Intelligent power module and preparation method thereof

Abstract

The present invention relates to an intelligent power module and a preparation method thereof. By sequentially arranging a first insulating layer and a circuit layer on a circuit substrate, the first ends of a plurality of pins are electrically connected to the circuit layer, and the first ends of an electrical connection wire group are electrically connected to the circuit layer; the circuit substrate, the electrical connection wire group and the circuit layer are wrapped by a sealing body, and the second ends of the respective pins are led out from the first side surface of the sealing body; a chip installation area is arranged on the second side surface of the sealing body, the chip installation area is provided with a plurality of electrical connectors, and the respective electrical connectors are correspondingly connected to the respective pins of the MCU chip; the respective electrical connectors are respectively connected to the second ends of the electrical connection wire group, so that the MCU chip is integrated outside the intelligent power module, the signal transmission distance is shortened, the anti-interference ability and the integration degree of the system are improved, the wiring is flexible, and the product volume is small; when the MCU fails, the failure can be eliminated by replacing the MCU chip, the maintenance cost is reduced, and the product reliability is improved.

Description

Technical Field

[0001] The present invention relates to an intelligent power module and a preparation method thereof, belonging to the technical field of power semiconductor devices. Background Art

[0002] An intelligent power module, i.e., IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technologies. The intelligent power module integrates power switching devices and high-voltage drive circuits, and internally contains fault detection circuits such as overvoltage, overcurrent, and overheating. On the one hand, the intelligent power module can receive control signals from the MCU (Microcontroller Unit) and drive the subsequent circuit to work. On the other hand, it sends the system status detection signals back to the MCU. The intelligent power module is composed of high-speed and low-power-consuming die, optimized gate-level drive circuits, and fast protection circuits. Even in the event of a load accident or improper use, the IPM itself can be protected from damage. IPM generally uses IGBT as a power switching element and has an integrated structure of current sensors and drive circuits. Facing the market competition of miniaturization and low cost, higher requirements are put forward for the high integration and high heat dissipation technologies of IPM intelligent power modules.

[0003] In the implementation process, the inventors found that there are at least the following problems in the traditional technology: for the existing intelligent power module with the MCU integrated inside the module, when the MCU fails, the entire intelligent power module will also be scrapped. In particular, when the MCU is integrated into the intelligent power module, the MCU needs to be secondarily packaged, which affects the reliability. In addition, for the existing intelligent power module with the MCU separated outside the module, the signal transmission distance is long, resulting in poor anti-interference ability of the entire system, low integration level, complex wiring, and high cost. Summary of the Invention

[0004] Based on this, in view of the problems in the traditional design and preparation process of intelligent power modules, for the intelligent power module with the MCU integrated inside the module, when the MCU fails, the entire intelligent power module will also be scrapped, and the product reliability is low; for the existing intelligent power module with the MCU separated outside the module, the signal transmission distance is long, resulting in poor anti-interference ability of the entire system, low integration level, complex wiring, and high cost. It is necessary to provide an intelligent power module and a preparation method thereof.

[0005] Specifically, the present invention discloses an intelligent power module, including:

[0006] A circuit board, on which a first insulating layer is provided;

[0007] A circuit layer, which is disposed on the first insulating layer;

[0008] Multiple pins, the first ends of the multiple pins are electrically connected to the circuit layer respectively;

[0009] An electrical connection wire group, the first end of the electrical connection wire group is electrically connected to the circuit layer;

[0010] A sealing body, the sealing body wraps the circuit board and the circuit layer to which the electrical connection wire group and each pin are connected;

[0011] Wherein, the second ends of the respective pins are led out from the first side surface of the sealing body respectively; a chip installation area for installing an MCU chip is provided on the second side surface of the sealing body, and a plurality of electrical connection members are provided in the chip installation area, and each electrical connection member is used for corresponding connection with each pin of the MCU chip one by one; each electrical connection member is electrically connected to the second end of the electrical connection wire group respectively.

[0012] Optionally, the electrical connection wire group includes a flexible cable layer, a second insulating layer and a thin film layer; the second insulating layer covers the flexible cable layer, the thin film layer covers the second insulating layer, and the first end of the flexible cable layer is led out from the second insulating layer and the thin film layer in sequence and then connected to the circuit layer, and the second end of the flexible cable layer is led out from the second insulating layer and the thin film layer in sequence and then connected to the corresponding electrical connection member.

[0013] Optionally, the chip installation area is a groove structure, and the depth of the chip installation area is equal to the height of the MCU chip.

[0014] Optionally, the circuit board is disposed on the third side surface of the sealing body corresponding to the second side surface, and the chip installation area is parallel to the circuit board; the electrical connection wire group is bent and disposed between the circuit layer and the chip installation area.

[0015] Optionally, the circuit layer includes a circuit wiring layer and circuit components disposed on the circuit wiring layer; the circuit wiring layer is disposed on the first insulating layer.

[0016] Optionally, the circuit layer includes a compressor control module and / or a fan control module; the compressor control module includes corresponding circuit wiring and circuit components in the circuit wiring layer; the fan control module includes corresponding circuit wiring and corresponding circuit components in the circuit wiring layer.

[0017] Optionally, the circuit layer further includes a PFC circuit and / or a rectifier circuit; the PFC circuit includes corresponding circuit wiring and circuit components in the circuit wiring layer; the rectifier circuit includes corresponding circuit wiring and corresponding circuit components in the circuit wiring layer.

[0018] Optionally, the compressor control module includes a compressor control circuit and a compressor inverter circuit; the fan control module includes a fan control circuit and a fan inverter circuit.

[0019] The present invention also discloses a preparation method of the intelligent power module according to the above, including the following steps:

[0020] Provide a circuit board;

[0021] Prepare an insulating layer on the circuit board;

[0022] Prepare a circuit layer on the insulating layer;

[0023] Arrange an electrical connection wire group and a plurality of pins on the circuit layer, and the first end of the electrical connection wire group is electrically connected to the circuit layer, and the first ends of the plurality of pins are respectively connected to the circuit layer through metal wires;

[0024] Bend the electrical connection wire group, and respectively connect each electrical connection part at the second end of the electrical connection wire group, so that each electrical connection part is located directly above the circuit layer;

[0025] Inject the circuit board provided with the circuit layer, the plurality of pins, and the electrical connection wire group through a packaging mold to form a sealed body, and each electrical connection part connecting the second end of the electrical connection wire group exposes from the second side surface of the sealed body; wherein, a chip installation area for installing an MCU chip is provided on the second side surface of the sealed body, and each electrical connection part is located in the chip installation area;

[0026] Place the MCU chip in the chip installation area, and weld each pin of the MCU chip to each electrical connection part one by one to form an intelligent power module.

