housing 700, an identification hole 708 is provided on the fourth bottom plate 701, and the identification hole 708 penetrates the fourth bottom plate 701. When the fourth housing 700 is coupled and fixed on the circuit board 300, the identification hole 708 is used to identify the positioning of the fourth housing 700.

[0135] The fourth housing 700 can be made of metal material, which can reduce the impact of the transmitted signal light on the light reception and shield the electromagnetic interference of the electrical components in the light receiving assembly when the lens array 710 and the reflective prism 720 are coupled and installed. Optionally, the fourth housing 700 is made of Kovar alloy, so that the expansion coefficient of the fourth housing 700 is close to the expansion coefficient of the lens array 710 and the reflective prism 720, which is convenient for ensuring the stability of the optical path during the high and low temperature deformation of the fourth housing 700.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that: include: Circuit boards; A second optical fiber adapter is located at the optical port of the optical module and is used to input a signal light; wherein the signal light is wavelength division multiplexed signal light of multiple wavelengths; The optical transceiver submodule comprises a housing cavity and an optical receiving assembly arranged in the housing cavity, wherein the housing cavity is connected to the second optical fiber adapter; one end of the circuit board extends into the housing cavity; Wherein, the light receiving component comprises: an optical demultiplexer, located on the output optical path of the second optical fiber adapter, for demultiplexing the optical signal output by the second optical fiber adapter and outputting multiple signal lights; A light receiving chip, arranged on the circuit board and electrically connected to the circuit board; A fourth housing is located at the light-emitting side of the optical demultiplexer; the fourth housing comprises a fourth bottom plate and a fifth side plate and a sixth side plate arranged on both sides of the fourth bottom plate, the fourth bottom plate, the fifth side plate and the sixth side plate form an opening, and the opening faces the optical demultiplexer; the fourth bottom plate is located above the light receiving chip; the bottoms of the fifth side plate and the sixth side plate are connected to the circuit board; A reflecting prism, the top of which is connected to the fourth base plate and is located on the output optical path of the optical demultiplexer; the reflecting prism includes a reflecting surface, the reflecting surface is located above the optical receiving chip, and the reflecting surface reflects and transmits the multi-path optical signals output by the optical demultiplexer to the optical receiving chip.

2. The optical module according to claim 1, characterized in that: The optical transceiver sub-module comprises a first shell, a second shell and a third shell, wherein the first shell, the second shell and the third shell form the accommodating cavity; The second shell includes a second bottom plate, a third side plate and a fourth side plate, the bottom surfaces of the third side plate and the fourth side plate are respectively connected to the second bottom plate, and the side surface of the fourth side plate is connected to the third side plate; The third side plate is provided with a second through hole, and the second optical fiber adapter is connected to the second through hole.

3. The optical module according to claim 1, characterized in that: The optical module further includes a first adjustment plate and a second adjustment plate, wherein the first adjustment plate and the second adjustment plate are arranged on the circuit board, and the first adjustment plate is located on one side of the optical receiving chip, and the second adjustment plate is located on the other side of the optical receiving chip; The first adjustment plate support connects one end of the fifth side plate and one end of the sixth side plate, and the second adjustment plate support connects the other end of the fifth side plate and the other end of the sixth side plate.

4. The optical module according to claim 2, characterized in that: A first slot is provided on the fifth side plate, and one end of the reflective prism contacts and is connected to the bottom of the first slot on the fifth side plate; And / or, a second slot is provided on the sixth side plate, and the other end of the reflective prism contacts and is connected to the bottom of the second slot on the sixth side plate.

5. The optical module according to claim 2, characterized in that: A positioning column is arranged on the fourth bottom plate, and a side surface of the positioning column is connected to a cylindrical surface of the reflecting prism close to the reflecting surface.

6. The optical module according to claim 2, characterized in that: A sinking groove is arranged on the fourth bottom plate, and the sinking groove is arranged at the connection between the fifth side plate and the fourth bottom plate, and one end of the reflecting prism spans the sinking groove.

7. The optical module according to claim 2, characterized in that: The fourth bottom plate is provided with an identification circular hole, and the identification circular hole passes through the fourth bottom plate.

8. The optical module according to claim 1, characterized in that: The light receiving assembly further comprises a lens array, wherein the lens array is arranged on a cylindrical surface of the reflecting prism away from the reflecting surface; a protrusion is arranged on a side surface of the lens array close to the cylindrical surface.

9. The optical module according to claim 1, characterized in that: The light receiving assembly also includes a third converging lens and a spacer; The pad is arranged on the circuit board, one end of the third converging lens is connected to the pad, and one end of the third converging lens provided with a converging protrusion is suspended above the light receiving chip.

10. The optical module according to claim 2, characterized in that: The optical module further includes a first optical fiber adapter, which is located at the optical port of the optical module and is used to output a signal light; wherein the signal light is wavelength-division multiplexed signal light of multiple wavelengths; the optical transceiver submodule further includes an optical transmitting component, which is located in the accommodating cavity; Wherein, the optical transmission component includes an optical multiplexer, a laser chip and a collimating lens; the second housing supports and connects the optical multiplexer and the optical multiplexer is located on the input optical path of the first optical fiber adapter; The laser chip and the collimating lens are arranged on the first housing, and the laser chip is electrically connected to the circuit board; the collimating lens is located on the output optical path of the laser chip and on the input optical path of the optical multiplexer.

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