Frequency Reduction Device and Communication Device

Abstract

The present invention relates to a frequency down-conversion device and a communication device. The frequency down-conversion device includes a metal resonant cavity, a metal cover body, and a resonant column. An opening is provided at the top of the metal resonant cavity, and the metal cover body is covered at the opening. The bottom of the resonant column is fixedly provided on the bottom wall of the metal resonant cavity. The resonant column includes a dielectric column. The top surface of the dielectric column is in contact with the metal cover body. In the above frequency down-conversion device, since the resonant column includes a dielectric column and the top surface of the dielectric column is in contact with the metal cover body, it is equivalent to loading a dielectric on the resonant column or the entire resonant column is made of a dielectric column, so that a lower resonant frequency can be achieved with a smaller single-cavity size than in the conventional form.

Description

Technical Field

[0001] The present invention relates to the technical field of communication products, and particularly to a frequency-down conversion device and a communication device. Background Art

[0002] Cavity filters are widely used in the field of communication products. Their basic function is to allow useful signals to pass through the signal link to the greatest extent and suppress useless signals to the greatest extent. There are generally two ways to lower the frequency of traditional filters: one is to change the structure of the resonant post, that is, to set a disc on the top of the resonant post, and the disc is in clearance fit with the metal cover body to achieve a lower resonant frequency in this way; the other is to lower the frequency by increasing the volume of the resonant cavity, or to use both methods at the same time. However, the method of setting a disc on the top of the resonant post increases the complexity of the resonant post. In addition, increasing the size of the resonant cavity will increase the volume of the filter, and both methods will increase the cost of the filter. Summary of the Invention

[0003] Based on this, it is necessary to overcome the defects of the prior art and provide a frequency-down conversion device and a communication device, which can reduce costs and achieve a lower resonant frequency.

[0004] The technical solution is as follows: A frequency-down conversion device, the frequency-down conversion device includes: a metal resonant cavity and a metal cover body, the top of the metal resonant cavity is provided with an opening, and the metal cover body is covered at the opening; a resonant post, the bottom of the resonant post is fixedly arranged on the bottom wall of the metal resonant cavity, and the resonant post includes a dielectric post, and the top surface of the dielectric post is in contact with the metal cover body.

[0005] In the above frequency-down conversion device, since the resonant post includes a dielectric post and the top surface of the dielectric post is in contact with the metal cover body, it is equivalent to loading a dielectric on the resonant post, or the entire resonant post is made of a dielectric post, so that a lower resonant frequency can be achieved under a smaller single cavity size than the conventional form.

[0006] In one embodiment, the resonant post further includes a metal post; the bottom of the metal post is fixedly arranged on the bottom wall of the metal resonant cavity, and the bottom surface of the dielectric post is fixedly arranged on the top surface of the metal post.

[0007] In one embodiment, the bottom surface of the metal post is detachably fixed on the bottom wall of the metal resonant cavity; or, the metal post and the metal resonant cavity are of an integrated structure.

[0008] In one embodiment, a first metal layer is provided on the bottom surface of the dielectric post, and the first metal layer is welded and fixed on the top surface of the metal post; a second metal layer is provided on the top surface of the dielectric post, and the second metal layer is in electrical contact with the metal cover body.

[0009] In one embodiment, a resonance hole is provided on the top surface of the resonance column, and the resonance hole penetrates through the dielectric column and extends into the metal column; the frequency reduction device further includes an adjusting screw disposed on the metal cover body, the adjusting screw penetrates through the metal cover body and extends into the resonance hole, and an adjusting nut is sleeved outside the adjusting screw, and the adjusting nut abuts against the metal cover body.

[0010] In one embodiment, the frequency reduction device further includes a metal elastic member; the metal elastic member is disposed between the dielectric column and the metal cover body and is respectively connected to the dielectric column and the metal cover body.

[0011] In one embodiment, the metal elastic member is a metal elastic sheet or a metal spring disposed between the dielectric column and the metal cover body.

[0012] In one embodiment, the frequency reduction device further includes a buffer pad; the metal elastic sheet includes a first elastic sheet and a second elastic sheet disposed opposite to each other, and a connecting sheet connecting the first elastic sheet and the second elastic sheet; the buffer pad is installed between the first elastic sheet and the second elastic sheet.

