A processing device

Abstract

The present invention discloses a processing device. The processing device comprises a first die, a second die and an intermediate die, the first die comprises a first die surface, the first die is movable along the height direction of the processing device, the second die comprises a second die surface, the intermediate die comprises a first intermediate surface and a second intermediate surface, the intermediate die is detachably connected to the first die and the second die, in a first state where the intermediate die is connected to the first die, the second intermediate surface and the second die surface are used for die pressing, and in a second state where the intermediate die is separated from the first die, the first intermediate surface and the first die surface are used for die pressing. According to the processing device of the present invention, both door sills and door lintels can be produced, labor costs are saved, equipment and mold costs are reduced, operation efficiency is improved, and production cycle requirements are met.

Description

Technical Field

[0001] The invention relates to the technical field of container production, and in particular to a processing device. Background Art

[0002] In the process of processing the existing container lintels and door thresholds, due to the limited equipment of the factory, it is impossible to produce the lintels and door thresholds separately. In actual production, since the lintels and door thresholds are produced on the same machine tool, there is a lot of mold change time, which wastes production hours and is not conducive to labor cost control.

[0003] Therefore, it is necessary to provide a processing device to at least partially solve the above problems. Summary of the invention

[0004] A series of simplified concepts are introduced in the Summary of the Invention, which will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0005] In order to at least partially solve the above problem, according to a first aspect of the present invention, a processing device is provided, the processing device comprising:

[0006] a first die member, the first die member comprising a first die surface, the first die member being movable along a height direction of the processing device;

[0007] a second die member, the second die member comprising a second die surface; and

[0008] an intermediate die, the intermediate die being arranged between the first die and the second die along the height direction, the intermediate die comprising a first intermediate surface and a second intermediate surface opposite to each other along the height direction, the first intermediate surface facing the first die surface, the second intermediate surface facing the second die surface,

[0009] wherein the intermediate die is detachably connected to the first die and the second die,

[0010] In a first state in which the intermediate die member is connected to the first die member, the intermediate die member is movable with the movement of the first die member so that the intermediate die member is separable from the second die member to perform die molding using the second intermediate surface and the second die surface,

[0011] In a second state in which the intermediate die member is separated from the first die member, the intermediate die member is separable from the first die member to perform die molding using the first intermediate surface and the first die surface.

[0012] According to the processing device of the present invention, both door sills and door lintels can be produced, and during the production process, the production of door sills and door lintels can be quickly switched without lifting and changing molds, which saves labor costs, reduces investment in equipment and mold costs, improves operating efficiency, and meets the requirements of production rhythm.

[0013] Optionally, the first die surface comprises a first end and a second end opposite to each other in a width direction of the processing device, the first end being higher than the second end in the height direction, and / or,

[0014] The second die surface includes a third end portion and a fourth end portion opposite to each other along the width direction, and the third end portion is higher than the fourth end portion along the height direction.

[0015] Optionally, it also includes a connecting component, which includes a first connecting hole, a second connecting hole, an intermediate connecting hole and a connecting plate, the first connecting hole is arranged on the first die, the second connecting hole is arranged on the second die, the intermediate connecting hole is arranged on the intermediate die, and the connecting plate is respectively connected to the first connecting hole and the second connecting hole.

[0016] Optionally, the connecting plate includes a first matching hole and a second matching hole, the first matching hole is located above the second matching hole along the height direction, the first matching hole is connected to the first connecting hole, and the second matching hole is connected to the middle connecting hole.

[0017] Optionally, the connecting plate includes a first matching hole and a second matching hole, the first matching hole is located above the second matching hole along the height direction, the first matching hole is connected to the middle connecting hole, and the second matching hole is connected to the second connecting hole.

[0018] Optionally, at least two of the connecting components are included, and the at least two connecting components are spaced apart along the length direction of the processing device.