[0027] Optionally, the preparation steps of the electrical connection wire group include:

[0028] Provide a metal sheet;

[0029] Prepare a flexible cable layer on the metal sheet;

[0030] Cover a second insulating layer on the flexible cable layer;

[0031] Cover a thin film layer on the second insulating layer; wherein, the first end of the flexible cable layer is led out from the second insulating layer and the thin film layer in sequence and then connected to the circuit layer, and the second end of the flexible cable layer is led out from the second insulating layer and the thin film layer in sequence and then connected to the corresponding electrical connection part.

[0032] One of the above technical solutions has the following advantages and beneficial effects:

[0033] In each of the above-described embodiments of the intelligent power module, by providing a first insulating layer on the circuit board, the circuit layer is disposed on the first insulating layer, the first ends of the plurality of pins are electrically connected to the circuit layer respectively, and the first end of the electrical connection line group is electrically connected to the circuit layer; the circuit board and the circuit layer connected with the electrical connection line group and each pin are wrapped by the sealing body, and the second ends of the respective pins are led out from the first side surface of the sealing body; a chip installation area for installing the MCU chip is provided on the second side surface of the sealing body, and a plurality of electrical connectors are provided in the chip installation area, and each electrical connector is connected to each pin of the MCU chip in one-to-one correspondence; each electrical connector is electrically connected to the second end of the electrical connection line group respectively, so as to integrate the MCU chip outside the intelligent power module (the second side surface), shorten the signal transmission distance, improve the anti-interference ability of the whole system, miniaturize the electronic control, further improve the integration degree of the intelligent power module, and make the wiring more flexible, and further reduce the product volume; in addition, when the intelligent power module fails, the MCU chip integrated outside the module can be taken out separately, improving the utilization rate of components, and at the same time facilitating failure analysis; when the MCU chip fails, the fault can be eliminated by replacing the MCU chip, reducing the maintenance cost and improving the product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is an external view of a conventional intelligent power module;

[0035] Figure 2 is a schematic diagram of a first semi-finished product of the intelligent power module according to an embodiment of the present invention;

[0036] Figure 3 is Figure 2 a cross-sectional view taken along the X-X' direction;

[0037] Figure 4 is a schematic diagram of a second semi-finished product of the intelligent power module according to an embodiment of the present invention;

[0038] Figure 5 is a schematic diagram of an internal finished product of the intelligent power module according to an embodiment of the present invention;

[0039] Figure 6 is a schematic diagram of the external structure of the intelligent power module according to an embodiment of the present invention without the MCU chip assembled;

[0040] Figure 7 is a schematic diagram of the external structure of the intelligent power module according to an embodiment of the present invention with the MCU chip assembled;

[0041] Figure 8 is a flowchart of the preparation steps of the intelligent power module according to an embodiment of the present invention;

[0042] Figure 9Flow chart of the preparation steps of the electrical connection wire group of the intelligent power module according to the embodiment of the present invention.

[0043] Reference numerals:

[0044] Intelligent power module 10, circuit board 100, first insulating layer 200, circuit layer 300, press control circuit 310, press inverter circuit 320, fan control circuit 330, fan inverter circuit 340, PFC circuit 350, rectifier circuit 360, pins 400, electrical connection wire group 500, sealing body 600, chip mounting area 610, electrical connection member 700, thin film layer 800, MCU chip 900. Detailed implementation manners

[0045] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0046] It should be noted that, without conflict in structure or function, the embodiments in the present invention and the features in the embodiments may be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0047] In traditional intelligent power modules, such as Figure 1 shown, it includes an MCU chip, pins and a package body, and the MCU chip is encapsulated inside the package body. When the MCU chip fails, since the MCU chip is inside the package body, it is difficult to disassemble. Even if it is forcibly disassembled, the entire intelligent power module will be damaged, resulting in the scrapping of the entire intelligent power module, increasing the maintenance cost and wasting resources; in addition, when integrating the MCU chip into the intelligent power module, the MCU chip needs to be secondarily encapsulated, which affects the product reliability, and the wiring is complex and the cost is high. For traditional intelligent power modules without integrated MCU chips, the signal transmission distance between the intelligent power module and the MCU chip is relatively long, resulting in poor anti-interference ability of the entire system and low integration level.

[0048] In order to overcome the problems existing in the above traditional intelligent power modules, in one embodiment, as Figure 2-7As shown in the figure, the present invention provides an intelligent power module 10, which includes a circuit substrate 100, a circuit layer 300, a plurality of pins 400, an electrical connection wire group 500, and a sealing body 600; a first insulating layer 200 is provided on the circuit substrate 100; the circuit layer 300 is disposed on the first insulating layer 200; the first ends of the plurality of pins 400 are electrically connected to the circuit layer 300 respectively; the first end of the electrical connection wire group 500 is electrically connected to the circuit layer 300; the sealing body 600 wraps the circuit substrate 100 and the circuit layer 300 to which the electrical connection wire group 500 and each pin 400 are connected; wherein, the second ends of each pin 400 are respectively led out from the first side surface of the sealing body 600; a chip installation area 610 for installing an MCU chip 900 is provided on the second side surface of the sealing body 600, and a plurality of electrical connectors 700 are provided in the chip installation area 610, and each electrical connector 700 is used to be correspondingly connected to each pin 400 of the MCU chip 900 one by one; each electrical connector 700 is electrically connected to the second end of the electrical connection wire group 500 respectively.

[0049] Among them, the circuit substrate 100 can be used to carry the circuits and corresponding components of the entire intelligent power module 10. The circuit substrate 100 can be made of a metal material, such as a rectangular plate made of aluminum of materials such as 1100 and 5052, and its thickness is much thicker than that of other layers, generally 0.8 mm to 2 mm, and the commonly used thickness is 1.5 mm, mainly for heat conduction and heat dissipation. For another example, the circuit substrate 100 can also be made of other metal materials with good thermal conductivity. For example, it can be a rectangular plate made of copper. It should be noted that the shape of the circuit substrate 100 in this application is not limited to a rectangular shape, and can also be a circular or trapezoidal shape, etc.

