Substrate processing device and substrate processing method

Abstract

The present invention proposes a substrate processing device and method that can accurately position and hold a substrate on a substrate holder. A configuration adjustment mechanism is controlled to adjust the configuration of the substrate based on the detection of a first sensor, a second sensor is controlled to detect feature points pre-formed on the plate surface of the substrate whose configuration is adjusted based on the detection of the first sensor, and it is confirmed whether the position of the feature point detected by the second sensor is within the allowable range. If the position of the feature point detected by the second sensor is within the allowable range, the configuration adjustment mechanism is controlled to adjust the configuration of the substrate based on the detection of the second sensor, and after the configuration of the substrate is adjusted based on the detection of the second sensor, the substrate disassembly and assembly mechanism is controlled to install the substrate on the substrate holder.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0002] In the past, as an example of a substrate processing device, there is a known electroplating device that performs electroplating treatment on a substrate. Generally speaking, in such an electroplating device, a substrate with a pattern such as a hole portion or a mask formed in advance is put into the electroplating device. Then, in the electroplating device, the substrate is installed on the substrate holder by being transported by a conveying device, and the electroplating treatment is performed on the substrate in a state where it is installed on the substrate holder. At this time, the conveying device that transports the substrate may not always be able to hold and transport the substrate at the same position and angle. Therefore, when the substrate is installed on the substrate holder, there is a situation where the substrate is offset from the specified correct position. Moreover, if there is such a positional offset of the substrate relative to the substrate holder, there is a possibility that the substrate is damaged or the substrate cannot be processed correctly.

[0003] In order to deal with such a problem, a substrate processing device has been proposed that detects the positions of two corners of a substrate by an image sensor when the substrate is transported to a predetermined position to determine the position of the substrate (see, for example, Patent Document 1). The substrate processing device uses an illumination device to illuminate the substrate from the side opposite to the image sensor, thereby accurately detecting the corners of the substrate.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2018-168432

[0005] In the method described in Patent Document 1, the positions of the two corners of the substrate are detected by an image sensor, and the position and angle of the substrate are corrected. However, in the case where the substrate is greatly warped, the position and angle of the substrate may not be corrected with sufficient accuracy. In addition, depending on the material of the substrate, light may pass through the substrate and the positions of the two corners of the substrate may not be detected. Summary of the invention

[0006] The present invention has been made in view of the above-mentioned situation, and one object of the present invention is to provide a substrate processing apparatus and method that can accurately position and hold a substrate on a substrate holder.

[0007] According to one embodiment of the present invention, a substrate processing device is proposed, characterized in that the substrate processing device comprises: a substrate holder for holding a substrate; a substrate disassembling and mounting mechanism for mounting the substrate on the substrate holder; a first sensor for detecting the configuration of the substrate based on the outer shape of the substrate; a second sensor for detecting feature points pre-formed on the plate surface of the substrate; a configuration adjustment mechanism configured to adjust the configuration of the substrate; and a control unit, wherein the control unit controls the configuration adjustment mechanism so as to adjust the configuration of the substrate based on the detection of the first sensor, the control unit controls the second sensor so as to detect feature points pre-formed on the plate surface of the substrate whose configuration is adjusted based on the detection of the first sensor, the control unit confirms whether the position of the feature point detected by the second sensor is within an allowable range, the control unit controls the configuration adjustment mechanism so as to adjust the configuration of the substrate based on the detection of the second sensor when the position of the feature point detected by the second sensor is within the allowable range, and after adjusting the configuration of the substrate based on the detection of the second sensor, the control unit controls the substrate disassembling and mounting mechanism to mount the substrate on the substrate holder.

[0008] According to another embodiment of the present invention, a substrate processing method is provided in a substrate processing device having a substrate holder for holding a substrate, a substrate disassembly and assembly mechanism for mounting the substrate on the substrate holder, and a configuration adjustment mechanism configured to adjust the configuration of the substrate, the substrate processing method comprising: a first detection step of detecting the configuration of the substrate based on the outer shape of the substrate; a first configuration adjustment step of controlling the configuration adjustment mechanism to adjust the configuration of the substrate based on the detection of the first detection step; a second detection step of detecting feature points pre-formed on the plate surface of the substrate whose configuration is adjusted in the first configuration adjustment step; a second configuration adjustment step of confirming whether the position of the feature point detected in the second detection step is within an allowable range, and controlling the configuration adjustment mechanism to adjust the configuration of the substrate based on the detection of the second detection step if the position of the detected feature point is within the allowable range; and a substrate installation step of controlling the substrate disassembly and assembly mechanism after the second configuration adjustment step to mount the substrate on the substrate holder. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is an overall configuration diagram of a substrate processing apparatus according to one embodiment of the present invention.

[0010] Figure 2 It is a schematic plan view for explaining the substrate arrangement adjustment mechanism according to the first embodiment.

[0011] Figure 3 It is a schematic side view for explaining the substrate arrangement adjustment mechanism according to the first embodiment.

[0012] Figure 4 The state in which the substrate is placed on the temporary substrate placement table by the substrate conveying device is the same as Figure 2 The corresponding figure.

[0013] Figure 5 The state in which the substrate is placed on the temporary substrate placement table by the substrate conveying device is the same as Figure 3 The corresponding figure.

[0014] Figure 6 It is used to explain the transfer of substrates from the temporary substrate placement station to the processing station. Figure 4 The corresponding figure.

[0015] Figure 7 It is used to explain the movement of the substrate to the configuration adjustment position through the processing station. Figure 4 The corresponding figure.

[0016] Figure 8 It is used to explain the configuration adjustment of the substrate through the processing station and Figure 3 The corresponding figure.

[0017] Fig. 9 It is a figure for demonstrating the arrangement|positioning adjustment of the board|substrate S in a board|substrate attachment and detachment mechanism.

[0018] Fig.10 It is a schematic diagram showing an example of a top view of a substrate.

[0019] Fig.11 It is a diagram for explaining the rotation angle of the substrate.

[0020] Fig.12 It is a diagram for explaining the imaging position of the second sensor.

[0021] Fig.13 It is a diagram for explaining the imaging position of the second sensor.

[0022] Fig.14 This is a flowchart showing an example of a process of adjusting the arrangement of substrates executed by each controller in the substrate processing apparatus.

[0023] Fig.15 It is a schematic diagram for explaining the arrangement adjustment of the substrate in the second embodiment.

[0024] Fig.16 It is an explanatory diagram for explaining the imaging positions of the first sensor and the second sensor in the second embodiment.

[0025] Fig.17 This is a flowchart showing an example of a process of adjusting the arrangement of substrates in the second embodiment.

[0026] Fig.18 It is a schematic diagram for explaining the arrangement adjustment of the substrate in the third embodiment.

[0027] Description of Reference Numerals

[0028] 11…substrate holder, 25…box table, 25a…box, 26…substrate configuration adjustment mechanism, 261…temporary substrate placement table, 265…processing table (first configuration adjustment mechanism), 27…substrate conveying device, 270…conveying robot (second configuration adjustment mechanism), 270a…controller, 28…traveling mechanism, 29…substrate disassembling and mounting mechanism, 290…substrate disassembling and mounting device, 32…prewetting tank, 33…prepreg tank, 34…prewashing tank, 35…blowing tank, 36…rinsing tank, 37…substrate holder conveying device, 38…overflow tank, 39…electroplating tank, 50…cleaning device, 50a…cleaning unit, 61, 6 1A~61E…first sensor, 62a…light projector, 62b…light receiver, 71, 71a, 71b…second sensor, 72, 72a, 72b…second lighting device, 100…substrate processing device, 110…unloading unit, 120…processing unit, 120A…pre-processing / post-processing unit, 120B…processing unit, 161, 161a, 161b…first sensor, 162, 162a, 162b…first lighting device, 175…controller, 175A…CPU, 175B…memory, 175C…control unit, 271…robot body, 272, 273…manipulator. DETAILED DESCRIPTION

[0029] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. However, the drawings used are schematic diagrams. Therefore, the size, position, shape, etc. of the components shown in the drawings may be different from the size, position, shape, etc. in the actual device. In addition, in the following description and the drawings used in the following description, the same reference numerals are used for parts that can be configured in the same manner, and repeated descriptions are omitted.

