A hybrid fan and heat pipe based system to remove heat from a head mounted display

Abstract

The present application relates to a system for discharging heat from a head-mounted display based on a mixing fan and a heat pipe. A head-mounted display (HMD) includes a mixing fan, a printed circuit board (PCB) having one or more electronic components, and a heat pipe for dissipating heat. The mixing fan has a central axis extending from the rear side of the HMD to the front side of the HMD. The mixing fan draws air from the rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds the periphery of the mixing fan and transfers heat at least away from the PCB. The HMD also includes a side cover and a front cover. The side cover surrounds the mixing fan, the PCB, and the heat pipe. The front cover is attached to the side cover, and there is a slit between the outer edge of the front cover and the outer edge of the side cover to discharge air from the mixing fan.

Description

[0001] This application is a divisional application of an application with an application date of May 2, 2017, application number 201780092324.4, and invention name “System for discharging heat from a head-mounted display based on a hybrid fan and a heat pipe”. background

[0002] The present disclosure relates generally to a system for dissipating heat generated in a head mounted display (HMD), and more particularly to a system for exhausting heat from an HMD based on a hybrid fan and heat pipe.

[0003] The HMD may be operated as part of, for example, a virtual reality (VR) system, an augmented reality (AR) system, a mixed reality (MR) system, or some combination thereof. During operation of the HMD, heat is generated inside the HMD. The heat in the HMD may be generated by one or more electronic components of the HMD, the face of a user wearing the HMD, etc. For normal operation of the HMD, the heat generated inside the HMD needs to be effectively discharged from the HMD.

[0004] Overview

[0005] Embodiments of the present disclosure relate to a head mounted display (HMD) including a mixing fan, a printed circuit board (PCB) having one or more electronic components, and a heat pipe. The mixing fan has a central axis extending from the rear side of the HMD to the front side of the HMD. The mixing fan is configured to draw air from the rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe at least partially surrounds the periphery of the mixing fan and transfers heat at least away from the PCB. The HMD also includes a side cover and a front cover. The side cover surrounds the mixing fan, the PCB and the heat pipe. The front cover is attached to the side cover, and there is a slit between the outer edge of the front cover and the outer edge of the side cover to exhaust air from the mixing fan.

[0006] Embodiments according to the invention are disclosed in particular in the attached claims, in particular for a head mounted display or a corresponding system. Features mentioned in one claim category may also be claimed in another claim category. Dependencies or back references in the attached claims are selected for formal reasons only. However, any subject matter resulting from an intentional back reference (in particular multiple references) to any previous claim may also be claimed, so that any combination of claims and their features is disclosed and may be claimed, regardless of the dependencies selected in the attached claims. The subject matter that may be claimed includes not only the combination of features as set out in the attached claims, but also any other combination of features in the claims, wherein each feature mentioned in a claim may be combined with any other feature in the claim or with a combination of other features. In addition, any of the embodiments and features described or depicted herein may be claimed in a separate claim and / or in any combination with any embodiment or feature described or depicted herein or in any combination with any feature of the attached claims.

[0007] In an embodiment according to the present invention, a head mounted display (HMD) may include:

[0008] a fan having a central axis extending from a rear side of the HMD to a front side of the HMD, the fan being configured to draw air from the rear side of the HMD;

[0009] a printed circuit board (PCB) having one or more electronic components; and

[0010] A heat pipe having an end coupled to the PCB at least partially surrounds the periphery of the fan and transfers heat away from the PCB.

[0011] In an embodiment according to the present invention, the HMD may include:

[0012] A side cover enclosing the fan, PCB, and heat pipe; and

[0013] The front cover, which is attached to the side cover, has a slit between an outer edge of the front cover and an outer edge of the side cover, the slit being configured to allow air from the fan to be exhausted.

[0014] Air may be drawn from the cavity between the user's face and the HMD to cool the temperature in the cavity.

[0015] One or more electronic components of the PCB may include a central processing unit (CPU), and the ends of the heat pipe may be coupled to the CPU, preferably through a thermal interface material.

[0016] The heat pipe may be a horseshoe shaped member having a first member connected to the PCB, a second member extending parallel to the first member, and a third member connecting the first member and the second member.

[0017] The heat pipe may include a first member connected to the PCB and a second member extending parallel to the first member.

[0018] In an embodiment according to the present invention, the HMD may include a metal frame, the PCB may be mounted on the metal frame, the metal frame may be formed with a hole to receive the fan, and may be enclosed within a side cover.

[0019] The metal frame may have an edge shaped with a profile matching an inner profile of the side cover to support the side cover.

