Electric control panel

Abstract

The present invention relates to an electric control board, comprising a first electric control board, a second electric control board and a MIPS, wherein the MIPS is installed between the first electric control board and the second electric control board which are stacked up and down, the pin distribution of the MIPS connects the first electric control board and the second electric control board, and the working voltage of the first electric control board is a weak voltage, and the working voltage of the second electric control board is a strong voltage. In this way, the isolation of the strong and weak current circuits is achieved, thereby minimizing the interference of the strong current on the weak current circuit, especially the interference on the input control signal, because the input control signal is electrically connected to the MCU, thus effectively reducing the interference on the control signal output by the MCU, thereby effectively improving the reliability of the entire electric control board.

Description

Technical Field

[0001] The invention relates to an electric control board, belonging to the technical field of modular intelligent power system application. Background Art

[0002] Modular Intelligent Power System, or MIPS (Modular Intelligent Power System), is a power drive product that combines power electronics and integrated circuit technology. The pins of MIPS include strong current pins and weak current pins. Strong current pins include pins for output loads and strong current power supply, and weak current pins include pins for input control signals. When applied, MIPS is usually installed on a single electric control board, which contains strong current circuits and weak current circuits. The strong current circuit is generally installed with discrete components such as large electrolytic capacitors for filtering, inductors for PFC circuits, bridge stacks for rectifier circuits, etc. The weak current circuit includes MCU and electronic components around MCU. During operation, the strong current circuit is easy to interfere with the weak current circuit, which interferes with the control signal output by MCU to MIPS, causing disorder in its control and affecting the reliability of MIPS. In addition, both strong current and weak current are set on one electric control board, and the isolation of strong and weak current must be considered, which makes the electric control board occupy a large area and is not convenient for miniaturization of the entire electric control board. Summary of the invention

[0003] The technical problem to be solved by the present invention is to solve the problem that the existing MIPS application circuit samples a single electric control board, causing strong electric interference and weak electric current to affect the working reliability of MIPS, and the electric control board occupies a large area.

[0004] Specifically, the present invention discloses an electric control board, comprising: a first electric control board, a second electric control board and a MIPS; the first electric control board and the second electric control board are stacked up and down, the MIPS is installed between the first electric control board and the second electric control board, the pins of the MIPS are divided into two groups bent up and down, respectively connecting the first electric control board and the second electric control board, wherein the working voltage of the first electric control board is a weak voltage, and the working voltage of the second electric control board is a strong voltage.

[0005] Optionally, a bracket is installed on a side of the first electric control board opposite to the MIPS, a support wall is arranged around the bracket, the support wall abuts against the radiator, and the MIPS is accommodated in an installation space surrounded by the support wall.

[0006] Optionally, the first electric control board is provided with a first electronic component, and the first electronic component includes an MCU and a passive electronic component.

[0007] Optionally, the first electronic component is a surface mount package, and the first electronic component is mounted on a side of the first electronic control board away from the MIPS.

[0008] Optionally, a radiator is installed between the second electric control board and the MIPS, and the radiator is installed in close contact with the heating surface of the MIPS.

[0009] Optionally, the heat sink includes a base and heat dissipation fins, and the heat dissipation fins are installed on a side of the second electronic control board away from the MIPS.

[0010] Optionally, mounting grooves are respectively provided on opposite side walls of the base, mounting arms cooperating with the mounting grooves are respectively provided on opposite sides of the second electric control board, and the base is fixed to the second electric control board through the cooperation between the mounting grooves and the mounting arms.

[0011] Optionally, the second electric control board is provided with a second electronic component, and the second electronic component is mounted on a side of the second electric control board away from the MIPS.

[0012] Optionally, the electric control board further includes a fixing member, the base and the mounting arm are respectively provided with a first mounting hole and a second mounting hole, and the fixing member passes through the first mounting hole and the second mounting hole to fix the base and the mounting arm.

[0013] Optionally, the pin group of MIPS connected to the first electronic control board includes pins for input control signals, power pins for the MIPS internal driver chip, and fault feedback pins for the driver chip; the pin group of MIPS connected to the second electronic control board includes pins for the MIPS output control load, high power supply pins, and lower bridge arm emitter output pins of MIPS.