[0030] (First Embodiment)

[0031] Figure 1 1 is an overall configuration diagram of a substrate processing apparatus 100 according to an embodiment of the present invention. In this example, the substrate processing apparatus 100 is an electrolytic plating apparatus. Here, an electrolytic plating apparatus is used as an example for description, but the present invention can also be applied to any other substrate processing apparatus such as an electroplating apparatus, a grinding apparatus, a grinding apparatus, a film forming apparatus, an etching apparatus, etc.

[0032] The substrate processing apparatus 100 is roughly divided into a process of loading a substrate (processing object) on a substrate holder 11 (in Figure 1The processing section 120 further includes a pre-processing / post-processing section 120A for performing pre-processing and post-processing of the substrate, and an electroplating processing section 120B for performing electroplating on the substrate. In addition, the substrate S includes an angular substrate and a circular substrate. In addition, the angular substrate includes a rectangular or other polygonal glass substrate, a liquid crystal substrate, a printed circuit substrate, and other polygonal processed objects. The circular substrate includes a semiconductor wafer, a glass substrate, and other circular processed objects.

[0033] The loading / unloading section 110 has a substrate configuration adjustment mechanism 26, a substrate conveying device 27, and a substrate disassembling mechanism 29. As an example, in the present embodiment, the loading / unloading section 110 has two substrate configuration adjustment mechanisms 26, namely, a substrate configuration adjustment mechanism 26A for loading to process the substrate S before processing, and a substrate configuration adjustment mechanism 26B for unloading to process the substrate S after processing. In the present embodiment, the substrate configuration adjustment mechanism 26A for loading and the substrate configuration adjustment mechanism 26B for unloading are of the same structure, and are configured to differ 180° from each other in direction. In addition, the substrate configuration adjustment mechanism 26 is not limited to a mechanism provided with substrate configuration adjustment mechanisms 26A and 26B for loading and unloading, and may not be distinguished for use for loading and unloading. In addition, in the present embodiment, the loading / unloading section 110 has two substrate disassembling mechanisms 29. The two substrate disassembling mechanisms 29 are the same mechanism, and the idle side (the side that does not process the substrate S) is used. In addition, one, three or more substrate arrangement adjustment mechanisms 26 and substrate attachment / detachment mechanisms 29 may be provided respectively according to the space in the substrate processing apparatus 100 .

[0034] The substrate arrangement adjustment mechanism 26 (substrate arrangement adjustment mechanism 26A for loading) is configured to adjust the substrate arrangement by the robot 24 from a plurality of substrates (for example, Figure 1The cassette table 25 (three in the figure) transports the substrate S. The cassette table 25 includes a cassette 25a for accommodating the substrate S. The cassette is, for example, a ring. The substrate configuration adjustment mechanism 26 is configured to adjust (align) the position and direction of the placed substrate S. The substrate disassembly and assembly device 290 is configured to be arranged on the substrate disassembly and assembly mechanism 29, and to disassemble and assemble the substrate S relative to the substrate holder 11. The substrate disassembly and assembly mechanism 29 includes a control device 29a. The control device 29a communicates with the controller 175 of the substrate processing device 100 to control the operation of the substrate disassembly and assembly mechanism 29. A substrate conveying device 27 including a conveying robot (substrate conveyor) 270 for conveying substrates between these units is configured between the substrate configuration adjustment mechanism 26 and the substrate disassembly and assembly mechanism 29. The substrate conveying device 27 includes a controller 27a. The controller 27a communicates with the controller 175 of the substrate processing device 100 to control the operation of the substrate conveying device 27.

[0035] The cleaning section 50a has a cleaning device 50 for cleaning and drying the substrate after the electroplating process. The substrate conveying device 27 is configured to convey the substrate after the electroplating process to the cleaning device 50 and take out the cleaned substrate from the cleaning device 50. Then, the cleaned substrate is handed over to the substrate arrangement adjustment mechanism 26 (substrate arrangement adjustment mechanism 26B for unloading) by the substrate conveying device 27, and returned to the box 25a by the robot 24.

[0036] The pre-processing and post-processing section 120A has a pre-wetting tank 32, a pre-impregnation tank 33, a pre-washing tank 34, a blowing tank 35, and a rinsing tank 36. In the pre-wetting tank 32, the substrate is immersed in pure water. In the pre-impregnation tank 33, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is etched and removed. In the pre-washing tank 34, the pre-impregnated substrate and the substrate holder are cleaned with a cleaning liquid (pure water, etc.). In the blowing tank 35, the liquid is removed from the cleaned substrate. In the rinsing tank 36, the electroplated substrate and the substrate holder are cleaned with a cleaning liquid. In addition, the structure of the pre-processing and post-processing section 120A of the substrate processing device 100 is an example, and the structure of the pre-processing and post-processing section 120A of the substrate processing device 100 is not limited, and other structures can be adopted.

[0037] The electroplating treatment section 120B has a plurality of electroplating tanks 39 having overflow tanks 38. Each electroplating tank 39 accommodates a substrate therein, and the substrate is immersed in the electroplating solution held therein to perform electroplating such as copper electroplating on the substrate surface. Here, the type of electroplating solution is not particularly limited, and various electroplating solutions can be used according to the application.

[0038] The substrate processing apparatus 100 has a substrate holder conveying device 37, for example, a linear motor method, which is located on the side of each of these devices and conveys substrates and substrate holders between these devices. The substrate holder conveying device 37 is configured to convey the substrate holder 11 between the substrate mounting and dismounting mechanism 29, the pre-wetting tank 32, the pre-preg tank 33, the pre-washing tank 34, the blowing tank 35, the rinsing tank 36, and the plating tank 39.

[0039] The electroplating processing system including the substrate processing apparatus 100 configured as described above has a controller 175 configured to control the above-mentioned parts. The controller 175 has a memory 175B storing various setting data and various programs, a CPU 175A executing the program of the memory 175B, and a control unit 175C realized by the CPU 175A executing the program. The recording medium constituting the memory 175B can include one or more of any recording media such as ROM, RAM, hard disk, CD-ROM, DVD-ROM, and floppy disk. The programs stored in the memory 175A include, for example, a program for controlling the substrate configuration adjustment mechanism 26, a program for controlling the conveyance of the substrate conveying device 27, a program for controlling the disassembly and attachment of the substrate to the substrate holder 11 in the substrate disassembly and attachment mechanism 29, a program for controlling the conveyance of the substrate holder conveying device 37, and a program for controlling the electroplating process in each electroplating tank 39. The controller 175 is configured to be able to communicate with a host controller (not shown) that centrally controls the substrate processing apparatus 100 and other related devices, and to be able to exchange data with a database of the host controller.

[0040] The substrate arrangement adjustment mechanism 26 is described in detail. As described above, in this embodiment, the loading substrate arrangement adjustment mechanism 26A and the unloading substrate arrangement adjustment mechanism 26B are arranged 180 degrees apart from each other but have the same structure, so they are collectively referred to as the substrate arrangement adjustment mechanism 26 for description. Figure 2 as well as Figure 3 2 is a schematic diagram illustrating the substrate arrangement adjustment mechanism 26 according to the first embodiment. Figure 2 It is a top view. Figure 3 yes Figure 2 This is a side view observed along the F3-F3 direction (along the y direction). Figure 2 as well as Figure 3 In FIG. 1 , the substrate S is shown by a dotted line. Figure 2 Set the up and down direction of Figure 2 as well as Figure 3 The left and right directions are set to "y direction", and Figure 3 The vertical direction (vertical direction) of is set as the "z direction" for explanation. In this embodiment, Figure 2 as well as Figure 3As shown, the case where the first sensors 61 ( 61A to 61E) are provided in the substrate arrangement adjustment mechanism 26 will be described as an example.

