Fluid cooling systems for closed electronic packages

Abstract

A fluid cooling system for an electronic package having a chassis is disclosed. The system includes: an electronic package housed in the chassis; one or more mounting structures attached to the chassis; and a fluid cooling module engaged with one or more electronic devices of the electronic package, the fluid cooling module housed in the chassis and mounted to the one or more mounting structures, wherein circulation of a fluid of the fluid cooling module cools the one or more electronic devices. A chassis fluid distribution manifold is used to connect to a chassis fluid inlet and a chassis fluid outlet, and is used to distribute fluid within the chassis.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to electronic device cooling. More specifically, embodiments of the present invention relate to a method for designing and assembling liquid cooling hardware for an enclosed electronic package (EEP) used in devices or IT hardware / devices performing edge computing. Background Art

[0002] Edge computing is an important technology in the era of AI and 5G. Edge computing devices will allow some level of local data processing and storage. Edge computing requires the deployment of IT equipment / electronic devices closer to end users, such as smart phones, self-driving vehicles, smart homes, etc. Therefore, the deployment environment may vary depending on the situation. In data centers, the deployment environment is very well controlled so that servers operate under desired thermal and humidity conditions. However, edge devices may be deployed in external environments, which directly expose computing devices to the outside air, i.e., conditions that are not suitable for running these devices. In some other applications, electronic devices may be deployed in harsh environments. This may affect the long-term reliability and / or normal operation of these electronic devices.

[0003] Previous attempts have used traditional air cooling for edge computing devices / electronics, similar to air cooling solutions used for IT equipment. Some disadvantages of air cooling include limited cooling, and exposing the electronics to the surrounding environment which may affect the operation and reliability of the electronics. Most current edge computing devices are designed to use natural conduction cooling. However, this is only feasible for low power design devices. For higher power density devices, the surface temperature may exceed the design limit, or the device may not work properly. Summary of the invention

[0004] According to one aspect of the present application, a fluid cooling system is provided, comprising: an electronic package mounted on a mainboard housed in a chassis; a first mounting structure attached to a first side panel of the chassis, comprising a first vertical mounting slot; a second mounting structure attached to a second side panel of the chassis, comprising a second vertical mounting slot; and a fluid cooling module spanning the top of the electronic package, wherein the fluid cooling module is mounted on the first mounting structure and the second mounting structure by inserting the first end and the second end of the fluid cooling module into the first vertical mounting slot and the second vertical mounting slot, wherein the fluid cooling module is used to provide fluid cooling to a cold plate attached to a top surface of the electronic package.

[0005] According to another aspect of the present application, there is provided a data processing system housed in a chassis, comprising: a motherboard; a central processing unit (CPU) mounted on the motherboard; an electronic package mounted on the motherboard housed in the chassis; a first mounting structure attached to a first side panel of the chassis, comprising a first vertical mounting slot; a second mounting structure attached to a second side panel of the chassis, comprising a second vertical mounting slot; and a fluid cooling module, the fluid cooling module spanning the top of the electronic package, wherein the fluid cooling module is mounted on the first mounting structure and the second mounting structure by inserting the first end and the second end of the fluid cooling module into the first vertical mounting slot and the second vertical mounting slot. The fluid cooling module is used to provide fluid cooling to a cold plate attached to a top surface of the electronic package.

[0006] According to another aspect of the present application, an electronic rack of a data center is provided, comprising: an array of server blades arranged in a rack, each server blade comprising one or more servers housed in a chassis, each chassis comprising: a motherboard; a central processing unit (CPU) mounted on the motherboard; an electronic package mounted on the motherboard housed in the chassis; a first mounting structure attached to a first side panel of the chassis, comprising a first vertical mounting slot; a second mounting structure attached to a second side panel of the chassis, comprising a second vertical mounting slot; and a fluid cooling module, the fluid cooling module spanning the top of the electronic package, wherein the fluid cooling module is mounted on the first mounting structure and the second mounting structure by inserting the first end and the second end of the fluid cooling module into the first vertical mounting slot and the second vertical mounting slot. The fluid cooling module is used to provide fluid cooling to a cold plate attached to the top surface of the electronic package. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the drawings in which like references indicate similar elements.

[0008] Figure 1 is a block diagram illustrating an example of a data center facility according to one embodiment.

[0009] Figure 2 is a block diagram illustrating an example of an electronics rack according to one embodiment.

[0010] Figure 3 is a block diagram illustrating a top view of a fluid cooled enclosure / chassis for enclosing an electronic package (EEP) according to one embodiment.

[0011] Figure 4Ais a block diagram illustrating a side view of a cooling system for a vertically mounted device enclosing an electronic package (EEP) according to one embodiment.