[0014] The electric control board of the present invention comprises a first electric control board, a second electric control board and a MIPS, wherein the MIPS is installed between the first electric control board and the second electric control board which are stacked up and down, the pin distribution of the MIPS connects the first electric control board and the second electric control board, and the working voltage of the first electric control board is a weak voltage, and the working voltage of the second electric control board is a strong voltage. In this way, the isolation of the strong and weak current circuits is achieved, thereby minimizing the interference of the strong current on the weak current circuit, especially the interference on the input control signal, because the input control signal is electrically connected to the MCU, thus effectively reducing the interference on the control signal output by the MCU, thereby effectively improving the reliability of the entire electric control board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a MIPS for an electric control board according to an embodiment of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of fixing the PCB and the bracket of the first electric control board according to an embodiment of the present invention;

[0017] Figure 3 is a schematic structural diagram of a second electric control board according to an embodiment of the present invention;

[0018] Figure 4It is a schematic diagram of the structure of the electric control board according to an embodiment of the present invention, wherein the surface of the first electric control board on which the electronic components are mounted faces upward;

[0019] Figure 5 It is a schematic diagram of the structure of the electric control board according to an embodiment of the present invention, wherein the surface of the second electric control board on which the electronic components are mounted faces upward;

[0020] Figure 6 for Figure 5 A schematic diagram of the structure of the electric control board in another direction;

[0021] Figure 7 for Figure 5 The right side view of the electric control panel in FIG.

[0022] Figure 8 for Figure 5 Front view of the electronic control panel.

[0023] Reference numerals:

[0024] Second electric control board 1, second electronic component 11, mounting arm 12, radiator 2, base 21, first mounting hole 211, heat sink fin 22, bracket 3, fixing hole 31, support wall 32, first electric control board 4, first electronic component 41, MCU411, MIPS5, second pin group 51, first pin group 52, package body 53. DETAILED DESCRIPTION

[0025] It should be noted that, in the case where the structures or functions do not conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below based on examples.

[0026] The present invention provides an electric control board, such as Figures 1 to 8 As shown, it includes a first electric control board 4, a second electric control board 1 and a MIPS5, the first electric control board 4 and the second electric control board 1 are stacked up and down, and the MIPS5 is installed between the first electric control board 4 and the second electric control board 1. The pins of the MIPS5 are divided into two groups bent up and down, respectively connecting the first electric control board 4 and the second electric control board 1, wherein the working voltage of the first electric control board 4 is a weak voltage, and the working voltage of the second electric control board 1 is a strong voltage. Figure 1 and Figure 4As shown, MIPS5 divides the pins into two groups, namely the first pin group 52 and the second pin group 51, wherein the functions of the first pin group 52 and the second pin group 51 are different, and the voltages of the signals transmitted by the pins are different. Specifically, the first pin group 52 is a weak voltage, and the second pin group 51 is a strong voltage. The strong voltage here generally refers to an AC or DC voltage above 180V, and the weak voltage refers to an AC or DC voltage below 36V. According to the prior art, the pins of MIPS5 are divided into pins for inputting control signals, power pins for the MIPS internal driver chip and fault feedback pins for the driver chip, pins for outputting control loads of MIPS, strong power supply pins, and emitter output pins of the lower bridge arm of MIPS according to their functions. Among them, the pins for inputting control signals, the power pins for the MIPS internal driver chip and the fault feedback pins for the driver chip transmit weak electric signals, and the pins for outputting control loads of MIPS, strong power supply pins, and emitter output pins of the lower bridge arm of MIPS transmit strong electric signals. By bending the first pin group 52 and the second pin group 51 up and down to electrically connect the first electric control board 4 and the second electric control board 1 stacked up and down respectively, the circuits connected to the MIPS5 are respectively arranged on different electric control boards according to the strong current and the weak current, so as to achieve the isolation of the strong current and the weak current circuits, thereby reducing the interference of the strong current on the weak current circuit as much as possible, especially the interference on the input control signal, because the input control signal is electrically connected to the MCU411, thus effectively reducing the interference on the control signal output by the MCU411, thereby effectively improving the reliability of the entire electric control board. Moreover, by dividing the electric control board into two pieces and stacking them up and down, the occupied area of ​​the electric control board set in the prior art can be effectively reduced, thereby effectively reducing the occupied volume of the entire electric control board, which is conducive to the miniaturization of the electric control board.

