A constant temperature destruction electronic tag

Abstract

The present invention provides a fixed-temperature destruction electronic tag, which relates to the technical field of electronic tags. The fixed-temperature destruction electronic tag provided by the present invention includes: a soluble substrate; a radiator circuit, the radiator circuit is located on the first surface of the soluble substrate, and the radiator circuit includes a liquid metal with a first melting point; a solvent supply layer, the solvent supply layer is used to provide a solvent to the soluble substrate, the solvent supply layer includes a solvent and a limiting structure, the limiting structure is used to limit the flow of the solvent, the limiting structure is made of a fixed-melting-point material with a second melting point, the solvent is used to dissolve the soluble substrate, and the second melting point is higher than the first melting point. The technical solution of the present invention can monitor whether the product fails due to over-temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic tags, and in particular to a constant temperature destruction electronic tag. Background Art

[0002] Cold Chain Logistics refers to a systematic project that keeps refrigerated and frozen products in a specified low-temperature environment throughout the production, storage, transportation, sales, and before consumption to ensure product quality and reduce losses. With the development of social needs, cold chain logistics is being used more and more widely.

[0003] The objects of cold chain logistics mainly include medicines, vaccines, and various fresh and quick-frozen foods that need to be stored at low temperatures. These products are highly sensitive to temperature. If the specified temperature is exceeded during the logistics process, they are prone to failure, deterioration, and other problems. At present, domestic cold chain logistics often have over-temperature problems due to technical and management problems. For example, intermittent refrigeration during storage and transportation, or refrigeration equipment failure, the product is still at a low temperature when it reaches the consumer / user, but it has reached above the specified temperature during storage and transportation. Therefore, it is necessary to monitor the temperature of the entire cold chain logistics process. Summary of the invention

[0004] The present invention provides a constant-temperature destruction electronic tag, which can monitor whether a product fails due to over-temperature.

[0005] The present invention provides a constant temperature destruction electronic tag, which adopts the following technical solution:

[0006] The constant temperature destruction electronic tag includes:

[0007] Soluble substrate;

[0008] a radiator circuit, the radiator circuit being located on the first surface of the soluble substrate and comprising a liquid metal having a first melting point;

[0009] A solvent supply layer, the solvent supply layer is used to provide a solvent to the soluble substrate, the solvent supply layer includes a solvent and a limiting structure, the limiting structure is used to limit the flow of the solvent, the solvent is used to dissolve the soluble substrate, and the limiting structure is made of a fixed melting point material with a second melting point, and the second melting point is higher than the first melting point.

[0010] Optionally, the soluble substrate is a lignocellulose film, and the solvent is water or an aqueous solution.

[0011] Furthermore, the thickness of the soluble substrate is 0.05 mm to 0.2 mm.

[0012] Optionally, the limiting structure is made of a fixed melting point material with a melting point of 5°C to 50°C.

[0013] Furthermore, the limiting structure is made of paraffin.

[0014] Optionally, the solvent supply layer includes a plurality of constant temperature melting microcapsules, the capsule walls of the constant temperature melting microcapsules are made of a constant melting point material having the second melting point and serve as the limiting structure, and the capsule core of the constant temperature melting microcapsules is the solvent.

[0015] Furthermore, the constant temperature melting microcapsule also includes a coupling agent, and the coupling agent is used to couple the capsule wall and the capsule core of the constant temperature melting microcapsule.

[0016] Optionally, the limiting structure is in the shape of a hollow shell, and the solvent is coated in the limiting structure.

[0017] Optionally, the solvent supply layer is located on the second surface of the soluble substrate and is disposed in contact with the soluble substrate.

[0018] Optionally, the constant temperature destruction electronic tag further comprises an outer package, and the outer package covers the soluble substrate, the radiator circuit and the solvent supply layer.

