Electronic component testing device, replacement parts therefor, and socket

Abstract

The present invention provides an electronic component device capable of implementing near-field OTA testing of a DUT having an antenna. The electronic component testing device (1) comprises a socket (5) electrically connectable to a DUT (10), a carrier (4) and a tester (3), wherein the socket (5) comprises: a top socket (60) arranged to face the upper surface (11a) of the DUT (10) and electrically connectable to the DUT (10); and a bottom socket (70) abutting against the lower surface (11b) of the DUT (10) and electrically connectable to the top socket, and the bottom socket (70) comprises: a base (71) abutting against the lower surface (11b) of the DUT (10); and a test antenna (73) electrically connected to the tester (3) and arranged to face the device antenna (12).

Description

Technical Field

[0001] The present invention relates to an electronic component testing device for testing an electronic component under test (DUT: Device Under Test) having an antenna, a socket, and a replacement part for the electronic component testing device. Background Art

[0002] As a method of determining the radiation performance characteristics of a wireless device, there is known a method of installing the wireless device in a mounting mechanism in a far-field anechoic room to measure a signal from the wireless device (for example, Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application No. 2008-518567 Summary of the invention

[0006] Problems to be solved by the invention

[0007] As an OTA (Over The Air) test of a wireless device, a test based on a near field (Near Field) may be performed instead of the test based on the far field (Far Field) as described above.

[0008] The problem to be solved by the present invention is to provide an electronic component test device, a socket, and a replacement component capable of performing OTA testing based on a near field.

[0009] Technical solutions to solve problems

[0010] [1] The electronic component testing device involved in the present invention is an electronic component testing device for testing a DUT having a device antenna and a terminal formed on a first main surface, comprising: a socket that can be electrically connected to the DUT; a first wiring board; and a tester having a test head equipped with the first wiring board, the socket comprising: a first socket that is arranged to face the first main surface and can be electrically connected to the DUT; and a second socket that is mounted on the first wiring board and abuts against a second main surface of the DUT on the opposite side of the first main surface and can be electrically connected to the first socket, the second socket comprising: a base that abuts against the second main surface of the DUT; and a test antenna that is electrically connected to the tester and arranged to face the device antenna, wherein the tester tests the DUT by transmitting and receiving radio waves between the device antenna and the test antenna in a state in which the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head via the second socket.

[0011] [2] The electronic component testing device involved in the present invention is an electronic component testing device for testing a DUT having a device antenna and a terminal formed on a first main surface, comprising: a socket that can be electrically connected to the DUT; a first wiring board having a first opening; and a tester having a test head equipped with the first wiring board, the socket comprising: a first socket that is arranged to face the first main surface and can be electrically connected to the DUT and can be electrically connected to the first wiring board; and a second socket that is exposed from the first wiring board through the first opening and abuts against a second main surface of the DUT on the opposite side of the first main surface, the second socket comprising: a base that abuts against the second main surface of the DUT; and a test antenna that is electrically connected to the tester and arranged to face the device antenna, wherein the tester tests the DUT by transmitting and receiving radio waves between the device antenna and the test antenna in a state in which the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head via the first wiring board.

[0012] [3] In the above invention, the second socket may include a first attenuation member for attenuating radio waves radiated from the device antenna or the test antenna, and the first attenuation member may be interposed between the test antenna and the device antenna.

[0013] [4] In the above invention, it may be that the device antenna includes a first device antenna arranged on the second main surface, the test antenna includes a first test antenna configured to be opposite to the first device antenna, and the base has a second opening that makes the first test antenna opposite to the first device antenna.

[0014] [5] In the above invention, the first attenuation member may be disposed in the second opening in a manner interposed between the first test antenna and the device antenna.

[0015] [6] In the above invention, the second socket may include: a second attenuation member, which is arranged on the inner surface of the second opening to attenuate the radio waves radiated from the first device antenna or the first test antenna; and a shielding layer, which is arranged on the outer surface of the base to shield the radio waves from the outside.

[0016] [7] In the above invention, the first test antenna may be a patch antenna having a substrate, a radiating element provided on the substrate, and a wiring pattern provided on the substrate and connected to the radiating element.

[0017] [8] In the above invention, the first test antenna may include: a plurality of the radiating elements arranged in a matrix on the substrate; and a wiring pattern connected to the plurality of radiating elements.

[0018] [9] In the above invention, the first test antenna may include: a plurality of the radiating elements arranged in a matrix on the substrate; and a plurality of wiring patterns respectively connected to the plurality of radiating elements.

[0019]

[10] In the above invention, it may also be that the device antenna includes a second device antenna arranged on the side of the DUT, and the test antenna includes a second test antenna configured to be opposite to the second device antenna, and the second test antenna is configured relative to the DUT in a direction substantially parallel to the first main surface.

[0020]

[11] In the above invention, the electronic component testing device may further include an electronic component operating device, wherein the electronic component operating device includes a moving unit, and the moving unit can hold and move the DUT and press the DUT relative to the socket.

[0021]

[12] In the above invention, the moving unit may include a holding portion having an adsorption mechanism for holding the DUT, and the first socket may be mounted on a front end of the holding portion.

[0022]

[13] In the invention of [1] above, the first socket may include: a first connection portion that can be electrically connected to the terminal of the DUT; a first conductive path that has one end connected to the first connection portion; and a second connection portion that is connected to the other end of the first conductive path, the second socket may include a third connection portion that can be electrically connected to the second connection portion of the first socket, and the first wiring board may include: a fourth connection portion that can be electrically connected to the third connection portion of the base; and a third conductive path that is connected to the fourth connection portion, and the third conductive path is electrically connected to the test head.

[0023]

[14] In the above invention, it may also be that the first socket includes a main body and a third wiring board on which the main body is installed, the first connecting portion is a first spring pin, the main body has a first retaining hole for inserting the first spring pin, and retains the first spring pin, the first conductive path includes a first wiring pattern formed on the third wiring board, the second connecting portion is a first solder pad provided at one end of the first wiring pattern, the third connecting portion is a second spring pin that can be electrically connected to the first solder pad, and the base has a second retaining hole for inserting the second spring pin, and retains the second spring pin.

[0024]

[15] In the above invention, the test antenna may be fixed to the base.

[0025]

[16] In the invention of [2] above, the first socket may include: a first connection portion that can be electrically connected to the terminal of the DUT; a first conductive path that has one end connected to the first connection portion; and a second connection portion that is connected to the other end of the first conductive path, and the first wiring board may include: a fourth connection portion that can be electrically connected to the second connection portion of the first socket; and a third conductive path that is connected to the fourth connection portion, and the third conductive path is electrically connected to the test head.

