Leadframe, package with die cut leads and saw cut sides, and corresponding methods

Abstract

A package (100) includes a carrier (102), an electronic component (104) on the carrier (102), an encapsulant (106) encapsulating at least a portion of the carrier (102) and the electronic component (104), and at least one lead (108) extending out of the encapsulant (106) and having a die cut surface (130), wherein at least a portion of at least one side (110) of the encapsulant (106) has a sawing texture (281).

Description

TECHNICAL FIELD

[0001] Various embodiments relate generally to a package, a leadframe and a method of manufacturing a package. BACKGROUND

[0002] A package can refer to an encapsulated electronic component having electrical connection structures protruding from the encapsulation and mounted to a peripheral electronic device, e.g. mounted on a printed circuit board.

[0003] Package costs are an important driver in the industry. Related to this are performance, size and reliability. Different package solutions are manifold and have to meet the requirements of the application. SUMMARY

[0004] It can be desirable to provide a possibility of manufacturing a package which focuses on reducing the complexity of the process while maintaining a high device reliability.

[0005] According to one exemplary embodiment, a package is provided, the package comprising a carrier, an electronic component on the carrier, an encapsulation encapsulating the carrier and at least a portion of the electronic component and at least one lead extending out of the encapsulation and having a punched surface, wherein at least a portion of at least one side of the encapsulation has a sawing texture.

[0006] According to another exemplary embodiment, a method of manufacturing a package is provided, wherein the method comprises mounting an electronic component on a carrier, encapsulating the carrier and at least a portion of the electronic component by an encapsulation, punching at least one lead extending out of the encapsulation and sawing at least a portion of at least one side of the encapsulation.

[0007] According to yet another exemplary embodiment, a leadframe concept is provided, the leadframe comprising a patterned conductive sheet, a plurality of carriers defined within the sheet and arranged in rows and columns and at least one lead assigned to each carrier, wherein the sheet has a larger extension along the rows than along the columns and wherein the leads extend along the rows.

[0008] According to one exemplary embodiment, a packaged, in particular molded, package is provided, the package having at least one sawed side, in particular two opposite sawed sides on opposite sides of the encapsulation, and at least one further side, in particular two opposite further sides on opposite sides of the encapsulation and different from the one or more sawed sides, the further side(s) having one or more leads punched. The feature of the at least one further side can be defined by the encapsulation process, in particular by molding.

[0009] According to one exemplary embodiment, a package with encapsulated electronic components mounted on carriers is provided, wherein a part of the outer contour of the package is defined by sawing, in particular by mechanical sawing, while another part of the contour is defined by punching. The respective manufacturing process flow can be efficient, as it can encapsulate multiple carriers with mounted electronic components by a spatially extended, in particular strip-shaped, encapsulation before separating the common encapsulation structure by sawing individual encapsulations into individual packages. In a direction perpendicular to the extension of such a common encapsulation body, one or more leads can extend from one or both opposite sides of the encapsulation attributed to the respective package which can be separated by punching. Thus, an efficient multi-package encapsulation and efficient singulation by high-speed sawing can be combined with fast and simple singulation in orthogonal direction by punching.

[0010] A leadframe according to one exemplary embodiment can advantageously be used to perform the described manufacturing process flow, which allows for a higher resource utilization efficiency for manufacturing packages. To support the above-described manufacturing process flow, such a leadframe can have leads attributed to various carriers oriented to extend from the short sides of the carriers and parallel to the long sides of the carriers. In contrast to conventional approaches, the respective carriers can be arranged to be rotated by 90° within the frame of the leadframe, as described. This can ensure compatibility with the formation of a common encapsulation strip or the like extending along the shorter sides of the carriers and the shorter sides of the leadframe, as a common encapsulation along the longer sides of the leadframe can be technically more difficult. Accordingly, sawing can be performed along the longer sides of the carriers and the leadframe. The sawing can be performed according to a copper-poor or even copper-free sawing trajectory, so that the sawing is performed mainly or completely through the encapsulation material which can allow for high-speed sawing. Punching, on the other hand, can be performed along the shorter sides of the leadframe, so that it can also be performed very efficiently. Finally, packages can be manufactured based on the described leadframe concept by performing a simple and material-saving manufacturing method according to one exemplary embodiment.

[0011] Description of further example embodiments

[0012] In the following, further exemplary embodiments of packages, leadframe concepts, and methods will be described.

[0013] In the context of the present application, the term "package" can particularly denote an electronic device which can comprise one or more electronic components mounted on a carrier, the carrier comprising or consisting of a single component, a plurality of components joined via an encapsulation or other package component, or a sub-assembly of a carrier. The components of the package can be at least partially encapsulated by an encapsulant. Optionally, one or more electrically conductive interconnects (e.g. connection wires and / or clips) for electrically coupling the electronic components with the carrier can be implemented in the package.

[0014] In the context of the present application, the term "electronic component" can particularly include a semiconductor chip (particularly a power semiconductor chip), an active electronic device (e.g. a transistor), a passive electronic device (e.g. a capacitor or inductor or ohmic resistor), a sensor (e.g. a microphone, a light sensor or a gas sensor), a light-emitting semiconductor-based device (e.g. a light-emitting diode (LED) or a laser), an actuator (e.g. a loudspeaker) and a microelectromechanical system (MEMS). Particularly, the electronic component can be a semiconductor chip having at least one integrated circuit element (e.g. a diode or a transistor) in a surface portion thereof. The electronic component can be a bare die or can have been packaged or encapsulated. Semiconductor chips implemented in accordance with a number of exemplary embodiments can be formed in silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0015] In the context of the present application, the term "encapsulant" can particularly denote a substantially electrically insulating material which surrounds at least a portion of an electronic component and at least a portion of a carrier to provide mechanical protection, electrical isolation, and optionally to facilitate heat removal during operation. Particularly, the encapsulant can be a molding compound. The molding compound can comprise a matrix of flowable and hardenable material and filler particles embedded therein. For example, the filler particles can serve to adjust the properties of the molded component, particularly to enhance thermal conductivity.

[0016] In the context of the present application, the term "carrier" can particularly denote a support structure (which can be at least partially electrically conductive) which serves as a mechanical support for one or more electronic components to be mounted thereon and which can also facilitate electrical interconnection between the electronic components and the periphery of the package. In other words, the carrier can implement a mechanical support function and an electrical connection function. The carrier can comprise or consist of a single component, a plurality of components joined via an encapsulant or other package component, or a sub-assembly of a carrier. When the carrier forms part of a leadframe, it can be or can comprise a die pad.

[0017] In the context of the present application, the term "lead" can particularly denote an electrically conductive (e.g. strip-shaped) element (which can be planar or curved) that can be functionally assigned to a carrier and used for contacting an electronic component from the outside of a package. For example, a lead can be partially encapsulated and partially exposed with respect to an encapsulant. When a carrier forms part of a leadframe, a lead can surround a die pad of the carrier. The one or more leads can or can not form part of the carrier.

[0018] In the context of the present application, the term "leadframe" can particularly denote a metal structure comprising an array of initially integrally connected carriers and leads for a package. Electronic components can be attached to the carriers of the leadframe, then connection wires and / or clips can be provided for attaching the pads of the electronic components to the leads of the leadframe. Subsequently, the leadframe can be molded in a plastic housing or any other encapsulant. At the outside and / or inside of the leadframe, respective parts of the leadframe can be cut off, thereby separating the respective leads and / or carriers. Before such cutting off, other processes can be performed, such as plating, final testing, packaging, etc. The leadframe can consist of a plurality of carriers for electronic components, wherein each carrier can have a mounting section and one or more leads.

[0019] In the context of the present application, the term "punch surface" can particularly denote a surface area that bounds the one or more leads and is defined by punching. Punching can denote a forming process that uses a punch press to force a tool, which can be referred to as a punch, through a workpiece to form a hole via shearing. Punching can be applied to a variety of sheet-like materials, including metal sheets. Punching is a simple, thus efficient method of defining structures in patterned sheet material. Thus, a punch surface is a surface defined by punching. The person skilled in the art will understand that a punch surface has characteristic properties that can be easily and unambiguously analyzed by the person skilled in the art. At the punch surface that bounds a lead, a respective side of the encapsulant can be defined by an encapsulation process, in particular by molding. The respective encapsulant, such as a molding compound, can comprise a matrix (e.g. comprising a resin) with filler particles. At the molding surface that corresponds to the punch surface of a lead, the filler particles are coated by the matrix material of the encapsulant, in particular of the molding compound type, in order to form a defined structure with a coated pixel-like structure on the surface. Furthermore, the molding side at the punch surface of the respective lead can be beveled (e.g. with a bevel angle in the range of 6° to 12°, in particular 8° to 10°), to facilitate removal of the respective molded body from a mold.

[0020] In the context of the present application, the term "sawn texture of the side" can particularly denote a surface structure or surface profile on the side surface of the encapsulant defined by sawing. Preferably, the sawing process is a mechanical sawing process using a saw blade. Alternatively, a laser saw is also feasible. Due to such a sawing process, particularly a mechanical sawing process using a saw blade, a rough surface texture is obtained (particularly with a roughness Ra of more than 0.8 pm, especially between 0.8 pm and 5 pm, for example approximately 1 pm). This rough feature of the sawing side results from the formation of microscopic scratches, traces, fine grooves or corrugations by the sawing tool. For example, a mechanical saw blade can have diamond bodies for sawing bonded with polyimide, which for example can generate the sawing texture. Particularly, the sawn texture of the at least one side can have a roughness Ra of more than 0.8 pm and corrugations of a greater size compared to the size of protrusions and indentations involved in the roughness. The roughness of a surface can be defined and measured as center line average height Ra. Ra is the arithmetic average of all distances of the profile from the center line. For example, as mentioned in the context of the present application, the measurement or determination of the roughness Ra of a sawed surface can be performed according to DIN EN ISO 4287:2010. A saw for forming the sawing texture can refer to a tool comprising a hard saw blade with a hard tooth edge. Such a saw can be used for cutting the encapsulant material and, optionally, also the metal material of one or more lead wires by forcing the tooth edge against the material and moving it forward with force and less forcefully or continuously back. For example, a power circular saw blade can be used for this purpose. At the sawed side of the encapsulant, particularly the sawed side of the molding compound, a fractured surface can be obtained at which filler particles can also be sawed on the surface of the sawed side. Thus, the sawed side can be defined by the material of the above-mentioned matrix of the encapsulant and can also be partially defined by the cut, uncoated filler particles.

[0021] In one embodiment, at least one other side of the encapsulant has a molded texture. Particularly, two opposite sides of the encapsulant can be at least partially sawed and the other two sides of the encapsulant can have a molded texture. In the context of the present application, the term "molded texture" can particularly denote a characteristic surface profile of the side formed by molding. Particularly, such a molded texture can comprise a smooth surface (particularly with a smaller surface roughness Ra than the side with the sawed texture), a microscopic surface pixel structure corresponding to the filler particles added to the molding compound and appearing on the outer surface of the molded type encapsulant and moreover coated with the molding encapsulant material, particularly the molding resin. Thus, two sides of the encapsulant profile can be defined by sawing, while the other two sides can be defined by molding. Such an encapsulant feature is for example referred to below with reference to Figure 3Unique hallmark of the highly advantageous manufacturing process flow described.

[0022] In one embodiment, the at least one lead is arranged at a shorter side of the (e.g. substantially rectangular) carrier, in particular at two opposite shorter sides of the carrier. By arranging the one or more leads at the shorter sides of the carrier, the column-wise arranged packages can be group- wise encapsulated and can be die-cut along the columns and saw-cut along the rows. This architecture is a paradigm shift to conventional approaches.