[0020] Heat pipes may be connected to the metal frame to transfer heat from one or more electronic components of the PCB to the metal frame.

[0021] The heat pipe can be fixed to the PCB by a metal bracket.

[0022] The fan may be a hybrid fan configured to exhaust air at the sides of the fan after drawing air from the back side of the HMD.

[0023] The fan may be configured to draw air from front slots located on the fan and exhaust air at the sides of the fan.

[0024] In an embodiment according to the present invention, the HMD may include:

[0025] a fan having a central axis extending from a rear side of the HMD to a front side of the HMD, the fan being configured to draw air from the rear side of the HMD;

[0026] a printed circuit board (PCB) having one or more electronic components;

[0027] a side cover that surrounds the fan and the PCB; and

[0028] The front cover, which is attached to the side cover, has a slit between an outer edge of the front cover and an outer edge of the side cover, the slit being configured to allow air from the fan to be exhausted.

[0029] Air may be drawn from the cavity between the user's face and the HMD to cool the temperature in the cavity.

[0030] In an embodiment according to the invention, the HMD may include a heat pipe having an end coupled to a central processing unit (CPU) in the PCB.

[0031] In an embodiment according to the present invention, the HMD may include a heat pipe, and the heat pipe may include a first member connected to the PCB and a second member extending parallel to the first member.

[0032] The heat pipe can be fixed to the PCB by a metal bracket.

[0033] In an embodiment according to the present invention, the HMD may include a metal frame to which the PCB may be mounted, the metal frame being formed with a hole for receiving a fan and being enclosed within a side cover.

[0034] The metal frame may have an edge shaped with a profile matching an inner profile of the side cover to support the side cover.

[0035] The fan may be a hybrid fan configured to exhaust air at the sides of the fan after drawing air from the back side of the HMD. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a perspective view of a head mounted display (HMD) according to an embodiment.

[0037] Figure 2A According to the embodiment without the front cover Figure 1 A perspective view of the front rigid body of the HMD in , showing the components within the front rigid body.

[0038] Figure 2B According to the embodiment without the front cover Figure 1 A perspective view of the front rigid body of the HMD in FIG. 1 , showing a heat pipe coupled to a printed circuit board (PCB).

[0039] Figure 3 According to the embodiment, Figure 1 The HMD along Figure 2B A cross-sectional view of the front rigid body taken along line AA'.

[0040] Figure 4 According to the embodiment Figure 1 A rear view of the front rigid body of the HMD in , showing a view of the mixing fan from the facial interface of the HMD.

[0041] The accompanying drawings depict embodiments of the present disclosure for purposes of illustration only. Those skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods shown herein may be employed without departing from the principles and benefits of the present disclosure described herein. Detailed Description

[0042] Embodiments of the present disclosure relate to a head mounted display (HMD) with a heat exhaust design, which includes a hybrid fan and a heat pipe. The hybrid fan exhausts heat through the front side of the HMD. A printed circuit board (PCB) including a central processing unit (CPU) can be placed under the top surface of the HMD and connected to the heat pipe to effectively transfer heat away from the CPU. The HMD also includes a metal frame that acts as a heat sink in addition to providing structural support.

[0043] Figure 1 1 is a perspective view of an HMD 100 according to an embodiment. The HMD 100 may be part of a virtual reality (VR) system. The HMD 100 may include a front rigid body 105, a headband 110, a front cover 115, and a side cover 120, among other components. The side cover 120 surrounds components for discharging heat generated inside the HMD 100, such as a headband 110, a front cover 115, and a side cover 120. Figure 2A-2B , Figure 3 and Figure 4 The front cover 115 is attached to the side cover 120 , with slits 125 between the outer edges of the front cover 115 and the outer edges of the side cover 120 to vent air and heat from the HMD 100 .

[0044] Figure 1 The illustrated HMD 100 also includes camera assemblies 130 located on the top and bottom of the front cover 115. In some embodiments, each camera assembly 130 may be implemented as a depth camera assembly (DCA) that determines depth information for a local area surrounding some or all of the HMD 100. Each camera assembly 130 includes an imaging aperture and an illumination aperture (not shown). Figure 1 ), and the illumination source of the camera assembly 130 (not shown Figure 1 ) emits light through the illumination aperture. The illumination source of the camera assembly 130 may consist of a plurality of laser-type light emitters on a single substrate that emit a plurality of light beams, for example in the form of a structured light pattern, simultaneously or at different times. The imaging device of the camera assembly 130 (not shown) Figure 1 130) captures light reflected and / or scattered from the local area from the illumination source through the imaging aperture. A controller (not shown) coupled to the imaging device or integrated within the imaging device of the camera assembly 130 Figure 1 ) can determine two-dimensional or three-dimensional information of one or more objects in the local area based on the captured reflected / scattered light. The same or a separate controller can control the operation of the illumination source of the camera assembly 130.