[0026]

[17] In the above invention, the first socket includes a main body and a third wiring board on which the main body is mounted, the first connecting portion is a first spring pin, the main body has a first retaining hole into which the first spring pin is inserted, and retains the first spring pin, the first conductive path includes a first wiring pattern formed on the third wiring board, the second connecting portion is a third spring pin, the main body has a third retaining hole into which the third spring pin is inserted, and retains the third spring pin, and the fourth connecting portion is a second solder pad formed on the first wiring board and capable of being electrically connected to the third spring pin.

[0027]

[18] In the above invention, the test antenna may be fixed to the base.

[0028]

[19] The socket involved in the present invention is a socket for testing a DUT having a device antenna and a terminal formed on a first main surface, the socket comprising: a first socket, which is configured to be opposite to the first main surface and can be electrically connected to the DUT; and a second socket, which is in contact with a second main surface on the opposite side of the first main surface of the DUT and can be electrically connected to the first socket, the second socket comprising: a base, which is in contact with the second main surface of the DUT; and a test antenna, which is configured to be opposite to the device antenna.

[0029]

[20] The socket involved in the present invention is a socket for testing a DUT having a device antenna and a terminal formed on a first main surface, the socket comprising: a first socket, which is configured to face the first main surface and can be electrically connected to the DUT; a second socket, which abuts against a second main surface of the DUT on the opposite side of the first main surface; and a first wiring board, which has a first opening for exposing the second socket and can be electrically connected to the first socket, the second socket comprising: a base, which abuts against the second main surface of the DUT; and a test antenna, which is configured to face the device antenna.

[0030]

[21] In the above invention, the second socket may include a first attenuation component for attenuating radio waves radiated from the device antenna or the test antenna, and the first attenuation component may be interposed between the test antenna and the device antenna.

[0031]

[22] In the above invention, it may also be that the device antenna includes a first device antenna arranged on the second main surface, the test antenna includes a first test antenna configured to be opposite to the first device antenna, and the base has a second opening that makes the first test antenna opposite to the first device antenna.

[0032]

[23] In the above invention, the first attenuation member may be disposed in the second opening in a manner interposed between the first test antenna and the device antenna.

[0033]

[24] In the above invention, the second socket may also include: a second attenuation component, which is arranged on the inner surface of the second opening to attenuate the radio waves radiated from the first device antenna or the first test antenna; and a shielding layer, which is arranged on the outer surface of the base to shield the radio waves from the outside.

[0034]

[25] In the above invention, the first test antenna may be a patch antenna having a substrate, a radiating element disposed on the second substrate, and a wiring pattern connected to the radiating element.

[0035]

[26] In the above invention, the first test antenna may include: a plurality of the radiating elements arranged in a matrix on the substrate; and a wiring pattern connected to the plurality of radiating elements.

[0036]

[27] In the above invention, the first test antenna may include: a plurality of the radiating elements arranged in a matrix on the substrate; and a plurality of wiring patterns respectively connected to the plurality of radiating elements.

[0037]

[28] In the above invention, it may also be that the device antenna includes a second device antenna arranged on the side of the DUT, and the test antenna includes a second test antenna configured to be opposite to the second device antenna, and the second test antenna is configured relative to the DUT in a direction substantially parallel to the first main surface.

[0038]

[29] The replacement component involved in the present invention is a replacement component for an electronic component testing device that tests a DUT having a device antenna and a terminal formed on a first main surface, and the replacement component comprises: a base that allows the DUT to abut against a second main surface on the opposite side of the first main surface; and a first test antenna that is configured to be opposite to the device antenna, and the base has a second opening that allows the first test antenna to be opposite to the first device antenna.

[0039]

[30] In the above invention, the replacement component may also include a first attenuation component for attenuating the radio waves radiated from the device antenna or the first test antenna, and the first attenuation component is arranged in the second opening in a manner between the test antenna and the device antenna.

[0040]

[31] In the above invention, the replacement component may include: a second attenuation component, which is arranged on the inner surface of the second opening to attenuate the radio waves radiated from the first device antenna or the first test antenna; and a shielding layer, which is arranged on the outer surface of the base to shield the radio waves from the outside.

[0041]

[32] In the above invention, the first test antenna may be a patch antenna having a substrate, a radiating element disposed on the substrate, and a wiring pattern disposed on the substrate and connected to the radiating element.

[0042]

[33] In the above invention, the first test antenna may include: a plurality of the radiating elements arranged in a matrix on the substrate; and a wiring pattern connected to the plurality of radiating elements.

[0043]

[34] In the above invention, the first test antenna may include: a plurality of the radiating elements, which are arranged in a matrix on the substrate; and a plurality of wiring patterns, which are respectively connected to the plurality of radiating elements.

[0044]

[35] In the above invention, it may also be that the device antenna includes a second device antenna arranged on the side of the DUT, and the test antenna includes a second test antenna configured to be opposite to the second device antenna, and the second test antenna is configured relative to the DUT in a direction substantially parallel to the first main surface.

[0045] Effects of the Invention

[0046] In the present invention, the second socket abutting the second main surface of the DUT has a test antenna arranged to face the device antenna of the DUT. By abutting the second main surface of the DUT against the base of the second socket, the positional relationship between the device antenna and the test antenna is set so that the radio waves from the device antenna reach the test antenna through the near field, thereby enabling OTA testing based on the near field to be performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a schematic cross-sectional view showing the overall structure of the electronic component testing apparatus in the first embodiment of the present invention.

[0048] Figure 2 1 is a cross-sectional view showing the contact chuck according to the first embodiment of the present invention, and is a view showing a state before the contact chuck comes into contact with the DUT.

[0049] Figure 3 is a diagram showing a state before the DUT is pressed against the socket in the first embodiment of the present invention. Figure 1 An enlarged cross-sectional view of part III.

[0050] Figure 4 FIG. 1 is a diagram showing a state where the DUT is pressed against the socket in the first embodiment of the present invention. Figure 3 The corresponding figure.

[0051] Figure 5 yes Figure 3 An enlarged cross-sectional view of the V portion.

[0052] Figure 6 It is a top view showing the test antenna in the first embodiment of the present invention.

[0053] Figure 7 It is a plan view showing a modified example of the test antenna in the first embodiment of the present invention.

[0054] Figure 8 It is a cross-sectional view showing a first modified example of the top socket and the bottom socket in the first embodiment of the present invention.

[0055] Fig. 9 1 is a diagram showing a first modified example of the bottom socket in the first embodiment of the present invention, and is a diagram showing a first modified example of the bottom socket in the first embodiment of the present invention. Figure 8 A cross-sectional view taken along line IX-IX.

[0056] Fig.10 It is a cross-sectional view showing a second modified example of the bottom socket in the first embodiment of the present invention.

[0057] Fig.11 It is a cross-sectional view showing a modified example of the electronic component testing apparatus in the first embodiment of the present invention.