[0041] like Figure 2 As shown, the substrate configuration adjustment mechanism 26 includes a temporary substrate placement table 261 and a processing table 265 (workbench, first configuration adjustment mechanism). The substrate S is taken out from the box 25a by the robot 24 and transported to the temporary substrate placement table 261. The temporary substrate placement table 261 is configured to enable the substrate S to move in the z direction (vertical direction) on the upper surface. In addition, although in the present embodiment, the loading surfaces of the substrate S on the temporary substrate placement table 261 and the processing table 265 are horizontally defined, in other words, defined along the x direction and the y direction, it is not limited to such an example. The temporary substrate placement table 261 is Figure 2 In the example shown, there are three support parts 262, 263, and 264 separated from each other for supporting the substrate S placed thereon. The temporary substrate placement table 261 includes a controller 261a (see Figure 3 ). The controller 261a is connected to the controller 175 of the substrate processing apparatus (see Figure 1 ) to communicate and control the operation of the temporary substrate placement table 261.

[0042] The processing table 265 is configured to receive the substrate S placed on the temporary substrate placement table 261, and is capable of adjusting the position and direction of the substrate S. The processing table 265 has two support parts 266 and 267 separated from each other for supporting the substrate S placed on the upper surface. Here, in the present embodiment, the support parts 262 to 264 of the temporary substrate placement table 261 and the support parts 266 and 267 of the processing table 265 are configured to support different regions of the substrate S. In other words, the temporary substrate placement table 261 is configured to support a first region of the substrate S, and the processing table 265 is configured to support a second region of the substrate S that is different from the first region. In addition, the processing table 265 is configured not to overlap with a predetermined corner of the substrate S in the up and down direction (z direction). The processing table 265 is configured to be able to move the substrate S in the x direction and the y direction, and to be able to rotate the substrate S in the θ direction around the z direction. The processing table 265 has a controller 265a (refer to Figure 3 ). The controller 265a is connected to the controller 175 of the substrate processing device (see Figure 1 ) to communicate and control the operation of processing station 265.

[0043] Figure 4 as well as Figure 5 The state where the substrate S is placed on the temporary substrate placement table 261 by the substrate conveying device 27 is shown in FIG. Figure 2 as well as Figure 3 The corresponding figure. Figure 4 as well as Figure 5As shown, if the substrate S is placed on the temporary substrate placement table 261 by the robot 24, then the processing table 265 moves to the bottom of the temporary substrate placement table 261. In addition, the processing table 265 can also be moved to the bottom of the temporary substrate placement table 261 before or at the same time as the substrate S is placed on the temporary substrate placement table 261.

[0044] Then, if Figure 6 As shown, the temporary substrate placement table 261 moves downward (in the z direction) to place the substrate S on the processing table 265. As described above, the temporary substrate placement table 261 and the processing table 265 are configured to support different areas of the substrate S. Therefore, by moving the temporary substrate placement table 261 downward, the substrate S can be transferred in a manner that the supporting parts 262 to 264 of the temporary substrate placement table 261 and the supporting parts 266 and 267 of the processing table 265 do not interfere with each other.

[0045] Next, if Figure 7 As shown, the processing table 265 moves in the y direction from directly below the temporary substrate placement table 261 to a predetermined position for adjusting the configuration of the substrate, that is, a configuration adjustment position (robot transfer position). Figure 7 As shown, a first sensor is configured at the configuration adjustment position. Figure 2 to Figure 8 In the example shown, the first sensor 61 (61A to 61E) is fixed at the arrangement adjustment position regardless of the position of the processing table 265. However, the present invention is not limited to this example, and the first sensor 61 may be moved integrally with the processing table 265.

[0046] Then, if Figure 8 As shown, the processing station 265 is in the configuration adjustment position, and adjusts the position of the substrate S in the x-direction and the y-direction, and the rotation angle θ (direction). Here, the rotation angle θ of the substrate S is defined as the angle at which the side of the substrate S along the x-axis (or y-axis) is inclined relative to the x-axis (or y-axis) in the x-y plane. In addition, the processing station 265 can also change the direction of the substrate S by 90 degrees or 180 degrees as required. If the configuration of the substrate S is adjusted by the processing station 265, the substrate S is then transported to the substrate disassembly device 290 by the substrate conveying device 27.

[0047] Refer again Figure 2 as well as Figure 3. In the present embodiment, the first sensor 61 (61A to 61E) is provided in the substrate configuration adjustment mechanism 26. The first sensor 61 (61A to 61E) is arranged at a position capable of detecting the outer shape of the substrate S when the substrate S is transported to a predetermined transport position (robot transport position) through the processing table 265. In the present embodiment, a plurality of (five as an example) laser sensors 61A to 61E are used as the first sensor 61. As an example, each laser sensor 61A to 61E has a light projecting body 62a in which a plurality of laser light projecting elements are arranged in a line, and a light receiving body 62b in which a plurality of light receiving elements are arranged in a line. The laser sensors 61A to 61E can determine the light entry / light blocking in each light receiving element by comparing the amount of light received by the light receiving body 62b with a predetermined binary level, and measure the edge portion (edge) of the substrate S. As such laser sensors 61A to 61E, for example, the IG series (IG-028 as an example) of Keyence Corporation can be used. In particular, by using such a laser sensor, the outer shape of the substrate S can be measured with good accuracy regardless of the light transmittance of the substrate S. In addition, the first sensor 61 can be any sensor that can measure the outer shape of the substrate S in order to adjust the position of the substrate S, and one to four, or six or more sensors can be used. In addition, the first sensor is not limited to the laser sensor 61, and various sensors such as a mechanical switch or a pressure sensor that is accompanied by mechanical contact with the substrate S, an image sensor, or an ultrasonic sensor can be used.

[0048] In this embodiment, the substrate S is a substantially rectangular substrate having four sides L1, L2, L3, and L4 and four corners P1, P2, P3, and P4 (see Fig.10 ). In addition, the center Pa0 of the substrate S can be defined as the intersection of the two diagonal lines. Figure 2As shown, as the first sensor 61, five laser sensors are used, including laser sensors 61A and 61B for measuring the position of the first opposing edge portions (L1, L3) on the substrate S, laser sensors 61C and 61D for measuring the position of the second opposing edge portions (L2, L4) on the substrate S, and laser sensor 61E for measuring the rotation angle θ together with any one of the laser sensors 61A to 61D. The five laser sensors 61A to 61E are fixed to a frame (not shown) on the substrate processing device 100, and their respective positions are calibrated in advance. In the first sensor 61, based on the detection of the position of the first opposing edge portions by the laser sensors 61A and 61B, the size in the first direction (y direction) and the center position (ya0) of the first direction (y direction) are measured. In addition, based on the detection of the position of the second opposing edge portions by the laser sensors 61C and 61D, the size in the second direction (x direction) and the center position (xa0) of the second direction (x direction) are measured. Furthermore, the rotation angle θa0 of the substrate S is measured based on the detection of any one of the laser sensors 61A to 61D (for example, the laser sensor 61A) and the laser sensor 61E. Then, based on the measured position of the substrate S, the processing station 265 adjusts the position of the substrate S in the x direction and the y direction, and the rotation angle θ (direction), so that the substrate S is configured at a specified target setting position (first target setting position). In the present embodiment, when the substrate S is configured to the configuration adjustment position by the processing station 265, the correct position to which the substrate S should be configured is referred to as the "target setting position (first target setting position)". In addition, although not limited to, when the direction of the substrate S is changed by a predetermined angle such as 90 degrees or 180 degrees by the processing station 265, the target setting position is the correct position to which the substrate S should be configured after the direction change. In the present embodiment, as reference values ​​corresponding to the first target setting position, the target center position (xat, yat) of the center of the substrate S and the target rotation angle θat of the substrate S are used.