[0045] Figure 1 The HMD 100 shown also includes a wireless transceiver 135. In some embodiments, the HMD 100 communicates with a console (not shown) via the wireless transceiver 135. Figure 1 The console may provide content to the HMD 100 for processing based on information received from the HMD 100. The HMD 100 may transmit information to the console via the wireless transceiver 135. The HMD may also receive content from the console via the wireless transceiver 135. In some embodiments, the console generates a two-dimensional and / or three-dimensional map of a local area around some or all of the HMD 100 based on information received from the HMD 100. In some embodiments, the console determines depth information for the three-dimensional map of the local area based on information related to the technique used in calculating depth received from the camera assembly 130. The HMD 100 may provide position information, acceleration information, velocity information, predicted future position, or some combination thereof of the HMD 100 to the console, for example, via the wireless transceiver 135. Based on the received information, the console determines content to be provided to the HMD 100 for display to the user.

[0046] In one embodiment, the front rigid body 105 includes one or more electronic display elements (not shown). Figure 1 ), one or more integrated eye tracking systems that estimate the position and angular orientation of the user's eyes (e.g., one eye tracking system for each eye of the user wearing HMD 100, which is not shown in Figure 1 ), Inertial Measurement Unit (IMU) (not shown in Figure 1 ), one or more position sensors (not shown) Figure 1 ) and reference points (not shown in Figure 1 ). The position sensor may be located within the IMU, and both the IMU and the position sensor are invisible to the user of the HMD 100. The IMU is an electronic device that generates fast calibration data based on measurement signals received from one or more position sensors. The position sensor generates one or more measurement signals in response to the movement of the HMD 100. Examples of position sensors include one or more accelerometers, one or more gyroscopes, one or more magnetometers, another suitable type of sensor that detects movement, a type of sensor used for error correction of the IMU, or some combination thereof. The position sensor may be located outside the IMU, inside the IMU, or some combination of these two locations.

[0047] One or more electronic display elements of HMD 100 may be integrated into an electronic display (not shown). Figure 1 The electronic display generates image light. In some embodiments, the electronic display includes an optical element that adjusts the focus of the generated image light. The electronic display is based on the control console (not shown). Figure 1The electronic display may display an image to a user based on data received by an electronic device (shown in FIG. 1 ). In various embodiments, the electronic display may include a single electronic display or multiple electronic displays (e.g., a display for each eye of a user). Examples of electronic displays include a liquid crystal display (LCD), an organic light emitting diode (OLED) display, an inorganic light emitting diode (ILED) display, an active matrix organic light emitting diode (AMOLED) display, a transparent organic light emitting diode (TOLED) display, some other display, a projector, or some combination thereof. The electronic display may also include an aperture, a Fresnel lens, a convex lens, a concave lens, a diffractive element, a waveguide, a filter, a polarizer, a diffuser, a fiber taper, a reflective surface, a polarized reflective surface, or any other suitable optical element that affects the image light emitted from the electronic display.

[0048] HMD 100 may also include an optical assembly (not shown). Figure 1 ). The optical assembly amplifies light received from the electronic display, corrects optical aberrations associated with the image light, and presents the corrected image light to a user of the HMD 100. At least one optical element of the optical assembly may be an aperture, a Fresnel lens, a refractive lens, a reflective surface, a diffractive element, a waveguide, a filter, a reflective surface, a polarized reflective surface, or any other suitable optical element that affects the image light emitted from the electronic display. In addition, the optical assembly may include a combination of different optical elements. In some embodiments, one or more optical elements in the optical assembly may have one or more coatings, such as an anti-reflective coating, a dichroic coating, and the like. Amplification of the image light by the optical assembly allows elements of the electronic display to be physically smaller, lighter, and consume less power than larger displays. In addition, amplification can increase the field of view of the displayed media. For example, the field of view of the displayed media is such that the displayed media is presented using substantially all (e.g., 110 degrees diagonal) of the user's field of view and in some cases all of the user's field of view. In some embodiments, the optical assembly is designed so that its effective focal length is greater than the spacing from the electronic display, which amplifies the image light projected by the electronic display. In addition, in some embodiments, the amount of amplification can be adjusted by adding or removing optical elements.

