Electronic packaging and method of manufacturing the same

Abstract

An electronic package and its manufacturing method, by arranging a plurality of shielding wires on a carrier and crossing an electronic component to cover the electronic component, the shielding wires are used as a shielding structure to avoid the problem that the electronic component is interfered by external electromagnetic waves.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging process, in particular to an electronic packaging component with a shielding structure and a manufacturing method thereof. Background Art

[0002] With the booming development of the electronics industry, most electronic products are developing towards the goal of miniaturization and high speed. In particular, the development of the communications industry has generally integrated communications devices into various electronic products, such as cell phones, laptops, etc. However, the above-mentioned electronic products need to use high-frequency radio frequency chips, and the radio frequency chips may be adjacent to digital integrated circuits, digital signal processors (DSP) or baseband chips (BB, Base Band), causing electromagnetic interference (EMI) problems, so electromagnetic shielding (Electromagnetic Shielding) processing is necessary.

[0003] There are existing methods for making radio frequency (RF) modules to avoid EMI, such as Figures 1A to 1C As shown, a plurality of RF chips 11a, 11b and a non-RF electronic component 11 are electrically connected to a packaging substrate 10, and then a packaging layer 13 such as epoxy resin is used to cover each of the RF chips 11a, 11b and the non-RF electronic component 11, and a metal film 14 is formed on the packaging layer 13. The RF module 1 protects the RF chips 11a, 11b, the non-RF electronic component 11 and the packaging substrate 10 through the packaging layer 13, and prevents them from being damaged by external moisture or pollutants, and protects the RF chips 11a, 11b from being affected by external EMI through the metal film 14.

[0004] However, although the outer periphery of the existing RF module 1 can be coated with the metal film 14 to avoid EMI, if the RF chips 11a, 11b are low-frequency components, the single metal film 14 as a barrier layer is still difficult to prevent electromagnetic interference.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0006] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package and a manufacturing method thereof to avoid the problem that electronic components are interfered by external electromagnetic waves.

[0007] The electronic package of the present invention comprises: a carrier; an electronic component, which is arranged on the carrier and electrically connected to the carrier; a plurality of shielding wires, which are arranged on the carrier and cross the electronic component to cover the electronic component, wherein the plurality of shielding wires are staggered with each other; and a packaging layer, which is formed on the carrier to cover the electronic component and the shielding wires.

[0008] The present invention also provides a method for manufacturing an electronic package, comprising: providing a carrier having at least one electronic component, and the electronic component is electrically connected to the carrier; forming a plurality of shielding wires on the carrier so that the shielding wires cross over the electronic component and cover the electronic component, wherein the plurality of shielding wires are staggered with each other; and forming a packaging layer on the carrier so that the packaging layer covers the electronic component and the shielding wires.

[0009] In the aforementioned electronic packaging component and its manufacturing method, the two opposite ends of the shielding wire are respectively connected to the carrier.

[0010] In the aforementioned electronic package and its manufacturing method, the shielding wire is a welding wire in a wire bonding process.

[0011] In the aforementioned electronic package and its manufacturing method, the plurality of shielding lines are formed along one direction.

[0012] In the aforementioned electronic package and its manufacturing method, the plurality of shielding lines are formed along multiple directions.

[0013] In the aforementioned electronic packaging component and its manufacturing method, the shielding line is exposed outside the packaging layer.

[0014] In the aforementioned electronic packaging and its manufacturing method, the shielding line is an arc line, and its arc top is exposed outside the packaging layer. For example, the arc top is flush with the surface of the packaging layer.

[0015] The aforementioned electronic package and its manufacturing method also include forming a shielding member on the packaging layer.

[0016] As can be seen from the above, the electronic package and its manufacturing method of the present invention mainly use the shielding wire to cross the electronic component to serve as a shielding structure to avoid the problem of the electronic component being interfered by external electromagnetic waves, and use the staggered shielding wire to form an irregular channel to destroy the radiation path, so as to achieve a smaller electromagnetic radiation amount and enhance the shielding effect of electromagnetic interference.