[0023] In one embodiment, the at least one sawing side is defined by the encapsulation only, in particular. In such an embodiment, the sawing of the side can be performed through the encapsulation material only, in particular the molding compound material. Since in such an embodiment a metal sawing can be completely avoided, a high-speed sawing can be ensured, which in turn can ensure an efficient processing.

[0024] In another embodiment, the at least one sawing side is defined by the encapsulation and a (in particular metallic) tie bar connected to the carrier only, in particular. Such a tie bar can be used to integrally connect various carriers in a leadframe compound before singulation into a package. In particular, a ratio between a surface area of the exposed tie bar at the respective sawing side and an overall surface area of the respective sawing side can be less than 10%, in particular less than 5%, more particularly less than 3%. In such an alternative embodiment, the sawing is performed through the material of the (in particular molding type) encapsulation and the material of the very limited amount of metallic tie bar only. The highly limited tie bar sawing can saw through only a few percent of the surface area of the metallic material, which preserves the advantage of a substantially high-speed sawing through the encapsulation material. At the same time, the tie bar can connect different carriers of a leadframe, which can increase the mechanical stability during manufacturing. Thus, a high-precision package can be obtained.

[0025] In one embodiment, the tie bar has a thicker portion within the encapsulation compared to a thinner portion at the respective sawing side. The amount or percentage of metallic material sawed during the singulation process of the package can be further reduced by locally thinning the tie bar section in the area of the leadframe to be sawed by methods such as punching or other methods. By taking this measure, a high mechanical stability can be obtained at the same time as a high-speed sawing.

[0026] In one embodiment, the encapsulation has at least one inclined side wall at which the at least one lead extends out of the encapsulation. In particular, the molding surface can have the feature of an inclined side wall which can be a unique hallmark of the molding process from which the encapsulation solidified afterwards is removed from the mold. In order to facilitate this removal process, an inclined side wall in the range of typically 6% to 10%, in particular 6° to 8° is obtained. Accordingly, the side of the encapsulation to which the punched lead extends out of the encapsulation can be inclined. In contrast to this, the sawed side can be perpendicular.

[0027] In one embodiment, the at least one sawed side having a sawed texture has a perpendicular side wall. Since the saw blade cuts through the packaging body (mainly the encapsulation) substantially perpendicularly during the sawing process, the one or more side walls defined by the sawing also extend perpendicularly.

[0028] In one embodiment, the at least one lead is partially or completely covered by a plating layer. For example, the exposed portion of the lead can be covered by a plating layer such as a tin layer. More generally, such a plating layer can be made of a solderable material, thereby simplifying the solder connection of the packaging body to a mounting base (e.g. a printed circuit board, PCB) after the formation of the packaging body is completed. For example, the entire exposed surface of the lead can be coated with a plating layer. Alternatively, only a portion of the exposed surface of the at least one lead is coated with such a plating layer. The material of the lead covered by the plating layer can for example be copper.

[0029] In one embodiment, the encapsulation has at least one recess in at least one of the at least one side having a sawed texture. In other words, a portion of at least one of the sides, in particular a central portion, can be delimited by a recess which is not formed by sawing but for example by punching. Accordingly, only a portion of the side can be sawed while another portion can be punched. By punching such a recess of the encapsulation, for example the metal tie bars holding the carrier together in the lead frame can be removed prior to sawing. Accordingly, since the tie bar remnants can be removed, sawing through the metal material can be completely prevented, thereby further accelerating the sawing. Accordingly, the punching recess can advantageously be formed prior to sawing.

[0030] In one embodiment, the carrier is exposed with respect to the encapsulation at the bottom side of the packaging body. Accordingly, an electrically conductive surface can be provided at the bottom side of the packaging body which can simplify the electrical connection of the packaging body and also can promote heat dissipation during operation of the packaging body, in particular when the electronic component is a power semiconductor chip.

[0031] In one embodiment, the package comprises a clip electrically connected to the upper main surface of the electronic component. Such a clip can be a curved electrically conductive body which realizes an electrical connection to the upper main surface of the respective electronic component with a high connection area. By embedding the clip into the package for electrically connecting the encapsulated electronic component, any desired electrically conductive path can be established without effort. In addition to or as an alternative to such a clip, one or more further electrically conductive interconnects, such as connection wires and / or connection strips, can also be implemented in the package.

[0032] In one embodiment, the clip is integrally formed with the at least one lead. Thus, at least a portion of the lead can form a portion of the clip. Thus, the clip can also comprise the at least one lead. Thus, the connection between the clip and the at least one lead can be solderless. In particular, a direct physical connection of the clip and the lead is possible. Advantageously, the clip itself can thus comprise the above-mentioned lead or at least one further lead which is partially covered by the encapsulation and partially exposed with respect to the encapsulation. Thus, the integrally formed clip-lead-structure can significantly simplify the manufacture of the package, since an additional connection between the clip and the lead, for example by soldering or the like, can not be required. This further simplifies the manufacturing process.

[0033] In one embodiment, the clip electrically connects the upper main surface of the electronic component with the at least one lead forming a portion of the carrier. Thus, at least a portion of the lead can form a portion of the carrier or can at least belong to a portion of a lead frame which has originally already been connected with the carrier. It is also possible that a portion of the lead is provided by the carrier and another portion of the lead is provided by the clip.

[0034] In one embodiment, a portion of the clip is arranged at the same vertical height level as the carrier. For example, the clip can be a curved body having an upper flat portion connected to the upper main surface of the electronic component and having a lower plate-like portion arranged coplanar with the carrier or the lead frame. Thus, a highly compact configuration form of the package can be obtained.

[0035] In one embodiment, the die-cut surface is an exposed surface of the at least one lead or lead portion which is not covered by the encapsulation. In particular, the exposed surface can be one of a die-cut end surface (see, for example, Figure 4 and Figure 5 ) and a die-cut side surface (see, for example, Figure 37 ) of the at least one lead. In particular, the at least one lead can be locally thickened at the die-cut side surface (see, for example, Figure 37). Thus, a portion of the leadframe can be punched to form or define one or more leads at the free end of the respective lead, i.e. the end defining its length. However, additionally or alternatively, the punching process can also laterally form a punched surface of the at least one lead, e.g. for uncoupling different leads by removing a respective portion of a tie bar or the like. In the latter case, due to tolerances or similar, it can happen that the respective lead has a locally thickened portion at the location where it is punched.

[0036] In one embodiment, the method comprises mounting further electronic components on a further (preferably conductive) carrier such that the electronic components and the carrier are arranged in a plurality of rows and a plurality of columns, encapsulating at least a portion of the further carrier and the further electronic components by a further encapsulant, punching further leads extending out of the further encapsulant, and sawing further side portions of the further encapsulant. In other words, the manufacturing method can be performed on a leadframe or panel level, i.e. simultaneously for a plurality of carriers and a plurality of electronic components. This batch processing further reduces the manufacturing effort and allows manufacturing the packages on an industrial scale. The carriers and thus the packages can be arranged in a matrix-like fashion in rows and columns. Descriptively, the sawing can be performed horizontally, i.e. along the rows, while the punching can be performed vertically, i.e. along the columns. In this way, an efficient manufacturing process can be achieved.

[0037] In one embodiment, the method comprises forming a plurality of parallel strips of the material of the encapsulant and the further encapsulant, wherein each strip at least partially encapsulates all carriers and all electronic components of a respective column. According to such a preferred embodiment, strips of the encapsulant material can be formed which, for example, simultaneously cover all carriers and electronic components of one column of the matrix-like arrangement of preforms of packages. Thus, a bar code-like arrangement of parallel, vertically extending strips of encapsulant can be obtained. This can be very advantageously performed by molding. Further advantageously, such a batch molding process can render a runner structure on the leadframe dispensable, which further simplifies the manufacturing process. Moreover, a gate structure for defining the encapsulation path can be significantly simplified or even completely omitted. In particular, the combination of the formation of vertically extending strips of encapsulant with the horizontal extension of leads is of greatest advantage. In one embodiment, such a strip of encapsulant material can have a band-like rectangular shape on the processed leadframe in a top view. However, alternatively, the strip can also be provided with a more complex structure, e.g. with one or more notches extending along the side walls of the strip. Moreover, a surface structure or texture, e.g. grooves, such as V-shaped grooves, can be formed in the upper main surface of the strip of encapsulant for further simplifying a subsequent sawing process, the execution of which serves for singulating the individual packages with the formation of sawed side portions.

[0038] In one embodiment, the method comprises sawing each strip, thereby separating the plurality of packages. Thus, each strip of encapsulations can be cut into a plurality of individual portions, each portion being attributed to a respective package. The cutting can be done by sawing, in particular mechanical sawing. However, it is also possible to saw the plurality of strips of encapsulations in a common process in which the saw blade can saw all parallel and spaced apart strips of encapsulations by first sawing along a first horizontal sawing row and then sawing along a second horizontal sawing row.

[0039] In one embodiment, the method comprises connecting the strips by means of lateral or vertical auxiliary strips of encapsulation material prior to sawing. In order to further improve the stability of the leadframe of the semi-finished strips of encapsulations, it is possible to temporarily connect, for example, vertically extending spaced apart strips of encapsulations by connecting auxiliary strips of encapsulation to all of them during a part of the manufacturing process. Such auxiliary strips or connecting strips can then be separated from the packages during sawing. By providing such strips of encapsulation for stabilizing other parallel arranged strips of encapsulation, it is possible to reduce or even completely dispense with the provision of tie bars, which further simplifies the sawing process. This simplification is due to the fact that the sawing can then be performed only through or substantially only through the encapsulation material and only through a very small amount of metal material of the tie bars or not through metal material of the tie bars at all.

[0040] In one embodiment, the method comprises connecting at least one column of carriers with at least one tie bar. By sawing through the at least one tie bar, it is then also possible to optionally monilize the resulting structure into a plurality of packages. In addition to or instead of providing auxiliary strips of encapsulation, tie bars can be provided to connect the carriers of a respective column or even of adjacent columns in a vertical or inclined manner, for example. These tie bars can improve the stability of the leadframe and of the resulting structure during the manufacturing of the packages. Advantageously, the cross section of the tie bars can remain very small, such that the sawing process cuts mainly through the encapsulation material containing only a small amount of metal material.

[0041] In one embodiment, the method comprises sawing through the at least one tie bar while sawing the strips of encapsulations into a plurality of packages. Thus, the separation of the tie bars and the monilization of the packages can be performed simultaneously.

[0042] In one embodiment, the method comprises connecting a clip frame comprising a plurality of clips between two adjacent columns. The clip frame, e.g. a unitary structure comprising a plurality of clips extending in rows and / or columns, can be attached to each electronic component of the respective carrier. When the clip frame is connected to the lead frame, the clips of the clip frame can be interconnected. As mentioned above, the clips can be curved conductive bodies that enable an electrical connection with the upper main surface of the respective electronic component mounted on the carrier with a high connection area. The clip frame can also be separated into individual clips when the resulting structure is singulated to form individual separate packages. Highly advantageously, such a clip frame can be connected to the aforementioned lead frame very early in the manufacturing process, e.g. after mounting the electronic components on the carrier of the lead frame. Thus, the formation of the clips can also be implemented on panel level, or in other words simultaneously for a plurality of preforms of the packages (ideally). In one embodiment, such a clip frame can establish a connection between the upper main surface of the electronic component and the respective carrier. Even more advantageously, the clip frame itself can comprise the leads of the package (e.g. still initially connected in one piece), which makes a separate solder connection between the leads of the carrier and the clips non-essential.