[0050] The first insulating layer 200 can be used to prevent the circuit layer 300 from conducting electricity with the circuit substrate 100. The first insulating layer 200 is disposed on the surface of the circuit substrate 100, and its thickness is relatively thin compared to the circuit substrate 100, generally 50 um to 150 um, and the commonly used one is 110 um. The circuit layer 300 is disposed on the first insulating layer 200, so that the circuit layer 300 is insulated from the circuit substrate 100. Internal circuits such as power switching devices, high-voltage drive circuits, and fault detection circuits are provided on the circuit layer 300. The power switching devices, high-voltage drive circuits, and fault detection circuits are electrically connected by metal wires.

[0051] Among them, the pin 400 can be used to transmit signals to the corresponding internal circuits on the circuit layer 300, and can also be used to transmit the signals output by the corresponding internal circuits on the circuit layer 300 to an external module. Multiple pins 400 can be divided into several low-voltage pins 400 and several high-voltage pins 400 according to the different voltage strengths of the transmitted signals. The low-voltage pin 400 refers to the pin 400 terminal for transmitting low-voltage logic control signals. Multiple low-voltage pins 400 are arranged at least on one side edge of the circuit board 100, and the low-voltage pins 400 are electrically connected to the circuit layer 300 on the circuit board 100; multiple low-voltage pins 400 are soldered to the pads of the circuit layer 300 on the circuit board 100 by soldering such as solder paste soldering, so as to realize the electrical connection with the circuit layer 300 on the circuit board 100. For example, the low-voltage pin 400 can be electrically connected to the fault detection circuit on the circuit layer 300; further, the low-voltage pin 400 can be electrically connected to the fault detection circuit on the circuit layer 300 through a metal wire, where the metal wire can be a copper wire. The high-voltage pin 400 refers to the pin 400 terminal for transmitting high-voltage power output signals. Multiple high-voltage pins 400 are arranged at least on one side edge of the circuit board 100, and the high-voltage pins 400 are electrically connected to the circuit layer 300 on the circuit board 100; multiple high-voltage pins 400 are soldered to the pads of the circuit layer 300 on the circuit board 100 by soldering such as solder paste soldering, so as to realize the electrical connection with the circuit layer 300 on the circuit board 100. For example, the high-voltage pin 400 can be electrically connected to the power switch device and the high-voltage drive circuit on the circuit layer 300 respectively; further, the high-voltage pin 400 can be electrically connected to the power switch device and the high-voltage drive circuit on the circuit layer 300 through metal wires respectively, where the metal wires can be copper wires.

[0052] The first end of the electrical connection line group 500 is used for electrically connecting with the corresponding circuit elements on the circuit layer 300, and the second end of the electrical connection assembly is used for electrically connecting with each electrical connection member 700. Each electrical connection member 700 is connected to each pin 400 of the MCU chip 900 in a one-to-one correspondence. That is, through the electrical connection line group 500 and the electrical connection members 700, a connection relationship is established between the MCU chip 900 and the corresponding circuit elements on the circuit layer 300. The electrical connection line group 500 can be a thin film circuit assembly; further, the electrical connection line group 500 is a bendable thin film circuit assembly. By providing a chip installation area 610 on the second side of the sealing body, by arranging each electrical connection member 700 in the chip installation area 610 on the second side of the sealing body, and by bending the electrical connection line group 500 and arranging it between the circuit layer 300 and the second side of the sealing body 600, after the MCU chip 900 is welded in the chip installation area 610, the electrical connection between the MCU chip 900 and the circuit layer 300 can be realized. Among them, the MCU (microcontroller) chip is a micro control unit, also known as a single-chip microcomputer or a microcontroller. It is a chip-level computer and is used for different combination controls in different application scenarios. It has a fast speed and the program can be encrypted, but its processing power is limited and it is suitable for use in control fields where high integration, size, power consumption, etc. are restricted.

[0053] Each electrical connection member 700 can be used as a welding position for the MCU chip 900, that is, a pad for welding with the MCU chip 900. In one example, each electrical connection member 700 can be arranged on a substrate, and a thin film layer 800 is covered on the substrate, and each electrical connection member 700 exposes the thin film layer 800, thereby preventing accidental short circuits between the electrical connection members 700 due to external environmental pollution, preventing oxidation of the electrical connection members 700, and preventing surface damage to the electrical connection members 700. Among them, the thin film layer 800 is an insulating material. It can be a paste or liquid material, and an insulating dielectric layer is formed on the surface of the substrate provided with each electrical connection member 700 through processes such as spraying or coating, and then a thin film is formed by drying; the thin film layer 800 can also be a thin film-shaped insulating material. By coating an adhesive on the surface of the substrate and air-drying or heating and drying naturally, this thin film-shaped insulating material is adhered, which plays a series of protective roles for each electrical connection member 700.

[0054] The material of the pin 400 can be C194(-1 / 2H) sheet (chemical composition: Cu(≧97.0), Fe: 2.4, P: 0.03, Zn: 0.12) or KFC(-1 / 2H) sheet (chemical composition: Cu(≧99.6), Fe: 0.1(0.05 - 0.15), P: 0.03(0.025 - 0.04)). The 0.5mm C194 or KFC sheet is processed by stamping or etching processes, and then nickel is plated on the surface with a thickness of 0.1 - 0.5um first, and then tin is plated with a thickness of 2 - 5um. The redundant connecting ribs of the pin 400 are cut off and formed into the required shape by a specific device.

[0055] It should be noted that after each pin 400 passes through the first side of the sealing body 600, each pin 400 is bent through a bending process to obtain a first bent end, and then the end of the first bent end is bent to obtain a second bent end. The first bent end can be parallel to the circuit board 100.

[0056] The sealing body 600 can be used to encapsulate the circuit board 100 that is electrically connected with multiple pins 400 and an electrical connection wire group 500, so that the circuit board 100, as well as the circuit layer 300 connected with each pin 400 and the electrical connection wire group 500, are wrapped inside the sealing body 600, playing a role in protecting the internal circuits and insulating against voltage. During the preparation process of the sealing body 600, the circuit board 100 that is electrically connected with multiple pins 400 and an electrical connection wire group 500 can be encapsulated inside the sealing body 600 by an encapsulation process using an encapsulation mold. The material of the sealing body 600 can be a thermosetting polymer, such as epoxy resin, phenolic resin, silica gel, amino, unsaturated resin; in order to improve the heat dissipation ability, the sealing body 600 can be a composite material containing powders or fibers such as metals, ceramics, silicon oxide, graphene, etc. In one example, the material used for the sealing body 600 can be a molding compound mixed with a matrix resin of epoxy resin, a curing agent of high-performance phenolic resin, silicon micropowder, etc. as fillers, and various additives.