[0017] In addition, if the electronic component is a low-frequency component, a better anti-electromagnetic interference effect can be provided by the shielding wire buried in the packaging layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figures 1A to 1C It is a cross-sectional schematic diagram of a conventional method for manufacturing a radio frequency module.

[0019] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a method for manufacturing an electronic package of the present invention.

[0020] Figure 2B 'and Figure 2B "for Figure 2B Partial top view schematic diagram of different forms.

[0021] Description of Reference Numerals

[0022] 1 RF module

[0023] 10 Package substrate

[0024] 11 Non-RF electronic components

[0025] 11a,11b RF chip

[0026] 13,24 Encapsulation layer

[0027] 14 metal film

[0028] 2 Electronic packaging

[0029] 20 Bearing

[0030] 20a First side

[0031] 20b Second side

[0032] 20' Insulation Cover

[0033] 200 Electrical contact pads

[0034] 201 Grounding pad

[0035] 202 Ground layer

[0036] 21 Electronic components

[0037] 21a Action surface

[0038] 21b Non-active surface

[0039] 22. Wire welding

[0040] 23,23' shielded cable

[0041] 23a,23b End

[0042] 230 Arc Top

[0043] 24a First surface

[0044] 24b Second surface

[0045] 25 Shielding

[0046] S Cutting path. DETAILED DESCRIPTION

[0047] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0048] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "first", "second", "upper", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0049] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a method for manufacturing an electronic package 2 of the present invention.

[0050] like Figure 2A As shown, a carrier 20 and at least one electronic component 21 are provided. The carrier 20 has a first side 20 a and a second side 20 b opposite to each other. The electronic component 21 is disposed on the first side 20 a of the carrier 20 and is electrically connected to the carrier 20 .

[0051] In the present embodiment, the carrier 20 is a substrate with a core layer and a circuit structure or a circuit structure without a core layer. The circuit structure forms a circuit layer (not shown) on a dielectric material, such as a fan-out redistribution layer (RDL), and the dielectric material is polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. For example, the outermost side of the substrate has a circuit layer and an insulating protective layer 20', and the circuit layer includes a plurality of electrical contact pads 200 and a grounding pad 201 exposed from the insulating protective layer 20', and the grounding pad 201 is electrically connected to the grounding layer 202 of the internal circuit of the substrate. It should be understood that the carrier 20 can also be other carrier units for carrying electronic components such as chips, such as lead-frames or silicon interposers, but is not limited to the above.

[0052] In addition, the electronic component 21 is an active component, a passive component or a combination thereof, and the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. The electronic component 21 is a radio frequency chip or other semiconductor chip, for example, a Bluetooth chip or a wireless hotspot (Wi-Fi (Wireless Fidelity)) chip, which has an active surface 21a and an inactive surface 21b opposite to the active surface 21a, and the active surface 21a has a plurality of electrode pads (not shown), and the inactive surface 21b is arranged on the first side 20a of the carrier 20, so that the electronic component 21 is electrically connected to the circuit layer of the carrier 20 by a wire bonding method through a plurality of welding wires 22 with its electrode pads; or, the electronic component 21 is electrically connected to the circuit layer by a flip chip method with a plurality of conductive bumps (not shown); or, the electronic component 21 can directly contact the circuit layer to electrically connect the circuit layer. However, the method for the electronic component 21 to electrically connect the carrier 20 is not limited to the above.

[0053] like Figure 2B As shown, a plurality of shielding lines 23 crossing the electronic component 21 are formed on the first side 20 a of the carrier 20 , so that the shielding lines 23 cover the active surface 21 a of the electronic component 21 .

[0054] In this embodiment, the two opposite ends 23a, 23b of the shielding line 23 are respectively connected to the ground pads 201. For example, the two shielding lines 23 are formed in a staggered manner at a single location, such as Figure 2B 'shown.

[0055] In addition, the shielding wire 23 is a bonding wire of a wire bonding process, such as an arc-shaped gold wire. For a single electronic component 21, a plurality of shielding wires 23 are arranged along one direction (such as the X or Y direction). Figure 2B 'As shown; or, for a single electronic component 21 along multiple directions (such as the X direction and the Y direction) arranged multiple shielding lines 23,23 ', such as Figure 2B ” as shown.