[0019] The present invention provides a constant-temperature-destruction electronic tag. The constant-temperature-destruction electronic tag comprises a solvent supply layer which is arranged in contact with a soluble substrate. The solvent supply layer comprises a solvent and a limiting structure. The limiting structure is used to limit the flow of the solvent. The solvent is used to dissolve the soluble substrate. The limiting structure is made of a fixed-melting-point material with a second melting point, and the second melting point is higher than the first melting point. After the constant temperature destructive electronic tag is fixed on the product, when the ambient temperature of the product is lower than the second melting point, the limiting structure in the solvent supply layer is solid, which limits the solvent, and the solvent cannot contact the soluble substrate. The soluble substrate structure is stable, which provides a good support for the radiator circuit, and the radiator circuit can work normally, that is, the constant temperature destructive electronic tag can be identified. When the ambient temperature of the product reaches or exceeds the second melting point, the limiting structure melts and releases the solvent. The solvent contacts the soluble substrate. After the soluble substrate is dissolved by the solvent, it cannot support the radiator circuit. Alternatively, after the soluble substrate is swollen, the radiator circuit is stretched and separated, which will disconnect the radiator circuit and make the constant temperature destructive electronic tag unidentifiable. Even if the ambient temperature drops below the second melting point afterwards, the soluble substrate and the radiator circuit will not return to their original state. Therefore, the constant temperature destructive electronic tag can accurately and irreversibly reflect the ambient temperature changes of the product, thereby monitoring whether the product fails due to over-temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the structure of a first constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the structure of the first type of constant temperature destruction electronic tag after destruction provided by an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of the structure of a second constant temperature destruction electronic tag provided by an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of the structure of a second type of constant temperature destruction electronic tag after destruction provided by an embodiment of the present invention;

[0025] Figure 5 A schematic diagram of the structure of a third constant temperature destruction electronic tag provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0028] The embodiment of the present invention provides a constant temperature destruction electronic tag, specifically, Figure 1 As shown, Figure 1 The first embodiment of the present invention provides a structural diagram of a fixed temperature destruction electronic tag, which includes:

[0029] Soluble substrate 1;

[0030] a radiator circuit 2, the radiator circuit 2 is located on the first surface of the soluble substrate 1, and the radiator circuit 2 comprises a liquid metal having a first melting point T1;

[0031] The solvent supply layer 3 is used to provide a solvent 31 to the soluble substrate 1. The solvent supply layer 3 includes a solvent 31 and a limiting structure 32. The limiting structure 32 is used to limit the flow of the solvent 31. The solvent 31 is used to dissolve the soluble substrate 1. The limiting structure 32 is made of a fixed melting point material having a second melting point T2, and the second melting point T2 is higher than the first melting point T1.

[0032] The set destruction temperature range of the above-mentioned fixed temperature destruction electronic tag can be 5°C to 50°C. Those skilled in the art must know that the specific value of the second melting point T2 should be determined according to the temperature corresponding to the high-temperature failure of the product to which the fixed temperature destruction electronic tag is applied. For example, if the high-temperature failure temperature of the product is 30°C, the second melting point T2 should be selected as 30°C, if the high-temperature failure temperature of the product is 5°C, the second melting point T2 should be selected as 5°C, and so on.

[0033] The above-mentioned "fixed melting point material" refers to a material having a specified melting point and a narrow melting range.

[0034] After the constant temperature destruction electronic tag is fixed on the product, Figure 1 As shown, when the ambient temperature of the product is lower than the second melting point T2, the limiting structure 32 in the solvent supply layer 3 is solid, which limits the solvent 31, and the solvent 31 cannot contact the soluble substrate 1. The soluble substrate 1 has a stable structure and plays a good supporting role for the radiator circuit 2. The radiator circuit 2 can work normally, that is, the constant temperature destruction electronic tag can be identified. When the ambient temperature of the product reaches or exceeds the second melting point T2, as shown in FIG. Figure 2 As shown, Figure 2 The schematic diagram of the structure of the first type of constant temperature destruction electronic tag after destruction provided in an embodiment of the present invention is that the limiting structure 32 melts to release the solvent 31, the solvent 31 contacts the soluble substrate 1, the soluble substrate 1 is dissolved by the solvent and cannot support the radiator circuit, or the soluble substrate 1 is swollen and the radiator circuit 2 is stretched and separated, both of which will cause the radiator circuit 2 to be disconnected and the constant temperature destruction electronic tag cannot be identified, even if the ambient temperature drops below the second melting point T2 thereafter, the soluble substrate 1 and the radiator circuit 2 will not return to their original state. Therefore, the constant temperature destruction electronic tag can accurately and irreversibly reflect the ambient temperature changes of the product, thereby monitoring whether the product fails due to over-temperature.

