Substrate pickup device and substrate pickup method

Abstract

A substrate pickup device and a substrate pickup method that reduce the following of other substrates when picking up a substrate. The substrate pickup device is a device that picks up a unit substrate from among a plurality of unit substrates arranged on a placement table, and includes a suction hand and a controller. The suction hand is attached to a robot arm. The suction hand includes a presser that presses a first corner scrap and a second corner scrap of a unit substrate that is a pickup target from above, and a suction portion main body that is movable upward obliquely with respect to the presser and is used to suction the unit substrate that is the pickup target from above. The controller performs the following steps: a step of causing the presser to press the first corner scrap and the second corner scrap from above; a step of causing the suction portion main body to suction the unit substrate that is the pickup target; and a step of picking up the unit substrate that is the pickup target by moving the suction portion main body so as to move away upward obliquely with respect to the presser.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate pickup device and a substrate pickup method, and particularly relates to a substrate pickup device and a substrate pickup method that pick up a substrate and separate it from another substrate. BACKGROUND

[0002] Generally, in a manufacturing process of a liquid crystal panel, a large-sized mother glass substrate that is patterned with a plurality of unit display panels (unit substrates) as a manufacturing unit is manufactured, and then is divided into each unit display panel. Specifically, a pair of upper and lower scribes are used to score both surfaces of the mother glass substrate from the upper and lower directions at the same time, and then are separated from both surfaces at the same time, thereby dividing into each unit display panel. Excess portions are provided between the unit display panels, and become scraps after being cut off.

[0003] When picking up the unit substrates, a single substrate is adsorbed by an adsorption hand and is picked up by being lifted straight upward (for example, refer to Patent Literature 1).

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 2019-107779

[0007] However, in the above-described pickup method, depending on the state of the scoring, there is a problem that the other unit substrate adjacent to the picked-up unit substrate is lifted together. SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] An object of the present application is to reduce the following of the other substrate when picking up a substrate in a substrate pickup device.

[0010] SOLUTION TO THE PROBLEM

[0011] Hereinafter, a plurality of modes will be described as a solution to the problem. These modes can be arbitrarily combined as needed.

[0012] A substrate pickup device according to one aspect of the present application is a device that picks up one substrate from a plurality of substrates arranged on a flat plate, and includes an adsorption hand and a control section.

[0013] The adsorption hand is attached to a robot arm. The adsorption hand has a pressing member that presses a scrap of a substrate to be picked up from above, and an adsorption section that is movable upward obliquely with respect to the pressing member and is used to adsorb the substrate to be picked up from above.

[0014] The control section performs the following steps.

[0015] a step of pressing the edge scraps from above by the pressing member.

[0016] a step of adsorbing the substrate to be picked up from above by the adsorption portion.

[0017] a step of picking up the substrate to be picked up by moving the adsorption portion away from the pressing member toward the obliquely upper side.

[0018] In this apparatus, the adsorption hand is lifted obliquely upward in a state where the edge scraps of the substrate are pressed by the pressing member of the adsorption hand, thereby lifting the substrate. Thus, it is possible to prevent the adjacent other substrate of the substrate to be picked up from being attracted and lifted. As a result, it is possible to prevent the substrate from being scratched, gapped, or the like at the time of picking up.

[0019] The substrate picking-up apparatus can further include a driving device for moving the adsorption portion in the oblique direction with respect to the pressing member.

[0020] The driving device can include a plurality of working cylinders.

[0021] The pressing member can have an L shape in plan view.

[0022] A substrate picking-up method according to another aspect of the present application is performed using a substrate picking-up apparatus. The substrate picking-up apparatus is an apparatus for picking up one substrate from a plurality of substrates arranged on a flat plate and includes an adsorption hand having a pressing member for pressing edge scraps of a substrate to be picked up from above and an adsorption portion capable of moving toward the obliquely upper side with respect to the pressing member and adsorbing the substrate to be picked up from above.