[0049] If the arrangement of the substrate S is adjusted by the processing table 265 (first arrangement adjustment mechanism) in the substrate arrangement adjustment mechanism 26A for loading, the substrate S is transported to the substrate mounting and dismounting mechanism 29 by the transport robot 270. Furthermore, if the arrangement of the substrate S is adjusted by the processing table 265 in the substrate arrangement adjustment mechanism 26A for unloading, the substrate S is returned to the box 25a by the robot 24. Thus, the substrate S can be returned to the box 25a in the state in which the arrangement is adjusted.

[0050] Fig. 9 2 is a diagram for explaining the arrangement and adjustment of the substrate S in the substrate mounting and dismounting mechanism 29. Fig. 9In FIG. 1 , an example of the substrate disassembly and assembly mechanism 29 is shown, but the substrate disassembly and assembly mechanism is not limited to such an example. For example, the substrate disassembly and assembly device described in Japanese Patent Application No. 2018-190116 can also be used as the substrate disassembly and assembly mechanism. Fig. 9 In the example shown, the substrate mounting and dismounting mechanism 29 includes a substrate mounting and dismounting device 290 having a rotating device 1200. The second holding member 400 of the substrate holder 11 is mounted on the rotating device 1200. In this state, the substrate S is mounted on the second holding member 400. The substrate S is transported to the second holding member 400 by the transport robot 270. In addition, the substrate holder 11 is a member that further includes a first holding member (not shown) and clamps and holds the substrate S between the first holding member and the second holding member 400.

[0051] The conveying robot 270 includes a robot body 271, a manipulator 272 mounted on the robot body 271, and a controller 270a. The movement of the manipulator 272 is controlled by the controller 270a. The manipulator 272 can hold the substrate S in a contact or non-contact manner. The manipulator 272 holds the substrate S in a non-contact manner, for example, by a Bernoulli chuck. Preferably, the manipulator 272 also has a chuck that limits the position of the substrate in the XY plane relative to the manipulator. The conveying robot 270 is a multi-axis robot that can move the position of the substrate S held by the manipulator 272 in the x, y, z directions, and the rotation direction (θ direction). The x, y, and z axes are defined as Fig. 9 The x-axis and the y-axis are parallel to the installation surface 800, and the z-axis is perpendicular to the installation surface 800. In addition, there are cases where two or more robots are installed.

[0052] In this embodiment, the conveying robot 270 is equivalent to the second configuration adjustment mechanism, and before the substrate S is set on the substrate disassembling device 290, the substrate disassembling mechanism 29 further adjusts the configuration of the substrate S through the conveying robot 270. In this embodiment, when the substrate S is set on the substrate disassembling device 290 by the conveying robot 270, the correct position to which the substrate S should be configured is referred to as the "target setting position (second target setting position)".

[0053] The substrate mounting and disassembling mechanism 29 is provided with a second sensor 71. The second sensor 71 is a sensor capable of detecting feature points (e.g., predetermined alignment marks or recesses or mask patterns) pre-formed on the surface of the substrate S, such as an image sensor. Fig. 9 In the example shown, the second lighting device 72 (72a, 72b) is disposed on the same side of the substrate S as the second sensor 71 (71a, 71b). Fig. 9In the example shown, the second sensor 71 and the second lighting device 72 are both disposed above the substrate S. The second lighting device 72 is, for example, a ceiling light composed of LEDs. In addition, although not limited thereto, it is preferred that the second lighting device 72 is disposed obliquely relative to the surface of the substrate S so that the irradiated light of the second lighting device 72 does not directly reflect and invade the second sensor 71. When the second sensor 71 photographs the surface of the substrate S, the second lighting device 72 illuminates the substrate S, so that the feature points pre-formed on the surface of the substrate S can be made clear. However, the substrate processing apparatus 100 may not include such a lighting device 72.

[0054] Next, the imaging position of the substrate S by the second sensor 71 and the target setting position (second target setting position) of the substrate S in the substrate mounting and dismounting mechanism 29 will be described in detail. Fig.10 1 is a diagram schematically showing an example of a plan view of the substrate S. Fig.11 is a diagram for explaining the rotation angle of the substrate S. As described above, in the present embodiment, the substrate S is a substantially rectangular angular substrate having four sides L1, L2, L3, L4, and four corners P1, P2, P3, P4. Fig.10 , Fig.11As shown, in the present embodiment, an alignment mark 73 is pre-formed on the substrate S. The alignment mark 73 is a mark pre-formed before the substrate S is put into the substrate processing apparatus 100 as a feature point for detection by the second sensor 71. It is preferred that the alignment mark 73 is formed together with a pattern such as a recess or a mask formed on the substrate S before being put into the substrate processing apparatus 100. In addition, the alignment mark 73 can be any shape and size as long as it is a mark that can detect the position by the second sensor 71. Moreover, the position where the feature point should be formed on the substrate S is pre-stored in any one of the controllers of the substrate processing apparatus 100. Specifically, in the present embodiment, as a reference value corresponding to the second target setting position, the target position (xbt, ybt) of the midpoint of the alignment mark 73 and the target inclination angle θbt are pre-stored. Although not limited, it is preferred that the alignment mark 73 is set near at least two of the corners P1 to P4 of the substrate S. In particular, the alignment mark 73 can be set near two corners on the diagonal line of the substrate S. As an example, in the present embodiment, the alignment mark 73 is arranged near the two corners P1 and P3. In addition, although it is not limited, in the present embodiment, the two alignment marks 73 are arranged at positions symmetrical with respect to the center of the substrate S without positional deviation, and the midpoint Pb0 of the two alignment marks 73 coincides with the center Pa0 of the substrate S. In addition, although in the present embodiment, two alignment marks 73 are formed on the substrate S as feature points, one, or three or more alignment marks 73 may be formed. In addition, instead of the alignment mark 73, or in addition to it, a pattern such as a recessed portion or a mask pre-formed on the plate surface of the substrate S may be used as a feature point pre-formed on the plate surface of the substrate S.

[0055] Fig.12 , Fig.13 2 is a diagram for explaining the photographing position of the second sensors 71a and 71b. The second sensors 71a and 71b are respectively fixed to a frame (not shown) in the substrate processing apparatus 100 so as to be able to photograph the alignment mark 73 when the substrate S is transported to the assumed position (second target setting position) on the substrate mounting and dismounting apparatus 290 by the transport robot 270. Fig.12 as well as Fig.13 As shown, the second sensors 71a and 71b are arranged so that the center C2 of the imaging part (e.g., lens) thereof is arranged at a position that coincides with the center of the alignment mark 73 of the substrate S when the substrate S is arranged at the assumed position (just above the second holding member 400, the second target setting position) on the substrate mounting and dismounting mechanism 29 when viewed from above. Fig.12 as well as Fig.13In FIG. 1 , an example in which the alignment mark 73 is located at an assumed position (center C2 of the imaging unit) is shown by a dotted line, and an example in which the position of the alignment mark 73 is deviated from the center C2 of the imaging unit is shown by a solid line.