[0035] It should be noted that in the embodiments of the present invention Figure 2 The dissolution of the soluble substrate 1 is taken as an example for explanation. The dissolution or swelling of the soluble substrate 1 shown in other subsequent figures is only for illustration and is not limiting. In actual situations, whether the soluble substrate 1 is dissolved or swollen after contacting the solvent 31 should be determined comprehensively based on the properties and thickness of the soluble substrate 1, and the properties and content of the solvent.

[0036] It should be noted that there are many combinations of the soluble substrate 1 and the solvent 31, such as the soluble substrate 1 is an organic film, the solvent 31 is an organic solvent, such as ethanol, acetone, etc., or the soluble substrate 1 is a water-soluble substance, and the solvent 31 includes water. In this case, toxic solvents are avoided, which is safer. Optionally, in the embodiment of the present invention, the soluble substrate 1 is a lignocellulose film, and the solvent 31 is water or an aqueous solution.

[0037] Furthermore, if the thickness of the soluble substrate 1 is too large, the dissolution or swelling process will be slow and the reliability will be poor. If the thickness of the soluble substrate 1 is too small, it will not provide sufficient support when it is in a solid state, and the amount of liquid provided after dissolution is small or the volume change after swelling is small. After fully considering the above content, the thickness of the soluble substrate 1 selected in the embodiment of the present invention is 0.05mm~0.2mm.

[0038] The previously mentioned "radiator circuit 2 includes liquid metal with a first melting point T1" can be implemented in many ways, such as the entire radiator circuit 2 is a liquid metal circuit, or part of the radiator circuit 2 is a liquid metal circuit, and part of the radiator circuit 2 is a circuit made of conductive materials such as copper, aluminum, and conductive silver paste.

[0039] Optionally, the liquid metal in the embodiment of the present invention is a metal element with a melting point below 300°C, an alloy with a melting point below 300°C, or a blend with a melting point below 300°C, the blend including at least two of the metal element, the alloy and the functional powder, that is, the blend includes the metal element and the alloy, or the blend includes the alloy and the functional powder, or the blend includes the metal element and the functional powder, or the blend includes the metal element, the alloy and the functional powder.

[0040] For example, the metal element may be mercury element, gallium element, indium element or tin element.

[0041] Exemplarily, the alloy can be one of a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-tin alloy, a gallium-zinc alloy, a gallium-indium-zinc alloy, a gallium-tin-zinc alloy, a gallium-indium-tin-zinc alloy, a gallium-tin-cadmium alloy, a gallium-zinc-cadmium alloy, a bismuth-indium alloy, a bismuth-tin alloy, a bismuth-indium-tin alloy, a bismuth-indium-zinc alloy, a bismuth-tin-zinc alloy, a bismuth-indium ...lead alloy, a bismuth-tin-cadmium alloy, a bismuth-lead-tin alloy, a bismuth-tin-lead-cadmium alloy, a tin-lead alloy, a tin-copper alloy,

[0042] When the electronic tag includes a chip, the antenna of the electronic tag is composed of an electromagnetic coupling circuit and an electromagnetic reflection circuit. The former determines whether the chip in the electronic tag is working, and the latter determines the distance of signal transmission. Based on this, the embodiment of the present invention selects that when part of the radiator circuit 2 is a liquid metal circuit, the liquid metal circuit is located at the connection between the radiator circuit 2 and the chip, and / or at the position of the electromagnetic coupling circuit. Such a setting can ensure that the chip cannot work after the liquid metal circuit is disconnected, and on the other hand, it can also avoid significant changes in the impedance of the radiator circuit 2 caused by the liquid metal circuit being connected to the radiator circuit 2 in other ways, and will not have an adverse effect on the communication distance.