[0023] The substrate picking-up method includes the following steps.

[0024] a step of pressing the edge scraps from above by the pressing member.

[0025] a step of adsorbing the substrate to be picked up from above by the adsorption portion.

[0026] a step of picking up the substrate to be picked up by moving the adsorption portion away from the pressing member toward the obliquely upper side.

[0027] In this method, the adsorption hand is lifted obliquely upward in a state where the edge scraps of the substrate are pressed by the pressing member of the adsorption hand. Thus, it is possible to prevent the adjacent other substrate of the substrate to be picked up from being attracted and lifted. As a result, it is possible to prevent the substrate from being scratched, gapped, or the like at the time of picking up.

[0028] Effects of the Invention

[0029] In the substrate pickup device and the substrate pickup method of the present application, it is possible to reduce the following of other substrates when picking up a substrate. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a schematic perspective view of the pickup device of the first embodiment.

[0031] Figure 2 is a schematic perspective view of the suction hand.

[0032] Figure 3 is a schematic bottom view of the suction hand.

[0033] Figure 4 is a schematic perspective view of the substrate.

[0034] Figure 5 is a block diagram showing the control structure of the pickup device.

[0035] Figure 6 is a flowchart of the pickup operation of the pickup device.

[0036] Figure 7 is a schematic view showing the pickup operation of the pickup device.

[0037] Figure 8 is a schematic view showing the pickup operation of the pickup device.

[0038] Figure 9 is a schematic view showing the pickup operation of the pickup device.

[0039] Figure 10 is a schematic view showing the pickup operation of the pickup device.

[0040] Figure 11 is a schematic view showing the pickup operation of the pickup device.

[0041] Figure 12 is a schematic perspective view of the suction hand.

[0042] Figure 13 is a schematic top view of the suction hand.

[0043] Figure 14 is a schematic top view of the suction hand.

[0044] Figure 15 is a schematic side view of the suction hand.

[0045] Figure 16 is a schematic side view of the suction hand.

[0046] Figure 17 is a schematic perspective view of the substrate.

[0047] BRIEF DESCRIPTION OF THE DRAWINGS

[0048] 1: pickup device

[0049] 2: stage

[0050] 3: robot arm

[0051] 5: suction hand

[0052] 7: suction portion main body

[0053] 7a: suction hole

[0054] 9: pressing rod

[0055] 21: tilt driving device

[0056] 23: cylinder main body

[0057] 25: first rotation coupling portion

[0058] 27: second rotation coupling portion

[0059] 31: arm driving device

[0060] 33: negative pressure generating device

[0061] 51: controller

[0062] M: mother substrate

[0063] Ma1: first edge scrap

[0064] Ma2: second edge scrap

[0065] Ma3: third edge scrap

[0066] Ma4: fourth edge scrap

[0067] P: unit substrate

[0068] S: scribe line DETAILED DESCRIPTION

[0069] 1. First embodiment

[0070] (1) Structure of pickup device

[0071] Use Figures 1-4 The structure of the pickup device 1 (an example of a substrate pickup device) will be described. Figure 1 is a schematic perspective view of the pickup device of the first embodiment. Figure 2 is a schematic perspective view of the suction hand. Figure 3 is a schematic bottom view of the suction hand. Figure 4 is a schematic perspective view of the substrate.

[0072] In the present embodiment, the object to be cut is a mother substrate M. The mother substrate M is, for example, a bonded glass composed of two substrates. The upper and lower wheels of a scribing device (not shown) form scribe lines S on the two substrates.

[0073] As shown in Figure 4 , the mother substrate M has a plurality of unit substrates P. Specifically, four unit substrates P are shown in Figure 4 . Scraps are provided around the unit substrates P (including the boundaries with other unit substrates P).

[0074] For example, as shown in Figure 4 , a first scrap Ma1, a second scrap Ma2, a third scrap Ma3, and a fourth scrap Ma4 are provided around one unit substrate P1. The first scrap Ma1 and the second scrap Ma2 are provided at the boundaries of the unit substrate P1 with other unit substrates P. The third scrap Ma3 and the fourth scrap Ma4 constitute the outer edges of the mother substrate M.