[0019] Optionally, the first die, the second die and the intermediate die each include two opposite side surfaces along the width direction of the processing device, the first connecting holes on the two side surfaces of the first die are completely staggered along the width direction of the processing device, the second connecting holes on the two side surfaces of the second die are completely staggered along the width direction of the processing device, and the intermediate connecting holes on the two side surfaces of the intermediate die are completely staggered along the width direction of the processing device.

[0020] Optionally, a driving member is further included, wherein the driving member is connected to the first die component to drive the first die component to move. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The following drawings of the present invention are used as part of the present invention for understanding the present invention. The drawings show the embodiments of the present invention and their descriptions, and are used to explain the device and principle of the present invention. In the drawings,

[0022] Figure 1 is a longitudinal cross-section of the threshold;

[0023] Figure 2 It is a longitudinal section of the lintel board;

[0024] Figure 3 A front view of a processing device according to a preferred embodiment of the present invention; and

[0025] Figure 4 for Figure 3 Right side view of the processing device shown.

[0026] Description of reference numerals:

[0027] 110: Threshold 111: First threshold surface

[0028] 112: Second threshold surface 120: Door lintel

[0029] 121: First lintel 122: Second lintel

[0030] 130: Processing device 140: First die

[0031] 141: first die surface 142: first end portion

[0032] 143: Second end 150: Second die piece

[0033] 151: Second die surface 152: Third end portion

[0034] 153: fourth end 160: intermediate die

[0035] 161: First intermediate surface 162: Second intermediate surface

[0036] 170: Connecting assembly 171: First connecting hole

[0037] 172: Second connection hole 173: Middle connection hole

[0038] 174: Connecting plate 175: First matching hole

[0039] 176: Second matching hole DETAILED DESCRIPTION

[0040] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0041] In order to fully understand the present invention, a detailed structure will be presented in the following description to illustrate the present invention. Obviously, the implementation of the present invention is not limited to the specific details familiar to those skilled in the art. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other embodiments and should not be construed as being limited to the embodiments presented here.

[0042] It should be understood that the purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present invention. The singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. When the terms "comprise" and / or "include" are used in this specification, they indicate the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof. The terms "upper", "lower", "front", "back", "left", "right" and similar expressions used in the present invention are for illustrative purposes only and are not limiting.

[0043] Ordinal numbers such as "first" and "second" cited in the present invention are merely identifications and do not have any other meanings, such as a specific order, etc. Moreover, for example, the term "first component" itself does not imply the existence of the "second component", and the term "second component" itself does not imply the existence of the "first component".

[0044] Hereinafter, specific embodiments of the present invention will be described in more detail with reference to the accompanying drawings. These drawings show representative embodiments of the present invention and do not limit the present invention.

[0045] like Figure 3 and Figure 4 As shown, the present invention provides a processing device 130 of a preferred embodiment, and the processing device 130 is used to process the threshold and lintel of a container. Figure 1 As shown, the threshold 110 of the container may include a first threshold surface 111 and a second threshold surface 112 opposite to each other, and both the first threshold surface 111 and the second threshold surface 112 may be configured as bent surfaces. Figure 2As shown, the lintel plate 120 of the container may include a first lintel surface 121 and a second lintel surface 122 opposite to each other, and the first lintel surface 121 and the second lintel surface 122 may also be configured as bent surfaces. The processing device 130 provided by the present invention may fold a flat plate to form a bent threshold 110, or may fold a flat plate to form a bent lintel plate 120. When alternately producing the threshold 110 and the lintel, there is no need to replace parts, which greatly improves production efficiency.

[0046] Specifically, Figure 3 As shown, the processing device 130 includes a first die 140, a second die 150 and an intermediate die 160, and the intermediate die 160 is arranged between the first die 140 and the second die 150 along the height direction of the processing device 130. The first die 140 is located above the intermediate die 160 along the height direction of the processing device 130, and the intermediate die 160 is located above the second die 150 along the height direction of the processing device 130. The first die 140 can be movable along the height direction of the processing device 130. Optionally, the processing device 130 includes a driving member, which can be a cylinder. The driving member can be connected to the first die 140, and the driving member can drive the first die 140 to move along the height direction of the processing device 130.