[0012] Figure 4B is a block diagram showing a top view of a cooling system for a vertically mounted device of an EEP according to one embodiment.

[0013] Figure 5 is a block diagram illustrating a side view of a cooling system for a horizontally mounted device of an EEP according to one embodiment.

[0014] Figure 6 A top view of a fluid dispensing unit for an EEP is shown according to one embodiment.

[0015] Figure 7 A top view of a fluid dispensing unit for an EEP is shown according to one embodiment.

[0016] Figure 8 A side view of a fluid cooling plate for an EEP is shown according to one embodiment.

[0017] Fig. 9 A side view of a mounting structure for an EEP is shown according to one embodiment.

[0018] Fig.10 A side view of mounting serrations or teeth of a mounting structure for an EEP is shown according to one embodiment. DETAILED DESCRIPTION

[0019] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and accompanying drawings are explanations of the present invention and should not be construed as limiting the present invention. Many specific details are described to provide a comprehensive understanding of various embodiments of the present invention. However, in some cases, well-known or conventional details are not described to provide a concise discussion of embodiments of the present invention.

[0020] Reference to "one embodiment" or "an embodiment" in this specification means that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in this specification does not necessarily refer to the same embodiment.

[0021] Fluid cooling thermal systems can be used for closed electronic packages having electronic devices enclosed in a chassis / housing for separating the electronic devices from the external ambient air-air. The system can provide a thermal management solution for hardware encapsulated in a closed environment using a liquid cooling device that cools the hardware. Since various types of hardware, such as a CPU, or a GPU, or a PCIE device and many other devices, can be assembled on the motherboard, different embodiments of the system address different types of hardware. The entire closed package can be hermetically sealed and cooled using a fluid that circulates through one or more fluid inlets / outlets of the closed package. The cooling system can be applied to server chassis or mobile applications in data centers (e.g., the electronic package can be in motion), such as edge computing devices housed in a chassis in an autonomous vehicle.

[0022] According to one aspect, a fluid cooling system includes an electronic package mounted on a motherboard housed in a chassis; a first mounting structure attached to a first side panel of the chassis, including a first vertical mounting slot; a second mounting structure attached to a second side panel of the chassis, including a second vertical mounting slot; and a fluid cooling module spanning the top of the electronic package, wherein the fluid cooling module is mounted on the first mounting structure and the second mounting structure by inserting a first end and a second end of the fluid cooling module into the first vertical mounting slot and the second vertical mounting slot. The fluid cooling module is used to provide fluid cooling to a cold plate attached to a top surface of the electronic package.

[0023] In one embodiment, the chassis forms a completely closed environment for the electronic enclosure such that no outside air is exchanged with the interior air into the closed environment. In one embodiment, the fluid cooling module comprises: a mounting rail attached to a mounting frame; the mounting frame mounted on one or more mounting structures of the chassis; a fluid circuit; and one or more cooling devices coupled to the fluid circuit, wherein the one or more cooling devices are secured to electronic devices of the electronic enclosure via the mounting rail.

[0024] In another embodiment, the system further comprises a fluid distribution unit coupled to the chassis, wherein the fluid distribution unit comprises a fluid inlet, a fluid outlet, and a fluid distribution channel coupled to the fluid inlet and the fluid outlet, the fluid distribution channel distributing the fluid from the fluid inlet to the fluid outlet. In another embodiment, the fluid circuit is coupled to the fluid distribution channel of the fluid distribution unit.

[0025] In another embodiment, the fluid distribution unit further comprises a fluid distribution manifold, the fluid distribution manifold being located near the first side panel of the chassis to receive the cooling fluid from the fluid inlet and return the hotter fluid to the fluid outlet. In another embodiment, the fluid circuit comprises a fluid supply circuit portion and a fluid return circuit portion, wherein the fluid supply circuit portion receives the cooling fluid from the fluid inlet through the fluid distribution manifold to cool the electronic device, and the fluid return circuit portion returns the hotter fluid to the fluid outlet through the fluid distribution manifold.

[0026] In another embodiment, the chassis fluid distribution unit includes: a fluid supply manifold located near a first side panel of the chassis to receive cooling fluid from a fluid inlet; and a fluid return manifold located near a second side panel of the chassis to return hotter fluid to a fluid outlet. In another embodiment, the fluid circuit includes a fluid supply circuit portion and a fluid return circuit portion, wherein the fluid supply circuit portion receives cooling fluid from the fluid inlet through the fluid supply manifold to cool the cooling device, and the fluid return circuit portion returns the hotter fluid from the cooling device to the fluid outlet through the fluid return manifold. The distribution unit may include one or more sub-inlets and sub-outlets for distributing the fluid.