[0043] In one embodiment, the method particularly comprises connecting the clip frame to the carrier by plugging, wherein the clip frame comprises a plurality of clips between two adjacent columns; and separating the clip frame into a plurality of clips by sawing and / or punching. In particular, the clip frame can be separated into a plurality of clips by punching the tie bars connecting adjacent clips.

[0044] In one embodiment, the method comprises connecting the clip frame to the lead frame by plugging, particularly without soldering. In particular, a simple mechanical form fit can be established between the clip frame and the lead frame. For example, the clip frame can be snapped into or plugged into the lead frame. This can be achieved, for example, by the connection pins of the clip frame and the connection recesses of the lead frame functionally cooperating, or vice versa. By taking this measure, the connection of a plurality of clips for a plurality of packages can be established simultaneously efficiently.

[0045] In one embodiment, the method comprises connecting each clip of the clip frame between a respective one carrier and a respective one electronic component. Thus, the clips can establish an electrically conductive connection between the electronic components and, particularly, the leads of the respective package. Alternatively, however, the clips can also comprise one or more leads, which makes the aforementioned connection non-essential.

[0046] In one embodiment, the method comprises separating the clip frame into a plurality of clips by sawing and / or punching. For example, when the clip frame is mounted on a lead frame which already is provided with electronic components, the clip frame can have tie bars or support structures which interconnect the individual clips. This simplifies the provision of the clips. When the overall structure of the lead frame, the clip frame, the electronic components and the encapsulant is singulated into individual packages, the clip frame can be separated into individual clips by a sawing and punching process. By sawing, the clip frame can be separated into a plurality of clips which are separated in vertical direction. By punching, a separation of the clip frame in vertical direction can be achieved, which is advantageous when the clip frame is provided with vertically arranged tie bars or support structures which are to be removed in order to separate two clips which are arranged in a butterfly form at two opposite sides of such tie bars or support structures.

[0047] Thus, the clip frame can be separated into clips by sawing in horizontal direction and / or by punching in vertical direction. For example, a plurality of clips can be arranged in a row along the lead frame. However, additionally or alternatively, the clip frame can also have two separate clips which are arranged along each row of the lead frame, i.e. in horizontal direction. This can be described as a butterfly configuration. The one or more tie bars described above can connect the clips of the monolithic clip frame in vertical and / or horizontal direction. By simultaneously and in a common process breaking the tie bars by punching, the processed lead frame can be separated into packages, thus allowing a high process efficiency for manufacturing the packages.

[0048] In one embodiment, the method comprises plating at least a portion of the at least one lead, in particular before punching. By such a plating process, the exposed surface of the lead can be made solderable, for example by tin coating. By plating before punching, the punched end of the lead can remain free of plating material. However, alternatively, such free end can also be plated after punching, in particular together with the remaining exposed surface of the at least one lead.

[0049] In one embodiment, the method comprises punching before sawing. Thus, the above described strips of encapsulant can remain intact and provide their stability after punching. Finally, they can be sawn into individual packages by a mechanical saw blade.

[0050] In one embodiment, the method comprises punching along a punching direction and sawing along a sawing direction perpendicular to the punching direction. In one embodiment, the method comprises sawing along a sawing direction perpendicular to the extension direction of each column. Highly advantageously, the sawing can be performed along a sawing trajectory corresponding to the extension direction of the rows. Thus, the fast sawing process can be performed in one piece along the longer extension direction of the leadframe, and thus can be performed efficiently. The punching can be performed along the shorter sides of the leadframe. It has proven to be difficult to form the encapsulant strips along the longer sides of the leadframe, while sawing in this direction is less difficult.

[0051] In one embodiment, the method comprises punching along a punching direction parallel to the extension direction of each column. In other words, the punching can be performed along the shorter extension direction of the leadframe, i.e. in a perpendicular direction or perpendicular to the index strip.

[0052] In one embodiment, the shorter sides of the carrier extend along the direction of the columns. By taking this measure, the formation of the encapsulant strips can advantageously be completed along the shorter sides, and sawing can be performed along the longer sides.

[0053] In one embodiment, the method comprises testing the packages prior to sawing, in particular after punching. The packages are tested, e.g. for electronic functionality, prior to the completion of singulation of the packages, i.e. still on the leadframe or panel level, which greatly simplifies the testing process. In such a testing process, the conductive pins of the testing device can be connected to the exposed pads or leads of the packages, a test signal can be applied, and a response signal can be detected. This can be performed in a highly parallel manner on the panel level, i.e. prior to separating the processed leadframe into individual packages.

[0054] In one embodiment, the method comprises punching the plurality of leads by removing a continuous strip of material connecting the carrier. For example, such a continuous strip of material can be a tie strip which can be removed in one piece. This can be advantageous when such a tie strip is arranged at the end of the leads to be separated.

[0055] In one embodiment, the method comprises punching the plurality of leads by removing a plurality of non-continuous segments of material connecting the carrier. In such an alternative embodiment, the punching process can be performed not at the ends of the leads, but at central portions of the leads or at portions of the encapsulant material immediately surrounding the leads. In this case, a plurality of separate island-like portions of the tie strip or the like are removed by punching.

[0056] In one embodiment, the method comprises arranging the leads in a staggered manner. Arranging the leads in a staggered manner can particularly mean setting the leads in a staggered finger structure. Such a configuration can enable a compact design of the leadframe, which can further improve the resource efficiency of the package manufacturing.

[0057] In one embodiment, the method comprises connecting the leads by tie bars extending along the columns, particularly by forming a mesh structure composed of leads and tie bars. Such an alternative embodiment is very advantageous in terms of compactness and effort. The plurality of tie bars can form vertical beams of the mesh structure, while the leads can form horizontal beams of the mesh structure. For singulation, portions of the tie bars of the mesh structure between the lead portions can be selectively removed.

[0058] In one embodiment of the leadframe, no lead extends along the columns. In such an embodiment, all leads attributed to the carrier of the leadframe can extend along the rows, particularly at one or both of the opposite row side sides of the carrier.

[0059] In one embodiment, the leadframe comprises at least one tie bar extending along the columns and connecting the carriers of at least one column. Tie bars on the leadframe level are very advantageous for holding the individual carriers of the leadframe together before singulation. Particularly before encapsulation, the individual carriers can be difficult to handle without a connecting structure such as a tie bar. Furthermore, such a vertically extending tie bar can easily be removed from the processed leadframe by punching during singulation of the manufactured package.

[0060] In one embodiment, the leadframe comprises two marker tapes extending along the rows, particularly in parallel, and being separated by the carriers along the columns. Such marker tapes can be metal tapes comprising a plurality of through-holes and can be used to simplify the automated handling of the leadframe. Furthermore, the marker tapes can facilitate the precise alignment of the components of the leadframe during package manufacturing. Furthermore, the marker tapes with holes can facilitate the transfer of the leadframe portions to the processing side.

[0061] In one embodiment, the leads extend parallel to the marker tapes of the leadframe. This can include a leadframe design in which the individual devices extend perpendicular to the marker tapes or lines, but their leads (at least one) extend parallel to the marker tapes or lines.

[0062] In one embodiment, the leadframe comprises at least one clipframe comprising a plurality of clips for the carriers and extending along the columns between two adjacent rows. Such a clipframe as already described above can be handled integrally and can be easily connected with the leadframe, e.g. by plug-in or snap-in operation. The connection between the leadframe and the clipframe can be made after mounting the electronic components onto the carriers of the leadframe. The clips of the clipframe can then electrically connect the electronic components. The clipframe can establish connections between the electronic components and the leads of the carriers or can itself contain leads, thereby simplifying the electrical connection of the electronic components. The clipframe can comprise a plurality of clips arranged horizontally and / or vertically. The clipframe and the leadframe can have mating connection structures for establishing a connection between the clipframe and the leadframe. Preferably, a plurality of clipframes is connected to a leadframe having carriers in the form of a matrix array arranged in rows and columns. For example, each individual clipframe can serve two rows of the leadframe.

[0063] In one embodiment, the at least one clipframe comprises a central tie strap extending along the columns and comprises clips on two opposite sides of the central tie strap. Such a central tie strap or support structure of the clipframe can connect the clips of the clipframe in vertical and horizontal direction. Separating the individual clips of the clipframe, each clip being assigned to a respective package, can be preferably done by die cutting in vertical direction, i.e. along the column direction. However, the plurality of parts of the clipframe can also be separated by sawing during singulation of the packages in horizontal direction. Within the leadframe, the shorter sides of the carriers can extend along the columns. Correspondingly, the longer sides of the carriers can extend along the rows.

[0064] In another embodiment, the carriers (instead of being embodied as a metal plate section of the leadframe as described above) comprise a stack of a central electrically insulating thermally conductive layer, e.g. a ceramic layer, and respective electrically conductive layers, e.g. copper layers or aluminum layers, which can be continuous or patterned layers, covering the two opposite main surfaces. In particular, each carrier can also be embodied as a Direct Copper Bonding (DCB) substrate or a Direct Aluminum Bonding (DAB) substrate.

[0065] In one embodiment, the packages are adapted for dual-sided cooling. For example, a first interface structure can thermally couple the encapsulated chip and the carrier with a first heat sink, while a second interface structure can thermally couple the encapsulated chip and the carrier with a second heat sink.

[0066] In one embodiment, the electronic component is configured as a power semiconductor chip. Thus, the electronic component, like a semiconductor chip, can be used for power applications, for example in the automotive field, and can for example have at least one integrated insulated gate bipolar transistor (IGBT) and / or at least another transistor of another type (e.g. MOSFET, JFET, etc.) and / or at least one integrated diode. Such integrated circuit elements can for example be made in silicon technology or based on wide bandgap semiconductors like silicon carbide or gallium nitride. The semiconductor power chip can comprise one or more field effect transistors, diodes, inverter circuits, half bridges, full bridges, drivers, logic circuits, further devices, etc.

[0067] As a substrate or wafer underlying the electronic component, a semiconductor substrate, preferably a silicon substrate, can be used. Alternatively, a silicon oxide substrate or another insulator substrate can be provided. A germanium substrate or a III-V semiconductor material substrate can also be implemented. For example, exemplary embodiments can be implemented in gallium nitride or silicon carbide technology.

[0068] For encapsulation, a plastics-like material or a ceramic material can be used, which can be supplemented by additives such as filler particles, additional resins or other encapsulation additives.

[0069] Furthermore, exemplary embodiments can make use of standard semiconductor processing techniques such as appropriate etching techniques (including isotropic and anisotropic etching techniques, in particular plasma etching, dry etching, wet etching), patterning techniques (which can involve photolithographic masks), deposition techniques (e.g. chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), sputtering, etc.).

[0070] The above and other objects, features and advantages will become apparent from the following description of the exemplary embodiments, taken in conjunction with the accompanying drawings, which show, by way of illustration, various embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0071] The accompanying drawings, which are included to provide a further understanding of the exemplary embodiments and constitute a part of this specification, illustrate the multiple exemplary embodiments.

[0072] In the drawings:

[0073] Figure 1A A top view of a package according to one exemplary embodiment is shown.

[0074] Figure 1B A top view of a leadframe is shown, according to one example embodiment.

[0075] Figure 2 A block diagram of a method of manufacturing a package is shown, according to one example embodiment.

[0076] Figure 3 A top view of a structure obtained during execution of a method of manufacturing a package is shown, according to one example embodiment.

[0077] Figure 4 A top view of a package is shown, according to one example embodiment, Figure 5 A side view of the package is shown.

[0078] Figure 6 A top view of a structure obtained during execution of a method of manufacturing a package is shown, according to one example embodiment.

[0079] Figure 7 A top view of a structure obtained during execution of a method of manufacturing a package is shown, according to another example embodiment.

[0080] Figure 8 A cross-sectional view of a preform of a package manufactured according to one example embodiment is shown.