[0075] The pickup device 1 is a device that picks up one unit substrate P from among the plurality of unit substrates P of the mother substrate M arranged on the placement table 2 Figure 7 . Specifically, the pickup device 1 performs a substrate cutting operation and a substrate suction and carrying operation.

[0076] As shown in Figure 1 , the pickup device 1 has a robot arm 3. The robot arm 3 is capable of raising and lowering a suction hand 5 (described later) and moving to the side using an arm drive device 31 Figure 5 . The arm drive device 31 includes, for example, a motor or the like.

[0077] The pickup device 1 has a suction hand 5 (an example of a suction hand). The suction hand 5 is a device that suctions and carries the mother substrate M. The suction hand 5 is attached to the front end of the robot arm 3.

[0078] The suction hand 5 has a suction portion main body 7 (an example of a suction portion). As shown in Figure 3 , a suction hole 7a is provided on the lower surface of the suction portion main body 7. The suction hole 7a suctions the mother substrate M as the pickup target from above. The suction hole 7a is connected to a negative pressure generating device 33 Figure 5 .

[0079] The suction hand 5 has a press bar 9 (an example of a pressing member). The press bar 9 presses the scrap Ma of the mother substrate M as the pickup target from above, specifically, the press bar 9 is lowered from the suction portion main body 7 and presses the scrap Ma of the mother substrate M to the placement table 2.

[0080] The press bar 9 is linked to the suction portion main body 7 so as to be movable in a tilting direction (described later). The press bar 9 has a flat bottom surface.

[0081] In the present embodiment, the pressing bar 9 is L-shaped in plan view. Specifically, the pressing bar 9 is disposed so as to approach or abut the outer sides of the two sides of the rectangular bottom surface of the suction portion main body 7.

[0082] The pickup device 1 has a tilt driving device 21. The tilt driving device 21 is a device that raises and lowers the suction portion main body 7 with respect to the pressing bar 9 in a manner inclined with respect to the vertical direction. In other words, the tilt driving device 21 moves the suction portion main body 7 and the pressing bar 9 with respect to each other in a manner inclined with respect to the vertical direction within a prescribed range (in plan view, in the first horizontal direction parallel to a straight line connecting the other corners from one corner of the rectangular bottom surface of the suction portion main body 7). The tilt driving device 21 is, for example, a pneumatic cylinder.

[0083] Specifically, the tilt driving device 21 has three pneumatic cylinders. The tilt driving device 21 is provided at the corners of the suction portion main body 7 and the side portions on both sides of the corners, respectively.

[0084] The tilt driving device 21 has a cylinder main body 23, a first rotationally linked portion 25 that rotationally links the upper portion of the cylinder main body 23 and the suction portion main body 7, and a second rotationally linked portion 27 that rotationally links the lower portion of the cylinder main body 23 and the pressing bar 9. The rotation axes of the first rotationally linked portion 25 and the second rotationally linked portion 27 extend in the second horizontal direction (a horizontal direction orthogonal to the first horizontal direction). Thus, by the action of the cylinder main body 23, the pressing bar 9 is able to move between an upper side position (a position in which the lower surface is higher than the lower surface of the suction portion main body 7) Figure 7 and Figure 8 ) and a lower side position (a position in which the lower surface is lower than the lower surface of the suction portion main body 7) Figure 10 and Figure 11 ).

[0085] (2) Control structure of pickup device

[0086] Using Figure 5 The control structure of the pickup device 1 will be described. Figure 5 is a block diagram showing the control structure of the pickup device.

[0087] The pickup device 1 has a controller 51 (an example of a control portion).