[0027] In one embodiment, the fluid circuit includes bendable or flexible fluid tubes and / or hoses. In another embodiment, the cooling device includes one or more cooling plates fixed to at least one surface of the electronic device to cool the surface of the electronic device. In another embodiment, each of the one or more cooling plates can be attached to the fluid circuit.

[0028] In another embodiment, the electronic device includes a peripheral component interconnect express (PCIe) electronic device coupled to a PCIe bus, and the one or more cooling plates are pressed to a surface of the PCIe electronic device. In another embodiment, the system further includes a large cooling plate mounted near the bottom of the chassis, wherein the electronic device includes a motherboard, wherein the large cooling plate is coupled to a bottom surface of the motherboard to assist in cooling the motherboard.

[0029] In another embodiment, the large cooling plate is directly mounted to the distribution channel of the fluid distribution unit to bypass the fluid circuit. In another embodiment, each of the mounting structures includes: a plurality of mounting teeth (e.g., serrations) along the length of the mounting structure to lock the mounting frame to the mounting structure; and an unlocking latch to deactivate the plurality of mounting teeth to release the mounting frame from the mounting structure.

[0030] In one embodiment, the electronics package includes electronics for a server blade that is part of a server rack. In one embodiment, the electronics package includes electronics for an edge computing device for an autonomous vehicle.

[0031] The chassis of electronic packages / devices (such as edge computing devices) using the cooling system can be mobile. Although the disclosed system is designed for electronic packages / devices, these devices can also be deployed for IT equipment in data centers.

[0032] Figure 1 is a block diagram illustrating an example of a data center or data center unit according to one embodiment. In this example, Figure 1 A top view of at least a portion of a data center is shown. Figure 1 According to one embodiment, a data center system 100 includes rows of electronic racks of information technology (IT) components, equipment, or instruments 101 to 102, such as computer servers or computing nodes that provide data services to various clients via a network (e.g., the Internet). In this embodiment, each row includes an array of electronic racks such as electronic racks 110A to 110N. However, more or fewer rows of electronic racks may be implemented. Typically, the rows 101 to 102 are aligned in parallel, with their front ends facing each other and their rear ends facing away from each other, thereby forming aisles 103 between the rows to allow management personnel to walk therein. However, other configurations or arrangements may also be applied.

[0033] In one embodiment, each of the electronic racks (e.g., electronic racks 110A to 110N) includes a housing to accommodate multiple electronic racks of IT components operating therein. The electronic racks may include a heat removal liquid manifold, multiple server slots, and multiple server blades that can be inserted into and removed from the server blades or server slots. Each server blade represents a computing node having one or more processors, memory, and / or permanent storage devices (e.g., hard drives). At least one of the processors is attached to a liquid cold plate (also referred to as a cold plate assembly) to receive cooling liquid. Note that the heat removal system 120 can be coupled to multiple data center systems, such as data center system 400.

[0034] In one embodiment, the heat rejection system 120 includes an external liquid loop connected to a cooling tower or dry cooler outside the building / containment vessel. The heat rejection system 120 may include, but is not limited to, evaporative cooling designs, free air designs, rejection designs for large thermal masses, and waste heat recovery designs. The heat rejection system 120 may include or be coupled to a cooling liquid source that provides cooling liquid.

[0035] In one embodiment, each server blade is modularly coupled to a heat exhaust liquid manifold so that the server blade can be removed from the electronics rack without affecting the operation of the remaining server blades on the electronics rack and the heat exhaust liquid manifold. In another embodiment, each server blade is coupled to a heat exhaust liquid manifold (also known as a cooling liquid manifold) by a quick release coupling assembly having a first liquid intake connector and a first liquid outlet connector coupled to a flexible hose to distribute heat exhaust liquid to the processor. The first liquid intake connector receives heat exhaust liquid from the heat exhaust liquid manifold mounted at the rear end of the electronics rack via a second liquid intake connector. The first liquid outlet liquid connector dissipates warmer or hotter liquid carrying heat exchanged from the processor to the heat exhaust liquid manifold via a second liquid outlet connector and then returns to a coolant distribution unit (CDU) within the electronics rack.