[0081] Figure 9 A top view of a structure obtained during execution of a method of manufacturing a package is shown, according to one example embodiment.

[0082] Figure 10 A general view and a partial enlargement of a structure obtained during manufacturing of a package, according to one example embodiment, is shown.

[0083] Figure 11 A top view of a structure obtained during execution of a method of manufacturing a package is shown, according to one example embodiment.

[0084] Figure 12 A top view of a structure obtained during execution of a method of manufacturing a package is shown, according to another example embodiment.

[0085] Figure 13 A general view and a partial enlargement of a structure obtained during manufacturing of a package, according to one example embodiment, is shown.

[0086] Figure 14 A top view of a structure obtained during execution of a method of manufacturing a package is shown, according to one example embodiment.

[0087] Figure 15A top view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0088] Figure 16 A top view of a package according to one exemplary embodiment is shown, Figure 17 A side view of the package is shown.

[0089] Figure 18 A top view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0090] Figure 19 Different views of a structure obtained during the manufacturing of a package according to one exemplary embodiment are shown.

[0091] Figure 20 A top view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0092] Figure 21 A top view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0093] Figure 22 A three-dimensional view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0094] Figure 23 A partial enlarged view of a structure according to Figure 22 is shown.

[0095] Figure 24 A three-dimensional view of a clip frame for a package according to one exemplary embodiment is shown.

[0096] Figure 25 A cross-sectional view of a clip frame for a package according to one exemplary embodiment is shown.

[0097] Figure 26 A top view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0098] Figure 27 A cross-sectional view of a portion of a package according to one exemplary embodiment is shown.

[0099] Figure 28 A top view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0100] Figure 29 A top view of a structure obtained during the execution of a method of manufacturing a package according to one exemplary embodiment is shown.

[0101] Figure 30 A top view of a structure obtained during execution of a method of manufacturing a package according to one example embodiment is shown.

[0102] Figure 31 A top view of a package according to one example embodiment is shown.

[0103] Figures 32 to 36 A top view of a structure obtained during execution of a method of manufacturing a package according to one example embodiment is shown.

[0104] Figure 37 A top view of a package according to one example embodiment is shown, obtained by execution of a method of manufacturing a package according to Figures 32 to 36

[0105] Figure 38 A top view of a structure obtained during execution of a method of manufacturing a package according to one example embodiment is shown.

[0106] Figure 39 A top view of a structure obtained during execution of a method of manufacturing a package according to one example embodiment is shown. DETAILED DESCRIPTION

[0107] The illustrations in the drawings are for the purpose of exemplifying an example embodiment and are not to scale.

[0108] Before example embodiments are described in detail, some general considerations based on the example embodiments that have been developed will be summarized.

[0109] ​According to one exemplary embodiment, a package is provided having an outer contour defined or delimited by sawing, in particular by mechanical sawing, at least predominantly through the encapsulation material, by punching, in particular of one or more leads, and by encapsulation, in particular by molding. Such a package having punched leads and sawed sides and, assigned to the leads, preferably molded other sides can advantageously be manufactured by a leadframe provided by another exemplary embodiment. Such a leadframe comprises a carrier in the form of a matrix arrangement having leads extending along the longer direction of the generally rectangular leadframe. The formation of the leads arranged horizontally enables encapsulation, in particular molding, in the transverse or vertical direction with the formation of stable encapsulation strips, e.g. molding strips, which can be formed parallel to each other and spaced apart with respect to each other. The typical dimensions of the shorter sides of such a leadframe, e.g. in the range between 50 mm and 150 mm, in particular in the range of 60 mm to 120 mm, are well compatible with the molding technology. Furthermore, it is possible to saw the package singulated in a very fast manner along the longer direction of the leadframe. Thus, multiple parallel and horizontal sawing paths can be used for singulation of the package and for dividing each encapsulation strip into portions corresponding to individual packages. Advantageously, such a manufacturing process flow does not result in a substantial loss of molding material, so that resources can be efficiently utilized. Furthermore, when performing the described formation of the encapsulation strips, in cooperation with the mold, it is possible to omit the molding structures conventionally required in the leadframe, in particular the flow channels and, to a certain extent, also the gate structures. Such a manufacturing process is very fast, in particular when the described mechanical sawing process using a mechanical saw blade can be performed by sawing horizontally through only (or substantially only) the encapsulation material, without sawing through (or only to a very limited extent, e.g. through tiny metal tie bars) the metal material. Furthermore, such a manufacturing process flow also enables testing of the easily manufactured packages still at panel level, i.e. when still forming an integral structure with the leadframe.

[0110] Preferably, the leadframe can be equipped with a clip frame comprising a plurality of clips arranged in both the horizontal and the vertical direction. Preferably, the clips of the clip frame can be arranged such that a 180° twist or rotation of the clip frame does not result in misalignment.

[0111] The embodiments are also compatible with dual gate packages, i.e. packages comprising different portions having different leadframe thicknesses.

[0112] According to one exemplary embodiment, a multi-process block concept for reducing the manufacturing effort of (in particular dual-sided) package platforms is provided. With such embodiments, it becomes possible to obtain full LTI (Lead Tip Inspection) functionality with ultra-high leadframe densities, to provide very simple molding layouts, to enable efficient EMC (Epoxy Molding Compound) usage and to perform panel-level testing. Advantageously, these features can be obtained using existing equipment and can maintain current equipment footprint.

[0113] In summary, the gist of exemplary embodiments is to rotate the carrier of the leadframe by 90° compared to conventional approaches. In particular, the structure can be held in horizontal direction by using tie bars that can be connected with the vertical leadframe strips. Also, it becomes possible to use cavity molding without runners and gates and to only define the leaded side. The molding strips (or more generally, the encapsulation strips) can be formed along the short sides of the leadframe for easy filling. In summary, it is thus possible to form a bar code shaped molding pattern to simultaneously encapsulate electronic components and the carrier along the complete column of the leadframe. Advantageously, a kiss cutting process along the vertical channels or directions is possible. This can enable the formation of LTI features and at the same time can remove the vertical leadframe strips in one common process. Furthermore, it is possible to hold the preform of the package in vertical direction only by the molding material. In particular, panel-level testing can be performed using such processed panels. Moreover, thin dicing (e.g. with a thickness of the dicing lanes of at least 30 pm, preferably 150 pm, most preferably 200 pm to 400 pm, in particular for certain metal contents) and fast dicing (e.g. sawing speeds of up to 1000 mm / s (or even higher effective speeds when deploying multiple spindle designs), but preferably 300 mm / s to 600 mm / s) only in horizontal channels or directions is possible. Advantageously, there is no metal (e.g. copper) within this channel. Furthermore, the dicing can result in very narrow device pitches. In this way, a highly parallel design and processing can be obtained. The sawing can be performed in a particularly fast manner and, for example, only in one direction.

[0114] Such embodiments can provide a significant improvement of the manufacturing process, which can reduce the manufacturing effort and material waste during high volume production of different types of packages (in particular SON, TOLL and DSO packages). This can simultaneously enable avoiding additional effort in more complex manufacturing equipment while maintaining the footprint of the device.

[0115] In particular, exemplary embodiments can provide ultra-high leadframe densities, can bypass conventional bottlenecks of the molding process, can allow panel-level testing and can efficiently use the leadframe area and efficiently singulate the packages. The process flow according to one exemplary embodiment can further allow to enable LTI feature integration.

[0116] Exemplary embodiments can be implemented for DSO, TOLL, and SON packages, for example. Certain packages of these and other types (e.g., TDSON or HSOF packages) typically sacrifice leadframe density to enable efficient singulation. Other packages such as S3O8 packages (e.g., TSDSON type) can provide adequate leadframe density but can require a saw singulation operation process, which is typically slower than a quick die singulation operation process, for example, due to excess copper in the corresponding saw streets.

[0117] Exemplary embodiments can reduce manufacturing effort for a variety of package types, such as SON packages (e.g., TDSON, TSDSON), DSO packages (e.g., DSO), and TOLL packages (e.g., HSOF). First, leadframe design can be improved by exemplary embodiments. Second, molding processes can be simplified. Third, final singulation can be improved.

[0118] With respect to leadframe design, exemplary embodiments can reduce the dead space on the leadframe that is traditionally left for flow channel structures by rotating individual packages 90° within their leadframe superstructure, thereby enabling reduction of package pitch. As a result, manufacturing effort for leadframes can be significantly reduced.

[0119] With respect to molding processes, the formation of an encapsulant strip for cavity molding can make traditional flow channel structures on the leadframe redundant or can eliminate them. In this way, panel size can be more easily increased.

[0120] With respect to package singulation, exemplary embodiments can adapt leadframe design to allow die singulation by die cutting. Singulation along the longer leadframe axis can be designed to allow quick saw singulation, particularly by omitting copper or any other metal in the saw streets completely or to a large extent. In one embodiment, device testing on a panel level prior to final saw singulation is an advantageous option. Furthermore, manufacturing processes can be designed to allow full LTI functionality to be achieved.

[0121] Accordingly, the gist of the exemplary embodiments consists of: (a) a single package is rotated 90° in its leadframe assembly (in particular, unlike conventional approaches), (b) replacing the mold flow structure with a limited space map molding route along the short half-axes of the leadframe can significantly reduce leadframe dead space and molding material waste, and (c) a combination of punch-based and saw-based singulation along the horizontal, lead terminal, and vertical, leadless package sides, respectively. The sawing can also allow creating full LTI features. The result of the manufacturing process according to one exemplary embodiment is a footprint neutral (in particular, double profile) package with punched lead terminals and two slit sides.

[0122] According to another exemplary embodiment, parallelization of the clip mounting process can be achieved. In particular, the above-described manufacturing process flow can be used for the arrangement of a device structure including clips. In such embodiments, the above-described features or advantages (in particular, in terms of cavity molding, sawing sides, punching leads with LTI, etc.) can be combined with (e.g., butterfly-shaped) leadframe designs and clip frame designs. In particular, one or several clip frames can be mounted per leadframe panel. In such embodiments, the lead bars of the clip frames can be located at the same height level as the lead bars of the leadframe. In particular, no protrusions from this surface can be provided, such that a simple and conventional mold design can be achieved. After assembling one or more clip frames, the lead bars of both the leadframe and the clip frame can be punched. In particular, the clip frame can have gate contact terminals that are separated from the source terminals by punching one or more lead bars. Accordingly, exemplary embodiments can achieve an embedded clip frame architecture to reduce manufacturing effort in (in particular, double-sided) package platforms.

[0123] In particular, an embedded clip design can be deployed that (a) avoids manufacturing effort that can occur in conventional leadframe designs and (b) can significantly reduce effort in conventional clip attachment processes. Accordingly, a general process design for high-yield manufacturing of (in particular, double-sided) package platforms can be provided that can significantly reduce effort during package manufacturing. Also, with the described clip frame design, no additional manufacturing equipment is essentially required, and the final package footprint can be maintained.

[0124] According to one exemplary embodiment, a clip frame can be added to such a leadframe that is designed to avoid one lead side of a double-sided package in its initial leadframe upper structure. In addition, one package column can be connected with its identical but mirrored column by a lead bar structure that holds both package columns in a butterfly arrangement in the leadframe.

[0125] In various embodiments, after die attach (i.e., mounting electronic components on the carrier of the leadframe), an embedded clip frame can be attached to the leadframe. Such an embedded clip frame can be in a similar butterfly-shaped upper structure design and can be deposited or placed in the leadframe. Such a clip frame can be punched out of a continuous clip roll and deployed in a multi-part pick-and-place process, at which all individual clip frames needed to load one leadframe can be attached to the leadframe at the same time. Further, the individual clip frames can be bent such that the clip frame and the final lead strips of the leadframe are on the same height level. The clip frame and the leadframe can be connected by a conductive (e.g., solder bed facilitated) plug-in connection to allow for efficient plating.