[0088] The controller 51 is a computer system having a processor (for example, a CPU), a storage device (for example, a ROM, a RAM, an HDD, an SSD, and the like), various interfaces (for example, an A / D converter, a D / A converter, a communication interface, and the like). The controller 51 performs various control actions by executing a program saved in a storage portion (corresponding to a part or all of the storage area of the storage device).

[0089] The controller 51 can be constituted by a single processor, but can also be constituted by a plurality of independent processors for each control.

[0090] Part or all of the functions of each element of the controller 51 can also be implemented as a program that can be executed by a computer system constituting the controller 51. Furthermore, part of the functions of each element of the controller 51 can also be constituted by a custom IC.

[0091] The controller 51 is connected with the arm driving device 31, the negative pressure generating device 33, and the tilt driving device 21.

[0092] A sensor that detects the size, shape, and position of the substrate, a sensor and a switch for detecting the state of each device, and an information input device are connected to the controller 51, but are not illustrated.

[0093] (3) Picking and substrate cutting operation of the picking device

[0094] Use Figures 6-16 The picking and substrate cutting operation of the picking device will be described.

[0095] Figure 6 is a flowchart of the picking operation of the picking device. Figures 7-11 is a schematic view showing the picking operation of the picking device. Figure 12 is a schematic perspective view of the suction hand. Figure 13 and Figure 14 is a schematic plan view of the suction hand. Figure 15 and Figure 16 is a schematic side view of the suction hand. Figure 17 is a schematic perspective view of the substrate.

[0096] The control flowchart described below is an example, and each step can be omitted and replaced as needed. In addition, a plurality of steps can be executed simultaneously, or a part or all of them can be executed overlappingly.

[0097] In addition, each module of the control flowchart is not limited to a single control operation, and can be replaced by a plurality of control operations represented by a plurality of modules.

[0098] Note that the operation of each device is the result of an instruction issued from the control unit to each device, and is represented by each step of the software, application program.

[0099] In step S1, a preparation operation of the suction hand 5 is performed. Specifically, as shown in Figure 7 , the suction hand 5 is moved above the stage 2 by the robot arm 3. At this time, the pressing rod 9 is positioned at the upper position. In addition, the mother substrate M is placed on the stage 2. Note that, in Figures 7-11In the present embodiment, only the unit substrate P1, the first edge scrap Ma1, and the second edge scrap Ma2 are shown for simplicity.

[0100] In step S2, as shown in Figure 8 , the suction hand 5 is lowered so that the lower surface comes into abutment with the mother substrate M. Specifically, the suction hole 7a is in close contact with the target unit substrate P of the mother substrate M.

[0101] In step S3, as shown in Figure 2 , Figure 9 , Figure 13 , Figure 15 , the presser 9 presses the edge scrap Ma from above. Specifically, the presser 9 is lowered relative to the suction portion main body 7 to move to a lower side position. More specifically, the presser 9 presses the first edge scrap Ma1 and the second edge scrap Ma2 of the unit substrate P. Figure 4

[0102] In step S4, as shown in Figure 9 , the suction hole 7a suctions the picked-up target unit substrate P of the mother substrate M. Specifically, the suction hole 7a suctions the unit substrate P using the negative pressure generating device 33.

[0103] In step S5, as shown in Figure 10 , Figure 12 , Figure 14 , Figure 16 , the inclined movement device 21 moves the suction portion main body 7 so as to move away from the presser 9 in an obliquely upward direction. At this time, the presser 9 maintains the state of pressing the first edge scrap Ma1 and the second edge scrap Ma2 of the mother substrate M from above. Therefore, as shown in Figure 17 , the unit substrate P is reliably cut from the first edge scrap Ma1 and the second edge scrap Ma2.

[0104] With the picking-up device 1, in a state where the presser 9 of the suction hand 5 is pressing the first edge scrap Ma1 and the second edge scrap Ma2 of the mother substrate M, the suction portion main body 7 of the suction hand 5 is lifted obliquely upward, thereby lifting the unit substrate P. Thus, adjacent other substrates of the picked-up target unit substrate P are prevented from being attracted and lifted. As a result, the unit substrate P can be prevented from being scratched, gapped, or the like at the time of picking-up.