[0047] The intermediate die 160 is detachably connected to the first die 140 and the second die 150. The intermediate die 160 can be connected to the second die 150, the first die 140 and the intermediate die 160 can be spaced apart, a flat plate can be placed between the first die 140 and the intermediate die 160, and the first die 140 can move along the height direction of the processing device 130 to fold the flat plate to form the threshold 110. The intermediate die 160 can be connected to the first die 140, the intermediate die 160 is spaced apart from the second die 150, the flat plate can be placed between the intermediate die 160 and the second die 150, and the first die 140 can drive the intermediate die 160 to move along the height direction of the processing device 130 to fold the flat plate to form the lintel board 120.

[0048] Specifically, the first die 140 includes a first die surface 141, the second die 150 includes a second die surface 151, and the intermediate die 160 includes a first intermediate surface 161 and a second intermediate surface 162 opposite to each other along the height direction of the processing device 130. The first intermediate surface 161 faces the first die surface 141, and the second intermediate surface 162 faces the second die surface 151.

[0049] In the first state where the intermediate die member 160 is connected to the first die member 140, the intermediate die member 160 can be moved along with the movement of the first die member 140, so that the intermediate die member 160 can be separated from the second die member 150, thereby performing die molding using the second intermediate surface 162 and the second die surface 151. The first lintel surface 121 and the second lintel surface 122 of the door lintel can match the shapes of the second intermediate surface 162 and the second die surface 151, respectively. The flat plate is placed between the middle die 160 and the second die 150. The driving component can drive the first die 140 to drive the middle die 160 to move along the height direction of the processing device 130 toward the second die 150. The second middle surface 162 and the second die surface 151 respectively fold the flat plate so that the flat plate is bent toward the plane of the second middle surface 162 and the flat plate is bent toward the plane of the second die surface 151. Finally, the two planes of the flat plate are respectively processed to form the first lintel surface 121 and the second lintel surface 122 of the lintel plate 120.

[0050] Of course, the first threshold surface 111 and the second threshold surface 112 of the threshold 110 can be matched with the shapes of the second middle surface 162 and the second die surface 151, respectively. The flat plate is placed between the middle die 160 and the second die 150, and the driving member can drive the first die 140 to drive the middle die 160 to move along the height direction of the processing device 130 toward the second die 150, and the second middle surface 162 and the second die surface 151 respectively fold the flat plate, so that the flat plate is bent toward the plane of the second middle surface 162, and the flat plate is bent toward the plane of the second die surface 151, so that the two planes of the flat plate are processed to form the first threshold surface 111 and the second threshold surface 112 of the threshold 110, respectively.

[0051] In the second state where the intermediate die 160 is separated from the first die 140, the intermediate die 160 is separable from the first die 140, and the intermediate die 160 is connected to the second die 150 to perform die pressing using the first die surface 141 and the first intermediate surface 161. The first threshold surface 111 and the second threshold surface 112 of the threshold 110 can match the shapes of the first die surface 141 and the first intermediate surface 161, respectively. The flat plate is placed between the first die 140 and the intermediate die 160, and the driving member can drive the first die 140 to move toward the intermediate die 160 along the height direction of the processing device 130, and the first die surface 141 and the first intermediate surface 161 respectively fold the flat plate, so that the flat plate is bent toward the plane of the first die surface 141, and the flat plate is bent toward the plane of the first intermediate surface 161, and finally the two planes of the flat plate are processed to form the first threshold surface 111 and the second threshold surface 112 of the threshold 110, respectively.

