Ultra-thin temperature balancing plate and manufacturing method thereof

Abstract

The present invention relates to an ultra-thin temperature equalizing plate and a manufacturing method thereof, wherein the manufacturing method comprises selecting a heat-conducting metal powder, mixing the heat-conducting metal powder with a solvent suitable for screen printing, printing the mixture on a thin heat-conducting first metal plate by screen printing, so that the mixture forms a support portion of a predetermined height, area and shape, sintering the first metal plate manufactured by the aforementioned process, so that the support portion forms a porous structure and is combined with the first metal plate, welding and sealing the first metal plate sintered by the aforementioned process and a thin heat-conducting second metal plate, and then vacuumizing and injecting a working fluid to form an ultra-thin temperature equalizing plate, wherein the porous structure support portion absorbs the working fluid, and has a better capillary phenomenon during operation to accelerate the diffusion of temperature, so that the ultra-thin temperature equalizing plate has a more efficient temperature equalizing effect.

Description

Technical Field

[0001] The invention belongs to the technical field of uniform temperature heat dissipation, and in particular relates to an ultra-thin uniform temperature plate and a manufacturing method thereof. Background Art

[0002] The heat dissipation of known electronic components is mostly achieved by using metal heat sinks, or by combining heat pipes, cooling chips, cooling fans, etc., which generally have the disadvantages of poor heat dissipation effect, slow heat dissipation speed, complex heat dissipation module structure, and high cost.

[0003] The heat pipe technology was born in the Los Alamos National Laboratory in the United States as early as 1963. Its inventor is GMGrover. Heat pipe is a heat transfer component. It makes full use of the principle of heat conduction and the rapid heat transfer properties of the refrigerant medium. The heat of the heating object is quickly transferred to the outside of the heat source through the heat pipe. Its thermal conductivity is far greater than that of any known metal. In the past, heat pipe technology has been widely used in aerospace, military and other industries, and it has been introduced into the radiator manufacturing industry in recent years. Why does heat pipe technology have such high performance? We need to look at this problem from the perspective of thermodynamics. The heat absorption and heat release of objects are relative. Whenever there is a temperature difference, heat will inevitably be transferred from high temperature to low temperature. There are three ways of heat transfer: radiation, convection, and conduction, among which heat conduction is the fastest. Heat pipes use evaporative cooling to make the temperature difference between the two ends of the heat pipe very small, so that heat can be quickly conducted. Common heat pipes are composed of a tube shell, a liquid wick and an end cap. The manufacturing method is to pump the inside of the heat pipe into a negative pressure state, and then fill it with a suitable liquid. This liquid has a very low boiling point and is easy to volatilize. The tube wall has a liquid wick, which is made of capillary porous material. One end of the heat pipe is the evaporation end, and the other end is the condensation end. When one section of the heat pipe is heated, the liquid in the capillary tube evaporates rapidly, and the vapor flows to the other end under a small pressure difference, and releases heat and condenses into liquid again. The liquid then flows back to the evaporation section along the porous material by the action of capillary force, and the cycle continues. Heat is transferred from one end of the heat pipe to the other end. This cycle is carried out quickly, and heat can be conducted continuously. However, the current fin-type heat sink is not efficient in heat conduction, and its inability to absorb a large amount of heat instantly is its shortcoming. How to combine heat pipes and fin-type heat sinks to improve heat dissipation efficiency has led to the invention of the temperature dispersion plate. For example, the flat-plate heat expansion board of Taiwan Patent No. M255446 (referenced in the patent announcement data on January 11, 2005) mainly includes a pair of shells with good heat conduction, one side of the shells has an opening, and there are an appropriate number of pillars inside, and an air flow channel is formed. A porous powder layer with good heat conduction is sintered on the inner edge of the shell, and sealed by a cover, so that a number of staggered tubular channels are formed inside the shell, and the working fluid is injected and evacuated, so that the metal powder layer adsorbs the working fluid to form a flat-plate heat expansion board. However, the known temperature averaging board is composed of powder with good heat conduction sintered in the two shells, or a metal mesh with good heat conduction is set. Although both have the effect of heat expansion and temperature equalization, the electronic components used in the 4G computer room today may generate instantaneous high heat due to large flow in an instant. The structure of the known temperature averaging board is not fast enough in terms of heat diffusion and temperature equalization, which will cause the electronic components to overheat, shut down or be damaged.The applicant previously applied for a temperature equalizing component (Announcement No. M494289), which mainly includes a pair of shells made of highly thermally conductive metal, and a working space inside the pair of shells. The working space has an appropriate number of heat-conducting columns connecting the pair of shells. By sealing the pair of shells, a number of staggered channels are formed inside the shells, and then vacuumed and injected with an appropriate amount of working fluid to form a temperature equalizing plate. The heat-conducting columns are a porous structure composed of highly thermally conductive powder. The working fluid is adsorbed by the heat-conducting columns with a porous structure, which has a better capillary phenomenon during operation, can indeed accelerate the diffusion of temperature, and has a more efficient temperature equalization effect.