[0049] Figure 2A According to the embodiment, there is no front cover 115 Figure 1 A perspective view 200 of the front rigid body 105 of the HMD 100. The front cover 115 is Figure 2A 105 is removed so that the various components placed within the front rigid body 105 can be shown. Figure 2AAs shown, the front rigid body 105 includes a mixing fan 205, a printed circuit board (PCB) 210 having one or more electronic components, and a heat pipe 215. The side cover 120 surrounds the mixing fan 205, the PCB 210, and the heat pipe 215. The front rigid body 105 also includes a metal frame 220, and the PCB 210 is mounted on the metal frame 220. In addition to providing structural support, the metal frame 220 also acts as a heat sink, such as in combination with Figure 2B The metal frame 220 is formed with a hole 225 to receive the mixing fan 205, and the metal frame 220 is also enclosed within the side cover 120. The metal frame 220 has an edge formed with a profile that matches the inner profile of the side cover 120 to support the side cover 120. In an embodiment, the metal frame 220 is made of magnesium. In alternative embodiments, the metal frame 220 can be made of other metals or combinations of metals.

[0050] The mixing fan 205 has a central axis extending from the rear side of the front rigid body 105 to the front side of the front rigid body 105. The mixing fan 205 draws air from the rear side of the front rigid body 105 to the front side of the front rigid body 105. For example, the mixing fan 205 draws air (e.g., warm and humid air) from the cavity between the face of the user wearing the HMD 100 and the front rigid body 105 to cool the temperature in the cavity. The mixing fan 205 discharges the air at each side of the axial fan 205 after drawing air from the rear side of the front rigid body 105. In this way, the mixing fan 205 discharges heat from the user's face or facial cavity from the HMD 100, and also cools the electronic components of the PCB 210. In combination with Figure 3 More details are disclosed regarding the air flow used to exhaust heat from the HMD 100. In some embodiments, the mixing fan 205 draws air from the front slots on the mixing fan 205. The air drawn from the front slots is exhausted at the sides of the mixing fan 205 for cooling the electronic components of the PCB 210. In some embodiments, various types of fans other than the mixing fan 205 may be utilized to exhaust heat from the HMD 100 and cool the electronic components of the PCB 210.

[0051] The PCB 210 is mounted on the metal frame 220. The PCB 210 includes one or more electronic components that perform different operations in the HMD 100. In some embodiments, the PCB 210 includes a central processing unit (CPU) 230 that performs computing operations in the HMD 100. Other electronic components of the PCB 210 and the CPU 230 generate heat when performing operations in the HMD 100. In order to reliably operate the HMD 100, the heat generated by one or more electronic components of the PCB 210 is discharged from the HMD 100, and the temperature of each electronic component is maintained below a threshold level.

[0052] To effectively transfer heat away from the PCB 210, a heat pipe 215 is included in the front rigid body 105 of the HMD 100. The heat pipe 215 at least partially surrounds the periphery of the mixing fan 205, as shown in FIG. Figure 2B In one embodiment, as further shown in Figure 2A-2B As shown, the heat pipe 215 is designed as a horseshoe-shaped object having a first member 235, a second member 240 extending parallel to the first member 235, and a third member 245 connecting the first member 235 and the second member 240. Figure 2A-2B ), the third member is removed for weight and cost saving. In this case, the heat pipe 215 is composed of a first member 235 and a second member 240 extending parallel to the first member 235, wherein the first member 235 and the second member 240 are not connected. In some embodiments, one end of the heat pipe 215 (e.g., the end of the first member 235) is coupled to the PCB 210.