[0057] According to different design requirements, plastic encapsulation molds with different shapes can be designed, and then a sealed body 600 with different shape structures can be obtained by plastic encapsulation. For example, the sealed body 600 can be a cuboid structure. By using the injection molding method of thermoplastic resin or the transfer molding method of thermosetting resin, the circuit board 100 and the circuit layer 300 connected with the electrical connection wire group 500 and each pin 400 are wrapped to play a protective role, and each electrical connector 700 is exposed in the chip installation area 610. Then, the corresponding pins 400 welded to the MCU chip 900 are welded to the corresponding electrical connectors 700, so as to realize the integration of the MCU chip 900 in the chip installation area 610 on the second side of the sealed body 600, and the electrical connection between the MCU chip 900 and the circuit layer 300 can be realized.

[0058] Furthermore, a plastic encapsulation mold can be designed to make the surface of the sealed body 600 have a chip installation area 610. During the preparation process, the first ends of each pin 400 are electrically connected to the circuit layer 300 respectively, the first end of the electrical connection wire group 500 is electrically connected to the circuit layer 300, and the second end of the electrical connection wire group 500 is connected to each electrical connector 700; then the electrical connection wire group 500 is bent so that each electrical connector 700 is located directly above the circuit layer 300, and through the plastic encapsulation process, the circuit board 100 electrically connected with multiple pins 400 and the electrical connection wire group 500 is plastic encapsulated in the sealed body 600 by using the pre-designed plastic encapsulation mold, and at the same time, each electrical connector 700 is exposed in the chip installation area 610. Furthermore, the MCU chip 900 can be welded to each electrical connector 700 to realize the integration of the MCU chip 900 on the outside (second side) of the intelligent power module 10.

[0059] In the above embodiments, by integrating the MCU chip 900 on the outside (second side) of the sealed body 600, the signal transmission distance is shortened, the anti-interference ability of the whole system is improved, the electric control is miniaturized, the integration degree of the intelligent power module 10 is further improved, the wiring is more flexible, and the product volume is further reduced; in addition, when the intelligent power module 10 fails, the MCU chip 900 integrated outside the module can be taken out separately, which improves the utilization rate of components and is convenient for failure analysis; when the MCU chip 900 fails, the failure can be eliminated by replacing the MCU chip 900, which reduces the maintenance cost and improves the product reliability.

[0060] In some embodiments of the present invention, such as Figure 3In it, the electrical connection wire group 500 includes a flexible cable layer, a second insulating layer, and a thin film layer 800; the second insulating layer covers the flexible cable layer, the thin film layer 800 covers the second insulating layer, and the first end of the flexible cable layer is led out from the second insulating layer and the thin film layer 800 in sequence and then connected to the circuit layer 300, and the second end of the flexible cable layer is led out from the second insulating layer and the thin film layer 800 in sequence and then connected to the corresponding electrical connection member 700.

[0061] Among them, the flexible cable layer may include a plurality of arranged metal wires. The manufacturing process of the flexible cable layer can be: processing the metal sheet through stamping or etching processes, and then a flexible cable layer with a plurality of metal wire patterns can be obtained. The second insulating layer can be used to insulate each metal wire on the flexible cable layer. The second insulating layer is disposed on the surface of the flexible cable layer, and its thickness is relatively thin compared to the flexible cable layer. For example, the thickness of the second insulating layer can be the same as the thickness of the first insulating layer 200. The thin film layer 800 can be used to prevent accidental short circuits between the metal wires on the flexible cable layer due to external environmental pollution, prevent oxidation of the metal wires on the flexible cable layer, and prevent surface damage to the metal wires on the flexible cable layer. When bending and folding, it increases the strength of the flexible cable layer, enabling the flexible cable layer to be bent by a preset radian, so that the electrical connection members 700 connecting the second end of the flexible cable layer can be located directly above the circuit layer 300, and enabling each electrical connection member 700 to expose the chip installation area 610. Further, the thin film layer 800 is an insulating material. It can be a paste or liquid that forms an insulating dielectric layer on the surface of the flexible cable layer through processes such as spraying or coating, and then forms a thin film through drying, and the thin film has a certain toughness and can be bent and folded; or a thin film-shaped insulating material is adhered to the surface of the flexible cable layer by applying an adhesive layer on the surface of the flexible cable layer and drying naturally or by heating, playing a series of protective roles for the flexible cable layer.

[0062] Further, after the flexible cable layer is prepared, the second insulating layer is covered on the flexible cable layer, and the thin film layer 800 is covered on the second insulating layer, so that the metal wires on the flexible cable layer are insulated from each other and the bending and folding strength of the flexible cable layer is enhanced. Then the first end of the flexible cable layer is led out from the second insulating layer and the thin film layer 800 in sequence and then connected to the circuit layer 300, and the second end of the flexible cable layer is led out from the second insulating layer and the thin film layer 800 in sequence and then connected to the corresponding electrical connection member 700; the flexible cable layer covered with the second insulating layer and the thin film layer 800 is bent so that each electrical connection member 700 is located directly above the circuit layer 300, and the bent flexible cable layer is fixed by a corresponding carrier and placed in a plastic encapsulation mold for encapsulation. Further, each electrical connection member 700 can expose the chip installation area 610. After the MCU chip 900 is installed in the chip installation area 610, the MCU chip 900 can be integrated on the outside (the second side) of the sealed body 600.

[0063] It should be noted that the preparation process of the electrical connection line group 500 can also be as follows: First, the first end of the flexible cable layer can be electrically connected to the corresponding components on the circuit layer 300, and the second end of the flexible cable layer is electrically connected to each electrical connector 700. Then, the flexible cable layer is successively covered with a second insulating layer and a thin film layer 800. Then, the flexible cable layer covered with the second insulating layer and the thin film layer 800 is bent, and each electrical connector 700 is fixed directly above the circuit layer 300. Finally, encapsulation is performed through a plastic encapsulation mold, so that each electrical connector 700 is exposed in the chip installation area 610.

[0064] In some embodiments of the present invention, the chip installation area 610 is a groove structure, and the depth of the chip installation area 610 is equal to the height of the MCU chip 900.