[0056] In such a second sensor 71, the midpoint position (xb0, yb0) and the inclination angle θb0 of the line connecting the two marks are calculated based on the positions of the alignment marks 73 measured by the two second sensors 71a and 71b. In addition, the controller may perform image processing on the entire imaging area of ​​the second sensor 71 in order to detect the position of the alignment mark 73, or may perform image processing on the area near the assumed position (center C2 of the imaging unit) of the alignment mark 73 (in the vicinity of the imaging unit). Fig.12 In the embodiment, the target midpoint position (xbt, ybt) and the target tilt angle θbt are used as reference values ​​corresponding to the second target setting position. Then, the conveying robot 270 moves the substrate S in the horizontal direction (x direction and y direction) and the rotation direction, and adjusts the position of the substrate S so that the midpoint position (xb0, yb0) and the tilt angle θb0 of the alignment mark 73 of the second sensor 71 are close to the reference values ​​at the second target setting position.

[0057] Next, the arrangement adjustment of the substrate S in the above-mentioned substrate processing apparatus 100 will be described according to the flowchart. Fig.14 1 is a flowchart showing an example of a process of adjusting the arrangement of the substrate S executed by at least one of various controllers (referred to simply as "controller") in the substrate processing apparatus 100. The process starts when the robot 24 places the substrate S on the substrate arrangement adjustment mechanism 26 (substrate arrangement adjustment mechanism 26A for loading).

[0058] First, the substrate S is transferred from the temporary substrate placement stage 261 to the processing stage 265, and the substrate S is transported to the robot transfer position by the processing stage 265 (step S12). Figure 2 to Figure 7 The processing of step S12 is described above. In addition, when the substrate S is rotated 90 degrees or 180 degrees in the processing station 265, the controller rotates the substrate S. However, the rotation of the substrate S may be performed after the measurement of the first sensor 61 described below. In addition, the controller may also determine whether to rotate the substrate S based on the measurement of the first sensor 61.

[0059] Next, the outer shape of the substrate S is measured by the first sensor 61 (step S16). Thus, the size, position, and rotation angle of the substrate S are calculated. Then, the controller determines whether the outer shape (size) of the substrate S is within the reference range (step S18). As the reference range, for example, it can be a predetermined range such as a few percent error relative to the desired substrate size. In step S18, for example, when the warping of the substrate S is large, it is determined that the outer shape of the substrate S is outside the reference range. Moreover, when the outer shape of the substrate S is not within the reference range (outside the reference range) (step S18: No), the controller performs a predetermined abnormal judgment processing (step S38) and ends the configuration adjustment processing. As the abnormal judgment processing, for example, the controller does not perform the subsequent processing on the substrate S, but (controls the substrate processing device 100) to return the substrate S to the box 25a. Alternatively, the substrate S can also be transported to a predetermined position different from the normal conveying position. In addition, as the abnormal judgment processing, it can also include an alarm in the substrate processing device 100, or an abnormal signal is sent from the substrate processing device 100 to the outside to report the abnormal situation. Thus, the administrator of the substrate processing apparatus 100 or the like can recognize and determine the abnormality of the substrate S.

[0060] Next, it is determined whether the error between the coordinates (xa0, ya0) of the center position of the substrate S and the rotation angle θa0 calculated based on the measurement of the first sensor 61 and the reference value (target center position (xat, yat) and rotation angle θat=0) corresponding to the first target setting position is within a specified range (step S20). Here, as the specified range, a predetermined range based on the accuracy of the configuration adjustment of the processing table 265 can be used. Moreover, if the error between the calculated coordinates (xa0, ya0) of the center position and the rotation angle θa0 and the target center position and the rotation angle is outside the specified range (step S20: No), based on the error amount, the processing table 265 is moved in the x direction, the y direction, and / or the rotation direction θ in the x-y plane, and the configuration of the substrate S is adjusted so that the configuration of the substrate S is close to the target setting position (first target setting position) (step S22). Thereafter, the processing of steps S16, S20, and S22 is repeatedly performed until the errors between the coordinates of the center position of the substrate S and the rotation angle calculated by the measurement of the first sensor 61 and the target center position and the rotation angle are within a prescribed range. Then, when the errors between the coordinates of the center position of the substrate S and the rotation angle calculated by the first sensor 61 and the target center position and the rotation angle are within a prescribed range (step S20: yes), the processing enters the processing of step S24 described below. In this way, the configuration of the substrate S can be adjusted with good accuracy by detecting the outer shape of the substrate S through the first sensor 61 and adjusting the configuration of the substrate S based on the detection result.

[0061] In addition, in this embodiment, the configuration adjustment of the substrate S based on the processing table 265 can be performed with good accuracy, and the substrate S can usually be set within a specified range relative to the target setting position (first target setting position) through a single configuration adjustment (step S22). Therefore, the substrate processing device 100 may adjust the configuration of the substrate S using the processing table 265 in the processing of step S22, and then enter the processing after step S24 without returning to the processing of step S16. In addition, the substrate processing device 100 may also Fig.14 In the process shown, when it is determined in step S20 that the error is outside the predetermined range for the same substrate S a plurality of times (for example, twice, three times, etc.), it is determined that an abnormality has occurred in the processing stage 265 or the first sensor 61 .

[0062] If the configuration of the substrate S is adjusted to within the specified range relative to the first target setting position based on the measurement of the first sensor 61, the controller transports the substrate S to the substrate disassembly and assembly device 290 through the conveying robot 270 (step S24). The conveying robot 270 is pre-adjusted to convey the substrate S to the assumed position (second target setting position) in the substrate disassembly and assembly device 290. In step S24, the state of holding the substrate S by the hand of the conveying robot 270 is maintained. In this embodiment, the conveying of the substrate S by the conveying robot 270 can be performed with good accuracy, and the substrate S can be conveyed to the substrate disassembly and assembly device 290 while maintaining the configuration adjustment of the processing table 265.

[0063] Next, in the substrate disassembly device 290, the second sensor 71 is used to capture the characteristic points (alignment marks 73 in this embodiment) of the substrate S (step S26). Based on the image, the coordinates (xb0, yb0) of the midpoint position of the characteristic points and the inclination angle θb0 of the line connecting the characteristic points are calculated.

[0064] Next, the controller determines whether the error between the calculated midpoint coordinates (xb0, yb0) and the tilt angle θb and the reference values ​​(target midpoint position (xbt, ybt) and target tilt angle θbt) corresponding to the second target setting position is within the prescribed allowable range (step S28). Fig.14Step S28 is a determination of "whether the position of the feature point is within the allowable range", but for the convenience of illustration and the concept of the invention, it is generally described. In the present embodiment, the determination of step S28 is performed based on the positional relationship of the two alignment marks 73 as feature points. Here, as the allowable range, a predetermined range based on the accuracy of the configuration adjustment of the processing table 265 and the conveying robot 270, and the position deviation range of the substrate allowed when the substrate S is held on the substrate holder can be used as a range for determining the abnormality of the substrate S. The substrate S is configured by the processing table 265 based on the measurement and adjustment of the shape of the first sensor 61. Usually, the position of the feature point calculated according to the measurement of the second sensor 71 is within the allowable range relative to the reference value corresponding to the second target setting position. Moreover, when the position of the feature point calculated according to the measurement of the second sensor 71 is within the allowable range (step S28: yes), the controller then determines whether the calculated position of the feature point is within the specified range (step S30). In this embodiment, the processing of step S30 is the same as that of step S28, and it is determined whether the error between the calculated midpoint coordinates (xb0, yb0) and the inclination angle θb and the reference value corresponding to the second target setting position (target midpoint position (xbt, ybt) and target inclination angle θbt) is within a specified range. Here, as the specified range, a predetermined range based on the range of positional deviation of the substrate allowed for the uniformity of electroplating, and the accuracy of the transfer robot 270 or the substrate disassembly mechanism 29 and the substrate holder 11 to transfer the substrate S can be used as a range for determining whether to adjust the configuration of the substrate S. In addition, the specified range in step S30 is a range smaller than the allowable range in step S28. When the calculated position of the feature point is not within the specified range (outside the specified range) (step S30: No), based on the error between the calculated position of the feature point and the second target setting position, the hand of the conveying robot 270 is moved in the x direction, the y direction, and / or the rotation direction θ in the x-y plane, and the configuration of the substrate S is adjusted so that the substrate S approaches the second target setting position (step S32). Thereafter, the processing of steps S26, S30, and S32 is repeatedly performed until the error between the midpoint position and the tilt angle of the feature point calculated according to the measurement of the second sensor 71 and the reference value corresponding to the second target setting position is within the specified range.