[0053] The first member 235 of the heat pipe 215 is coupled to the PCB 210 through the metal bracket 250, the metal plate 255, and the elastic material 260 placed in the opening of the metal plate 255. Figure 2B As shown, the metal plate 255 is placed under the first member 235 of the heat pipe 215, and the metal plate 255 is directly coupled to the PCB 210. The metal bracket 250 is placed on top of the first member 235 of the heat pipe 215, thereby fixing the heat pipe 215 to the PCB 210. Figure 2A As shown, the screws located in the holes of the metal bracket 250 are placed on corresponding screw bosses protruding from the portion of the PCB 210 surrounding the CPU 230, thereby attaching the metal bracket 250 and the heat pipe 215 to the PCB 210. The metal bracket 250 and the heat pipe 215 can be used in conjunction with Figure 2A210. In some embodiments, to facilitate heat transfer from the CPU 230 to the heat pipe 215, a thermal interface material 265 is placed on top of the CPU 230. Specifically, the end of the first member 235 of the heat pipe 215 is coupled to the CPU 230 via the thermal interface material 265. The thermal interface material 265 can be a thermal paste or thermal grease. In an alternative embodiment (not shown), the thermal interface material 265 is placed on top of the CPU 230 to facilitate heat transfer from the CPU 230 to the heat pipe 215. In some embodiments, the thermal interface material 265 is placed on top of the CPU 230 to facilitate heat transfer from the CPU 230 to the heat pipe 215. Specifically, the end of the first member 235 of the heat pipe 215 is coupled to the CPU 230 via the thermal interface material 265. The thermal interface material 265 can be a thermal paste or thermal grease. Figure 2A ), the thermal interface that couples the end of the first member 235 of the heat pipe 215 to the CPU 230 is implemented as a phase change pad. Figure 2A The other components shown are used to couple the first member 235 of the heat pipe 215 to the PCB 210.

[0054] Figure 2B is a perspective view 270 of the front rigid body 105 of the HMD 100 without the front cover 115 according to an embodiment. Figure 2B FIG. 270 shows a heat pipe 215 coupled to the PCB 210 and mounted on the metal frame 220. The heat pipe 215 is fixed to the PCB 210 by a metal bracket 250. Figure 2B As shown, one end of the first member 235 of the heat pipe 215 is placed between the metal bracket 250 and the metal plate 255. The metal plate 255 is connected by a thermal paste 265 (not shown). Figure 2B ) is directly coupled to PCB 210 and CPU 230 (not shown in Figure 2B ).

[0055] Heat pipes 215 are connected to the metal frame 220 to transfer heat from one or more electronic components of the PCB 210 to the metal frame 220, which acts as a primary heat sink. The metal frame 220 spreads the heat, thereby facilitating heat dissipation, for example, by Figure 1 The slits 125 formed between the outer edges of the front cover 115 and the outer edges of the side covers 120 of the front rigid body 105 are used to discharge heat from the front rigid body 105. Figure 2B As shown, the heat pipe 215 at least partially surrounds the periphery of the mixing fan 205. In this way, heat can be more effectively transferred away from one or more electronic components of the PCB 210 including the CPU 230. Figure 3 Further details regarding the air flow used to exhaust heat from the HMD 100 are disclosed.

[0056] Figure 3 yes Figure 1 The HMD 100 Figure 2B A cross-sectional view 300 of the front rigid body 105 taken along line AA'. Figure 33 shows the air flow within the HMD 100. As discussed above, the mixing fan 205 draws air 305 from the rear side of the front rigid body 105. The mixing fan 205 draws air 305 from an area 310, such as a cavity between the face of a user wearing the HMD 100 and the front rigid body 105, to cool the temperature in the cavity. Figure 3 As shown, air 305 is drawn from region 310 by the mixing fan 205 and then exhausted as air 315 radially around the periphery of the mixing fan 205. Thereafter, the air 315 is pushed out of the front rigid body 105 through the slits 125 along at least a portion of the inner surface of the front cover 115. In some embodiments, the exhaust of the air 315 is restricted to a portion of the entire circle (360°) around the periphery of the mixing fan 205. The restricted exhaust of the air 315 can be used to preferentially direct the flow of the air 315 over heat-sensitive portions of the HMD 100, such as for cooling one or more electronic components of the PCB 210 including the CPU 230.

[0057] As combined Figure 2A-2B As discussed, the heat pipe 215 partially surrounds the periphery of the mixing fan 205 (at Figure 3 The heat pipe 215 is connected to the metal frame 220 (not visible in the cross-sectional view 300 in FIG. 2 ) to transfer heat and air away from one or more electronic components of the PCB 210 including the CPU 230. Figure 3 The metal frame 220 (not visible in the cross-sectional view 300 in FIG. 1 ) acts as a heat sink for transferring heat away from one or more components of the PCB 210. The metal frame 220 diffuses the heat, which helps to remove the heat from the front rigid body 105, for example, through the slits 125. Thus, Figure 3 The illustrated air 315 may include air 305 drawn from region 310 (ie, from the rear side of the front rigid body 105 ) and heat transferred through the heat pipe 215 away from one or more electronic components of the PCB 210 .