[0052] Of course, the first lintel surface 121 and the second lintel surface 122 of the lintel plate 120 can be matched with the shapes of the first die surface 141 and the first intermediate surface 161, respectively. The flat plate is placed between the first die 140 and the intermediate die 160, and the driving member can drive the first die 140 to move along the height direction of the processing device 130 toward the intermediate die 160, and the first die surface 141 and the first intermediate surface 161 respectively fold the flat plate, so that the flat plate is bent toward the plane of the first intermediate surface 161, and the flat plate is bent toward the plane of the first die surface 141, so that the two planes of the flat plate are processed to form the first lintel surface 121 and the second lintel surface 122 of the lintel plate 120, respectively.

[0053] In this embodiment, the thickness direction of the plate is parallel to the height direction of the processing device 130, and the length direction of the plate is parallel to the length direction of the processing device 130. Figure 3 The length direction of the processing device shown may be a direction perpendicular to the paper surface, and the width direction of the plane may be parallel to the width direction of the processing device 130 .

[0054] According to the processing device of the present invention, both door sills and door lintels can be produced, and during the production process, the production of door sills and door lintels can be quickly switched without lifting and changing molds, which saves labor costs, reduces investment in equipment and mold costs, improves operating efficiency, and meets the requirements of production rhythm.

[0055] Further, in order to make the intermediate die 160 detachably connected to the first die 140 and the second die 150, respectively, the processing device 130 further includes a connecting assembly 170, and the connecting assembly 170 includes a first connecting hole 171, a second connecting hole 172, an intermediate connecting hole 173 and a connecting plate 174. The first connecting hole 171 is provided on the first die 140, and the extending direction of the first connecting hole 171 can be parallel to the width direction of the processing device 130. The first connecting hole 171 can be a threaded hole. The second connecting hole 172 is provided on the second die 150, and the extending direction of the second connecting hole 172 can be parallel to the width direction of the processing device 130. The second connecting hole 172 can be a threaded hole. The intermediate connecting hole 173 is provided on the intermediate die 160, and the extending direction of the intermediate connecting hole 173 can be parallel to the width direction of the processing device 130. The intermediate connecting hole 173 can also be a threaded hole.

[0056] The connecting plate 174 can be connected to the first connecting hole 171 and the second connecting hole 172 respectively to detachably connect the intermediate die 160 to the first die 140 and the second die 150. The projections of the first connecting hole 171, the intermediate connecting hole 173 and the second connecting hole 172 along the height direction of the processing device 130 can overlap to ensure that the connecting plate 174 can be connected to the first connecting hole 171 and the second connecting hole 172 respectively.

[0057] Specifically, combined Figure 4 As shown, the connecting plate 174 includes a first matching hole 175 and a second matching hole 176, and the first matching hole 175 and the second matching hole 176 can both be threaded holes. The extension direction of the first matching hole 175 and the second matching hole 176 can be parallel to the width direction of the processing device 130. The first matching hole 175 is located above the second matching hole 176 along the height direction of the processing device 130. In the first state where the intermediate die 160 is connected to the first die 140, the distance between the first connecting hole 171 and the intermediate connecting hole 173 along the height direction of the processing device 130 is equal to the distance between the first matching hole 175 and the second matching hole 176 of the connecting plate 174.

[0058] The first matching hole 175 of the connecting plate 174 is connected to the first connecting hole 171 on the first die 140 through a connecting piece, and the second matching hole 176 of the connecting plate 174 is connected to the middle connecting hole 173 on the intermediate die 160 through a connecting piece. Preferably, the outer peripheral surface of the connecting piece can be provided with an external thread, and the external thread can be engaged with the internal thread of the threaded hole. In this way, the intermediate die 160 is connected to the first die 140, and the intermediate die 160 can move along the height direction of the processing device 130 with the first die 140, and the second intermediate surface 162 and the second die surface 151 are used for die pressing.