[0058] Fig.12 It is a schematic cross-sectional view showing the overall structure of an electronic component testing apparatus according to a second embodiment of the present invention.

[0059] Fig.13 is a diagram showing a state before the DUT is pressed against the socket in the second embodiment of the present invention. Fig.12 An enlarged cross-sectional view of part XIII.

[0060] Fig.14 FIG. 2 is a diagram showing a state where the DUT is pressed against the socket in the second embodiment of the present invention. Fig.13 The corresponding figure.

[0061] Fig.15 yes Fig.13 An enlarged cross-sectional view of section XV. DETAILED DESCRIPTION

[0062] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0063] 《First Implementation Mode》

[0064] Figure 1 It is a schematic cross-sectional view showing the overall structure of the electronic component testing apparatus in this embodiment.

[0065] The electronic component test device 1 in this embodiment is a device for performing OTA testing of a DUT having a device antenna. Specifically, the electronic component test device 1 is a device for causing a test antenna 73 (described later) to receive radio waves (so-called millimeter waves) with a frequency of 24.250 to 52.600 GHz radiated from a DUT 10 having a device antenna 12 through a near field (Near Field), and testing the radio wave radiation characteristics of the DUT 10, and causing the DUT 10 to receive millimeter waves radiated from the test antenna 73 through a near field, and testing the radio wave reception characteristics of the DUT 10.

[0066] The DUT 10 to be tested is a so-called AiP (Antenna in Package) device, which includes a device antenna 12 formed on the lower surface 11b of a substrate 11, a semiconductor chip 13 mounted on the lower surface 11b of the substrate 11, and input / output terminals 14 formed on the upper surface 11a of the substrate 11 (see Figure 2 ). The semiconductor chip 13 is a device for controlling the transmission and reception of the device antenna 12. As specific examples of the device antenna 12 provided in the DUT 10, a patch antenna, a dipole antenna, and a Yagi antenna can be exemplified. In addition, although not particularly shown, the semiconductor chip 13 can also be mounted on the upper surface 11a of the substrate 11.

[0067] The DUT 10 in this embodiment is equivalent to an example of the “DUT” in the present invention, the device antenna 12 in this embodiment is equivalent to an example of the “first device antenna” in the present invention, the input and output terminals 14 in this embodiment are equivalent to an example of the “terminal” in the present invention, the upper surface 11a in this embodiment is equivalent to an example of the “first main surface” in the present invention, and the lower surface 11b in this embodiment is equivalent to an example of the “second main surface” in the present invention.

[0068] like Figure 1 As shown, the electronic component test device 1 in this embodiment includes: a processing device 2 that moves the DUT 10; a tester 3 that performs a test on the DUT 10; a carrier 4 mounted on a test head 32 (described later) provided in the tester 3; and a socket 5 that is mounted on the carrier 4 and can be electrically connected to the DUT 10. The processing device 2 presses the DUT 10 on the socket 5 to electrically connect the DUT 10 to the tester 3. Thereafter, the tester 3 performs the following test on the DUT 10. First, the tester 3 transmits a test signal to the DUT 10 via the socket 5, and radiates radio waves from the device antenna 12 of the DUT 10. The radio waves are received by the test antenna 73 (described later) provided in the socket 5, and the radio wave radiation characteristics of the DUT 10 are tested. Next, the radio waves are radiated from the test antenna 73 and received by the DUT 10, so as to test the radio wave reception characteristics of the DUT 10.

[0069] The electronic component testing device 1 in the present embodiment is equivalent to an example of an “electronic component testing device” in the present invention, the processing device 2 in the present embodiment is equivalent to an example of an “electronic component operating device” in the present invention, the tester 3 in the present embodiment is equivalent to an example of a “tester” in the present invention, the carrier 4 in the present embodiment is equivalent to an example of a “first wiring board” in the present invention, and the socket 5 in the present embodiment is equivalent to an example of a “socket” in the present invention.

[0070] like Figure 1 As shown, the processing device 2 includes a constant temperature bath 20 and a contact arm 21. The processing device 2 has a portion protruding to the side, and the constant temperature bath 20 is accommodated in the protruding portion, and a test head 32 is arranged in the space below the protruding portion. That is, the constant temperature bath 20 is arranged above the test head 32. In the constant temperature bath 20, a socket 5 is arranged inside through an opening formed at the bottom of the constant temperature bath 20. The constant temperature bath 20 is a device that applies a high or low temperature to the DUT 10 arranged in the socket 5. Although not particularly limited, the constant temperature bath 20 is preferably capable of adjusting the temperature within the range of -55°C to +155°C. The contact arm 21 in this embodiment is equivalent to an example of a "moving unit" in the present invention.

[0071] The contact arm 21 is a moving unit for moving the DUT 10, and is supported on a track (not shown) provided by the processing device 2. The contact arm 21 is provided with an actuator (not shown) for horizontal movement, and can move forward, backward, left and right along the track. In addition, the contact arm 21 is provided with an actuator (not shown) for up and down driving, and can move in the up and down directions. The contact arm 21 is provided with a contact suction cup 22 mounted on the front end of the contact arm 21, and can hold and move the DUT 10. The contact suction cup 22 in this embodiment is equivalent to an example of a "holding portion" in the present invention.

[0072] Figure 2 1 is a cross-sectional view showing the contact chuck in the present embodiment, and is a view showing a state before the contact chuck comes into contact with the DUT.

[0073] like Figure 2 As shown, the contact suction cup 22 is provided with an adsorption mechanism 23 for adsorbing and holding the DUT 10. The adsorption mechanism 23 is provided with a suction pipe 24, an adsorption pad 25, and a vacuum pump 26. The suction pipe 24 is formed along the vertical direction inside the contact suction cup 22 and a top socket 60 (described later) mounted on the front end of the contact suction cup 22, and one end of the suction pipe 24 is connected to the adsorption pad 25. The vacuum pump 26 is connected to the other end of the suction pipe 24. The adsorption pad 25 is connected to the suction pipe 24 and opens at the lower surface of the top socket 60. The adsorption mechanism 23 in this embodiment is equivalent to an example of the "adsorption mechanism" in the present invention.

[0074] When the contact chuck 22 holds the DUT 10, as shown in FIG. Figure 2 As shown in FIG. 1 , the contact chuck 22 is moved to the position directly above the DUT 10 by the contact arm 21. Next, the suction pad 25 is brought into contact with the DUT 10 by the contact arm 21, thereby forming a closed space surrounded by the suction pad 25 and the DUT 10. At this time, the suction pad 25 is brought into contact with the flat portion of the upper surface 11a of the DUT 10 where the input / output terminals 14 are not formed. Thereafter, the air in the closed space is sucked from the suction pipe 24 by the vacuum pump 26, thereby holding the DUT 10 on the contact chuck 22.