[0043] When the entire radiator circuit 2 is a liquid metal circuit, the radiator circuit 2 can be made on the substrate 1 using a mixed material of liquid metal and metal powder by printing (screen printing, steel screen printing, flexographic printing), printing, pad printing, transfer printing, etc.

[0044] Optionally, the liquid metal in the above-mentioned mixed material is a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-indium-tin-zinc or a gallium-tin alloy, and the metal powder is silver powder or silver-coated copper powder. The mass fraction of the metal powder in the mixed material is 0% to 35%, such as 1%, 2%, 5%, 8%, 10%, 15%, 20%, 25%, 30% or 35%, to ensure that the mixed material has a suitable viscosity. The particle size range of the metal powder is 50nm to 50μm, so that the mixed material is more delicate, less granular, and easy to make liquid metal circuits by screen printing and other methods.

[0045] In the embodiment of the present invention, the solvent supply layer 3 may be located on the first surface of the soluble substrate 1, or on the second surface of the soluble substrate 1. The solvent supply layer 3 may also include multiple parts, which are respectively located at different positions of the first surface, different positions of the second surface, or different positions of the first surface and the second surface of the soluble substrate 1. In addition, the solvent supply layer 3 may be in direct contact with the soluble substrate 1, or may not be in direct contact with the soluble substrate 1, as long as the solvent 31 released by the limiting structure 32 in the solvent supply layer 3 after melting can contact the soluble substrate 1.

[0046] The inventors found that when Figure 1 As shown, the solvent supply layer 3 is located on the second surface of the soluble substrate 1 and is in direct contact with the soluble substrate 1. The solvent supply layer 3 can be a whole layer structure, which is relatively simple to manufacture and can provide a large amount of solvent 31. When the solvent supply layer 3 is located on the first surface of the soluble substrate 1, as shown in FIG. Figure 3 and Figure 4 As shown, Figure 3 A schematic diagram of the structure of a second constant temperature destruction electronic tag provided by an embodiment of the present invention, Figure 4The present invention provides a schematic structural diagram of the second type of constant temperature destruction electronic tag after destruction. If the constant temperature destruction electronic tag also includes a chip 4, the solvent supply layer 3 should include an opening corresponding to the chip 4 to prevent the solvent in the solvent supply layer from adversely affecting the chip 4 and to improve the surface flatness of the constant temperature destruction electronic tag.

[0047] Optionally, the limiting structure 32 in the embodiment of the present invention is made of a fixed melting point material with a melting point of 5°C to 50°C. The fixed melting point material that meets the above melting point range may be paraffin, lipids, etc. Furthermore, in the embodiment of the present invention, the limiting structure 32 is selected to be made of paraffin. Exemplarily, the melting point and melting range of the paraffin sheet can be adjusted by changing the preparation process of paraffin and adjusting the molecular weight and polymer chain length of the synthetic polymer, thereby satisfying the requirement of the fixed temperature destruction electronic tag in the embodiment of the present invention for the second melting point T2 of the limiting structure 32 in different application scenarios.

[0048] In the embodiment of the present invention, there are many ways for the limiting structure 32 in the solvent supply layer 3 to limit the solvent 31. For example, the limiting structure 32 is an integral structure, and all the solvents 31 are limited therein; or, the limiting structure 32 is divided into multiple parts, and the solvent 31 is divided into multiple parts, and each limiting structure 32 limits a part of the solvent 31 respectively.