[0065] Among them, the size of the groove structure can be determined according to the size of the MCU chip 900. Generally, the length and width of the groove structure are both larger than the length and width of the MCU chip 900, which facilitates placing the MCU chip 900 in the groove structure. The depth of the groove structure is the same as the height of the MCU chip 900, that is, the depth of the chip installation area 610 is equal to the height of the MCU chip 900. Furthermore, after the MCU chip 900 is installed in the chip installation area 610, the top surface of the MCU chip 900 and the second side surface of the sealing body 600 are on the same surface, realizing the integration of the MCU chip 900 on the outside (the second side surface) of the sealing body 600, without increasing the overall volume of the intelligent power module 10 and without affecting the aesthetics.

[0066] Furthermore, the electrical connectors 700 (i.e., the pads) are arranged at intervals, and the arrangement rule of the electrical connectors 700 corresponds to the arrangement rule of the pins 400 of the MCU chip 900. Therefore, after the MCU chip 900 is placed in the chip installation area 610, the pins 400 of the MCU chip 900 can be in one-to-one contact with the electrical connectors 700 respectively, so that the pins 400 of the MCU chip 900 and the electrical connectors 700 can be welded in one-to-one correspondence, realizing the integration of the MCU chip 900 on the outside (the second side surface) of the intelligent power module 10.

[0067] In some embodiments of the present invention, such as Figure 5 In, the circuit board 100 is disposed close to the third side surface of the sealing body 600 corresponding to the second side surface, and the chip installation area 610 is parallel to the circuit board 100; the electrical connection line group 500 is bent and disposed between the circuit layer 300 and the chip installation area 610.

[0068] Specifically, the second side of the sealing body 600 corresponds to the third side of the sealing body 600. The circuit board 100 is disposed close to the third side of the sealing body 600. The chip mounting area 610 is provided on the second side of the sealing body 600. The chip mounting area 610 is parallel to the circuit board 100. Then, by bending the electrical connection wire group 500, it is disposed between the circuit layer 300 and the chip mounting area 610. The first end of the electrical connection wire group 500 is electrically connected to the circuit layer 300, and the second end of the electrical connection wire group 500 is electrically connected to each electrical connection member 700. Each electrical connection member 700 exposes the chip mounting area 610. After the MCU chip 900 is welded to the chip mounting area 610, the electrical connection between the MCU chip 900 and the circuit layer 300 can be realized. At the same time, the vertical distance between each electrical connection member 700 and the circuit board 100 is increased respectively, so as to avoid a large amount of heat generated on the circuit layer 300 from being directly transferred to the MCU chip 900, causing the temperature of the MCU chip 900 to be too high. By integrating the MCU chip 900 on the second side of the sealing body 600, the heat dissipation effect of the MCU chip 900 is further improved.

[0069] In some embodiments of the present invention, such as Figure 4 In, the circuit layer 300 includes a circuit wiring layer (not shown) and circuit elements disposed on the circuit wiring layer; the circuit wiring layer is disposed on the first insulating layer 200.

[0070] Among them, the circuit wiring layer is made of a metal such as copper and is insulated from the circuit board 100. The circuit wiring layer includes circuit lines formed by etched copper foils, and the thickness of the line layer is also relatively thin, such as about 70 um. In one example, the circuit wiring layer further includes pads disposed at the side position close to the circuit board 100, and the above-mentioned circuit wiring layer can be formed by using 2-ounce copper foil. Finally, a relatively thin green oil layer can be coated on the circuit wiring layer to play a role in line isolation, cutting off the electrical connection between circuit lines. A plurality of circuit elements are disposed on the circuit wiring layer, and the plurality of circuit elements or between the circuit elements and the circuit wiring layer can be electrically connected by metal wires; the circuit elements can be fixed to the circuit wiring layer by welding.

[0071] In one example, the circuit elements may be active elements such as transistors or diodes, or passive elements such as capacitors or resistors. Additionally, components with high heat generation, such as power components, can be fixed on the circuit board 100 through a heat sink made of copper or the like. Here, the active elements mounted face up are connected to the circuit wiring through metal wires. The first insulating layer 200 is formed to cover at least one surface of the circuit board 100. Moreover, fillers such as alumina and aluminum silicon carbide can be filled in high concentration in the resin material such as epoxy resin for forming the sealing layer to improve the thermal conductivity. For improving the thermal conductivity, the fillers can be in an angular shape, and for avoiding the risk of the fillers damaging the surface of the circuit elements, the fillers can be in a spherical shape. The pins 400 are generally made of a metal such as copper, and a nickel-tin alloy layer is formed on the copper surface through electroless plating and electroplating. The thickness of the alloy layer is generally 5 μm. The plating layer can protect the copper from corrosion and oxidation and can improve the weldability.

[0072] In some embodiments of the present invention, such as Figure 4 in, the circuit layer includes a compressor control module and / or a fan control module; the compressor control module includes corresponding circuit wirings and corresponding circuit elements in the circuit wiring layer; the fan control module includes corresponding circuit wirings and corresponding circuit elements in the circuit wiring layer.

[0073] Among them, the compressor can be, but is not limited to, an air-conditioning compressor. The compressor control module can be used to convert direct current into alternating current and supply the alternating current to the compressor, and the compressor control module can also be used to control the on-off of the compressor. The fan can be, but is not limited to, an air-conditioning fan. The fan control module can be used to convert direct current into alternating current and supply the alternating current to the fan, and the fan control module can also be used to control the on-off of the fan.

[0074] Specifically, based on the functions implemented by the circuit, the circuit elements and circuit wirings on the circuit wiring layer can be divided into a compressor control module and / or a fan control module. That is, the corresponding circuit elements and circuit wirings included in the compressor control module can implement the corresponding compressor control functions; the corresponding circuit elements and circuit wirings included in the fan control module can implement the corresponding fan control functions.

[0075] Furthermore, the compressor control module includes a compressor control circuit 310 and a compressor inverter circuit 320; the fan control module includes a fan control circuit 330 and a fan inverter circuit 340.

[0076] Among them, the compressor inverter circuit 320 can be used to convert direct current into alternating current and supply the alternating current to the compressor; the compressor control circuit 310 can be used to control the on-off of the compressor. The fan inverter circuit 340 can be used to convert direct current into alternating current and supply the alternating current to the fan; the fan control circuit 330 can be used to control the on-off of the fan.