[0058] As above combined Figure 1 The discussed and Figure 3 As further shown in FIG. 1 , the front cover 115 is attached to the side cover 120, and there are slits 125 between each outer edge of the front cover 115 and each outer edge of the side cover 120 to exhaust air 315 from the mixing fan 205 and from the front rigid body 105 and the HMD 100. Figure 3As shown, the air 315 flows at least partially along the inner surface of the front cover 115 and then flows out of the front rigid body 105 through the slits 125 formed between the front cover 115 and the side cover 120. By drawing the air 315 out of the front rigid body 105 through the slits 125, heat generated inside the HMD 100 by one or more components of the PCB 210 and / or by the user's face is exhausted from the HMD 100.

[0059] Figure 4 According to the embodiment Figure 1 4 shows a rear view 400 of the front rigid body 105 of the HMD 100, which shows a view of the mixing fan 205 from the facial interface 405 of the HMD 100. The user wearing the HMD 100 places his face on the facial interface 405. When wearing the HMD 100, the user generates heat on his face (i.e., in the cavity between the user's face and the front side of the front rigid body 105).

[0060] As discussed above, the mixing fan 205 draws warm and humid air from the back side of the front rigid body 105 to the front side of the front rigid body 105, i.e., from the facial interface 405 to the front side of the front rigid body 105. Thus, the mixing fan 205 transfers warm air and heat away from the user's face and / or facial cavity through the mixing fan 205. Thereafter, the mixing fan 205 moves at the sides of the mixing fan 205 and along the inner surface of the front cover 115 (not shown). Figure 4 ) and passes through a slit 125 (not shown) formed between the front cover 115 and the side cover 120. Figure 4 205 exhausts air from the front rigid body 105. Thus, in addition to cooling one or more electronic components of the PCB 210 including the CPU 230, the mixing fan 205 helps keep the user's face more comfortable and reduces fogging of the lens 410. Heat from one or more components of the PCB 210 including the CPU 230 is removed by the heat pipe 215 (not shown). Figure 4 ) along at least a portion of the inner surface of the front cover 115 and through the slit 125 from the front rigid body 105, such as in combination Figure 3 discussed in more detail.

[0061] The language used in the specification is selected primarily for readability and teaching purposes, and it may not be selected to delimit or limit the inventive subject matter. Therefore, it is intended that the scope of the present disclosure is not limited by this detailed description, but by any claims issued on an application based thereon. Therefore, the disclosure of the embodiments is intended to be illustrative, rather than restrictive, of the scope of the present disclosure, which is set forth in the appended claims.

[0062] Aspects of the present disclosure may be implemented in one or more of the following embodiments.

[0063] 1) A head mounted display (HMD), comprising:

[0064] a fan having a central axis extending from a rear side of the HMD to a front side of the HMD, the fan being configured to draw air from the rear side of the HMD;

[0065] a printed circuit board (PCB) having one or more electronic components; and

[0066] A heat pipe has an end coupled to the PCB, the heat pipe at least partially surrounding a periphery of the fan and transferring heat away from the PCB.

[0067] 2) The HMD according to 1), further comprising:

[0068] a side cover surrounding the fan, the PCB, and the heat pipe; and

[0069] A front cover, which is attached to the side cover, has a slit between an outer edge of the front cover and an outer edge of the side cover to exhaust air from the fan.

[0070] 3) The HMD according to 1), wherein air is sucked out from a cavity between a user's face and the HMD to cool the temperature in the cavity.

[0071] 4) The HMD according to 1), wherein the one or more electronic components of the PCB include a central processing unit (CPU), and wherein the end of the heat pipe is coupled to the CPU through a thermal interface material.

[0072] 5) The HMD according to 1), wherein the heat pipe is a horseshoe-shaped piece formed with a first member connected to the PCB, a second member extending parallel to the first member, and a third member connecting the first member and the second member.

[0073] 6) The HMD according to 1), wherein the heat pipe includes a first member connected to the PCB and a second member extending parallel to the first member.

[0074] 7) The HMD according to 2), further comprising a metal frame, the PCB being mounted on the metal frame, the metal frame being formed with a hole for receiving the fan and being enclosed within the side cover.

[0075] 8) The HMD according to 7), wherein the metal frame has an edge shaped with a profile matching an inner profile of the side cover to support the side cover.

[0076] 9) The HMD according to 7), wherein the heat pipe is connected to the metal frame to transfer heat from the one or more electronic components of the PCB to the metal frame.

[0077] 10) The HMD according to 1), wherein the heat pipe is fixed to the PCB via a metal bracket.

[0078] 11) The HMD according to 2), wherein the fan is a mixing fan that exhausts air at a side of the fan after sucking air from the rear side of the HMD.

[0079] 12) The HMD according to 2), wherein the fan draws air from a front slot located on the fan and discharges the air at a side of the fan.