[0013] In one embodiment, there are a plurality of the metal elastic members, the buffer pad is an annular washer, and the plurality of metal elastic members are arranged at intervals along the buffer pad.

[0014] In one embodiment, the buffer pad is a polytetrafluoroethylene pad, a silica gel pad, a rubber pad, a plastic pad or a resin pad; or, a raised portion is provided on the first elastic sheet or the second elastic sheet; or, a concave portion is provided on the side surface of the metal cover body facing the bottom wall of the metal resonance cavity, and the buffer pad and the metal elastic member are both disposed in the concave portion, and the edge of the buffer pad abuts against the inner wall of the concave portion; or, the frequency reduction device further includes a connector disposed on the cavity wall of the metal resonance cavity.

[0015] A communication device includes the frequency reduction device as described above.

[0016] For the above-mentioned communication device, since the resonance column includes a dielectric column and is in contact with the metal cover body through the top surface of the dielectric column, that is, a dielectric is loaded on the resonance column, or the entire resonance column is made of a dielectric column, a lower resonance frequency can be achieved with a smaller single cavity size than in the conventional form. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 It is a sectional view of the axial direction of a frequency reduction device according to an embodiment of the present invention;

[0020] Figure 2 For Figure 1 It is a schematic enlarged view at position A;

[0021] Figure 3 It is a top view of the frequency reduction device according to an embodiment of the present invention with the metal cover plate and the adjusting screw hidden;

[0022] Figure 4 It is a schematic view of the resonant column, buffer pad and metal elastic member of the frequency reduction device according to an embodiment of the present invention;

[0023] Figure 5 It is a schematic view of one perspective of the buffer pad and the metal elastic member of the frequency reduction device according to an embodiment of the present invention;

[0024] Figure 6 It is a schematic view of another perspective of the buffer pad and the metal elastic member of the frequency reduction device according to an embodiment of the present invention.

[0025] 10. Metal resonant cavity; 11. Opening; 20. Metal cover body; 21. Recess; 30. Resonant column; 31. Dielectric column; 32. Metal column; 33. Mounting member; 34. Resonant hole; 41. Adjusting screw; 42. Adjusting nut; 50. Metal elastic member; 51. First elastic piece; 52. Second elastic piece; 53. Connecting piece; 54. Raised portion; 60. Buffer pad; 61. Inner hole; 70. Connecting head. Detailed implementation manners

[0026] To make the above objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific implementation manners of the present invention will be made with reference to the drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0027] Refer to Figures 1 to 3 , Figure 1 which shows a sectional view of the axial direction of a frequency reduction device according to an embodiment of the present invention,Figure 2 shows Figure 1 a schematic enlarged view at A, Figure 3 shows a top view structure diagram after hiding the metal cover plate and the adjusting screw 41 of the frequency reduction device according to an embodiment of the present invention. A frequency reduction device provided by an embodiment of the present invention includes a metal resonant cavity 10, a metal cover body 20, and a resonant column 30. An opening 11 is provided at the top of the metal resonant cavity 10, and the metal cover body 20 is covered at the opening 11. The bottom of the resonant column 30 is fixedly provided on the bottom wall of the metal resonant cavity 10. The resonant column 30 includes a dielectric column 31. The top surface of the dielectric column 31 is in contact with the metal cover body 20.

[0028] For the above frequency reduction device, since the resonant column 30 includes a dielectric column 31 and the top surface of the dielectric column 31 is in contact with the metal cover body 20, that is, it is equivalent to loading a dielectric on the resonant column 30, or the entire resonant column 30 is made of the dielectric column 31, so that a lower resonant frequency can be achieved with a smaller single cavity size than the conventional form.

[0029] It should be noted that the frequency reduction device is not limited to being a single metal resonant cavity 10 as shown in Figure 1 the figure, and it can also be two metal resonant cavities 10, three metal resonant cavities 10, etc., which are not limited herein.