[0077] In one example, the circuit layer includes a compressor control module. The corresponding device chips of the compressor control module are mounted on the corresponding component mounting positions of the circuit layer 300 by brushing solder paste or dotting silver glue, and the corresponding resistors and capacitors of the compressor control module are mounted on the corresponding component mounting positions of the circuit layer 300 by an automatic chip mounter SMT device; then the entire semi-finished product is passed through a reflow oven to weld all the components to the corresponding mounting positions, and the welding quality of the components is detected by a visual inspection AOI device; through cleaning methods such as spraying and ultrasonic cleaning, foreign matters such as solder flux and aluminum chips remaining on the circuit board 100 are removed, and a connection is formed between the compressor control module and the circuit wiring through bonding wires, realizing the installation of the compressor control module, and further realizing the two-in-one intelligent power module 10 integrating the compressor control module and the MCU chip 900.

[0078] In one example, the circuit layer includes a fan control module. The corresponding device chips of the fan control module are mounted on the corresponding component mounting positions of the circuit layer 300 by brushing solder paste or dotting silver glue, and the corresponding resistors and capacitors of the fan control module are mounted on the corresponding component mounting positions of the circuit layer 300 by an automatic chip mounter SMT device; then the entire semi-finished product is passed through a reflow oven to weld all the components to the corresponding mounting positions, and the welding quality of the components is detected by a visual inspection AOI device; through cleaning methods such as spraying and ultrasonic cleaning, foreign matters such as solder flux and aluminum chips remaining on the circuit board 100 are removed; a connection is formed between the fan control module and the circuit wiring through bonding wires, realizing the installation of the fan control module, and further realizing the two-in-one intelligent power module 10 integrating the fan control module and the MCU chip 900.

[0079] It should be noted that the circuit layer may also include a compressor control module and a fan control module at the same time. Based on the above installation and preparation methods of the compressor control module and the fan control module, the installation of the compressor control module and the fan control module can be realized, and further the three-in-one intelligent power module 10 integrating the compressor control module, the fan control module and the MCU chip 900 can be realized.

[0080] Furthermore, the circuit layer further includes a PFC circuit 350 and / or a rectifier circuit 360; the PFC circuit 350 includes corresponding circuit wiring and corresponding circuit components in the circuit wiring layer; the rectifier circuit 360 includes corresponding circuit wiring and corresponding circuit components in the circuit wiring layer.

[0081] Among them, the PFC (Power Factor Correction) circuit 350 can be used to improve the power factor of the device. It should be noted that the power factor refers to the relationship between the active power and the total power consumption (apparent power), that is, the ratio of the active power divided by the total power consumption (apparent power). The power factor can measure the degree to which electric power is effectively utilized. When the power factor value is larger, it means the higher the power utilization rate. The rectifier circuit 360 can be used to convert AC electrical energy into DC electrical energy. The rectifier circuit 360 can be a rectifier bridge circuit, and the rectifier bridge circuit can include a rectifier device composed of two or four diodes.

[0082] Specifically, based on the functions implemented by the circuit, the circuit components and circuit wirings on the circuit wiring layer can be divided into the PFC circuit 350 and / or the rectifier circuit 360. That is, the corresponding circuit components and circuit wirings included in the PFC circuit 350 can implement the corresponding PFC (Power Factor Correction) function; the corresponding circuit components and circuit wirings included in the rectifier circuit 360 can implement the corresponding rectification function.

[0083] In one example, the circuit layer may further include the PFC circuit 350. The corresponding device chips of the PFC circuit 350 are mounted on the corresponding component mounting positions of the circuit layer 300 by brushing solder paste or dotting silver glue, and the corresponding resistor components and capacitor components of the PFC circuit 350 are mounted on the corresponding component mounting positions of the circuit layer 300 by an automatic SMT device; then the entire semi-finished product is passed through a reflow oven to weld all the components to the corresponding mounting positions, and the welding quality of the components is detected by a visual inspection AOI device; through cleaning methods such as spraying and ultrasonic cleaning, foreign matters such as flux and aluminum chips remaining on the circuit board 100 are removed; through bonding wires, a connection is formed between the PFC circuit 350 and the circuit wiring, the installation of the PFC circuit 350 is realized, and further, the three-in-one intelligent power module 10 integrating the PFC circuit 350, the fan control module, and the MCU chip 900 is realized; or the three-in-one intelligent power module 10 integrating the PFC circuit 350, the compressor control module, and the MCU chip 900 is realized; or the four-in-one intelligent power module 10 integrating the PFC circuit 350, the compressor control module, the fan control module, and the MCU chip 900 is realized.

[0084] In one example, the circuit layer may further include a rectifier circuit 360. The corresponding device chips of the rectifier circuit 360 are mounted on the corresponding component mounting positions of the circuit layer 300 by brushing solder paste or dotting silver glue, and the corresponding resistor components and capacitor components of the rectifier circuit 360 are mounted on the corresponding component mounting positions of the circuit layer 300 by an automatic SMT device; then the entire semi-finished product is passed through a reflow oven to weld all the components to the corresponding mounting positions, and the welding quality of the components is detected by a visual inspection AOI device; through cleaning methods such as spraying and ultrasonic cleaning, foreign matters such as flux and aluminum chips remaining on the circuit board 100 are removed; through bonding wires, a connection is formed between the PFC circuit 350 and the circuit wiring, so as to realize the installation of the rectifier circuit 360, and further realize the three-in-one intelligent power module 10 integrating the rectifier circuit 360, the fan control module and the MCU chip 900; or the three-in-one intelligent power module 10 integrating the rectifier circuit 360, the compressor control module and the MCU chip 900; or the four-in-one intelligent power module 10 integrating the rectifier circuit 360, the compressor control module, the fan control module and the MCU chip 900.

[0085] It should be noted that the circuit layer may further include the PFC circuit 350 and the rectifier circuit 360 at the same time. Based on the above installation preparation methods of the PFC circuit 350 and the rectifier circuit 360, the installation of the PFC circuit 350 and the rectifier circuit 360 can be realized, and further the four-in-one intelligent power module 10 integrating the compressor control module, the PFC circuit 350, the rectifier circuit 360 and the MCU chip 900 can be realized; or the four-in-one intelligent power module 10 integrating the fan control module, the PFC circuit 350, the rectifier circuit 360 and the MCU chip 900; or the five-in-one intelligent power module 10 integrating the compressor control module, the fan control module, the PFC circuit 350, the rectifier circuit 360 and the MCU chip 900.

[0086] In the above embodiments, based on the characteristics of the high integration level, strong wiring flexibility, good heat dissipation, and small product volume of the intelligent power module 10 of the present application, by combining different circuit elements and corresponding circuit wiring, different functions of the intelligent power module 10 can be realized.