[0056] like Figure 2C As shown, a packaging layer 24 is formed on the first side 20 a of the carrier 20 , so that the packaging layer 24 covers the electronic element 21 , the bonding wires 22 and the shielding wires 23 .

[0057] In this embodiment, the packaging layer 24 is an insulating material, such as polyimide (PI), dry film, packaging colloid such as epoxy, or molding compound. For example, the packaging layer 24 can be formed on the carrier 20 by liquid compound, injection, lamination, or compression molding.

[0058] In addition, the packaging layer 24 has a first surface 24a and a second surface 24b opposite to each other, so that the packaging layer 24 is bonded to the first side 20a of the carrier 20 with its second surface 24b, and at least a portion of the surface of the shielding line 23 is exposed on the first surface 24a of the packaging layer 24. For example, a flattening process can be used to make the first surface 24a of the packaging layer 24 flush with the arc top 230 of the shielding line 23, so that the arc top 230 of the shielding line 23 is exposed on the first surface 24a of the packaging layer 24. Specifically, the flattening process removes part of the material of the packaging layer 24 by grinding. It should be understood that there are many ways to expose the shielding line 23, such as opening a hole, and it is not limited to the above.

[0059] like Figure 2D As shown, a shielding member 25 is formed on the first surface 24 a of the packaging layer 24 , and the shielding member 25 is in contact with the shielding line 23 .

[0060] In this embodiment, the shielding member 25 is a conductive material, and its material is different from the material of the packaging layer 24. For example, the shielding member 25 is a conductive layer, such as copper (Cu), nickel (Ni), iron (Fe) or aluminum (Al), etc., which is formed by electroplating, chemical plating such as sputtering, coating or other methods.

[0061] like Figure 2E As shown, along Figure 2D The cutting path S shown is used for singulation process to obtain a plurality of electronic packages 2, and a plurality of conductive elements such as solder balls (not shown) can be formed on the second side 20b of the carrier 20 for the electronic package 2 to be connected to an electronic device such as a circuit board (not shown).

[0062] In this embodiment, the electronic package 2 is capable of emitting electromagnetic waves, such as a radio frequency (RF) module.

[0063] Therefore, the manufacturing method of the present invention mainly uses the shielding wires 23, 23' to cross the electronic component 21 to serve as a shielding structure to prevent the electronic component 21 from being interfered by external electromagnetic waves, and uses the staggered shielding wires 23, 23' to form irregular channels to destroy the radiation path, thereby achieving a smaller electromagnetic radiation amount and improving the shielding effect of electromagnetic interference.

[0064] In addition, if the electronic component 21 is a low-frequency component, the shielding wires 23 , 23 ′ are buried in the packaging layer 24 to be closer to the electronic component 21 , so that the shielding wires 23 , 23 ′ can provide a better anti-electromagnetic interference effect.

[0065] The present invention also provides an electronic package 2 , comprising: a carrier 20 , an electronic component 21 and a plurality of shielding lines 23 .

[0066] The carrier 20 has a plurality of ground pads 201 .

[0067] The electronic component 21 is disposed on the carrier 20 and electrically connected to the carrier 20 .

[0068] The shielding wires 23 are disposed on the carrier 20 and cross the electronic component 21 to cover the electronic component 21 , wherein the plurality of shielding wires 23 are interlaced with each other.

[0069] The packaging layer 24 is formed on the carrier 20 to cover the electronic component 21 and the shielding line 23 .

[0070] In one embodiment, two opposite ends 23 a and 23 b of the shielding wire 23 are respectively connected to the ground pad 201 of the carrier 20 .

[0071] In one embodiment, the shielding wire 23 is a bonding wire of a wire bonding process.

[0072] In one embodiment, the plurality of shielding lines 23 are arranged along one direction corresponding to the electronic component.

[0073] In one embodiment, the plurality of shielding lines 23 , 23 ′ are arranged along multiple directions corresponding to the electronic components.

[0074] In one embodiment, the shielding line 23 is exposed outside the packaging layer 24 .