[0030] Please refer to Figure 1 and Figure 4 , Figure 4 shows a schematic structural diagram of the resonant column 30, the buffer pad 60, and the metal elastic member 50 of the frequency reduction device according to an embodiment of the present invention. Further, the resonant column 30 further includes a metal column 32. The bottom of the metal column 32 is fixedly provided on the bottom wall of the metal resonant cavity 10, and the bottom surface of the dielectric column 31 is fixedly provided on the top surface of the metal column 32.

[0031] Refer to Figure 1 and Figure 4 , in one embodiment, the bottom surface of the metal column 32 is detachably fixed on the bottom wall of the metal resonant cavity 10. Specifically, the bottom surface of the metal column 32 is fixedly installed on the bottom wall of the metal resonant cavity 10 through installation members 33 such as metal screws, metal pins, metal rivets, etc. The metal column 32 can also be fixedly installed on the bottom wall of the metal resonant cavity 10 by snap connection, screwing, etc., which are not limited herein.

[0032] In another embodiment, the metal column 32 and the metal resonant cavity 10 are of an integral structure. Thus, the metal column 32 and the metal resonant cavity 10 can also be formed into an integral structure by welding, or integrally formed by forging, casting, etc.

[0033] Refer to Figure 1 and Figure 4, in one embodiment, a first metal layer is provided on the bottom surface of the dielectric column 31. The first metal layer is fixedly welded to the top surface of the metal column 32. A second metal layer is provided on the top surface of the dielectric column 31, and the second metal layer is fixedly welded to the metal cover 20. Specifically, the first metal layer can be a silver layer, a copper layer, an aluminum layer, a tin layer, etc., and the second metal layer can be a silver layer, a copper layer, an aluminum layer, a tin layer, etc., which are not limited herein. By being welded to the top surface of the metal column 32, the dielectric column 31 can be quickly and stably installed on the metal column 32. It should be noted that when the frequency reduction device includes a metal elastic member 50 between the top surface of the dielectric column 31 and the metal cover 20, the second metal layer is fixedly welded to the metal elastic member 50, and the metal elastic member 50 is fixedly welded to the metal cover 20.

[0034] Refer to Figure 1 and Figure 4 , in one embodiment, a resonance hole 34 is provided on the top surface of the resonance column 30. The resonance hole 34 penetrates through the dielectric column 31 and extends into the metal column 32. Specifically, the dielectric column 31 is provided with a first through hole that extends from the top surface of the dielectric column 31 to the bottom surface of the dielectric column 31. The top surface of the metal column 32 is provided with a blind hole. The first through hole and the blind hole are coaxially arranged, and the first through hole and the blind hole are connected to form the resonance hole 34.

[0035] Refer to Figure 1 and Figure 4 , further, the frequency reduction device further includes an adjustment screw 41 provided on the metal cover 20. The adjustment screw 41 penetrates through the metal cover 20 and extends into the resonance hole 34, and an adjustment nut 42 is sleeved outside the adjustment screw 41. The adjustment nut 42 abuts against the metal cover 20. When the adjustment nut 42 is rotated, the adjustment nut 42 drives the adjustment screw 41 to move up and down, and the depth of the adjustment screw 41 extending into the resonance hole 34 can be adjusted, so as to play a tuning role.

[0036] Refer to Figure 1 and Figure 2 , in one embodiment, the frequency reduction device further includes a metal elastic member 50. The metal elastic member 50 is arranged between the dielectric column 31 and the metal cover 20 and is respectively connected to the dielectric column 31 and the metal cover 20. In this way, when the metal cover 20 deforms due to external force or thermal expansion and contraction in a high or low temperature environment, the metal elastic member 50 can deform accordingly, playing a good buffering role. In this way, when the resonance column 30 and the metal cover plate deform (mainly stretching and squeezing), it can be avoided that the bottom of the resonance column 30 is in poor contact with the bottom surface of the metal resonance cavity 10 or the resonance column 30 is damaged, etc., and it can be avoided that the top surface of the resonance column 30 is in poor contact with the metal cover plate, etc., so as to ensure the performance of the filter.