[0065] When the position of the characteristic point calculated based on the measurement of the second sensor 71 is within the specified range (step S30: yes), the controller sets the substrate S to the substrate disassembly and assembly mechanism 29 through the conveying robot 270 (step S34). Then, the controller controls the substrate disassembly and assembly mechanism 29 to install the substrate S on the substrate holder 11 (step S36), and ends this process. Alternatively, the conveying robot 270 can directly hand over the substrate S to the second holding member 400 of the substrate holder 11. In this way, in this embodiment, the characteristic point of the substrate S is measured by the second sensor 71, and the configuration of the substrate S is adjusted based on the measurement result and the substrate S is installed on the substrate holder 11. Thus, even if the substrate S is warped or the substrate S is a transparent substrate and the substrate alignment using the outer shape reference using a camera cannot be performed, the substrate S can be held in an appropriate position on the substrate holder 11, and the subsequent processing can be performed more appropriately.

[0066] On the other hand, if the coordinates (xb0, yb0) and the inclination angle θb calculated by the measurement of the second sensor 71 and the reference value corresponding to the second target setting position are out of the allowable range in step S28 (step S28: No), the controller determines that the position of the feature point on the substrate S is abnormal, and causes the processing to enter the prescribed abnormality determination processing (step S38). To reiterate, in the determination of step S28, the configuration of the substrate S is adjusted in advance based on the calculated value based on the measurement of the first sensor 61. Therefore, when the position of the feature point measured by the second sensor 71 deviates greatly from the position where the feature point should be formed (reference value at the second target setting position), the controller determines that the pattern of the substrate S has a large deviation, or the outer shape of the substrate S is missing, and an abnormality occurs in the substrate S. By such a determination, the abnormality of the substrate S can be determined with good accuracy. As the abnormality determination processing when it is determined that the substrate S has an abnormality, for example, the controller does not perform subsequent processing on the substrate S, but (controls the substrate processing device 100) to return the substrate S to the box 25a. Alternatively, the substrate S can be transported to a prescribed position different from the normal transport position. In addition, as an abnormality determination process, it may also include an alarm in the substrate processing device 100, or an abnormality signal is sent from the substrate processing device 100 to the outside to report the abnormality. Thus, the manager of the substrate processing device 100 can identify and determine the abnormality of the substrate S. In most cases, a large deviation in the pattern of the substrate S can be considered as a defective product. According to the present embodiment, it is possible to remove a defective substrate from the production line without electroplating. In addition, if the substrate S has a deviation in the pattern, the substrate is aligned based on the feature point, and the position of the substrate itself is adjusted with a large displacement. In this case, there is a possibility that the substrate S is placed on the substrate holder 11, or the contact point of the substrate holder 11 is not in contact at the correct position, and the substrate S cannot be properly held on the substrate holder 11. According to the present embodiment, the problem caused by the deviation of the pattern of the substrate S can be avoided, and the substrate is aligned based on the feature point, so that the substrate S is held on the substrate holder 11.

[0067] (Second Embodiment)

[0068] Fig.15 It is a schematic diagram for explaining the configuration adjustment of the substrate S in the second embodiment. In the substrate processing device of the second embodiment, the first sensor and the second sensor 71 are provided in the substrate disassembly and assembly mechanism 29. Specifically, in the second embodiment, a plurality of (two as an example) image sensors 161a, 161b are fixedly provided on the frame (not shown) of the substrate disassembly and assembly mechanism 29 as the first sensor 161. In addition, in the second embodiment, the first lighting device 162 (162a, 162b) is provided on the opposite side of the substrate S to the first sensor 161 (161a, 161b). Fig.15 In the example shown, the first sensor 161 is disposed above the substrate S, and the first lighting device 162 is disposed below the substrate S. The first lighting device 162 is configured to illuminate the corner of the substrate S from the opposite side to the first sensor 161. The first lighting device 162 is, for example, a backlight composed of LEDs. When the first sensor 161 photographs the corner of the substrate S, the first lighting device 162 illuminates the substrate S from the opposite side, so that the background of the substrate S becomes white, and the outline of the substrate S can be made clear.

[0069] The first lighting device 162 is configured to be movable between a position corresponding to the first sensor 161, that is, a photographing position and a retreat position moved outward from the photographing position. This is to avoid obstructing the conveying path of the robot 272 conveying the substrate S to the second holding member 400. The mechanism for moving the first lighting device 162 can be a mechanism using various power sources such as a motor, a solenoid, or a pneumatic actuator.

[0070] Fig.16 1 is an explanatory diagram for explaining the shooting positions of the first sensor 161 and the second sensor 71 in the second embodiment. Here, the shooting position of the second sensor 71 is the same as that in the first embodiment, so the description is omitted. Fig.16 As shown, the first sensor 161 is arranged so that the center C1 of the photographing part (e.g., lens) of the first sensor 161 is arranged at a position after the corners P1 and P3 of the substrate S placed at an assumed position (a target setting position, or a position rotated 90° or 180° from the target setting position) are displaced inward by a predetermined distance Δx and Δy in the x and y directions. In other words, the center C1 of the first sensors 161a and 161b corresponds to a position located inside the substrate S compared to the position of the corner (vertex) of the substrate S. According to this configuration, the first sensor 161 can capture a wider range near the corners P1 and P3 of the substrate S, and the detection accuracy of the position of the corner can be improved. For example, a longer range of two adjacent sides (adjacent two sides (L1-L4, L2-L3)) in each corner can be captured, and the calculation accuracy of the positions of the corners P1 and P3 as the revolution of the adjacent two sides and the calculation accuracy of the rotation angle θ of the substrate S calculated based on the inclination of at least one of the adjacent two sides can be improved. Furthermore, the distances by which the centers C1 of the first sensors 161a and 161b are displaced inwardly of the substrate S may be different in each sensor. In addition, the centers C1 of the imaging parts of only a portion of the sensors may be displaced inwardly. In other embodiments, the centers C1 of the imaging parts of a portion or all of the first sensors 161 may coincide with the positions of the corners of the substrate when viewed from above, or may be located outside the substrate compared to the positions of the corners of the substrate. Fig.16In the example shown, the first sensor 161 captures images near the corners of the alignment marks 73, but the present invention is not limited to this example. In the second embodiment, the first sensor 161 and the second sensor 71 capture images at different positions, but they may overlap at least in part.

[0071] In the second embodiment, the controller detects the position and inclination θa of the edge by image processing based on the image information of the corner periphery captured by the first sensor 161. In addition, the controller may perform image processing on the entire captured area of ​​the first sensor 161 to detect the position and inclination θa of the edge, or may perform image processing on the area near the assumed position of the edge (in the vicinity of the corner periphery). Fig.16 In the example, the controller calculates the intersection of two adjacent sides as the position of the corner of the substrate S. By calculating the position of the corner as the intersection of two adjacent sides, the position of the corner can be correctly calculated even when there is R at the corner or when the position of the vertex is unclear. Then, the controller calculates the center position (xa0, ya0) of the substrate S based on the calculated position of the corner.

[0072] Next, arrangement adjustment of the substrate S in the second embodiment will be described according to the flowchart. Fig.17 FIG. 2 is a flowchart showing an example of a process for adjusting the arrangement of the substrate S in the second embodiment. Fig.17 In, with Fig.14 The same reference numerals are used for the same processes as those in the first embodiment, and the description of the processes overlapping with those in the first embodiment will be omitted below.