[0059] In the second state where the intermediate die 160 is separated from the first die 140, the distance between the second connection hole 172 and the intermediate connection hole 173 along the height direction of the processing device 130 is equal to the distance between the first matching hole 175 and the second matching hole 176 of the connection plate 174. The first matching hole 175 of the connection plate 174 is connected to the intermediate connection hole 173 on the intermediate die 160 through a connecting member, and the second matching hole 176 of the connection plate 174 is connected to the second connection hole 172 on the second die member through a connecting member. In this way, the intermediate die 160 and the second die 150 are connected together, and die-molding is performed using the first intermediate surface 161 and the first die surface 141. Preferably, the outer peripheral surface of the connecting member may be provided with an external thread, and the external thread may be engaged with the internal thread of the threaded hole.

[0060] In order to ensure the stability of the connection, Figure 4As shown, the processing device 130 includes at least two connecting assemblies 170, and the at least two connecting assemblies 170 can be arranged at intervals along the length direction of the processing device 130. In this way, the connection between the intermediate die 160 and the first die 140 is ensured to be firm, and the intermediate die 160 is prevented from falling when moving with the first die 140, thereby improving safety.

[0061] Return now Figure 3 The first die surface 141 can press the first sill surface 111 of the threshold 110, and the first middle surface 161 can press the second sill surface 112 of the threshold 110. The second middle surface 162 can press the first lintel surface 121 of the door lintel, and the second die surface 151 can press the second lintel surface 122 of the door lintel. The first die surface 141 includes a first end 142 and a second end 143 opposite to each other along the width direction of the processing device 130, and the first end 142 is higher than the second end 143 along the height direction of the processing device 130 to prevent the flat plate from breaking during the process of folding and pressing to form the threshold 110. The second die surface 151 includes a third end 152 and a fourth end 153 opposite to each other along the width direction of the processing device 130, and the third end 152 is higher than the fourth end 153 along the height direction of the processing device 130 to prevent the flat plate from breaking during the process of folding and pressing to form the door lintel plate 120.

[0062] The first die 140 includes two opposite side surfaces along the width direction of the processing device 130, and the first connection holes 171 are provided on both side surfaces of the first die 140. The first end 142 of the first die surface 141 is higher than the second end 143 along the height direction of the processing device 130. In order to ensure that the connection plate 174 is smoothly connected to the first connection hole 171 and the intermediate connection hole 173, the first connection holes 171 on the two side surfaces of the first die 140 are completely staggered along the width direction of the processing device 130. For example, the first connection hole 171 of one of the two side surfaces of the first die 140 can be higher than the first connection hole 171 of the other of the two side surfaces along the height direction of the processing device 130. In this way, in the first state where the intermediate die 160 is connected to the first die 140, it is ensured that the connection plate 174 can be connected to the first connection hole 171 of the first die 140.

[0063] Accordingly, the intermediate die 160 includes two opposite side surfaces along the width direction of the processing device 130, and both side surfaces of the intermediate die 160 are provided with intermediate connection holes 173. The intermediate connection holes 173 on the two side surfaces of the intermediate die 160 are completely staggered along the width direction of the processing device 130. For example, the intermediate connection hole 173 on one of the two side surfaces of the intermediate die 160 can be higher than the intermediate connection hole 173 on the other of the two side surfaces along the height direction of the processing device 130. In this way, in the first state where the intermediate die 160 is connected to the first die 140, it is ensured that the connection plate 174 can be connected to the intermediate connection hole 173.

[0064] Of course, the second die 150 includes two opposite side surfaces along the width direction of the processing device 130, and the second connection holes 172 are provided on both side surfaces of the second die 150. The third end 152 of the second die surface 151 is higher than the fourth end 153 along the height direction of the processing device 130. In order to ensure that the connection plate 174 is smoothly connected to the second connection hole 172 and the intermediate connection hole 173, the second connection holes 172 on the two side surfaces of the second die 150 are completely staggered along the width direction of the processing device 130. For example, the second connection hole 172 on one of the two side surfaces of the second die 150 can be higher than the second connection hole 172 on the other side surface along the height direction of the processing device 130. In this way, in the second state where the intermediate die 160 is separated from the first die 140, the intermediate die 160 is connected to the second die 150, and the second connection hole 172 is connected to the intermediate connection hole 173, so that the connection plate 174 can be connected to the second connection hole 172 of the second die 150.