[0037] Refer to Figure 1 , Figure 2 ,Figure 5 and Figure 6 , Figure 5 Fig. 5 shows a schematic structural view of one perspective of the buffer pad 60 and the metal elastic member 50 of the frequency down-converting device according to an embodiment of the present invention. Figure 6 Fig. 6 shows a schematic structural view of another perspective of the buffer pad 60 and the metal elastic member 50 of the frequency down-converting device according to an embodiment of the present invention. In one embodiment, the metal elastic member 50 is a metal elastic sheet or a metal spring disposed between the dielectric column 31 and the metal cover 20. In this way, the metal elastic member 50 can play a good elastic buffering role, and when the resonance column 30 and the metal cover are deformed (mainly stretching and squeezing), it can avoid the situation that the bottom surface of the resonance column 30 is in poor contact with the bottom surface of the metal resonance cavity 10 or the resonance column 30 is damaged, and can avoid the situation that the top surface of the resonance column 30 is in poor contact with the metal cover, so as to ensure the performance of the filter. It should be noted that the metal elastic member 50 can also be other structures that can play an elastic buffering role, which is not limited herein.

[0038] Referring to Figure 1 , Figure 2 , Figure 5 and Figure 6 , in one embodiment, the frequency down-converting device further includes a buffer pad 60. The metal elastic sheet includes a first elastic sheet 51 and a second elastic sheet 52 which are oppositely arranged, and a connecting sheet 53 connecting the first elastic sheet 51 and the second elastic sheet 52. The buffer pad 60 is installed between the first elastic sheet 51 and the second elastic sheet 52. In this way, not only the metal elastic member 50 plays a buffering role, but the buffer pad 60 further plays a buffering role, making the buffering effect better. In this way, when the resonance column 30 and the metal cover are deformed (mainly stretching and squeezing), it can avoid the situation that the bottom surface of the resonance column 30 is not firmly in contact with the bottom surface of the metal resonance cavity 10 or the resonance column 30 is damaged, and can avoid the situation that the top surface of the resonance column 30 is not firmly in contact with the metal cover, so as to ensure the performance of the filter.

[0039] In addition, specifically, the first elastic sheet 51 is welded to the second metal layer on the top surface of the dielectric column 31. The second elastic sheet 52 is welded to the side surface of the metal cover facing the bottom surface of the metal resonance cavity 10. In this way, the top surface of the dielectric column 31 and the side surface of the metal cover facing the bottom surface of the metal resonance cavity 10 are not directly connected, but are in indirect contact. Additionally, as an example, the metal elastic sheet is specifically a U-shaped elastic sheet.

[0040] Referring to Figure 1 , Figure 2 , Figure 5 and Figure 6, Further, there are several metal elastic members 50, and the buffer pad 60 is an annular washer. The several metal elastic members 50 are arranged at intervals along the buffer pad 60. In addition, specifically, the annular washer is coaxially arranged with the resonant column 30. Additionally, the inner hole 61 diameter of the annular washer is the same as or substantially the same as the diameter of the resonant hole 34. In this way, when the metal cover 20 is deformed due to external force or thermal expansion and contraction in a high or low temperature environment, the several metal elastic members 50 can deform synchronously accordingly, playing a good buffering role. Among them, the number of the metal elastic members 50 can be one, two, three, four, five, six or other numbers, which are not limited herein. Further, the several metal elastic members 50 are arranged at equal intervals along the buffer pad 60.

[0041] Refer to Figure 1 and Figure 2 , In one embodiment, the buffer pad 60 is a polytetrafluoroethylene pad, a silica gel pad, a rubber pad, a plastic pad or a resin pad. The polytetrafluoroethylene pad, the silica gel pad, the rubber pad, the plastic pad or the resin pad all have good elastic buffering performance and can be used as the buffer pad 60 and are arranged between the first elastic piece 51 and the second elastic piece 52. Specifically, the first elastic piece 51 and the second elastic piece 52 are clamped and fixed on the buffer pad 60, that is, the elastic metal member is stably installed on the buffer pad 60 and is not easy to fall off from the buffer pad 60. Further, in order to improve the clamping force of the first elastic piece 51 and the second elastic piece 52 on the buffer pad 60, for example, a step is provided on one side surface of the buffer pad 60, and the free end of the first elastic piece 51 is placed on the step. The step plays a limiting role on the free end of the first elastic piece 51, which can avoid the first elastic piece 51 from detaching from the buffer pad 60 to a certain extent, so as to improve the clamping effect of the first elastic piece 51 and the second elastic piece 52 on the buffer pad 60.