[0073] When the substrate S is transported to the substrate mounting and dismounting mechanism 29 by the robot 272, Fig.17The processing shown. First, the controller conveys the substrate S to the specified position of the substrate disassembly and assembly mechanism 29 through the conveying robot 270 (step S12A). The conveying robot 270 pre-adjusts the substrate S to be conveyed to the assumed position (first target setting position) on the substrate disassembly and assembly device 290. In step S12A, the state of holding the substrate S by the hand of the conveying robot 270 is maintained. Next, the controller uses the first sensor 161 to measure the shape of the substrate S (step S16). In addition, before the processing of step S16, the controller moves the first lighting device (backlight) 162 from the retreat position to the shooting position, and uses the first lighting device 162 to illuminate the corner of the substrate S. Next, the controller confirms whether the shape of the substrate S is within the reference range (step S18) in the same way as the first embodiment, and performs abnormal judgment processing when it is determined that the shape of the substrate S is outside the reference range (step S38). In addition, when the controller determines that the outer shape of the substrate S is within the reference range, based on the calculated coordinates (xa0, ya0) and the rotation angle θa using the first sensor 161, the position of the substrate S is adjusted by the conveying robot 270 so that the position of the substrate S is within the specified range relative to the target setting position (first target setting position) (steps S20, S22A). Here, as the first target setting position, it can be the same as the target setting position of the substrate S in the substrate disassembly and assembly mechanism 29, that is, the second target setting position. However, it is not limited to such an example, and the first target setting position can also be a position different from the second target setting position. In this way, by using the first sensor 161 to detect the outer shape of the substrate S and adjusting the configuration of the substrate S based on the detection result, the configuration of the substrate S can be adjusted with good precision.

[0074] Furthermore, if the configuration of the substrate S is adjusted based on the detection of the first sensor 161, the controller adjusts the configuration of the substrate S based on the detection of the second sensor 71 (steps S26 to S32) as in the first embodiment. As a result, the substrate S can be held at a location more suitable for the pattern formed on the substrate S by the substrate holder 11 (step S36), and subsequent processing can be performed more appropriately. In addition, after adjusting the configuration of the substrate S based on the detection of the first sensor 161 or after adjusting the configuration of the substrate S based on the detection of the second sensor 71, the controller can move the first lighting device 162 from the shooting position to the retreat position.

[0075] (Third Embodiment)

[0076] Fig.18 2 is a schematic diagram for explaining the arrangement adjustment of the substrate S in the third embodiment. In the substrate processing apparatus of the third embodiment, the first sensor 61 and the second sensor 71 are provided in the substrate arrangement adjustment mechanism 26. Fig.18In the third embodiment, the second lighting device 72 is not shown, but the second lighting device 72 for the second sensor 71 may be provided in the substrate configuration adjustment mechanism 26. In the third embodiment, the controller adjusts the configuration of the substrate S through the processing table 265 based on the measurement of the outer shape of the substrate S by the first sensor 61, as in the first embodiment. Moreover, the controller adjusts the configuration of the substrate S through the processing table 265 based on the detection of the feature point of the second sensor 71. In such a third embodiment, the substrate S is also subsequently configured to the substrate disassembly device 290 by the conveying robot 270, so that the substrate S can be held at a position more suitable for the pattern formed on the substrate S by the substrate holder 11, as in the first and second embodiments. In addition, in the third embodiment, the second sensor 71 may be provided only in the substrate configuration adjustment mechanism 26A for loading, and not in the substrate configuration adjustment mechanism 26B for unloading.

[0077] (Variation Example)

[0078] In the first to third embodiments described above, as an example of a substrate processing device, an electroplating device that immerses the substrate S in an electroplating solution is described. However, as a substrate processing device, it is not limited to such an electroplating device, for example, it is also possible to use a device that performs surface treatment of the substrate by washing the substrate with a processing liquid such as an electroplating solution. As such a device, it is also possible to include a plurality of processing units arranged in a straight line, such as a water washing processing unit, a decontamination processing unit, and an electroless plating processing unit. In addition, the substrate processing device is not limited to an electroplating device, and it can also be any other device such as an electroplating device, a grinding device, a grinding device, a film forming device, an etching device, etc.

[0079] Furthermore, in the first to third embodiments, the alignment is finally performed based on the position of the feature point measured by the second sensor 71. However, the detection of the feature point by the second sensor 71 may be used only for the detection of the deviation of the pattern of the substrate S, and the alignment of the substrate S to the substrate holder may be performed only by the detection of the outer shape by the first sensor. In this case, it is also possible to remove defective substrates from the production line without performing electroplating.

[0080] Several embodiments of the present invention have been described above, but the embodiments of the invention described above are embodiments for facilitating the understanding of the present invention and do not limit the present invention. The present invention can certainly be changed and improved within the scope of its main purpose, and the present invention includes its equivalents. In addition, any combination or omission of the constituent elements described in the claims and the specification can be performed within the scope of at least a part of the above-mentioned problems, or within the scope of at least a part of the effects.

[0081] This application claims priority to Japanese Patent Application No. 2020-384 filed on January 6, 2020. The entire contents are incorporated herein by reference. The entire disclosure of Japanese Patent Application Publication No. 2018-168432 (Patent Document 1) including the specification, claims, drawings, and abstract is incorporated herein by reference.

[0082] The present embodiment described above can also be described as the following aspects.

[0083] [Method 1] According to method 1, a substrate processing device is proposed, characterized in that the above-mentioned substrate processing device comprises: a substrate holder for holding a substrate; a substrate disassembly and assembly mechanism for mounting the substrate on the above-mentioned substrate holder; a first sensor for detecting the configuration of the substrate based on the outer shape of the substrate; a second sensor for detecting feature points pre-formed on the board surface of the substrate; a configuration adjustment mechanism configured to adjust the configuration of the substrate; and a control unit, the above-mentioned control unit controls the above-mentioned configuration adjustment mechanism to adjust the configuration of the above-mentioned substrate based on the detection of the above-mentioned first sensor, the above-mentioned control unit controls the above-mentioned second sensor to detect feature points pre-formed on the board surface of the substrate whose configuration is adjusted based on the detection of the above-mentioned first sensor, the above-mentioned control unit confirms whether the position of the feature point detected by the above-mentioned second sensor is within the allowable range, the above-mentioned control unit controls the above-mentioned configuration adjustment mechanism to adjust the configuration of the above-mentioned substrate based on the detection of the above-mentioned second sensor when the position of the feature point detected by the above-mentioned second sensor is within the above-mentioned allowable range, and the above-mentioned control unit controls the above-mentioned substrate disassembly and assembly mechanism to mount the substrate on the above-mentioned substrate holder after adjusting the configuration of the above-mentioned substrate based on the detection of the above-mentioned second sensor.

[0084] According to aspect 1, the substrate can be positioned and held on the substrate holder with high accuracy.

[0085] [Method 2] According to method 2, in method 1, when the position of the feature point detected by the second sensor is outside the allowable range, the control unit causes the substrate to be transported to a predetermined position different from the support. According to method 2, substrates whose feature point positions are outside the allowable range can be classified.

[0086] [Mode 3] According to Mode 3, in Mode 1 or 2, when the size of the substrate determined by the detection of the first sensor is outside a predetermined reference range, the control unit causes the substrate to be transported to a predetermined position different from the substrate holder. According to Mode 3, substrates whose sizes are outside the predetermined reference range can be classified.

[0087] [Mode 4] According to Mode 4, in Mode 2 or 3, there is a box for accommodating the substrates, and a substrate conveying device for conveying the substrates accommodated in the box to the arrangement adjustment mechanism, and the predetermined position is the box. According to Mode 4, the substrates can be classified into boxes.