[0027] In some embodiments of the present invention, Figures 2 to 8As shown, a bracket 3 is installed on one side of the first electric control board 4 opposite to the MIPS5, and a support wall 32 is arranged around the bracket 3, the support wall 32 abuts against the radiator 2, and the MIPS5 is accommodated in the installation space surrounded by the support wall 32. The support wall 32 is arranged on the side of the bracket 3, and a space is left on the pin side where the MIPS5 is installed to facilitate the installation of the pin. The height of the support wall 32 can be slightly higher than the thickness of the package body 53 of the MIPS5, so that the entire package body 53 can be accommodated in the space surrounded by the support wall 32. The bracket 3 can be made of insulating plastic material. A fixing hole 31 can also be arranged on the bottom surface of the bracket 3 to facilitate fixing the bracket 3 to the first electric control board 4 by fixing parts such as screws. By providing the bracket 3, when MIPS5 is installed between the first electric control board 4 and the second electric control board 1, MIPS5 is protected in the support wall 32 of the bracket 3 to avoid damage caused by collision with foreign objects. In addition, during the installation process, due to the protection of the support wall 32 of the bracket 3, damage to MIPS5 caused by squeezing during the installation of the first electric control board 4 and the second electric control board 1 is avoided, thereby effectively protecting MIPS5.

[0028] In some embodiments of the present invention, Figures 3 to 8 As shown, the first electric control board 4 is provided with a first electronic component 41, and the first electronic component 41 includes an MCU 411 and passive electronic components. Since the first electric control board 4 is provided with a weak current circuit, the first electronic components 41 installed on the first electric control board 4 are all electronic components that work with weak current, such as the MCU 411, IC and other passive components such as resistors and capacitors. These electronic components are preferably arranged on the side of the first electric control board 4 away from the MIPS 5, that is, as shown in FIG. Figure 4 The upper surface of the first electric control board 4 is shown, so as to be further away from the second electric control board 1 working with strong electricity, reducing the influence of its interference. Since the first electronic component 41 works at a weak voltage, its power consumption is very low, so it can be packaged with a patch, which further reduces its occupied volume, thereby reducing the volume of the first electric control board 4, including the occupied area and the thickness of the upper and lower parts. It is conducive to the miniaturization of the entire electric control board.

[0029] In some embodiments of the present invention, Figures 3 to 8As shown, a heat sink 2 is also installed between the second electric control board 1 and MIPS5, and the heat sink 2 is installed in close contact with the heating surface of MIPS5. One side of the package body 53 of MIPS5 is a heating surface formed by an exposed metal substrate to transfer the heat generated by the high-power power devices packaged inside it, such as the six switch tubes constituting the upper and lower bridge arms of the inverter, such as IGBT (Insulated Gate Bipolar Transistor) or MOS tube (metal oxide semiconductor), as well as freewheeling diodes, rectifier bridge stacks, etc. The overcurrent of these power devices can be as large as more than 10A, so the power is high and the heat is high. In order to achieve heat dissipation, an aluminum or copper heat sink 2 is generally installed on the heating surface of MIPS5. The heat sink 2 includes a base 21 and heat dissipation fins 22 connected thereto. The surface of the base 21 is tightly fitted with the heating surface, and a thermal conductive material such as silicone grease can be further coated between the two to enhance the heat transfer between the two. The heat dissipation fins 22 are installed on the side of the second electric control board 1 away from MIPS5, as shown in FIG. Figure 4 The figure shows the downward side of the second electric control board 1. The heat generated by the power device is finally transferred to the air through the heat dissipation fins 22 to achieve heat dissipation. The MIPS5 and the heat sink 2 can generally be installed by opening a threaded hole in the base 21. The MIPS5 package body 53 is generally provided with fixing grooves on both sides. The MIPS5 and the heat sink 2 are fixed by fixing parts such as screws embedded in the fixing grooves and screwed into the threaded holes.