[0049] In an example, Figure 1 and Figure 3 As shown, the solvent supply layer 3 includes a plurality of constant temperature melting microcapsules, the capsule wall of the constant temperature melting microcapsules is made of a constant melting point material having a second melting point T2 and serves as a limiting structure 32, and the capsule core of the constant temperature melting microcapsules is a solvent 31. When the ambient temperature of the product reaches the second melting point T2, the capsule wall of the constant temperature melting microcapsules melts and releases the solvent 31 therein.

[0050] Furthermore, the constant temperature melting microcapsule also includes a coupling agent, which is used to couple the capsule wall and capsule core of the constant temperature melting microcapsule. When the constant temperature melting microcapsule is prepared by mixing the capsule wall material in a liquid or dissolved state with the capsule core, the addition of the coupling agent can greatly improve the efficiency of the constant temperature melting microcapsule preparation.

[0051] In another example, Figure 5 As shown, Figure 5 The schematic diagram of the structure of the third constant temperature destruction electronic tag provided by the embodiment of the present invention is that the limiting structure 32 is in the shape of a hollow shell, and the solvent 31 is coated in the limiting structure 32. When the ambient temperature of the product reaches the second melting point T2, the limiting structure 32 melts and releases the solvent 31 therein.

[0052] Optionally, the constant temperature destruction electronic tag in the embodiment of the present invention further includes an outer package, which covers the soluble substrate 1, the radiator circuit 2, the solvent supply layer 3, etc., thereby protecting various structures in the constant temperature destruction electronic tag.

[0053] The above-mentioned external packaging can be in the form of vacuum packaging. Such a setting can make the external packaging provide a certain stress to the liquid metal and the soluble substrate 1 after packaging (the stress is derived from the inevitable stress difference between the upper and lower layers of packaging materials during vacuum packaging). When the soluble substrate 1 is in a solid state, the stress will not cause damage to the soluble substrate 1 and the radiator circuit 2. When the substrate 1 dissolves into liquid, the stress will promote the disconnection of the soluble substrate 1 and the radiator circuit 2, thereby improving the reliability of the constant temperature destruction label.

[0054] Furthermore, when vacuum packaging is adopted, the outer packaging can be a PET film or a nylon film.

[0055] To facilitate understanding and implementation by those skilled in the art, the following embodiments of the present invention provide two specific constant temperature destruction electronic tags, as follows:

[0056] Embodiment 1:

[0057] like Figure 1 As shown, the constant temperature destructible electronic tag includes a soluble substrate 1, a radiator circuit 2 and a solvent supply layer 3, the solvent supply layer 3 includes a plurality of constant temperature melting microcapsules, the radiator circuit 2 is located on the first surface of the soluble substrate 1, the solvent supply layer 3 is located on the second surface of the soluble substrate 1 and is in direct contact with the soluble substrate 1.

[0058] Among them, the soluble substrate 1 is a 0.05mm thick wood cellulose film; the material of the radiator circuit 2 is a gallium-indium alloy mixed with a mass ratio of 8% and a silver-coated copper powder with a particle size of 2μm; the radiator circuit 2 is drawn on the soluble substrate 1 by screen printing; the constant temperature melting microcapsule is obtained by mixing paraffin with a melting point of 37°C, water, and a coupling agent, that is, the capsule wall of the constant temperature melting microcapsule is paraffin with a melting point of 37°C, the capsule core is water, and the capsule wall and the capsule core are connected by a coupling agent.

[0059] At present, some biologically active vaccines use cold chain logistics below 37°C. The above-mentioned fixed temperature destruction electronic label can be pasted inside the vaccine packaging box. When the ambient temperature reaches or exceeds 37°C, Figure 2 As shown, the paraffin melts, water is released, the soluble matrix 1 contacts water and is dissolved or swelled, the radiator circuit 2 fails due to a short circuit and cannot be identified. When the vaccine ends the cold chain logistics, the constant temperature destruction electronic tag is identified. If there is a constant temperature destruction electronic tag whose data cannot be read, it means that the corresponding vaccine has failed due to over-temperature in the cold chain logistics process.