[0004] Furthermore, heat pipe products (including vapor chambers) transfer heat through the change of liquid-vapor phase and flow of the internal working fluid, and their heat conduction and diffusion capabilities are better than all currently known materials of the same size. If heat pipe products can be introduced into the current thin and light mobile device products, the waste heat generated by the high-heat chip can be quickly diffused from the heat pipe direction by using its temperature-averaging characteristics, which will make the system operation more stable. However, the heat pipe diameters commonly used in the heat dissipation modules of thin and light mobile device products are mostly 6mm or 8mm, which is even thicker than the mobile device. In addition, the thickness of the traditional vapor chamber is more than 2~3mm, so it cannot be used directly on the mobile device. It must be thinned to have a chance to be introduced into the mobile device with limited space. In view of the heat dissipation needs of mobile devices, in recent years, many heat pipe manufacturers have continuously invested in the development of thin heat pipes or vapor chamber products as the future direction of industrial development, and have released ultra-thin heat pipes or vapor chambers with a thickness of less than 1mm. The operating principles of heat pipes and vapor chambers are similar, so their design principles are almost the same. However, compared to the limited width of thin heat pipes, which can only be changed in one-dimensional length direction, the advantage of thin temperature spreaders is that their area can be changed according to needs, so the design variability is very high, and it can be regarded as a two-dimensional temperature spreader. For example, the Industrial Technology Research Institute has developed a silicon-based thin temperature spreader using a micro-electromechanical process, which uses a silicon wafer as a substrate to etch a micron-level capillary structure. Other companies also use etching processes to prepare traditional metal temperature spreaders, but because the etching liquid used in the etching process is very environmentally unfriendly, how to use other environmentally friendly processes that do not damage the environment to thin the temperature spreader has become a problem that the industry needs to overcome urgently. Summary of the invention

[0005] In view of the deficiencies of the aforementioned known technologies, the inventor of the present invention, after years of practical experience in the design and manufacture of precision ceramic technology industrial products, has successfully developed the present invention after continuous research and improvement and has made it public.

[0006] The main purpose of the present invention is to provide a method for manufacturing an ultra-thin temperature equalizing plate. The method for manufacturing an ultra-thin temperature equalizing plate comprises selecting a thermally conductive metal powder (preferably coarser particles), mixing the aforementioned thermally conductive metal powder with a solvent suitable for screen printing to form a mixture, printing the aforementioned mixture on a thin thermally conductive first metal plate by screen printing to form a support portion of a predetermined height, area and shape, sintering the first metal plate manufactured by the aforementioned process to form a porous structure of the support portion and combining it with the first metal plate, welding and sealing the first metal plate sintered by the aforementioned process and a thin thermally conductive second metal plate, and then vacuuming and injecting a working fluid to form an ultra-thin temperature equalizing plate.

[0007] In the present invention, a porous structure layer is first sintered with heat-conducting metal powder on the inner end surface of the second metal plate, and then welded and sealed with the first metal plate to increase the efficiency of heat expansion and temperature uniformity.

[0008] The aforementioned heat-conductive metal powder of the present invention is copper powder.

[0009] The first metal plate and the second metal plate of the present invention are sealed by diffusion welding.

