A novel VCSEL array laser

Abstract

The present invention discloses a novel VCSEL array laser, which includes a metal substrate, an insulating heat dissipation plate, a light-transmitting cover plate, an optical lens assembly, and a plurality of VCSEL chips. A plurality of installation areas are provided on the metal substrate, and the installation areas correspond to the VCSEL chips one by one. The VCSEL chips are installed on the corresponding installation areas. The light beams emitted by the VCSEL chips form a parallel light beam that vertically exits from the light-transmitting cover plate after passing through the optical lens assembly. The metal substrate is installed on the insulating heat dissipation plate, the optical lens assembly is installed on the light-transmitting cover plate, the light-transmitting cover plate is installed on the insulating heat dissipation plate, and a sealed installation space is formed between the insulating heat dissipation plate and the light-transmitting cover plate. The novel VCSEL array laser of the present invention can obtain a VCSEL array laser with an increased irradiation area and enhanced irradiation edge power. At the same time, it has the advantages of small size and good heat dissipation effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of VCSEL lasers, and particularly relates to a novel VCSEL array laser. Background Art

[0002] A VCSEL (Vertical-cavity surface-emitting laser) laser, that is, a vertical-cavity surface-emitting laser, combines advantages such as high output power, high conversion efficiency, and high-quality light beams. Compared with LEDs and edge-emitting lasers (EELs), it has all-round advantages in terms of precision, miniaturization, low power consumption, and reliability. In existing VCSEL lasers, increasing the number of VCSEL chips can increase the light beam irradiation area. However, due to the gaps between VCSEL chips, it is difficult to effectively synthesize the laser beams emitted by different VCSEL chips into a complete vertical laser beam, which will affect the detection effect of the laser. At the same time, for the laser beam finally emitted by either a single VCSEL chip or a laser formed by an array of multiple VCSEL chips, due to the scattering effect of media such as air at its edge, the intensity is significantly weakened, resulting in a blurred edge in the final imaging and other detection effects, which affects the use effect of the laser. Summary of the Invention

[0003] To solve the above technical problems, the technical solution adopted by the present invention is: a novel VCSEL array laser, including a metal substrate, an insulating heat dissipation plate, a light-transmitting cover plate, an optical lens assembly, and a plurality of VCSEL chips. A plurality of installation areas are provided on the metal substrate, and the installation areas correspond to the VCSEL chips one by one. The VCSEL chips are installed on the corresponding installation areas. The light beams emitted by the VCSEL chips form a parallel light beam that vertically exits from the light-transmitting cover plate after passing through the optical lens assembly. The metal substrate is installed on the insulating heat dissipation plate, the optical lens assembly is installed on the light-transmitting cover plate, the light-transmitting cover plate is installed on the insulating heat dissipation plate, and a sealed installation space is formed between the insulating heat dissipation plate and the light-transmitting cover plate.

[0004] As a preference of the above technical solution, the installation area includes a main installation area and a plurality of side installation areas surrounding the main installation area. An angle of 30-60 degrees is formed between the side installation areas and the main installation area.

[0005] As a preference of the above technical solution, the optical lens assembly includes an incident surface and an exit surface. The incident surface includes a main incident surface and a plurality of side incident surfaces. The exit surface includes a main exit surface and a plurality of side exit surfaces. The main exit surface corresponds to the main incident surface, and the side exit surfaces correspond to the side incident surfaces one by one. A refractive coating is provided on the side exit surface. The light beam emitted by the VCSEL chip installed on the main installation area vertically enters the main incident surface and then vertically exits from the main exit surface. The light beam emitted by the VCSEL chip installed on the side installation area vertically enters the corresponding side incident surface and then is refracted by the refractive coating on the corresponding side exit surface and is parallel to the light beam emitted by the VCSEL chip on the main installation area. There is an overlapping edge between the light beam emitted by the VCSEL chip on the side installation area after being refracted by the refractive coating and the light beam emitted by the VCSEL chip on the main installation area.

[0006] As a preference of the above technical solution, the number of the side installation areas is 4, and the included angle between the side installation areas and the main installation area is 45 degrees.

[0007] As a preference of the above technical solution, an installation groove is provided on the inner surface of the light-transmitting cover plate. The upper end of the optical lens assembly is installed in the installation groove by UV glue. An external heat dissipation ring is provided on the light-transmitting cover plate. A plurality of through holes are provided around the light-transmitting cover plate. A plurality of installation feet are provided on the upper end of the insulating heat dissipation plate. The installation feet correspond to the through holes one by one. After the installation feet pass through the corresponding through holes, they are welded to the external heat dissipation ring. The external heat dissipation ring and the insulating heat dissipation plate are made of the same material.