[0036] In one embodiment, a heat removal liquid manifold disposed on the rear end of each electronic rack is coupled to a liquid supply line 132 to receive heat removal liquid (also referred to as cooling liquid) from the heat removal system 120. The heat removal liquid is distributed by a liquid distribution loop attached to a cold plate assembly on which a processor is mounted to remove heat from the processor. The cold plate is configured similarly to a radiator in which a liquid distribution tube is attached or embedded. The resulting warmer or hotter liquid carrying heat exchanged from the processor is transmitted back to the heat removal system 120 via a liquid return line 131. Liquid supply / return lines 131 to 132 are referred to as data center or room liquid supply / return lines (e.g., global liquid supply / return lines), which supply heat removal liquid to all electronic racks in rows 101 to 102. Liquid supply line 132 and liquid return line 131 are coupled to a heat exchanger of a CDU located in each of the electronic racks, thereby forming a primary loop. A second loop of the heat exchanger is coupled to each of the server blades in the electronic rack to deliver cooling liquid to the cold plate of the processor.

[0037] According to one embodiment, each of the electronic racks includes an optional rack management unit (RMU) coupled to the CDU and each of the computing nodes of the electronic rack (not shown). The RMC periodically or continuously monitors the operating status of the CDU and the computing nodes. The operating data of the operating status may include the operating temperature of each processor, coolant, etc. measured in real time. Based on the operating data received from the various components, the RMU performs optimization using an optimization function to determine the optimal pump speed of the liquid pump of the CDU so that the power consumption of the liquid is minimized while the liquid pumps operate appropriately according to their respective specifications (e.g., the speed of the liquid pumps is within their respective predetermined ranges).

[0038] That is, the optimization is performed at a global level by optimizing all components involved simultaneously so that: 1) the temperature of the processors is below their respective reference temperatures; 2) the total power consumption of the liquid pumps is minimized; and 3) each of the liquid pumps operates within their respective specifications. The liquid pumps are then configured with the optimal pump speed. As a result, the total power consumption of the liquid pumps is minimized when the processors of the computing node operate appropriately.

[0039] Figure 2 2 is a block diagram showing an electronic rack according to one embodiment. The electronic rack 200 may be represented as follows: Figure 1 Any of the electronic racks shown, for example, electronic racks 110A to 110N. Figure 2 According to one embodiment, the electronic rack 200 includes, but is not limited to, a CDU 201, an optional RMU 202, and one or more server blades 203A to 203E (collectively referred to as server blades 203). The server blades 203 can be inserted into the array of server slots from the front end 204 or the back end 205 of the electronic rack 200, respectively. Note that although five server blades 203A to 203E are shown here, more or fewer server blades can be maintained within the electronic rack 200. It should also be noted that the specific locations of the CDU 201, RMU 202, and server blades 203 are shown for illustrative purposes only; other arrangements or configurations of the CDU 201, RMU 202, and server blades 203 can also be implemented. In one embodiment, the electronic rack 200 can be open to the environment or partially contained by a rack container. In another embodiment, the electronic rack 200 can be fully contained and not exposed to the environment.

[0040] In one embodiment, the CDU 201 mainly includes a heat exchanger 211, a liquid pump 212 and a pump controller (not shown), as well as some other components such as a liquid container, a power supply, a monitoring sensor, etc. The heat exchanger 211 can be a liquid-to-liquid heat exchanger. The heat exchanger 211 includes a first loop having an inlet port and an outlet port, and the inlet port and the outlet port have a first pair of liquid connectors connected to external liquid supply / return lines 131 to 132 to form a main loop. The connector connected to the external liquid supply / return lines 131 to 132 can be set or installed on the rear end 205 of the electronic rack 200. The liquid supply / return lines 131 to 132 are also called room liquid supply / return lines and are connected to the heat removal system 120 as described above. In addition, the heat exchanger 211 also includes a second loop having two ports, wherein the two ports have a second pair of liquid connectors coupled to the liquid manifold 225 to form a second loop, wherein the second loop may include a supply manifold (also referred to as a rack liquid supply line) and a return manifold (also referred to as a rack liquid return line), wherein the supply manifold supplies cooling liquid to the server blades 203 and the return manifold returns warmer liquid to the CDU 201. Note that the CDU 201 may be any kind of CDU that is commercially available or custom made. Thus, the details of the CDU 201 will not be described herein.

[0041] Each of the server blades 203 may include one or more IT components (e.g., a central processing unit or CPU, a graphics processing unit (GPU), memory, and / or storage devices). Each IT component may perform data processing tasks, wherein the IT component may include software installed in a storage device, loaded into the memory, and executed by one or more processors to perform the data processing tasks. The server blades 203 may include a master server (referred to as a master node) connected to one or more computing servers (also referred to as computing nodes, such as CPU servers and GPU servers). The master server (having one or more CPUs) typically interfaces with a client over a network (e.g., the Internet) to receive requests for specific services such as storage services (e.g., cloud-based storage services such as backup and / or recovery), execute applications to perform certain operations (e.g., image processing, deep data learning algorithms or modeling, etc., as part of a software as a service or SaaS platform).