[0087] In one embodiment, a preparation method of the intelligent power module mentioned in the above embodiment is further proposed, as Figure 8 shown, the preparation method includes the following steps:

[0088] Step S100, provide a circuit board;

[0089] Step S200, prepare an insulating layer on the circuit board;

[0090] Step S300, prepare a circuit layer on the insulating layer;

[0091] Step S400: Arrange an electrical connection wire group and multiple pins on the circuit layer. The first end of the electrical connection wire group is electrically connected to the circuit layer, and the first ends of the multiple pins are respectively connected to the circuit layer through metal wires.

[0092] Step S500: Bend the electrical connection wire group, and connect each electrical connector to the second end of the electrical connection wire group respectively, so that each electrical connector is located directly above the circuit layer.

[0093] Step S600: Inject the circuit board provided with the circuit layer, multiple pins, and the electrical connection wire group through a packaging mold to form a sealed body, and each electrical connector connecting the second end of the electrical connection wire group exposes from the second side surface of the sealed body; wherein, a chip installation area for installing an MCU chip is provided on the second side surface of the sealed body, and each electrical connector is located in the chip installation area.

[0094] Step S700: Place the MCU chip in the chip installation area, and weld each pin of the MCU chip to each electrical connector one by one to form an intelligent power module.

[0095] Specifically, the specific preparation process of the intelligent power module is as follows: Design a circuit board with a suitable size according to the required circuit layout. For a general intelligent power module, the size of one can be selected as 64mm×30mm; Place the prepared circuit board into a special carrier (the carrier can be made of materials such as aluminum, composite stone, ceramic, PPS, etc. that can withstand high temperatures above 200°C). Prepare a first insulating layer on the circuit board, then press a copper foil on the surface of the first insulating layer, and then etch the copper foil to locally remove the copper foil to form a circuit wiring layer; Paste the power device chip onto the component installation position through an automatic die bonding equipment (DA machine) by brushing solder paste or dotting silver glue at the component installation positions reserved on the circuit layer. Paste resistors and capacitors onto the component installation positions through an automatic surface mount technology (SMT) equipment. Place the pins onto the corresponding installation positions through a manipulator or manually and fix them through the carrier; Then pass the entire semi-finished product including the carrier through a reflow oven to weld all the components to the corresponding installation positions, detect the welding quality of the components through a visual inspection AOI equipment, and remove foreign matters such as flux and aluminum chips remaining on the metal aluminum substrate through cleaning methods such as spraying and ultrasonic cleaning. Form a connection between the circuit components and the circuit wiring through bonding wires, and thus form a circuit layer on the circuit board.

[0096] All pins (such as each low-voltage pin and each high-voltage pin) are made of a metal substrate such as a copper substrate, for example, in the shape of a long strip with a length C of 25 mm, a width K of 1.5 mm, and a thickness H of 1 mm. For ease of assembly, a certain arc can be pressed and shaped at one end. Then, a nickel layer is formed on the surface of the pin by electroless plating: a nickel layer is formed on the surface of the copper material with a specific shape through a mixed solution of nickel salt and sodium hypophosphite, and an appropriate complexing agent is added. Nickel has a strong passivation ability and can quickly form an extremely thin passivation film, which can resist the corrosion of the atmosphere, alkali, and certain acids. The nickel plating crystals are extremely fine, and the thickness of the nickel layer is generally 0.1 μm. Then, through an acidic sulfate process, the copper material with the formed shape and nickel layer is immersed in a plating solution with positive tin ions and energized at room temperature to form a nickel-tin alloy layer on the surface of the nickel layer. The thickness of the nickel layer is generally controlled at 5 μm, and the formation of the nickel layer greatly improves the protection and solderability. In this way, the preparation of the pins is completed. Then, the first ends of the respective pins are prepared on the circuit layer by reflow soldering, curing with solder paste or silver paste.

[0097] Next, the metal sheet is processed by stamping or etching processes, and thus multiple metal wire patterns can be obtained; the second insulating layer and the thin film layer are sequentially covered on the surface of the metal wire patterns by spraying or coating processes, etc., and then dried to form a thin film with certain toughness that can be bent and folded; or a bonding material is coated on the surface of the metal wire patterns, and this thin-film insulating material is bonded by natural air drying or heating and drying, which plays a series of protective roles for the metal wire patterns, thereby forming an electrical connection wire group; then, the first end of the electrical connection wire group is connected to the circuit layer, and the second end of the electrical connection wire group is connected to the corresponding electrical connector; the electrical connection wire group is bent by a preset arc so that the respective electrical connectors connecting the second end of the electrical connection wire group can be located directly above the circuit layer and fixed by a special carrier, so that the respective electrical connectors can expose the chip installation area. Among them, a metal substrate can be processed by stamping or etching processes, and thus an MCU pad with patterns of respective electrical connectors can be obtained; the second insulating layer and the thin film layer are sequentially covered on the surface of the patterns of the respective electrical connectors by spraying or coating processes, etc., and then dried to form a thin film with certain toughness; or a bonding material is coated on the surface of the patterns of the respective electrical connectors, and this thin-film insulating material is bonded by natural air drying or heating and drying, thereby forming the respective electrical connectors.

[0098] Adopt a pre-designed plastic packaging mold with a chip installation area. During the preparation process, through the plastic packaging process, use a plastic packaging mold with a chip installation area to encapsulate a circuit board electrically connected with multiple pins and an electrical connection wire group in the plastic packaging mold with plastic packaging material; finally, perform demolding. After demolding, the plastic packaging material forms a sealed body, and the circuit board electrically connected with multiple pins and an electrical connection wire group is encapsulated in the sealed body, and each electrical connector exposes the chip installation area, that is, a specific position of the circuit wiring of a specific potential exposed from the sealed body is connected to the MCU chip.

[0099] Finally, after processes such as marking, post-curing of PMC, and trimming and forming, a packaged semi-finished product is formed; by applying glue to each electrical connector (i.e., pin pads) on the chip installation area and soldering the MCU chip to the chip installation area on the sealed body through high-temperature reflow; the electrical performance of the product is tested by an electrical parameter tester, and then an intelligent power module is formed.