[0030] Furthermore, if Figures 3 to 8 As shown, the two opposite side walls of the base 21 are respectively provided with mounting grooves (not shown in the figure), and the two opposite sides of the second electric control board 1 are respectively provided with mounting arms 12 that match the mounting grooves, and the base 21 is fixed to the second electric control board 1 through the matching of the mounting grooves and the mounting arms 12. Figure 3 As shown, two mounting arms 12 extend from the left and right sides of the second electric control board 1 along the direction of the side edges, and the length of the mounting arms 12 is Figure 4 The length of the radiator 2 in the front-to-back direction is consistent, and the mounting arm 12 is preferably formed integrally with the PCB (printed circuit board) of the second electric control board 1 to facilitate processing. The left and right side walls of the base 21 of the radiator 2 are provided with mounting grooves, the depth of the mounting grooves is consistent with the width of the mounting arm 12, and the height of the mounting grooves in the up-down direction is consistent with the thickness of the mounting arm 12, so that it is convenient for the mounting arm 12 to penetrate into the mounting grooves to achieve the cooperation between the two, thereby quickly realizing the installation of the radiator 2 on the second electric control board 1. Moreover, if Figure 5As shown, a fixing member (not shown in the figure) may also be provided, and the base 21 and the mounting arm 12 may also be provided with a first mounting hole 211 and a second mounting hole (not shown in the figure), respectively. The fixing member passes through the first mounting hole 211 and the second mounting hole to fix the base 21 and the mounting arm 12, so that the radiator 2 is reliably fixed to the second electric control board 1 through the fixing member such as a self-tapping screw or a bolt.

[0031] In some embodiments of the present invention, Figures 3 to 8 As shown, the second electric control board 1 is provided with a second electronic component 11, and the second electronic component 11 is installed on the side of the second electric control board 1 away from MIPS5. The second electric control board 1 is for high-voltage operation, and because the transmission current of the second pin group 51 connected to MIPS5 is large, the power of the second electronic component installed thereon is also relatively large, so its volume is also larger than the first electronic component 41, and is generally a plug-in package. Its corresponding circuit is generally a power supply circuit that provides a high-voltage working power supply (such as 300V DC voltage) for MIPS5, and an electronic component of a PFC circuit, such as a rectifier bridge stack, an electrolytic capacitor for filtering, a PFC switch tube such as an IGBT, an inductor, and a freewheeling diode. The volume of these electronic components is much larger than that of the first electronic component 41 of the SMD package, and the thickness of the installation thereof generally does not exceed the thickness of the heat sink fin 22. By installing the second electronic component 11 on the side of the second electric control board 1 away from MIPS5, Figure 4 The lower surface of the second electric control board 1 is formed in the middle, so that the second electronic component 11 is as far away from the first electronic component 41 as possible, further reducing the interference between the two.

[0032] According to the electric control board provided in the above embodiment, the installation steps are as follows:

[0033] The first step is to manufacture MIPS5. The MIPS5 manufacturing method in the prior art can be referred to and will not be described in detail here. After the MIPS5 is manufactured, the pins of MIPS5 can be further shaped by bending and shaping the first pin group 52 and the second pin group 51 mentioned in the above embodiment up and down to facilitate the pin installation in subsequent steps.

[0034] In the second step, the plug-in packaged second electronic component 11 is mounted on the PCB of the second electric control board 1 to form a mounting board of the second electric control board 1 .

[0035] In the third step, the mounting arm 12 of the PCB of the second electric control board 1 is extended into the mounting groove of the heat sink 2, and the two are fixed by a fixing member to form a second electric control board assembly.