[0008] As a preference of the above technical solution, a limiting step is provided on the installation feet, and the light-transmitting cover plate is placed on the limiting step.

[0009] The beneficial effects of the present invention are as follows: The novel VCSEL array laser of the present invention can obtain a VCSEL array laser with an increased irradiation area and enhanced irradiation edge power. At the same time, it has the advantages of small volume and good heat dissipation effect. Description of the Drawings

[0010] Figure 1 is a schematic structural diagram of the present invention;

[0011] Figure 2 is a schematic structural diagram of the present invention from another angle. Detailed Embodiments

[0012] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0013] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0014] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0015] As Figure 1-2 shown, a novel VCSEL array laser includes a metal substrate 1, an insulating heat dissipation plate 2, a light-transmitting cover plate 3, an optical lens assembly 4, and a plurality of VCSEL chips 5. A plurality of installation areas are provided on the metal substrate 1, and the installation areas correspond to the VCSEL chips 5 one by one. The VCSEL chips 5 are mounted on the corresponding installation areas. The light beam 6 emitted by the VCSEL chips 5 forms a parallel light beam 7 that vertically emits from the light-transmitting cover plate 3 after passing through the optical lens assembly 4. The metal substrate 1 is mounted on the insulating heat dissipation plate 2, the optical lens assembly 4 is mounted on the light-transmitting cover plate 3, the light-transmitting cover plate 3 is mounted on the insulating heat dissipation plate 2, and a sealed installation space 8 is formed between the insulating heat dissipation plate 2 and the light-transmitting cover plate 3. The light beams 6 emitted by a plurality of different VCSEL chips 5 form a parallel light beam 7 after passing through the optical lens assembly 4. In this way, the detection area of the VCSEL array laser is larger, there is no gap between the light beams 6 emitted by different VCSEL chips 5, and the detection effect is better.

[0016] Furthermore, the installation area includes a main installation area 9 and a plurality of side installation areas 10 surrounding the main installation area. An angle of 30 - 60 degrees is formed between the side installation areas 10 and the main installation area 9.

[0017] Further, the optical lens assembly 4 includes an incident surface and an exit surface. The incident surface includes a main incident surface 11 and a plurality of side incident surfaces 12. The exit surface includes a main exit surface 13 and a plurality of side exit surfaces 14. The main exit surface 13 corresponds to the main incident surface 11, and the side exit surfaces 14 correspond to the side incident surfaces 12 one by one. A refractive coating 15 is provided on the side exit surface 14. The light beam emitted by the VCSEL chip 5 installed on the main installation area 9 vertically enters the main incident surface 11 and then vertically exits from the main exit surface 13. The light beam emitted by the VCSEL chip 5 installed on the side installation area 10 vertically enters the corresponding side incident surface 12 and then is refracted by the refractive coating 15 on the corresponding side exit surface 14 and is parallel to the light beam emitted by the VCSEL chip 5 on the main installation area 9. There is a coincident edge between the light beam emitted by the VCSEL chip 5 on the side installation area 10 after being refracted by the refractive coating 15 and the light beam emitted by the VCSEL chip 5 on the main installation area 9. This can avoid the situation where the light beams between adjacent VCSEL chips 5 cannot form a complete parallel light beam 7 due to the installation position relationship. The optical lens assembly 4 can also be other structures, for example, an optical lens assembly 4 composed of existing optical elements such as concave lenses and convex lenses, as long as it can combine the light beams 6 emitted by the VCSEL chips 5 on the side installation area 10 and the light beams emitted by the VCSEL chips 5 on the main installation area 9 in a coincident or spliced optical path merging manner.

[0018] Further, the number of the side installation areas 10 is 4, and the included angle between the side installation areas 10 and the main installation area 9 is 45 degrees. Of course, the number of the side installation areas 10 can be 8, 16, etc. The more the number of the side installation areas 10, the more the formed regular polygon detection surface can approximate a circle. Since the edge part of the light beam emitted by the VCSEL chip 5 on the side installation area 10 forms a parallel light beam 7 after refraction, the acting area is reduced, and the power per unit area can be enhanced, so that the edge of the laser has a stronger power than the central position. In this way, during the long-distance detection process, the influence caused by the scattering of media such as air can be reduced.