[0042] In response to the request, the master server assigns the task to one or more of the performance computing nodes or computing servers (with one or more GPUs) managed by the master server. The performance computing server performs the actual task, which may generate heat during operation. One or more computing servers may be edge computing servers having a motherboard and electronic devices such as CPU / GPU electronic devices mounted horizontally on the motherboard and vertically mounted components, such as components mounted vertically on the PCIE expansion bus of the motherboard. These components may be memory modules, accelerators, or any other electronic components.

[0043] The electronics rack 200 also includes an optional RMU 202 configured to provide and manage power supplied to the servers 203 and the CDU 201. The RMU 202 can be coupled to a power supply unit (not shown) to manage the power consumption of the power supply unit. The power supply unit can include necessary circuitry (e.g., an alternating current (AC) to direct current (DC) or DC to DC power converter, a battery, a transformer or a voltage regulator, etc.) to provide power to the remaining components of the electronics rack 200.

[0044] In one embodiment, the RMU 202 includes an optimization module 221 and a rack management controller (RMC) 222. The RMC 222 may include a monitor to monitor the operating status of various components within the electronic rack 200, such as the computing nodes 203 and the CDU 201. Specifically, the monitor receives operating data from various sensors representing the operating environment of the electronic rack 200. For example, the monitor may receive operating data representing the temperature of the processor, coolant, and airflow, which may be captured and collected via various temperature sensors. The monitor may also receive data representing the pump power generated by the liquid pump 212, which may be proportional to the speed of each of the liquid pumps 212. These operating data are referred to as real-time operating data. Note that the monitor may be implemented as a separate module within the RMU 202.

[0045] Based on the operating data, the optimization module 221 performs optimization using a predetermined optimization function or optimization model to derive an optimal pump speed for the liquid pump 212 so that the total power consumption of the liquid pump 212 is minimized while the operating data associated with the liquid pump 212 is within their respective design specifications. Once the optimal pump speed is determined, the RMC 222 configures the liquid pump 212 based on the optimal pump speed.

[0046] Figure 3 is a block diagram showing a top view of a fluid cooled enclosure / chassis for enclosing an electronic package (EEP) according to one embodiment. Figure 3, a fluid cooling system 300 for an electronic package 301 held in a chassis 303 is disclosed. The electronic package may be closed / hermetically sealed within the chassis. The cooling system 300 includes a plurality of cooling devices / modules 305 to 309 for different types of electronic devices, both for vertically mounted electronic devices 313 and horizontally mounted electronic devices 311. These cooling devices 305, 307, 309 are used to cool heat generating electronic devices 311 to 315, including low power density electronic devices 315 and high power density electronic devices 311 to 313.

[0047] In one embodiment, the cooling device is a cooling plate or mounting plate. For low power density electronic devices 315, their heat can be cooled by natural convection and / or a plate cooling device (e.g., a plate cooling plate) 305. The cooling system 300 may include a fluid distribution manifold 321 and / or a fluid distribution / pipe 323. The fluid distribution manifold 321 is used to distribute the fluid to the cooling device. The fluid distribution manifold 321 is connected to a fluid inlet 325 and a fluid outlet 327 so that the fluid flows into and out of the fluid distribution manifold 321, respectively. The cooling system 300 can provide a fluid cooling design for the entire housing at the same time, providing a high degree of separation of the fluid portion from the electronic devices.

[0048] Figure 4A is a block diagram showing a side view of a cooling system for a vertically mounted device enclosing an electronic package (EEP) according to one embodiment. Figure 4A , the cooling system 300 includes an electronic package with a motherboard 401. A fluid cooling module / device 309 (e.g., a cooling plate or a mounting / support plate as part of a mounting device) is mounted on an electronic device 313 that is vertically mounted on the motherboard 401. For example, the vertically mounted electronic device 313 can be attached to the motherboard 401 via a PCIE bus. Since the electronic device / hardware is mounted in a vertical manner, the fluid cooling device 309 can be mounted in a vertical manner. Figure 4A The illustrated method is mounted on one or both sides of the electronic device. For some electronic devices, two cooling plates 409 are sandwiched between the electronic devices 313, while for some electronic devices, a single cooling plate 409 is used, and the other side is a support 403. The support 403 can be a mounting plate, or a support plate or a support panel.