[0010] Another main purpose of the present invention is to provide an ultra-thin temperature equalizing plate, which mainly includes a thin heat-conductive first metal plate and a second metal plate, wherein a working space is provided between the first metal plate and the second metal plate, and an inner end surface of the first metal plate has a supporting portion of a predetermined height, area and shape formed by screen printing, wherein the supporting portion is a porous structure sintered from heat-conductive metal powder, and the aforementioned supporting portion is welded to the relative inner end surface of the second metal plate when sealing the first metal plate and the second metal plate, and by sealing the first metal plate and the second metal plate, a plurality of interlaced channels are formed in the internal working spaces of the first metal plate and the second metal plate, and then the working space is evacuated and an appropriate amount of working fluid is injected to form an ultra-thin temperature equalizing plate, and since the supporting portion is a heat-conductive powder sintered to form a porous structure, the working fluid is adsorbed by the supporting portion with the porous structure, and better capillary phenomenon is provided during operation to accelerate the diffusion of temperature, thereby having a more efficient temperature equalizing effect.

[0011] The inner end surface of the second metal plate of the present invention has a porous structure layer formed by sintering heat-conducting metal powder to increase the efficiency of heat expansion and temperature uniformity.

[0012] The aforementioned heat-conductive metal powder of the present invention is copper powder. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A top view of an embodiment of the present invention;

[0014] Figure 2 It is a partial assembly cross-sectional view of an embodiment of the present invention;

[0015] Figure 3It is a partial assembly cross-sectional view of another embodiment of the present invention.

[0016] Explanation of symbols in the accompanying drawings:

[0017] 1 ultra-thin temperature plate; 2 first metal plate; 3 second metal plate; 30 porous structure layer; 4 working space; 40 channel; 5 support part. DETAILED DESCRIPTION

[0018] In order to achieve the technical means for the aforementioned purpose of the present invention, an embodiment is now listed and described with reference to the drawings as follows.

[0019] The ultra-thin heat spreader of the present invention generally refers to a heat spreader with a thickness of less than 1 mm and flexibility (bending), which is called a soft heat spreader and can be applied to thin and light mobile devices such as mobile phones.

[0020] The manufacturing method of the ultra-thin temperature equalizing plate of the present invention is as follows:

[0021] Use thermally conductive metal powder (coarser particles are preferred);

[0022] Mixing the aforementioned thermally conductive metal powder with a solvent suitable for screen printing to form a mixture;

[0023] The mixture is printed on a thin heat-conductive first metal plate by screen printing to form a support portion (such as Figure 1 The shape and area of ​​the support portion shown are designed to match the temperature-averaging component to be bonded);

[0024] The first metal plate manufactured by the aforementioned process is sintered to form a porous structure on the support portion and combined with the first metal plate, and the solvent mixed in the screen printing is burned off, and the working fluid is adsorbed by the porous structure support portion, which has a better capillary phenomenon during operation to accelerate the diffusion of temperature and has a more efficient temperature equalization effect. In addition, the support portion can prevent the surface of the first metal plate and the second metal plate from being dented during the subsequent vacuum degassing operation inside the temperature equalization plate, and prevent the temperature equalization plate from being unable to achieve flat contact between the surfaces when contacting the surface of the electronic heating component due to the aforementioned dent problem, thereby affecting the thermal conductivity efficiency;

[0025] The first metal plate sintered by the above process is welded and sealed with the thin heat-conductive second metal plate;

[0026] After vacuuming and injecting working fluid, an ultra-thin temperature equalizing plate is produced.

[0027] In the present invention, a porous structure layer is first sintered with heat-conducting metal powder on the inner end surface of the second metal plate, and then welded and sealed with the first metal plate to increase the efficiency of heat expansion and temperature uniformity.

[0028] The aforementioned heat-conductive metal powder of the present invention is copper powder.

[0029] The first metal plate and the second metal plate of the present invention are sealed by diffusion welding. Diffusion welding is a solid-state bonding technology that uses high temperature and pressure in a vacuum environment to make the distance between the contact surfaces of the two workpieces reach the atomic distance, so that the atoms are embedded and diffused and bonded with each other, thereby bonding metal and / or ceramic parts. Compared with traditional welding technology, diffusion welding can make the joint surface stronger and reduce deformation.