[0075] like Figure 1 As shown, the tester 3 includes a main frame (tester body) 31 and a test head 32. The main frame 31 is connected to the test head 32 via a cable 33. The main frame 31 transmits a test signal to the DUT 10 via the test head 32 to test the DUT 10, and evaluates the DUT 10 based on the test result.

[0076] The test head 32 is connected to the main frame 31 via a cable 33, and transmits a test signal to the DUT 10 when testing the DUT 10. Although not particularly shown, a pin electronic card electrically connected to the socket 5 is accommodated in the test head 32.

[0077] like Figure 1 As shown in FIG. 1 , the carrier board 4 is a wiring board mounted on the test head 32 and electrically connected to the test head 32. The carrier board 4 includes a conductive path 41 for electrically connecting the test head 32 and the socket 5, and a pad 42 provided at the end of the conductive path 41 (see FIG. 1 ). Figure 5 ). A test signal transmitted from the tester 3 is transmitted to the DUT 10 via the conductive path 41. The conductive path 41 is composed of a wiring pattern, a through hole, and the like.

[0078] Figure 3 is a diagram showing a state before the DUT is pressed against the socket in this embodiment, and is Figure 1 An enlarged cross-sectional view of part III, Figure 4 FIG. 1 is a diagram showing a state where the DUT is pressed against the socket in this embodiment, and is similar to FIG. Figure 3 The corresponding figure, Figure 5 yes Figure 3 An enlarged cross-sectional view of the V portion.

[0079] like Figure 3 As shown, the socket 5 includes a top socket 60 mounted on the contact suction cup 22 and a bottom socket 70 mounted on the carrier board 4. Figure 4 As shown, in the socket 5, the top socket 60 held by the contact suction cup 22 abuts against the bottom socket 70 through the contact arm 21, so that the top socket 60 and the bottom socket 70 can be electrically connected. The top socket 60 is detachably fixed to the contact suction cup 22 by screws or the like. In addition, the bottom socket 70 is also detachably fixed to the carrier 4 by screws or the like. The top socket 60 and the bottom socket 70 are replaced according to changes in the type of the DUT 10, etc. The top socket 60 in this embodiment is equivalent to an example of the "first socket" in the present invention, and the bottom socket 70 in this embodiment is equivalent to an example of the "second socket" in the present invention.

[0080] The top socket 60 includes a socket body 61, spring pins 62, and a wiring board 63. The socket body 61 is fixed to the wiring board 63. As a method of fixing the socket body 61 to the wiring board 63, for example, screw fixing can be exemplified.

[0081] like Figure 5 As shown, the spring pin 62 is disposed inside a holding hole 611 formed in the socket body 61 and is held by the socket body 61 through the holding hole 611. The spring pin 62 is connected to the input / output terminal 14 of the DUT 10, so that the DUT 10 is electrically connected to the electronic component test apparatus 1.

[0082] The wiring board 63 includes a conductive path 631 electrically connected to the pogo pin 62 and a pad 632 provided at an end of the conductive path 631. The conductive path 631 is composed of a wiring pattern, a through hole, etc. The pad 632 is exposed from the socket body 61 via a through hole 612 formed in the socket body 61.

[0083] Although not particularly shown, a notch for exposing the pad 632 may be formed in the socket body 61 instead of the through hole 612. Alternatively, the pad 632 may be exposed from the socket body 61 by making the socket body 61 smaller than the wiring board 63.

[0084] The bottom socket 70 includes a base 71, a spring pin 72, a test antenna 73, and a damping member 74. The bottom socket 70 abuts against the lower surface 11b of the substrate 11 to hold the DUT 10, and can be electrically connected to the top socket 60. The base 71 in this embodiment is equivalent to an example of the "base" in the present invention, the test antenna 73 in this embodiment is equivalent to an example of the "test antenna" and the "first test antenna" in the present invention, and the damping member 74 in this embodiment is equivalent to an example of the "first damping member" in the present invention.

[0085] The base 71 is fixed to the carrier 4. As a method for fixing the base 71 to the carrier 4, for example, screw fixing can be exemplified. The base 71 is made of a material having electrical insulation properties such as a resin material. Figure 4 As shown in FIG. 1 , the base 71 has a flat contact surface 711 on its upper portion, and the contact surface 711 contacts the lower surface 11b of the substrate 11, thereby being able to hold the DUT 10. In addition, an opening 712 is formed in the base 71, and the opening 712 allows the test antenna 73 to face the device antenna 12 of the DUT 10 when the top socket 60 and the bottom socket 70 contact each other. Figure 5 As shown, the base 71 has a holding hole 713 that penetrates the base 71 in the thickness direction. The spring pin 72 is inserted into the holding hole 713 and is held by the base 71. The opening 712 in this embodiment corresponds to an example of the "second opening" in the present invention.

[0086] The spring pin 72 is a contact member that can be connected to the pad 632 of the top socket 60. The lower end of the spring pin 72 contacts the pad 42 of the carrier board 4, and the spring pin 72 is electrically connected to the pad 42. In addition, the top socket 60 abuts against the bottom socket 70, so that the upper end of the spring pin 72 can contact the pad 632 of the top socket 60. The spring pin 72 contacts the pad 632, so that the bottom socket 70 and the top socket 60 are electrically connected, and the test signal transmitted from the tester 3 can be transmitted to the top socket 60.

[0087] like Figure 4As shown, when the top socket 60 and the bottom socket 70 are in contact, the test antenna 73 is arranged inside the opening 712 of the base 71 so as to face the device antenna 12 of the DUT 10. The distance between the test antenna 73 and the device antenna 12 is adjusted so that the radio waves radiated from the device antenna 12 reach the test antenna 73 through the near field. As the test antenna 73, for example, a patch antenna (microstrip antenna) and a horn antenna can be exemplified.

[0088] Figure 6 1 is a plan view showing the test antenna in this embodiment.

[0089] Although not particularly limited, for example Figure 6 As shown, the test antenna 73 may include a plurality of radiating elements 732 arranged in a matrix on the upper surface 731a of the substrate 731, and a wiring pattern 733 connected to the plurality of radiating elements 732. The radiating elements 732 are formed by patterning the metal layer on the substrate 731, and are connected to the signal line of the coaxial connector 734 mounted on the substrate 731 via the wiring pattern 733 formed on the substrate 731. In addition, in the present embodiment, although a plurality of radiating elements 732 are provided on the substrate 731, this is not limited to this, and the number of radiating elements 732 may be one. In addition, the plurality of radiating elements 732 are arranged in a matrix of 4 rows × 4 columns, but the number of rows and columns is not limited to this. For example, the radiating elements 732 may be arranged in 8 rows × 8 columns, etc. In addition, the radiating elements 732 may be arranged in a single column instead of being arranged in a matrix.