[0065] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art in the technical field of the present invention. The terms used herein are only for describing specific implementation purposes and are not intended to limit the present invention. Terms such as "parts" and "pieces" appearing in this article may represent either a single part or a combination of multiple parts. Terms such as "installation" and "setting" appearing in this article may represent either a component being directly attached to another component or a component being attached to another component through an intermediate. Features described in this article in one embodiment may be applied to another embodiment alone or in combination with other features, unless the feature is not applicable in the other embodiment or otherwise specified.

[0066] The present invention has been described through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and description, and are not intended to limit the present invention to the scope of the described embodiments. In addition, it can be understood by those skilled in the art that the present invention is not limited to the above-mentioned embodiments, and more variations and modifications can be made according to the teachings of the present invention, and these variations and modifications all fall within the scope of the protection claimed by the present invention. The protection scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A processing device, characterized in that: The processing device comprises: a first die member, the first die member comprising a first die surface, the first die member being movable along a height direction of the processing device; a second die member, the second die member comprising a second die surface; and an intermediate die, the intermediate die being arranged between the first die and the second die along the height direction, the intermediate die comprising a first intermediate surface and a second intermediate surface opposite to each other along the height direction, the first intermediate surface facing the first die surface, the second intermediate surface facing the second die surface, wherein the intermediate die is detachably connected to the first die and the second die, In a first state in which the intermediate die member is connected to the first die member, the intermediate die member is movable with the movement of the first die member so that the intermediate die member is separable from the second die member to perform die molding using the second intermediate surface and the second die surface, In a second state in which the intermediate die member is separated from the first die member, the intermediate die member is separable from the first die member to perform die molding using the first intermediate surface and the first die surface.

2. The processing device according to claim 1, characterized in that: The first die surface comprises a first end and a second end opposite to each other in the width direction of the processing device, the first end is higher than the second end in the height direction, and / or, The second die surface includes a third end portion and a fourth end portion opposite to each other along the width direction, and the third end portion is higher than the fourth end portion along the height direction.

3. The processing device according to claim 1, characterized in that: It also includes a connecting component, which includes a first connecting hole, a second connecting hole, an intermediate connecting hole and a connecting plate, the first connecting hole is arranged on the first die, the second connecting hole is arranged on the second die, the intermediate connecting hole is arranged on the intermediate die, and the connecting plate is respectively connected to the first connecting hole and the second connecting hole.

4. The processing device according to claim 3, characterized in that: The connecting plate includes a first matching hole and a second matching hole, the first matching hole is located above the second matching hole along the height direction, the first matching hole is connected to the first connecting hole, and the second matching hole is connected to the middle connecting hole.

5. The processing device according to claim 3, characterized in that: The connecting plate includes a first matching hole and a second matching hole, the first matching hole is located above the second matching hole along the height direction, the first matching hole is connected to the middle connecting hole, and the second matching hole is connected to the second connecting hole.

6. The processing device according to claim 3, characterized in that: It comprises at least two connecting components, and the at least two connecting components are arranged at intervals along the length direction of the processing device.

7. The processing device according to claim 3, characterized in that: The first die, the second die and the intermediate die each include two opposite side surfaces along the width direction of the processing device, the first connecting holes on the two side surfaces of the first die are completely staggered along the width direction of the processing device, the second connecting holes on the two side surfaces of the second die are completely staggered along the width direction of the processing device, and the intermediate connecting holes on the two side surfaces of the intermediate die are completely staggered along the width direction of the processing device.

8. The processing device according to claim 1, characterized in that: Also included is a driving member connected to the first die member to drive the first die member to move.

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