[0126] Thus, the clip frame can be transferred into the leadframe. Both the clip frame and the leadframe lead strips can be arranged on the same height level. The clip frame and the leadframe can be connected by a conductive plug-in connection. All subsequent manufacturing processes can be similar to the previously described multi-process block concept of a (in particular dual-in-line) package platform.

[0127] The clip frame design according to one exemplary embodiment can allow for depositing conductive solderable pads (e.g., silver pads) on the gate leads via continuous plating. When the gate leads are designed as part of the clip frame, plating can be performed before the clip frame is punched off from its original source roll.

[0128] Thus, one exemplary embodiment relates to a package having punched leadframes, sawed sides and no heterogeneous medium mediated connection between the clip and the leadframe. In other words, such an embodiment can provide for one or more leadframes that form part of the clip, rather than being connected separately from the clip. Advantageously, such a clip frame can be provided with a rotated butterfly design within the leadframe pattern, which can allow for a high clip frame density to be obtained. In particular, the lack of a solder connection between the clip and the leadframe can characterize such a clip structure, wherein the clip itself can have one or more integrally formed leadframes.

[0129] Instead of a butterfly-type clip frame and a leadframe, both frames can be stacked on top of each other to create a multi-layer leadframe structure to be punched through.

[0130] According to yet another exemplary embodiment, an embedded frame can be provided to reduce the manufacturing effort of (in particular TO-type) package platforms. In such an embodiment, a reduced effort multi-process block can be allowed for manufacturing a package, in particular a dual-in-line package. In particular, a modified leadframe handling concept can be introduced into the manufacturing process, which can allow for an effort-saving molding process (in particular by forming an encapsulation strip from the molding) and a combined punching and sawing singulation method to be obtained.

[0131] For example, a dual-in-line package similar to a TO 247 type package can be manufactured by exemplary embodiments as follows:

[0132] With respect to the leadframe, a standard leadframe can form the basis for further manufacturing processes. Prior to molding, a lead length cut via die cutting can be performed, thereby customizing the leadframe.

[0133] For a subsequent molding process, a plurality of package assemblies can be placed in a mold cavity to produce staggered leads. Then, as described above, a strip molding can be performed and a horizontal auxiliary molding strip connecting the plurality of package assemblies can be incorporated. For lead plating, clips of appropriate shape, e.g. crocodile shape, can be connected to the leadframe on opposite sides of the molding strip, thereby enabling electrochemical plating.

[0134] At the end of the manufacturing process, a singulation or individualization process can be performed, e.g. as described above. In particular, a die cut singulation can be performed along the short sides of the leadframe. A singulation along the long leadframe axis can be designed to allow for a fast saw cut singulation, in particular without metal, e.g. copper, in the saw cut. The easily manufacturable package according to such embodiments can have a slightly changed profile or footprint and can result in an asymmetric package (see e.g. Figure 37 ).

[0135] The described manufacturing process according to one exemplary embodiment can keep manufacturing efforts small while enabling highly sophisticated leaded TO packages by increasing leadframe density, reducing molding waste and highly advantageous singulation methods. In particular, a staggered side-by-side arrangement of a fragmented standard dual-in-line leadframe strip can be used in a favorable process combination with highly material saving strip molding and saw cut singulation, thereby resulting in a device with only slightly changed footprint.

[0136] The obtained package according to one exemplary embodiment can have die cut leads, saw cut sides and an asymmetric final package footprint. The reassembled leadframe can be connected by a horizontal auxiliary molding strip. The described manufacturing process can be particularly advantageous for dual-in-line packages.

[0137] Figure 1A A top view of a package 100 according to one exemplary embodiment is shown.

[0138] The illustrated package 100 includes a carrier 102. Electronic components 104 are mounted on the carrier 102. An encapsulant 106 encapsulates the carrier 102 and the electronic components 104. A lead 108 extends from the encapsulant 106 and has a punched surface 130, i.e., a surface formed by punching. Opposite sides 110 of the encapsulant 106 have sawed textures 281, i.e., surface textures formed by sawing (see reference). Figure 5 (To be described in more detail).

[0139] Figure 1B A lead frame 180 according to an exemplary embodiment is shown. The lead frame 180 shown includes a patterned conductive sheet 182. A plurality of carriers 102 are defined within the sheet 182 and arranged in rows 134 (along...). Figure 1B (extending horizontally) and column 136 (along the horizontal direction) Figure 1B (Extending vertically). Leads 108 are assigned to each carrier 102. The sheet 180 has a larger extension scale L along row 134 compared to the smaller extension scale D along column 136. Leads 108 extend along row 134 instead of along column 136.

[0140] Figure 2 The manufacturing process according to an exemplary embodiment is shown as follows. Figure 1A A block diagram of the method of the package 100 shown. See the following reference. Figure 2 The reference numerals mentioned in the description correspond to those based on Figure 1A An embodiment of the package 100.

[0141] As shown in box 210, electronic component 104 can be mounted on carrier 102. Referring to box 220, at least a portion of carrier 102 and at least a portion of electronic component 104 can be encapsulated with encapsulant 106. In box 230, at least one lead 108 extending beyond encapsulant 106 can be punched. Furthermore, referring to box 240, at least a portion of at least one side 110 of encapsulant 106 can be sawn.

[0142] For example, although the two opposite sides 110 of the encapsulation 106 are partially or completely sawn and thus have sawn texture 281, the other two opposite sides of the encapsulation 106 (from which the lead 108 extends) have molded texture, i.e., have the surface characteristics of a molded surface (as shown in the reference). Figure 5 For a more detailed description, see figure 285).

[0143] Figure 3 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0144] According to an exemplary embodiment, the structure shown is obtained by processing a lead frame 180. The lead frame 180 includes a patterned conductive sheet 182, such as a punched or etched copper plate. A plurality of carriers 102 are defined within the sheet 182 in a matrix pattern, each carrier 102 being configured to carry a corresponding electronic component 104. In other words, the carriers 102 are arranged in rows 134 of the lead frame 180 (according to...). Figure 3 (extending horizontally) and column 136 (according to) Figure 3 (Vertically extending) arrangement. As shown, the shorter side 132 of the carrier 102 may extend along the direction of column 136. In the embodiment described herein, a plurality of leads 108 configured to form an external connection structure for an easily manufactured package 100 are assigned to each carrier 102 and form part of a lead frame 180. More specifically, the respective leads 108 can electrically connect a respective electronic component 104 mounted on a respective carrier 102 to the electronic environment of the easily manufactured package 100. The connection between the leads 108 and the electronic component 104 may be formed by conductive connection elements such as clips 252 and / or connecting wires 254.

[0145] like Figure 3 As schematically shown, the lead frame 180 has a larger extension dimension L in the horizontal or main direction compared to a smaller extension dimension D in the vertical or lateral direction. Figure 3 In some embodiments, the length L can be, for example, in the range of 250 mm to 300 mm (e.g., about 250 mm or about 300 mm), while the width D can be, for example, in the range of 60 mm to 100 mm (e.g., about 62 mm, about 70 mm, or about 100 mm). In the easily manufactured package 100, all leads 108 extend along the main direction and along two antiparallel directions. Furthermore, Figure 3 A tiny tie bar 112 is shown, integrally formed with the carrier 102, extending laterally and connecting the carriers 102 of corresponding columns 136 to each other. The tie bar 112 can provide stability to the lead frame 180 in early processing stages, particularly before encapsulation. In other words, each column 136 of the carriers 102 may be provided with a tie bar 112 connecting all the carriers 102 of the corresponding column 136. (Using according to...) Figure 3 The manufacturing process results in a package 100 whose horizontal parallel side 110 is primarily defined by the material of the encapsulant 106 and, to a lesser extent, by the copper material of the tie bar 112 connected to the corresponding carrier 102.

[0146] Similarly, Figure 3As shown, two parallel metal leader tapes 184 form the upper and lower ends of the lead frame 180 and extend in the main direction. The rows 134 of the carriers 102 are arranged in the vertical direction between the upper and lower leader tapes 184. The leader tapes 184 simplify the automated handling and alignment of the lead frame 180 during processing.

[0147] As already mentioned, a respective electronic component 104, for example a semiconductor chip, is mounted on each carrier 102. Thereafter, the carriers 102 and the respective portions of the electronic components 104 mounted on the carriers 102 can be encapsulated by a mold-type encapsulation 106. Thus, parallel arranged and spaced-apart vertically extending encapsulation strips 124 are formed, each made of a molded component material and covering the electronic components 104 of a respective column 136. With a common encapsulation process, a plurality of packages 100 can be efficiently encapsulated. Thus, a plurality of parallel encapsulation strips 124 of the material of the encapsulation 106 can be formed in the manufacturing process, wherein each strip 124 encapsulates all carriers 102 and all electronic components 104 of a respective column 136.

[0148] After surface mounting of the electronic components 104 on the carriers 102 and connecting the electronic components 104 with the carriers 102 by the clips 252 and the connecting wires 254, and after encapsulation, the method comprises plating the exposed portions of the leads 108. Plating the leads 108 with a solder material such as tin enables lead end inspection of the manufactured packages 100 and facilitates connection of the packages 100 to an electronic environment by soldering.

[0149] As a first process to form individual packages 100 from the processed lead frame 180 monolith, the leads 108 of the carriers 102 extending beyond the encapsulation 106 can be cut by die cutting on both lateral sides of each package 100. Die cutting the leads 108 can be achieved by removing a continuous strip of material of the lead frame 180 connecting different carriers 102.

[0150] As a second process during singulation of the individual packages 100, the two opposite horizontal side portions 110 of the encapsulant 106 of each respective package 100 can be defined by mechanical sawing using a rotating saw blade (not shown). Thus, each strip 124 is divided by sawing into a plurality of sections, each section forming a portion of a respective package 100. In this way, encapsulated packages 100 are obtained which are easy to manufacture and have partially exposed leads 108 on two opposite side surfaces, while the two opposite horizontal side surfaces or portions 110 of the encapsulant 106 are free of leads 108 and are defined by sawing. In particular, the described method comprises sawing through the tie bars 112 of a respective column 136 while sawing each encapsulant strip 124 into a plurality of packages 100. By ensuring that the majority of the material sawed is the molding material of the bulk encapsulant strip 124 and only to a small extent the copper material of the tiny tie bars 112, a fast and simple sawing process can be performed.

[0151] Advantageously, a special punching can be performed prior to the horizontal sawing. More specifically, the punching process can be performed along a vertical punching direction 142 and the sawing can be performed along a horizontal sawing direction 144, i.e. perpendicular to the punching direction 142. As Figure 3 illustrated, the sawing can be performed in a sawing direction 144 which is oriented perpendicular to the extension direction of each column 136.

[0152] Optionally, the packages 100 can be subjected to an electronic functional test prior to sawing and after punching. Testing the packages 100 on panel level can greatly simplify the testing process.

[0153] As Figure 3 illustrated, the described manufacturing process flow can be performed in a batch-wise manner, such that the packages 100 can be produced on panel level, i.e. by processing the common leadframe 180 in a highly parallel manner.