[0036] The fourth step is to install the second pin group 51 of MIPS5 in the PCB of the second electric control board 1, and fix MIPS5 and the heat sink 2 by fixing parts such as screws to achieve close fit between the surface of the invention and the surface of the mounting seat, and apply thermal conductive silicone grease between the two to enhance the heat transfer between the two. The heat sink 2, MIPS5, and the second electric control board 1 assembly can be fixed by a special carrier, and then the second pin group 51 of MIPS5 and the second electronic component 11 are welded to the PCB of the second electric control board 1 by welding such as wave soldering, thereby fixing MIPS5, the heat sink 2 and the electronic components to the PCB of the second electric control board 1. Among them, the special carrier has a high temperature resistance of 100-300 degrees Celsius and good heat insulation, and the material used cannot react with tin.

[0037] Step 5: fix the first electronic component 41 on the PCB of the first electronic control board 4 by welding, such as reflow soldering, and install the bracket 3 on the Figure 4 The lower surface of the PCB board of the first electronic control board 4 is shown.

[0038] In the sixth step, the MIPS5 of the second electric control board 1 formed in the fourth step is installed in the bracket 3, and the first pin group 52 of the MIPS5 is installed on the PCB board of the first electric control board 4, and the first electric control board 4 and the second electric control board 1 are fixed by fixing members such as screws, so as to fix the MIPS5 in the bracket 3. Since the height of the support wall 32 of the bracket 3 is higher than the thickness of the package body 53 of the MIPS5, when fixing the first electric control board 4 and the second electric control board 1, as shown in FIG. Figure 4 As shown, the support wall 32 abuts against the lower surface of the first electric control board 4 and the surface of the base 21 of the radiator 2 from top to bottom, and the MIPS 5 will not be squeezed, thereby protecting the MIPS 5 and achieving reliable fixation of the first electric control board 4 and the second electric control board 1.

[0039] In the seventh step, the first pin group 52 installed on the first electric control board 4 in the sixth step is fixed to the PCB of the first electric control board 4 by welding, such as wave soldering, through a special carrier, so as to complete the installation of the entire electric control board. The special carrier has a high temperature resistance of 100-300 degrees Celsius and good heat insulation, and the material used cannot react with tin.

[0040] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0041] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0043] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An electric control panel, characterized in that: include: A first electric control board, a second electric control board and a modular intelligent power system; The first electric control board and the second electric control board are stacked up and down, the modular intelligent power system is installed between the first electric control board and the second electric control board, the pins of the modular intelligent power system are divided into two groups bent up and down, respectively connected to the first electric control board and the second electric control board, wherein the working voltage of the first electric control board is a weak voltage, and the working voltage of the second electric control board is a strong voltage; A bracket is installed on one side of the first electric control board relative to the modular intelligent power system, a support wall is arranged around the bracket, the support wall abuts against the radiator, and the modular intelligent power system is accommodated in an installation space surrounded by the support wall; The first electric control board is provided with a first electronic component, and the first electronic component includes an MCU and a passive electronic component; The first electronic component is a surface mount package, and the first electronic component is installed on a side of the first electric control board away from the modular intelligent power system; A radiator is also installed between the second electric control board and the modular intelligent power system, and the radiator is installed in close contact with the heating surface of the modular intelligent power system; The heat sink comprises a base and heat dissipation fins, and the heat dissipation fins are installed on a side of the second electric control board away from the modular intelligent power system; The two opposite side walls of the base are respectively provided with mounting grooves, the two opposite sides of the second electric control board are respectively provided with mounting arms matched with the mounting grooves, and the base is fixed to the second electric control board through the matching of the mounting grooves and the mounting arms; The second electric control board is provided with a second electronic component, and the second electronic component is installed on a side of the second electric control board away from the modular intelligent power system.

2. The electric control board according to claim 1, characterized in that: A fixing piece is also included, the base and the mounting arm are respectively provided with a first mounting hole and a second mounting hole, and the fixing piece passes through the first mounting hole and the second mounting hole to fix the base and the mounting arm.

3. The electric control board according to claim 1, characterized in that: The pin group of the modular intelligent power system connected to the first electric control board includes a pin for inputting a control signal, a power pin of the internal driving chip of the modular intelligent power system, and a fault feedback pin of the driving chip; the pin group of the modular intelligent power system connected to the second electric control board includes a pin for outputting a control load of the modular intelligent power system, a high-voltage power supply pin, and an emitter output pin of the lower bridge arm of the modular intelligent power system.

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