[0030] See also Figure 1 The top view of the embodiment of the present invention and Figure 2 The embodiment of the present invention is partially assembled in a cross-sectional view. It can be seen from the figure that the ultra-thin temperature equalizing plate 1 of the present invention mainly includes a first metal plate 2 and a second metal plate 3 that are thin and heat-conductive. There is a working space 4 between the first metal plate 2 and the second metal plate 3. The inner end surface of the first metal plate 2 has a support portion 5 (such as a support portion 5) of a predetermined height, area and shape formed by screen printing. Figure 1 The shape and area of ​​the support portion 5 shown in the embodiment are designed to match the temperature-averaging component to be bonded). The support portion 5 is a porous structure sintered with heat-conducting metal powder. The support portion 5 is welded to the inner end surface of the second metal plate 3 when the first metal plate 2 and the second metal plate 3 are sealed. By sealing the first metal plate 2 and the second metal plate 3, the internal working space 4 of the first metal plate 2 and the second metal plate 3 forms a plurality of interlaced channels 40, which are then evacuated and injected with an appropriate amount of working fluid to form an ultra-thin temperature-averaging plate. 1. Since the support part 5 is a porous structure formed by sintering a heat-conducting powder, the support part 5 with the porous structure absorbs the working fluid, and has a better capillary phenomenon during operation, which can accelerate the diffusion of temperature and has a more efficient temperature equalization effect. In addition, the support part 5 can avoid the subsequent vacuum degassing operation inside the temperature equalization plate, which may cause the surface of the first metal plate 2 and the second metal plate 3 to be concave, thereby preventing the temperature equalization plate from being unable to achieve surface-to-surface flat contact due to the aforementioned concave problem when contacting the surface of the electronic heating component, thereby affecting the thermal conductivity efficiency.

[0031] See also Figure 3 As shown, the inner end surface of the second metal plate 3 of the present invention has a porous structure layer 30 formed by sintering heat-conducting metal powder (such as copper powder) to increase the efficiency of heat expansion and temperature uniformity.

[0032] The aforementioned heat-conductive metal powder of the present invention is copper powder.

[0033] The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Any alternative method or equivalent structural change made by a person familiar with the art using the present specification and the scope of the patent application should be included in the patent scope of the present invention.

Claims

1. A method for manufacturing an ultra-thin temperature averaging board, for manufacturing an ultra-thin temperature averaging board with a thickness of less than 1 mm, wherein the ultra-thin temperature averaging board is a flexible soft temperature averaging board, characterized in that: The manufacturing method of the ultra-thin temperature equalizing plate is as follows: Use thermally conductive metal powder; Mixing the thermally conductive metal powder with a solvent suitable for screen printing to form a mixture; Printing the mixture on a thin, heat-conductive first metal plate by screen printing to form a support portion with a predetermined height, area and shape; Sintering the first metal plate manufactured by the aforementioned process so that the support portion forms a porous structure and is combined with the first metal plate; A porous structure layer is first sintered on the inner end surface of the thin heat-conducting second metal plate using heat-conducting metal powder; The first metal plate and the second metal plate sintered in the above process are welded and sealed by diffusion welding; After vacuuming and injecting working fluid, an ultra-thin temperature equalizing plate is produced.

2. The method for manufacturing an ultra-thin temperature equalizing plate according to claim 1, characterized in that: The heat-conducting metal powder is copper powder.

3. An ultra-thin temperature averaging board, wherein the ultra-thin temperature averaging board has a thickness of less than 1 mm and is a flexible soft temperature averaging board, characterized in that: It includes a thin heat-conductive first metal plate and a second metal plate, with a working space between the first metal plate and the second metal plate. The inner end surface of the first metal plate has a supporting portion of a predetermined height, area and shape formed by screen printing, and the supporting portion is a porous structure sintered by heat-conductive metal powder. The inner end surface of the second metal plate has a porous structure layer formed by sintering heat-conductive metal powder. When sealing the first metal plate and the second metal plate, the supporting portion is welded to the relative inner end surface of the second metal plate to form a plurality of staggered channels in the internal working space of the first metal plate and the second metal plate, and then the working space is evacuated and the working fluid is injected.

4. The ultra-thin temperature equalizing plate according to claim 3, characterized in that: The heat-conducting metal powder is copper powder.

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