[0154] According to Figure 3The manufacturing process flow and the leadframe design provide a space-optimized design without the need for gate and runner areas for encapsulation. Thus, a high-density simply manufacturable package 100 can be obtained. The formation of the molded strip 124 by cavity molding is compatible with the gateless layout concept. Such a manufacturing concept does not involve dead space, thus enabling a more efficient use of the molding compound per device or package 100. Furthermore, no gate removal is required, which further simplifies the manufacturing process. During the manufacturing process, the lead / webbing die cutting can be performed by single-sided die cutting. Thus, no additional lead strip is required. The described plating process allows for the manufacture of LTI (lead tip inspection) features in a simple way. By two-stage die cutting, there is no electrical connection between the leads 108. Furthermore, panel-level marking and testing is enabled. The slitting in one direction does not require segmented cutting. The amount of copper within the slitting lane is very small, if any, enabling fast slitting, in particular at speeds of 100 mm / s or higher. The webbing die cutting is compatible with the formation of LTI features as it is a parallel process. Since the die cutting requires some space on the leadframe 180, the die cutting is used in only one direction. The slitting is a space-saving singulation process, but can be slow if there is too much amount of metal in the slitting lane. Thus, the efficient manufacturing process can remove all major metal components in the slitting lane, for example, by configuring the slitting lane to consist only of the encapsulation material (optionally only except for the tie bars 112 with a small amount of metal). A certain amount of material in the slitting lane can also be removed from above together with the die cutting process to further speed up the sawing process. Referring again to the molded strip 124, the device or preform of the package 100 can be held in place only by the material of the molding compound. Thus, there is no risk of shorting. Testing of the package 100 in the panel or leadframe 180 is also possible.

[0155] Furthermore, the panel or leadframe 180 can be provided without webbing and can be manipulated for plating, marking, and testing. It can be attached on a slitting foil (not shown) or placed on a slitting chuck (not shown) for tapeless slitting. The easily manufactured package 100 or device can have two-sided sawed surface textures (see reference sign 281 in Figure 1A and Figure 5 and two-sided cavity surface textures (see reference sign 285 in Figure 5 The package 100 has die cut leads 108 and sawed sides 110. In one embodiment, the two sawed sides 110 can involve only the molding compound surface without cutting the tie bars 112 that form part of the sawed surface. In another embodiment, the sawed surface at the sides 110 can be formed mainly by the material of the encapsulation 106, with a very small portion involving cutting of the tie bars 112.

[0156] In a manufacturing process performed according to a workflow corresponding to arrow 250, the process can start with providing the above-referenced Figure 1B Starting with a leadframe 180 of the type described, which can here be implemented as a punched or etched copper plate, the individual carriers 102 and tie bars 112 between the opposing indexing strips 184 can be formed as part of the leadframe 180. The manufacturing process can then proceed with die attach, during which electronic components 104, e.g. semiconductor chips, can be attached to respective mounting sections (e.g. die pads) of the carriers 102. The upper main surfaces of such electronic components 104 can be connected to the leads 108 by clips 252, connecting wires 254, etc. After the clip attach and lead connection formation process, encapsulation can be performed by molding, as indicated schematically by reference numeral 256. The molding process can be performed in a simple manner without the need for a gate (which can traditionally be necessary) and with limited effort regarding the gate, thereby forming a plurality of parallelly arranged encapsulant strips 124, which are here implemented as strips of molding compound. After molding and as indicated by reference numeral 258, a plating process for plating exposed surface portions of the leads 108 can then be performed. Accordingly, the leads 108 can be covered with a plating layer 120. Such a plating process can be performed to provide a lead tip inspection (LTI) function. Thereafter and as indicated by reference numeral 260, a punching process can be performed, in which the integrally connected leads 108 of the tie bars 112 and adjacent carriers 102 in the vertical arrangement between the carriers 102 can be separated. At the stage of the manufacturing process indicated by reference numeral 262, the still integrally connected packages 100 can be tested on a panel or leadframe level and can be marked. As indicated by reference numeral 264, the individual packages 100 can be singulated from the previously integrally connected encapsulant strips 124 and connected components by sawing along horizontally arranged sawing lanes 266. Thereafter, a tape and reel process can be performed, see reference numeral 268, and the individual packages 100 can be detached from the tape into bowls. During the process of processing the leadframe 180 in the described manufacturing method, the indexing strips 184 with through-holes 270 can simplify the transport and alignment of the leadframe 180 and the described components.

[0157] In particular, the combination of the design of the leadframe 180, the formation of the encapsulant strips 124 and the combined punching and sawing singulation process has the greatest advantage of simplifying the manufacturing process and manufacturing the packages 100 with less effort and reducing or even minimizing waste cases.

[0158] Figure 4 A top view of a package 100 according to one exemplary embodiment is shown, Figure 5 A side view of the package 100 is shown.

[0159] Figure 4 and Figure 5 The package 100 shown comprises an electrically conductive carrier 102, which is embodied here as a copper portion of a leadframe 180 (e.g. as shown in Figure 3 The carrier 102 is encapsulated by an encapsulant 106, thus not visible in Figure 4 and Figure 5 An electronic component 104 (e.g. a semiconductor die, not shown in Figure 4 and Figure 5 either) is surface mounted on the carrier 102. Moreover, the molded encapsulant 106 encapsulates the carrier 102 and the electronic component 104. As shown, an array of parallel arranged leads 108 extends out of the encapsulant 106 at two opposite side portions of the encapsulant 106. Each of the leads 108 has a punched end face 130. The two remaining side portions 110 of the encapsulant 106 are formed completely by sawing.

[0160] As shown in Figure 4 The leads 108 are arranged at two opposite, shorter sides 132 of the carrier 102. The side portions 110 are defined by sawing and are only bounded by the material of the encapsulant 106, i.e. by the molded compound material with filler particles 284. As can be seen from Figure 5 The encapsulant 106 has inclined side walls 114 at the surfaces defined by molding and the leads 108 extend out of the encapsulant 106 at the side walls 114. The side portions 110 defined by sawing have vertical side walls. At the bottom side of the package 100, the carrier 102 (not shown in Figure 4 and Figure 5 may be exposed from the encapsulant 106.

[0161] Figure 4 and Figure 5 The embodiment of the package 100 shown has leads 108 extending parallel out of the encapsulant 106 at two opposite, inclined side walls 114 of the package 100. In other words, the package 100 is a dual side package. The free ends of the leads 108 are formed by the punched surfaces 130. The surface portions 274 of the encapsulant 106 adjacent to the leads 108 are surfaces defined by the molding process. However, the side portions 110 are defined by sawing, more specifically by mechanical sawing. As Figure 5As shown, the sawing surface 276 of the package 100 has a high roughness, e.g. Ra = 1 pm, and has microscopic waviness 278, as shown by the locally magnified sawing texture 281. Cut filler particles 282 can also be seen at this surface. The inclined side walls 114 have a surface appearance as shown by the locally magnified molding texture 285 due to the inclined side walls 114 being defined by the molding process. Filler particles 284 of the molding compound at the inclined side walls 114 defined by the molding process are coated with molding material (different from the cut filler particles 282) and form a dot or pixel structure on the outer surface of the inclined side walls 114.

[0162] Figure 6 A top view of a structure obtained during execution of a method of manufacturing a package 100 according to one exemplary embodiment is shown. Figure 7 A top view of a structure obtained during execution of a method of manufacturing a package 100 according to another exemplary embodiment is shown.

[0163] Figure 6 and Figure 7 Different tie bars 112 are shown, which connect different carriers 102 and extend vertically or in an inclined manner. With vertically extending tie bars 112, the carriers 102 of individual columns 136 can be connected and stabilized. With inclined tie bars 112, even carriers 102 of adjacent columns 136 can be connected to each other. For singulation, the tie bars 112 can be removed by sawing and / or punching. According to Figure 7 , all tie bars 112 are oriented vertically. According to Figure 6 , some tie bars 112 are oriented vertically, while others are oriented in an inclined manner. Thus, in exemplary embodiments, fine tie bars 112 can be added within the sawing channel at the cost of slightly reduced sawing speed to increase stability. Thus, after lead strip punching, all leads 108 can remain connected. Plating can be applied to create LTI features.

[0164] Figure 8 A cross-sectional view of a preform of a package 100 manufactured according to one exemplary embodiment is shown. As Figure 8 shown, the ratio between the surface area of the exposed tie bar sections 112 at the respective side portions 110 and the entire surface area of the respective side portions 110 is rather small, e.g. less than 10% or preferably less than 3%. By configuring the tie bars 112 to have a thicker portion 113 inside the enclosure 106 and a thinner portion 116 at the side portions 110, it can be advantageous to limit the metal in the sawing channel for high sawing speed. Descriptively, it can be possible to Figure 8A tie-bar 112 is created which is molded. This can increase the sawing speed. Thus, a reduced amount of copper can be located in the sawing channel. A thick saw blade (e.g. with a thickness of 100 to 400 μm, preferably 300 to 400 μm) can be used to further increase the cutting speed.

[0165] Thus, Figure 8 It is illustrated how the amount of copper to be sawn in the cutting channel can be further reduced. For this purpose, the tie-bar 112 can be locally thinned at the place where sawing takes place. By the illustrated design of the tie-bar 112, a fast and simple sawing process can be achieved while achieving a high stability of the carrier 102 in the leadframe 180.

[0166] Figure 9 A top view of a structure obtained during the execution of a method of manufacturing a package 100 according to one exemplary embodiment is shown.

[0167] Figure 9 The embodiment of Fig. 2 shows a pin-side design of the leadframe 180. According to Figure 9 Some tie-bars 112 are arranged vertically for connecting a column 136 of carriers 102. Other tie-bars 112 have horizontally extending tie-bar sections which can be removed by punching before sawing. By taking this measure, the carriers 102 in the leadframe 180 can be realized with a high stability while achieving a fast and simple sawing, since the tie-bars 112 can be partially removed by punching which is performed before sawing.

[0168] Figure 9 The preferred embodiment of Fig. 3 corresponds to a pin-side design, wherein only one tie-bar 112 remains at the singulation. The other tie-bars can be punched after plating.

[0169] Figure 10 A sketch and a partial enlargement of a structure obtained during the manufacturing of a package 100 according to one exemplary embodiment is shown.

[0170] Figure 10 The illustration of a sketch 280 and a partial enlargement 282 with a leadframe 180 in Fig. 2 again shows that all leads 108 extend horizontally along the vertical sides of the carrier 102, while the horizontal sides of the carrier 102 are free of leads 108.

[0171] Figure 11 A top view of a structure obtained during the execution of a method of manufacturing a package 100 according to one exemplary embodiment is shown.

[0172] As Figure 11As shown by arrow 284, strip molding can be performed using a cavity in the shape of a bar. Thus, strips 124 of encapsulants can be formed in parallel and spaced apart without the need for complex runners and without requirements for gates.

[0173] Figure 12 A top view of a structure obtained during execution of a method of manufacturing package 100 is shown according to one exemplary embodiment. This embodiment provides a very simple molding flow design that is capable of handling standard size leadframe designs (60mm to 70mm x 250mm) and also larger panel size leadframes, such as 300mm x 100mm leadframes.

[0174] Figure 12 It is shown that the above architecture can be scaled appropriately in the vertical direction. For example, Figure 11 The configuration shown can have an extension in the horizontal direction of, for example, 300mm, wherein the size in the vertical direction can be, for example, 60mm to 70mm. According to Figure 12 , the size in the vertical direction can be, for example, 100mm, while the extension in the horizontal direction can be, for example, 300mm. Thus, exemplary embodiments can be scaled appropriately to different panel sizes.

[0175] Figure 13 A sketch 280 and a partial enlargement 282 of a structure obtained during manufacturing of package 100 are shown according to one exemplary embodiment.

[0176] Figure 14 A top view of a structure obtained during execution of a method of manufacturing package 100 is shown according to another exemplary embodiment.

[0177] As Figure 13 and Figure 14 shown, exemplary embodiments can be applied to significantly different package types. Figure 13 The embodiment of Figure 14 relates to a HSOF design of the TOLL package platform.