[0090] The wiring pattern 733 is a microstrip line, and functions as a power supply wiring for supplying power to the radiating element 732, and also functions as a transmission path for transmitting an electrical signal from the radiating element 732 to the coaxial connector 734. The wiring pattern 733 branches on one side and is connected to a plurality of radiating elements 732. In addition, the wiring pattern 733 merges into one on the other side and is connected to the coaxial connector 734.

[0091] Although not particularly shown, a ground layer is formed on the entire lower surface of the test antenna 73, and the ground layer is connected to the ground line of the coaxial connector 734. Figure 4 ) is connected to the coaxial connector 734 via a matching coaxial connector, and the test antenna 73 is electrically connected to the tester 3 via the coaxial connector 734. In addition, although not specifically shown in the figure, a coaxial waveguide conversion adapter can also be connected to the coaxial connector 734 so that the waveguide is interposed between the test antenna 73 and the tester 3.

[0092] In addition, the substrate 731 is fixed to the base 71. As a method of fixing the substrate 731 to the base 71, for example, screw fixing can be exemplified. In addition, in order to adjust the distance between the test antenna 73 and the device antenna 12, a pad can be arranged between the substrate and the carrier 4. The substrate 731 in this embodiment is equivalent to an example of the "substrate" in the present invention, the radiation element 732 in this embodiment is equivalent to an example of the "radiation element" in the present invention, and the wiring pattern 733 in this embodiment is equivalent to an example of the "wiring pattern" in the present invention.

[0093] Although not particularly limited, the substrate 731 and the base 71 of the test antenna 73 may be integrally formed. As a method of integrally forming the substrate 731 and the base 71 of the test antenna 73, a method using 3D printing or the like can be exemplified.

[0094] Figure 7 It is a plan view showing a modified example of the test antenna in the present embodiment.

[0095] like Figure 7 As shown, the test antenna 73 may include a plurality of wiring patterns 733 respectively connected to the plurality of radiating elements 732. The test antenna 73 includes a plurality of radiating elements 732, a plurality of wiring patterns 733, and a plurality of coaxial connectors 734.

[0096] In the case of this modification, one end of each wiring pattern 733 is connected to the radiating element 732, and the other end of each wiring pattern 733 is connected to the coaxial connector 734. Each wiring pattern 733 is independent of and not electrically connected to other wiring patterns 733. The signal sent from each radiating element 732 is sent to each coaxial connector 734 via the wiring pattern 733 independently of the signal sent from other radiating elements 732.

[0097] As described above, in this modification, the signals sent from the radiating elements 732 do not merge in the wiring pattern 733 and the coaxial connector 734, so the signals are sent independently to the test head 32. Thus, since the intensity of the radio wave detected for each radiating element 732 can be measured, the directivity can be evaluated based on the distribution of the intensity in the OTA test.

[0098] In addition, Figure 7In the case of the modification shown, the same number of coaxial connectors 734 as the number of radiating elements 732 and wiring patterns 733 is provided, but the present invention is not particularly limited to this. For example, the test antenna 73 may include one coaxial connector 734 and a switch between the coaxial connector 734 and 16 wiring patterns 733, and the wiring pattern 733 to be connected to the coaxial connector 734 is appropriately switched by the switch, and the OTA test is performed. In this way, the number of coaxial connectors 734 can be reduced.

[0099] Figure 8 is a cross-sectional view showing a first modified example of the top socket and the bottom socket in the present embodiment, Fig. 9 is a diagram showing a first modified example of the bottom socket in this embodiment, and is along Figure 8 A cross-sectional view taken along line IX-IX.

[0100] In addition, the structure of the bottom socket 70 is not particularly limited to the above structure. Figure 8 As shown, in addition to the device antenna 12 on the lower surface 11b, there is also a case where the DUT 10 has a device antenna 12a provided on the side of the DUT 10. In this case, Figure 8 as well as Fig. 9 As shown, in addition to the above-mentioned test antenna 73, the bottom socket 70 may also have a test antenna 73a. The test antenna 73a is arranged in a direction substantially parallel to the lower surface of the DUT 10 relative to the device antenna 12a. By configuring the test antenna 56 in this way, even the device antenna 12a having the directivity of the radio wave in the direction parallel to the mounting surface can be tested. As such a device antenna 12a, for example, a dipole antenna can be exemplified. The test antenna 73a is also electrically connected to the tester 3 in the same manner as the above-mentioned test antenna 73. The device antenna 12a in this embodiment is equivalent to an example of the "second device antenna" in the present invention.

[0101] Furthermore, when the DUT 10 does not include the device antenna 12 but includes only the device antenna 12 a , the bottom socket 70 may include only the test antenna 73 a instead of the test antenna 73 .

[0102] In addition, if Figure 8 As shown in FIG. 1 , when the DUT 10 further includes a device antenna 12b on the surface opposite to the device antenna 12, the test antenna 73b may be arranged on the wiring board 63 of the top socket 60. In this case, the socket body 61 is provided with an opening 613 for making the test antenna 73b face the device antenna 12. By arranging the test antenna 73b in this way, even when the DUT 10 includes antennas on both surfaces of the substrate 11, OTA testing can be performed on each device antenna.

[0103] Back to Figure 4 The attenuation member 74 is disposed inside the opening 712 of the base 71 and between the test antenna 73 and the device antenna 12. The attenuation member 74 is a sheet-like member made of a material capable of absorbing radio waves (particularly millimeter waves). As the material of the attenuation member 74, the same material as the radio wave absorbing material used for the inner wall of the radio wave darkroom can be used, and specifically, ferrite and resin materials can be exemplified. The attenuation amount of radio waves of the attenuation member 74 can also be adjusted by changing the content and dielectric constant of the radio wave absorbing material of the attenuation member 74. In addition, the attenuation amount of radio waves of the attenuation member 74 can also be adjusted by adjusting the thickness of the attenuation member 74.

[0104] The attenuation member 74 is disposed inside the opening 712 of the base 71 so as to face the radiating element 732 of the test antenna 73. In the present embodiment, the attenuation member 74 closes the opening 712 of the base 71 in a plan view (when viewed along the vertical direction) and covers the entire surface of the radiating element 732. In addition, the attenuation member 74 is disposed so as to face the device antenna 12 of the DUT 10 when the DUT 10 is in contact with the base 71, and is disposed so as to be interposed between the radiating element 732 and the device antenna 12.

[0105] Although not particularly shown in the figure, in the present embodiment, the attenuation member 74 is embedded in grooves formed on three inner surfaces of the opening 712 of the base 71, and is connected to the fixing member via an opening formed on the remaining inner surface, and the fixing member is fixed to the outer surface of the base 71 by screwing or the like, thereby being fixed to the base 71. Alternatively, the attenuation member 74 may be fixed to the base 71 using an adhesive.