[0088] [Method 5] According to method 5, in methods 1 to 4, the above-mentioned configuration adjustment mechanism includes a first configuration adjustment mechanism for adjusting the configuration of the above-mentioned substrate based on the detection of the above-mentioned first sensor, and a second configuration adjustment mechanism for adjusting the configuration of the above-mentioned substrate based on the detection of the above-mentioned second sensor.

[0089] [Mode 6] According to Mode 6, in Mode 5, the second arrangement adjustment mechanism is a substrate conveyor that holds and conveys the substrate between the first arrangement adjustment mechanism and the substrate mounting and dismounting mechanism.

[0090] [Mode 7] According to Mode 7, in Modes 1 to 5, the arrangement adjustment mechanism includes a substrate conveyor that holds and conveys the substrate.

[0091] [Mode 8] According to Mode 8, in Mode 6 or 7, the second sensor is provided on the substrate mounting and dismounting mechanism, and the control unit controls the second sensor to detect the feature point of the substrate held by the substrate conveyor. According to Mode 8, the configuration of the substrate can be adjusted before the substrate is mounted on the substrate holder by the substrate mounting and dismounting mechanism.

[0092] [Mode 9] According to Mode 9, in Modes 1 to 8, the arrangement adjustment mechanism includes a table configured to horizontally move and / or rotationally move the placed substrate. According to Mode 9, the arrangement of the substrate can be adjusted using the table.

[0093] [Mode 10] According to Mode 10, the first sensor is a laser sensor. As the laser sensor, a sensor having a plurality of laser light projecting elements and light receiving elements arranged in a line can be used.

[0094] [Mode 11] In the substrate processing apparatus according to any one of Modes 1 to 10, the second sensor is an image sensor. As the image sensor, for example, a black-and-white camera or a color camera can be used.

[0095] [Mode 12] According to Mode 12, in Modes 1 to 11, the control unit reports an abnormality when the position of the feature point detected by the second sensor is outside the allowable range. According to Mode 12, it is possible to report that the position of the feature point is determined to be outside the allowable range.

[0096] [Method 13] According to Method 13, a substrate processing method is proposed in a substrate processing device having a substrate holder for holding a substrate, a substrate disassembly and assembly mechanism for mounting the substrate on the above-mentioned substrate holder, and a configuration adjustment mechanism configured to adjust the configuration of the substrate, the above-mentioned substrate processing method comprising: a first detection step of detecting the configuration of the substrate based on the outer shape of the substrate; a first configuration adjustment step of controlling the above-mentioned configuration adjustment mechanism to adjust the configuration of the substrate based on the detection of the above-mentioned first detection step; a second detection step of detecting feature points pre-formed on the plate surface of the substrate whose configuration is adjusted in the above-mentioned first configuration adjustment step; a second configuration adjustment step of confirming whether the position of the feature point detected in the above-mentioned second detection step is within an allowable range, and if the position of the detected feature point is within the above-mentioned allowable range, controlling the above-mentioned configuration adjustment mechanism to adjust the configuration of the above-mentioned substrate based on the detection of the above-mentioned second detection step; and a substrate installation step of controlling the above-mentioned substrate disassembly and assembly mechanism to mount the substrate on the above-mentioned substrate holder after the above-mentioned second configuration adjustment step.

[0097] According to aspect 13, the substrate can be positioned and held on the substrate holder with high accuracy.

[0098] Several embodiments of the present invention have been described above, but the embodiments of the invention described above are embodiments for facilitating the understanding of the present invention and do not limit the present invention. The present invention can certainly be changed and improved within the scope of its main purpose, and its equivalents are included in the present invention. In addition, any combination or omission of the constituent elements described in the claims and the specification can be performed within the scope of at least a part of the above-mentioned problems, or within the scope of at least a part of the effects.

Claims

1. A substrate processing device, characterized in that: have: A substrate holder for holding a substrate; A substrate disassembly and assembly mechanism, used for mounting the substrate on the substrate support; a first sensor for detecting a configuration of the substrate based on an outer shape of the substrate; A second sensor is used to detect feature points pre-formed on the board surface of the substrate; a configuration adjustment mechanism configured to adjust the configuration of the substrate; as well as Control Department, The control unit controls the configuration adjustment mechanism to adjust the configuration of the substrate based on the detection of the first sensor. The control unit controls the second sensor so as to detect a feature point formed in advance on the plate surface of the substrate whose arrangement is adjusted based on the detection of the first sensor. The control unit confirms whether the position of the feature point detected by the second sensor is within an allowable range. When the position of the feature point detected by the second sensor is within the allowable range, the control unit controls the configuration adjustment mechanism to adjust the configuration of the substrate based on the detection of the second sensor. After adjusting the arrangement of the substrate based on the detection of the second sensor, the control unit controls the substrate mounting and dismounting mechanism so as to mount the substrate on the substrate holder. The configuration adjustment mechanism includes: a first configuration adjustment mechanism for adjusting the configuration of the substrate based on the detection of the first sensor, and a second configuration adjustment mechanism for adjusting the configuration of the substrate based on the detection of the second sensor. The second arrangement adjustment mechanism is a substrate conveyor that holds and conveys the substrate between the first arrangement adjustment mechanism and the substrate attachment / detachment mechanism.

2. The substrate processing device according to claim 1, characterized in that: When the position of the feature point detected by the second sensor is outside the allowable range, the control unit conveys the substrate to a predetermined position different from the substrate holder.

3. The substrate processing device according to claim 1, characterized in that: When the size of the substrate obtained by the detection of the first sensor is outside a predetermined reference range, the control unit conveys the substrate to a predetermined position different from the substrate holder.

4. The substrate processing device according to claim 2 or 3, characterized in that: have: A box for accommodating the substrate; and A substrate conveying device is used to convey the substrate contained in the box to the configuration adjustment mechanism. The above-specified position is the above-mentioned box.

5. The substrate processing apparatus according to claim 1, wherein: The arrangement adjustment mechanism includes a substrate conveyor that holds and conveys the substrate.

6. The substrate processing apparatus according to claim 1, wherein: The second sensor is arranged on the substrate disassembly mechanism. The control unit controls the second sensor to detect the feature point of the substrate held by the substrate conveyor.

7. The substrate processing apparatus according to claim 1, wherein: The arrangement adjustment mechanism includes a table configured to horizontally move and / or rotationally move the placed substrate.

8. The substrate processing apparatus according to claim 1, wherein: The first sensor is a laser sensor.

9. The substrate processing apparatus according to claim 1, wherein: The second sensor is an image sensor.

10. The substrate processing apparatus according to claim 1, wherein: The control unit reports an abnormality when the position of the feature point detected by the second sensor is outside the allowable range.

11. A substrate processing method, comprising: a substrate processing apparatus having a substrate holder for holding a substrate, a substrate mounting and dismounting mechanism for mounting a substrate on the substrate holder, a first configuration adjustment mechanism for adjusting the configuration of the substrate, and a second configuration adjustment mechanism for holding and conveying the substrate between the first configuration adjustment mechanism and the substrate mounting and dismounting mechanism, wherein: Include: a first detection step of detecting a configuration of the substrate based on an outer shape of the substrate; A first configuration adjustment step of controlling the first configuration adjustment mechanism to adjust the configuration of the substrate based on the detection of the first detection step; A second detection step of detecting feature points pre-formed on the plate surface of the substrate whose configuration is adjusted in the first configuration adjustment step; A second configuration adjustment step of confirming whether the position of the feature point detected in the second detection step is within an allowable range, and if the position of the detected feature point is within the allowable range, controlling the second configuration adjustment mechanism to adjust the configuration of the substrate based on the detection in the second detection step; and After the second arrangement adjustment step, a substrate mounting step is performed in which the substrate mounting and dismounting mechanism is controlled so as to mount the substrate on the substrate holder.

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