[0019] Further, an installation groove 16 is provided on the inner surface of the light-transmitting cover plate 3. The upper end of the optical lens assembly 4 is installed in the installation groove 16 through UV glue. An outer heat dissipation ring 17 is provided on the light-transmitting cover plate 3, and a plurality of through holes 18 are provided around the light-transmitting cover plate 3. A plurality of installation feet 19 are provided on the upper end of the insulating heat dissipation plate 2, and the installation feet 19 correspond to the through holes 18 one by one. The installation feet 19 pass through the corresponding through holes 18 and are welded to the outer heat dissipation ring 17. The outer heat dissipation ring 17 and the insulating heat dissipation plate 2 are made of the same material. This can form effective heat dissipation both in front of and behind the VCSEL array laser, and ensure the heat dissipation effect of the laser in the case of multiple VCSEL chips 5.

[0020] Further, a limiting step 20 is provided on the mounting foot 19, and the light-transmitting cover plate 3 is placed on the limiting step 20. The insulating heat dissipation plate 2 not only plays the role of insulating heat dissipation, but also plays the role of supporting the light-transmitting cover plate 3 and the optical lens assembly 4 of the housing. Compared with the single-sided heat dissipation in the laser that conventionally arranges the VCSEL chips 5 on the same plane, the VCSEL array laser of the present application dissipates heat in a three-dimensional space, and the volume of the entire laser is smaller and the internal structure is more compact.

[0021] Except for the above mounting structure, other structures of the laser can adopt the conventional designs in the art.

[0022] It is worth mentioning that the technical features such as the VCSEL chips 5 involved in this invention patent application should be regarded as the prior art. The specific structures, working principles, and possible control methods and spatial arrangement methods of these technical features can adopt the conventional selections in the art, and should not be regarded as the inventive points of this invention patent. This invention patent will not be further specifically elaborated.

[0023] The preferred specific embodiments of the present invention have been described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and variations according to the concept of the present invention without creative labor. Therefore, all technical solutions that can be obtained by those skilled in the art in the technical field based on the concept of the present invention through logical analysis, reasoning, or limited experiments on the basis of the prior art should be within the protection scope determined by the claims.

Claims

1. A VCSEL array laser, characterized in that, It includes a metal substrate, an insulating heat dissipation plate, a light-transmitting cover plate, an optical lens assembly, and several VCSEL chips. Several installation areas are provided on the metal substrate, and the installation areas correspond to the VCSEL chips one by one. The VCSEL chips are installed on the corresponding installation areas. The light beams emitted by the VCSEL chips form a parallel light beam that vertically exits from the light-transmitting cover plate after passing through the optical lens assembly. The metal substrate is installed on the insulating heat dissipation plate, the optical lens assembly is installed on the light-transmitting cover plate, the light-transmitting cover plate is installed on the insulating heat dissipation plate, and a sealed installation space is formed between the insulating heat dissipation plate and the light-transmitting cover plate. The installation area includes a main installation area and several side installation areas surrounding the main installation area. The optical lens assembly includes an incident surface and an exit surface. The incident surface includes a main incident surface and several side incident surfaces. The exit surface includes a main exit surface and several side exit surfaces. The main exit surface corresponds to the main incident surface, and the side exit surfaces correspond to the side incident surfaces one by one. A refractive coating is provided on the side exit surfaces. The light beams emitted by the VCSEL chips installed on the main installation area vertically enter the main incident surface and then vertically exit from the main exit surface. The light beams emitted by the VCSEL chips installed on the side installation areas vertically enter the corresponding side incident surfaces and then are refracted by the refractive coatings on the corresponding side exit surfaces to be parallel to the light beams emitted by the VCSEL chips on the main installation area. There is an overlapping edge between the light beams emitted by the VCSEL chips on the side installation areas after being refracted by the refractive coatings and the light beams emitted by the VCSEL chips on the main installation area.

2. The VCSEL array laser according to claim 1, characterized in that, The number of the side installation areas is 4.

3. The VCSEL array laser according to claim 2, characterized in that, An installation groove is provided on the inner surface of the light-transmitting cover plate. The upper end of the optical lens assembly is installed in the installation groove through UV glue. An external heat dissipation ring is provided on the light-transmitting cover plate. Several through holes are provided around the light-transmitting cover plate. Several installation feet are provided on the upper end of the insulating heat dissipation plate, and the installation feet correspond to the through holes one by one. The installation feet pass through the corresponding through holes and are welded to the external heat dissipation ring. The external heat dissipation ring and the insulating heat dissipation plate are made of the same material.

4. The VCSEL array laser according to claim 3, characterized in that, A limiting step is provided on the installation feet, and the light-transmitting cover plate is placed on the limiting step.

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