[0106] Thus, by interposing the attenuation member 74 between the radiation element 732 and the device antenna 12, the distance between the test antenna 73 and the device antenna 12 in radio wave communication can be maintained, and the actual distance between the test antenna 73 and the device antenna 12 can be relatively shortened. Therefore, the socket 5 can be miniaturized.

[0107] In addition, by interposing the attenuation member 74 between the radiation element 732 and the device antenna 12, the actual distance between the test antenna 73 and the device antenna 12 can be maintained, and the distance in radio wave communication between the test antenna 73 and the device antenna 12 can be extended. Therefore, it is possible to prevent the test antenna 73 and the device antenna 12 from interfering with each other and causing the test accuracy to deteriorate.

[0108] Fig.10 It is a cross-sectional view showing a second modified example of the bottom socket in the present embodiment.

[0109] like Fig.10 As shown, the bottom socket 70 may further include an attenuation member 74a provided on the inner surface of the opening 712, and a shielding layer 75 provided on the outer surface of the base 71. The attenuation member 74a in this embodiment is equivalent to an example of the "second attenuation member" in the present invention, and the shielding layer 75 in this embodiment is equivalent to an example of the "shielding layer" in the present invention.

[0110] By providing the attenuation member 74a on the inner surface of the opening 712, the radio waves radiated from the device antenna 12 or the test antenna 73 can be attenuated and reflection can be suppressed, thereby improving the accuracy of the test. The attenuation member 74a is made of the same material as the attenuation member 74 described above.

[0111] Furthermore, by providing the shielding layer 75 on the outer surface of the base 71 , when the DUT 10 is brought into contact with the contact surface 711 of the base 71 , the DUT 10 is surrounded by the shielding layer 75 , and can shield radio waves from the outside, thereby improving the accuracy of the test.

[0112] In addition, the base 71 may be provided with a radio wave shielding function by forming the base 71 itself from a conductive material such as a metal material instead of the shielding layer 75. In this case, an insulator is interposed between the inner surface of the holding hole 713 of the base 71 and the spring pin 72.

[0113] Below, refer to Figure 2 to Figure 4 The OTA test of the DUT 10 performed by the electronic component testing apparatus 1 in the present embodiment will be described.

[0114] First, the thermostatic bath 20 is started, and the temperature inside the thermostatic bath 20 is adjusted to a predetermined temperature.

[0115] Then, if Figure 2 As shown, the contact suction cup 22 of the handling device 2 is moved to the position directly above the DUT 10 of the test object by the contact arm 21. Thereafter, the contact suction cup 22 is lowered toward the DUT 10, the spring pins 62 of the top socket 60 abut against the input / output terminals 14 of the DUT 10, and the suction pads 25 abut against the DUT 10. At this time, the DUT 10 is held on the contact suction cup 22 in a posture reversed from the normal posture (the posture in which the input / output terminals 14 face downward).

[0116] Next, by sucking air from the suction pipe 24, the contact suction cup 22 sucks and holds the DUT 10. Figure 3 As shown, the contact arm 21 moves to just above the bottom socket 70 .

[0117] Then, if Figure 4As shown, the contact suction cup 22 is lowered by the contact arm 21, and the DUT 10 is pressed against the bottom socket 70. As a result, the lower surface 11b of the DUT 10 abuts against the abutment surface 711 of the base 71 of the bottom socket 70, and the device antenna 12 faces the test antenna 73. In addition, at the same time, the spring pin 72 of the bottom socket 70 abuts against the pad 632 of the top socket 60, and the DUT 10 is electrically connected to the test head 32 via the bottom socket 70 and the top socket 60.

[0118] Then, in a state where the DUT 10 is pressed against the bottom socket 70 and the top socket 60 is pressed against the DUT 10 , the following test of the radio wave radiation characteristic and the test of the radio wave reception characteristic of the DUT 10 are performed.

[0119] Specifically, first, the test signal output from the main frame 31 is transmitted to the DUT 10 via the conductive path 41 of the carrier 4 mounted on the test head 32, the spring pin 72 of the bottom socket 70, the conductive path 631 of the wiring board 63, and the spring pin 62 of the top socket 60. Then, the DUT 10 receiving the test signal radiates radio waves downward from the device antenna 12. The radio waves are received by the test antenna 73, converted into electrical signals, and transmitted to the main frame 31 via the coaxial connector 734, and the radio wave radiation characteristics of the DUT 10 are evaluated based on the signals.

[0120] Next, while the DUT 10 is kept pressed against the bottom socket 70, the test signal output from the main frame 31 is transmitted to the test antenna 73 via the coaxial connector 734. The test antenna 73, which receives the test signal, radiates radio waves upward. The radio waves are converted into electrical signals by the device antenna 12 of the DUT 10, and transmitted to the main frame 31 via the top socket 60, the bottom socket 70, and the carrier 4, and the radio wave reception characteristics of the DUT 10 are evaluated based on the signals.

[0121] After the evaluation of the DUT 10, the contact arm 21 moves upward, and the DUT 10 leaves the bottom socket 70. The test of the DUT 10 is thus completed.

[0122] As described above, in this embodiment, the bottom socket 70 holding the DUT 10 includes the test antenna 73 disposed opposite to the device antenna 12 of the DUT 10. By bringing the lower surface 11b of the DUT 10 into contact with the contact surface 711 of the bottom socket 70, the positional relationship between the device antenna 12 and the test antenna 73 is set such that the radio wave from the device antenna 12 reaches the test antenna 73 through the near field, thereby enabling OTA testing based on the near field to be performed.

[0123] In addition, a method of placing the test antenna on the contact chuck of the handling device for OTA testing can be considered. However, in this method, a detachable connector is interposed between the test antenna and the test head, and since the connector is detached for each test, the connection reliability is poor.

[0124] In contrast, in this embodiment, the test antenna 73 is disposed on the bottom socket 70 on the carrier board 4 and is electrically connected to the test head 32 via the coaxial connector 734. This allows the signal to be stably transmitted to the tester, thereby improving the accuracy of the test.

[0125] Furthermore, in this embodiment, since the attenuation member 74 is interposed between the test antenna 73 and the device antenna 12, the distance between the test antenna 73 and the device antenna 12 in radio wave communication can be maintained, and the actual distance between the test antenna 73 and the device antenna 12 can be relatively shortened. Therefore, the socket 5 can be miniaturized.

[0126] Fig.11 It is a cross-sectional view showing a modified example of the electronic component testing device in the present embodiment.