[0178] Figure 15 A top view of a structure obtained during execution of a method of manufacturing package 100 is shown according to yet another exemplary embodiment. This embodiment corresponds to a design in which the tie bars and lead bars are die cut within the molding window.

[0179] Figure 15 A DSO package design is shown using die pads and leads 108 as respective carriers 102. According to Figure 15Encapsulation windows 286 can be formed in the molded encapsulation strip 124. Therefore, these windows 286 can be referred to as molded windows. Within the molded windows 286, the metal tie rod 112 and / or lead wire can be removed by punching, thereby simplifying the subsequent sawing process. After sawing, due to the presence of the previous windows 286, a recess 150 is formed at the edge of the obtained encapsulation 100.

[0180] Figure 16 A top view of a package 100 according to an exemplary embodiment is shown. Figure 17 A side view of the package 100 is shown. Figure 16 and Figure 17 In one embodiment, the encapsulation 106 has two recesses 150, each located in the central portion of a corresponding one of two opposite sides 110. Therefore, each sawn surface can be provided with a corresponding recessed area.

[0181] Therefore, the forming of the molded window 286 and the subsequent punching process of removing the tie bar 112 in the corresponding window 286 can result in the formation of a recess 150 in the side 110 defined by sawing. In other words, according to Figure 16 and Figure 17 The side portion 110 is partially formed by sawing; that is, the outer section of the side portion 110 is formed by sawing. In contrast, the formation of the side portion 110 has a corresponding central section of the recess 150 defined by molding and punching rather than sawing. Regarding Figure 16 and Figure 17 The texture of the sawn surface 276 of the package 100 shown can be referenced. Figure 5 The accompanying figure is labeled 281.

[0182] Figure 18 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to another exemplary embodiment, is shown. Figure 18 A lead frame 180 designed according to a DSO package is shown.

[0183] Figure 19 Different views of the structure obtained during the manufacture of package 100 according to an exemplary embodiment are shown. Figure 19 Enlarged details related to the barcode cavity molding are shown. The molded V-groove 290 in the encapsulation 106 reduces any potential warping issues, which will be described in more detail below.

[0184] In undesirable circumstances, the barcode cavity molding design that produces encapsulation strip 124 may involve warping issues. Figure 19An embodiment is shown that is capable of strongly suppressing any warpage tendency. As shown in the top view and the cross-sectional view of the partially processed leadframe 180, grooves 290 can be formed at the locations where the processed leadframe 180 is to be subsequently singulated into individual packages 100 by sawing. These grooves 290, which are preferably V-shaped, can thus reduce the sawing depth, can simplify the sawing process and can strongly suppress warpage, as Figure 19 is shown schematically on the right side.

[0185] Figure 20 A top view of a structure obtained during the execution of a method of manufacturing a package 100 according to another exemplary embodiment is shown.

[0186] According to an embodiment of Figure 20 the shown leadframe 180 comprises clip frames 138, each clip frame 138 comprising a plurality of integrally formed clips 152 for the carriers 102 and extending in the lateral dimension between two adjacent columns 136 of carriers 102 of the leadframe 118. More particularly, each clip frame 138 comprises a central tie strap 140 extending in the lateral direction and comprises clips 152 on two opposite sides of the central tie strap 140. The shown clip frames 138 can be connected to the carriers 102 (or more precisely to the electronic components 104 mounted on the respective carriers 102) between two adjacent columns 136 of the leadframe 180. The connection of the clip frames 138 to the carriers 102 can be established by a mechanical plug-in mechanism. However, for example, also a conductive paste, e.g. a solder paste, can be provided at the junction between the leadframe 180 and the respective clip frame 138. By connecting the clip frames 138 to the leadframe 180, each clip 152 of the clip frame 138 can be simultaneously connected to a respective one of the electronic components 104 assembled on the carriers 102. After the connection process, the method comprises separating the clip frames 138 into individual clips 152 by a punching process that separates and singulates the individual packages 100. More particularly, the method can comprise separating the clip frames 138 into clips 152 by punching off the tie straps 140 that connect adjacent clips 152 of the respective clip frame 138.

[0187] Highly advantageously, each respective clip 152 can integrally comprise (and thus provide to the respective package 100) a lead 108 (which can thus form an integral part of the respective clip 152). Thus, a direct physical connection exists between the component contact portion of the respective clip 152 and the lead 108. The part of the three-dimensionally curved clip 152 that provides the integral lead 108 can be arranged at the same vertical height as the carrier 102.

[0188] Thus, Figure 20Embodiments of the application provide a parallel clip mounting concept based on the insertion of the electronic clip frame 138 in the leadframe 180. This can allow to establish an electrical connection between the leadframe 180 and the clip frame 138, which also facilitates the creation of LTI plating. The electrical connection can also be provided by wire connections or by conductive glue or by solder connections.

[0189] With regard to Figure 20 Embodiments of the application, reference is made to the detailed description of Figure 3 Embodiments of the application. In the following, differences between the manufacturing concept according to Figure 20 Embodiments of the application and Figure 3 will be explained. According to Figure 20 , a clip frame 138 is provided having an arrangement of multiple clips 152 arranged on both sides of a vertically extending clip tie 140. Thus, on each side of the clip tie 140, a linear arrangement of vertically extending clips 152 is provided. Due to the butterfly configuration of the clip frame 138 according to Figure 20 , the respective clips 102 are formed on the left and right side of the clip tie 140, respectively.

[0190] Although the clip frame 138 according to Figure 20 Embodiments of the application exhibits a certain degree of anisotropy, it can also be provided axisymmetrically with respect to a central axis defined by the clip tie 140. At this time, the handling of the clip frame 138 is particularly failure resistant.

[0191] The clip frame 138 shown can be connected to the leadframe 180 in a manner as shown in Figure 20 such that the respective clips 152 are connected on the upper main surface of the surface mounted electronic component 104 which has been previously mounted on the die pad of the carrier 102. Highly advantageously, the clips 152 of the clip frame 138 already comprise the structure of the later formed leads 108. In other words, clips 152 can be provided having integrally formed leads 108. After molding of the encapsulant strips 124 in the above described manner, the exposed clip tie 140 between adjacent encapsulant strips 124 can be removed by die cutting. Subsequently, the package 100 can be singulated by horizontal sawing.

[0192] Figure 21 A top view of a structure obtained during the execution of a method of manufacturing a package 100 according to one exemplary embodiment is shown.

[0193] Figure 21A leadframe 180 is shown with a clip frame 138 that can be simply inserted into the leadframe 180. The clip frame 138 can be connected manually or automatically by simply establishing a shape closure between the cooperating connection structures 294 of the clip frame 138 and the cooperating connection structures 296 of the leadframe 180. In the shown embodiment, the connection structures 294 can be pins and the connection structures 296 can be corresponding recesses, as shown in the partial enlargement 295. The opposite is also possible.

[0194] Figure 22 A three-dimensional view of a structure obtained during the execution of a method for manufacturing the package 100 is shown according to one exemplary embodiment. Figure 23 A partial enlargement of a structure according to Figure 22 is shown. Figure 22 and Figure 23 relate to the connection of the butterfly clip frame 138 with the leadframe 180.

[0195] An electrical connection required for plating can be established between the clip frame 138 and the leadframe 180. For example, the electrical connection can be made by a solder paste printed on the slots of the leadframe 180. The pins or bars of the clip frame 138 can slide through the solder paste and can smear it down. An additional web can optionally be provided for higher stability and better molding. In a cross section with a single bending direction, a roll-over is possible. In particular, in one embodiment, a strip plating is possible.

[0196] Figure 22 A butterfly arrangement of the clip frame 138 is shown. The actual clips 152 are arranged vertically protruding so as to be attachable to the upper main surface of the electronic component 104. When the clip frame 138 is mounted in the leadframe 180, the lower lead portions of the clips 152 including the integrally formed leads 108 can be arranged at the same vertical height as the carrier 102.

[0197] Figure 24 A three-dimensional view of a clip frame 138 for manufacturing the package 100 is shown according to one exemplary embodiment. Figure 25 A cross-sectional view of a clip frame 138 for a package 100 is shown according to one exemplary embodiment. Figure 26 A top view of a structure obtained during the execution of a method for manufacturing the package 100 is shown according to one exemplary embodiment. According to Figure 26 , the clip frame 138 is assembled to the leadframe 180. Figure 27 A cross-sectional view of a portion of a package 100 created using a clip 152 of a clip frame 138 is shown according to one exemplary embodiment.

[0198] To use the electrically conductive clips 152, no solder and no double copper layer is required in the lead terminal area. To easily, densely and variably in size manufacture the lead frame 180, the lead frame can be manufactured by performing a punching with a corresponding recess. The corresponding clip frame 138 can be used as an insertion portion to be inserted into the corresponding recess of the lead frame 180, thereby obtaining a high-density clip frame manufacturing process flow. The tie bars 112, 140 can be punched (and optionally sawn) for both the lead frame 180 and the clip frame 138, preferably in a common process. The obtained package 100 or device can have a double-sided sawn surface texture, a double-sided mold cavity surface texture and the electric clips 152. In particular, such package 100 or device can have punched leads 108, sawn sides and the electric clips 152.

[0199] The leads 108 of the clip frame 138 can be individualized by punching out the clip tie bar 140. Figures 24 to 26 More details of the described arrangement are shown. In Figure 27 A cross-sectional view of a corresponding package 100 is shown in

[0200] Figure 28 A top view of a structure obtained during performing a method of manufacturing a package 100 is shown according to one exemplary embodiment.

[0201] In particular for manufacturing double-specification packages 100 (e.g. packages 100 comprising a carrier 102 having sections of different thickness), a space-saving staggered design of the leads 108 is advantageous. In particular, an embedded lead frame 180 can be very efficient in terms of space saving. Such concept can advantageously be combined with single lane slitting (preferably slitting in a metal-free manner).

[0202] Figure 28 How a conventional lead frame can be processed to be compatible with the manufacturing process flow is shown according to one exemplary embodiment. The embodiments described below relate to a package 100 having leads 108 extending out of one side portion 110 of the encapsulation 106 only. As shown, a carrier 102 with already manufactured ready leads 108 (i.e. already having free ends) is provided together with a tie bar structure 112. Two Figure 28 The structures shown in the upper part of Figure 28 The structure shown in the lower part of To this end, the connection structure 299 can be removed and one of the obtained two structures is turned 180°. As shown, the electronic components 104 can be mounted on the die pads of the carrier 102 and can be connected by connection wires 254. Thus, a staggered design is obtained which can be manufactured in a space-saving manner. Descriptively, such staggered design has leads 108 which are connected as a staggered finger structure.

[0203] Figure 29 A top view of another structure obtained during execution of a method of manufacturing a package 100 according to one exemplary embodiment is shown. According to the described embodiment, the method can include connecting the leads 108 by the vertical tie bars 112, in particular by forming a mesh structure 156 composed of the leads 108 and the tie bars 112. Thus, Figure 29 Another embodiment of a leadframe or leadframe portion used according to another exemplary embodiment is shown. Figure 29 The configuration has a mesh structure 156 composed of tie bars 112 and leads 108.

[0204] Figure 28 and Figure 29 Both structures shown can be used as a basis for performing the manufacturing process described above with reference to Figure 3 or Figure 20 .

[0205] Figure 30 A top view of a structure obtained during execution of a method of manufacturing a package 100 according to one exemplary embodiment is shown.

[0206] In such an embodiment, the method includes forming and connecting the above-mentioned encapsulation bars 124 by right-angled or vertical auxiliary bars 154 composed of material of the encapsulation 106. Furthermore, the leads 108 can be punched by removing a plurality of discontinuous sections of material of the tie bars 112. Then, singulation by sawing can be performed as described above. As shown, the described method includes arranging the leads 108 in a staggered manner.