[0042] In addition, it should be noted that the buffer pad 60 is not limited to the annular washer in the above embodiment, and can also be other shapes. For example, it can be one or several blocks, columns or other structures that can buffer the first elastic piece 51 and the second elastic piece 52 and are arranged between the first elastic piece 51 and the second elastic piece 52, which are not limited herein.

[0043] Refer to Figure 1 and Figure 2In one embodiment, a protrusion 54 is provided on the first elastic sheet 51 or the second elastic sheet 52. Specifically, when the first elastic sheet 51 is provided with a protrusion 54, the protrusion 54 is formed by bending, pressing, casting or forging the first elastic sheet 51. Similarly, when the second elastic sheet 52 is provided with a protrusion 54, the protrusion 54 is formed by bending, pressing, casting or forging the second elastic sheet 52. In this way, for example, when an external force acts on the metal cover 20, the metal cover 20 transmits the force to the metal elastic member 50, pushing the metal elastic member 50, and the protrusion 54 of the metal elastic member 50 is easily flattened after being subjected to the force, thereby playing a better buffering role. When the external force on the metal cover 20 is cancelled, the protrusion 54 of the metal elastic member 50 restores its original shape under the action of its own elastic force, so that the metal cover 20 is reset.

[0044] See also Figure 1 and Figure 2 In one embodiment, a recess 21 is provided on the side surface of the metal cover 20 facing the bottom wall of the metal resonant cavity 10. The buffer pad 60 and the metal elastic member 50 are both disposed in the recess 21. In addition, the edge of the buffer pad 60 is in conflict with the inner wall of the recess 21. In this way, the buffer pad 60 and the metal elastic member 50 are installed between the metal cover 20 and the dielectric column 31, and the buffer pad 60 and the metal elastic member 50 are located in the recess 21 of the metal cover 20. The metal cover 20 limits the buffer pad 60 and the metal elastic member 50, and can prevent the buffer pad 60 and the metal elastic member 50 from moving relative to the metal cover 20.

[0045] See also Figure 1 and Figure 2 In one embodiment, the frequency reduction device further includes a connector 70 disposed on the cavity wall of the metal resonant cavity 10. The frequency reduction device transmits communication signals with an external device through the connector 70.

[0046] It should be noted that in the infringement comparison, the "metal pillar 32" can be "a part of the metal resonant cavity 10", that is, the "metal pillar 32" and the "other parts of the metal resonant cavity 10" are integrally formed and manufactured; it can also be an independent component separable from the "other parts of the metal resonant cavity 10", that is, the "metal pillar 32" can be manufactured independently and then combined with the "other parts of the metal resonant cavity 10" into a whole.

[0047] It should be noted that, in the infringement comparison, the "first elastic sheet 51" can be "a part of the connecting sheet 53", that is, the "first elastic sheet 51" and the "other parts of the connecting sheet 53" are manufactured as one piece; it can also be an independent component separable from the "other parts of the connecting sheet 53", that is, the "first elastic sheet 51" can be manufactured independently and then combined with the "other parts of the connecting sheet 53" into a whole.

[0048] It should be noted that in the infringement comparison, the "second elastic sheet 52" can be "a part of the connecting sheet 53", that is, the "second elastic sheet 52" and the "other parts of the connecting sheet 53" are integrally formed; or it can be an independent component separable from the "other parts of the connecting sheet 53", that is, the "second elastic sheet 52" can be independently manufactured and then combined with the "other parts of the connecting sheet 53" to form a whole.

[0049] It should be noted that in the infringement comparison, the "bulge 54" can be "a part of the first elastic sheet 51", that is, the "bulge 54" and the "other parts of the first elastic sheet 51" are integrally formed; or it can be an independent component separable from the "other parts of the first elastic sheet 51", that is, the "bulge 54" can be independently manufactured and then combined with the "other parts of the first elastic sheet 51" to form a whole.