[0127] In addition, in the present embodiment, the electronic component test device 1 includes the processing device 2, but the electronic component test device 1 may be a so-called manual type test device that does not include the processing device 2. In this case, Fig.11 As shown, the top socket 60 includes a socket cover 64 that fits with the bottom socket 70, and includes a recess 714 that engages with the base 71 and the socket cover 64. The socket cover 64 includes a latch 641 that engages with the recess 714, and the top socket 60 is fixed to the bottom socket 70 by the latch 641 and the recess 714 engaging. Since the top socket 60 is provided with the socket cover 64, the top socket 60 can be fixed to the bottom socket 70 even without using the processing device 2, and the DUT 10 can be pressed against the bottom socket 70. As a result, the device antenna 12 and the test antenna 73 can be placed opposite to each other, and the top socket 60 and the bottom socket 70 can be electrically connected, so that OTA testing based on the near field can be implemented.

[0128] Second Implementation Method

[0129] Fig.12 It is a schematic cross-sectional view showing the overall structure of the electronic component testing apparatus in this embodiment.

[0130] The electronic component test device 1B in this embodiment has a structure of a carrier 4B, a top socket 60B, and a bottom socket 70B that is different from that in the first embodiment, and the other structures are the same. Hereinafter, only the differences between the electronic component test device 1B in the second embodiment and the first embodiment will be described, and the same reference numerals are given to the parts having the same structure as that in the first embodiment, and the description thereof will be omitted.

[0131] like Fig.12 As shown, the carrier 4B in this embodiment has an opening 43 into which the bottom socket 70B is inserted. The DUT 10 held by the contact chuck 22 can be brought into contact with the bottom socket 70B via the opening 43. The opening 43 in this embodiment is an example of the "first opening" in the present invention.

[0132] Fig.13 is a diagram showing a state before the DUT is pressed against the socket in this embodiment, and is Fig.12 An enlarged cross-sectional view of part XIII, Fig.14 FIG. 1 is a diagram showing a state where the DUT is pressed against the socket in this embodiment, and is similar to FIG. Fig.13 The corresponding figure, Fig.15 yes Fig.13 An enlarged cross-sectional view of section XV.

[0133] like Fig.13 As shown, the top socket 60B has spring pins 65 arranged corresponding to the pads 42 of the carrier 4B. Fig.15 As shown, the spring pin 65 is arranged inside the through hole 612 of the socket body 61B and is held by the socket body 61B, and contacts the pad 632. The DUT 10 is brought into contact with the bottom socket 70B (see Fig.14 ), so that the spring pin 65 abuts against the pad 42 of the carrier 4B, and the top socket 60B and the carrier 4B can be electrically connected.

[0134] like Fig.13 As shown, the bottom socket 70B is configured to be embedded in the carrier 4B and the test head 32. The bottom socket 70B is exposed from the carrier 4B via an opening 43 formed in the carrier 4B, and the test antenna 73 can be opposed to the device antenna 12 via the opening 43.

[0135] The bottom socket 70B is different from the bottom socket in the first embodiment and does not have a spring pin electrically connected to the tester 3. In this embodiment, the test signal transmitted from the tester 3 is not transmitted via the bottom socket 70B, but is transmitted from the pad 42 of the carrier 4B to the DUT 10 via the spring pin 65 of the top socket 60B. In this embodiment, in addition to the top socket 60B and the bottom socket 70B, the carrier 4B is also replaced according to the type change of the DUT 10. That is, in this embodiment, the socket 5B is composed of the top socket 60B, the bottom socket 70B and the carrier 4B. In addition, the carrier 4B is detachably fixed to the test head 32 via a connector or the like.

[0136] The OTA test of the DUT 10 performed by the electronic component test apparatus 1B in this embodiment can be implemented in the same procedure as the test in the first embodiment. In this test, the test signal transmitted from the tester 3 is transmitted to the DUT 10 via the test head 32, the carrier 4B and the top socket 60B.

[0137] As described above, in this embodiment, the bottom socket 70B holding the DUT includes the test antenna 73 disposed opposite to the device antenna 12 of the DUT 10. By bringing the lower surface 11b of the DUT 10 into contact with the contact surface 711 of the bottom socket 70B, the positional relationship between the device antenna 12 and the test antenna 73 is set such that the radio waves from the device antenna 12 reach the test antenna 73 through the near field, thereby enabling OTA testing based on the near field to be performed.

[0138] In addition, in this embodiment, similarly to the first embodiment, since the attenuation member 74 is interposed between the test antenna 73 and the device antenna 12, the distance between the test antenna 73 and the device antenna 12 in radio wave communication can be maintained and the actual distance between the test antenna 73 and the device antenna 12 can be relatively shortened. Therefore, the socket 5B can be miniaturized.

[0139] In addition, the above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, the gist of each element disclosed in the above-described embodiments also includes all design changes and equivalents belonging to the technical scope of the present invention.

[0140] For example, in the above-mentioned embodiment, as a test of the DUT, the electronic component test device tests both the radio wave radiation characteristic and the radio wave reception characteristic of the DUT, but the present invention is not particularly limited thereto. For example, as a test of the DUT, the electronic component test device may also test only one of the radio wave radiation characteristic or the radio wave reception characteristic of the DUT.

[0141] (Number Description)

[0142] 1.1B Electronic component test equipment

[0143] 2 Processing device

[0144] 20 Constant temperature bath

[0145] 21 Contact arm

[0146] 22 Contact suction cup

[0147] 23 Adsorption mechanism

[0148] 24 Suction pipe

[0149] 25 Adsorption pad

[0150] 26 Vacuum Pump

[0151] 3 Tester

[0152] 31 Main frame

[0153] 32 Test Head

[0154] 33 Cables

[0155] 4.4B carrier board

[0156] 41 Conductive Path

[0157] 42 pads

[0158] 43 Opening

[0159] 5. 5B socket

[0160] 60, 60B top socket

[0161] 61 Socket body

[0162] 611 Holding hole

[0163] 612 Through hole

[0164] 613 Opening

[0165] 62 Pogo pins

[0166] 63 Wiring board

[0167] 631 Conductive Path

[0168] 632 pads

[0169] 64 socket cover

[0170] 65 Spring Pin

[0171] 70, 70B bottom socket

[0172] 71, 71 base

[0173] 711 abutment surface

[0174] 712 Opening

[0175] 713 Holding hole

[0176] 714 concavity

[0177] 72 Spring pin

[0178] 73, 73a, 73b Test antenna

[0179] 731 base plate

[0180] 732 Radiating Elements

[0181] 733 Wiring Pattern

[0182] 734 Coaxial Connector

[0183] 735 Coaxial Cable

[0184] 74, 74a Attenuation component

[0185] 75 Shielding layer

[0186] 10 Electronic components

[0187] 12, 12a, 12b Equipment antenna

[0188] 13 Semiconductor Chip

[0189] 14 Input and output terminals.