[0075] In one embodiment, the shielding line 23 is an arc line, and the arc top 230 thereof is exposed from the packaging layer 24. For example, the arc top 230 is flush with the first surface 24a of the packaging layer 24.

[0076] In one embodiment, the electronic seal 2 further includes a shielding member 25 formed on the packaging layer 24 .

[0077] In summary, the electronic package and the manufacturing method thereof of the present invention prevent the electronic component from being interfered by external electromagnetic waves through the design of the shielding wire.

[0078] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as listed in the attached claims.

Claims

1. An electronic package, characterized in that: include: bearing member; An electronic component, which is disposed on the carrier and electrically connected to the carrier; A plurality of first shielding lines and a plurality of second shielding lines are disposed on the carrier and cross the electronic component, wherein any two of the plurality of first shielding lines are staggered in a first direction above the electronic component, and any two of the plurality of second shielding lines are staggered in a second direction different from the first direction above the electronic component, and the staggered plurality of first shielding lines and the staggered plurality of second shielding lines are further staggered with each other above the electronic component; as well as The packaging layer is formed on the carrier to cover the electronic element, the first shielding line and the second shielding line.

2. The electronic package according to claim 1, characterized in that: The opposite two ends of each of the first shielding wires and each of the second shielding wires are respectively connected to the carrier.

3. The electronic package according to claim 1, characterized in that: The first shielding line and the second shielding line are welding wires of a wire bonding process.

4. The electronic package according to claim 1, characterized in that: The plurality of first shielding lines are arranged along the first direction relative to the electronic component.

5. The electronic package according to claim 1, characterized in that: The plurality of first shielding wires and the plurality of second shielding wires are arranged along the first direction and the second direction respectively relative to the electronic component.

6. The electronic package according to claim 1, characterized in that: The first shielding line and the second shielding line are partially exposed outside the packaging layer.

7. The electronic package according to claim 1, characterized in that: The first shielding line and the second shielding line are arc lines, and the arc tops are exposed from the packaging layer.

8. The electronic package according to claim 7, characterized in that: The arc top is flush with the surface of the packaging layer.

9. The electronic package according to claim 1, characterized in that: The electronic package also includes a shielding component arranged on the packaging layer.

10. A method for manufacturing an electronic package, characterized in that: include: Providing a carrier having at least one electronic component, wherein the electronic component is electrically connected to the carrier; Forming a plurality of first shielding lines and a plurality of second shielding lines on the carrier, and making the plurality of first shielding lines and the plurality of second shielding lines cross the electronic component, wherein any two of the plurality of first shielding lines are staggered in a first direction above the electronic component, and any two of the plurality of second shielding lines are staggered in a second direction different from the first direction above the electronic component, and the staggered plurality of first shielding lines and the staggered plurality of second shielding lines are further staggered with each other above the electronic component; as well as A packaging layer is formed on the carrier so that the packaging layer covers the electronic element, the first shielding line and the second shielding line.

11. The method for manufacturing an electronic package according to claim 10, characterized in that: The opposite two ends of each of the first shielding wires and each of the second shielding wires are respectively connected to the carrier.

12. The method for manufacturing an electronic package according to claim 10, characterized in that: The first shielding line and the second shielding line are welding wires of a wire bonding process.

13. The method for manufacturing an electronic package according to claim 10, characterized in that: The plurality of first shielding lines are formed along the first direction relative to the electronic component.

14. The method for manufacturing an electronic package according to claim 10, characterized in that: The plurality of first shielding lines and the plurality of second shielding lines are formed along the first direction and the second direction respectively relative to the electronic component.

15. The method for manufacturing an electronic package according to claim 10, characterized in that: The first shielding line and the second shielding line are partially exposed outside the packaging layer.

16. The method for manufacturing an electronic package according to claim 10, characterized in that: The first shielding line and the second shielding line are arc lines, and the arc tops are exposed from the packaging layer.

17. The method for manufacturing an electronic package according to claim 16, characterized in that: The arc top is flush with the surface of the packaging layer.

18. The method for manufacturing an electronic package according to claim 10, characterized in that: The manufacturing method further includes forming a shielding element on the packaging layer.

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