[0050] In one embodiment, a communication device includes the frequency reduction device described in any of the above embodiments.

[0051] In the above communication device, since the resonant column 30 includes the dielectric column 31 and is in contact with the metal cover 20 through the top surface of the dielectric column 31, that is, it is equivalent to loading a dielectric on the resonant column 30, or the entire resonant column 30 is made of the dielectric column 31, so that a lower resonant frequency can be achieved with a smaller single cavity size than the conventional form.

[0052] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0053] The above embodiments only represent several implementation manners of the present invention, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent should be subject to the appended claims.

[0054] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0055] In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0056] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0058] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

Claims

1. A frequency reduction device, characterized in that, The frequency reduction device includes: A metal resonant cavity and a metal cover. The top of the metal resonant cavity is provided with an opening, and the metal cover is covered at the opening. A resonant column. The bottom of the resonant column is fixedly arranged on the bottom wall of the metal resonant cavity. The resonant column includes a dielectric column, and the top surface of the dielectric column is in contact with the metal cover. Wherein, the frequency reduction device further includes a metal elastic member; the metal elastic member is arranged between the dielectric column and the metal cover and is respectively connected to the dielectric column and the metal cover. The metal elastic member is a metal elastic sheet arranged between the dielectric column and the metal cover. The frequency reduction device further includes a buffer pad; the metal elastic sheet includes a first elastic sheet and a second elastic sheet arranged oppositely, and a connecting sheet connecting the first elastic sheet and the second elastic sheet; the buffer pad is installed between the first elastic sheet and the second elastic sheet; there are a plurality of the metal elastic members, the buffer pad is an annular washer, and the plurality of the metal elastic members are arranged at intervals along the buffer pad.

2. The down-frequency device according to claim 1, wherein The resonant column further includes a metal column; the bottom of the metal column is fixedly arranged on the bottom wall of the metal resonant cavity, and the bottom surface of the dielectric column is fixedly arranged on the top surface of the metal column.

3. The down-frequency device according to claim 2, wherein The bottom surface of the metal column is detachably fixed on the bottom wall of the metal resonant cavity; or, the metal column and the metal resonant cavity are of an integral structure.

4. The down-frequency device according to claim 2, wherein A first metal layer is provided on the bottom surface of the dielectric column, and the first metal layer is welded and fixed on the top surface of the metal column; a second metal layer is provided on the top surface of the dielectric column, and the second metal layer is in electrical contact with the metal cover.

5. The down-frequency device according to claim 2, wherein A resonant hole is provided on the top surface of the resonant column. The resonant hole penetrates through the dielectric column and extends into the metal column. The frequency reduction device further includes an adjustment screw arranged on the metal cover. The adjustment screw penetrates through the metal cover and extends into the resonant hole, and an adjustment nut is sleeved outside the adjustment screw, and the adjustment nut abuts against the metal cover.

6. The down-frequency device according to claim 1, characterized in that, The first elastic sheet is welded and connected to the second metal layer arranged on the top surface of the dielectric column; the second elastic sheet is welded and connected to the side surface of the metal cover facing the bottom surface of the metal resonant cavity.

7. The down-frequency device according to claim 1, wherein The metal elastic sheet is a U-shaped elastic sheet.

8. The down-frequency device according to claim 1, characterized in that The annular washer is coaxially arranged with the resonant column; the inner hole diameter of the annular washer is the same as the aperture of the resonant hole of the resonant column.

9. The down-frequency device according to claim 1, wherein The buffer pad is a polytetrafluoroethylene pad, a silica gel pad, a rubber pad, a plastic pad or a resin pad; or, a raised portion is provided on the first elastic sheet or the second elastic sheet; or, a concave portion is provided on the side surface of the metal cover facing the bottom wall of the metal resonant cavity, the buffer pad and the metal elastic member are both arranged in the concave portion, and the edge of the buffer pad abuts against the inner wall of the concave portion; or, the frequency reduction device further includes a connector arranged on the cavity wall of the metal resonant cavity.

10. A communication device, characterized in that, The communication device includes the frequency reduction device according to any one of claims 1 to 9.

Images