[0100] In the above embodiment, by integrating the MCU chip on the outside (the second side) of the intelligent power module, the signal transmission distance is shortened, the anti-interference ability of the entire system is improved, the electric control is miniaturized, the integration degree of the intelligent power module is further improved, the wiring is more flexible, and the product volume is further reduced; in addition, when the intelligent power module fails, the MCU chip integrated outside the module can be taken out separately, improving the utilization rate of components and facilitating failure analysis at the same time; when the MCU chip fails, the failure can be eliminated by replacing the MCU chip, reducing the maintenance cost and improving the product reliability.

[0101] In some embodiments of the present invention, as Figure 9 shown, the preparation steps of the electrical connection wire group include:

[0102] Step S410: Provide a metal sheet;

[0103] Step S420: Prepare a wiring layer on the metal sheet;

[0104] Step S430: Cover a second insulating layer on the wiring layer;

[0105] Step S440: Cover a thin film layer on the second insulating layer; wherein, the first end of the wiring layer is sequentially led out from the second insulating layer and the thin film layer and then connected to the circuit layer, and the second end of the wiring layer is sequentially led out from the second insulating layer and the thin film layer and then connected to the corresponding electrical connector.

[0106] Specifically, the metal sheet is processed by stamping or etching processes to obtain a flexible printed circuit (FPC) layer with multiple metal wire patterns. The second insulating layer and the thin film layer are sequentially covered on the surface of the FPC layer by spraying or coating processes, and then dried to form a thin film with certain toughness that can be bent and folded. Alternatively, a bonding agent is applied on the surface of the FPC layer, and this thin film-like insulating material is bonded by natural drying or drying with heating, which plays a series of protective roles for the FPC layer, preventing accidental short circuits between the metal wires on the FPC layer due to external environmental pollution, preventing oxidation of the metal wires on the FPC layer, and preventing surface damage to the metal wires on the FPC layer, and increasing the strength of the FPC layer during bending and folding. Then, the first end of the FPC layer is sequentially led out from the second insulating layer and the thin film layer and connected to the circuit layer, and the second end of the FPC layer is sequentially led out from the second insulating layer and the thin film layer and connected to the corresponding electrical connectors. The FPC layer with the second insulating layer and the thin film layer is bent at a preset radian so that the electrical connectors connecting the second end of the FPC layer can be located directly above the circuit layer and fixed by a special carrier, enabling the electrical connectors to expose the chip installation area.

[0107] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0108] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention.

[0109] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0110] In the present invention, unless otherwise clearly defined or limited, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0111] In the present invention, unless otherwise clearly defined or limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0112] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An intelligent power module, characterized in that, it includes: A circuit board, on which a first insulating layer is provided; A circuit layer, which is disposed on the first insulating layer; Multiple pins, the first ends of the multiple pins are respectively electrically connected to the circuit layer; An electrical connection line group, the first end of the electrical connection line group is electrically connected to the circuit layer; A sealing body, which wraps the circuit board and the circuit layer to which the electrical connection line group and each of the pins are connected; Wherein, the second ends of each of the pins are respectively led out from the first side surface of the sealing body; a chip installation area for installing an MCU chip is provided on the second side surface of the sealing body, and a plurality of electrical connection members are provided in the chip installation area, and each of the electrical connection members is used for corresponding connection with each pin of the MCU chip; each of the electrical connection members is respectively electrically connected to the second end of the electrical connection line group; The electrical connection line group includes a wiring layer, a second insulating layer and a thin film layer; the second insulating layer covers the wiring layer, the thin film layer covers the second insulating layer, and the first end of the wiring layer is sequentially led out from the second insulating layer and the thin film layer and then connected to the circuit layer, and the second end of the wiring layer is sequentially led out from the second insulating layer and the thin film layer and then connected to the corresponding electrical connection member; The chip installation area is a groove structure, and the depth of the chip installation area is equal to the height of the MCU chip; The circuit board is disposed on the third side surface of the sealing body opposite to the second side surface, the chip installation area is parallel to the circuit board; the electrical connection line group is bent and disposed between the circuit layer and the chip installation area; The circuit layer includes a circuit wiring layer and circuit elements disposed on the circuit wiring layer; the circuit wiring layer is disposed on the first insulating layer.

2. The intelligent power module according to claim 1, characterized in that, The circuit layer includes a compressor control module and / or a fan control module; the compressor control module includes corresponding circuit wiring and circuit elements in the circuit wiring layer; the fan control module includes corresponding circuit wiring and corresponding circuit elements in the circuit wiring layer.

3. The intelligent power module according to claim 2, characterized in that, The circuit layer further includes a PFC circuit and / or a rectification circuit; the PFC circuit includes corresponding circuit wiring and circuit elements in the circuit wiring layer; the rectification circuit includes corresponding circuit wiring and corresponding circuit elements in the circuit wiring layer.

4. The intelligent power module according to claim 2, characterized in that, The compressor control module includes a compressor control circuit and a compressor inverter circuit; the fan control module includes a fan control circuit and a fan inverter circuit.

5. A preparation method of the intelligent power module according to any one of claims 1 to 4, characterized in that, it includes the following steps: Provide a circuit board; Prepare a first insulating layer on the circuit board; Prepare a circuit layer on the first insulating layer; An electrical connection line group and a plurality of pins are disposed on the circuit layer, and a first end of the electrical connection line group is electrically connected to the circuit layer, and first ends of the plurality of pins are respectively connected to the circuit layer through metal wires; The electrical connection line group is bent, and electrical connectors are respectively connected to second ends of the electrical connection line group, so that the electrical connectors are located directly above the circuit layer; The circuit substrate provided with the circuit layer, the plurality of pins, and the electrical connection line group is injection molded through a packaging mold to form a sealed body, and the electrical connectors connecting the second ends of the electrical connection line group are exposed from a second side surface of the sealed body; wherein, a chip installation area for installing an MCU chip is provided on the second side surface of the sealed body, and each of the electrical connectors is located in the chip installation area; The MCU chip is placed in the chip installation area, and each pin of the MCU chip is welded to each of the electrical connectors one by one to form the intelligent power module.

6. A method for manufacturing the intelligent power module according to claim 5, characterized in that, the preparation steps of the electrical connection line group include: providing a metal sheet; preparing a wiring layer on the metal sheet; covering a second insulating layer on the wiring layer; covering a thin film layer on the second insulating layer; wherein, a first end of the wiring layer is sequentially led out from the second insulating layer and the thin film layer and then connected to the circuit layer, and a second end of the wiring layer is sequentially led out from the second insulating layer and the thin film layer and then connected to the corresponding electrical connector.

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