[0049] In one embodiment, the cooling system 300 includes one or more fluid circuits 405. The fluid circuits may include fluid tubes / hoses. The fluid circuits 405 may be preassembled to the cooling module 309 or removable circuits via a coupler at the end that engages with the cooling module 309. When the cooling plate 409 (as part of the cooling module 309) is Figure 4AWhen attached to the electronic device 313 in the manner shown in FIG. 1 , horizontal pressure applied between the vertically mounted electronic device 313 and one or more cooling plates 409 ensures proper thermal contact between the electronic device 313 and the cooling plates 409. In addition, thermal glue can be used at the electronic device to cooling plate interface ( Figure 4A not shown).

[0050] Figure 4B is a block diagram showing a top view of a cooling system for a vertically mounted device 313 of an EEP, according to one embodiment. Figure 4B A top view of a cooling system 300 for a vertically mounted device 313 is shown. The cooling system 300 may include a mounting frame 431. Multiple functions are provided by the mounting frame 431. First, the mounting frame 431 can be used as a structural support for cooling devices (e.g., cold plates) and fluid circuits. The second function is to provide separation of the fluid circuit 405 and the electronic device 313 / mainboard 401. The third function is to be used to mount and secure the cooling module 309 to the chassis and the electronic device 313. In one embodiment, the mounting frame 431 is attached to one or more side or bottom panels of the chassis. In one embodiment, the mounting frame is preassembled with the chassis. In another embodiment, the mounting frame is attached to the chassis via one or more mounting structures, wherein the one or more mounting structures are attached to the chassis.

[0051] Figure 5 is a block diagram illustrating a side view of a cooling system for a horizontally mounted device of an EEP according to one embodiment. Figure 5 A cooling system 300 is shown for an electronic device 311 that is mounted on a motherboard 401 in a horizontal manner, such as by a column socket. It can be seen that a cooling module 307 (e.g., a cooling plate 407 as part of the cooling module 307) is attached over the top of the electronic device. Here, the one or more cooling devices are each attached to one of the electronic devices 311 (such as a high-density power processor / microcontroller, etc.). In this case, no modification of the electronic device is required for the cold plate to be mounted on the electronic device. Instead, the mounting frame supports the installation and fixation of the cooling module.

[0052] Figure 6 A top view of a fluid dispensing unit for an EEP is shown according to one embodiment. Figure 7 A top view of a fluid dispensing unit for an EEP is shown according to one embodiment. Figure 6 to Figure 7 Two implementations of the fluid distribution unit 323 delivering fluid to the cooling module 309 are shown. Figure 6A fluid distribution manifold 321 (as part of a fluid distribution unit 323) is shown that supplies and returns fluid on the same side of the chassis. Two cold plates (as part of cooling modules 309) are connected to a fluid circuit 405, which is connected to the fluid distribution manifold 421. The fluid circuit may include a supply circuit 405A and a return circuit 405B, which supply cooling fluid to the cold plates and return warm fluid from the cold plates, respectively.

[0053] In one embodiment, the circuits of the cold plates are assembled with no-drip quick disconnects for use with the ports of the fluid distribution manifold. In one embodiment, each cold plate has its corresponding fluid circuit. In another embodiment, one or more cold plates share a fluid circuit.

[0054] Figure 7 A fluid supply manifold and a fluid return manifold are shown on opposite sides of the chassis, supplying and returning fluids, respectively. The fluid supply / return manifold may be disposed on a side panel of the chassis within the chassis housing. It should be noted that the manifolds and fluid circuits may be arranged in not only Figure 6 to Figure 7 For example, the circuit design can consider using multiple circuits to distribute the fluid in parallel, each circuit is used for a different cooling plate.

[0055] Figure 8 A side view of a fluid cooling plate for an EEP is shown according to one embodiment. Figure 8 A large fluid cooling plate 305 is shown located near the bottom of the electronics (e.g., a motherboard 401 with the electronics). Since these electronics enclosed within the chassis housing (these devices may be low power density components) generate additional heat, since these devices are low power density devices, heat conduction through the large cooling plate may be sufficient for their normal operation. Therefore, a large fluid cooling plate may be used for the motherboard electronics to provide additional cooling to the motherboard electronics. In one embodiment, a thermal interface material 801 is applied between the large cooling plate 305 and the motherboard electronics 401.

[0056] Fig. 9 A side view of a mounting structure for an EEP is shown according to one embodiment. Fig. 9One or more mounting structures attached to the side panel of the chassis are shown. The mounting structure 901 can be preassembled to the chassis 303 or mounted to the chassis 303 after assembly. The mounting structure 901 can provide an insertion opening for inserting the mounting frame 431 into the mounting structure 901. When inserted, the mounting frame 431 is structurally supported by the mounting structure 901 and the chassis 303. Thereafter, a cooling module for cooling equipment (e.g., a cooling plate) can be attached to the mounting frame. In one embodiment, the length of the mounting frame is equal to the length of the chassis. The two ends of the mounting frame can be inserted into two mounting structures located at opposite ends of the chassis.