[0080] 13) A head mounted display (HMD), comprising:

[0081] a fan having a central axis extending from a rear side of the HMD to a front side of the HMD, the fan being configured to draw air from the rear side of the HMD;

[0082] a printed circuit board (PCB) having one or more electronic components;

[0083] a side cover surrounding the fan and the PCB; and

[0084] A front cover, which is attached to the side cover, has a slit between an outer edge of the front cover and an outer edge of the side cover to exhaust air from the fan.

[0085] 14) The HMD according to 13), wherein air is sucked out from a cavity between the user's face and the HMD to cool the temperature in the cavity.

[0086] 15) The HMD according to 13), further comprising a heat pipe having an end coupled to a central processing unit (CPU) in the PCB.

[0087] 16) The HMD according to 13), further comprising a heat pipe, wherein the heat pipe comprises a first member connected to the PCB and a second member extending parallel to the first member.

[0088] 17) The HMD according to 16), wherein the heat pipe is fixed to the PCB via a metal bracket.

[0089] 18) The HMD according to 13), further comprising a metal frame, the PCB being mounted on the metal frame, the metal frame being formed with a hole for receiving the fan and being enclosed within the side cover.

[0090] 19) The HMD according to 18), wherein the metal frame has an edge shaped to match an inner contour of the side cover to support the side cover.

[0091] 20) The HMD according to 13), wherein the fan is a mixing fan that exhausts air at a side of the fan after sucking air from the rear side of the HMD.

[0092] 21) A head mounted display, comprising:

[0093] a fan having a central axis extending from a rear side of the head mounted display to a front side of the head mounted display, the fan being configured to draw air from the rear side of the head mounted display;

[0094] a printed circuit board having one or more electronic components; and

[0095] A heat pipe has an end coupled to the printed circuit board, the heat pipe at least partially surrounding a periphery of the fan and transferring heat away from the printed circuit board.

[0096] 22) The head mounted display according to 21) further comprising:

[0097] a side cover surrounding the fan, the printed circuit board, and the heat pipe; and

[0098] A front cover is attached to the side cover and has a slit between an outer edge of the front cover and an outer edge of the side cover, the slit being configured to exhaust air from the fan.

[0099] 23) A head mounted display according to 21) or 22), wherein air is sucked out from a cavity between a user's face and the head mounted display to cool the temperature in the cavity.

[0100] 24) A head-mounted display according to any one of 21) to 23), wherein the one or more electronic components of the printed circuit board include a central processing unit, and wherein the end of the heat pipe is coupled to the central processing unit via a thermal interface material.

[0101] 25) A head-mounted display according to any one of 21) to 24), wherein the heat pipe is a horseshoe-shaped member having a first member connected to the printed circuit board, a second member extending parallel to the first member, and a third member connecting the first member and the second member.

[0102] 26) A head mounted display according to any one of 21) to 24), wherein the heat pipe comprises a first member connected to the printed circuit board and a second member extending parallel to the first member.

[0103] 27) The head mounted display according to any one of 21) to 26), further comprising a metal frame, the printed circuit board being mounted on the metal frame, the metal frame being formed with a hole for receiving the fan and being enclosed within the side cover;

[0104] Optionally, the metal frame has an edge shaped to match the inner contour of the side cover to support the side cover; and / or

[0105] Optionally, the heat pipe is connected to the metal frame to transfer heat from the one or more electronic components of the printed circuit board to the metal frame.

[0106] 28) A head mounted display according to any one of 21) to 27), wherein the heat pipe is fixed to the printed circuit board via a metal bracket.

[0107] 29) The head-mounted display according to any one of 21) to 28), wherein the fan is a hybrid fan configured to exhaust air at a side of the fan after drawing air from the rear side of the head-mounted display.

[0108] 30) A head mounted display according to any one of 21) to 29), wherein the fan is configured to draw air from a front slot located on the fan and exhaust air at the side of the fan.

[0109] 31) A head mounted display, in particular a head mounted display according to any one of 21) to 30), comprising:

[0110] a fan having a central axis extending from a rear side of the head mounted display to a front side of the head mounted display, the fan being configured to draw air from the rear side of the head mounted display;

[0111] a printed circuit board having one or more electronic components;

[0112] a side cover surrounding the fan and the printed circuit board; and

[0113] A front cover is attached to the side cover and has a slit between an outer edge of the front cover and an outer edge of the side cover, the slit being configured to exhaust air from the fan.