[0207] After the length of the punched leads is cut, the multi-package assembly is placed in a mold to produce a staggered leadframe design. After barcoding molding, including the connected top molding bars, plating is performed using a plurality of crocodile-type electrical connections. Thereby, a plating layer 120 can be formed. Singulation can then be performed by punching (for separating the leads 108) and sawing separation (on the top and bottom sides of the obtained package 100).

[0208] Figure 30 Details of one possible manufacturing process are shown. The method according to Figure 28of the bottom view, and can be handled by encapsulation, in particular by molding. By this molding process, the encapsulation strips 124 can be manufactured in the manner as described above. However, a plurality of spaced apart and separated encapsulation strips 124 can be connected to each other by means of horizontally extending auxiliary strips 154, which can be made of the same encapsulation material, in particular can be formed simultaneously with the molding process in which the encapsulation strips 124 are also formed. Thereafter, the exposed portions of the lead 108 can be plated, for example with a solderable material such as tin. Thereafter, the unconnected sections of the tie strap 112 can be removed by die cutting. Further thereafter, the individual molded strips 124 with the encapsulated carrier 102 and electronic components 104 can be singulated by horizontal sawing along the sawing trajectory schematically shown by reference numeral 298 in Figure 30

[0209] Figure 31 A top view of a package 100 is shown, which has an asymmetric design, more specifically, a left-right asymmetric design, according to one exemplary embodiment.

[0210] As a result of the manufacturing process according to Figure 28 and Figure 30 , a package 100 as shown in Figure 31 can be obtained. As shown, and as a result of the described manufacturing process, an asymmetric design of the package 100 on the left and right side of the lower image according to Figure 28 can be obtained. As shown by reference numeral 130 in Figure 31 , now the die cut surface portions of the lead 108 can be positioned on the side surface thereof, instead of the flange surface thereof.

[0211] Further, and as shown by reference numeral 300 in Figure 31 , the package 100 can have mounting recesses, by which they can be connected to an electronic environment, for example can be screwed onto a heat sink or a printed circuit board.

[0212] Figures 32 to 36 A top view of a structure is shown, which is obtained during the execution of a method of manufacturing a package 100 according to one exemplary embodiment.

[0213] With reference to Figure 32 , a standard lead frame is shown, which can be used as a basis for the subsequent manufacturing process. A lead length cut can be performed.

[0214] With reference to Figure 33 , an arrangement of two interleaved lead frames is shown, which is obtained according to Figure 32 , which can then be subjected to transfer molding.

[0215] With reference to Figure 34 ​The transfer strip molding can be performed.

[0216] Referring to Figure 35 , a die-cut surface 130 is formed by die-cutting. The die-cut surface 130 can be a die-cut side surface of the lead 108. As shown, the lead 108 can be locally thickened at the die-cut side surface.

[0217] Referring to Figure 36 , the slitting can then preferably be performed in a copper-free manner.

[0218] Figure 32 A leadframe structure is shown, which can be obtained by lead length cutting from a standard leadframe of the TO247 package type, as described above with reference to Figure 28 . Two such structures as shown in Figure 32 can be interleaved in order to form an interleaved lead 108, as shown in Figure 33 . The structure of Figure 33 can then be subjected to the respective molding procedure as described above. As shown in Figure 34 , a package strip 124 and optionally also an auxiliary strip 154 (compare Figure 30 ) can be formed. By die-cutting, a structure as shown in Figure 35 can be obtained. In such a die-cutting process, the non-continuous or non-continuing portion of the tie-bar 112 is removed and the individual leads 108 of the respective package 100 can be separated from each other. Thereafter and as shown in Figure 36 , the slitting or sawing is advantageously performed only through the material of the molded type package 106. This allows for a high speed and simple sawing.

[0219] Figure 37 A top view of a finished package 100 according to one exemplary embodiment is shown, which is obtained by performing the method of manufacturing a package 100 according to Figures 32 to 36 .

[0220] Figure 37 A package 100 obtained by the described manufacturing process is shown. A slight asymmetry of the package 106 allowing to distinguish between a left side package 100 and a right side package 100 is indicated by reference numeral 302. The package portion corresponding to reference numeral 304 is identical for the left side package 100 and the right side package 100.

[0221] Figure 38 A top view of a structure obtained during the performance of the method of manufacturing a package 100 according to one exemplary embodiment is shown. A standard leadframe which can be used as a starting point for the manufacturing process according to one exemplary embodiment (e.g. by laser welding) can be arranged on a tape and reel 184 having the functionality as described above.

[0222] Figure 32 The structure can be used to create Figure 38 The structure shown (similar to) Figure 33 ).to this end, Figure 32 The two structures shown can be arranged on the lead tape 184 to form the lead frame 180. The connection to the lead tape 184 can be achieved, for example, by laser welding.

[0223] Figure 39 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0224] Instead of using a standard double-track lead frame design as a starting point, an embedded frame can be used where interleaved leads 108 have already been created. This can have the advantage of a particularly space-saving architecture. Figure 39 This alternative lead frame embedding design can also be used according to an exemplary embodiment.

[0225] It should be noted that the term "comprising" does not exclude other elements or features, and "an" or "a" does not exclude multiple or more. Furthermore, elements described in different embodiments may be combined and integrated. It should also be noted that reference numerals should not be construed as limiting the scope of the claims. Moreover, the scope of this application is not limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, measures, methods, and steps described in the specification. Therefore, the appended claims are intended to include such processes, machines, manufactures, compositions of matter, measures, methods, or steps within their scope.

Claims

1. A package (100) comprising: • a carrier (102); • an electronic component (104) located on the carrier (102); • an encapsulant (106) encapsulating at least a portion of the carrier (102) and the electronic component (104); and • at least one lead (108) extending out of the encapsulant (106) and having a free end, the free end being constituted by a die cut surface (130); • wherein at least a portion of at least one side (110) of the encapsulant (106) has a saw cut texture (281); and • wherein the encapsulant (106) has at least one recess (150) in at least one of the at least one side (110) having a saw cut texture (281), the recess containing therein a tie strap (112) connected to the carrier (102), an end face of the tie strap (112) being formed by die cutting.

2. The package (100) of claim 1, wherein, The at least one side (110) is defined by the encapsulant (106) and the tie strap (112).

3. The package (100) according to any one of claims 1 to 2, wherein, The encapsulant (106) has at least one inclined side wall (114) at which the at least one lead (108) extends out of the encapsulant (106).

4. The package (100) according to any one of claims 1 to 2, wherein, The at least one side (110) having a saw cut texture (281) has a vertical side wall.

5. The package (100) according to any one of claims 1 to 2, wherein, The at least one lead (108) is at least partially covered by a plating layer (120).

6. The package (100) according to any one of claims 1 to 2, wherein, At least one other side of the encapsulant (106) has a molded texture (285).

7. The package (100) according to any one of claims 1 to 2, wherein, The package (100) comprises a clip (152, 252) electrically connected to an upper major surface of the electronic component (104).

8. The package (100) of claim 2, wherein, The package (100) comprises at least one of the following features: a ratio between a surface area of the exposed tie strap (112) at the respective side (110) and an entire surface area of the respective side (110) is less than 10%; the tie strap (112) has a thicker portion (113) inside the encapsulant (106) and a thinner portion (116) at the respective side (110).

9. The package (100) of claim 8, wherein, The ratio is less than 5%.

10. The package (100) of claim 8, wherein, The ratio is less than 3%.

11. The package (100) of claim 7, wherein, The clip (152, 252) comprises one of the following features: the clip (152) is integrally formed with the at least one lead (108); the clip (252) electrically connects an upper major surface of the electronic component (104) with the at least one lead (108) forming a portion of the carrier (102).

12. A method of manufacturing a package (100), the method comprising: • mounting an electronic component (104) on a carrier (102); • encapsulating the carrier (102) and at least a portion of the electronic component (104) by an encapsulant (106); • die cutting at least one lead (108) extending out of the encapsulant (106) such that the at least one lead (108) has a free end, the free end being constituted by a die cut surface (130); and • wherein at least a portion of at least one side (110) of the encapsulant (106) has a saw cut texture (281); and • wherein the encapsulant (106) has at least one recess (150) in at least one of the at least one side (110) having a saw cut texture (281), the recess containing therein a tie strap (112) connected to the carrier (102), an end face of the tie strap (112) being formed by die cutting. • sawing at least one portion of at least one side (110) of the encapsulation (106), • wherein the encapsulation (106) has at least one recess (150) in at least one of the at least one side (110) having a sawing texture (281), the recess containing a tie tab (112) connected to the carrier (102), the end face of the tie tab (112) being formed by punching.

13. The method of claim 12, wherein, The method comprises: • mounting further electronic components (104) on a further carrier (102) such that the electronic components (104) and the carrier (102) are arranged in a plurality of rows (134) and columns (136); • encapsulating at least a portion of the further carrier (102) and the further electronic components (104) by a further encapsulation (106); • punching further leads (108) extending out of the further encapsulation (106); • sawing further sides (110) of the further encapsulation (106).

14. The method of claim 13, wherein, The method comprises connecting at least one column (136) of carriers (102) by the tie tabs (112).

15. The method of claim 13 or 14, wherein, The method comprises: • connecting a clip frame (138) to at least a portion of the carriers (102) by insertion, wherein the clip frame (138) comprises a plurality of clips (152) between two adjacent columns (136); • separating the clip frame (138) into clips (152) by sawing and / or punching; • separating the clip frame (138) into clips (152) by punching a central tie tab (140) connecting adjacent clips (152).

16. The method of any one of claims 12 to 14, wherein, The method comprises performing the punching prior to the sawing.

17. The method of any one of claims 12 to 14, wherein, The method comprises performing the sawing along a sawing direction (144) perpendicular to the extension direction of each column (136).

18. The method of any one of claims 12 to 14, wherein, The method comprises testing the package (100) prior to the sawing and after the punching.

19. The method of any one of claims 12 to 14, wherein, The method comprises one of the following features: punching a plurality of leads (108) by removing a continuous strip of material connecting the carriers (102); punching a plurality of leads (108) by removing a plurality of discrete sections of material connecting the carriers (102).

20. The method of any one of claims 12-14, wherein, The method comprises arranging the leads (108) in a staggered manner.

21. A lead frame (180) for a package (100) according to any one of claims 1 to 11, comprising: • a patterned conductive sheet (182); • a plurality of carriers (102) defined within the conductive sheet (182) and arranged in rows (134) and columns (136); and • at least one lead (108) assigned to each carrier (102), wherein the leads (108) extend parallel to a leader tape (184) of the lead frame (180); • wherein the conductive sheet (182) has a larger extension (L) along the rows (134) compared to a smaller extension (D) along the columns (136); • wherein the leads (108) extend along the rows (134).

22. The leadframe (180) of claim 21, wherein the leadframe (180) comprises at least one of the following features: the leadframe (180) comprises at least one tie bar (112) extending along a column (136) and connecting at least one column (136) of carriers (102); the leadframe (180) comprises two of the leader tapes (184) extending along a row (134) and being spaced apart along a column (136) by carriers (102); The leadframe (180) includes at least one clip frame (138) including a plurality of clips (152) for the carrier (102), wherein, the clip (152) extends along a column (136) between two adjacent columns (136), the at least one clip frame (138) comprises a central tie bar (140) extending along the column (136) and comprises the clip (152) on two opposite sides of the central tie bar (140).

23. The leadframe (180) of any of claims 21-22, wherein, the at least one lead (108) has a free end extending perpendicular to the leader tape (184) and being constituted by a die-cut surface (130).

Images