[0105] Step S6 causes the unit substrate P1 to be carried out from the picking-up device 1. Specifically, as shown in Figure 11 , the suction portion main body 7 is further moved upward, thereby further lifting the unit substrate P1. At this time, the presser 9 is lifted together with the suction portion main body 7 and moves away from the first edge scrap Ma1 and the second edge scrap Ma2 in the upward direction.

[0106] ​As described above, after the cutting of the edge scraps Ma, the suction hand 5 is capable of sucking and carrying the unit substrate P of the mother substrate M to other devices. That is, without providing a driving device dedicated to the removal of the edge scraps, the unit substrate P can be picked up from the mother substrate M.

[0107] 2. Other Embodiments

[0108] The above describes one embodiment of the present application, but the present application is not limited to the above-described embodiment, and various modifications can be made within the scope of the gist of the present application. In particular, the plurality of embodiments and modified examples described in the present specification can be arbitrarily combined as needed.

[0109] (1) Modified Example of Pressing Rod

[0110] The number, shape, and position of the pressing rods are not limited to the first embodiment.

[0111] (2) Modified Example of Inclination Moving Device

[0112] The type, number, and position of the inclination moving devices are not particularly limited.

[0113] (3) Modified Example of Substrate

[0114] The bonded fragile material substrate in which two fragile material substrates are bonded includes a flat panel display such as a liquid crystal panel, a plasma display panel, and an organic EL display panel, in which a glass substrate is bonded; and a semiconductor substrate in which a silicon substrate or a sapphire substrate is bonded to a glass substrate.

[0115] The type of the substrate is not particularly limited. The substrate includes a single glass plate, a semiconductor wafer, and a ceramic substrate.

[0116] (4) Modified Example of Scribe Line

[0117] The shape of the scribe line is not limited. In the above-described embodiment, the scribe line is a straight line, but can have a curve in part or all.

[0118] Industrial Applicability

[0119] The present application can be widely applied to a substrate picking device and a substrate picking method for picking up a substrate and separating it from another substrate.

Claims

1. A substrate pickup device that is a device that picks up one substrate from among a plurality of substrates arranged on a flat plate, wherein the substrate pickup device is provided with a suction hand and a control section, the suction hand is attached to a robot arm and has a pressing member that presses a scarp between a substrate to be picked up and a substrate adjacent to the substrate from above, and a suction section that is movable to an obliquely upward direction with respect to the pressing member and is used to suction the substrate to be picked up from above, the control section performs a step of causing the pressing member to press the scarp from above, a step of causing the suction section to suction the substrate to be picked up, and a step of picking up the substrate to be picked up by moving the suction section so as to move away from the pressing member to an obliquely upward direction.

2. The substrate pickup device according to claim 1, wherein the substrate pickup device is further provided with a driving device that is used to move the suction section in a tilting direction with respect to the pressing member.

3. The substrate pickup device according to claim 2, wherein the driving device has a plurality of working cylinders.

4. The substrate pickup device according to any one of claims 1 to 3, wherein the pressing member has an L shape in plan view.

5. A substrate pickup method that is a method of picking up a substrate in a substrate pickup device that is a device that picks up one substrate from among a plurality of substrates arranged on a flat plate and is provided with a suction hand attached to a robot arm, the suction hand having a pressing member that presses a scarp between a substrate to be picked up and a substrate adjacent to the substrate from above, and a suction section that is movable to an obliquely upward direction with respect to the pressing member and is used to suction the substrate to be picked up from above, wherein the substrate pickup method is provided with: a step of causing the pressing member to press the scarp from above; a step of causing the suction section to suction the substrate to be picked up; and a step of picking up the substrate to be picked up by moving the suction section so as to move away from the pressing member to an obliquely upward direction. ​ ​ ​ ​ ​ ​ ​ ​

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