[0060] Embodiment 2:

[0061] like Figure 3 As shown, the constant temperature destruction electronic tag includes a soluble substrate 1, a radiator circuit 2, a solvent supply layer 3 and a chip 4, the solvent supply layer 3 includes a plurality of constant temperature melting microcapsules, the radiator circuit 2 is located on the first surface of the soluble substrate 1, the chip 4 is placed on the first surface of the soluble substrate 1, and is connected to the radiator circuit 2 to form a radio frequency circuit; the solvent supply layer 3 covers the soluble substrate 1, the radiator circuit 2 and the chip 4, and has an opening corresponding to the chip 4.

[0062] Among them, the soluble substrate 1 is a 0.2mm thick wood cellulose film; the material of the radiator circuit 2 is a gallium-indium-tin-zinc alloy mixed with a mass ratio of 15% and a silver powder with a particle size of 20μm; the radiator circuit 2 is drawn on the soluble substrate 1 by transfer; the constant temperature melting microcapsule is obtained by mixing paraffin with a melting point of 8°C, water, and a coupling agent, that is, the capsule wall of the constant temperature melting microcapsule is paraffin with a melting point of 8°C, the capsule core is water, and the capsule wall and the capsule core are connected by a coupling agent.

[0063] At present, the storage and transportation of medicines, vaccines, and fresh foods widely use cold chain logistics below 8°C, and the fixed temperature destruction electronic label can be pasted inside the product packaging box. Figure 4 As shown, the paraffin melts, water is released, the soluble matrix 1 contacts water and is dissolved or swelled, the radiator circuit 2 fails due to a short circuit and cannot be identified. When the vaccine ends the cold chain logistics, the constant temperature destruction electronic tag is identified. If there is a constant temperature destruction electronic tag whose data cannot be read, it means that the corresponding vaccine has failed due to over-temperature in the cold chain logistics process.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A constant temperature destruction electronic tag, characterized in that: include: Soluble substrate; a radiator circuit, the radiator circuit being located on the first surface of the soluble substrate and comprising a liquid metal having a first melting point; a solvent supply layer, the solvent supply layer is used to provide a solvent to the soluble substrate, the solvent supply layer comprises a solvent and a limiting structure, the limiting structure is used to limit the flow of the solvent, the solvent is used to dissolve the soluble substrate, the limiting structure is made of a fixed melting point material having a second melting point, and the second melting point is higher than the first melting point; The limiting structure is in the shape of a hollow shell, and the solvent is coated in the limiting structure; The constant temperature destruction electronic tag further comprises an outer package, which covers the soluble substrate, the radiator circuit and the solvent supply layer.

2. The constant temperature destruction electronic tag according to claim 1, characterized in that: The soluble substrate is a lignocellulose film, and the solvent is water or an aqueous solution.

3. The constant temperature destruction electronic tag according to claim 2, characterized in that: The thickness of the soluble substrate is 0.05 mm to 0.2 mm.

4. The constant temperature destruction electronic tag according to claim 1, characterized in that: The limiting structure is made of a fixed melting point material with a melting point of 5°C to 50°C.

5. The constant temperature destruction electronic tag according to claim 4, characterized in that: The limiting structure is made of paraffin.

6. The constant temperature destruction electronic tag according to claim 1, characterized in that: The solvent supply layer comprises a plurality of constant temperature melting microcapsules, the capsule walls of the constant temperature melting microcapsules are made of a constant melting point material having the second melting point and serve as the limiting structure, and the capsule cores of the constant temperature melting microcapsules are the solvent.

7. The constant temperature destruction electronic tag according to claim 6, characterized in that: The constant temperature melting microcapsule further comprises a coupling agent, and the coupling agent is used for coupling the capsule wall and the capsule core of the constant temperature melting microcapsule.

8. The constant temperature destruction electronic tag according to claim 1, characterized in that: The solvent supply layer is located on the second surface of the soluble substrate and is disposed in contact with the soluble substrate.

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