Claims

1. An electronic component testing device for testing an electronic component under test (DUT), wherein the DUT has a device antenna and a terminal formed on a first main surface, The electronic component testing device comprises: a socket capable of being electrically connected to the DUT; a first wiring board; and a tester including a test head equipped with the first wiring board, The socket has: a first socket, which is arranged to face the first main surface and is electrically connectable to the DUT; as well as a second socket mounted on the first wiring board, abutting against a second main surface of the DUT opposite to the first main surface, and capable of being electrically connected to the first socket, The second socket comprises: a base abutting against the second main surface of the DUT; a test antenna electrically connected to the tester and configured to be opposite to the device antenna; as well as a first attenuation member for attenuating electric waves radiated from the device antenna or the test antenna, The device antenna comprises a first device antenna disposed on the second main surface, The test antenna comprises a first test antenna configured to be opposite to the first device antenna, The base has a second opening that allows the first test antenna to be opposite to the first device antenna. The first attenuation component contains an electric wave absorbing material capable of absorbing millimeter waves, is interposed between the test antenna and the device antenna, and closes the second opening. The second main surface of the DUT abuts against the base of the second socket, so that the positional relationship between the device antenna and the test antenna is set to a positional relationship such that the radio waves from the device antenna reach the test antenna through the near field. In a state where the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head via the second socket, the tester tests the DUT by transmitting and receiving electric waves between the device antenna and the test antenna.

2. An electronic component testing device for testing an electronic component under test (DUT), wherein the DUT has a device antenna and a terminal formed on a first main surface, The electronic component testing device comprises: a socket capable of being electrically connected to the DUT; a first wiring board having a first opening; and a tester including a test head equipped with the first wiring board, The socket has: a first socket disposed opposite to the first main surface and capable of being electrically connected to the DUT and the first wiring board; as well as a second socket exposed from the first wiring board through the first opening and in contact with a second main surface of the DUT opposite to the first main surface; The second socket comprises: a base abutting against the second main surface of the DUT; a test antenna electrically connected to the tester and configured to be opposite to the device antenna; as well as a first attenuation member for attenuating electric waves radiated from the device antenna or the test antenna, The device antenna comprises a first device antenna disposed on the second main surface, The test antenna comprises a first test antenna configured to be opposite to the first device antenna, The base has a second opening that allows the first test antenna to be opposite to the first device antenna. The first attenuation component contains an electric wave absorbing material capable of absorbing millimeter waves, is interposed between the test antenna and the device antenna, and closes the second opening. The second main surface of the DUT abuts against the base of the second socket, so that the positional relationship between the device antenna and the test antenna is set to a positional relationship such that the radio waves from the device antenna reach the test antenna through the near field. The tester tests the DUT by transmitting and receiving electric waves between the device antenna and the test antenna in a state where the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head via the first wiring board.

3. The electronic component testing device according to claim 1 or 2, wherein: The second socket comprises: a second attenuation member, which is disposed on an inner surface of the second opening and attenuates radio waves radiated from the first device antenna or the first test antenna; as well as The shielding layer is arranged on the outer surface of the base and shields the radio waves from the outside.

4. The electronic component testing device according to claim 1 or 2, wherein: The first test antenna is a patch antenna including a substrate, a radiating element provided on the substrate, and a wiring pattern provided on the substrate and connected to the radiating element.

5. The electronic component testing device according to claim 1 or 2, wherein: The device antenna includes a second device antenna disposed on a side of the DUT, The test antenna includes a second test antenna configured to be opposite to the second device antenna, The second test antenna is arranged in a direction substantially parallel to the first main surface with respect to the DUT.

6. The electronic component testing device according to claim 1 or 2, wherein: The electronic component testing apparatus further includes an electronic component handling device including a moving unit that holds and moves the DUT and can press the DUT against the socket.

7. The electronic component testing device according to claim 6, wherein: The moving unit includes a holding portion, and the holding portion has an adsorption mechanism for holding the DUT. The first socket is mounted on the front end of the holding portion.

8. A socket for testing an electronic component under test (DUT), the DUT having a device antenna and a terminal formed on a first main surface, The socket has: a first socket, which is arranged to face the first main surface and is electrically connectable to the DUT; as well as a second socket that abuts against a second main surface of the DUT on the opposite side of the first main surface and is electrically connectable to the first socket, The second socket comprises: a base abutting against the second main surface of the DUT; a test antenna configured to be opposite to the device antenna; as well as a first attenuation member for attenuating electric waves radiated from the device antenna or the test antenna, The base has a second opening for positioning the test antenna opposite to the device antenna. The first attenuation component contains an electric wave absorbing material capable of absorbing millimeter waves, is interposed between the test antenna and the device antenna, and closes the second opening. The second main surface of the DUT abuts against the base of the second socket, so that the positional relationship between the device antenna and the test antenna is set such that the radio waves from the device antenna reach the test antenna through the near field.

9. A socket for testing an electronic component under test (DUT), the DUT having a device antenna and a terminal formed on a first main surface, The socket has: a first socket, which is arranged to face the first main surface and is electrically connectable to the DUT; a second socket abutting against a second main surface of the DUT on the opposite side of the first main surface; as well as a first wiring board having a first opening for exposing the second socket and being electrically connectable to the first socket, The second socket comprises: a base abutting against the second main surface of the DUT; a test antenna configured to be opposite to the device antenna; as well as a first attenuation member for attenuating electric waves radiated from the device antenna or the test antenna, The base has a second opening for positioning the test antenna opposite to the device antenna. The first attenuation component contains an electric wave absorbing material capable of absorbing millimeter waves, is interposed between the test antenna and the device antenna, and closes the second opening. The second main surface of the DUT abuts against the base of the second socket, so that the positional relationship between the device antenna and the test antenna is set such that the radio waves from the device antenna reach the test antenna through the near field.

10. The socket according to claim 8 or 9, wherein: The device antenna comprises a first device antenna disposed on the second main surface, The test antenna comprises a first test antenna configured to be opposite to the first device antenna, The base has a second opening for arranging the first test antenna opposite to the first device antenna.

11. A replacement component for an electronic component testing device for testing an electronic component under test (DUT), the DUT having a device antenna and a terminal formed on a first main surface, The replacement part has: a base portion abutting against a second main surface of the DUT on the opposite side of the first main surface; and a first test antenna, which is arranged to be opposite to the device antenna, The base has a second opening for positioning the first test antenna opposite to the device antenna; and a first attenuation member for attenuating electric waves radiated from the device antenna or the first test antenna, The first attenuation member contains an electric wave absorbing material capable of absorbing millimeter waves, and is disposed in the second opening in a manner interposed between the first test antenna and the device antenna, and closes the second opening. The second main surface of the DUT abuts against the base, so that the positional relationship between the device antenna and the first test antenna is set such that the radio wave from the device antenna reaches the first test antenna through the near field.

Images