[0057] The structural design of the mounting structure enables the mounting frame to be inserted into the mounting structure in a top-down manner. In one embodiment, the mounting structure includes a locking track 903. The locking track 903 can be a directional track. For horizontally mounted electronic devices, where a cooling module is attached to the mounting frame, an operator can apply pressure and push the cooling module downward to insert the mounting frame into the locking track, and then the cooling plate (as part of the cooling module) can load pressure onto the electronic device via the locking track. Here, the locking track enables the mounting frame to be inserted downward while preventing upward movement. Once the mounting frame is pushed to a certain vertical position, the mounting frame is fixed to the locking track. Thus, appropriate pressure can be loaded onto the horizontally mounted electronic device.

[0058] For vertically mounted electronic devices, the operator can apply a similar process, except that pressure is applied to the cooling device sandwiched between vertically mounted electronic devices such as PCIE electronic devices. In this case, the loading and installation of the mounting frame on the mounting structure does not require downward pressure. On the contrary, the mounting frame needs to be installed to a certain height. Then, the cooling device / module (which may have an adjustable height or structural design) can be pressed against the surface of the vertically mounted electronic device. In this way, the pressure loaded on the cooling device / module is directly transmitted to the electronic device, which is fixed by the mounting frame and the mounting structure.

[0059] Fig.10 A side view of mounting / locking teeth (serrated edges) of a mounting structure for an EEP is shown according to one embodiment. Fig.10 A plurality of mounting structures 901 are shown mounted on one side panel of the chassis housing. Each mounting structure includes a locking track 903 coupled to the mounting structure 901, the locking track 903 including an opening insert 1001 that serves as an entry for inserting an end of a mounting frame (not shown) into the mounting structure. The locking track includes mounting teeth 1003 (or serrated teeth or serrated edges) for locking and securing the mounting frame to the mounting structure.

[0060] In one embodiment, the serrated teeth 1003 point in one direction, thereby allowing the mounting frame to be inserted in one direction from top to bottom, but not removable. The mounting frame edge may have corresponding teeth that can cooperate or lock with the mounting teeth. In one embodiment, the mounting structure includes an unlocking kit 1005. The unlocking kit 1005 can be activated to release the mounting teeth. Once the mounting teeth are released, the mounting frame can be removed from the mounting structure. It should be noted that the current implementation is only one possible implementation for implementing the concept. However, other designs or implementations can also be used to achieve similar functions or results for the mounting frame or mounting teeth.

[0061] In the above description, embodiments of the present invention have been described with reference to specific exemplary embodiments of the present invention. It will be apparent that various modifications may be made to the present invention without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Therefore, the present description and the accompanying drawings should be understood in an illustrative rather than a restrictive sense.

Claims

1. A fluid cooling system, comprising: An electronic package mounted on a motherboard contained within a computer case; a first mounting structure attached to a first side panel of the chassis, comprising a first vertical mounting slot; a second mounting structure attached to a second side panel of the chassis, comprising a second vertical mounting slot; and a fluid cooling module that spans across the top of the electronic package, wherein the fluid cooling module is mounted on the first mounting structure and the second mounting structure by inserting a first end and a second end of the fluid cooling module into the first vertical mounting slot and the second vertical mounting slot for providing fluid cooling to a cold plate attached to the top surface of the electronic package, wherein the fluid cooling module includes mounting rails attached to a mounting frame that is attached to the first and second mounting structures; Wherein, the fluid cooling module includes: a mounting track attached to a mounting frame, the mounting frame attached to the first mounting structure and the second mounting structure of the chassis; a fluid circuit formed on the mounting track; and one or more cooling devices connected to the fluid circuit, wherein the one or more cooling devices are fixed to the electronic components of the electronic package via the mounting track.

2. The system according to claim 1, wherein: The chassis forms a completely closed environment for the electronic enclosure such that no outside air is exchanged with the air inside the closed environment.

3. The system of claim 1 , further comprising a fluid distribution unit coupled to the chassis, the fluid distribution unit comprising: fluid inlet; Fluid outlet; as well as A fluid distribution channel is coupled to the fluid inlet and the fluid outlet, and distributes the fluid from the fluid inlet to the fluid outlet.

4. The system according to claim 3, wherein: The fluid circuit is coupled to a fluid distribution channel of the fluid distribution unit.

5. The system according to claim 3, wherein: The fluid distribution unit also includes a fluid distribution manifold located adjacent the first side panel of the chassis to receive cooling fluid from the fluid inlet and return warmer fluid to the fluid outlet.