[0114] 32) A head mounted display according to 31), wherein air is sucked out from a cavity between a user's face and the head mounted display to cool the temperature in the cavity.

[0115] 33) The head mounted display according to 31) or 32), further comprising a heat pipe having an end coupled to a central processing unit in the printed circuit board; and / or

[0116] The head mounted display further includes a heat pipe including a first member connected to the printed circuit board and a second member extending parallel to the first member;

[0117] Optionally, the heat pipe is fixed to the printed circuit board via a metal bracket.

[0118] 34) The head mounted display according to any one of 31) to 33), further comprising a metal frame to which the printed circuit board is mounted, the metal frame being formed with a hole for receiving the fan and being enclosed within the side cover;

[0119] Optionally, the metal frame has an edge shaped to have a profile matching an inner profile of the side cover to support the side cover.

[0120] 35) A head-mounted display according to any one of 31) to 34), wherein the fan is a hybrid fan configured to exhaust air at a side of the fan after drawing air from the rear side of the head-mounted display.

Claims

1. A head mounted display (HMD), comprising: a front rigid body, wherein a front cover of the front rigid body is attached to side covers of the front rigid body, a slit being defined between outer edges of the front cover and outer edges of the side covers; a fan having a central axis extending from the rear side of the front rigid body to the front side of the front rigid body, the fan being configured to push air through the slit defined between the outer edge of the front cover and the outer edge of the side cover, and the fan being positioned to draw air out of a cavity between a face of a user wearing the HMD and the front rigid body to cool the temperature in the cavity; a circuit board having at least one processor separate from the fan, the at least one processor generating heat during operation of the HMD; and A metal frame acts as a heat sink that receives heat and dissipates the heat, and the circuit board is directly mounted on the side of the metal frame.

2. The HMD according to claim 1, wherein: Heat is discharged from the HMD through the slits. 3 . The HMD according to claim 1 , wherein air is urged to flow at least partially along the inner surface of the front cover and is pushed out of the HMD through the slit. The HMD according to claim 1 , wherein the metal frame is enclosed within the side cover. The HMD of claim 1 , wherein the side cover surrounds the fan and the at least one processor.

6. The HMD of claim 1, wherein the fan is further configured to draw air from the back side of the HMD to cool the at least one processor. 7 . The HMD of claim 1 , wherein the fan is further configured to exhaust air to flow over the at least one processor for cooling the at least one processor.

8. The HMD of claim 1, wherein the metal frame diffuses heat to help dissipate heat from the HMD through the slits. 9 . The HMD according to claim 1 , wherein the metal frame has an edge formed with a profile at least partially matching an inner profile of the side cover to support the side cover.

10. The HMD according to claim 1, further comprising: A heat pipe is provided in the interior space, the heat pipe at least partially surrounding a periphery of the fan and transferring heat away from the at least one processor.

11. The HMD of claim 10, wherein an end of the heat pipe is coupled to the at least one processor via a thermal interface material, and the heat pipe transfers heat away from the at least one processor into the metal frame. 12 . The HMD of claim 10 , wherein the heat pipe is a horseshoe shaped piece having a first member coupled to the at least one processor, a second member extending parallel to the first member, and a third member connecting the first member and the second member.

13. The HMD of claim 1, wherein the fan is a mixing fan that exhausts air at a side of the fan after drawing air from the rear side of the HMD.

14. A head mounted display (HMD), comprising: a front rigid body, wherein a front cover of the front rigid body is attached to side covers of the front rigid body, a slit being defined between outer edges of the front cover and outer edges of the side covers; a circuit board having at least one processor in an interior space defined by a front cover of the HMD and a side cover of the HMD, the at least one processor generating heat during operation of the HMD; a fan having a central axis extending from the rear side of the front rigid body to the front side of the front rigid body, the fan being configured to push air through the slit defined between an outer edge of the front cover of the front rigid body and an outer edge of the side cover of the front rigid body to exhaust air and heat from the HMD, and the fan being positioned to draw air out of a cavity between a face of a user wearing the HMD and the front rigid body to cool the temperature in the cavity; as well as A metal frame, in the inner space, acts as a heat sink for dissipating heat generated by the at least one processor, and the circuit board is directly mounted on a side of the metal frame.

15. The HMD of claim 14, wherein the metal frame diffuses heat to help remove heat from the HMD through the slits.

16. The HMD of claim 14, wherein the fan is further configured to discharge air to flow over the at least one processor for cooling the at least one processor. 17 . The HMD of claim 14 , wherein air is urged to flow at least partially along an inner surface of the front cover and is pushed out of the HMD through the slit.

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