6. The system according to claim 5, wherein: The fluid circuit includes a fluid supply circuit portion and a fluid return circuit portion, wherein the fluid supply circuit portion is used to receive cooling fluid from the fluid inlet via the fluid distribution manifold to supply cooling fluid to the electronic device, and the fluid return circuit portion is used to return warmer fluid from the electronic device to the fluid outlet via the fluid distribution manifold.

7. The system according to claim 3, wherein: The fluid distribution unit comprises: a fluid supply manifold located adjacent the first side panel of the chassis to receive cooling fluid from the fluid inlet; and A fluid return manifold is located adjacent the second side panel of the chassis to return warmer fluid to the fluid outlet.

8. The system according to claim 7, wherein: The fluid circuit includes a fluid supply circuit portion and a fluid return circuit portion, wherein the fluid supply circuit portion is used to receive cooling fluid from the fluid inlet via the fluid supply manifold to cool the cooling device, and the fluid return circuit portion is used to return warmer fluid from the cooling device to the fluid outlet via the fluid return manifold.

9. The system according to claim 7, wherein: The fluid circuit is a flexible fluid tube.

10. The system according to claim 1, wherein: The cooling device includes one or more cooling plates fixed to at least one surface of the electronic device to cool the surface of the electronic device.

11. The system according to claim 10, wherein: Each of the one or more cooling plates is attachable to the fluid circuit, wherein the cooling plate's corresponding fluid circuit is assembled with a no-drip quick disconnect for use with a port of a fluid distribution manifold.

12. The system according to claim 10, wherein: The electronic device includes a Peripheral Component Interconnect Express (PCIe) electronic device coupled to a PCIe bus, and the one or more cooling plates are pressed to a surface of the PCIe electronic device.

13. The system of claim 1, further comprising a large cooling plate assembled near a bottom of the chassis, wherein the large cooling plate is located on a bottom surface of the motherboard to cool the bottom surface of the motherboard.

14. The system according to claim 13, wherein: The large cooling plate is directly assembled to the distribution channel of the fluid distribution unit to bypass the fluid circuit.

15. The system of claim 1, wherein: Each of the first mounting structure and the second mounting structure comprises: a plurality of mounting teeth along a length of the mounting structure to lock the mounting frame to the mounting structure; and An unlocking latch deactivates the plurality of mounting teeth to release the mounting frame from the mounting structure.

16. The system of claim 1, wherein: The electronics package includes electronics for a server blade that is part of a server rack.

17. The system of claim 1, wherein: The electronic package includes electronic devices for an edge computing device for an autonomous vehicle.

18. A data processing system contained in a chassis, comprising: Motherboard; a central processing unit (CPU), mounted on the mainboard; an electronic package mounted on the mainboard contained within the chassis; a first mounting structure attached to a first side panel of the chassis, comprising a first vertical mounting slot; a second mounting structure attached to a second side panel of the chassis, comprising a second vertical mounting slot; and a fluid cooling module spanning across the top of the electronic package, wherein the fluid cooling module is mounted on the first mounting structure and the second mounting structure by inserting a first end and a second end of the fluid cooling module into the first vertical mounting slot and the second vertical mounting slot for providing fluid cooling to a cold plate attached to a top surface of the electronic package; Wherein, the fluid cooling module includes: a mounting track attached to a mounting frame, the mounting frame attached to the first mounting structure and the second mounting structure of the chassis; a fluid circuit formed on the mounting track; and one or more cooling devices connected to the fluid circuit, wherein the one or more cooling devices are fixed to the electronic components of the electronic package via the mounting track.

19. An electronic rack for a data center, comprising: The server blade array is arranged in a rack, each server blade includes one or more servers accommodated in a chassis, and each chassis includes: Motherboard; a central processing unit (CPU), mounted on the mainboard; An electronic package mounted on a motherboard housed within a computer case; a first mounting structure attached to a first side panel of the chassis, comprising a first vertical mounting slot; a second mounting structure attached to a second side panel of the chassis, comprising a second vertical mounting slot; and a fluid cooling module spanning across the top of the electronic package, wherein the fluid cooling module is mounted on the first mounting structure and the second mounting structure by inserting a first end and a second end of the fluid cooling module into the first vertical mounting slot and the second vertical mounting slot for providing fluid cooling to a cold plate attached to a top surface of the electronic package; Wherein, the fluid cooling module includes: a mounting track attached to a mounting frame, the mounting frame attached to the first mounting structure and the second mounting structure of the chassis; a fluid circuit formed on the mounting track; and one or more cooling devices connected to the fluid circuit, wherein the one or more cooling devices are fixed to the electronic components of the electronic package via the mounting track.

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